ON NCV33269DTRK-3.3 800 ma, adjustable output, low dropout voltage regulator Datasheet

MC33269, NCV33269
800 mA, Adjustable Output,
Low Dropout Voltage
Regulator
The MC33269/NCV33269 series are low dropout, medium current,
fixed and adjustable, positive voltage regulators specifically designed
for use in low input voltage applications. These devices offer the
circuit designer an economical solution for precision voltage
regulation, while keeping power losses to a minimum.
The regulator consists of a 1.0 V dropout composite PNP−NPN pass
transistor, current limiting, and thermal shutdown.
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1
GND/Adj
Features
 3.3 V, 5.0 V, 12 V and Adjustable Versions








2.85 V version available as MC34268
Space Saving DPAK, SO−8 and SOT−223 Power Packages
1.0 V Dropout
Output Current in Excess of 800 mA
Thermal Protection
Short Circuit Protection
Output Trimmed to 1.0% Tolerance
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These are Pb−Free Devices
Vout
Vin
MC33269D−5.0
MC33269DT−5.0
NCV33269DT−5.0*
NCV33269DTRK−5.0*
MC33269T−5.0
MC33269D−012
MC33269DT−012
NCV33269DTRK−012*
MC33269T−012
5.0 V
5.0 V
5.0 V
5.0 V
5.0 V
12 V
12 V
12 V
12 V
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and
Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.
8
2
7
3
6
4
5
DPAK
DT SUFFIX
CASE 369C
1
3
1. GND/Adj
2. Vout
3. Vin
1
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
Adj
Adj
Adj
Adj
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
1
NC
Vout
NC
(Top View)
3
MC33269D
NCV33269D*
MC33269DT
NCV33269DTRK*
MC33269T
MC33269D−3.3
MC33269DT−3.3
NCV33269DTRK−3.3*
MC33269T−3.3
MC33269ST−3.3
SO−8
D SUFFIX
CASE 751
8
SOT−223
ST SUFFIX
CASE 318E
1 2 3
(Top View)
1
2
3
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
TO−220AB
T SUFFIX
CASE 221AB
1
2
3
1. GND/Adj
2. Vout
3. Vin
12 3
(Top View)
Heatsink surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 8 of this data sheet.
 Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 27
1
Publication Order Number:
MC33269/D
MC33269, NCV33269
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Vin
20
V
PD
qJA
qJC
PD
qJA
qJC
PD
qJA
qJC
PD
qJA
qJC
Internally Limited
92
6.0
Internally Limited
160
25
Internally Limited
65
5.0
Internally Limited
156
15
W
C/W
C/W
W
C/W
C/W
W
C/W
C/W
W
C/W
C/W
TJ
−40 to +150
C
TA
−40 to +125
−40 to +125
C
Storage Temperature
Tstg
−55 to +150
C
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM)
Machine Model (MM)
ESD
4000
400
V
Power Supply Input Voltage
Power Dissipation
Case 369C (DPAK)
Case 751 (SO−8)
Case 221A (TO−220)
Case 318E (SOT−223)
TA = 25C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
TA = 25C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
TA = 25C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
TA = 25C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Operating Die Junction Temperature Range
Operating Ambient Temperature Range
NCV33269
MC33269
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (CO = 10 mF, TA = 25C, for min/max values TA = −40C to +125C, unless otherwise noted.)
Symbol
Characteristic
Output Voltage (Iout = 10 mA, TA = 25C)
3.3 Suffix (VCC = 5.3 V)
5.0 Suffix (VCC = 7.0 V)
12 Suffix (VCC = 14 V)
Output Voltage (Line, Load and Temperature) (Note 1)
(1.25 V  Vin − Vout  15 V, Iout = 500 mA)
(1.35 V  Vin − Vout  10 V, Iout = 800 mA)
VO
Min
Typ
Max
3.27
4.95
11.88
3.3
5.0
12
3.33
5.05
12.12
VO
3.3 Suffix
5.0 Suffix
12 Suffix
Unit
V
V
3.23
4.9
11.76
3.3
5.0
12
3.37
5.1
12.24
Reference Voltage for Adjustable Voltage
(Iout = 10 mA, Vin − Vout = 2.0 V, TA = 25C)
Vref
1.235
1.25
1.265
V
Reference Voltage (Line, Load and Temperature) (Note 1) for Adjustable Voltage
(1.25 V  Vin − Vout  15 V, Iout = 500 mA)
(1.35 V  Vin − Vout  10 V, Iout = 800 mA)
Vref
1.225
1.25
1.275
V
Regline
−
−
0.3
%
Line Regulation
(Iout = 10 mA, Vin = [Vout + 1.5 V] to Vin = 20 V, TA = 25C)
Load Regulation
(Vin = Vout + 3.0 V, Iout = 10 mA to 800 mA, TA = 25C)
Dropout Voltage
(Iout = 500 mA)
(Iout = 800 mA)
Ripple Rejection
Current Limit
Regload
−
−
0.5
%
Vin − Vout
−
−
1.0
1.1
1.25
1.35
V
(10 Vpp, 120 Hz Sinewave; Iout = 500 mA)
RR
55
−
−
dB
(Vin − Vout = 10 V)
ILimit
800
−
−
mA
Quiescent Current (Fixed Output)
(1.5 V  Vout  3.3 V)
(5 V  Vout  12 V)
IQ
−
−
5.5
−
8.0
20
mA
Minimum Required Load Current
Fixed Output Voltage
Adjustable Voltage
ILoad
−
8.0
−
−
0
−
mA
IAdj
−
−
120
mA
Adjustment Pin Current
1. The MC33269−12, Vin − Vout is limited to 8.0 V maximum, because of the 20 V maximum rating applied to Vin.
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2
MC33269, NCV33269
Vin
Vout
Trim Links
VAdj
Gnd
This device contains 38 active transistors.
Figure 1. Internal Schematic
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3
MC33269, NCV33269
 VO , OUTPUT
VOLTAGE DEVIATION
1.3
TA = -40C
TA = 25C
1.1
TA = 125C
0.9
0.7
0.5
100
mV/Div
Cin = 10 mF
CO = 10 mF Tantalum
Vin = VO + 3.0 V
Preload = 0.1 A
I O , OUTPUT
CURRENT
Vin -Vout , DROPOUT VOLTAGE (V)
1.5
0
200
400
600
800
0.5 A
0A
1000
20 ms/DIV
IO, OUTPUT LOAD CURRENT (mA)
Figure 3. Transient Load Regulation
1.6
1100
IO = 800 mA
1.4
1060
OUTPUT CURRENT (A)
V FB(OV), OVERVOLTAGE INPUT THRESHOLD (%VFB )
Figure 2. Dropout Voltage versus
Output Load Current
1020
980
1.0
TA = 25C
MC33269D-XX
L = 25 mm Copper
0.8
0.6
0.4
940
0.2
900
-55
0
-25
0
25
50
75
TA, AMBIENT TEMPERATURE (C)
100
4.0
6.0
8.0
10
12
14
16
Figure 5. MC33269−XX Output DC Current versus
Input−Output Differential Voltage
70
RR, RIPPLE REJECTION RATIO (dB)
VO = 3.3 V or 5.0 V
60
VO = 12 V
50
Vin = VO + 3.0 V
IL = 800 mA
TA = 25C
30
20
0.1
2.0
INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
70
40
0
125
Figure 4. Dropout Voltage
versus Temperature
RR, RIPPLE REJECTION RATIO (dB)
1.2
1.0
10
f, FREQUENCY (kHz)
60
50
40
30
20
0.1
100
Vin = 8.0 V
Vout = 5.0 V
IL = 800 mA
CAdj = 22 mF
TA = 25C
Figure 6. MC33269 Ripple Rejection
versus Frequency
1.0
10
f, FREQUENCY (kHz)
Figure 7. MC33269−ADJ Ripple Rejection
versus Frequency
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4
100
MC33269, NCV33269
3.2
2.8
150
JUNCTION-TO-AIR ( C/W)
R  JA, THERMAL RESISTANCE,
170
PD(max) for TA = 50C
2.4
130
ÏÏÏ ÏÏÏ
ÏÏÏÏÏÏÏÏÏ
ÏÏÏ ÏÏÏ
110
90
L
70
50
10
20
1.2
3.0 mm
RqJA
0
1.6
2.0 oz.
Copper
L
30
2.0
Graph represents symmetrical layout
30
0.8
0.4
50
40
L, LENGTH OF COPPER (mm)
Figure 8. SOP−8 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
2.4
JUNCTION-TO-AIR ( C/W)
R  JA, THERMAL RESISTANCE,
100
PD(max) for TA = 50C
Free Air
Mounted
Vertically
90
ÏÏÏ
ÏÏÏ
ÏÏÏ
ÏÏÏ
2.0 oz. Copper
L
80
Minimum
Size Pad
70
2.0
1.6
1.2
L
60
50
0.8
0.4
RqJA
40
0
0
5.0
10
15
20
25
30
L, LENGTH OF COPPER (mm)
JUNCTION‐TO‐AIR (C/W)
R  JA, THERMAL RESISTANCE
280
240
2.50
PD(max) for TA = 50C
Free Air
Mounted
Vertically
1.25
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
200
Minimum
Size Pad
160
120
2.0 oz. Copper
L
0.83
L
0.63
0.50
80
0.42
RqJA
40
0
5.0
10
15
20
25
30
0.35
L, LENGTH OF COPPER (mm)
Figure 10. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
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5
PD, MAXIMUM POWER DISSIPATION (W)
Figure 9. DPAK Thermal Resistance and Maximum
Power Dissipation versus P.C.B. Copper Length
MC33269, NCV33269
APPLICATIONS INFORMATION
supply input filter with long wire lengths. This will reduce
the circuit’s sensitivity to the input line impedance at high
frequencies. A 0.33 mF or larger tantalum, mylar, ceramic,
or other capacitor having low internal impedance at high
frequencies should be chosen. The bypass capacitor should
be mounted with shortest possible lead or track length
directly across the regulator’s input terminals. Applications
should be tested over all operating conditions to insure
stability.
Internal thermal limiting circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated, typically at
170C, the output is disabled. There is no hysteresis built
into the thermal limiting circuit. As a result, if the device is
overheating, the output will appear to be oscillating. This
feature is provided to prevent catastrophic failures from
accidental device overheating. It is not intended to be used
as a substitute for proper heat−sinking.
Figures 11 through 15 are typical application circuits. The
output current capability of the regulator is in excess of
800 mA, with a typical dropout voltage of less than 1.0 V.
Internal protective features include current and thermal
limiting.
* The MC33269 requires an external output capacitor for
stability. The capacitor should be at least 10 mF with an
equivalent series resistance (ESR) of less than 10 W but
greater than 0.2 W over the anticipated operating
temperature range. With economical electrolytic capacitors,
cold temperature operation can pose a problem. As
temperature decreases, the capacitance also decreases and
the ESR increases, which could cause the circuit to oscillate.
Also capacitance and ESR of a solid tantalum capacitor is
more stable over temperature. The use of a low ESR ceramic
capacitor placed within close proximity to the output of the
device could cause instability.
** An input bypass capacitor is recommended to improve
transient response or if the regulator is connected to the
Vin
** Cin
Co *
10 mF
** Cin
Vout
Vin
Vout
MC33269-XX
MC33269
R1
GND
R2
An input capacitor is not necessary for stability, however
it will improve the overall performance.
CAdj***
ǒ
Figure 11. Typical Fixed Output Application
RS
Vin
***CAdj is optional, however it will improve the ripple rejection.
The MC34269 develops a 1.25 V reference voltage between the
output and the adjust terminal. Resistor R1, operates with
constant current to flow through it and resistor R2. This current
should be set such that the Adjust Pin current causes negligible
drop across resistor R2. The total current with minimum load
should be greater than 8.0 mA.
Iout
Co *
10 mF
Adj
Ǔ
V out + 1.25 1 ) R2 ) I R2
Adj
R1
MC33269
** Cin
Co *
10 mF
Adj
I out + 1.25
R
S
Figure 13. Current Regulator
Figure 12. Typical Adjustable Output Application
Vout
Vin
MC33269-XX
** Cin
Vout
Vin
GND
** Cin
MC33269
R1
Adj
R2
Co*
10 mF
MC33269-XX
Co *
10 mF
** Cin
GND
The Schottky diode in series with the ground leg of the upper
regulator shifts its output voltage higher by the forward
voltage drop of the diode. This will cause the lower device
to remain off until the input voltage is removed.
R2 sets the maximum output voltage. Each transistor
reduces the output voltage when turned on.
Figure 14. Battery Backed−Up Power Supply
Figure 15. Digitally Controlled Voltage Regulator
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6
MC33269, NCV33269
ORDERING INFORMATION
Package
Shipping Information†
MC33269DG
SO−8
(Pb−Free)
98 Units / Rail
MC33269DR2G
SO−8
(Pb−Free)
2500 Units / Tape & Reel
MC33269DTG
DPAK
(Pb−Free)
75 Units / Rail
MC33269DTRKG
DPAK
(Pb−Free)
2500 Units / Tape & Reel
MC33269TG
TO−220
(Pb−Free)
50 Units / Rail
MC33269D−3.3G
SO−8
(Pb−Free)
98 Units / Rail
MC33269DR2−3.3G
SO−8
(Pb−Free)
2500 Units / Tape & Reel
MC33269DT−3.3G
DPAK
(Pb−Free)
75 Units / Rail
MC33269DTRK−3.3G
DPAK
(Pb−Free)
2500 Units / Tape & Reel
MC33269ST−3.3T3G
SOT−223
(Pb−Free)
4000 Units / Tape & Reel
MC33269T−3.3G
TO−220
(Pb−Free)
50 Units / Rail
MC33269D−5.0G
SO−8
(Pb−Free)
98 Units / Rail
MC33269DR2−5.0G
SO−8
(Pb−Free)
2500 Units / Tape & Reel
MC33269DT−5.0G
DPAK
(Pb−Free)
75 Units / Rail
NCV33269DT−5.0G*
DPAK
(Pb−Free)
75 Units / Rail
MC33269DTRK−5.0G
DPAK
(Pb−Free)
2500 Units / Tape & Reel
MC33269T−5.0G
TO−220
(Pb−Free)
50 Units / Rail
MC33269D−012G
SO−8
(Pb−Free)
98 Units / Rail
MC33269DR2−012G
SO−8
(Pb−Free)
2500 Units / Tape & Reel
MC33269DT−012G
DPAK
(Pb−Free)
75 Units / Rail
MC33269DTRK−012G
DPAK
(Pb−Free)
2500 Units / Tape & Reel
MC33269T−012G
TO−220
(Pb−Free)
50 Units / Rail
NCV33269DR2G*
SO−8
(Pb−Free)
2500 Units / Tape & Reel
NCV33269DTRKG*
DPAK
(Pb−Free)
2500 Units / Tape & Reel
NCV33269DTRK3.3G*
DPAK
(Pb−Free)
2500 Units / Tape & Reel
NCV33269DTRK5.0G*
DPAK
(Pb−Free)
2500 Units / Tape & Reel
NCV33269DTRK−12G*
DPAK
(Pb−Free)
2500 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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7
MC33269, NCV33269
MARKING DIAGRAMS
SO−8
D SUFFIX
CASE 751
8
8
269AJ
ALYW
G
8
8
269−3
ALYW
G
69−12
ALYW
G
1
1
1
269−5
ALYW
G
1
DPAK
DT SUFFIX
CASE 369C
269AJG
ALYWW
1
2
69−12G
ALYWW
3
1
2
3
SOT−223
ST SUFFIX
CASE 318E
269−3G
ALYWW
1
2
269−5G
ALYWW
3
1
2
AYW
2693 G
G
3
2
1
TO−220AB
T SUFFIX
CASE 221A
MC
33269T
AWLYWWG
1 2
3
MC
33269T−12
AWLYWWG
1 2
MC
33269T−33
AWLYWWG
3
1 2
3
A
= Assembly Location
L, WL = Wafer Lot
Y
= Year
W, WW = Work Week
G
= Pb−Free Package
G
= Pb−Free Package
(Note: Microdot may be in either location)
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8
MC
33269T−5
AWLYWWG
1 2
3
3
MC33269, NCV33269
PACKAGE DIMENSIONS
SO−8
D SUFFIX
CASE 751−07
ISSUE AK
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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9
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC33269, NCV33269
PACKAGE DIMENSIONS
DPAK
DT SUFFIX
CASE 369C
ISSUE D
A
E
b3
c2
B
Z
D
1
L4
A
4
L3
b2
e
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
C
H
DETAIL A
3
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
c
b
0.005 (0.13)
M
H
C
L2
GAUGE
PLANE
C
L
L1
DETAIL A
SEATING
PLANE
A1
ROTATED 905 CW
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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10
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
MC33269, NCV33269
PACKAGE DIMENSIONS
SOT−223
ST SUFFIX
CASE 318E−04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
HE
4
HE
E
1
2
3
b
e1
e
0.08 (0003)
A1
C
q
A
L
q
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
−−−
−−−
1.75
2.00
7.00
7.30
−
10
L1
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
−−−
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
−−−
0.078
0.287
10
MC33269, NCV33269
PACKAGE DIMENSIONS
TO−220, SINGLE GAUGE
T SUFFIX
CASE 221AB
ISSUE A
−T−
B
F
T
SEATING
PLANE
C
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND
LEAD IRREGULARITIES ARE ALLOWED.
4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS
S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM)
4
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
V
Z
A
Q
U
1 2 3
H
K
Z
L
R
V
J
G
D
N
INCHES
MIN
MAX
0.570
0.620
0.380
0.405
0.160
0.190
0.025
0.035
0.142
0.147
0.095
0.105
0.110
0.155
0.018
0.025
0.500
0.562
0.045
0.060
0.190
0.210
0.100
0.120
0.080
0.110
0.020
0.024
0.235
0.255
0.000
0.050
0.045
----0.080
MILLIMETERS
MIN
MAX
14.48
15.75
9.66
10.28
4.07
4.82
0.64
0.88
3.61
3.73
2.42
2.66
2.80
3.93
0.46
0.64
12.70
14.27
1.15
1.52
4.83
5.33
2.54
3.04
2.04
2.79
0.508
0.61
5.97
6.47
0.00
1.27
1.15
----2.04
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