ASM3P2669A January 2007 rev 1.7 Low Power Peak EMI Reducing Solution Features • The ASM3P2669A uses the most efficient and optimized Generates an EMI optimized clock signal at the output. • Integrated loop filter components. • Operates with a 3.3V /2.5V supply. • Operating current less than 4mA. • Low power CMOS design. • Input frequency range : 6MHz to 12MHz for 2.5V implemented by using a proprietary all digital method. The ASM3P2669A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of : 6MHz to 13MHz for 3.3V • modulation profile approved by the FCC and is Generates a 1X low EMI spread spectrum clock of the input frequency. its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation’. • Frequency deviation: ±1% @ 10MHz • Available in 6-pin TSOT-23, 8-pin SOIC and 8-pin TSSOP packages. Applications The ASM3P2669A is targeted towards all portable Product Description devices with very low power requirements like MP3 The ASM3P2669A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The ASM3P2669A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock players and digital still cameras. Key Specifications Description Specification Supply voltages VDD = 3.3V /2.5V system cost savings by reducing the number of circuit Cycle-to-Cycle Jitter 200pS ( Max) board layers ferrite beads, shielding that are traditionally Output Duty Cycle 45/55% required to pass EMI regulations. Modulation Rate Equation FIN/256 Frequency Deviation ±1% @ 10MHz dependent signals. The ASM3P2669A allows significant Block Diagram VDD PD PLL Modulation CLKIN Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. ASM3P2669A January 2007 rev 1.7 Pin Configuration (6-pin TSOT-23 Package) PD 1 NC 2 ASM3P2669A CLKIN 3 6 VSS 5 ModOUT 4 VDD Pin Description Pin# 1 Pin Name PD Type Description I Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. 2 NC - No connect. 3 CLKIN I External reference frequency input. 4 VDD P Power supply for the entire chip 5 ModOUT O Spread spectrum clock output. 6 VSS P Ground connection. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 2 of 11 ASM3P2669A January 2007 rev 1.7 Pin Configuration (8-pin SOIC and TSSOP Package) CLKIN 1 8 VDD 7 NC PD 3 6 ModOUT NC 4 5 VSS NC 2 ASM3P2669A Pin Description Pin# Pin Name Type 1 CLKIN I 2 NC - No Connect. I Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. 3 PD Description External reference frequency input. 4 NC - No connect. 5 VSS P Ground connection. 6 ModOUT O Spread spectrum clock output. 7 NC - No connect. 8 VDD P Power supply for the entire chip Modulation Profile Specifications Description Frequency Range Specification For 2.5V Supply 6MHz < CLKIN < 12MHz For 3.3V Supply 6MHz < CLKIN < 13MHz Modulation Equation FIN/256 Frequency Deviation ±1% @ 10MHz Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 3 of 11 ASM3P2669A January 2007 rev 1.7 Absolute Maximum Ratings Symbol Rating Unit Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV VDD, VIN TSTG Parameter Static Discharge Voltage TDV (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics for 2.5V Supply (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol Min Typ Max Unit VIL Input low voltage VSS - 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current - - -35 µA IIH Parameter Input high current - - 35 µA IXOL XOUT output low current (@0.5V, VDD=2.5V) - 3 - mA IXOH XOUT output high current (@1.8V, VDD=2.5V) - 3 - mA VOL Output low voltage (VDD = 2.5 V, IOL = 8 mA) - - 0.6 V VOH Output high voltage (VDD = 2.5 V, IOH = 8 mA) 1.8 - - V IDD Static supply current* - - 10 uA ICC Dynamic supply current (2.5V, 10MHz and no load) - 2.0 - mA 2.375 2.5 2.625 V Power-up time (first locked cycle after power-up)** - - 5 mS Output impedance - 50 - Ω VDD Operating voltage tON ZOUT * XIN/CLKIN pin and PD pin are pulled low ** VDD and XIN/CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics for 2.5V Supply Symbol CLKIN ModOUT fd Parameter Min Typ Max Unit Input frequency 6 - 12 MHz Output frequency 6 - 12 MHz Input Frequency = 6MHz - ±1.5 - Input Frequency = 12MHz - ±0.8 - Frequency Deviation % tLH* Output rise time (measured from 0.7V to 1.7V) 0.8 1.5 1.7 nS tHL* Output fall time (measured from 1.7V to 0.7V) 0.5 1.0 1.2 nS tJC Jitter (cycle to cycle) - - 200 pS tD Output duty cycle 45 50 55 % * tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 4 of 11 ASM3P2669A January 2007 rev 1.7 DC Electrical Characteristics for 3.3V Supply (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol Min Typ Max Unit VIL Input low voltage Parameter VSS - 0.3 - 0.8 V VIH Input high voltage 2.0 - VDD + 0.3 V IIL Input low current - - -35 µA IIH Input high current - - 35 µA IXOL XOUT output low current (@0.4V, VDD=3.3V) - 3 - mA IXOH XOUT output high current (@2.5V, VDD=3.3V) - 3 - mA VOL Output low voltage (VDD = 3.3 V, IOL = 8 mA) - - 0.4 V VOH Output high voltage (VDD = 3.3 V, IOH = 8 mA) 2.5 - - V IDD Static supply current* - - 10 uA ICC Dynamic supply current (3.3V, 10MHz and no load) - 2.5 - mA 2.7 3.3 3.6 V Power-up time (first locked cycle after power-up)** - - 5 mS Output impedance - 45 - Ω VDD tON ZOUT Operating voltage * XIN/CLKIN pin and PD pin are pulled low ** VDD and XIN/CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics for 3.3V Supply Symbol CLKIN ModOUT fd Parameter Min Typ Max Unit Input frequency 6 - 13 MHz Output frequency 6 - 13 MHz Input Frequency = 6MHz - ±1.5 - Input Frequency = 13MHz - ±0.75 - Frequency Deviation % tLH* Output rise time (measured from 0.8 to 2.0V) 0.5 1.3 1.5 nS tHL* Output fall time (measured at 2.0V to 0.8V) 0.4 0.9 1.1 nS tJC Jitter (cycle to cycle) - - 200 pS tD Output duty cycle 45 50 55 % *tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 5 of 11 ASM3P2669A January 2007 rev 1.7 Package Information 6-pin TSOT-23 Package Dimensions Symbol Inches Min A Max Millimeters Min Max 0.04 1.00 A1 0.00 0.004 0.00 0.10 A2 0.033 0.036 0.84 0.90 b 0.012 0.02 0.30 0.50 H 0.005 BSC 0.127 BSC D 0.114 BSC 2.90 BSC B 0.06 BSC 1.60 BSC e 0.0374 BSC 0.950 BSC C 0.11 BSC 2.80 BSC L 0.0118 0.02 0.30 0.50 θ 0° 4° 0° 4° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 6 of 11 ASM3P2669A January 2007 rev 1.7 8-Pin SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Millimeters Min Max Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 7 of 11 ASM3P2669A January 2007 rev 1.7 8-Pin TSSOP Package H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 8 of 11 ASM3P2669A January 2007 rev 1.7 Ordering Information Part Number Marking ASM3P2669AF-06OR H4LL ASM3P2669AF-08TT ASM3P2669AF-08TR Package Type Temperature 6-Pin TSOT-23, TAPE & REEL, Pb Free Commercial 3P2669AF 8-Pin TSSOP, TUBE, Pb Free Commercial 3P2669AF 8-Pin TSSOP, TAPE & REEL, Pb Free Commercial ASM3P2669AF-08ST 3P2669AF 8-Pin SOIC, TUBE, Pb Free Commercial ASM3P2669AF-08SR 3P2669AF 8-Pin SOIC, TAPE & REEL, Pb Free Commercial ASM3P2669AG-06OR H3LL 6-Pin TSOT-23, TAPE & REEL, Green Commercial ASM3P2669AG-08TT 3P2669AG 8-Pin TSSOP, TUBE, Green Commercial ASM3P2669AG-08TR 3P2669AG 8-Pin TSSOP, TAPE & REEL, Green Commercial ASM3P2669AG-08ST 3P2669AG 8-Pin SOIC, TUBE, Green Commercial ASM3P2669AG-08SR 3P2669AG 8-Pin SOIC, TAPE & REEL, Green Commercial ASM3I2669AF-06OR H5LL ASM3I2669AF-08TT 6-Pin TSOT-23, TAPE & REEL, Pb Free Industrial 3I2669AF 8-Pin TSSOP, TUBE, Pb Free Industrial ASM3I2669AF-08TR 3I2669AF 8-Pin TSSOP, TAPE & REEL, Pb Free Industrial ASM3I2669AF-08ST 3I2669AF 8-Pin SOIC, TUBE, Pb Free Industrial ASM3I2669AF-08SR 3I2669AF 8-Pin SOIC, TAPE & REEL, Pb Free Industrial ASM3I2669AG-06OR H6LL 6-Pin TSOT-23, TAPE & REEL, Green Industrial ASM3I2669AG-08TT 3I2669AG 8-Pin TSSOP, TUBE, Green Industrial ASM3I2669AG-08TR 3I2669AG 8-Pin TSSOP, TAPE & REEL, Green Industrial ASM3I2669AG-08ST 3I2669AG 8-Pin SOIC, TUBE, Green Industrial ASM3I2669AG-08SR 3I2669AG 8-Pin SOIC, TAPE & REEL, Green Industrial Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 9 of 11 ASM3P2669A January 2007 rev 1.7 Device Ordering Information A S M 3 P 2 6 6 9 A F - 0 8 T R R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under U.S Patent Nos 5,488,627 and 5,631,921 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 10 of 11 ASM3P2669A January 2007 rev 1.7 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM3P2669A Document Version: 1.7 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 11 of 11