Fujitsu MB89T627RP-SH 8-bit proprietary microcontroller Datasheet

FUJITSU SEMICONDUCTOR
DATA SHEET
DS07-12534-4E
8-bit Proprietary Microcontroller
CMOS
F2MC-8L MB89620R Series
MB89623R/625R/P625/W625/626R/627R/P627/W627/T627R
MB89PV620
■ DESCRIPTION
The MB89620R series has been developed as a general-purpose version of the F2MC*-8L family consisting of
proprietary 8-bit, single-chip microcontrollers.
In addition to the F2MC-8L CPU core which can operate at low voltage but at high speed, the microcontrollers
contain a variety of peripheral functions such as timers, serial interfaces, an A/D converter, and an external
interrupt.
The MB89620R series is applicable to a wide range of applications from consumer products to industrial equipment, including portable devices.
*: F2MC stands for FUJITSU Flexible Microcontroller.
■ FEATURES
• Various package options
Three types of QFP packages (1 mm, 0.65 mm, or 0.5 mm lead pitch)
SDIP packages
• High-speed processing at low voltage
Minimum execution time: 0.4 µs/3.5 V, 0.8 µs/2.7 V
• F2MC-8L family CPU core
Instruction set optimized for controllers
Multiplication and division instructions
16-bit arithmetic operations
Test and branch instructions
Bit manipulation instructions, etc.
• Four types of timers
8-bit PWM timer (also usable as a reload timer)
8-bit pulse width count timer (Continuous measurement capable, applicable to remote control, etc.)
16-bit timer/counter
20-bit timebase timer
• Two serial interfaces
Switchable transfer direction allows communication with various equipment.
• 8-bit A/D converter
Sense mode function enabling comparison at 5 µs
Activation by an external input capable
(Continued)
MB89620R Series
(Continued)
• External interrupt: 4 channels
Four channels are independent and capable of wake-up from low-power consumption modes (with an edge
detection function).
• Low-power consumption modes
Stop mode (Oscillation stops to minimize the current consumption.)
Sleep mode (The CPU stops to reduce the current consumption to approx. 1/3 of normal.)
• Bus interface functions
Including hold and ready functions
■ PACKAGE
64-pin Plastic SH-DIP
64-pin Plastic LQFP
(DIP-64P-M01)
(FPT-64P-M03)
64-pin Ceramic SH-DIP
(DIP-64C-A06)
2
64-pin Plastic QFP
(FPT-64P-M06)
64-pin Ceramic MQFP
(MQP-64C-P01)
64-pin Plastic QFP
(FPT-64P-M09)
64-pin Ceramic MDIP
(MDP-64C-P02)
MB89620R Series
■ PRODUCT LINEUP
Part number
Parameter
MB89P625 MB89P627 MB89PV620
MB89623R MB89625R MB89626R MB89627R MB89T627R MB89W625
MB89W627
Classificati
on
External
ROM
products
Mass production products
(mask ROM products)
ROM size
8 K × 8 bits 16 K × 8 bits 24 K × 8 bits 32 K × 8 bits External
(internal
(internal
(internal
(internal
ROM
mask ROM) mask ROM) mask ROM) mask ROM)
1 K × 8 bits
1 K × 8 bits
One-time PROM
products/EPROM
products
16 K × 8 bits
(internal
PROM,
programmable
with
generalpurpose
EPROM
programmer)
512 × 8 bits
Piggyback/
evaluation
product for
evaluation
and
development
32 K × 8 bits 32 K × 8 bits
(internal
(external
PROM,
programmable ROM)
with
generalpurpose
EPROM
programmer)
RAM size
256 × 8 bits 512 × 8 bits 768 × 8 bits
1 K × 8 bits
CPU
functions
Number of instructions:
Instruction bit length:
Instruction length:
Data bit length:
Minimum execution time:
Interrupt processing time:
136
8 bits
1 to 3 bytes
1, 8, 16 bits
0.4 µs /10 MHz
3.6 µs/10 MHz
Ports
Input ports:
Output ports (N-ch open-drain):
I/O ports (N-ch open-drain)
Output ports (CMOS):
I/O ports (CMOS):
Total:
5 (4 ports also serve as peripherals.)
8 (All also serve as peripherals.)
8 (4 ports also serve as peripherals.)
8 (All also serve as bus control pins.)
24 (All also serve as bus pins or peripherals.)
53
1 K × 8 bits
8-bit PWM
timer
8-bit reload timer operation (toggled output capable, operating clock cycle: 0.4 µs to 3.3 ms)
8-bit resolution PWM operation (conversion cycle: 102 µs to 839 ms)
8-bit pulse
width
count
timer
8-bit timer operation (overflow output capable, operating clock cycle: 0.4 to 12.8 µs)
8-bit reload timer operation (toggled output capable, operating clock cycle: 0.4 to 12.8 µs)
8-bit pulse width measurement operation
(Continuous measurement “H” pulse width/“L” pulse width/from ↑ to ↑/from ↓ to ↓ capable)
16-bit
timer/
counter
16-bit timer operation (operating clock cycle: 0.4 µs)
16-bit event counter operation (Rising/falling/both edges selectable)
8-bit serial
I/O 1,
8-bit serial
I/O 2
8 bits
LSB first/MSB first selectable
One clock selectable from four transfer clocks
(one external shift clock, three internal shift clocks: 0.8 µs, 3.2 µs, 12.8 µs)
8-bit A/D
converter
8-bit resolution × 8 channels
A/D conversion mode (conversion time: 18 µs)
Sense mode (conversion time: 5 µs)
Continuous activation by an external activation or an internal timer capable
Reference voltage input
(Continued)
3
MB89620R Series
(Continued)
Part number
Parameter
MB89P625 MB89P627 MB89PV620
MB89623R MB89625R MB89626R MB89627R MB89T627R MB89W625
MB89W627
External
interrupt
4 independent channels (edge selection, interrupt vector, source flag)
Rising edge/falling edge selectable
Used also for wake-up from stop/sleep mode. (Edge detection is also permitted in stop mode.)
Standby
modes
Sleep mode, stop mode
Process
CMOS
Operating
voltage*
2.2 V to 6.0 V
2.7 V to 6.0 V
EPROM
for use
MBM27C256
A-20TV
MBM27C256
A-20CZ
—
*: Varies with conditions such as the operating frequency. (See section “■ Electrical Characteristics.”)
■ PACKAGE AND CORRESPONDING PRODUCTS
MB89623R
MB89625R
MB89626R
MB89627R
MB89T627R
MB89P625
MB89W625
MB89W627
MB89PV620
×
×
×*
×*
FPT-64P-M06
×
×
FPT-64P-M09
×*
×*
Package
MB89P627
DIP-64P-M01
×*
FPT-64P-M03
×*
DIP-64C-A06
×
×
×
MQP-64C-P01
×
×
×
×
MDP-64C-P02
×
×
×
×
: Available
×
×: Not available
*: Lead pitch converter sockets (manufacturer: Sun Hayato Co., Ltd.) are available.
64SD-64QF2-8L: For conversion from DIP-64P-M01 or DIP-64C-A06 to FPT-64P-M03
64SD-64SQF-8L: For conversion from DIP-64P-M01 or DIP-64C-A06 to FPT-64P-M09
Inquiry: Sun Hayato Co., Ltd.: TEL (81)-3-3986-0403
FAX (81)-3-5396-9106
Note: For more information about each package, see section “■ Package Dimensions.”
4
MB89620R Series
■ DIFFERENCES AMONG PRODUCTS
1. Memory Size
Before evaluating using the piggyback product, verify its differences from the product that will actually be used.
Take particular care on the following points:
• On the MB89623R, the upper half of the register bank cannot be used.
• On the MB89P627, the program area starts from address 8007H but on the MB89PV620 and MB89627R starts
from 8000H.
(On the MB89P627, addresses 8000H to 8006H comprise the option setting area, option settings can be read
by reading these addresses. On the MB89PV620 and MB89627R, addresses 8000H to 8006H could also be
used as a program ROM. However, do not use these addresses in order to maintain compatibility of the
MB89P627.)
• The stack area, etc., is set at the upper limit of the RAM.
• The external area is used.
2. Current Consumption
• In the case of the MB89PV620, add the current consumed by the EPROM which is connected to the top socket.
• When operated at low speed, the product with an OTPROM (one-time PROM) or an EPROM will consume
more current than the product with a mask ROM.
However, the current consumption in sleep/stop modes is the same. (For more information, see section
“■ Electrical Characteristics”.)
3. Mask Options
Functions that can be selected as options and how to designate these options vary by the product.
Before using options check section “■ Mask Options.”
Take particular care on the following points:
• A pull-up resistor cannot be set for P40 to P47 on the MB89P625, MB89W625, MB89P627, and MB89W627.
• A pull-up resistor is not selectable for P50 to P57 when the A/D converter is used.
• Options are fixed on the MB89PV620.
5
MB89620R Series
4. Differences between the MB89620 and MB89620R Series
• Memory access area
Memory access area of the following products is the same; both the MB89625 and MB89625R, and both the
MB89627 and MB89627R.
The access area of the MB89623 and MB89626 is different from that of the MB89623R and MB89626R respectively when using in external bus mode. See below.
Memory area
Address
MB89623
MB89623R
0000H to 007FH
I/O area
I/O area
0080H to 017FH
RAM area
RAM area
0180H to 027FH
0280H to BFFFH
Access prohibited
External area
External area
C000H to DFFFH
E000H to FFFFH
Access prohibited
ROM area
ROM area
Memory area
Address
MB89626
MB89626R
0000H to 007FH
I/O area
I/O area
0080H to 037FH
RAM area
RAM area
0380H to 047FH
0480H to 7FFFH
Access prohibited
External area
External area
8000H to 9FFFH
A000H to FFFFH
Access prohibited
ROM area
ROM area
• Other specifications
Both the MB89620R and MB89620 series is the same.
• Electrical specifications/electrical characteristics
Electrical specifications of the MB89620R series are the same with that of the MB89620 series.
■ CORRESPONDENCE BETWEEN THE MB89620 AND MB89620R SERIES
• The MB89620R series is the reduction version of the MB89620 series.
• The MB89620 and MB89620R series consist of the following products:
MB89620 series
MB89623
MB89625
MB89626
MB896267
MB89623R
MB89625R
MB89626R
MB896267R
MB89W625
MB89W627
MB89T627R
MB89P625
MB89620R series
MB89620 series
MB89620R series
6
MB89P627
MB89PV620
MB89620R Series
■ PIN ASSIGNMENT
(Top view)
P36/WTO
P37/PTO
P40
P41
P42
P43
P44/BZ
P45/SCK2
P46/SO2
P47/SI2
P50/AN0
P51/AN1
P52/AN2
P53/AN3
P54/AN4
P55/AN5
P56/AN6
P57/AN7
AVCC
AVR
AVSS
P60/INT0
P61/INT1
P62/INT2
P63/INT3
P64
RST
MOD0
MOD1
X0
X1
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
VPP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O1
O2
O3
VSS
65
66
67
68
69
70
71
72
73
74
75
76
77
78
64
63
VCC
62
92
61
A14
91
60
A13
90
59
A8
89
58
A9
88
57
A11
87
56
OE
86
55
A10
85
54
CE
84
53
O8
83
52
O7
82
51
O6
81
50
O5
80
49
O4
79
48
47
46
45
44
Each pin inside the
43
dashed line is for the 42
41
MB89PV620 only.
40
39
38
37
36
35
34
33
VCC
P35/PWC
P34/EC
P33/SI1
P32/SO1
P31/SCK1
P30/ADST
VSS
P00/AD0
P01/AD1
P02/AD2
P03/AD3
P04/AD4
P05/AD5
P06/AD6
P07/AD7
P10/A08
P11/A09
P12/A10
P13/A11
P14/A12
P15/A13
P16/A14
P17/A15
P20/BUFC
P21/HAK
P22/HRQ
P23/RDY
P24/CLK
P25/WR
P26/RD
P27/ALE
(DIP-64P-M01)
(DIP-64C-A06)
(MDP-64C-P02)
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
P45/SCK2
P44/BZ
P43
P42
P41
P40
P37/PTO
P36/WTO
VCC
P35/PWC
P34/EC
P33/SI1
P32/SO1
P31/SCK1
P30/ADST
VSS
(Top view)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P00/AD0
P01/AD1
P02/AD2
P03/AD3
P04/AD4
P05/AD5
P06/AD6
P07/AD7
P10/A08
P11/A09
P12/A10
P13/A11
P14/A12
P15/A13
P16/A14
P17/A15
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P63/INT3
P64
RST
MOD0
MOD1
X0
X1
VSS
P27/ALE
P26/RD
P25/WR
P24/CLK
P23/RDY
P22/HRQ
P21/HAK
P20/BUFC
P46/SO2
P47/SI2
P50/AN0
P51/AN1
P52/AN2
P53/AN3
P54/AN4
P55/AN5
P56/AN6
P57/AN7
AVCC
AVR
AVSS
P60/INT0
P61/INT1
P62/INT2
(FPT-64P-M03)
(FPT-64P-M09)
7
MB89620R Series
85
86
87
88
89
90
91
92
93
77
76
75
74
73
72
71
70
69
94
95
96
65
66
67
68
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
Each pin inside the dashed line
is for the MB89PV620 only.
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
P30/ADST
VSS
P00/AD0
P01/AD1
P02/AD2
P03/AD3
P04/AD4
P05/AD5
P06/AD6
P07/AD7
P10/A08
P11/A09
P12/A10
P13/A11
P14/A12
P15/A13
P16/A14
P17/A15
P20/BUFC
RST
MOD0
MOD1
X0
X1
VSS
P27/ALE
P26/RD
P25/WR
P24/CLK
P23/RDY
P22/HRQ
P21/HAK
20
21
22
23
24
25
26
27
28
29
30
31
32
P45/SCK2
P46/SO2
P47/SI2
P50/AN0
P51/AN1
P52/AN2
P53/AN3
P54/AN4
P55/AN5
P56/AN6
P57/AN7
AVCC
AVR
AVSS
P60/INT0
P61/INT1
P62/INT2
P63/INT3
P64
84
83
82
81
80
79
78
64
63
62
61
60
59
58
57
56
55
54
53
52
P44/BZ
P43
P42
P41
P40
P37/PTO
P36/WTO
VCC
P35/PWC
P34/EC
P33/SI1
P32/SO1
P31/SCK1
(Top view)
(FPT-64P-M06)
(MQP-64C-P01)
• Pin assignment on package top (MB89PV620 only)
Pin no.
Pin name
Pin no.
Pin name
Pin no.
Pin name
Pin no.
Pin name
65
N.C.
73
A2
81
N.C.
89
OE
66
VPP
74
A1
82
O4
90
N.C.
67
A12
75
A0
83
O5
91
A11
68
A7
76
N.C.
84
O6
92
A9
69
A6
77
O1
85
O7
93
A8
70
A5
78
O2
86
O8
94
A13
71
A4
79
O3
87
CE
95
A14
72
A3
80
VSS
88
A10
96
VCC
N.C.: Internally connected. Do not use.
8
MB89620R Series
■ PIN DESCRIPTION
Pin no.
Pin name
SH-DIP*1
MDIP*2
QFP1*3
MQFP*4
LQFP*5
QFP2*6
30
23
22
X0
31
24
23
X1
28
21
20
MOD0
29
22
21
MOD1
27
20
19
RST
56 to 49
49 to 42
48 to 41
41 to 34
40
33
32
39
32
38
Circuit
type
Function
A
Crystal oscillator pins
B
Operating mode selection pins
Connect directly to VCC or VSS.
C
Reset I/O pin
This pin is an N-ch open-drain output type with a
pull-up resistor, and a hysteresis input type.
“L” is output from this pin by an internal reset source.
The internal circuit is initialized by the input of “L”.
48 to 41 P00/AD0 to
P07/AD7
D
General-purpose I/O ports
When an external bus is used, these ports function as
multiplex pins of lower address output and data I/O.
40 to 33 P10/A08 to
P17/A15
D
General-purpose I/O ports
When an external bus is used, these ports function as
upper address output.
P20/BUFC
F
General-purpose output-only port
When an external bus is used, this port can also be
used as a buffer control output by setting the BCTR.
31
P21/HAK
F
General-purpose output-only port
When an external bus is used, this port can also be
used as a hold acknowledge output by setting the
BCTR.
31
30
P22/HRQ
D
General-purpose output-only port
When an external bus is used, this port can also be
used as a hold request input by setting the BCTR.
37
30
29
P23/RDY
D
General-purpose output-only port
When an external bus is used, this port functions as a
ready input.
36
29
28
P24/CLK
F
General-purpose output-only port
When an external bus is used, this port functions as a
clock output.
35
28
27
P25/WR
F
General-purpose output-only port
When an external bus is used, this port functions as a
write signal output.
34
27
26
P26/RD
F
General-purpose output-only port
When an external bus is used, this port functions as a
read signal output.
33
26
25
P27/ALE
F
General-purpose output-only port
When an external bus is used, this port functions as
an address latch signal output.
(Continued)
*1: DIP-64P-M01, DIP-64C-A06
*4: MQP-64C-P01
*2: MDP-64C-P02
*5: FPT-64P-M03
*3: FPT-64P-M06
*6: FPT-64P-M09
9
MB89620R Series
(Continued)
Pin no.
*1
Pin name
Circuit
type
Function
SH-DIP
MDIP*2
QFP1*3
MQFP*4
LQFP*5
QFP2*6
58
51
50
P30/ADST
E
General-purpose I/O port
Also serves as an A/D converter external activation.
This port is a hysteresis input type.
59
52
51
P31/SCK1
E
General-purpose I/O port
Also serves as the clock I/O for the 8-bit serial I/O 1.
This port is a hysteresis input type.
60
53
52
P32/SO1
E
General-purpose I/O port
Also serves as the data output for the 8-bit serial I/O 1.
This port is a hysteresis input type.
61
54
53
P33/SI1
E
General-purpose I/O port
Also serves as the data input for the 8-bit serial I/O 1.
This port is a hysteresis input type.
62
55
54
P34/EC
E
General-purpose I/O port
Also serves as the external clock input for the 16-bit
timer/counter. This port is a hysteresis input type.
63
56
55
P35/PWC
E
General-purpose I/O port
Also serves as the measured pulse input for the 8-bit
pulse width count timer. This port is a hysteresis input
type.
1
58
57
P36/WTO
E
General-purpose I/O port
Also serves as the toggle output for the 8-bit pulse
width count timer. This port is a hysteresis input type.
2
59
58
P37/PTO
E
General-purpose I/O port
Also serves as the toggle output for the 8-bit PWM
timer. This port is a hysteresis input type.
3 to 6
60 to 63
G
N-ch open-drain I/O ports
These ports are a hysteresis input type.
7
64
63
P44/BZ
G
N-ch open-drain I/O port
Also serves as a buzzer output. This port is a
hysteresis input type.
8
1
64
P45/SCK2
G
N-ch open-drain I/O port
Also serves as the clock I/O for the 8-bit serial I/O 2.
This port is a hysteresis input type.
9
2
1
P46/SO2
G
N-ch open-drain I/O port
Also serves as the data output for the 8-bit serial I/O 2.
This port is a hysteresis input type.
10
3
2
P47/SI2
G
N-ch open-drain I/O port
Also serves as the data input for the 8-bit serial I/O 2.
This port is a hysteresis input type.
59 to 62 P40 to P43
(Continued)
*1: DIP-64P-M01, DIP-64C-A06
*4: MQP-64C-P01
10
*2: MDP-64C-P02
*5: FPT-64P-M03
*3: FPT-64P-M06
*6: FPT-64P-M09
MB89620R Series
(Continued)
Pin no.
SH-DIP*1
MDIP*2
QFP1*3
MQFP*4
LQFP*5
QFP2*6
Pin name
Circuit
type
11 to 18
4 to 11
3 to 10
P50/AN0 to
P57/AN7
H
N-ch open-drain output-only ports
Also serve as the analog input for the A/D converter.
22 to 25
15 to 18
14 to 17 P60/INT0 to
P63/INT3
I
General-purpose input-only ports
Also serve as an external interrupt input. These ports
are a hysteresis input type.
26
19
18
P64
I
General-purpose input-only port
This port is a hysteresis input type.
64
57
56
VCC
—
Power supply pin
32, 57
25, 50
24, 49
VSS
—
Power supply (GND) pins
19
12
11
AVCC
—
A/D converter power supply pin
20
13
12
AVR
—
A/D converter reference voltage input pin
21
14
13
AVSS
—
A/D converter power supply (GND) pin
Use this pin at the same voltage as VSS.
*1: DIP-64P-M01, DIP-64C-A06
*4: MQP-64C-P01
Function
*2: MDP-64C-P02
*5: FPT-64P-M03
*3: FPT-64P-M06
*6: FPT-64P-M09
11
MB89620R Series
• External EPROM pins (MB89PV620 only)
Pin no.
MDIP
*1
MQFP*2
I/O
Function
65
66
VPP
O
“H” level output pin
66
67
68
69
70
71
72
73
74
67
68
69
70
71
72
73
74
75
A12
A7
A6
A5
A4
A3
A2
A1
A0
O
Address output pins
75
76
77
77
78
79
O1
O2
O3
I
Data input pins
78
80
VSS
O
Power supply (GND) pin
79
80
81
82
83
82
83
84
85
86
O4
O5
O6
O7
O8
I
Data input pins
84
87
CE
O
ROM chip enable pin
Outputs “H” during standby.
85
88
A10
O
Address output pin
86
89
OE
O
ROM output enable pin
Outputs “L” at all times.
87
88
89
91
92
93
A11
A9
A8
O
Address output pins
90
94
A13
O
91
95
A14
O
92
96
VCC
O
EPROM power supply pin
—
65
76
81
90
N.C.
—
Internally connected pins
Be sure to leave them open.
*1: MDP-64C-P02
*2: MQP-64C-P01
12
Pin name
MB89620R Series
■ I/O CIRCUIT TYPE
Type
A
Circuit
Remarks
• At an oscillation feedback resistor of approximately
1 MΩ/5.0 V
X1
X0
Standby control signal
B
C
R
P-ch
• At an output pull-up resistor (P-ch) of approximately
50 kΩ/5.0 V
• Hysteresis input
N-ch
D
• CMOS output
• CMOS input
R
P-ch
N-ch
• Pull-up resistor optional (except P22 and P23)
E
• CMOS output
• Hysteresis input
R
P-ch
N-ch
• Pull-up resistor optional
F
• CMOS output
P-ch
N-ch
(Continued)
13
MB89620R Series
(Continued)
Type
Circuit
Remarks
G
• N-ch open-drain output
• Hysteresis input
R
N-ch
• Pull-up resistor optional
(MB89623R, MB89625R, MB89626R, and
MB89627R only)
H
• N-ch open-drain output
• Analog input
R
N-ch
Analog input
I
• Hysteresis input
• Pull-up resistor optional
R
14
• Pull-up resistor optional
MB89620R Series
■ HANDLING DEVICES
1. Preventing Latchup
Latchup may occur on CMOS ICs if voltage higher than VCC or lower than VSS is applied to input and output pins
other than medium- and high-voltage pins or if higher than the voltage which shows on “1. Absolute Maximum
Ratings” in section “■ Electrical Characteristics” is applied between VCC and VSS.
When latchup occurs, power supply current increases rapidly and might thermally damage elements. When
using, take great care not to exceed the absolute maximum ratings.
Also, take care to prevent the analog power supply (AVCC and AVR) and analog input from exceeding the digital
power supply (VCC) when the analog system power supply is turned on and off.
2. Treatment of Unused Input Pins
Leaving unused input pins open could cause malfunctions. They should be connected to a pull-up or pull-down
resistor.
3. Treatment of Power Supply Pins on Microcontrollers with A/D and D/A Converters
Connect to be AVCC = DAVC = VCC and AVSS = AVR = VSS even if the A/D and D/A converters are not in use.
4. Treatment of N.C. Pins
Be sure to leave (internally connected) N.C. pins open.
5. Power Supply Voltage Fluctuations
Although VCC power supply voltage is assured to operate within the rated range, a rapid fluctuation of the voltage
could cause malfunctions, even if it occurs within the rated range. Stabilizing voltage supplied to the IC is therefore
important. As stabilization guidelines, it is recommended to control power so that VCC ripple fluctuations (P-P
value) will be less than 10% of the standard VCC value at the commercial frequency (50 to 60 Hz) and the transient
fluctuation rate will be less than 0.1 V/ms at the time of a momentary fluctuation such as when power is switched.
6. Precautions when Using an External Clock
When an external clock is used, oscillation stabilization time is required even for power-on reset (optional) and
wake-up from stop mode.
15
MB89620R Series
■ PROGRAMMING TO THE EPROM ON THE MB89P625
The MB89P625 is an OTPROM version of the MB89620R series.
1. Features
• 16-Kbyte PROM on chip
• Options can be set using the EPROM programmer.
• Equivalency to the MBM27C256A in EPROM mode (when programmed with the EPROM programmer)
2. Memory Space
Memory space in each mode such as 16-Kbyte PROM, option area is diagrammed below.
Single chip
Address
EPROM mode
(Corresponding addresses on the EPROM programmer)
0000 H
I/O
0080 H
RAM
0280 H
External area
BFF0H
3FF0 H
External area
BFF6H
Option area
3FF6H
Vacancy
(Read value: FF H)
External area
C000H
4000H
PROM
16 KB
FFFFH
EPROM
16 KB
7FFFH
3. Programming to the EPROM
In EPROM mode, the MB89P625 functions equivalent to the MBM27C256A. This allows the PROM to be
programmed with a general-purpose EPROM programmer (the electronic signature mode cannot be used) by
using the dedicated socket adapter.
When the operating ROM area for a single chip is 16 Kbytes (C000H to FFFFH) the PROM can be programmed
as follows:
• Programming procedure
(1) Set the EPROM programmer to the MBM27C256A.
(2) Load program data into the EPROM programmer at 4000H to 7FFFH (note that addresses C000H to FFFFH
while operating as a single chip assign to 4000H to 7FFFH in EPROM mode).
Load option data into addresses 3FF0H to 3FF5H of the EPROM programmer. (For information about each
corresponding option, see “4. Setting OTPROM Options.”)
(3) Program to 3FF0H to 7FFFH with the EPROM programmer.
16
MB89620R Series
4. Setting OTPROM Options
The programming procedure is the same as that for the PROM. Options can be set by programming values at
the addresses shown on the memory map.
The relationship between bits and options is shown on the following bit map:
• OTPROM option bit map (MB89P625)
Address
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Vacancy
Vacancy
Vacancy
Vacancy
Vacancy
Bit 2
Reset pin
output
1: Yes
0: No
Bit 1
Oscillation
stabilization
time
1: Crystal
0: Ceramic
Bit 0
Power-on
reset
1: Yes
0: No
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
3FF1H
P07
Pull-up
1: No
0: Yes
P06
Pull-up
1: No
0: Yes
P05
Pull-up
1: No
0: Yes
P04
Pull-up
1: No
0: Yes
P03
Pull-up
1: No
0: Yes
P02
Pull-up
1: No
0: Yes
P01
Pull-up
1: No
0: Yes
P00
Pull-up
1: No
0: Yes
3FF2H
P17
Pull-up
1: No
0: Yes
P16
Pull-up
1: No
0: Yes
P15
Pull-up
1: No
0: Yes
P14
Pull-up
1: No
0: Yes
P13
Pull-up
1: No
0: Yes
P12
Pull-up
1: No
0: Yes
P11
Pull-up
1: No
0: Yes
P10
Pull-up
1: No
0: Yes
3FF3H
P37
Pull-up
1: No
0: Yes
P36
Pull-up
1: No
0: Yes
P35
Pull-up
1: No
0: Yes
P34
Pull-up
1: No
0: Yes
P33
Pull-up
1: No
0: Yes
P32
Pull-up
1: No
0: Yes
P31
Pull-up
1: No
0: Yes
P30
Pull-up
1: No
0: Yes
3FF4H
P57
Pull-up
1: No
0: Yes
P56
Pull-up
1: No
0: Yes
P55
Pull-up
1: No
0: Yes
P54
Pull-up
1: No
0: Yes
P53
Pull-up
1: No
0: Yes
P52
Pull-up
1: No
0: Yes
P51
Pull-up
1: No
0: Yes
P50
Pull-up
1: No
0: Yes
Vacancy
Vacancy
Vacancy
Readable
and
writable
Readable
and
writable
Readable
and
writable
P64
Pull-up
1: No
0: Yes
P63
Pull-up
1: No
0: Yes
P62
Pull-up
1: No
0: Yes
P61
Pull-up
1: No
0: Yes
P60
Pull-up
1: No
0: Yes
3FF0H
3FF5H
Note: Each bit is set to ‘1’ as the initialized value, therefore the pull-up option is not selected.
17
MB89620R Series
■ PROGRAMMING TO THE EPROM ON THE MB89P627
The MB89P627 is an OTPROM version of the MB89620R series.
1. Features
• 32-Kbyte PROM on chip
• Options can be set using the EPROM programmer.
• Equivalency to the MBM27C256A in EPROM mode (when programmed with the EPROM programmer)
2. Memory Space
Memory space in each mode such as 32-Kbyte PROM, option area is diagrammed below.
Single chip
Address
EPROM mode
(Corresponding addresses on the EPROM programmer)
0000H
I/O
0080H
RAM
0480H
External area
8000H
0000H
External area
8007HH
Option area
0007H
PROM
32 KB
FFFFH
EPROM
32 KB
7FFFH
3. Programming to the EPROM
In EPROM mode, the MB89P627 functions equivalent to the MBM27C256A. This allows the PROM to be
programmed with a general-purpose EPROM programmer (the electronic signature mode cannot be used) by
using the dedicated socket adapter.
When the operating ROM area for a single chip is 32 Kbytes (8007H to FFFFH) the PROM can be programmed
as follows:
• Programming procedure
(1) Set the EPROM programmer to the MBM27C256A.
(2) Load program data into the EPROM programmer at 0007H to 7FFFH (note that addresses 8007H to FFFFH
while operating as a single chip assign to 0007H to 7FFFH in EPROM mode).
Load option data into addresses 0000H to 0006H of the EPROM programmer. (For information about each
corresponding option, see “4. Setting OTPROM Options.”)
(3) Program to 0000H to 7FFFH with the EPROM programmer.
18
MB89620R Series
4. Setting OTPROM Options
The programming procedure is the same as that for the PROM. Options can be set by programming values at
the addresses shown on the memory map.
The relationship between bits and options is shown on the following bit map:
• OTPROM option bit map (MB89P627)
Address
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Vacancy
Vacancy
Vacancy
Vacancy
Vacancy
Bit 2
Reset pin
output
1: Yes
0: No
Bit 1
Oscillation
stabilization
time
1: Crystal
0: Ceramic
Bit 0
Power-on
reset
1: Yes
0: No
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
0001H
P07
Pull-up
1: No
0: Yes
P06
Pull-up
1: No
0: Yes
P05
Pull-up
1: No
0: Yes
P04
Pull-up
1: No
0: Yes
P03
Pull-up
1: No
0: Yes
P02
Pull-up
1: No
0: Yes
P01
Pull-up
1: No
0: Yes
P00
Pull-up
1: No
0: Yes
0002H
P17
Pull-up
1: No
0: Yes
P16
Pull-up
1: No
0: Yes
P15
Pull-up
1: No
0: Yes
P14
Pull-up
1: No
0: Yes
P13
Pull-up
1: No
0: Yes
P12
Pull-up
1: No
0: Yes
P11
Pull-up
1: No
0: Yes
P10
Pull-up
1: No
0: Yes
0003H
P37
Pull-up
1: No
0: Yes
P36
Pull-up
1: No
0: Yes
P35
Pull-up
1: No
0: Yes
P34
Pull-up
1: No
0: Yes
P33
Pull-up
1: No
0: Yes
P32
Pull-up
1: No
0: Yes
P31
Pull-up
1: No
0: Yes
P30
Pull-up
1: No
0: Yes
0004H
P57
Pull-up
1: No
0: Yes
P56
Pull-up
1: No
0: Yes
P55
Pull-up
1: No
0: Yes
P54
Pull-up
1: No
0: Yes
P53
Pull-up
1: No
0: Yes
P52
Pull-up
1: No
0: Yes
P51
Pull-up
1: No
0: Yes
P50
Pull-up
1: No
0: Yes
Vacancy
Vacancy
Vacancy
Readable
and
writable
Readable
and
writable
Readable
and
writable
P64
Pull-up
1: No
0: Yes
P63
Pull-up
1: No
0: Yes
P62
Pull-up
1: No
0: Yes
P61
Pull-up
1: No
0: Yes
P60
Pull-up
1: No
0: Yes
Vacancy
Vacancy
Vacancy
Vacancy
Vacancy
Vacancy
Vacancy
Vacancy
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
Readable
and
writable
0000H
0005H
0006H
Note: Each bit is set to ‘1’ as the initialized value, therefore the pull-up option is not selected.
19
MB89620R Series
■ HANDLING THE MB89P625/P627
1. Recommended Screening Conditions
High-temperature aging is recommended as the pre-assembly screening procedure for a product with a blanked
OTPROM microcomputer program.
Program, verify
Aging
+150°C, 48 h
Data verification
Assembly
2. Programming Yield
All bits cannot be programmed at Fujitsu shipping test to a blanked OTPROM microcomputer, due to its nature.
For this reason, a programming yield of 100% cannot be assured at all times.
3. Erasure
In order to clear all locations of their programmed contents, it is necessary to expose the internal EPROM to an
ultraviolet light source. A dosage of 10 Ws/cm2 is required to completely erase an internal EPROM. This dosage
can be obtained by exposure to an ultraviolet lamp (wavelength of 2537 Angstroms (Å)) with intensity of 12000
µW/cm2 for 15 to 21 minutes. The internal EPROM should be about one inch from the source and all filters
should be removed from the UV light source prior to erasure.
It is important to note that the internal EPROM and similar devices, will erase with light sources having wavelengths shorter than 4000Å. Although erasure time will be much longer than with UV source at 2537Å, nevertheless the exposure to fluorescent light and sunlight will eventually erase the internal EPROM, and exposure
to them should be prevented to realize maximum system reliability. If used in such an environment, the package
windows should be covered by an opaque label or substance.
20
MB89620R Series
4. EPROM Programmer Socket Adapter and Recommended Programmer Manufacturer
Part number
Package
Compatible socket
adapter
Sun Hayato Co., Ltd.
Recommended programmer manufacturer
and programmer name
UNISITE
MB89P625P-SH
SH-DIP-64
ROM-64SD-28DP-8L
MB89P625PF
QFP-64
ROM-64QF-28DP-8L
MB89P625PFM
QFP-64
ROM-64QF2-28DP-8L
Advantest
Corp.
Data I/O Co., Ltd.
3900
Recommended
Recommended
Recommended
—
2900
R4945A
—
Recommended
Recommended
Recommended
*: It is required to connect a capacitor of approximately 0.1 µF between VPP and GND, and VCC and GND.
Inquiry:Sun Hayato Co., Ltd.: TEL (81)-3-3986-0403
FAX (81)-3-5396-9106
Data I/O Co., Ltd.: TEL:USA/ASIA(1)-206-881-6444
EUROPE(49)-8-985-8580
Advantest Corp.:TEL:Except JAPAN (81)-3-3930-4111
21
MB89620R Series
■ PROGRAMMING TO THE EPROM PIGGYBACK/EVALUATION DEVICE
1. EPROM for Use
MBM27C256A-20TV, MBM27C256A-20CZ
2. Programming Socket Adapter
To program to the PROM using an EPROM programmer, use the socket adapter (manufacturer: Sun Hayato
Co., Ltd.) listed below.
Package
LCC-32 (Rectangle)
Adapter socket part number
ROM-32LC-28DP-YG
Inquiry: Sun Hayato Co., Ltd.:TEL (81)-3-3986-0403
FAX (81)-3-5396-9106
3. Memory Space
Memory space in 32-Kbyte PROM is diagrammed below.
Single chip
Corresponding addresses on the EPROM programmer
Address
0000H
I/O
0080H
RAM
0480H
Not available
8000H
0000H
Not available
8006H
Not available
0006H
PROM
32 KB
FFFFH
EPROM
32 KB
7FFFH
4. Programming to the EPROM
(1) Set the EPROM programmer to the MBM27C256A.
(2) Load program data into the EPROM programmer at 0006H to 7FFFH.
(3) Program to 0000H to 7FFFH with the EPROM programmer.
22
MB89620R Series
■ BLOCK DIAGRAM
X0
X1
20-bit timebase
timer
Oscillator
Clock controller
8-bit PWM timer
P37/PTO
8-bit pulse width
count timer
P36/WTO
8
P10/A08
to P17/A15
8
P35/PWC
Port 3
CMOS I/O port
Ports 0 and 1
P00/AD0
to P07/AD7
Internal bus
Reset circuit
(WDT)
RST
P34/EC
16-bit timer/counter
P33/SI1
P32/SO1
P31/SCK1
8-bit serial I/O 1
MOD0
MOD1
External bus
interface
P30/ADST
Port 2
CMOS I/O port
P47/SI2
P46/SO2
P45/SCK2
CMOS output port
Port 4
8-bit serial I/O 2
Buzzer output
P44/BZ
4
P40 to P43
N-ch open-drain I/O port
N-ch open-drain output port
8
F2MC-8L
CPU
8-bit A/D converter
Port 5
RAM
8
ROM
External interrupt
The other pins
VCC, VSS × 2
P50/AN0
to P57/AN7
AVR
AVCC
AVSS
4
4
Port 6
P27/ALE
P26/RD
P25/WR
P24/CLK
P23/RDY
P22/HRQ
P21/HAK
P20/BUFC
P60/INT0
to P63/INT3
P64
Input port
23
MB89620R Series
■ CPU CORE
1. Memory Space
The microcontrollers of the MB89620R series offer a memory space of 64 Kbytes for storing all of I/O, data, and
program areas. The I/O area is located at the lowest address. The data area is provided immediately above the
I/O area. The data area can be divided into register, stack, and direct areas according to the application. The
program area is located at exactly the opposite end, that is, near the highest address. Provide the tables of
interrupt reset vectors and vector call instructions toward the highest address within the program area. The
memory space of the MB89620R series is structured as illustrated below.
• Memory Space
0000H
MB89PV620
0000H
I/O
0080H
MB89623R
0080H
0080H
0000H
I/O
RAM
768 B
RAM
1 KB
0100H
0100H
Register
MB89627R
MB89P627
MB89T627R
MB89W627
0080H
0080H
0100H
Register
Register
MB89626R
I/O
RAM
512 B
RAM
256 B
0100H
0000H
I/O
I/O
RAM
1 KB
0100H
0000H
MB89625R
MB89P625
MB89W625
Register
Register
0180H
0200H
*3
0280H
0200H
0200H
0200H
0280H
0380H
0480H
0480H
8000H
8006H
External area
External area
*2
8000H
A000H
External ROM
32 KB
FFFFH
External area
External area
*3
0480H
8000H
8006H
C000H
C000H
*3
ROM* 1
8 KB
FFFFH
FFFFH
External area
*2
ROM
32 KB
ROM
24 KB
ROM*1
16 KB
E000H
FFFFH
*3
FFFFH
*1: The ROM area is an external area depending on the mode.
*2: Since addresses 8000H to 8005H for the MB89P627 and MB89W627 comprise an option area, do not
use this area for the MB89PV620 and MB89627R.
*3: Access to this area is prohibited when using external bus mode.
24
MB89620R Series
2. Registers
The F2MC-8L family has two types of registers; dedicated registers in the CPU and general-purpose registers
in the memory. The following dedicated registers are provided:
Program counter (PC):
A 16-bit register for indicating instruction storage positions
Accumulator (A):
A 16-bit temporary register for storing arithmetic operations, etc. When the
instruction is an 8-bit data processing instruction, the lower byte is used.
Temporary accumulator (T):
A 16-bit register which performs arithmetic operations with the accumulator
When the instruction is an 8-bit data processing instruction, the lower byte is used.
Index register (IX):
A 16-bit register for index modification
Extra pointer (EP):
A 16-bit pointer for indicating a memory address
Stack pointer (SP):
A 16-bit register for indicating a stack area
Program status (PS):
A 16-bit register for storing a register pointer, a condition code
Initial value
16 bits
FFFDH
: Program counter
PC
A
: Accumulator
Indeterminate
T
: Temporary accumulator
Indeterminate
IX
: Index register
Indeterminate
EP
: Extra pointer
Indeterminate
SP
: Stack pointer
Indeterminate
PS
: Program status
I-flag = 0, IL1, 0 = 11
The other bit values are indeterminate.
The PS can further be divided into higher 8 bits for use as a register bank pointer (RP) and the lower 8 bits for
use as a condition code register (CCR). (See the diagram below.)
• Structure of the Program Status Register
15
PS
14
13
12
RP
11
10
9
8
Vacancy Vacancy Vacancy
RP
7
6
H
I
5
4
IL1, 0
3
2
1
0
N
Z
V
C
CCR
25
MB89620R Series
The RP indicates the address of the register bank currently in use. The relationship between the pointer contents
and the actual address is based on the conversion rule illustrated below.
• Rule for Conversion of Actual Addresses of the General-purpose Register Area
RP
Lower OP codes
“0” “0” “0” “0” “0” “0” “0” “1” R4 R3 R2 R1 R0 b2
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
↓
b1
b0
↓
↓
Generated addresses A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
The CCR consists of bits indicating the results of arithmetic operations and the contents of transfer data and
bits for control of CPU operations at the time of an interrupt.
H-flag:Set to ‘1’ when a carry or a borrow from bit 3 to bit 4 occurs as a result of an arithmetic operation. Cleared
to ‘0’ otherwise. This flag is for decimal adjustment instructions.
I-flag: Interrupt is enabled when this flag is set to ‘1’. Interrupt is disabled when the flag is cleared to ‘0’. Cleared
to ‘0’ at the reset.
IL1, 0: Indicates the level of the interrupt currently allowed. Processes an interrupt only if its request level is
higher than the value indicated by this bit.
IL1
IL0
Interrupt level
0
0
0
1
1
0
2
1
1
3
1
High-low
High
Low
N-flag: Set to ‘1’ if the MSB becomes ‘1’ as the result of an arithmetic operation. Cleared to ‘0’ when the bit is
cleared to ‘0’.
Z-flag: Set to ‘1’ when an arithmetic operation results in 0. Cleared to ‘0’ otherwise.
V-flag: Set to ‘1’ if the complement on 2 overflows as a result of an arithmetic operation. Cleared to ‘0’ if the
overflow does not occur.
C-flag: Set to ‘1’ when a carry or a borrow from bit 7 occurs as a result of an arithmetic operation. Cleared to ‘0’
otherwise.
Set to the shift-out value in the case of a shift instruction.
26
MB89620R Series
The following general-purpose registers are provided:
General-purpose registers: An 8-bit register for storing data
The general-purpose registers are 8 bits and located in the register banks of the memory. One bank contains
eight registers and up to a total of 32 banks can be used on the MB89620R. In the MB89623R, there are 16
banks in internal RAM. The remaining 16 banks can be extended externally by allocating an external RAM to
addresses 0180H to 01FFH using an external circuit. The bank currently in use is indicated by the register bank
pointer (RP).
Note: The number of register banks that can be used varies with the RAM size.
• Register Bank Configuration
This address = 0100H + 8 × (RP)
R0
R1
R2
R3
R4
R5
R6
R7
32 banks
Memory area
27
MB89620R Series
■ I/O MAP
Address
Read/write
Register name
Register description
00H
(R/W)
PDR0
Port 0 data register
01H
(W)
DDR0
Port 0 data direction register
02H
(R/W)
PDR1
Port 1 data register
03H
(W)
DDR1
Port 1 data direction register
04H
(R/W)
PDR2
Port 2 data register
05H
(R/W)
BCTR
External bus pin control register
06H
Vacancy
07H
Vacancy
08H
(R/W)
STBC
Standby control register
09H
(R/W)
WDTC
Watchdog timer control register
0AH
(R/W)
TBTC
Timebase timer control register
Vacancy
0BH
0CH
(R/W)
PDR3
Port 3 data register
0DH
(W)
DDR3
Port 3 data direction register
0EH
(R/W)
PDR4
Port 4 data register
0FH
(R/W)
BZCR
Buzzer register
10H
(R/W)
PDR5
Port 5 data register
11H
(R)
PDR6
Port 6 data register
12H
(R/W)
CNTR
PWM control register
13H
(W)
COMR
PWM compare register
14H
(R/W)
PCR1
PWC pulse width control register 1
15H
(R/W)
PCR2
PWC pulse width control register 2
16H
(R/W)
RLBR
PWC reload buffer register
17H
Vacancy
18H
(R/W)
TMCR
16-bit timer control register
19H
(R/W)
TCHR
16-bit timer count register (H)
1AH
(R/W)
TCLR
16-bit timer count register (L)
Vacancy
1BH
1CH
(R/W)
SMR1
Serial I/O 1 mode register
1DH
(R/W)
SDR1
Serial I/O 1 data register
1EH
(R/W)
SMR2
Serial I/O 2 mode register
1FH
(R/W)
SDR2
Serial I/O 2 data register
(Continued)
28
MB89620R Series
(Continued)
Address
Read/write
Register name
Register description
20H
(R/W)
ADC1
A/D converter control register 1
21H
(R/W)
ADC2
A/D converter control register 2
22H
(R/W)
ADCD
A/D converter data register
Vacancy
23H
24H
(R/W)
EIC1
External interrupt 1 control register 1
25H
(R/W)
EIC2
External interrupt 1 control register 2
26H to 7BH
Vacancy
7CH
(W)
ILR1
Interrupt level setting register 1
7DH
(W)
ILR2
Interrupt level setting register 2
7EH
(W)
ILR3
Interrupt level setting register 3
7FH
Vacancy
Note: Do not use vacancies.
29
MB89620R Series
■ ELECTRICAL CHARACTERISTICS
1. Absolute Maximum Ratings
(AVSS = VSS = 0.0 V)
Parameter
Symbol
Rating
Min.
Max.
Unit
Remarks
Power supply voltage
VCC
AVCC
VSS – 0.3
VSS + 7.0
V
*1
A/D converter reference input
voltage
AVR
VSS – 0.3
VSS + 7.0
V
AVR must not exceed AVCC + 0.3
V.
VI
VSS – 0.3
VCC + 0.3
V
Except P40 to P47*2
VI2
VSS – 0.3
VSS + 7.0
V
P40 to P47
VO
VSS – 0.3
VCC + 0.3
V
Except P40 to P47*2
VO2
VSS – 0.3
VSS + 7.0
V
P40 to P47
“L” level maximum output
current
IOL

20
mA
“L” level average output current
IOLAV

4
mA
“L” level total maximum output
current
∑IOL

100
mA
“L” level total average output
current
∑IOLAV

40
mA
“H” level maximum output
current
IOH

–20
mA
“H” level average output current
IOHAV

–4
mA
“H” level total maximum output
current
∑IOH

–50
mA
“H” level total average output
current
∑IOHAV

–20
mA
Power consumption
PD

300
mW
Operating temperature
TA
–40
+85
°C
Storage temperature
Tstg
–55
+150
°C
Input voltage
Output voltage
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
Average value (operating
current × operating rate)
*1: Use AVCC and VCC set to the same voltage.
Take care so that AVCC does not exceed VCC, such as when power is turned on.
*2: VI and VO must not exceed VCC + 0.3 V.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
30
MB89620R Series
2. Recommended Operating Conditions
(AVSS = VSS = 0.0 V)
Symbol
Parameter
A/D converter reference input
voltage
Operating temperature
Unit
2.2*
6.0*
V
2.7*
6.0*
V
1.5
6.0
V
AVR
0.0
AVCC
V
TA
–40
+85
°C
VCC
AVCC
Power supply voltage
Value
Min.
Max.
Remarks
Normal operation assurance range*
(MB89623R/625R/626R/627R)
Normal operation assurance range*
(MB89P625/W625/P627/T627R/W627/PV620)
Retains the RAM state in stop mode
*: These values vary with the operating frequency and analog assurance range. See Figure 1 and “5. A/D Converter
Electrical Characteristics.”
Figure 1
Operating Voltage vs. Clock Operating Frequency
6
Analog accuracy assured in the
AVCC = VCC = 3.5 V to 6.0 V range
5
Operating voltage (V)
Operation assurance range
4
3
2
1
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
Clock operating frequency (MHz)
Note: The shaded area is assured only for the MB89623R/625R/626R/627R.
Figure 1 indicates the operating frequency of the external oscillator at an instruction cycle of 4/FC.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
31
MB89620R Series
3. DC Characteristics
(AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin name
Condition
Value
Min.
Typ.
Max.
Unit
VIH
P00 to P07,
P10 to P17,
P22, P23

0.7 VCC

VCC + 0.3
V
VIHS
RST, MOD0,
MOD1,
P30 to P37,
P60 to P64

0.8 VCC

VCC + 0.3
V
VIHS2
P40 to P47

0.8 VCC

VCC + 0.3
V
VIL
P00 to P07,
P10 to P17,
P22, P23

VSS − 0.3

0.3 VCC
V
VILS
RST, MOD0,
MOD1,
P30 to P37,
P40 to P47,
P60 to P64

VSS − 0.3

0.2 VCC
V
VD
P50 to P57

VSS − 0.3

VCC + 0.3
V
VD2
P40 to P47

VSS − 0.3

VSS + 6.0
V
VOH
P00 to P07,
P10 to P17,
P20 to P27,
P30 to P37
IOH = –2.0 mA
4.0


V
VOL
P00 to P07,
P10 to P17,
P20 to P27,
P30 to P37,
P40 to P47,
P50 to P57


0.4
V
VOL2
RST


0.4
V
Input leakage
current
ILI1
(Hi-z output
leakage current)
P00 to P07,
P10 to P17,
P20 to P27,
0.0 V < VI <
P30 to P37,
VCC
P40 to P47,
P60 to P64,
MOD0, MOD1


±5
µA
Pull-up
resistance
P00 to P07,
P10 to P17,
P30 to P37,
P40 to P47,
P50 to P57,
P60 to P64,
RST
25
50
100
kΩ
“H” level input
voltage
“L” level input
voltage
Open-drain
output pin
application
voltage
“H” level output
voltage
“L” level output
voltage
RPULL
IOL = +4.0 mA
VI = 0.0 V
Remarks
Without
pull-up resistor
(Continued)
32
MB89620R Series
(Continued)
(AVCC = VCC = 5.0 V, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin name
Condition
FC = 10 MHz
Normal
operating
mode
tinst*2 = 0.4 µs
ICC
VCC
Power supply
current*1
Min.
—
Typ.
9
Max.
Unit
15
—
10
18
MB89P625/
W625
mA
MB89P627/
W627
FC = 10 MHz
Sleep mode
tinst*2 = 0.4 µs
—
3
4
mA
ICCH
Stop mode
TA = +25°C
—
—
1
µA
IA
FC = 10 MHz,
when starting
A/D conversion
—
1
3
mA
FC = 10 MHz,
TA = +25°C,
when stopping
A/D conversion
—
—
1
µA
f = 1 MHz
—
10

pF
IAH
CIN
Other than
AVCC, AVSS,
VCC, and VSS
Remarks
MB89623R/
625R/626R/
mA
627R/T627R/
PV620
ICCS
AVCC
Input
capacitance
Value
*1: In the case of the MB89PV620, the current consumed by the connected EPROM and ICE is not included.
The power supply current is measured at the external clock.
*2: For information on tinst, see “(4) Instruction Cycle” in “4. AC Characteristics.”
33
MB89620R Series
4. AC Characteristics
(1) Reset Timing
(VCC = +5.0 V±10%, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Symbol
Parameter
RST “L” pulse width
Value
Condition
tZLZH
—
Min.
Max.
16 tXCYL
—
Unit
Remarks
ns
Note: tXCYL is the oscillation cycle (1/FC) to input to the X0 pin.
tZLZH
RST
0.2 VCC
0.2 VCC
(2) Power-on Reset
(AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Power supply rising time
tR
Power supply cut-off time
tOFF
Condition
—
Value
Unit
Remarks
Min.
Max.
—
50
ms
Power-on reset function only
1
—
ms
Due to repeated operations
Note: Make sure that power supply rises within the selected oscillation stabilization time.
If power supply voltage needs to be varied in the course of operation, a smooth voltage rise is
recommended.
tR
tOFF
2.0 V
VCC
0.2 V
34
0.2 V
0.2 V
MB89620R Series
(3) Clock Timing
(AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Symbol
Pin name
Clock frequency
FC
Clock cycle time
Parameter
Condition
Value
Unit
Remarks
Min.
Max.
X0, X1
1
10
MHz
tXYCL
X0, X1
100
1000
ns
Input clock pulse width
PWH
PWL
X0
20
—
ns
External clock
Input clock rising/falling
time
tCR
tCF
X0
—
10
ns
External clock
—
• X0 and X1 Timing and Conditions
tXCYL
PW
PWL
tCR
0.8 VCC
tCF
0.8 VCC
X0
0.2 VCC
0.2 VCC
0.2 VCC
• Clock Conditions
When a crystal
or
ceramic resonator is used
X0
When an external clock is used
X1
X0
X1
Open
(4) Instruction Cycle
Parameter
Instruction cycle
(minimum execution time)
Symbol
tinst
Value (typical)
Unit
Remarks
4/FC
µs
tinst = 0.4 µs when operating at
FC = 10 MHz
35
MB89620R Series
(5) Clock Output Timing
(VCC = +5.0 V±10%, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Symbol
Parameter
Cycle time
Pin name
Condition
tCYC
CLK
CLK ↑ → CLK ↓
Value
Remarks
—
ns
tXCYL × 2 at 10 MHz
oscillation
100
ns
Approx. tCYC/2 at
10 MHz oscillation
Max.
200
30
—
tCHCL
tCYC
tCHC
2.4 V
2.4 V
CLK
0.8 V
36
Unit
Min.
MB89620R Series
(6) Bus Read Timing
(VCC = +5.0 V±10%, FC = 10 MHz, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin name
Value
Condition
Min.
Max.
Unit Remarks
Valid address → RD ↓ time
tAVRL
RD, A15 to A08,
AD7 to AD0
1/4 tinst*– 64 ns
—
µs
RD pulse width
tRLRH
RD
1/4 tinst*– 20 ns
—
µs
Valid address → data read time
tAVDV
AD7 to AD0,
A15 to A08
—
1/2 tinst*
µs
In the case
of no wait
RD ↓ → data read time
tRLDV
RD, AD7 to AD0
—
1/2 tinst*– 80
ns
µs
In the case
of no wait
RD ↑ → data hold time
tRHDX
AD7 to AD0, RD
0
—
µs
RD ↑ → ALE ↑ time
tRHLH
RD, ALE
1/4 tinst*– 40 ns
—
µs
RD ↑ → address invalid time
tRHAX
RD, A15 to A08
1/4 tinst*– 40 ns
—
µs
RD ↓ → CLK ↑ time
tRLCH
1/4 tinst*– 40 ns
—
µs
CLK ↓ → RD ↑ time
tCLRH
0
—
ns
RD ↓ → BUFC ↓ time
tRLBL
RD, BUFC
–5
—
µs
A15 to A08,
AD7 to AD0,
BUFC
5
—
µs
—
RD, CLK
BUFC ↑ → valid address time tBHAV
*: For information on tinst, see “(4) Instruction Cycle.”
2.4 V
CLK
0.8 V
tRHL
ALE
0.8 V
AD
2.4 V
0.7 VCC
0.3 VCC
0.8 V
tAVD
A
2.4 V
0.8 V
0.7 VCC
2.4 V
0.3 VCC
0.8 V
tRHDX
2.4 V
tCLRH
tRLC
0.8 V
tAVRL
tRLDV
2.4 V
0.8 V
tRHA
tRLR
RD
0.8 V
tRLBL
2.4 V
tBHAV
2.4 V
BUFC
0.8 V
37
MB89620R Series
(7) Bus Write Timing
(VCC = +5.0 V±10%, FC = 10 MHz, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin name
Condition
Value
Min.
Max.
Valid address → ALE ↓ time
tAVLL
AD7 to AD0,
ALE, A15 to A08
1/4 tinst*1– 64 ns
—
µs
ALE ↓ time → address
invalid time
tLLAX
AD7 to AD0,
ALE, A15 to A08
5
—
ns
Valid address → WR ↓ time
tAVWL
WR, ALE
1/4 tinst*1– 60 ns
WR pulse width
tWLWH
WR
Write data → WR ↑ time
tDVWH
AD7 to AD0, WR
—
µs
inst 1
—
µs
inst 1
1/2 t * – 60 ns
—
µs
1/4 tinst*1– 40 ns
—
ns
1/4 tinst*1– 40 ns
1/2 t * – 20 ns
WR ↑ → address invalid time tWHAX
WR, A15 to A08
WR ↑ → data hold time
tWHDX
AD7 to AD0, WR
WR ↑ → ALE ↑ time
tWHLH
WR, ALE
WR ↓ → CLK ↑ time
tWLCH
CLK ↓ → WR ↑ time
tCLWH
ALE pulse width
tLHLL
ALE
ALE ↓ → CLK ↑ time
tLLCH
ALE,CLK
—
—
µs
inst 1
—
µs
inst 1
1/4 t * – 40 ns
—
µs
0
—
ns
—
µs
—
µs
1/4 t * – 40 ns
WR, CLK
1/4 tinst*1– 35 ns*2
inst 1
2
1/4 t * – 30 ns*
*1: For information on tinst, see “(4) Instruction Cycle.”
*2: These characteristics are also applicable to the bus read timing.
2.4 V
CLK
0.8 V
tLHLL
ALE
tLLC
tWHL
2.4 V
0.8 V
tAVL
AD
0.8 V
tLLAX
2.4 V 2.4 V
2.4 V
2.4 V
0.8 V 0.8 V
0.8 V
0.8 V
tDVW
A
2.4 V
0.8 V
tWHD
2.4 V
tCLWH
0.8 V
tWLC
tAVW
tWHA
tWLW
WR
2.4 V
0.8 V
38
Unit Remarks
MB89620R Series
(8) Ready Input Timing
(VCC = +5.0 V±10%, FC = 10 MHz, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Symbol
Parameter
RDY valid → CLK ↑ time
tYVCH
CLK ↑ → RDY invalid time
tCHYX
Pin name
RDY, CLK
Condition
—
Value
Unit Remarks
Min.
Max.
60
—
ns
*
0
—
ns
*
*: These characteristics are also applicable to the read cycle.
2.4 V
CLK
2.4 V
ALE
AD
Data
Address
A
WR
tYVCH tCHYX
RDY
tYVCH tCHYX
Note: The bus cycle is also extended in the read cycle in the same manner.
39
MB89620R Series
(9) Serial I/O Timing
(VCC = +5.0 V±10%, AVSS = VSS= 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol
Pin name
Value
Unit Remarks
Min.
Max.
2 tinst*
—
µs
–200
200
ns
tSCYC
SCK1,
SCK2
SCK1 ↓ → SO1 time
SCK2 ↓ → SO2 time
tSLOV
SCK1,
SO1
SCK2,
SO2
Valid SI1 → SCK1 ↑
Valid SI2 → SCK2 ↑
tIVSH
SI1, SCK1
SI2, SCK2
1/2 tinst*
—
µs
SCK1 ↑ → valid SI1 hold time
SCK2 ↑ → valid SI2 hold time
tSHIX
SCK1, SI1
SCK2, SI2
1/2 tinst*
—
µs
Serial clock “H” pulse width
tSHSL
SCK1,
SCK2
1 tinst*
—
µs
Serial clock “L” pulse width
tSLSH
SCK1,
SCK2
1 tinst*
—
µs
SCK1 ↓ → SO1 time
SCK2 ↓ → SO2 time
tSLOV
SCK1,
SO1
SCK2,
SO2
0
200
ns
Valid SI1 → SCK1 ↑
Valid SI2 → SCK2 ↑
tIVSH
SI1, SCK1
SI2, SCK2
1/2 tinst*
—
µs
SCK1 ↑ → valid SI1 hold time
SCK2 ↑ → valid SI2 hold time
tSHIX
SCK1, SI1
SCK2, SI2
1/2 tinst*
—
µs
Serial clock cycle time
*: For information on tinst, see “(4) Instruction Cycle.”
40
Condition
Internal shift
clock mode
External shift
clock mode
MB89620R Series
• Internal Shift Clock Mode
tSCYC
SCK1
SCK2
2.4 V
0.8 V
0.8 V
tSLOV
SO1
SO2
2.4 V
0.8 V
tIVSH
SI1
SI2
tSHIX
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
• External Shift Clock Mode
tSLSH
tSHSL
SCK1
SCK2
0.8 VCC
0.2 VCC
0.8 VCC
0.2 VCC
tSLOV
SO1
SO2
2.4 V
0.8 V
tIVSH
SI1
SI2
tSHIX
0.8 VCC
0.8 VCC
0.2 VCC
0.2 VCC
41
MB89620R Series
(10) Peripheral Input Timing
(VCC = +5.0 V±10%, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Symbol Pin name
Parameter
Peripheral input “H” pulse width 1
tILIH1
Peripheral input “L” pulse width 1
tIHIL1
Peripheral input “H” pulse width 2
tILIH2
Peripheral input “L” pulse width 2
tIHIL2
Peripheral input “H” pulse width 2
tILIH2
Peripheral input “L” pulse width 2
tIHIL2
Condition
PWC,
EC, INT0
to INT3
—
A/D mode
ADST
Sense mode
Value
Max.
2 tinst*
—
µs
2 tinst*
—
µs
32 tinst*
—
µs
32 tinst*
—
µs
8 tinst*
—
µs
8 tinst*
—
µs
*: For information on tinst, see “(4) Instruction Cycle.”
tIHIL1
PWC
EC
INT0 to INT3
tILIH1
0.2 VCC
0.2 VCC
tIHIL2
tILIH2
0.8 VCC
ADST
0.2 VCC
42
0.8 VCC
0.8 VCC
0.2 VCC
Unit
Min.
0.8 VCC
Remarks
MB89620R Series
5. A/D Converter Electrical Characteristics
(AVCC = VCC = +3.5 V to +6.0 V, AVSS = VSS = 0.0 V, TA = –40°C to +85°C)
Parameter
Symbol Pin name
Resolution
Condition
—
Total error
—
Linearity error
Differential linearity
error
Zero transition
voltage
VOT
Full-scale transition
voltage
VFST
AVR=AVCC
Unit Remarks
Min.
Typ.
Max.
—
—
8
bit
—
—
±1.5
LSB
—
—
±1.0
LSB
—
—
±0.9
LSB
AVSS –1.0LSB AVSS +0.5LSB AVSS +2.0LSB
mV
AVR–3.0LSB
AVR–1.5LSB
AVR
mV
—
—
0.5
LSB
—
44 tinst*
—
µs
—
12 tinst*
—
µs
—
—
10
µA
—
Interchannel
disparity
A/D mode
conversion time
—
Sense mode
conversion time
Analog port input
current
Value
—
IAIN
AN0 to AN7
Analog input voltage
—
0.0
—
AVR
V
Reference voltage
—
0.0
—
AVCC
V
AVR = 5.0 V,
when starting
A/D
conversion
—
100

µA
AVR = 5.0 V,
when
stopping A/D
conversion
—
—
1
µA
IR
AVR
Reference voltage
supply current
IRH
*: For information on tinst, see “(4) Instruction Cycle” in “4 AC Characteristics.”
6. A/D Converter Glossary
• Resolution
Analog changes that are identifiable with the A/D converter.
When the number of bits is 8, analog voltage can be divided into 28 = 256.
• Linearity error (unit: LSB)
The deviation of the straight line connecting the zero transition point (“0000 0000” ↔ “0000 0001”) with the
full-scale transition point (“1111 1111” ↔ “1111 1110”) from actual conversion characteristics
• Differential linearity error (unit: LSB)
The deviation of input voltage needed to change the output code by 1 LSB from the theoretical value
• Total error (unit: LSB)
The difference between theoretical and actual conversion values
43
MB89620R Series
Digital
Digitaloutput
output
1111
1111 1111
1111
1111
1111 • • 1110
1110
••
••
••
••
••
••
••
••
••
••
••
••
••
••
••
••
••
••
••
Theoretical
Theoreticalconversion
conversionvalue
value
Actual
Actualconversion
conversionvalue
value
(1
(1LSB
LSB××NN++VVOT
OT))
11LSB
LSB==
AVR
AVR
256
256
Linearity
Linearityerror
error==
Linearity
Linearityerror
error
VVNT
NT –– (1
(1LSB
LSB××NN++VVOT
OT))
11LSB
LSB
VV((NN++11))TT––VVNT
NT
Differential
––11
Differentiallinearity
linearityerror
error==
11LSB
LSB
Total
Totalerror
error==
VVNT
NT –– (1
(1LSB
LSB××NN++11LSB)
LSB)
11LSB
LSB
0000
0000 0010
0010
0000
0000 0001
0001
0000
0000 0000
0000
VVOT
OT
VVNT
NT V
V(N
(N++I)T
I)T
VVFST
FST
Analog
Analoginput
input
7. Notes on Using A/D Converter
• Input impedance of the analog input pins
The A/D converter contains a sample hold circuit as illustrated below to fetch analog input voltage into the
sample hold capacitor for eight instruction cycles after activating A/D conversion.
For this reason, if the output impedance of the external circuit for the analog input is high, analog input voltage
might not stabilize within the analog input sampling period. Therefore, it is recommended to keep the output
impedance of the external circuit low (below 10 kΩ).
Note that if the impedance cannot be kept low, it is recommended to connect an external capacitor of about
0.1 µF for the analog input pin.
• Analog Input Equivalent Circiut
Sample hold circuit
.
C =. 33 pF
Analog input pin
Comparator
If the analog input
impedance is higher
than 10 kΩ, it is
recommended to
connect an external
capacitor of approx.
0.1 µF.
.
R =. 6 kΩ
Close for 8 instruction cycles after activating
A/D conversion.
Analog channel selector
• Error
The smaller the | AVR – AVSS |, the greater the error would become relatively.
44
MB89620R Series
■ EXAMPLE CHARACTERISTICS
(2) “H” Level Output Voltage
(1) “L” Level Output Voltage
VOL vs. IOL
VOL (V)
VCC = 3.0 V
VCC = 4.0 V
TA = +25°C
0.5
VCC = 5.0 V
0.4
VCC = 6.0 V
0.3
VCC – VOH (V)
1.0
0.9
VCC – VOH vs. IOH
TA = +25°C
VCC = 2.5 V
0.8
0.7
0.6
VCC = 3.0 V
0.5
VCC = 4.0 V
VCC = 5.0 V
VCC = 6.0 V
0.4
0.2
0.3
0.2
0.1
0.1
0
1
2
3
4
5
6
7
8
0.0
0.0
9 10
IOL (mA)
(3) “H” Level Input Voltage/“L” Level Input
Voltage (CMOS Input)
TA = +25°C
4.0
3.5
3.5
3.0
3.0
2.5
2.5
2.0
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0.0
0.0
2
3
4
5
6
–2.0
–2.5
–3.0
IOH (mA)
TA = +25°C
4.5
4.0
1
–1.5
VIN vs. VCC
VIN (V)
5.0
4.5
0
–1.0
(4) “H” Level Input Voltage/“L” Level Input
Voltage (Hysteresis Input)
VIN vs. VCC
VIN (V)
5.0
–0.5
7
VCC (V)
VIHS
VILS
0
1
2
3
4
5
6
7
VCC (V)
VIHS: Threshold when input voltage in hysteresis
characteristics is set to “H” level
VILS: Threshold when input voltage in hysteresis
characteristics is set to “L” level
45
MB89620R Series
(5) Power Supply Current (External Clock)
ICC vs. VCC
ICC (mA)
16
ICCS vs. VCC
ICCS (mA)
5
TA = +25°C
TA = +25°C
14
FC = 10 MHz
4
12
10
FC = 10 MHz
8
FC = 8 MHz
6
FC = 8 MHz
3
2
FC = 4 MHz
4
FC = 4 MHz
1
2
FC = 1 MHz
0
1
3
2
4
5
6
7
VCC (V)
IA vs. AVCC
IA (mA)
5.0
1
FC = 10 MHz
TA = +25°C
160
3.5
140
3.0
120
2.5
100
2.0
80
1.5
60
1.0
40
0.5
20
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
AVCC (V)
(6) Pull-up Resistance
RPULL vs. VCC
RPULL (kΩ)
1000
TA = +25°C
100
10
1
2
3
4
5
4
5
6
VCC (V)
0
2.0
6
7
VCC (V)
IR vs. AVR
TA = +25°C
180
4.0
0
2.0
3
2
IR (µA)
200
4.5
46
FC = 1 MHz
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
AVR (V)
MB89620R Series
■ INSTRUCTIONS (136 INSTRUCTIONS)
Execution instructions can be divided into the following four groups:
• Transfer
• Arithmetic operation
• Branch
• Others
Table 1 lists symbols used for notation of instructions.
Table 1
Symbol
dir
off
ext
#vct
#d8
#d16
dir: b
rel
@
A
AH
AL
T
TH
TL
IX
EP
PC
SP
PS
dr
CCR
RP
Ri
×
(×)
(( × ))
Instruction Symbols
Meaning
Direct address (8 bits)
Offset (8 bits)
Extended address (16 bits)
Vector table number (3 bits)
Immediate data (8 bits)
Immediate data (16 bits)
Bit direct address (8:3 bits)
Branch relative address (8 bits)
Register indirect (Example: @A, @IX, @EP)
Accumulator A (Whether its length is 8 or 16 bits is determined by the instruction in use.)
Upper 8 bits of accumulator A (8 bits)
Lower 8 bits of accumulator A (8 bits)
Temporary accumulator T (Whether its length is 8 or 16 bits is determined by the instruction in use.)
Upper 8 bits of temporary accumulator T (8 bits)
Lower 8 bits of temporary accumulator T (8 bits)
Index register IX (16 bits)
Extra pointer EP (16 bits)
Program counter PC (16 bits)
Stack pointer SP (16 bits)
Program status PS (16 bits)
Accumulator A or index register IX (16 bits)
Condition code register CCR (8 bits)
Register bank pointer RP (5 bits)
General-purpose register Ri (8 bits, i = 0 to 7)
Indicates that the very × is the immediate data.
(Whether its length is 8 or 16 bits is determined by the instruction in use.)
Indicates that the contents of × is the target of accessing.
(Whether its length is 8 or 16 bits is determined by the instruction in use.)
The address indicated by the contents of × is the target of accessing.
(Whether its length is 8 or 16 bits is determined by the instruction in use.)
Columns indicate the following:
Mnemonic: Assembler notation of an instruction
~:
The number of instructions
#:
The number of bytes
Operation: Operation of an instruction
TL, TH, AH:
A content change when each of the TL, TH, and AH instructions is executed. Symbols in
the column indicate the following:
• “–” indicates no change.
• dH is the 8 upper bits of operation description data.
• AL and AH must become the contents of AL and AH prior to the instruction executed.
• 00 becomes 00.
N, Z, V, C:
An instruction of which the corresponding flag will change. If + is written in this column,
the relevant instruction will change its corresponding flag.
OP code:
Code of an instruction. If an instruction is more than one code, it is written according to
the following rule:
Example: 48 to 4F ← This indicates 48, 49, ... 4F.
47
MB89620R Series
Table 2
Mnemonic
Transfer Instructions (48 instructions)
~
#
Operation
TL
TH
AH
NZVC
OP code
MOV dir,A
MOV @IX +off,A
MOV ext,A
MOV @EP,A
MOV Ri,A
MOV A,#d8
MOV A,dir
MOV A,@IX +off
MOV A,ext
MOV A,@A
MOV A,@EP
MOV A,Ri
MOV dir,#d8
MOV @IX +off,#d8
MOV @EP,#d8
MOV Ri,#d8
MOVW dir,A
MOVW @IX +off,A
3
4
4
3
3
2
3
4
4
3
3
3
4
5
4
4
4
5
2
2
3
1
1
2
2
2
3
1
1
1
3
3
2
2
2
2
–
–
–
–
–
AL
AL
AL
AL
AL
AL
AL
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
––––
––––
––––
––––
––––
++––
++––
++––
++––
++––
++––
++––
––––
––––
––––
––––
––––
––––
45
46
61
47
48 to 4F
04
05
06
60
92
07
08 to 0F
85
86
87
88 to 8F
D5
D6
MOVW ext,A
MOVW @EP,A
MOVW EP,A
MOVW A,#d16
MOVW A,dir
MOVW A,@IX +off
5
4
2
3
4
5
3
1
1
3
2
2
–
–
–
AL
AL
AL
–
–
–
AH
AH
AH
–
–
–
dH
dH
dH
––––
––––
––––
++––
++––
++––
D4
D7
E3
E4
C5
C6
MOVW A,ext
MOVW A,@A
MOVW A,@EP
MOVW A,EP
MOVW EP,#d16
MOVW IX,A
MOVW A,IX
MOVW SP,A
MOVW A,SP
MOV @A,T
MOVW @A,T
MOVW IX,#d16
MOVW A,PS
MOVW PS,A
MOVW SP,#d16
SWAP
SETB dir: b
CLRB dir: b
XCH A,T
XCHW A,T
XCHW A,EP
XCHW A,IX
XCHW A,SP
MOVW A,PC
5
4
4
2
3
2
2
2
2
3
4
3
2
2
3
2
4
4
2
3
3
3
3
2
3
1
1
1
3
1
1
1
1
1
1
3
1
1
3
1
2
2
1
1
1
1
1
1
(dir) ← (A)
( (IX) +off ) ← (A)
(ext) ← (A)
( (EP) ) ← (A)
(Ri) ← (A)
(A) ← d8
(A) ← (dir)
(A) ← ( (IX) +off)
(A) ← (ext)
(A) ← ( (A) )
(A) ← ( (EP) )
(A) ← (Ri)
(dir) ← d8
( (IX) +off ) ← d8
( (EP) ) ← d8
(Ri) ← d8
(dir) ← (AH),(dir + 1) ← (AL)
( (IX) +off) ← (AH),
( (IX) +off + 1) ← (AL)
(ext) ← (AH), (ext + 1) ← (AL)
( (EP) ) ← (AH),( (EP) + 1) ← (AL)
(EP) ← (A)
(A) ← d16
(AH) ← (dir), (AL) ← (dir + 1)
(AH) ← ( (IX) +off),
(AL) ← ( (IX) +off + 1)
(AH) ← (ext), (AL) ← (ext + 1)
(AH) ← ( (A) ), (AL) ← ( (A) ) + 1)
(AH) ← ( (EP) ), (AL) ← ( (EP) + 1)
(A) ← (EP)
(EP) ← d16
(IX) ← (A)
(A) ← (IX)
(SP) ← (A)
(A) ← (SP)
( (A) ) ← (T)
( (A) ) ← (TH),( (A) + 1) ← (TL)
(IX) ← d16
(A) ← (PS)
(PS) ← (A)
(SP) ← d16
(AH) ↔ (AL)
(dir): b ← 1
(dir): b ← 0
(AL) ↔ (TL)
(A) ↔ (T)
(A) ↔ (EP)
(A) ↔ (IX)
(A) ↔ (SP)
(A) ← (PC)
AL
AL
AL
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
AL
AL
–
–
–
–
AH
AH
AH
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
AH
–
–
–
–
dH
dH
dH
dH
–
–
dH
–
dH
–
–
–
dH
–
–
AL
–
–
–
dH
dH
dH
dH
dH
++––
++––
++––
––––
––––
––––
––––
––––
––––
––––
––––
––––
––––
++++
––––
––––
––––
––––
––––
––––
––––
––––
––––
––––
C4
93
C7
F3
E7
E2
F2
E1
F1
82
83
E6
70
71
E5
10
A8 to AF
A0 to A7
42
43
F7
F6
F5
F0
Note: During byte transfer to A, T ← A is restricted to low bytes.
Operands in more than one operand instruction must be stored in the order in which their mnemonics
are written. (Reverse arrangement of F2MC-8 family)
48
MB89620R Series
Table 3
Mnemonic
~
#
ADDC A,Ri
ADDC A,#d8
ADDC A,dir
ADDC A,@IX +off
ADDC A,@EP
ADDCW A
ADDC A
SUBC A,Ri
SUBC A,#d8
SUBC A,dir
SUBC A,@IX +off
SUBC A,@EP
SUBCW A
SUBC A
INC Ri
INCW EP
INCW IX
INCW A
DEC Ri
DECW EP
DECW IX
DECW A
MULU A
DIVU A
ANDW A
ORW A
XORW A
CMP A
CMPW A
RORC A
3
2
3
4
3
3
2
3
2
3
4
3
3
2
4
3
3
3
4
3
3
3
19
21
3
3
3
2
3
2
1
2
2
2
1
1
1
1
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
ROLC A
2
1
CMP A,#d8
CMP A,dir
CMP A,@EP
CMP A,@IX +off
CMP A,Ri
DAA
DAS
XOR A
XOR A,#d8
XOR A,dir
XOR A,@EP
XOR A,@IX +off
XOR A,Ri
AND A
AND A,#d8
AND A,dir
2
3
3
4
3
2
2
2
2
3
3
4
3
2
2
3
2
2
1
2
1
1
1
1
2
2
1
2
1
1
2
2
Arithmetic Operation Instructions (62 instructions)
Operation
TL
TH
AH
NZVC
OP code
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
dL
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
00
–
–
–
–
–
–
–
–
–
–
–
dH
–
–
–
–
–
–
dH
–
–
–
–
dH
–
–
–
dH
dH
00
dH
dH
dH
–
–
–
++++
++++
++++
++++
++++
++++
++++
++++
++++
++++
++++
++++
++++
++++
+++–
––––
––––
++––
+++–
––––
––––
++––
––––
––––
++R–
++R–
++R–
++++
++++
++–+
28 to 2F
24
25
26
27
23
22
38 to 3F
34
35
36
37
33
32
C8 to CF
C3
C2
C0
D8 to DF
D3
D2
D0
01
11
63
73
53
12
13
03
C ← A←
–
–
–
++–+
02
(A) − d8
(A) − (dir)
(A) − ( (EP) )
(A) − ( (IX) +off)
(A) − (Ri)
Decimal adjust for addition
Decimal adjust for subtraction
(A) ← (AL) ∀ (TL)
(A) ← (AL) ∀ d8
(A) ← (AL) ∀ (dir)
(A) ← (AL) ∀ ( (EP) )
(A) ← (AL) ∀ ( (IX) +off)
(A) ← (AL) ∀ (Ri)
(A) ← (AL) ∧ (TL)
(A) ← (AL) ∧ d8
(A) ← (AL) ∧ (dir)
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
++++
++++
++++
++++
++++
++++
++++
++R–
++R–
++R–
++R–
++R–
++R–
++R–
++R–
++R–
14
15
17
16
18 to 1F
84
94
52
54
55
57
56
58 to 5F
62
64
65
(A) ← (A) + (Ri) + C
(A) ← (A) + d8 + C
(A) ← (A) + (dir) + C
(A) ← (A) + ( (IX) +off) + C
(A) ← (A) + ( (EP) ) + C
(A) ← (A) + (T) + C
(AL) ← (AL) + (TL) + C
(A) ← (A) − (Ri) − C
(A) ← (A) − d8 − C
(A) ← (A) − (dir) − C
(A) ← (A) − ( (IX) +off) − C
(A) ← (A) − ( (EP) ) − C
(A) ← (T) − (A) − C
(AL) ← (TL) − (AL) − C
(Ri) ← (Ri) + 1
(EP) ← (EP) + 1
(IX) ← (IX) + 1
(A) ← (A) + 1
(Ri) ← (Ri) − 1
(EP) ← (EP) − 1
(IX) ← (IX) − 1
(A) ← (A) − 1
(A) ← (AL) × (TL)
(A) ← (T) / (AL),MOD → (T)
(A) ← (A) ∧ (T)
(A) ← (A) ∨ (T)
(A) ← (A) ∀ (T)
(TL) − (AL)
(T) − (A)
→ C→A
(Continued)
49
MB89620R Series
(Continued)
Mnemonic
AND A,@EP
AND A,@IX +off
AND A,Ri
OR A
OR A,#d8
OR A,dir
OR A,@EP
OR A,@IX +off
OR A,Ri
CMP dir,#d8
CMP @EP,#d8
CMP @IX +off,#d8
CMP Ri,#d8
INCW SP
DECW SP
~
#
Operation
3
4
3
2
2
3
3
4
3
5
4
5
4
3
3
1
2
1
1
2
2
1
2
1
3
2
3
2
1
1
(A) ← (AL) ∧ ( (EP) )
(A) ← (AL) ∧ ( (IX) +off)
(A) ← (AL) ∧ (Ri)
(A) ← (AL) ∨ (TL)
(A) ← (AL) ∨ d8
(A) ← (AL) ∨ (dir)
(A) ← (AL) ∨ ( (EP) )
(A) ← (AL) ∨ ( (IX) +off)
(A) ← (AL) ∨ (Ri)
(dir) – d8
( (EP) ) – d8
( (IX) + off) – d8
(Ri) – d8
(SP) ← (SP) + 1
(SP) ← (SP) – 1
Table 4
Mnemonic
BZ/BEQ rel
BNZ/BNE rel
BC/BLO rel
BNC/BHS rel
BN rel
BP rel
BLT rel
BGE rel
BBC dir: b,rel
BBS dir: b,rel
JMP @A
JMP ext
CALLV #vct
CALL ext
XCHW A,PC
RET
RETI
~
#
3
3
3
3
3
3
3
3
5
5
2
3
6
6
3
4
6
2
2
2
2
2
2
2
2
3
3
1
3
1
3
1
1
1
Mnemonic
PUSHW A
POPW A
PUSHW IX
POPW IX
NOP
CLRC
SETC
CLRI
SETI
50
~
#
4
4
4
4
1
1
1
1
1
1
1
1
1
1
1
1
1
1
TH
AH
NZVC
OP code
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
++R–
++R–
++R–
++R–
++R–
++R–
++R–
++R–
++R–
++++
++++
++++
++++
––––
––––
67
66
68 to 6F
72
74
75
77
76
78 to 7F
95
97
96
98 to 9F
C1
D1
Branch Instructions (17 instructions)
Operation
If Z = 1 then PC ← PC + rel
If Z = 0 then PC ← PC + rel
If C = 1 then PC ← PC + rel
If C = 0 then PC ← PC + rel
If N = 1 then PC ← PC + rel
If N = 0 then PC ← PC + rel
If V ∀ N = 1 then PC ← PC + rel
If V ∀ N = 0 then PC ← PC + reI
If (dir: b) = 0 then PC ← PC + rel
If (dir: b) = 1 then PC ← PC + rel
(PC) ← (A)
(PC) ← ext
Vector call
Subroutine call
(PC) ← (A),(A) ← (PC) + 1
Return from subrountine
Return form interrupt
Table 5
TL
TL
TH
AH
NZVC
OP code
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
dH
–
–
––––
––––
––––
––––
––––
––––
––––
––––
–+––
–+––
––––
––––
––––
––––
––––
––––
Restore
FD
FC
F9
F8
FB
FA
FF
FE
B0 to B7
B8 to BF
E0
21
E8 to EF
31
F4
20
30
Other Instructions (9 instructions)
Operation
TL
TH
AH
NZVC
OP code
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
dH
–
–
–
–
–
–
–
––––
––––
––––
––––
––––
–––R
–––S
––––
––––
40
50
41
51
00
81
91
80
90
L
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R0
A,R0
A,R0
A,R0
R0,A
A,R0
A,R0
A,R0
R0,#d8
R0,#d8
dir: 0 dir: 0,rel
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R1
A,R1
A,R1
A,R1
R1,A
A,R1
A,R1
A,R1
R1,#d8
R1,#d8
dir: 1 dir: 1,rel
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R2
A,R2
A,R2
A,R2
R2,A
A,R2
A,R2
A,R2
R2,#d8
R2,#d8
dir: 2 dir: 2,rel
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R3
A,R3
A,R3
A,R3
R3,A
A,R3
A,R3
A,R3
R3,#d8
R3,#d8
dir: 3 dir: 3,rel
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R4
A,R4
A,R4
A,R4
R4,A
A,R4
A,R4
A,R4
R4,#d8
R4,#d8
dir: 4 dir: 4,rel
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R5
A,R5
A,R5
A,R5
R5,A
A,R5
A,R5
A,R5
R5,#d8
R5,#d8
dir: 5 dir: 5,rel
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R6
A,R6
A,R6
A,R6
R6,A
A,R6
A,R6
A,R6
R6,#d8
R6,#d8
dir: 6 dir: 6,rel
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
SETB
BBS
INC
A,R7
A,R7
A,R7
A,R7
R7,A
A,R7
A,R7
A,R7
R7,#d8
R7,#d8
dir: 7 dir: 7,rel
9
A
B
C
D
E
F
A
SUBC
A
XCH
A, T
XOR
A
AND
A
OR
A
MOV
MOV
CLRB
BBC
INCW
DECW
MOVW
MOVW
@A,T
A,@A
dir: 2 dir: 2,rel
IX
IX
IX,A
A,IX
XOR
AND
OR
DAA
A,#d8
A,#d8
A,#d8
DAS
R7
R6
R5
R4
R3
R2
R1
R0
DEC
DEC
DEC
DEC
DEC
DEC
DEC
DEC
R7
R6
R5
R4
R3
R2
R1
R0
rel
rel
rel
rel
CALLV
BLT
#7
rel
CALLV
BGE
#6
rel
CALLV
BZ
#5
CALLV
BNZ
#4
rel
CALLV
BN
#3
CALLV
BP
#2
CALLV
BC
#1
CALLV
BNC
#0
rel
CLRB
BBC
MOVW
MOVW
MOVW
XCHW
dir: 4 dir: 4,rel
A,ext
ext,A
A,#d16
A,PC
ADDCW SUBCW XCHW
XORW
ANDW
ORW
MOVW
MOVW
CLRB
BBC
INCW
DECW
MOVW
MOVW
A
A
A, T
A
A
A
@A,T
A,@A
dir: 3 dir: 3,rel
EP
EP
EP,A
A,EP
ADDC
CLRB
BBC
INCW
DECW
MOVW
MOVW
dir: 1 dir: 1,rel
SP
SP
SP,A
A,SP
8
A
A
SETC
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
CLRB
BBC
MOVW
MOVW
MOVW
XCHW
A,@EP
A,@EP
A,@EP
A,@EP
@EP,A
A,@EP
A,@EP
A,@EP @EP,#d8 @EP,#d8
dir: 7 dir: 7,rel
A,@EP
@EP,A EP,#d16
A,EP
CMPW
CMP
JMP
CALL
PUSHW POPW
MOV
MOVW
CLRC
addr16
addr16
IX
IX
ext,A
PS,A
7
F
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
CLRB
BBC
MOVW
MOVW
MOVW
XCHW
A,@IX +d A,@IX +d A,@IX +d A,@IX +d @IX +d,A A,@IX +d A,@IX +d A,@IX +d @IX +d,#d8 @IX +d,#d8
dir: 6
dir: 6,rel A,@IX +d @IX +d,A
IX,#d16
A,IX
E
6
D
MOV
CMP
ADDC
SUBC
MOV
XOR
AND
OR
MOV
CMP
CLRB
BBC
MOVW
MOVW
MOVW
XCHW
A,dir
A,dir
A,dir
A,dir
dir,A
A,dir
A,dir
A,dir
dir,#d8
dir,#d8
dir: 5 dir: 5,rel
A,dir
dir,A SP,#d16
A,SP
C
5
B
CLRB
BBC
INCW
DECW
JMP
MOVW
dir: 0 dir: 0,rel
A
A
@A
A,PC
A
MOV
CMP
ADDC
SUBC
A,#d8
A,#d8
A,#d8
A,#d8
A
A
DIVU
SETI
9
4
8
RORC
7
3
6
ROLC
A
5
PUSHW POPW
MOV
MOVW
CLRI
A
A
A,ext
A,PS
4
2
A
RETI
3
MULU
RET
2
1
SWAP
1
NOP
0
0
H
MB89620R Series
■ INSTRUCTION MAP
51
MB89620R Series
■ MASK OPTIONS
Part number
MB89623R
MB89625R
MB89626R
MB89627R
Specifying procedure
Specify when
ordering masking
No.
52
Selectable per pin.
(P50 to P57 must
be set to without a
pull-up resistor
when an A/D
converter is used.)
MB89P625
MB89W625
MB89P627
MB89W627
Set with EPROM
programmer
MB89PV620
MB89T627R
Setting not
possible
Can be set per pin.
(P40 to P47 are
available only for
without a pull-up
resistor.)
Fixed to without pull-up
resistor
1
Pull-up resistors
P00 to P07, P10 to P17,
P30 to P37, P40 to P47,
P50 to P57, P60 to P64
2
Power-on reset selection
With power-on reset
Without power-on reset
Selectable
Setting possible
Fixed to with power-on
reset
3
Oscillation stabilization time
selection
Crystal oscillator: 218/FC(s)
Ceramic oscillator: 214/FC(s)
Selectable
Setting possible
Crystal oscillator
(218/FC(s))
4
Reset pin output
With reset output
Without reset output
Selectable
Setting possible
With reset output
MB89620R Series
■ ORDERING INFORMATION
Part number
MB89623RP-SH
MB89625RP-SH
MB89626RP-SH
MB89627RP-SH
MB89P625P-SH
MB89P627-SH
MB89T627RP-SH
Package
Remarks
64-pin Plastic SH-DIP
(DIP-64P-M01)
MB89623RPFV
MB89625RPFV
64-pin Plastic LQFP
(FPT-64P-M03)
Lead pitch: 0.5 mm
MB89623RPF
MB89625RPF
MB89626RPF
MB89627RPF
MB89P625PF
MB89P627PF
MB89T623RPF
MB89T625RPF
MB89T627RPF
64-pin Plastic QFP
(FPT-64P-M06)
Lead pitch: 1.0 mm
MB89623RPFM
MB89625RPFM
MB89626RPFM
MB89627RPFM
MB89P625PFM
MB89P627PFM
MB89T627RPFM
64-pin Plastic QFP
(FPT-64P-M09)
Lead pitch: 0.65 mm
MB89W625C-SH
MB89W627C-SH
64-pin Ceramic SH-DIP
(DIP-64C-A06)
MB89PV620CF
64-pin Ceramic MQFP
(MQP-64C-P01)
MB89PV620C-SH
64-pin Ceramic MDIP
(MDP-64C-P02)
53
MB89620R Series
■ PACKAGE DIMENSIONS
64-pin Plastic SH-DIP
(DIP-64P-M01)
+0.22
58.00 –0.55
+.008
2.283 –.022
INDEX-1
17.00±0.25
(.669±.010)
INDEX-2
5.65(.222)MAX
0.25±0.05
(.010±.002)
3.00(.118)MIN
+0.50
1.00 –0
+.020
.039 –0
0.45±0.10
(.018±.004)
0.51(.020)MIN
15°MAX
19.05(.750)
TYP
1.778±0.18
(.070±.007)
1.778(.070)
MAX
C
1994 FUJITSU LIMITED D64001S-3C-4
55.118(2.170)REF
Dimensions in mm(inches).
(Continued)
54
MB89620R Series
(Continued)
64-pin Plastic LQFP
(FPT-64P-M03)
12.00±0.20(.472±.008)SQ
10.00±0.10(.394±.004)SQ
48
33
49
32
0.08(.003)
Details of "A" part
INDEX
+0.20
1.50 –0.10
+.008
(Mounting height)
.059 –.004
64
17
"A"
LEAD No.
1
0.50±0.08
(.020±.003)
0~8°
16
0.18
.007
+0.08
–0.03
+.003
–.001
0.08(.003)
M
0.145±0.055
(.006±.002)
0.50±0.20
(.020±.008)
0.45/0.75
(.018/.030)
C
1998 FUJITSU LIMITED F64009S-3C-6
0.10±0.10
(.004±.004)
(Stand off)
0.25(.010)
Dimensions in mm (inches).
(Continued)
55
MB89620R Series
(Continued)
64-pin Plastic QFP
(FPT-64P-M06)
24.70±0.40(.972±.016)
20.00±0.20(.787±.008)
51
3.35(.132)MAX
(Mounting height)
0.05(.002)MIN
(STAND OFF)
33
52
32
14.00±0.20
(.551±.008)
18.70±0.40
(.736±.016)
12.00(.472)
REF
16.30±0.40
(.642±.016)
INDEX
64
20
"A"
LEAD No.
19
1
1.00(.0394)
TYP
0.40±0.10
(.016±.004)
0.15±0.05(.006±.002)
0.20(.008)
M
Details of "A" part
Details of "B" part
0.25(.010)
"B"
0.10(.004)
18.00(.709)REF
22.30±0.40(.878±.016)
C
2000 FUJITSU LIMITED F64013S-3C-3
0.30(.012)
0.18(.007)MAX
0.63(.025)MAX
0
10°
1.20±0.20
(.047±.008)
Dimensions in mm (inches).
(Continued)
56
MB89620R Series
(Continued)
64-pin Plastic QFP
(FPT-64P-M09)
14.00±0.20(.551±.008)SQ
48
33
12.00±0.10(.472±.004)SQ
+0.20
1.50 –0.10
+.008
.059 –.004
49
(Mounting height)
32
9.75
(.384)
REF
13.00
(.512)
NOM
1 PIN INDEX
64
LEAD No.
17
1
0.65(.0256)TYP
Details of "A" part
16
0.30±0.10
(.012±.004)
"A"
0.13(.005)
M
+0.05
0.127 –0.02
0.10±0.10 (STAND OFF)
(.004±.004)
+.002
.005 –.001
0.10(.004)
0
C
2000 FUJITSU LIMITED F64018S-1C-3
10°
0.50±0.20
(.020±.008)
Dimensions in mm (inches).
(Continued)
57
MB89620R Series
(Continued)
64-pin Ceramic SH-DIP
(DIP-64C-A06)
56.90±0.56
(2.240±.022)
8.89(.350) DIA
TYP
R1.27(.050)
REF
18.75±0.25
(.738±.010)
INDEX AREA
1.27±0.25
(.050±.010)
5.84(.230)MAX
0.25±0.05
(.010±.004)
3.40±0.36
(.134±.014)
1.45(.057)
MAX
C
1994 FUJITSU LIMITED D64006SC-1-2
1.778±0.180
(.070±.007)
0.90±0.10
(.0355±.0040)
+0.13
0.46 –0.08
+.005
.018 –.003
19.05±0.25
(.750±.010)
0°~9°
55.118(2.170)REF
Dimensions in mm (inches).
(Continued)
58
MB89620R Series
(Continued)
64-pin Ceramic MQFP
(MQP-64C-P01)
18.70(.736)TYP
INDEX AREA
16.30±0.33
(.642±.013)
15.58±0.20
(.613±.008)
12.00(.472)TYP
+0.40
1.20 –0.20
.047
1.00±0.25
(.039±.010)
+.016
–.008
1.00±0.25
(.039±.010)
1.27±0.13
(.050±.005)
22.30±0.33
(.878±.013)
24.70(.972)
TYP
0.30(.012)
TYP
1.27±0.13
(.050±.005)
18.12±0.20
12.02(.473)
(.713±.008)
TYP
10.16(.400)
14.22(.560)
TYP
TYP
0.30(.012)TYP
7.62(.300)TYP
0.40±0.10
(.016±.004)
18.00(.709)
TYP
0.40±0.10
(.016±.004)
+0.40
1.20 –0.20
+.016
.047 –.008
9.48(.373)TYP
11.68(.460)TYP
0.50(.020)TYP
C
1994 FUJITSU LIMITED M64004SC-1-3
10.82(.426)
0.15±0.05 MAX
(.006±.002)
Dimensions in mm (inches).
(Continued)
59
MB89620R Series
(Continued)
64-pin Ceramic MDIP
(MDP-64C-P02)
0°~9°
56.90±0.64
(2.240±.025)
15.24(.600)
TYP
18.75±0.30
(.738±.012)
2.54±0.25
(.100±.010)
33.02(1.300)REF
INDEX AREA
0.25±0.05
(.010±.002)
1.27±0.25
(.050±.010)
10.16(.400)MAX
1.778±0.25
(.070±.010)
C
60
19.05±0.30
(.750±.012)
1994 FUJITSU LIMITED M64002SC-1-4
+0.13
0.46 –0.08
+.005
.018 –.003
55.12(2.170)REF
0.90±0.13
(.035±.005)
3.43±0.38
(.135±.015)
Dimensions in mm (inches).
MB89620R Series
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
Corporate Global Business Support Division
Electronic Devices
Shinjuku Dai-Ichi Seimei Bldg. 7-1,
Nishishinjuku 2-chome, Shinjuku-ku,
Tokyo 163-0721, Japan
Tel: +81-3-5322-3347
Fax: +81-3-5322-3386
http://edevice.fujitsu.com/
North and South America
FUJITSU MICROELECTRONICS, INC.
3545 North First Street,
San Jose, CA 95134-1804, U.S.A.
Tel: +1-408-922-9000
Fax: +1-408-922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: +1-800-866-8608
Fax: +1-408-922-9179
http://www.fujitsumicro.com/
Europe
FUJITSU MICROELECTRONICS EUROPE GmbH
Am Siebenstein 6-10,
D-63303 Dreieich-Buchschlag,
Germany
Tel: +49-6103-690-0
Fax: +49-6103-690-122
http://www.fujitsu-fme.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE. LTD.
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-281-0770
Fax: +65-281-0220
http://www.fmap.com.sg/
Korea
FUJITSU MICROELECTRONICS KOREA LTD.
1702 KOSMO TOWER, 1002 Daechi-Dong,
Kangnam-Gu,Seoul 135-280
Korea
Tel: +82-2-3484-7100
Fax: +82-2-3484-7111
F0012
 FUJITSU LIMITED Printed in Japan
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications, and
are not intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the use
of this information or circuit diagrams.
The contents of this document may not be reproduced or copied
without the permission of FUJITSU LIMITED.
FUJITSU semiconductor devices are intended for use in standard
applications (computers, office automation and other office
equipments, industrial, communications, and measurement
equipments, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage, or
where extremely high levels of reliability are demanded (such as
aerospace systems, atomic energy controls, sea floor repeaters,
vehicle operating controls, medical devices for life support, etc.)
are requested to consult with FUJITSU sales representatives before
such use. The company will not be responsible for damages arising
from such use without prior approval.
Any semiconductor devices have inherently a certain rate of failure.
You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Control Law of Japan, the
prior authorization by Japanese government should be required for
export of those products from Japan.
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