Intersema MS5541B Miniature 14 bar module Datasheet

MS5541B (RoHS*)
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MINIATURE 14 bar MODULE
Integrated pressure sensor 6.2x6.4 mm
Pressure range 0 - 14 bar (200 PSI)
15 Bit ADC
6 coefficients for a software compensation stored
on-chip
3-wire serial interface
1 system clock line (32.768 kHz)
Low voltage / low power
RoHS-compatible & Pb-free*
DESCRIPTION
The MS5541B is the miniature version of the popular MS5535B pressure sensor module. It contains a precision
piezoresistive pressure sensor and an improved version of the 15 Bit Micropower Sensor interface IC known
from the MS5535B. Compared to the MS5535A the temperature range has been improved (-40 to +85°C).
Other improvements concern the ESD sensitivity, current consumption and converter accuracy. In addition to
this the MS5541B is from its outer dimensions compatible to the MS54xx series of pressure sensors. It uses an
antimagnetic polished stainless steel ring for sealing with O-ring. The sensor provides 15 Bit pressure and
temperature data via a 3 wire serial interface that can be easily interfaced with 4 Bit low power microcontrollers.
64 Bit of factory programmed PROM provides calibration data for a highly accurate pressure and temperature
calculation. The MS5541B is fully software compatible to the MS5535B and MS5535A.
FEATURES
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APPLICATIONS
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Resolution 1.2 mbar
Supply voltage 2.2 V to 3.6 V
Operating current < 5uA
Standby current < 0.1uA
-40°C to +85°C
Small size 6.2x6.4 mm
No external components required
Diving computers and divers watches
Mobile water depth measurement systems
BLOCK DIAGRAM
VDD
MCLK
Input MUX
SENSOR
Digital
Interface
+IN
-IN
ADC
Sensor
Interface IC
SGND
DIN
DOUT
dig.
Filter
SCLK
Memory
(PROM)
64 bits
GND
Fig.: 1 Block Diagram 5541B
*
The European RoHS directive 2002/95/EC (Restriction of the use of certain Hazardous Substances in electrical and electronic
equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (PBB) or polybrominated
diphenyl ethers (PBDE).
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PIN CONFIGURATION
Fig. 2: Pin configuration of MS5541B
Pin Name
Pin
Type
Function
SCLK
VSS
PV (1)
PEN (1)
VDD
MCLK
DIN
DOUT
1
2
3
4
5
6
7
8
I
G
N
I
P
I
I
O
Serial data clock
Ground
Negative programming voltage (do not connect)
Programming enable (do not connect)
Positive supply voltage
Master clock (32.768kHz)
Serial data input
Serial data output
NOTE
1) Pins 3 (PV) and 4 (PEN) are only used by the manufacturer for calibration purposes and should not be
connected.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Storage Temperature
Overpressure
Symbol
Conditions
Min
Max
Unit
Notes
VDD
TS
P
Ta = 25°C
-0.3
-40
4
+85
30
V
C
bar
1
2
Ta = 25°C
o
NOTES
1) Storage and operation in an environment of dry and non-corrosive gases.
2) The MS5541BM is qualified referring to the ISO 6425 standard and can withstand an absolute pressure of
30 bar in salt water.
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RECOMMENDED OPERATING CONDITIONS
Parameter
Operating pressure range
Supply voltage
Supply current,
Average (1)
during conversion (2)
standby (no conversion)
Current consumption into
MCLK (3)
Operating temperature
Range
Conversion time (15 Bit)
External clock signal (4)
Symbol
p
Conditions
VDD
Iavg
ISC
Iss
Min.
0
Typ.
Max
14
Unit
bar
2.2
3.0
3.6
V
0.1
0.5
µA
mA
µA
µA
+85
°C
35
ms
VDD = 3.0 V
4
1
MCLK=32768Hz
Ta
Tconv
-40
+25
MCLK=32768Hz
MCLK
Duty cycle of MCLK
Serial data clock
(T=25°C, VDD=3.0V unless noted otherwise)
SCLK
30000
32768
35000
Hz
40/60
50/50
60/40
%
500
kHz
NOTES
1) Under the assumption of one conversion every second. Conversion means either a pressure or a
temperature measurement started by a command to the serial interface of MS5541B.
2) During conversion the sensor will be switched on and off in order to reduce power consumption; the total on
time within a conversion is about 2ms.
3) This value can be reduced by switching off MCLK while MS5541B is in standby mode.
4) It is strongly recommended that a crystal oscillator be used because the device is sensitive to clock jitter. A
square-wave form of the clock signal is a must.
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ELECTRICAL CHARACTERISTICS
DIGITAL INPUTS
(T=-40°C .. 85°C)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Input High Voltage
VIH
VDD = 2.2…3.6V
80% VDD
100% VDD
V
Input Low Voltage
VIL
VDD = 2.2…3.6 V
0% VDD
20% VDD
V
Signal Rise Time
tR
200
ns
Signal Fall Time
tf
200
ns
DIGITAL OUTPUTS
(T=-40°C .. 85°C, VDD = 2.2V..3.6V)
Parameter
Symbol
Conditions
Min
Output High Voltage
VOH
ISource = 0.6 mA
Output Low Voltage
VOL
ISink = 0.6 mA
Typ
Max
Unit
75% VDD
100% VDD
V
0% VDD
20% VDD
V
Signal Rise Time
tr
200
ns
Signal Fall Time
tf
200
ns
AD-CONVERTER
Parameter
Symbol
Conditions
Min
Resolution
INL
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(T=25°C, VDD =3.0V)
Max
15
Linear Range
Conversion Time
Typ
0
MCLK=32768Hz
within linear
Range
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Unit
Bit
40000
LSB
35
ms
4
LSB
4
PRESSURE OUTPUT CHARACTERISTICS
With the calibration data provided by the MS5541B (stored in the interface IC) the following characteristics can
be achieved:
Parameter
Resolution
Absolute Pressure Accuracy
Error over Temperature
Long-term Stability
Maximum Error over Supply
Voltage
Conditions
Min
p = 0 .. 5bar
p = 0 .. 10bar
p = 0 .. 14bar
Ta = 0 .. 40°C
p = 0 .. 5bar
p = 0 .. 10bar
p = 0 .. 14bar
Ta = -40 .. 85°C
Ta = -40…+85°C
p = const. Relative to 20°C
6 month
VDD = 2.2…3.6V
-20
Typ
1.2
Max
Unit
mbar
Note
1
-25
-60
-150
+20
+20
+20
mbar
mbar
mbar
2
-40
-60
-160
+100
+180
+200
mbar
mbar
mbar
3
-10
+100
mbar
20
mbar
20
4
mbar/V
NOTES
1) A stable pressure reading of the given resolution requires taking the average of 2 to 4 subsequent pressure
values due to noise of the ADC.
2) Maximum error of pressure reading over the pressure range.
3) With the second-order temperature compensation as described in Section “FUNCTION". See next section
for typical operating curves.
4) The long-term stability is measured with non-soldered devices
TEMPERATURE OUTPUT CHARACTERISTICS
This temperature information is not required for most applications, but it is necessary to allow for temperature
compensation of the pressure output. The reference temperature is 20°C.
Parameter
Conditions
Resolution
Accuracy
Ta = 20°C
Min
Typ
Max
Unit
0.005
0.01
0.015
°C
0.8
°C
-0.8
Ta = -40…+85°C
Maximum Error over Supply
Voltage
°C
±2
VDD = 2.2…3.6V
-0.3
0.3
Note
1
°C/V
NOTE
1) With the second-order temperature compensation as described in Section “FUNCTION". See next section
for typical operating curves.
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TYPICAL PERFORMANCE CURVES
ADC-value D1 vs Pressure (typical)
ADC-value D1 (LSB)
30000
25000
85°C
20000
25°C
-40°C
15000
10000
0
2000
4000
6000
8000
10000
12000
Pressure (mbar)
ADC-value D2 vs Temperature (typical)
40000
ADC-value D2 (LSB)
35000
30000
25000
20000
15000
-40
-20
0
20
40
60
80
Temperature (°C)
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Absolute Pressure Accuracy after Calibration (1st order)
200
Pressure error (mbar)
150
85
60
100
40
25
50
0
-40
0
0
2000
4000
6000
8000
10000
12000
-50
Pressure (mbar)
Pressure Accuracy after Calibration (2nd order)
50
40
Pressure error (mbar)
30
20
85
10
60
40
0
-10
0
2000
4000
6000
8000
10000
12000
25
0
-40
-20
-30
-40
-50
Pressure (mbar)
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Temperature Error Accuracy vs temperature (typical)
10
Temperature error (°C)
8
Temperature
error
(standard
calculation)
Temperature
error (w ith
2nd order
calculation)
6
4
2
0
-40
-20
0
20
40
60
80
-2
Temperature (°C)
Pressure Error Accuracy vs temperature (typical)
80
70
Pressure error (mbar)
60
Pressure error
at 4 bar
(standard
calculation)
50
40
30
Pressure error
at 4 bar (2nd
order
calculation)
20
10
0
-10
-40
-20
0
20
40
60
80
-20
Temperature (°C)
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FUNCTION
GENERAL
The MS5541B consists of a piezoresistive sensor and a sensor interface IC. The main function of the MS5541B
is to convert the uncompensated analog output voltage from the piezoresistive pressure sensor into a 16-Bit
digital value, as well as providing a 16-Bit digital value for the temperature of the sensor.
• measured pressure (16-Bit)
• measured temperature (16-Bit)
“D1”
“D2”
As the output voltage of a pressure sensor is strongly dependent on temperature and process tolerances, it is
necessary to compensate for these effects. This compensation procedure must be performed by software using
an external microcontroller.
D1
Sensor
D2
Word1..4
Pressure
Calculation
in external
microcontroller
Temperature
re
For both pressure and temperature measurement the same ADC is used (sigma delta converter):
• for the pressure measurement, the differential output voltage from the pressure sensor is converted
• for the temperature measurement, the sensor bridge resistor is sensed and converted
During both measurements the sensor will only be switched on for a very short time in order to reduce power
consumption. As both, the bridge bias and the reference voltage for the ADC are derived from VDD, the digital
output data is independent of the supply voltage.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and two pressures. As a result, 6 coefficients
necessary to compensate for process variations and temperature variations are calculated and stored in the 64Bit PROM of each module. These 64-Bit (partitioned into four words of 16-Bit) must be read by the
microcontroller software and used in the program converting D1 and D2 into compensated pressure and
temperature values.
PRESSURE AND TEMPERATURE MEASUREMENT
The sequence of reading pressure and temperature as well as of performing the software compensation is
depicted in flow chart, Fig. 3 and Fig. 5.
First the WORD1 to WORD4 have to be read through the serial interface. This can be done once after reset of
the microcontroller that interfaces to the MS5541B. Next the compensation coefficients C1 to C6 are extracted
using Bit-wise logical- and shift-operations (refer to Fig. 4 for the Bit-pattern of word 1 to word 4).
For the pressure measurement the microcontroller has to read the 16 Bit values for pressure (D1) and
temperature (D2) via the serial interface in a loop (for instance every second). Then, the compensated pressure
is calculated out of D1, D2 and C1 to C6 according to the algorithm in Fig. 3 (possibly using quadratic
temperature compensation according to Fig. 5). All calculations can be performed with signed 16-Bit variables.
Results of multiplications may be up to 32-Bit long (+sign). In the flow according to Fig. 3 each multiplication is
followed by a division. This division can be performed by Bit-wise shifting (divisors are to the power of 2). It is
ensured that the results of these divisions are less than 65536 (16-Bit).
For the timing of signals to read out WORD1 to WORD4, D1, and D2 please refer to the paragraph “SERIAL
INTERFACE”.
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Basic equations:
System
initialisation
Start
Read calibration data (factory calibrated) from
PROM of MS5541
Word1 = 18556
Word2 = 49183
Word3 = 22354
Word4 = 28083
Word1, Word2, Word3 and Word4 (4x16 Bit)
Convert calibration data into coefficients:
(see bit pattern of Word1-Word4)
C1: Pressure sensitivity
C2: Pressure offset
C3: Temperature coefficient of pressure sensitivity
C4: Temperature coefficient of pressure offset
C5: Reference Temperature
C6: Temperature coefficient of the temperature
Pressure and temperature measurement
Example:
(13 Bit)
(13 Bit)
(10 Bit)
(9 Bit)
(12 Bit)
(7 Bit)
SENST1
OFFT1
TCS
TCO
Tref
TEMPSENS
C1 = 2319
C2 = 4864
C3 = 349
C4 = 219
C5 = 2002
C6 =
51
Read digital pressure value from MS5541
D1 (16 Bit)
D1 = 17788
Read digital temperature value from MS5541
D2 (16 Bit)
D2 = 26603
Calculate calibration temperature
UT1 = 26016
UT1=8*C5+10000
Calculate actual temperature
Difference between actual temperature and reference
temperature:
dT = D2 - UT1
Actual temperature:
11
TEMP = 200 + dT*(C6+100)/2
resolution)
dT(D2) = D2 - Tref
dT
TEMP(D2)=20°+dT(D2)*TEMPSENS
TEMP = 243
= 24.3 °C
(0.1°C resolution)
= 587
Calculate temperature compensated pressure
OFF(D2)=OFFT1+TCO*dT(D2)
Offset at actual temperature:
OFF = C2 + ((C4-250)*dT)/212 + 10000
SENS(D2)=SENST1+TCS*dT(D2)
Sensitivity at actual temperature:
SENS = C1/2 + ((C3+200)*dT)/213 + 3000
OFF
= 14859
SENS = 4198
Temperature compensated pressure in mbar:
P = (SENS * (D1-OFF))/212 + 1000
P(D1,D2)=D1*SENS(D2)-OFF(D2)
P
= 4001
= 4001 mbar
Display pressure and temperature value
Fig. 3: Flow chart for pressure/temperature reading and software compensation.
NOTES
1) Readings of D2 can be done less frequently, but the display will be less stable in this case
2) For a stable display of 1 mbar resolution, it is recommended to display the average of 4 to 8 subsequent
pressure values.
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C1 (13 Bit)
Word 1
DB12
DB11
DB10
DB9
DB8
DB7
DB6
C2/I (3 Bit)
DB5
DB4
DB3
DB2
DB1
C2/II (10 Bit)
Word 2
DB9
DB8
DB7
DB6
DB5
DB4
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
DB11
DB10
DB8
DB7
DB6
DB5
DB4
DB11
DB10
DB9
DB7
DB6
DB2
DB1
DB0
DB2
DB1
DB0
DB8
C5/II (6 Bit)
DB3
DB2
DB1
DB0
DB5
DB4
C4 (9 Bit)
Word 4
DB12
C5/I (6 Bit)
C3 (10 Bit)
Word 3
DB0
DB3
C6 (7-Bit)
DB3
DB2
DB1
DB1
DB6
DB5
DB4
DB3
Fig. 4: Arrangement (Bit-pattern) of calibration data in Word1 to Word4.
SECOND-ORDER TEMPERATURE COMPENSATION
In order to obtain full temperature accuracy over the whole temperature range, it is recommended to
compensate for the non-linearity of the output of the temperature sensor. This can be achieved by the second
order temperature calculation, i.e. by replacing the “TEMP” equation given in fig. 1 by the small algorithm given
hereafter. The calculation of the temperature compensated pressure as shown in Fig. 3 is not affected by this
second-order calculation.
dT < 0
dT ≥ 0
yes
yes
Low Temperatures
High Temperatures
dT2 = dT – (dT/128*dT/128)/2
dT2 = dT – (dT/128*dT/128)/8
Calculate temperature
11
TEMP = (200 + dT2*(C6+100)/2 ) (0.1°C)
Fig. 5: Flow chart for calculating the temperature and pressure to the optimum accuracy.
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SERIAL INTERFACE
The MS5541B communicates with microprocessors and other digital systems via a 3-wire synchronous serial
interface as shown in Fig. 1. The SCLK (Serial Clock) signal initiates the communication and synchronizes the
data transfer with each Bit being sampled by the MS5541B on the rising edge of SCLK and each Bit being sent
by the MS5541B on the rising edge of SCLK. The data should thus be sampled by the microcontroller on the
falling edge of SCLK and sent to the MS5541B with the falling edge of SCLK. The SCLK-signal is generated by
the microprocessor’s system. The digital data provided by the MS5541B on the DOUT pin is either the
conversion result or the software calibration data. In addition the signal DOUT (Data Out) is also used to indicate
the conversion status (conversion-ready signal, see below). The selection of the output data is done by sending
the corresponding instruction on the pin DIN (Data Input).
Following is a list of possible output data instructions:
•
•
•
•
•
•
•
Conversion start for pressure measurement and ADC-data-out
Conversion start for temperature measurement and ADC-data-out
Calibration data read-out sequence for word 1
Calibration data read-out sequence for word 2
Calibration data read-out sequence for word 3
Calibration data read-out sequence for word 4
RESET sequence
“D1”
“D2”
(Figure 6a)
(Figure 6b)
(Figure 6c)
(Figure 6d)
(Figure 6c)
(Figure 6d)
(Figure 6e)
Every communication starts with an instruction sequence at pin DIN. Fig. 6 shows the timing diagrams for the
MS5541B. The device does not need a ‘Chip select’ signal. Instead there is a Start Sequence (3-Bit high) before
each Setup Sequence and Stop Sequence (3-Bit low) after each Setup Sequence. The Setup Sequence consists
in 4-Bit that select a reading of pressure, temperature or calibration data. In case of pressure- (D1) or
temperature- (D2) reading the module acknowledges the start of a conversion by a low to high transition at pin
DOUT during the last bit of the Stop Sequence.
Two additional clocks at SCLK are required after the acknowledge signal. Then SCLK is to be held low by the
microcontroller until a high to low transition on DOUT indicates the end of the conversion.
This signal can be used to create an interrupt in the microcontroller. The microcontroller may now read out the
16-Bit word by giving another 17 clocks on the SLCK pin. It is possible to interrupt the data read-out sequence
with a hold of the SCLK signal.
It is important to always read out the last conversion result before starting a new conversion.
Conversion start for pressure measurement and ADC-data-out "D1":
end of conversion
start of conversion
conversion
(33ms)
ADC-data out MSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1
DIN
DOUT SCLK
The RESET-sequence is special as its unique pattern is recognized by the module in any state. By consequence
it can be used to restart if synchronization between the microcontroller and the MS5541B has been lost. This
sequence is 21-Bit long. The DOUT signal might change during that sequence (see Fig. 6e).
It is thus recommended to send the RESET-Sequence before each Conversion Sequence to avoid
hanging up the protocol permanently in case of electrical interference.
ADC-data out LSB
DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
sequence: START+P-measurement
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9
Start-bit
Setup-bits
Stop-bit
Fig. 6a: D1 acquisition sequence
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end of conversion
conversion
(33ms)
start of conversion
ADC-data out MSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1
DIN
DOUT SCLK
Conversion start for temperature measurement and ADC-data-out "D2":
ADC-data out LSB
DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
sequence: START+T-measurement
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9
Start-bit
Setup-bits
Stop-bit
DIN
DOUT SCLK
Fig. 6b: D2 acquisition sequence
Calibration data read out sequence for word 1/ word 3:
coefficient-data out MSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1
coefficient-data out LSB
DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
sequence: coefficient read + address
Bit0 Bit1 Bit2
Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11
Setup-bits
Start-bit
Stop-bit
address word 1
address word 3
DIN
DOUT SCLK
Fig. 6c: W1, W3 reading sequence
Calibration data read out sequence for word 2/ word 4:
coefficient-data out MSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1
coefficient-data out LSB
DB0 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
sequence: coefficient read + address
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11
Setup-bits
Start-bit
Stop-bit
address word 2
address word 4
Fig. 6d: W2, W4 reading sequence
DIN
DOUT SCLK
RESET - sequence:
sequence: RESET
Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Bit8 Bit9 Bit10 Bit11Bit12 Bit13 Bit14 Bit15 Bit16 Bit17 Bit18 Bit19 Bit20
Fig. 6e: Reset sequence (21-Bit)
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APPLICATION INFORMATION
GENERAL
The advantage for this combination of a sensor with a directly adapted integrated circuit is to save other external
components and to achieve very low power consumption. The main application field for this system includes
portable devices with battery supply, but its high accuracy and resolution make it also suited for industrial and
automotive applications. The possibility to compensate the sensor with a software allows the user to adapt it to
his particular application. Communication between the MS5541B and the widely available microcontrollers is
realised over an easy-to-use 3-wire serial interface. Customers may select which microcontroller system to be
used, and there are no specific standard interface cells required, which may be of interest for specially designed
4 Bit-microcontroller applications.
CALIBRATION
The MS5541B is factory calibrated. The calibration data is stored inside the 64 Bit PROM memory.
SOLDERING
Please refer to the application note AN808 for all soldering issues.
HUMIDITY, WATER PROTECTION
The silicon pressure transducer and the bonding wires are protected by a anticorrosive and antimagnetic
protection cap. The MS5541B carries a metal protection cap filled with silicone gel for enhanced protection
against humidity. The properties of this gel ensure function of the sensor even when in direct water contact. This
feature can be useful for waterproof watches or other applications, where direct water contact cannot be
avoided. Nevertheless the user should avoid drying of hard materials like for example salt particles on the
silicone gel surface. In this case it is better to rinse with clean water afterwards. Special care has to be taken to
not mechanically damage the gel. Damaged gel could lead to air entrapment and consequently to unstable
sensor signal, especially if the damage is close to the sensor surface.
The metal protection cap is fabricated of special anticorrosive and antimagnetic stainless steel in order to avoid
any corrosive battery effects inside the final product. The MS5541B was qualified referring to the ISO 6425
standard and can withstand a pressure of 21 bar in salt water. The concentration of the see water used for the
qualification is 41 g of see salt for 1 liter of DI water.
For underwater operations like specified in ISO 6425 standard it is important to seal the sensor with a rubber ORing around the metal Ring. Any salt water coming to the contact side (ceramic and Pads) of the sensor could
lead to permanent damage. For "water-resistant" watches it is recommended to provide a stable mechanical
pusher from the backside of the sensor. Otherwise the overpressure might push the sensor backwards and even
bend the electronic board on which the sensor is mounted.
LIGHT SENSITIVITY
The MS5541B is protected against sunlight by a layer of white gel. It is, however, important to note that the
sensor may still be slightly sensitive to sunlight, especially to infrared light sources. This is due to the strong
photo effect of silicon. As the effect is reversible there will be no damage, but the user has to take care that in
the final product the sensor cannot be exposed to direct light during operation. This can be achieved for instance
by placing mechanical parts with holes in such that light cannot pass.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB to connect it. This can be important for
applications in watches and other special devices, and will also reduce mechanical stress on the device.
For applications subjected to mechanical shock, it is recommended to enhance the mechanical reliability of the
solder junctions by covering the rim or the corners of MS5541B'
s ceramic substrate with glue or glob top-like
material.
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DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to power supply: A 47µF tantalum capacitor must be
placed as close as possible of the MS5541B'
s VDD pin. This capacitor will stabilize the power supply during data
conversion and thus, provide the highest possible accuracy.
APPLICATION EXAMPLE: DIVING COMPUTER SYSTEM USING MS5541B
MS5541B is a circuit that can be used in connection with a microcontroller in diving computer applications. It is
designed for low-voltage systems with a supply voltage of 3V, particularly in battery applications. The MS5541B is
optimised for low current consumption as the AD-converter clock (MCLK) can use the 32.768kHz frequency of a
standard watch crystal, which is supplied in most portable watch systems.
3V-Battery
LCD-Display
VDD
32.768 kHz
XTAL1
MS5541
VDD
47uF
Tantal
XTAL2
Keypad
MCLK
DIN
DOUT
SCLK
GND
4/8bit-Microcontroller
VSS
EEPROM
optional
Fig. 7: Demonstration of MS5541B in a diving computer
RECOMMENDED PAD LAYOUT
Pad layout for bottom side of MS5541B soldered onto printed circuit board
Fig. 8: Pad layout of MS5541B
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DEVICE PACKAGE OUTLINES
Fig. 9: Device package outlines of MS5541B
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ASSEMBLY
MECHANICAL STRESS
It is recommended to avoid mechanical stress on the PCB on which the sensor is mounted. The thickness of the
PCB should be not below 1.6 mm. A thicker PCB is more stiff creating less stress on the soldering contacts. For
applications where mechanical stress cannot be avoided (for example ultrasound welding of the case or thin
PCB’s in watches) please fix the sensor with drops of low stress epoxy (for example Hysol FP-4401).
MOUNTING
The MS5541B can be placed with automatic Pick&Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects.
Special care has to be taken to not touch the protective gel of the sensor during the assembly.
It is important to solder all contact pads. The Pins PEN and PV shall be left open or connected to Vdd. Do not
connect the Pins PEN and PV to GND!
SEALING WITH O-RING
In products like diving computers the electronics must be protected against direct water or humidity. For those
products the MS5541B provides the possibility to seal with an O-ring. The protective cap of the MS5541B is
made of special anticorrosive stainless steel with a polished surface. In addition to this the MS5541B is filled with
silicone gel covering the sensor and the bonding wires. The O-ring (or O-rings) shall be placed at the outer
diameter of the metal cap. This method avoids mechanical stress because the sensor can move in vertical
direction.
CLEANING
The MS5541B has been manufactured under cleanroom conditions. Each device has been inspected for the
homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under
class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening
during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean”
shall be used. Cleaning might damage the sensor!
ESD PRECAUTIONS
The electrical contacts except programming pads are protected against ESD according to 2KV HBM (human
body model). The PV programming pads are more sensitive due to the nature of the OTP programming cells
that store the calibration coefficients. The breakdown voltage of PV is 1kV. It is therefore essential to ground
machines and personal properly during assembly and handling of the device. The MS5541B is shipped in
antistatic transport boxes. Any test adapters or production transport boxes used during the assembly of the
sensor shall be of an equivalent antistatic material.
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ORDERING INFORMATION
Product
Code
MS5541-BM
Product
Miniature 14 bar
module with
metal cap
Art.-Nr.
325541001
Package
SMD hybrid with solder paste,
anticorrosive and antimagnetic
metal protection cap, silicon gel
sensor protection
Comments
Recommended
for outdoor
products
FACTORY CONTACTS
Intersema Sensoric SA
Ch. Chapons-des-Prés 11
CH-2022 BEVAIX
SWITZERLAND
Tel. (032) 847 9550
Tel. Int. +41 32 847 9550
Telefax +41 32 847 9569
e-mail:
http://www.intersema.ch
NOTICE
Intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance
and to supply the best possible products. Intersema assumes no responsibility for the use of any circuits shown in this data sheet, conveys
no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from
patent infringement. Applications for any devices shown in this data sheet are for illustration only and Intersema makes no claim or
warranty that such applications will be suitable for the use specified without further testing or modification.
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