AUTO AUTOTVS/ASB TVS/PK ASB Series Features > Glass passivated chip > 8000 W peak pulse power capability with a 10/1000 ȝs waveform, repetitive rate (duty cycle):0.01 % > Meet AEC-Q101 requirement > Low leakage > Uni-directional polarity > Excellent clamping capability > Very fast response time > RoHS compliant Mechanical Data > Plastic package DO-218AB/SOD-BLOCK > Epoxy: UL 94V-0 rate flame retardant > Polarity: Heatsink is anode IEC Compatibility >ISO 16750-2 Test A 12v System( 100V 1Ω 400ms 10c) 24v System (174V 4Ω 350ms 10c) Electrical Characteristics (T A=25 ɗ unless otherwise noted) Maximum Working Breakdown Voltage VBR @I T Reverse Part Number Peak Reverse Leakage IR Voltage VRWM (Uni) Min(V) Max(V) IT(mA) @VRWM(uA) (V) Maximum Maximu IR@VRWM Reverse Surge TJ=175 Current I PP (1) (uA) (A) Maximum Clamping Voltage VC@I PP (V) ASB20A 20 22.2 24.5 5 10 150 246.9 32.4 ASB22A 22 24.4 26.9 5 10 150 225.4 35.5 ASB24A 24 26.7 29.5 5 10 150 205.7 38.9 ASB26A 26 28.9 31.9 5 10 150 190.0 42.1 ASB28A 28 31.1 34.4 5 10 150 176.2 45.4 ASB30A 30 33.3 36.8 5 10 150 165.3 48.4 ASB33A 33 36.7 40.6 5 10 150 150.1 53.3 ASB36A 36 40.0 44.2 5 10 150 137.7 58.1 NOTE: Surge current waveform is defined at 10/1000uS waveform REV.2016.01.04 01 | www.spsemi.cn AUTO AUTOTVS/ASB TVS/PK ) Series ASC Series Max imum Ratings(TA=25ɗunless otherwise noted) Symbol PPP Parameter Peak power dissipation with a 10/1000 ȝs waveform (1) Peak pulse current wih a 10/1000 ȝs waveform (1) Power dissipation on infinite heatsink at TL= 25 °C Value 8000 UNIT W I PP See above Table PD 5.0 I FSM 500 TJ , TSTG –55 to +175 Peak forward surge current 8.3 ms single half sineOperating junction and storage temperature range A W A °C Note: (1)Non-repetitive current pulse per Fig.2 and derated above TA = 25 °C per Fig.1 AMBIENAVERAGE FORWARD CURRENT, (A) 100 0 25 100 175 0 75 100 50 25 Peak Value (Ipp) Half Value = Ipp 2 50 10/1000 ȝsec. Waveform 0 0 25 50 75 100 125 150 175 200 0 1 Ambient Temperature ,TA (ɗ) Fig. 1 - Pulse Derating Curve PPPM-Peak Pulse Power (kW) Steady State Power Dissipation, (W) 5 0 4.0 2.0 0.0 0 25 50 75 100 125 150 175 200 Lead Temperature , TL (ɗ) Fig. 3 - Steady State Power Derating Curve REV.2016.01.04 3 0 ## 76 50 33 23 13 10 4 1000 5 6.0 2 Time , (ms) 0 0.2 0.5 1 1.5 2 3 4 Fig. 2 - Pulse Waveform 8.0 0 ## TJ = 25 ƱC Pulse Width (td) is defined as the point where the peak current decays to 50 % of Ipp td 0 25 unless otherwise noted) Tr=10ȝs 100 Peak Pulse Current , (% ) Peak Pulse Derating in Percentage of Peak Power or Current, (%) Ratings and Characteristics Curves (TA =25ɗ 100 10 1 0.1 0.000001 0.00001 0.0001 0.001 td-Pulse Width (Sec.) Fig. 4 - Peak Pulse Power Rating Curve 02 | www.spsemi.cn AUTO AUTOTVS/ASB TVS/PK ) Series ASB Series Fig. 5 Ri-Vs chart for ISO-16750-2 Test A : 12V System Fig. 6 Ri-Vs chart for ISO-16750-2 Test A : 24V System PACKAGE OUTLINE DIMENSIONS (millimeters) Recommended Mounting Pad Layout 3.3 3.0 3.5 11.0 9.5 REV.2016.01.04 15.8 03 | www.spsemi.cn AUTO AUTOTVS/ASB TVS/PK ASC Series SURFACE MOUNT TAPE AND REEL PACKAGING G ZONE 1 N A ZONE1 B D C T DIMENSIONS in millimeters (inches) TAPE SIZE A MAX. 24 mm (0.945) B MIN. C 330 ± 2.0 (13.0 ± 13.0 ± 0.20 0.079) 1.5 (0.059) (0.51 ± 178 ± 2.0 (7.0 ± 0.0008) 0.079) D MIN. N MIN. G MAX. T MAX. 20.2 (0.795) 50 (1.97) 26.4 (1.039) 30.4 (1.197) Recommended Soldering Parameters IR-Reflow Condition 150 ɗ Temp. max 200 ɗ Time(min to max) 60-180 Ramp up rate (150-200 ɗ) <3 Liquidus Temp. >220 Reflow Peak Temp. 255-260 Time(Liq. to Peak) 60-150 Ramp up rate (220-200 ɗ) <3 Time within actual peak temp.10-30 sec ɗ/sec ɗ sec sec ɗ/sec tp Temperature(T) Pre Heat Temp. min TP Ramp-up tL TL Ts(max) Ts(min) ts Perheat sec Temp from 25 °C to Peak Ramp down Rate <5 ɗ/sec Time(25ɗ to Peak temp.) <6 njo Do not exceed 280 ɗ REV.2016.01.04 Time(t) 04 | www.spsemi.cn