LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET KEY FEATURES DESCRIPTION operation is guaranteed at 1.6V input The output voltage is programmed easily using two external resistors in conjunction with the feedback pin. Depending on the MOSFET selected, the LX1741 is capable of achieving output voltages much higher than 40V. The LX1741 has an additional feature for simple dynamic adjustment of the output voltage (i.e., up to ±15% of the nominal output voltage). Voltage adjustment is achieved via an analog reference signal or a direct PWM input signal applied to the ADJ pin. Any PWM amplitude is easily accommodated with a single external resistor. The LX1741 is available in both the 8Pin MSOP, and the miniature 8-Pin MLP requiring minimal PCB area. WWW . Microsemi .C OM The LX1741 is a compact high efficiency step-up boost controller. Featuring a pseudo-hysteretic pulse frequency modulation topology, the LX1741 was designed for maximum efficiency, reduced board size, and minimal cost. Utilizing an external N-Channel MOSFET, the LX1741 offers designers maximum flexibility with respect to efficiency and cost. The LX1741 provides several design enhancements that improve overall performance under very light load currents by implementing control circuitry that is optimized for portable systems - thus providing a quiescent supply current of only 80µA (typ) and a shutdown current of less than 1µA. The input voltage ranges from 1.6V to 6.0V, allowing for a wide selection of system battery voltages. Start-up > 85% Maximum Efficiency 80µA Typical Quiescent Supply Current Externally Programmable Peak Inductor Current Limit For Maximum Efficiency Logic Controlled Shutdown < 0.5 µA Shutdown Current (typ) Dynamic Output Voltage Adjustment Via Analog Reference Or Direct PWM Input 8-Pin MSOP Package or 8-Pin MLP APPLICATIONS/BENEFITS Pagers Wireless Phones PDAs Handheld Computers General LCD Bias Applications LED Driver IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com PRODUCT HIGHLIGHT VLCD = 18V ± 15% L1 VBAT = 1.6V to 6.0V 47µH 1206 Case Size C1 4.7µF NDRV IN ON OFF SRC SHDN LX1741 FB CS ADJ RCS 1kΩ GND 0 to 70 LX1741 TA (°C) PACKAGE ORDER INFO Plastic MLP Plastic MSOP LM 8-Pin DU 8-Pin LX1741CLM LX1741CDU Note: Available in Tape & Reel. Append the letter “T” to the part number. (i.e. LX1741CDUT) Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. THERMAL DATA SRC 1 8 NDRV GND 2 7 IN CS 3 6 FB ADJ 4 5 SHDN DU PACKAGE (Top View) SRC 1 8 NDRV GND 2 7 IN CS 3 6 FB ADJ 4 5 SHDN WWW . Microsemi .C OM Supply Voltage (VCC)..................................................................................... -0.3V to 7.0V Feedback Input Voltage (VFB).............................................................. -0.3V to VIN + 0.3V Shutdown Input Voltage (V SHDN )........................................................ -0.3V to VIN + 0.3V PWM Input Amplitude......................................................................... -0.3V to VIN + 0.3V Analog Adjust Input Voltage (VADJ) ................................................................ -0.3V to VIN Source Input Current (ISRC) ..................................................................................0.80 ARMS Operating Junction Temperature ................................................................................ 150°C Storage Temperature Range ........................................................................ -65°C to 150°C Lead Temperature (Soldering 180 seconds)............................................................... 235°C LM PACKAGE DU Plastic MSOP 8-Pin THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA THERMAL RESISTANCE-JUNCTION TO CASE, θJC (Top View) 206°C/W 39°C/W LM Plastic MLP 8-Pin THERMAL RESISTANCE-JUNCTION TO AMBIENT, THERMAL RESISTANCE-JUNCTION TO CASE, θJC θJA 41°C/W 5.2°C/W Junction Temperature Calculation: TJ = TA + (PD x θJC). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. FUNCTIONAL PIN DESCRIPTION NAME DESCRIPTION IN Unregulated IC Supply Voltage Input – Input range from +1.6V to 6.0V. Bypass with a 1µF or greater capacitor for operation below 2.0V. FB Feedback Input – Connect to a resistive divider network between the output and GND to set the voltage at VFB (see Output Voltage Programming: Application Information). SHDN Active-Low Shutdown Input – A logic low shuts down the device and reduces the supply current to 0.1µA. Connect SHDN to VCC for normal operation. NDRV MOSFET Gate Driver – Connects to an external N-Channel MOSFET. Current-Sense Amplifier Input – Connecting a resistor between CS and GND sets the peak inductor current limit. GND Common terminal for ground reference. ADJ An applied PWM Signal Input becomes the internal reference, via an internal filter and gain resistor, thus allowing for a dynamic output voltage adjustment of ±15% (i.e., corresponding to the duty cycle variance). Connecting this pin to ground causes the device to revert to the internal voltage reference (note: refer to figure 8). SRC MOSFET Current Sense Input - Connects to the External N-Channel MOSFET Source. Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 PACKAGE DATA CS LX1741 I N T E G R A T E D High Efficiency High Voltage Boost Controller P R O D U C T S P RODUCTION D ATA S HEET Start-up Voltage Temperature Coefficient IQ Quiescent Current VFB IFB FB Threshold Voltage FB Input Bias Current ADJ Input Voltage Range 1 ADJ Input Bias Current SRC Input Current Shutdown Input Bias Current Shutdown High Input Voltage Shutdown Low Input Voltage Current Sense Bias Current Minimum Peak Current Comparator A Delay NDRV Sink Current NDRV Source Current Minimum Off-Time -2 kVST VFB = 1.5V V SHDN < 0.4V VADJ = GND VFB = 1.4V 1.264 -200 VADJ IADJ ISRC I SHDN V SHDN V SHDN ICS IMIN tD ISNK ISRC tOFF 80 0.2 1.290 0 VADJ = VFB = 1.29V 0.3 SHDN = GND VIN = 2V VIN = 2V -50 1.6 3.0 2 GBNT 2 GBNT VIN = 5V VIN = 5V VFB = 1V mV/°C 100 0.5 1.316 200 µA µA V nA VIN – 100mV V 1.0 0.8 50 5.0 145 620 50 100 100 0.4 7.0 500 WWW . Microsemi .C OM ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 70°C except where otherwise noted and the following test conditions: VIN = 3V, VOUT = 18.5V, VADJ = 0V, RLOAD = 9.25kΩ, SHDN = VIN LX1741 Parameter Symbol Test Conditions Units Min Typ Max Operating Voltage VIN 1.6 6.0 V Minimum Start-up Voltage VSU 1.6 V TA = +25°C µA ARMS nA V V µA mA ns mA mA ns Notes: 1. When using a DC source to adjust VOUT, the recommended VADJ (range) is from 0.9V to 1.50V: see figure 3 and 8. o 2. Guaranteed typical value (not tested) @ TA = 25 C (see section “Inductor Selection and Current Limit Programming”) SIMPLIFIED BLOCK DIAGRAM FB A NDRV Reference Logic ADJ GND 2.5M Ω 1.29V Reference 4µ A B CS Shutdown Logic IN Copyright 2000 Rev. 1.1, 2002-11-21 Driver ELECTRICALS 50pF SRC Logic Controller Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 SHDN Page 3 LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET APPLICATION CIRCUITS WWW . Microsemi .C OM Typical LCD Bias Applications L1 VBAT = (1.6V to 6.0V) 47µH C2* 1nF R1 NDRV IN SHDN R VOUT = VREF 1 + 1 R2 C1 4.7µF SRC LX1741 FB ADJ CS RCS 1kΩ GND R2 * Optional Component used to reduce output voltage ripple. Figure 1 – Fixed Output Voltage Operation L1 VBAT = (1.6V to 6.0V) 47µH SHDN 100kHz VPWM = 3.0V R1 NDRV IN RPWM C2* 1nF SRC LX1741 R VOUT = VADJ 1 + 1 R2 C1 4.7µF FB ADJ 625kΩ CS GND R2 * Optional Component used to reduce output voltage ripple. APPLICATIONS RCS 1kΩ Figure 2 – Dynamic Output Voltage Operation Via PWM Input Note: An in-series RPWM will attenuate the PWM amplitude to the proper signal level at the ADJ pin. With the RPWM value shown, a PWM signal having a duty of 30% to 50% will generate 0.9V to 1.5V at the ADJ pin. Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX1741 I N T E G R A T E D High Efficiency High Voltage Boost Controller P R O D U C T S P RODUCTION D ATA S HEET APPLICATION CIRCUITS (CONTINUED) WWW . Microsemi .C OM Typical LCD Bias Applications (Cont) L1 VBAT = (1.6V to 6.0V) 47µH C2* 1nF R1 NDRV IN SHDN C1 4.7µF SRC LX1741 FB ADJ + - VADJ = 0.9V to 1.5V R VOUT = VADJ 1 + 1 R2 CS R2 RCS 1kΩ GND * Optional Component used to reduce output voltage ripple. Figure 3 – Dynamic Output Voltage Operation Via Analog Voltage Input LED Driver Application L1 VBAT = 1.6V to 6.0V 47µH 1206 Case Size C1 4.7µF NDRV IN ON OFF SRC SHDN R1 1ΜΩ LX1741 FB CS ADJ I LED RCS 1kΩ R2 59kΩ APPLICATIONS VF = 3.6V typ. ILED = 20mA to 0.25mA GND R3 63.4Ω = 1 VADJ − 4VF R 2 ( ) R R R + 3 1 2 Figure 4 – LED Driver with Full-Range Dimming Via PWM Input Note The component values shown are only examples for a working system. Actual values will vary greatly depending on desired parameters, efficiency, and layout constraints. Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX1741 I N T E G R A T E D High Efficiency High Voltage Boost Controller P R O D U C T S P RODUCTION D ATA S HEET APPLICATION CIRCUITS (CONTINUED) WWW . Microsemi .C OM D1 B150/B 50V L1 47µH Vbat = 3.2V Vout = 40V C1 4.7uF 50V R1 1M 7 5 2 4 C2 1nF 50V Q1 3 x BSS138 8 1 6 3 LX1741 R2 30.9K Rcs 20K Figure 5 – Application of Fixed Output, 40V @ 20mA C3 1uF 25V D3 UPS5819 C1 1uF 25V L1 47µH -VOUT C5 1uF 25V D2 UPS5819 D1 UPS5819 VBAT +VOUT C4 4.7uF 25V 7 5 2 4 Q1 FDV303N D4 UPS5819 C1 1000pF 50V 8 1 6 3 R8 4.02K APPLICATIONS LX1741 C6 1uF 25V R1 787K R2 49.9K Figure 6 – Application of Dual Output, ± 20V @ 2mA Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET APPLICATION INFORMATION OUTPUT VOLTAGE PROGRAMMING Selecting the appropriate values for R1 and R2 in the voltage divider connected to the feedback pin programs the output voltage. Using a value of 49.9K for R2 works well in most applications. R1 can be determined by the following equation (where VREF = 1.29V nominal): The load is powered from energy stored in the output capacitor during the inductor charging cycle. Once the peak inductor current value is achieved, the NDRV output is turned off (off-time is typically 300ns) allowing a portion of the energy stored in the inductor to be delivered to the load. This causes the output voltage to continue to rise at the input to the feedback circuit (i.e., comparator A). If the voltage at the FB input is still less than 1.29V at the end of the off-time period, the NDRV output switches the external FET “on” and the inductor charging cycle repeats until VFB is greater than the internal reference. This switching behavior is shown in Figure 9 and 11. INDUCTOR SELECTION AND CURRENT LIMIT PROGRAMMING Setting the level of peak inductor current to, at least, 1.5x the expected maximum DC input current will minimize the inductor size, the input ripple current, and the output ripple voltage. The designer is encouraged to use inductors that will not saturate at the peak inductor current level. An inductor value of 47µH is recommended. Choosing a lower value emphasizes peak current overshoot while choosing a higher value emphasizes output ripple voltage. The peak switch current is defined using a resistor placed between the CS terminal and ground and the IPEAK equation is: The adjustment voltage level is selectable (with limited accuracy) by implementing the voltage divider created between the external series resistor and the internal 2.5MΩ resistor. If the DC voltage at the ADJ pin drops below 0.6V, the device will revert to the internal reference voltage level of 1.29V. A typical adjustment curve is shown in Figure 8 (see section titled: Characteristic Curves). Disabling the LX1741 is achieved by driving the SHDN pin with a low-level logic signal thus reducing the device power consumption to less than 1µA. Copyright 2000 Rev. 1.1, 2002-11-21 (VOUT - VREF ) VREF DESIGN EXAMPLE: Let R2 equals 49.9K and the required VOUT equal to 18V. (18V - 1.29V ) = 646.4KΩ R1 = 49.9KΩ × 1.29V I PEAK = I MIN + V IN L t D + I SCALE R CS The maximum IPEAK value is limited by the ISRC value (max. = 0.8ARMS). The minimum IPEAK value is defined when RCS is zero. A typical value for the minimum peak current (IMIN) at 25oC is 145mA. The parameter tD is related to internal operation of comparator A. A typical value at 25oC is 620ns. A typical value of ISCALE at 25oC is 31mA per KΩ. All of these parameters have an effect on the final IPEAK value. DESIGN EXAMPLE: Determine IPEAK where VIN equals 3.0V and RCS equals 4.02KΩ using nominal values for all other parameters. IPEAK =145mA+ 3.0V × 620ns+ 31mA × 4.02KΩ kΩ 47µH The result of this example yields a nominal IPEAK equal to 145mA + 39.6mA + 124.6ma = 309.2mA. Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7 APPLICATIONS The application of an external voltage source at the ADJ pin allows for output voltage adjustment over a typical range of approximately ±15%. The designer can select one of two possible methods. One option is to vary the reference voltage directly at the ADJ pin by applying a DC voltage from 0.9 to 1.5V. The second option is to connect a PWM logic signal to the ADJ pin (e.g., see Figure 2). The LX1741 includes an internal 50pF capacitor to ground that works with an external resistor to create a low-pass filter (i.e., filter out the AC component of a pulse width modulated input of fPWM ≥ 100KHz). R1 = R2 × WWW . Microsemi .C OM FUNCTIONAL DESCRIPTION The LX1741 is a Pulse Frequency Modulated (PFM) boost converter that is optimized for large step up voltage applications like LCD biasing. It operates in a pseudohysteretic mode with a fixed switch “off time” of 300ns. Converter switching is enabled when the feedback voltage, VFB, falls below the 1.29V reference or VADJ (see Block Diagram). When this occurs, comparator A activates the off-time controller. The off-time controller and the current limiter circuit activate comparator B which toggles the NDRV output circuit. The NDRV output is switched “on” (and remains “on”) until the inductor current ramps up to the peak current level. This current level is set via the external RCS resistor and monitored through the CS and SRC inputs. LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET APPLICATION INFORMATION (CONTINUED) VRIPPLE = ∆VDROOP + ∆VOVERSHOOT + 10mV The initial droop can be estimated as follows where the 0.5v value in the denominator is an estimate of the voltage drop across the inductor and the FET’s RDS_ON: ∆VDROOP L × (I PK × I OUT ) C OUT = (VIN − 0.5) The output overshoot can be estimated as follows where the 0.5 value in the denominator is an estimate of the voltage drop across the diode: 1 ∆VOVERSHOOT = L × (I PK − IOUT )2 C OUT (VOUT + 0.5 − VIN ) 2× DESIGN EXAMPLE: Determine the VRIPPLE where IPK equals 200mA, IOUT equals 35mA, L equals 47µH, COUT equals 4.7µF, VIN equals 3.0V, and VOUT equals 18.0V: ∆VDROOP 1 ∆VOVERSHOOT = Copyright 2000 Rev. 1.1, 2002-11-21 47µH 2 × (200mA − 35mA ) 4.7µF = 9.4mV (18.0 + 0.5 − 3.0) 2 × Therefore, for COUT equals 4.7µF: VRIPPLE = 28mV + 9.4mV + 10mV = 47.4mV Increasing the output capacitor value results in the reduction of the output voltage ripple voltage. Low ESR capacitors are recommended to reduce ripple caused by the switching current. Multi-layer ceramic capacitors with X5R or X7R dielectric are a superior choice featuring small size, very low ESR, and a temperature stable dielectric. Low ESR electrolytic capacitors such as solid tantalum or OS-CON types are also acceptable. Moreover, adding a capacitor from the output to the feedback pin (C2) allows the internal feedback circuitry to respond faster which further minimizes output voltage ripple and reduces noise coupling into the high impedance feedback input. DIODE SELECTION A Schottky diode is recommended for most applications (e.g. Microsemi UPS5819). The low forward voltage drop and fast recovery time associated with this device supports the switching demands associated with this circuit topology. The designer is encouraged to consider the diode’s average and peak current ratings with respect to the application’s output and peak inductor current requirements. Further, the diode’s reverse breakdown voltage characteristic must be capable of withstanding a negative voltage transition that is greater than VOUT. TRANSISTOR SELECTION The LX1741 can drive up to 100mA of gate drive current. An N-channel MOSFET with a relatively low threshold voltage, low gate charge and low RDS(ON) is required to optimize overall circuit performance. The LXE1741 Evaluation Board uses a Fairchild FDV303. This NMOS device was chosen because it demonstrates an RDS_ON of 0.33Ω and a total gate charge Qg of 1.64nC (typ.). PCB LAYOUT The LX1741 produces high slew-rate voltage and current waveforms hence; the designer should take this into consideration when laying out the circuit. Minimizing trace lengths from the IC to the inductor, transistor, diode, input and output capacitors, and feedback connection (i.e., pin 6) are typical considerations. Moreover, the designer should maximize the DC input and output trace widths to accommodate peak current levels associated with this circuit. Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 APPLICATIONS × (200mA × 35mA ) 47µH 4.7µF = 28mV = (3.0 − 0.5) WWW . Microsemi .C OM OUTPUT RIPPLE CAPACITOR SELECTION Output voltage ripple is a function of the inductor value (L), the output capacitor value (COUT), the peak switch current setting (IPEAK), the load current (IOUT), the input voltage (VIN) and the output voltage (VOUT) for a this boost converter regulation scheme. When the switch is first turned on, the peak-to-peak voltage ripple is a function of the output droop (as the inductor current charges to IPEAK), the feedback transition error (i.e., typically 10mV), and the output overshoot (when the stored energy in the inductor is delivered to the load at the end of the charging cycle). Therefore the total ripple voltage is Page 8 LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET OVERVIEW The LXE1741 evaluation board is available from Microsemi for assessing overall circuit performance. The evaluation board, shown in Figure 5, is 3 by 3 inches (i.e., 7.6 X 7.6cm) square and factory calibrated to provide a nominal 18V output from a 1.6V to 6.0V input. Circuit designers can easily modify output voltage and current to suit their particular application by replacing the R1 and RCS values respectively. Moreover, inductor, FET, and diodes are easily swapped out to promote design verification of a circuit that maximizes efficiency and minimizes cost for any particular application. The input and output connections are described in Table 1. The LX1741 can achieve output voltages in excess of 25V. In certain applications, it is necessary to protect the load from excessive voltage excursions. The evaluation board provides a VLIM jumper position for this purpose. Engaging this jumper position ensures that the output voltage does not exceed 25V. The LXE1741 evaluation board provides an easy and cost effective solution for evaluation on the LX1741. The factory installed component list for the evaluation board is provided in Table 3 and the schematic is shown in Figure 6. ELECTRICAL CONNECTIONS Apply the DC input voltage to VBAT (not VCC) however, the LX1741 IC may be driven from a separate DC source via the VCC input (if desired). Connect the test load to VOUT. Primary output voltage adjustment is accomplished by selecting the appropriate value for R1. Optional fine adjustment of the output voltage is achieved by applying either a DC voltage or a PWM-type signal to the VADJ input. Both low frequency (f < 100KHz) and high frequency (f > 100KHz) PWM signals are accommodated by choosing the appropriate jumper connection. Further, the VADJ circuit can be bypassed by selecting the appropriate jumper position (see Table 2). The LX1741 exhibits a low quiescent current (IQ < 1µA: typ) during shutdown mode. The SHDN pin can be used to examine shutdown performance on the evaluation board. This pin is pulled-up to VCC via a 10KΩ resistor. Grounding the SHDN pin shuts down the IC however, the load is still capable of drawing current through the inductor & diode circuit path. Hence, VOUT during shutdown will be approximately VBAT minus the inductor and diode forward voltage drop. WWW . Microsemi .C OM EVALUATION BOARD Figure 7 – LX1741 Circuit Evaluation Board Table 1: Input and Output Pin Assignments Allowable Range VBAT 0 to 6V VCC 1.6V to 6V SHDN 0 to VCC VOUT VCC to 25V VADJ IN 0 to VCC Description EVAL BOARD Pin Name Main power supply for output. (Set external current limit to 0.5A) LX1741 power. May be strapped to VBAT or use a separate supply if VCC jumper is in the SEP position. Do not power output from VCC pin on board.. Pulled up to VCC on board (10KΩ), Ground to inhibit the LX1741. Programmed for 18V output, adjustable up to 25V. Apply a DC input or PWM input to adjust the output voltage. Note: All pins are referenced to ground. Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 9 LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET WWW . Microsemi .C OM EVALUATION BOARD (CONTINUED) Table 2: Jumper Pin Position Assignments Jumper / Position VCC/ VBAT Function Use this position when powering VBAT and VCC from the same supply. Do not connect power to the VCC input when using this jumper position. VCC/ SEP Use this position when using a separate VCC supply (different from VBAT). REF/ EXT Use this position when using an external source to adjust the output voltage. REF/ INT ADJ/ HF ADJ/ LF VLIM/ IN VLIM/ OUT Use this position when using the fixed output voltage mode. In this mode the output voltage can be varied by changing the value of R1 as described in the data sheet. Use this position when adjusting the output with an external PWM that has a repetition rate in excess of 100KHz. Use this position when adjusting the output with an external PWM that has a repetition rate less than 100KHz. Or when using a DC adjustment voltage. Use this position when adjusting the output voltage to prevent the output voltage from accidentally exceeding 25V. This position disables the output voltage adjustment clamp. This position may be desired if maximizing efficiency when operating near 25V output level. Note: Always put jumpers in one of the two possible positions Table 3: Factory Installed Component List for the LX1741Evaluation Board Ref Description Supplier Part Number C1 CAPACITOR, COG, 1000pF, 0402, 50V MURATA GRM36X7R102M050 C2 CAPACITOR, X7R, 0.1uF, 0805, 50V MURATA GRM40X7R104M050 C3 CAPACITOR, Y5V, 2.2uF, 0805, 16V AVX C4,5 CAPACITOR, X5R, 4.7uF, 1210, 25V TAIYO YUDEN CR1 RECTIFIER, SCHOTTKY, 1A, 40V, POWERMITE L1 INDUCTOR, 47UH, 480mA, SMT JP1-7 3 TERM HEADER, 0.1 IN CTR SB1-4 JUMPER MICROSEMI 0805YG225ZAT CETMK325BJ475MN UPS5819 TOKO A920CY-470M 3M 929647-09-36-I 929955-06 MOSFET, N-CHAN, 25V, SOT-23 FAIRCHILD FDV303N Q2 TRANSISTOR, NPN, 40V, SOT-23 ON MMBT3904LT1 R1 RESISTOR, 698K, 1/16W, 0603 PANASONIC ERJ3EKF6983 R2 RESISTOR, 49.9K, 1/16W, 0603 PANASONIC ERJ3EKF4992 R3 RESISTOR, 619K, 1/16W, 0603 PANASONIC ERJ3EKF6193 R4 RESISTOR, 100K, 1/16W, 0603 PANASONIC ERJ3EKF1003 R5,R6 RESISTOR, 1.00K, 1/16W, 0603 PANASONIC ERJ3EKF1001 R7 RESISTOR, 10.0K, 1/16W, 0603 PANASONIC ERJ3EKF1002 R8 RESISTOR, 4.02K, 1/16W, 0603 PANASONIC ERJ3EKF4021 U1 IC, BOOST CONTROLLER MICROSEMI LX1741 VR1 ZENER, 24V,225mW, SOT-23 ON EVAL BOARD 3M Q1 BZX84C24LT1 Note: The minimum part set for a working power supply consists of: C1, C2, C5, CR1, L1, Q1, R1, R2, R8, U1 Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 10 LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET EVALUATION BOARD (CONTINUED) VBAT GND WWW . Microsemi .C OM CR1 UPS5819 L1 47µH VOUT JB1 VCC C4 4.7µF 25V Q1 FDV303N X C1 1000pF 50V VCC C2 0.1µF 50V R7 10K LX1741 JB4 VLIM JB2 REF X R3 619K VR1 24V 225mW BZX84C24LT1 VADJ R4 100K C3 2.2µF 16V GND R2 49.9K R8 4.02K SHDN C5 4.7µF 25V R1 698K R5 1K Q2 MMBT3904LT1 ADJ R6 1K Figure 8 – LX1741 Boost Evaluation Board Schematic CHARACTERISTIC CURVES 30 25 Channel 1 Output Voltage 20 15 10 5 0 Channel 2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 Adj ustment Voltage Channel 1: VOUT (AC coupled; 100mV/div) Channel 2: Inductor Current (100mA/div.) Configuration: VIN = 1.6V, VOUT = 5.0V, IOUT = 20.0mA Copyright 2000 Rev. 1.1, 2002-11-21 Figure 10 – Typical VOUT versus VADJ 0 ~ 0.6V : LX1741 uses internal 1.29V reference. 0.7V ~ 0.8V : transition from internal to external reference. 0.9 to 1.6V : LX1741 defaults to external voltage reference. Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 11 CHARTS Figure 9 – VOUT and Inductor Current Waveforms • • • LX1741 I N T E G R A T E D High Efficiency High Voltage Boost Controller P R O D U C T S P RODUCTION D ATA S HEET CHARACTERISTIC CURVES WWW . Microsemi .C OM 100% Channel 1 Efficiency (%) 90% 80% 70% 60% Channel 2 50% 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 18 19 20 Output Current Figure 11 – VOUT and Inductor Current Waveforms (mA) Figure 12 – Efficiency vs. Output Current (mA) Configuration: VIN = 3.0V, VOUT = 17.9V, L1 = 47.0µH 100% 100% 90% 90% Efficiency (%) Efficiency (%) Channel 1: VOUT (AC coupled; 100mV/div) Channel 2: Inductor Current (100mA/div.) Configuration: VIN = 3.0V, VOUT = 17.9V, IOUT = 11.0mA 80% 70% 80% 70% 60% 60% 50% 50% 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Output Current 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Output Current Configuration: VIN = 5.2V, VOUT = 17.9V, L1 = 94.0µH CHARTS Figure 13 – Efficiency vs. Output Current (mA) Copyright 2000 Rev. 1.1, 2002-11-21 1 Figure 14 – Efficiency vs. Output Current (mA) Configuration: VIN = 3.0V, VOUT = 10.0V, L1 = 47.0µH Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 12 LX1741 I N T E G R A T E D High Efficiency High Voltage Boost Controller P R O D U C T S P RODUCTION D ATA S HEET 100% 90% 90% Efficiency (%) Efficiency (%) 100% 80% 70% WWW . Microsemi .C OM CHARACTERISTIC CURVES 80% 70% 60% 60% 50% 50% 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 1 20 2 3 4 5 6 7 Figure 15 – Efficiency vs. Output Current (mA) 9 10 11 12 13 14 15 16 17 18 19 20 Figure 16 – Efficiency vs. Output Current (mA) Configuration: VIN = 1.6V, VOUT = 5.0V, L1 = 47.0µH Configuration: VIN = 3.0V, VOUT = 5.0V, L1 = 47.0µH 6 100% 5 Gate Drive Voltage (V) 90% Efficiency (%) 8 Output Current Output Current 80% 70% 4 3 2 60% 1 0 50% 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 0 20 20 40 60 80 100 120 Drive Current (mA) Output Current Figure 17 – Efficiency vs. Output Current (mA) Figure 18 – Gate Drive Voltage vs. Drive Current (mA) Configuration: VIN = 3.0V, VOUT = 5.0V, L1 = 47.0µH CHARTS Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 13 LX1741 I N T E G R A T E D High Efficiency High Voltage Boost Controller P R O D U C T S P RODUCTION D ATA S HEET PACKAGE DIMENSIONS WWW . Microsemi .C OM DU 8-Pin Miniature Shrink Outline Package (MSOP) A Dim B H G P M C N LM K L D A B C D G H J K L M N P MILLIMETERS MIN MAX 2.85 3.05 2.90 3.10 – 1.10 0.25 0.40 0.65 BSC 0.38 0.64 0.13 0.18 0.95 BSC 0.40 0.70 3° 0.05 0.15 4.75 5.05 INCHES MIN MAX .112 .120 .114 .122 – 0.043 0.009 0.160 0.025 BSC 0.015 0.025 0.005 0.007 0.037 BSC 0.016 0.027 3° 0.002 0.006 0.187 0.198 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.65 0.75 0.15 0.25 0.28 0.38 2.90 3.10 2.90 3.10 0.65 BSC 1.52 2.08 1.02 1.31 0.20 * 0.20 0.60 0 0.13 0° 12° INCHES MIN MAX 0.031 0.039 0.000 0.002 0.025 0.029 0.005 0.009 0.011 0.015 0.114 0.122 0.114 0.122 0.025 BSC 0.060 0.082 0.040 0.052 0.008 * 0.008 0.023 0 0.005 0° 12° 8-Pin Plastic MLP-Micro Exposed Pad Dim D L L2 K D2 E E2 e b Θ A2 A A3 A1 Internally Connected together, but isolated from all other terminals MECHANICALS L2 A A1 A2 A3 b D E e D2 E2 K L L2 Θ Note: 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not include solder coverage. Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 14 LX1741 I N T E G R A T E D P R O D U C T S High Efficiency High Voltage Boost Controller P RODUCTION D ATA S HEET WWW . Microsemi .C OM NOTES NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright 2000 Rev. 1.1, 2002-11-21 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 15