ON MBRS320T3 Surface mount schottky power rectifier Datasheet

MBRS320T3, MBRS330T3,
MBRS340T3
Surface Mount
Schottky Power Rectifier
These devices employ the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Features
•
•
•
•
•
•
•
•
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SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES
20, 30, 40 VOLTS
Small Compact Surface Mountable Package with J−Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
(0.5 V Max @ 3.0 A, TJ = 25°C)
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guard−Ring for Stress Protection
Device Passes ISO 7637 Pulse #1
Pb−Free Packages are Available
SMC
CASE 403
PLASTIC
MARKING DIAGRAM
AYWW
B3xG
G
Mechanical Characteristics
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Polarity: Notch in Plastic Body Indicates Cathode Lead
Device Meets MSL 1 Requirements
ESD Ratings: Machine Model, C > 400 V
Human Body Model, 3B > 8000 V
B3x = Device Code
x
= 2, 3 or 4
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MBRS320T3
MBRS320T3G
MBRS330T3
MBRS330T3G
MBRS340T3
MBRS340T3G
Package
Shipping†
SMC
2500/Tape & Reel
SMC
(Pb−Free)
2500/Tape & Reel
SMC
2500/Tape & Reel
SMC
(Pb−Free)
2500/Tape & Reel
SMC
2500/Tape & Reel
SMC
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
November, 2008 − Rev. 9
1
Publication Order Number:
MBRS340T3/D
MBRS320T3, MBRS330T3, MBRS340T3
MAXIMUM RATINGS
Symbol
MBRS320T3
MBRS330T3
MBRS340T3
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Rating
VRRM
VRWM
VR
20
30
40
V
Average Rectified Forward Current
IF(AV)
3.0 @ TL = 110°C
4.0 @ TL = 105°C
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave,
single phase, 60 Hz)
IFSM
80
A
TJ
− 65 to +150
°C
ISO 7637 Pulse #1
(100 V, 10W)
5000
Pulses
ESD Ratings: Machine Model = C
ESD Ratings: Human Body Model = 3B
>400
>8000
V
Operating Junction Temperature
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Lead
11
RqJL
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 3.0 A, TJ = 25°C)
VF
Maximum Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 100°C)
iR
V
0.50
mA
2.0
20
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
TYPICAL ELECTRICAL CHARACTERISTICS
1
10
IF, FORWARD CURRENT (AMPS)
IF, FORWARD CURRENT (AMPS)
10
TJ = 125°C
TJ = 100°C
TJ = 25°C
0.1
0.0
TJ = −65°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
TJ = 25°C
0.1
0.0
1.0
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
TJ = 100°C
TJ = 125°C
TJ = −65°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9 1.0
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
MBRS320T3, MBRS330T3, MBRS340T3
1.E−01
IR, REVERSE CURRENT (AMPS)
1.E−01
TJ = 125°C
1.E−02
1.E−02 TJ = 125°C
1.E−03
1.E−03
TJ = 100°C
TJ = 100°C
1.E−04
1.E−04
1.E−05
1.E−06
IR, MAXIMUM REVERSE CURRENT (AMPS)
TYPICAL ELECTRICAL CHARACTERISTICS (continued)
0
5
TJ = 25°C
1.E−05
TJ = 25°C
10
15
20
25
30
35
40
1.E−06
5
0
10
VR, REVERSE VOLTAGE (V)
PFO, AVERAGE POWER DISSIPATION (W)
3.5
3
2.5
SQUARE WAVE
2
1.5
1
0.5
0
90
100
110
120
130
140
150
1.8
1.6
IPK/IO = p
1.4
SQUARE
WAVE
dc
0.8
0.6
0.4
0.2
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
IO, AVERAGE FORWARD CURRENT (A)
Figure 6. Forward Power Dissipation
TYPICAL CAPACITANCE AT 0 V = 658 pF
TJ = 25°C
500
400
300
200
100
4
40
1
600
0
0
35
IPK/IO = 5
1.2
Figure 5. Current Derating
700
30
2
TL, LEAD TEMPERATURE (°C)
C, CAPACITANCE (pF)
IO, AVERAGE FORWARD CURRENT (AMPS)
Freq = 20 kHz
RqJL = 11°C/W
dc
25
Figure 4. Maximum Reverse Current
5
4
20
VR, REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Current
4.5
15
8
12
16
20
24
28
32
VR, REVERSE VOLTAGE (V)
Figure 7. Typical Capacitance
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3
36
40
5
MBRS320T3, MBRS330T3, MBRS340T3
PACKAGE DIMENSIONS
SMC
CASE 403−03
ISSUE E
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
MIN
1.90
0.05
2.92
0.15
5.59
6.60
7.75
0.76
MILLIMETERS
NOM
MAX
2.13
2.41
0.10
0.15
3.00
3.07
0.23
0.30
5.84
6.10
6.86
7.11
7.94
8.13
1.02
1.27
0.51 REF
MIN
0.075
0.002
0.115
0.006
0.220
0.260
0.305
0.030
INCHES
NOM
0.084
0.004
0.118
0.009
0.230
0.270
0.313
0.040
0.020 REF
MAX
0.095
0.006
0.121
0.012
0.240
0.280
0.320
0.050
A
L
L1
c
A1
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
SCALE 4:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MBRS340T3/D
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