Data Sheet, V1.0, January 2008 BGA734L16 Low Power Tri-Band UMTS LNA (2100, 1900, 800 MHz) RF & Protection Devices Edition 2008-01-25 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGA734L16 - Low Power Tri-Band UMTS LNA BGA734L16 Revision History: 2008-01-25, V1.0 Previous Version: V1.2, 2007-07-18 Page Subjects (major changes since last revision) 8-10 Improved low gain mode IIP3 8-10 Improved low gain mode P1dB Data Sheet 3 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Description 1 Description The BGA734L16 is a highly flexible tri-band (2100, 1900, 850/800 MHz) low noise amplifier MMIC for worldwide use. Based on Infineon’s proprietary and cost-effective SiGe:C technology, the BGA734L16 features dynamic gain control, temperature stabilization, standby mode, and 1 kV ESD protection on-chip and matching off chip. Because the matching is off chip, the 1900 MHz path can be converted into a 2100 MHz path and vice versa by optimizing the input and output matching network. This document specifies device performance for the most common band combination - UMTS bands I, II, and V. Features • Gain: 15 / -8 dB in high / low gain • Noise figure: 1.2 dB in high gain mode • Low Band (5, 6, 8, FOMA800) • Mid Band (2, 3, 9, FOMA1700) • High Band (1, 4, 10) • High and low gain modes support • Supply current: 3.5 / 0.65 mA in high / low gain modes • Standby mode (<10 µA typ) • 1 kV HBM ESD protection • Small leadless TSLP-16-1 package (2.3 x 2.3 x 0.39 mm) • Pb-free (RoHS compliant) package TSLP-16-1 package 5 n/c 4 RFGNDH 3 VCC 2 VGS 6 n/c 1 16 RFINM RFOUTM 7 15 RFINH RFOUTH 14 8 RFOUTL RFGNDM Biasing & Logic Circuitry 9 Figure 1 n/c 10 RFINL 11 VEN2 12 VEN1 n/c 13 Block diagram of triple-band LNA Type Package Marking Chip BGA734L16 TSLP-16-1 BGA734 T1520 Data Sheet 4 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Absolute Maximum Ratings 2 Electrical Characteristics 2.1 Absolute Maximum Ratings Table 1 Absolute Maximum Ratings Parameter Symbol VCC Supply current ICC Pin voltage VPIN Pin voltage RF input pins VRFIN RF input power PRFIN Junction temperature Tj Ambient temperature range TA Storage temperature range TSTG Supply voltage 2.2 Thermal Resistance Table 2 Thermal Resistance Parameter Symbol Thermal resistance junction RthJS to soldering point 2.3 ESD Integrity Table 3 ESD Integrity Parameter Symbol Values Unit Min. Max. -0.3 3.6 V 5 mA -0.3 VCC +0.3 V -0.3 0.9 V 4 dBm 150 °C -30 85 °C -65 150 °C Note / Test Condition All pins except RF input pins Value Unit Note / Test Conditions ≤ 110 K/W Value Unit Note / Test Conditions V All pins Typ. ESD hardness HBM 1) VESD-HBM 1000 1) According to JESD22-A114 Data Sheet 5 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics DC Characteristics 2.4 DC Characteristics Table 4 DC Characteristics, TA = 25 °C Parameter Symbol Supply voltage VCC ICCHG Supply current high gain mode Values Min. Typ. Max. 2.7 2.8 3.0 All bands µA All bands 650 Supply current standby mode ICCOFF 0.1 Logic level high VHI VLOW IENL IENH IGSL IGSH Logic currents VEN Logic currents VGS V mA ICCLG 1.5 Note / Test Condition 3.5 Supply current low gain mode Logic level low Unit µA 2 2.8 V 0.0 0.5 V 0.2 µA 10.0 µA 0.1 µA 5.0 µA 2.5 Band Select / Gain Control Truth Table Table 5 Band Select Truth Table VEN1 and VEN2 VEN1 and VEN2 VGS Band I Band II Band V Power Down VCC H H H H VEN1 H H L L VEN2 H L H L Table 6 VGS Data Sheet Gain Control Truth Table High Gain Low Gain H L 6 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Logic Signal Characteristics; TA = 25 °C Logic Signal Characteristics; TA = 25 °C 2.6 Current consumption of logic inputs VEN1, VEN2, VGS Logic currents IEN1,2 = f(VEN1,2) VCC = 2.8 V Logic currents IGS = f(VGS) VCC = 2.8 V 12 6 10 4 IGS [µA] IEN1,2 [µA] 8 6 4 2 2 0 0 0.5 1 1.5 2 2.5 0 3 0 0.5 1 VEN1,2 [V] 2.7 Switching Times Table 7 Typical switching times; TA = -30... 85 °C Parameter 1.5 2 2.5 3 VGS [V] Symbol Values Min. Typ. Unit Note / Test Condition Max. Settling time gainstep tGS 1.2 µs Switching LG ↔ HG all bands Settling time bandselect tBS 1.2 µs Switching from any band to a different band Data Sheet 7 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured RF Characteristics Low Band (UMTS Band V) 2.8 Measured RF Characteristics Low Band (UMTS Band V) Table 8 Typical Characteristics 800 MHz Band, TA = 25 °C, VCC = 2.8 V Parameter Symbol Values Min. Typ. Unit Max. Pass band range 869 894 MHz Input power range -100 0 dBm Current consumption Gain Reverse Isolation 1) Noise figure Input return loss 1) 1) Output return loss 2) Stability factor Input compression point1) 1) Inband IIP3 f1 - f2 = 1 MHz Pf1 = Pf2 = -25 dBm Note / Test Condition ICCHG ICCLG S21HG S21LG S12HG S12LG NFHG NFLG S11HG S11LG S22HG S22LG k 3.5 mA High gain mode 0.65 mA Low gain mode 15.2 dB High gain mode -6.8 dB Low gain mode -34 dB High gain mode -6.8 dB Low gain mode 1.2 dB High gain mode 6.9 dB Low gain mode -13 dB 50 Ω, high gain mode -18 dB 50 Ω, low gain mode -24 dB 50 Ω, high gain mode -11 dB 50 Ω, low gain mode IP1dBHG IP1dBLG IIP3HG IIP3LG -12 dBm High gain mode -6 dBm Low gain mode -6 5 dBm High gain mode Low gain mode >2.1 DC to 10 GHz; all gain modes 1) Verified by random sampling; not 100% RF tested 2) Not tested in production; guaranteed by device design Data Sheet 8 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured RF Characteristics Mid Band (UMTS Band II) 2.9 Measured RF Characteristics Mid Band (UMTS Band II) Table 9 Typical Characteristics 1900 MHz Band, TA = 25 °C, VCC = 2.8 V Parameter Symbol Values Min. Typ. Unit Max. Pass band range 1930 1990 MHz Input power range -100 0 dBm Current consumption Gain Reverse Isolation 1) Noise figure Input return loss 1) 1) Output return loss 2) Stability factor Input compression point1) 1) Inband IIP3 f1 - f2 = 1 MHz Pf1 = Pf2 = -26 dBm Note / Test Condition ICCHG ICCLG S21HG S21LG S12HG S12LG NFHG NFLG S11HG S11LG S22HG S22LG k 3.4 mA High gain mode 0.65 mA Low gain mode 16.5 dB High gain mode -6.9 dB Low gain mode -35 dB High gain mode -7 dB Low gain mode 1.0 dB High gain mode 6.8 dB Low gain mode -13 dB 50 Ω, high gain mode -12 dB 50 Ω, low gain mode -20 dB 50 Ω, high gain mode -17 dB 50 Ω, low gain mode IP1dBHG IP1dBLG IIP3HG IIP3LG -10 dBm High gain mode -4 dBm Low gain mode -5 6 dBm High gain mode Low gain mode >2.0 DC to 10 GHz; all gain modes 1) Verified by random sampling; not 100% RF tested 2) Not tested in production; guaranteed by device design Data Sheet 9 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured RF Characteristics High Band (UMTS Band I) 2.10 Measured RF Characteristics High Band (UMTS Band I) Table 10 Typical Characteristics 2100 MHz Band, TA = 25 °C, VCC = 2.8 V Parameter Symbol Values Min. Typ. Unit Max. Pass band range 2110 2170 MHz Input power range -100 0 dBm Current consumption Gain Reverse Isolation 1) Noise figure Input return loss 1) 1) Output return loss 2) Stability factor Input compression point1) 1) Inband IIP3 f1 - f2 = 1 MHz Pf1 = Pf2 = -27 dBm Note / Test Condition ICCHG ICCLG S21HG S21LG S12HG S12LG NFHG NFLG S11HG S11LG S22HG S22LG k 3.5 mA High gain mode 0.65 mA Low gain mode 16.5 dB High gain mode -7.7 dB Low gain mode -36 dB High gain mode -8 dB Low gain mode 1.1 dB High gain mode 7.4 dB Low gain mode -13 dB 50 Ω, high gain mode -27 dB 50 Ω, low gain mode -18 dB 50 Ω, high gain mode -9 dB 50 Ω, low gain mode IP1dBHG IP1dBLG IIP3HG IIP3LG -11 dBm High gain mode -4 dBm Low gain mode -6 7 dBm High gain mode Low gain mode >1.8 DC to 10 GHz; all gain modes 1) Verified by random sampling; not 100% RF tested 2) Not tested in production; guaranteed by device design Data Sheet 10 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Low Band High Gain Mode vs. Frequency 2.11 Measured Performance Low Band High Gain Mode vs. Frequency TA = 25 °C, VCC = 2.8 V, VGS = 2.8 V, VEN1 = 0 V, VEN2 = 2.8 V Power Gain |S21| = f ( f ) Power Gain Wideband |S21| = f ( f ) 18 20 17.5 10 16.5 Power Gain [dB] Power Gain [dB] 17 −30°C 16 15.5 25°C 15 14.5 0 −10 −20 85°C 14 −30 13.5 13 0.86 0.87 0.88 0.89 −40 0.9 0 Frequency [GHz] 24 −5 23.5 −10 8 23 S 11 Delta Gain [dB] |S11|, |S22| [dB] 6 Gainstep HG - LG |∆S21| = f ( f ) 0 −15 S −20 22 −25 22.5 −30°C 21.5 21 −35 20.5 0.87 0.88 0.89 20 0.86 0.9 Frequency [GHz] 25°C 85°C 22 −30 Data Sheet 4 Frequency [GHz] Matching |S11| = f ( f ), |S22| = f ( f ) −40 0.86 2 0.87 0.88 0.89 0.9 Frequency [GHz] 11 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Low Band High Gain Mode vs. Temperature Noise Figure NF = f ( f ) Input Compression P1dB = f ( f ) 1.5 −8 1.4 −9 1.3 −10 P1dB [dBm] NF [dB] 1.2 1.1 1 0.9 −11 −12 0.8 −13 0.7 0.6 0.86 0.87 0.88 0.89 −14 0.86 0.9 0.87 Frequency [GHz] 2.12 0.88 0.89 0.9 Frequency [GHz] Measured Performance Low Band High Gain Mode vs. Temperature VCC = 2.8 V, VGS = 2.8 V, VEN1 = 0 V, VEN2 = 2.8 V Power Gain |S21| = f (TA) Supply Current ICC = f (TA) 19 4 3.9 3.8 3.7 17 ICC [mA] Power Gain [dB] 18 16 15 3.6 3.5 3.4 3.3 3.2 14 3.1 13 −40 −20 0 20 40 60 80 3 −40 100 T [°C] 0 20 40 60 80 100 T [°C] A Data Sheet −20 A 12 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Low Band Low Gain Mode vs. Frequency Noise Figure NF = f (TA) Input Compression P1dB = f (TA) 1.8 −4 1.6 −6 1.4 P1dB [dBm] NF [dB] −8 1.2 1 −10 −12 0.8 −14 0.6 0.4 −40 −20 0 20 40 60 80 −16 −40 100 −20 0 TA [°C] 2.13 20 40 60 80 100 TA [°C] Measured Performance Low Band Low Gain Mode vs. Frequency TA = 25 °C, VCC = 2.8 V, VGS = 0 V, VEN1 = 0 V, VEN2 = 2.8 V Power Gain |S21| = f ( f ) Power Gain Wideband |S21| = f ( f ) −5 0 −5.5 −10 −30°C Power Gain [dB] Power Gain [dB] −6 −6.5 25°C −7 85°C −7.5 −20 −30 −40 −8 −50 −8.5 −9 0.86 0.87 0.88 0.89 −60 0.9 Frequency [GHz] Data Sheet 0 2 4 6 8 Frequency [GHz] 13 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Low Band Low Gain Mode vs. Frequency Matching |S11| = f ( f ), |S22| = f ( f ) Noise Figure NF = f ( f ) 0 9 −5 8.5 S 8 22 −15 7.5 S 11 NF [dB] |S11|, |S22| [dB] −10 −20 7 −25 6.5 −30 6 −35 5.5 −40 0.86 0.87 0.88 0.89 5 0.86 0.9 Frequency [GHz] 0.87 0.88 0.89 0.9 Frequency [GHz] Input Compression P1dB = f ( f ) −2 −3 P1dB [dBm] −4 −5 −6 −7 −8 0.86 0.87 0.88 0.89 0.9 Frequency [GHz] Data Sheet 14 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Low Band Low Gain Mode vs. Temperature 2.14 Measured Performance Low Band Low Gain Mode vs. Temperature VCC = 2.8 V, VGS = 0 V, VEN1 = 0 V, VEN2 = 2.8 V Power Gain |S21| = f (TA) Supply Current ICC = f (TA) −5 0.8 −5.5 0.75 −6.5 0.7 −7 ICC [mA] Power Gain [dB] −6 −7.5 −8 0.65 0.6 −8.5 −9 0.55 −9.5 −10 −40 −20 0 20 40 60 80 0.5 −40 100 −20 0 TA [°C] 9.5 −1 9 −2 8.5 −3 P1dB [dBm] NF [dB] 0 8 7.5 7 100 −5 −6 −7 6 −8 5.5 −9 20 40 60 80 −10 −40 100 T [°C] −20 0 20 40 60 80 100 T [°C] A Data Sheet 80 −4 6.5 0 60 Input Compression P1dB = f (TA) 10 −20 40 TA [°C] Noise Figure NF = f (TA) 5 −40 20 A 15 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Mid Band High Gain Mode vs. Frequency 2.15 Measured Performance Mid Band High Gain Mode vs. Frequency TA = 25 °C, VCC = 2.8 V, VGS = 2.8 V, VEN1 = 2.8 V, VEN2 = 0 V Power Gain |S21| = f ( f ) Power Gain Wideband |S21| = f ( f ) 18 20 −30°C 17.5 10 16.5 Power Gain [dB] Power Gain [dB] 17 25°C 16 15.5 85°C 15 14.5 14 0 −10 −20 −30 13.5 13 1.93 1.94 1.95 1.96 1.97 1.98 −40 1.99 0 2 Frequency [GHz] 26 −5 25.5 −10 25 S11 −15 Delta Gain [dB] |S11|, |S22| [dB] 0 S 22 −20 −25 24 −30°C 23.5 25°C 23 −35 22.5 1.95 1.96 1.97 1.98 22 1.93 1.99 Frequency [GHz] Data Sheet 8 24.5 −30 1.94 6 Gainstep HG - LG |∆S21| = f ( f ) Matching |S11| = f ( f ), |S22| = f ( f ) −40 1.93 4 Frequency [GHz] 85°C 1.94 1.95 1.96 1.97 1.98 1.99 Frequency [GHz] 16 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Mid Band High Gain Mode vs. Temperature Noise Figure NF = f ( f ) Input Compression P1dB = f ( f ) 1.5 −8 1.4 −9 1.3 −10 P1dB [dBm] NF [dB] 1.2 1.1 1 0.9 −11 −12 0.8 −13 0.7 0.6 1.93 1.94 1.95 1.96 1.97 1.98 −14 1.93 1.99 1.94 Frequency [GHz] 2.16 1.95 1.96 1.97 1.98 1.99 Frequency [GHz] Measured Performance Mid Band High Gain Mode vs. Temperature VCC = 2.8 V, VGS = 2.8 V, VEN1 = 2.8 V, VEN2 = 0 V Power Gain |S21| = f (TA) Supply Current ICC = f (TA) 19 4 3.9 3.8 3.7 17 ICC [mA] Power Gain [dB] 18 16 15 3.6 3.5 3.4 3.3 3.2 14 3.1 13 −40 −20 0 20 40 60 80 3 −40 100 T [°C] 0 20 40 60 80 100 T [°C] A Data Sheet −20 A 17 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Mid Band Low Gain Mode vs. Frequency Noise Figure NF = f (TA) Input Compression P1dB = f (TA) 1.8 −4 1.6 −6 1.4 P1dB [dBm] NF [dB] −8 1.2 1 −10 −12 0.8 −14 0.6 0.4 −40 −20 0 20 40 60 80 −16 −40 100 −20 0 TA [°C] 2.17 20 40 60 80 100 TA [°C] Measured Performance Mid Band Low Gain Mode vs. Frequency TA = 25 °C, VCC = 2.8 V, VGS = 0 V, VEN1 = 2.8 V, VEN2 = 0 V Power Gain |S21| = f ( f ) Power Gain Wideband |S21| = f ( f ) −5 0 −5.5 −10 −30°C Power Gain [dB] Power Gain [dB] −6 −6.5 25°C −7 85°C −7.5 −20 −30 −40 −8 −50 −8.5 −9 1.93 1.94 1.95 1.96 1.97 1.98 −60 1.99 Frequency [GHz] Data Sheet 0 2 4 6 8 Frequency [GHz] 18 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Mid Band Low Gain Mode vs. Frequency Noise Figure NF = f ( f ) 0 9 −5 8.5 −10 S 8 −15 S 7.5 11 22 NF [dB] |S11|, |S22| [dB] Matching |S11| = f ( f ), |S22| = f ( f ) −20 7 −25 6.5 −30 6 −35 5.5 −40 1.93 1.94 1.95 1.96 1.97 1.98 5 1.93 1.99 Frequency [GHz] 1.94 1.95 1.96 1.97 1.98 1.99 Frequency [GHz] Input Compression P1dB = f ( f ) −2 −3 P1dB [dBm] −4 −5 −6 −7 −8 1.93 1.94 1.95 1.96 1.97 1.98 1.99 Frequency [GHz] Data Sheet 19 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance Mid Band Low Gain Mode vs. Temperature 2.18 Measured Performance Mid Band Low Gain Mode vs. Temperature VCC = 2.8 V, VGS = 0 V, VEN1 = 2.8 V, VEN2 = 0 V Input Compression P1dB = f (TA) 10 0 9.5 −1 9 −2 8.5 −3 P1dB [dBm] NF [dB] Noise Figure NF = f (TA) 8 7.5 7 −4 −5 −6 6.5 −7 6 −8 5.5 −9 5 −40 −20 0 20 40 60 80 −10 −40 100 TA [°C] Data Sheet −20 0 20 40 60 80 100 TA [°C] 20 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance High Band High Gain Mode vs. Frequency 2.19 Measured Performance High Band High Gain Mode vs. Frequency TA = 25 °C, VCC = 2.8 V, VGS = 2.8 V, VEN1 = 2.8 V, VEN2 = 2.8 V Power Gain |S21| = f ( f ) Power Gain Wideband |S21| = f ( f ) 20 18 17.5 −30°C 10 16.5 Power Gain [dB] Power Gain [dB] 17 25°C 16 15.5 85°C 15 14.5 14 0 −10 −20 −30 13.5 13 2.11 −40 2.12 2.13 2.14 2.15 2.16 2.17 0 2 4 6 8 Frequency [GHz] Frequency [GHz] Gainstep HG - LG |∆S21| = f ( f ) Matching |S11| = f ( f ), |S22| = f ( f ) 0 28 27.5 −5 27 26.5 S 11 −15 Delta Gain [dB] |S11|, |S22| [dB] −10 S22 −20 −25 −30 26 25.5 25 24.5 −30°C 24 25°C 85°C 23.5 23 −35 22.5 −40 2.11 2.12 2.13 2.14 2.15 2.16 22 2.11 2.17 Frequency [GHz] Data Sheet 2.12 2.13 2.14 2.15 2.16 2.17 Frequency [GHz] 21 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance High Band High Gain Mode vs. Temperature Noise Figure NF = f ( f ) Input Compression P1dB = f ( f ) 1.5 −8 1.4 −9 1.3 −10 P1dB [dBm] NF [dB] 1.2 1.1 1 0.9 −11 −12 0.8 −13 0.7 0.6 2.11 2.12 2.13 2.14 2.15 2.16 −14 2.11 2.17 2.12 Frequency [GHz] 2.20 2.13 2.14 2.15 2.16 2.17 Frequency [GHz] Measured Performance High Band High Gain Mode vs. Temperature VCC = 2.8 V, VGS = 2.8 V, VEN1 = 2.8 V, VEN2 = 2.8 V Power Gain |S21| = f (TA) Supply Current ICC = f (TA) 19 4 3.9 3.8 3.7 17 ICC [mA] Power Gain [dB] 18 16 15 3.6 3.5 3.4 3.3 3.2 14 3.1 13 −40 −20 0 20 40 60 80 3 −40 100 T [°C] 0 20 40 60 80 100 T [°C] A Data Sheet −20 A 22 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance High Band Low Gain Mode vs. Frequency Noise Figure NF = f (TA) Input Compression P1dB = f (TA) 1.8 −4 1.6 −6 1.4 P1dB [dBm] NF [dB] −8 1.2 1 −10 −12 0.8 −14 0.6 0.4 −40 −20 0 20 40 60 80 −16 −40 100 −20 0 TA [°C] 2.21 20 40 60 80 100 TA [°C] Measured Performance High Band Low Gain Mode vs. Frequency TA = 25 °C, VCC = 2.8 V, VGS = 0 V, VEN1 = 2.8 V, VEN2 = 2.8 V Power Gain |S21| = f ( f ) Power Gain Wideband |S21| = f ( f ) −5 0 −5.5 −10 Power Gain [dB] Power Gain [dB] −6 −6.5 −30°C −7 25°C −7.5 −40 −50 −8.5 2.12 2.13 2.14 2.15 2.16 −60 2.17 Frequency [GHz] Data Sheet −30 85°C −8 −9 2.11 −20 0 2 4 6 8 Frequency [GHz] 23 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance High Band Low Gain Mode vs. Frequency Matching |S11| = f ( f ), |S22| = f ( f ) Noise Figure NF = f ( f ) 0 9 −5 8.5 S 22 8 −15 7.5 NF [dB] |S11|, |S22| [dB] −10 −20 S11 7 −25 6.5 −30 6 −35 5.5 −40 2.11 2.12 2.13 2.14 2.15 2.16 5 2.11 2.17 Frequency [GHz] 2.12 2.13 2.14 2.15 2.16 2.17 Frequency [GHz] Input Compression P1dB = f ( f ) −2 −3 P1dB [dBm] −4 −5 −6 −7 −8 2.11 2.12 2.13 2.14 2.15 2.16 2.17 Frequency [GHz] Data Sheet 24 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Electrical Characteristics Measured Performance High Band Low Gain Mode vs. Temperature 2.22 Measured Performance High Band Low Gain Mode vs. Temperature VCC = 2.8 V, VGS = 0 V, VEN1 = 2.8 V, VEN2 = 2.8 V Power Gain |S21| = f (TA) Supply Current ICC = f (TA) −5 0.8 −5.5 0.75 −6.5 0.7 −7 ICC [mA] Power Gain [dB] −6 −7.5 −8 0.65 0.6 −8.5 −9 0.55 −9.5 −10 −40 −20 0 20 40 60 80 0.5 −40 100 −20 0 TA [°C] 9.5 −1 9 −2 8.5 −3 P1dB [dBm] NF [dB] 0 8 7.5 7 100 −5 −6 −7 6 −8 5.5 −9 20 40 60 80 −10 −40 100 T [°C] −20 0 20 40 60 80 100 T [°C] A Data Sheet 80 −4 6.5 0 60 Input Compression P1dB = f (TA) 10 −20 40 TA [°C] Noise Figure NF = f (TA) 5 −40 20 A 25 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Application Circuit and Block Diagram UMTS bands I, II and V Application Circuit Schematic 3 Application Circuit and Block Diagram 3.1 UMTS bands I, II and V Application Circuit Schematic VCC= 2.8 V VGS= 0 / 2.8 V C7 10nF 0 GND 5 n/c RFIN 1900 MHz 3 VCC 2 VGS n/c 1 C1 10pF 6 C2 22pF RFIN 2100 MHz 4 RFGNDH 16 L1 RFINM L1 3.9nH 3.9nH RFOUTM C3 10pF L2 2.7nH 7 15 RFINH RFOUTH RFOUT 1900 MHz RFOUT 2100 MHz C4 22pF 14 8 RFOUTL RFGNDM RFOUT 800 MHz Biasing & Logic Circuitry 9 n/c 10 RFINL 11 VEN2 12 VEN1 n/c 13 C5 3.0pF RFIN 800 MHz C6 22pF Figure 2 L3 9.1nH VEN= 0 / 2.8 V VEN= 0 / 2.8 V Application circuit with chip outline (top view) Note: Package paddle (Pin 0) has to be RF grounded. Table 11 Parts List Part Number Part Type Manufacturer Size Comment L1 ... L3 Chip inductor Various 0402 Wirewound, Q ≈ 50 C1 ... C7 Chip capacitor Various 0402 Data Sheet 26 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Application Circuit and Block Diagram Pin Definition 3.2 Pin Definition Table 12 Pin Definition and Function Pin Number Symbol Function 0 GND Ground connection for low band (800 MHz) LNA and control circuity (package paddle) 1 n/c Not connected 2 VGS Gain step control 3 VCC Supply voltage 4 RFGNDH High band (2100 MHz) LNA emitter ground 5 n/c Not connected 6 RFINM Mid band (1900 MHz) LNA input 7 RFINH High band (2100 MHz) LNA input 8 RFGNDM Mid band (1900 MHz) LNA emitter ground 9 n/c Not connected 10 RFINL Low band (800 MHz) LNA input 11 VEN2 Band select control 12 VEN1 Band select control 13 n/c Not connected 14 RFOUTL Low band (800 MHz) LNA output 15 RFOUTH High band (2100 MHz) LNA output 16 RFOUTM Mid band (1900 MHz) LNA output Data Sheet 27 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Application Circuit and Block Diagram Application Board 3.3 Application Board Top layer (top view) Figure 3 Figure 4 Data Sheet Middle layer (top view) Bottom layer (top view) Application board layout on 3-layer FR4. Top layer thickness: 0.2 mm, bottom layer thickness: 0.8 mm, 35 µm Cu metallization, gold plated. Board size: 21 x 50 mm 0.017 mm 0.100 mm Copper Prepreg FR4 0.100 mm 0.035 mm Prepreg FR4 Copper 0.460 mm FR4 0.100 mm Prepreg FR4 0.100 mm 0.017 mm Prepreg FR4 Copper Cross-section view of application board 28 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Application Circuit and Block Diagram RFINM 5 4 3 GS VCC RFGNDH Application Board 2 6 RFINH GND 7 RFOUTM 15 RFOUTH 11 12 RFOUTL 13 EN1 10 EN2 9 16 14 RFINL 8 1 RFGNDM Figure 5 Detail of application board layout Note: In order to achieve the same performance as given in this datasheet please follow the suggested PCB-layout as closely as possible. The position of the GND vias is critical for RF performance. Data Sheet 29 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Physical Characteristics Package Footprint 4 Physical Characteristics 4.1 Package Footprint Figure 6 Recommended footprint and stencil layout for the TSLP-16-1 package. Data Sheet 30 V1.0, 2008-01-25 BGA734L16 - Low Power Tri-Band UMTS LNA Physical Characteristics Package Dimensions 4.2 Package Dimensions Top view Bottom view 2.3 ±0.05 0.39 +0.01 -0.03 2 ±0.05 0.05 MAX. 1±0.05 9 10 11 12 16 4 3 2 2.3 ±0.05 6 1 1 6 x 0.2 ±0.035 1) Dimension applies to plated terminals Data Sheet 15 1 6 x 0.2 ±0.035 7 5 Pin 1 marking Figure 7 14 1.4 ±0.035 1) 0 . 0 5 x 45˚ 8 1±0.05 1.4 ±0.035 2 ±0.05 13 GPC01203 Package outline (top, side and bottom view) 31 V1.0, 2008-01-25