LINER LTC5557 16-bit, 125/105/80msps low power dual adc Datasheet

LTC2185/LTC2184/LTC2183
16-Bit, 125/105/80Msps
Low Power Dual ADCs
Features
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Description
The LTC®2185/LTC2184/LTC2183 are two-channel simultaneous sampling 16-bit A/D converters designed for
digitizing high frequency, wide dynamic range signals.
They are perfect for demanding communications applications with AC performance that includes 76.8dB SNR and
90dB spurious free dynamic range (SFDR). Ultralow jitter
of 0.07psRMS allows undersampling of IF frequencies with
excellent noise performance.
Two-Channel Simultaneously Sampling ADC
76.8dB SNR
90dB SFDR
Low Power: 370mW/308mW/200mW Total
185mW/154mW/100mW per Channel
Single 1.8V Supply
CMOS, DDR CMOS, or DDR LVDS Outputs
Selectable Input Ranges: 1VP-P to 2VP-P
550MHz Full Power Bandwidth S/H
Optional Data Output Randomizer
Optional Clock Duty Cycle Stabilizer
Shutdown and Nap Modes
Serial SPI Port for Configuration
64-Pin (9mm × 9mm) QFN Package
DC specs include ±2LSB INL (typ), ±0.5LSB DNL (typ)
and no missing codes over temperature. The transition
noise is 3.4LSBRMS.
The digital outputs can be either full rate CMOS, Double
Data Rate CMOS, or Double Data Rate LVDS. A separate
output power supply allows the CMOS output swing to
range from 1.2V to 1.8V.
Applications
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The ENC+ and ENC– inputs may be driven differentially
or single-ended with a sine wave, PECL, LVDS, TTL, or
CMOS inputs. An optional clock duty cycle stabilizer allows high performance at full speed for a wide range of
clock duty cycles.
Communications
Cellular Base Stations
Software Defined Radios
Portable Medical Imaging
Multi-Channel Data Acquisition
Nondestructive Testing
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
Typical Application
1.8V
VDD
2-Tone FFT, fIN = 70MHz and 69MHz
1.8V
OVDD
0
–10
CH 2
ANALOG
INPUT
–20
D1_15
•
•
•
D1_0
16-BIT
ADC CORE
S/H
16-BIT
ADC CORE
S/H
OUTPUT
DRIVERS
D2_15
•
•
•
D2_0
–30
CMOS,
DDR CMOS
OR DDR LVDS
OUTPUTS
AMPLITUDE (dBFS)
CH 1
ANALOG
INPUT
–40
–50
–60
–70
–80
–90
–100
–110
–120
125MHz
CLOCK
CONTROL
CLOCK
0
10
20
30
40
FREQUENCY (MHz)
50
60
218543 TA01b
218543 TA01a
GND
OGND
218543f
1
LTC2185/LTC2184/LTC2183
Absolute Maximum Ratings
(Notes 1, 2)
Supply Voltages (VDD, OVDD)........................ –0.3V to 2V
Analog Input Voltage (AIN+, AIN–,
PAR/SER, SENSE) (Note 3)........... –0.3V to (VDD + 0.2V)
Digital Input Voltage (ENC+, ENC–, CS,
SDI, SCK) (Note 4)..................................... –0.3V to 3.9V
SDO (Note 4)............................................. –0.3V to 3.9V
Digital Output Voltage................. –0.3V to (OVDD + 0.3V)
Operating Temperature Range
LTC2185C, 2184C, 2183C......................... 0°C to 70°C
LTC2185I, 2184I, 2183I........................ –40°C to 85°C
Storage Temperature Range.................... –65°C to 150°C
Pin ConfigurationS
FULL-RATE CMOS OUTPUT MODE
DOUBLE DATA RATE CMOS OUTPUT MODE
TOP VIEW
64 VDD
63 SENSE
62 VREF
61 SDO
60 OF1
59 OF2
58 D1_15
57 D1_14
56 D1_13
55 D1_12
54 D1_11
53 D1_10
52 D1_9
51 D1_8
50 D1_7
49 D1_6
64 VDD
63 SENSE
62 VREF
61 SDO
60 OF2_1
59 DNC
58 D1_14_15
57 DNC
56 D1_12_13
55 DNC
54 D1_10_11
53 DNC
52 D1_8_9
51 DNC
50 D1_6_7
49 DNC
TOP VIEW
VDD 1
VCM1 2
GND 3
AIN1+ 4
AIN1– 5
GND 6
REFH 7
REFL 8
REFH 9
REFL 10
PAR/SER 11
AIN2+ 12
AIN2– 13
GND 14
VCM2 15
VDD 16
65
GND
48 D1_4_5
47 DNC
46 D1_2_3
45 DNC
44 D1_0_1
43 DNC
42 OVDD
41 OGND
40 CLKOUT+
39 CLKOUT–
38 D2_14_15
37 DNC
36 D2_12_13
35 DNC
34 D2_10_11
33 DNC
VDD 17
ENC+ 18
ENC– 19
CS 20
SCK 21
SDI 22
DNC 23
D2_0_1 24
DNC 25
D2_2_3 26
DNC 27
D2_4_5 28
DNC 29
D2_6_7 30
DNC 31
D2_8_9 32
65
GND
48 D1_5
47 D1_4
46 D1_3
45 D1_2
44 D1_1
43 D1_0
42 OVDD
41 OGND
40 CLKOUT+
39 CLKOUT–
38 D2_15
37 D2_14
36 D2_13
35 D2_12
34 D2_11
33 D2_10
VDD 17
ENC+ 18
ENC– 19
CS 20
SCK 21
SDI 22
D2_0 23
D2_1 24
D2_2 25
D2_3 26
D2_4 27
D2_5 28
D2_6 29
D2_7 30
D2_8 31
D2_9 32
VDD 1
VCM1 2
GND 3
AIN1+ 4
AIN1– 5
GND 6
REFH 7
REFL 8
REFH 9
REFL 10
PAR/SER 11
AIN2+ 12
AIN2– 13
GND 14
VCM2 15
VDD 16
UP PACKAGE
64-LEAD (9mm × 9mm) PLASTIC QFN
TJMAX = 150°C, θJA = 20°C/W
EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB
UP PACKAGE
64-LEAD (9mm × 9mm) PLASTIC QFN
TJMAX = 150°C, θJA = 20°C/W
EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB
218543f
2
LTC2185/LTC2184/LTC2183
Pin ConfigurationS
DOUBLE DATA RATE LVDS OUTPUT MODE
64 VDD
63 SENSE
62 VREF
61 SDO
60 OF2_1+
59 OF2_1–
58 D1_14_15+
57 D1_14_15–
56 D1_12_13+
55 D1_12_13–
54 D1_10_11+
53 D1_10_11–
52 D1_8_9+
51 D1_8_9–
50 D1_6_7+
49 D1_6_7–
TOP VIEW
VDD 1
VCM1 2
GND 3
AIN1+ 4
AIN1– 5
GND 6
REFH 7
REFL 8
REFH 9
REFL 10
PAR/SER 11
AIN2+ 12
AIN2– 13
GND 14
VCM2 15
VDD 16
48 D1_4_5+
47 D1_4_5–
46 D1_2_3+
45 D1_2_3–
44 D1_0_1+
43 D1_0_1–
42 OVDD
41 OGND
40 CLKOUT+
39 CLKOUT–
38 D2_14_15+
37 D2_14_15–
36 D2_12_13+
35 D2_12_13–
34 D2_10_11+
33 D2_10_11–
VDD 17
ENC+ 18
ENC– 19
CS 20
SCK 21
SDI 22
D2_0_1– 23
D2_0_1+ 24
D2_2_3– 25
D2_2_3+ 26
D2_4_5– 27
D2_4_5+ 28
D2_6_7– 29
D2_6_7+ 30
D2_8_9– 31
D2_8_9+ 32
65
GND
UP PACKAGE
64-LEAD (9mm × 9mm) PLASTIC QFN
TJMAX = 150°C, θJA = 20°C/W
EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB
Order Information
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2185CUP#PBF
LTC2185CUP#TRPBF
LTC2185UP
64-Lead (9mm × 9mm) Plastic QFN
0°C to 70°C
LTC2185IUP#PBF
LTC2185IUP#TRPBF
LTC2185UP
64-Lead (9mm × 9mm) Plastic QFN
–40°C to 85°C
LTC2184CUP#PBF
LTC2184CUP#TRPBF
LTC2184UP
64-Lead (9mm × 9mm) Plastic QFN
0°C to 70°C
LTC2184IUP#PBF
LTC2184IUP#TRPBF
LTC2184UP
64-Lead (9mm × 9mm) Plastic QFN
–40°C to 85°C
LTC2183CUP#PBF
LTC2183CUP#TRPBF
LTC2183UP
64-Lead (9mm × 9mm) Plastic QFN
0°C to 70°C
LTC2183IUP#PBF
LTC2183IUP#TRPBF
LTC2183UP
64-Lead (9mm × 9mm) Plastic QFN
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
218543f
3
LTC2185/LTC2184/LTC2183
Converter Characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 5)
LTC2185
PARAMETER
CONDITIONS
Resolution (No Missing Codes)
MIN
l
LTC2184
TYP
MAX
MIN
±2
7.5
–7.5
16
LTC2183
TYP
MAX
MIN
±2
7.5
–7.5
16
TYP
MAX
UNITS
±2
7.5
LSB
16
Bits
Integral Linearity Error
Differential Analog Input (Note 6) l
–7.5
Differential Linearity Error
Differential Analog Input
l
–0.9
±0.5
0.9
–0.9
±0.5
0.9
–0.9
±0.5
0.9
LSB
Offset Error
(Note 7)
l
–7
±1.5
7
–7
±1.5
7
–7
±1.5
7
mV
Gain Error
Internal Reference
External Reference
l
–2.3
±1.5
–0.9
0.3
–2.1
±1.5
–0.8
0.4
–1.8
±1.5
–0.5
0.8
%FS
%FS
Offset Drift
±10
±10
±10
µV/°C
±30
±10
±30
±10
±30
±10
ppm/°C
ppm/°C
Gain Matching
±0.3
±0.3
±0.3
%FS
Offset Matching
±1.5
±1.5
±1.5
mV
Transition Noise
3.4
3.5
3.2
LSBRMS
Full-Scale Drift
Internal Reference
External Reference
Analog Input
The l denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VIN
Analog Input Range (AIN+ – AIN–)
1.7V < VDD < 1.9V
l
Differential Analog Input (Note 8)
l
0.7
VCM
1.25
V
l
0.625
1.250
1.300
V
1 to 2
VP-P
VIN(CM)
Analog Input Common Mode (AIN+ + AIN–)/2
VSENSE
External Voltage Reference Applied to SENSE External Reference Mode
IINCM
Analog Input Common Mode Current
Per Pin, 125Msps
Per Pin, 105Msps
Per Pin, 80Msps
IIN1
Analog Input Leakage Current (No Encode)
0 < AIN+, AIN– < VDD
l
–1.5
1.5
µA
IIN2
PAR/SER Input Leakage Current
0 < PAR/SER < VDD
l
–3
3
µA
IIN3
SENSE Input Leakage Current
0.625 < SENSE < 1.3V
l
–3
3
µA
tAP
Sample-and-Hold Acquisition Delay Time
tJITTER
Sample-and-Hold Acquisition Delay Jitter
CMRR
Analog Input Common Mode Rejection Ratio
BW-3B
Full-Power Bandwidth
200
170
130
0
Single-Ended Encode
Differential Encode
Figure 6 Test Circuit
0.07
0.09
µA
µA
µA
ns
psRMS
psRMS
80
dB
550
MHz
218543f
4
LTC2185/LTC2184/LTC2183
Dynamic Accuracy
The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. AIN = –1dBFS. (Note 5)
LTC2185
SYMBOL
PARAMETER
CONDITIONS
SNR
Signal-to-Noise Ratio
5MHz Input
70MHz Input
140MHz Input
SFDR
S/(N+D)
MIN
TYP
l
74.8
Spurious Free Dynamic Range 5MHz Input
2nd Harmonic
70MHz Input
140MHz Input
l
Spurious Free Dynamic Range 5MHz Input
3rd Harmonic
70MHz Input
140MHz Input
Spurious Free Dynamic Range 5MHz Input
4th Harmonic or Higher
70MHz Input
140MHz Input
Signal-to-Noise Plus
Distortion Ratio
5MHz Input
70MHz Input
140MHz Input
Crosstalk
10MHz Input
LTC2184
MAX
MIN
TYP
76.8
76.6
76.1
74.8
79
90
89
84
l
82
l
l
LTC2183
MIN
TYP
76.7
76.5
76
75.1
77.1
76.9
76.4
dBFS
dBFS
dBFS
81
90
89
84
81
90
89
84
dBFS
dBFS
dBFS
90
89
84
81
90
89
84
82
90
89
84
dBFS
dBFS
dBFS
89
95
95
95
89
95
95
95
89
95
95
95
dBFS
dBFS
dBFS
73.3
76.6
76.2
75.1
73.9
76.5
76.1
75
74.4
76.9
76.5
75.3
dBFS
dBFS
dBFS
–110
dBc
–110
MAX
–110
MAX
UNITS
Internal Reference Characteristics
The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5)
PARAMETER
CONDITIONS
VCM Output Voltage
IOUT = 0
MIN
TYP
MAX
0.5 • VDD – 25mV
0.5 • VDD
0.5 • VDD + 25mV
VCM Output Temperature Drift
±25
VCM Output Resistance
–600µA < IOUT < 1mA
VREF Output Voltage
IOUT = 0
VREF Output Temperature Drift
1.250
±25
VREF Output Resistance
–400µA < IOUT < 1mA
VREF Line Regulation
1.7V < VDD < 1.9V
7
0.6
V
ppm/°C
4
1.225
UNITS
Ω
1.275
V
ppm/°C
Ω
mV/V
218543f
5
LTC2185/LTC2184/LTC2183
Digital Inputs and Outputs
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
ENCODE INPUTS (ENC+, ENC– )
Differential Encode Mode (ENC– Not Tied to GND)
VID
Differential Input Voltage
(Note 8)
l
0.2
VICM
Common Mode Input Voltage
Internally Set
Externally Set (Note 8)
l
1.1
l
0.2
V
1.2
1.6
V
V
3.6
V
VIN
Input Voltage Range
ENC+, ENC– to GND
RIN
Input Resistance
(See Figure 10)
10
kΩ
CIN
Input Capacitance
(Note 8)
3.5
pF
Single-Ended Encode Mode (ENC– Tied to GND)
VIH
High Level Input Voltage
VDD = 1.8V
l
VIL
Low Level Input Voltage
VDD = 1.8V
l
1.2
V
VIN
Input Voltage Range
ENC+ to GND
l
RIN
Input Resistance
(See Figure 11)
30
kΩ
CIN
Input Capacitance
(Note 8)
3.5
pF
0.6
0
3.6
V
V
DIGITAL INPUTS (CS, SDI, SCK in Serial or Parallel Programming Mode. SDO in Parallel Programming Mode)
VIH
High Level Input Voltage
VDD = 1.8V
l
VIL
Low Level Input Voltage
VDD = 1.8V
l
IIN
Input Current
VIN = 0V to 3.6V
l
CIN
Input Capacitance
(Note 8)
1.3
V
–10
0.6
V
10
µA
3
pF
200
Ω
SDO OUTPUT (Serial Programming Mode. Open-Drain Output. Requires 2kΩ Pull-Up Resistor if SDO is Used)
ROL
Logic Low Output Resistance to GND
VDD = 1.8V, SDO = 0V
IOH
Logic High Output Leakage Current
SDO = 0V to 3.6V
COUT
Output Capacitance
(Note 8)
l
–10
10
µA
3
pF
1.790
V
DIGITAL DATA OUTPUTS (CMOS MODES: FULL DATA RATE AND DOUBLE DATA RATE)
OVDD = 1.8V
VOH
High Level Output Voltage
IO = –500µA
l
VOL
Low Level Output Voltage
IO = 500µA
l
1.750
0.010
0.050
V
OVDD = 1.5V
VOH
High Level Output Voltage
IO = –500µA
1.488
V
VOL
Low Level Output Voltage
IO = 500µA
0.010
V
OVDD = 1.2V
VOH
High Level Output Voltage
IO = –500µA
1.185
V
VOL
Low Level Output Voltage
IO = 500µA
0.010
V
DIGITAL DATA OUTPUTS (LVDS MODE)
VOD
Differential Output Voltage
100Ω Differential Load, 3.5mA Mode
100Ω Differential Load, 1.75mA Mode
l
247
350
175
454
VOS
Common Mode Output Voltage
100Ω Differential Load, 3.5mA Mode
100Ω Differential Load, 1.75mA Mode
l
1.125
1.250
1.250
1.375
RTERM
On-Chip Termination Resistance
Termination Enabled, OVDD = 1.8V
100
mV
mV
V
V
Ω
218543f
6
LTC2185/LTC2184/LTC2183
Power Requirements
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 9)
LTC2185
SYMBOL PARAMETER
CONDITIONS
LTC2184
LTC2183
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
CMOS Output Modes: Full Data Rate and Double Data Rate
VDD
Analog Supply Voltage
(Note 10)
l
1.7
1.8
1.9
1.7
1.8
1.9
1.7
1.8
1.9
V
OVDD
Output Supply Voltage
(Note 10)
l
1.1
1.8
1.9
1.1
1.8
1.9
1.1
1.8
1.9
V
IVDD
Analog Supply Current
DC Input
Sine Wave Input
l
206
209
228
171
173
188
111
113
124
mA
mA
IOVDD
Digital Supply Current
Sine Wave Input, OVDD = 1.2V
10
PDISS
Power Dissipation
l
DC Input
Sine Wave Input, OVDD = 1.2V
370
388
410
8
6
308
321
339
mA
200
211
223
mW
mW
LVDS Output Mode
VDD
Analog Supply Voltage
(Note 10)
l
1.7
1.8
1.9
1.7
1.8
1.9
1.7
1.8
1.9
V
OVDD
Output Supply Voltage
(Note 10)
l
1.7
1.8
1.9
1.7
1.8
1.9
1.7
1.8
1.9
V
IVDD
Analog Supply Current
Sine Input, 1.75mA Mode
Sine Input, 3.5mA Mode
l
211
213
233
175
177
193
115
117
128
mA
mA
Digital Supply Current
(0VDD = 1.8V)
Sine Input, 1.75mA Mode
Sine Input, 3.5mA Mode
l
40
76
86
40
75
85
39
75
84
mA
mA
Power Dissipation
Sine Input, 1.75mA Mode
Sine Input, 3.5mA Mode
l
452
520
574
387
454
500
277
346
382
mW
mW
IOVDD
PDISS
All Output Modes
PSLEEP
Sleep Mode Power
1
1
1
mW
PNAP
Nap Mode Power
16
16
16
mW
PDIFFCLK
Power Increase with Differential Encode Mode Enabled
(No increase for Nap or Sleep Modes)
20
20
20
mW
Timing Characteristics
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
LTC2185
SYMBOL
PARAMETER
CONDITIONS
MIN
fS
Sampling Frequency
(Note 10)
l
1
tL
ENC Low Time (Note 8)
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
l
l
3.8
2
tH
ENC High Time (Note 8)
Duty Cycle Stabilizer Off
Duty Cycle Stabilizer On
l
l
3.8
2
tAP
Sample-and-Hold
Acquisition Delay Time
SYMBOL
PARAMETER
TYP
LTC2184
MAX
MIN
125
1
4
4
500
500
4.52
2
4
4
500
500
4.52
2
0
TYP
LTC2183
MAX
MIN
105
1
4.76
4.76
500
500
5.93
2
4.76
4.76
500
500
5.93
2
0
CONDITIONS
TYP
MAX
UNITS
80
MHz
6.25
6.25
500
500
ns
ns
6.25
6.25
500
500
ns
ns
0
ns
MIN
TYP
MAX
UNITS
Digital Data Outputs (CMOS Modes: Full Data Rate and Double Data Rate)
tD
ENC to Data Delay
CL = 5pF (Note 8)
l
1.1
1.7
3.1
ns
tC
ENC to CLKOUT Delay
CL = 5pF (Note 8)
l
1
1.4
2.6
ns
tSKEW
DATA to CLKOUT Skew
tD – tC (Note 8)
l
0
0.3
0.6
ns
Pipeline Latency
Full Data Rate Mode
Double Data Rate Mode
6
6.5
Cycles
Cycles
218543f
7
LTC2185/LTC2184/LTC2183
timing characteristics
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 5)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Digital Data Outputs (LVDS Mode)
tD
ENC to Data Delay
CL = 5pF (Note 8)
l
1.1
1.8
3.2
ns
tC
ENC to CLKOUT Delay
CL = 5pF (Note 8)
l
1
1.5
2.7
ns
tSKEW
DATA to CLKOUT Skew
tD – tC (Note 8)
l
0
0.3
0.6
ns
Pipeline Latency
6.5
Cycles
SPI Port Timing (Note 8)
tSCK
SCK Period
tS
Write Mode
Readback Mode, CSDO = 20pF, RPULLUP = 2k
l
l
40
250
ns
ns
CS to SCK Setup Time
l
5
ns
tH
SCK to CS Setup Time
l
5
ns
tDS
SDI Setup Time
l
5
ns
tDH
SDI Hold Time
l
5
tDO
SCK Falling to SDO Valid
Readback Mode, CSDO = 20pF, RPULLUP = 2k
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to GND with GND and OGND
shorted (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above VDD, they
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above VDD without latchup.
Note 4: When these pin voltages are taken below GND they will be
clamped by internal diodes. When these pin voltages are taken above VDD
they will not be clamped by internal diodes. This product can handle input
currents of greater than 100mA below GND without latchup.
Note 5: VDD = OVDD = 1.8V, fSAMPLE = 125MHz (LTC2185), 105MHz
(LTC2184), or 80MHz (LTC2183), LVDS outputs, differential ENC+/ENC– =
2VP-P sine wave, input range = 2VP-P with differential drive, unless
otherwise noted.
l
ns
125
ns
Note 6: Integral nonlinearity is defined as the deviation of a code from a
best fit straight line to the transfer curve. The deviation is measured from
the center of the quantization band.
Note 7: Offset error is the offset voltage measured from –0.5 LSB when
the output code flickers between 0000 0000 0000 0000 and 1111 1111
1111 1111 in 2’s complement output mode.
Note 8: Guaranteed by design, not subject to test.
Note 9: VDD = 1.8V, fSAMPLE = 125MHz (LTC2185), 105MHz (LTC2184),
or 80MHz (LTC2183), CMOS outputs, ENC+ = single-ended 1.8V square
wave, ENC– = 0V, input range = 2VP-P with differential drive, 5pF load on
each digital output unless otherwise noted. The supply current and power
dissipation specifications are totals for the entire IC, not per channel.
Note 10: Recommended operating conditions.
218543f
8
LTC2185/LTC2184/LTC2183
Timing Diagrams
Full-Rate CMOS Output Mode Timing
All Outputs Are Single-Ended and Have CMOS Levels
tAP
CH 1
ANALOG
INPUT
A+4
A+2
A
A+3
tAP
CH 2
ANALOG
INPUT
A+1
B+4
B+2
B
B+3
tH
tL
B+1
ENC–
ENC+
tD
D1_0 - D1_15, OF1
A–6
A–5
A–4
A–3
A–2
D2_0 - D2_15, OF2
B–6
B–5
B–4
B–3
B–2
tC
CLKOUT +
CLKOUT –
218543 TD01
Double Data Rate CMOS Output Mode Timing
All Outputs Are Single-Ended and Have CMOS Levels
tAP
CH 1
ANALOG
INPUT
A+3
tAP
CH 2
ANALOG
INPUT
A+4
A+2
A
A+1
B+4
B+2
B
B+3
tH
tL
B+1
ENC–
ENC+
tD
tD
BIT 0
A-6
BIT 1
A-6
BIT 0
A-5
BIT 1
A-5
BIT 0
A-4
BIT 1
A-4
BIT 0
A-3
BIT 1
A-3
BIT 0
A-2
D1_14_15
BIT 14
A-6
BIT 15
A-6
BIT 14
A-5
BIT 15
A-5
BIT 14
A-4
BIT 15
A-4
BIT 14
A-3
BIT 15
A-3
BIT 14
A-2
D2_0_1
BIT 0
B-6
BIT 1
B-6
BIT 0
B-5
BIT 1
B-5
BIT 0
B-4
BIT 1
B-4
BIT 0
B-3
BIT 1
B-3
BIT 0
B-2
BIT 14
B-6
BIT 15
B-6
BIT 14
B-5
BIT 15
B-5
BIT 14
B-4
BIT 15
B-4
BIT 14
B-3
BIT 15
B-3
BIT 14
B-2
OF
B-6
OF
A-6
OF
B-5
OF
A-5
OF
B-4
OF
A-4
OF
B-3
OF
A-3
OF
B-2
D1_0_1
••
•
••
•
D2_14_15
OF2_1
CLKOUT+
CLKOUT –
tC
tC
218543 TD02
218543f
9
LTC2185/LTC2184/LTC2183
timing DIAGRAMS
Double Data Rate LVDS Output Mode Timing
All Outputs Are Differential and Have LVDS Levels
tAP
CH 1
ANALOG
INPUT
A+4
A+2
A
A+3
tAP
CH 2
ANALOG
INPUT
A+1
B+4
B+2
B
B+3
tH
B+1
tL
ENC–
ENC+
tD
D1_0_1+
D1_0_1–
••
•
D1_14_15+
D1_14_15–
D2_0_1+
D2_0_1–
••
•
D2_14_15+
D2_14_15–
OF2_1+
OF2_1–
tD
BIT 0
A-6
BIT 1
A-6
BIT 0
A-5
BIT 1
A-5
BIT 0
A-4
BIT 1
A-4
BIT 0
A-3
BIT 1
A-3
BIT 0
A-2
BIT 14
A-6
BIT 15
A-6
BIT 14
A-5
BIT 15
A-5
BIT 14
A-4
BIT 15
A-4
BIT 14
A-3
BIT 15
A-3
BIT 14
A-2
BIT 0
B-6
BIT 1
B-6
BIT 0
B-5
BIT 1
B-5
BIT 0
B-4
BIT 1
B-4
BIT 0
B-3
BIT 1
B-3
BIT 0
B-2
BIT 14
B-6
BIT 15
B-6
BIT 14
B-5
BIT 15
B-5
BIT 14
B-4
BIT 15
B-4
BIT 14
B-3
BIT 15
B-3
BIT 14
B-2
OF
B-6
OF
A-6
OF
B-5
OF
A-5
OF
B-4
OF
A-4
OF
B-3
OF
A-3
OF
B-2
tC
tC
CLKOUT+
CLKOUT –
218543 TD03
SPI Port Timing (Readback Mode)
tDS
tS
tDH
tSCK
tH
CS
SCK
tDO
SDI
SDO
R/W
A6
A5
A4
A3
A2
A1
A0
XX
D7
HIGH IMPEDANCE
XX
D6
XX
D5
XX
D4
XX
D3
XX
D2
XX
XX
D1
D0
SPI Port Timing (Write Mode)
CS
SCK
SDI
SDO
R/W
HIGH IMPEDANCE
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
218543 TD04
218543f
10
LTC2185/LTC2184/LTC2183
Typical Performance Characteristics
LTC2185: Integral
Non-Linearity (INL)
LTC2185: Differential
Non-Linearity (DNL)
4.0
3.0
1.0
0
0.8
–10
–20
0.6
1.0
0
–1.0
–2.0
–30
0.4
AMPLITUDE (dBFS)
DNL ERROR (LSB)
2.0
INL ERROR (LSB)
LTC2185: 64k Point FFT, fIN = 5MHz,
–1dBFS, 125Msps
0.2
0
–0.2
–0.4
–0.8
–4.0
–1.0
0
16384
32768
49152
OUTPUT CODE
65536
0
16384
32768
49152
OUTPUT CODE
218543 G01
–70
–80
65536
–110
–120
0
–10
–20
–20
–20
–30
–30
–30
–70
–80
AMPLITUDE (dBFS)
0
–10
AMPLITUDE (dBFS)
0
–60
–40
–50
–60
–70
–80
–60
–70
–80
–90
–100
–110
–120
–110
–120
–110
–120
20
30
40
FREQUENCY (MHz)
50
60
0
10
20
30
40
FREQUENCY (MHz)
218543 G04
LTC2185: 64k Point 2-Tone FFT,
fIN = 69MHz, 70MHz, –7dBFS,
125Msps
60
77
8000
5000
4000
3000
–90
–100
–110
–120
6000
SNR (dBFS)
COUNT
–80
20
30
40
FREQUENCY (MHz)
50
60
218543 G07
0
32750
74
DIFFERENTIAL
ENCODE
73
71
1000
10
75
72
2000
0
60
SINGLE-ENDED
ENCODE
76
7000
–70
50
LTC2185: SNR vs Input Frequency,
–1dBFS, 125Msps, 2V Range
78
–60
20
30
40
FREQUENCY (MHz)
LTC2185: Shorted Input Histogram
9000
–40
10
218543 G06
10000
–30
0
218543 G05
0
–20
AMPLITUDE (dBFS)
50
–10
–50
60
–40
–90
–100
10
50
–50
–90
–100
0
20
30
40
FREQUENCY (MHz)
LTC2185: 64k Point FFT,
fIN = 140MHz, –1dBFS, 125Msps
–10
–50
10
218543 G03
LTC2185: 64k Point FFT,
fIN = 70MHz, –1dBFS, 125Msps
–40
0
218543 G02
LTC2185: 64k Point FFT,
fIN = 30MHz, –1dBFS, 125Msps
AMPLITUDE (dBFS)
–60
–90
–100
–0.6
–3.0
–40
–50
32756
32762 32768
OUTPUT CODE
32774
218543 G08
70
0
50
100
150
200
250
INPUT FREQUENCY (MHz)
300
218543 G09
218543f
11
LTC2185/LTC2184/LTC2183
Typical Performance Characteristics
LTC2185: 2nd, 3rd Harmonic
vs Input Frequency, –1dBFS,
125Msps, 1V Range
100
95
95
90
3RD
85
80
2ND
75
70
65
0
50
100
150
200
250
INPUT FREQUENCY (MHz)
130
120
85
2ND
80
75
60
50
40
30
0
80
50
100
150
200
250
INPUT FREQUENCY (MHz)
20
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
300
3.5mA LVDS OUTPUTS
IOVDD (mA)
200
LTC2185: SNR vs SENSE,
fIN = 5MHz, –1dBFS
78
3.5mA LVDS
70
77
60
76
50
1.75mA LVDS
40
30
160
1.8V CMOS
10
0
25
50
75
100
SAMPLE RATE (Msps)
0
125
74
73
71
1.2V CMOS
0
25
50
75
100
SAMPLE RATE (Msps)
218543 G13
70
125
1.0
0
3.0
0.8
–10
–4.0
0.2
0
–0.2
–0.4
–0.8
0
16384
32768
49152
OUTPUT CODE
65536
218543 G16
–1.0
1.3
–40
–50
–60
–70
–80
–90
–100
–0.6
–3.0
1.2
–30
0.4
AMPLITUDE (dBFS)
DNL ERROR (LSB)
–2.0
0.9
1
1.1
SENSE PIN (V)
–20
0.6
2.0
–1.0
0.8
LTC2184: 64k Point FFT,
fIN = 5MHz, –1dBFS, 105Msps
4.0
0
0.7
218543 G15
LTC2184: Differential
Non-Linearity (DNL)
1.0
0.6
218543 G14
LTC2184: Integral
Non-Linearity (INL)
INL ERROR (LSB)
75
72
20
170
0
218543 G12
SNR (dBFS)
210
CMOS OUTPUTS
dBc
70
LTC2185: IOVDD vs Sample Rate,
5MHz, –1dBFS Sine Wave Input
on Each Channel
220
IVDD (mA)
90
80
218543 G11
LTC2185: IVDD vs Sample Rate,
5MHz, –1dBFS Sine Wave Input
on Each Channel
180
100
70
218543 G10
190
dBFS
110
3RD
90
65
300
LTC2185: SFDR vs Input Level,
fIN = 70MHz, 125Msps, 2V Range
SFDR (dBc AND dBFS)
100
2ND AND 3RD HARMONIC (dBFS)
2ND AND 3RD HARMONIC (dBFS)
LTC2185: 2nd, 3rd Harmonic
vs Input Frequency, –1dBFS,
125Msps, 2V Range
0
16384
32768
49152
OUTPUT CODE
65536
218543 G17
–110
–120
0
10
20
30
40
FREQUENCY (MHz)
50
218543 G18
218543f
12
LTC2185/LTC2184/LTC2183
Typical Performance Characteristics
0
0
–10
–20
–20
–20
–30
–30
–30
–40
–50
–60
–70
–80
AMPLITUDE (dBFS)
–10
–40
–50
–60
–70
–80
–40
–50
–60
–70
–80
–90
–100
–90
–100
–90
–100
–110
–120
–110
–120
–110
–120
0
10
20
30
40
FREQUENCY (MHz)
50
0
10
20
30
40
FREQUENCY (MHz)
218543 G19
LTC2184: 64k Point 2-Tone FFT,
fIN = 69MHz, 70MHz, –7dBFS,
105Msps
77
8000
5000
4000
3000
–90
–100
10
20
30
40
FREQUENCY (MHz)
0
32790
50
32796
32802 32808
OUTPUT CODE
100
95
95
2ND AND 3RD HARMONIC (dBFS)
100
80
2ND
75
70
65
0
50
100
150
200
250
INPUT FREQUENCY (MHz)
300
218543 G25
50
100
150
200
250
INPUT FREQUENCY (MHz)
LTC2184: SFDR vs Input Level,
fIN = 70MHz, 105Msps, 2V Range
130
120
110
3RD
90
85
2ND
80
75
dBFS
100
90
80
70
dBc
60
50
40
70
65
300
218543 G24
LTC2184: 2nd, 3rd Harmonic
vs Input Frequency, –1dBFS,
105Msps, 1V Range
3RD
0
218543 G23
LTC2184: 2nd, 3rd Harmonic
vs Input Frequency, –1dBFS,
105Msps, 2V Range
90
DIFFERENTIAL
ENCODE
73
70
32814
218543 G22
85
74
71
1000
0
75
72
2000
SFDR (dBc AND dBFS)
–110
–120
6000
SNR (dBFS)
COUNT
–80
SINGLE-ENDED
ENCODE
76
7000
–70
50
LTC2184: SNR vs Input Frequency,
–1dBFS, 105Msps, 2V Range
9000
–60
20
30
40
FREQUENCY (MHz)
LTC2184: Shorted Input Histogram
78
–50
10
218543 G21
10000
–40
0
218543 G20
0
–30
AMPLITUDE (dBFS)
50
–10
–20
2ND AND 3RD HARMONIC (dBFS)
LTC2184: 64k Point FFT,
fIN = 140MHz, –1dBFS, 105Msps
LTC2184: 64k Point FFT,
fIN = 70MHz, –1dBFS, 105Msps
–10
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
0
LTC2184: 64k Point FFT,
fIN = 30MHz, –1dBFS, 105Msps
30
0
50
100
150
200
250
INPUT FREQUENCY (MHz)
300
218543 G26
20
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
0
218543 G27
218543f
13
LTC2185/LTC2184/LTC2183
Typical Performance Characteristics
LTC2184: IVDD vs Sample Rate,
5MHz, –1dBFS Sine Wave Input
on Each Channel
LTC2184: IOVDD vs Sample Rate,
5MHz, –1dBFS Sine Wave Input
on Each Channel
180
80
3.5mA LVDS OUTPUTS
CMOS OUTPUTS
150
70
77
60
76
50
1.75mA LVDS
40
30
1.8V CMOS
10
0
25
50
75
SAMPLE RATE (Msps)
0
100
73
0
25
50
75
SAMPLE RATE (Msps)
70
100
1.0
0
3.0
0.8
–10
–4.0
0.2
0
–0.2
–0.4
–0.8
0
16384
32768
49152
OUTPUT CODE
65536
–1.0
0
16384
32768
49152
OUTPUT CODE
–40
–50
–60
–70
–80
65536
–110
–120
0
–10
–20
–20
–20
–30
–30
–30
–70
–80
AMPLITUDE (dBFS)
0
–10
AMPLITUDE (dBFS)
0
–60
–40
–50
–60
–70
–80
–50
–60
–70
–80
–90
–100
–90
–100
–110
–120
–110
–120
–110
–120
10
20
30
FREQUENCY (MHz)
40
218543 G34
0
10
20
30
FREQUENCY (MHz)
40
–40
–90
–100
0
20
30
FREQUENCY (MHz)
LTC2183: 64k Point FFT,
fIN = 140MHz, –1dBFS, 80Msps
–10
–50
10
218543 G33
LTC2183: 64k Point FFT,
fIN = 70MHz, –1dBFS, 80Msps
–40
0
218543 G32
218543 G31
LTC2183: 64k Point FFT,
fIN = 30MHz, –1dBFS, 80Msps
1.3
–90
–100
–0.6
–3.0
1.2
–30
0.4
AMPLITUDE (dBFS)
DNL ERROR (LSB)
–2.0
0.9
1
1.1
SENSE PIN (V)
–20
0.6
2.0
–1.0
0.8
LTC2183: 64k Point FFT,
fIN = 5MHz, –1dBFS, 80Msps
4.0
0
0.7
218543 G30
LTC2183: Differential
Non-Linearity (DNL)
1.0
0.6
218543 G29
LTC2183: Integral
Non-Linearity (INL)
INL ERROR (LSB)
74
71
1.2V CMOS
218543 G28
AMPLITUDE (dBFS)
75
72
20
140
130
78
3.5mA LVDS
SNR (dBFS)
160
IOVDD (mA)
IVDD (mA)
170
LTC2184: SNR vs SENSE,
fIN = 5MHz, –1dBFS
40
218543 G35
0
10
20
30
FREQUENCY (MHz)
40
218543 G36
218543f
14
LTC2185/LTC2184/LTC2183
Typical Performance Characteristics
LTC2183: 64k Point 2-Tone FFT,
fIN = 69MHz, 70MHz, –7dBFS,
80Msps
LTC2183: Shorted Input
Histogram
0
10000
78
–10
9000
–20
77
8000
–30
–60
–70
6000
5000
4000
–80
3000
–90
–100
2000
10
20
30
FREQUENCY (MHz)
0
32817
40
32823
32829
32835
OUTPUT CODE
100
100
95
95
85
80
2ND
75
70
65
0
50
100
150
200
250
INPUT FREQUENCY (MHz)
2ND
80
75
IOVDD (mA)
IVDD (mA)
3.5mA LVDS OUTPUTS
0
50
100
150
200
250
INPUT FREQUENCY (MHz)
90
80
60
50
LTC2183: SNR vs SENSE,
fIN = 5MHz, –1dBFS
78
70
77
60
76
50
1.75mA LVDS
40
30
218543 G43
0
0
218543 G27
3.5mA LVDS
75
74
73
72
1.8V CMOS
10
80
dBc
70
20
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
300
20
90
20
40
60
SAMPLE RATE (Msps)
100
30
SNR (dBFS)
120
dBFS
40
70
80
0
LTC2183: SFDR vs Input Level,
fIN = 70MHz, 80Msps, 2V Range
218543 G41
130
300
218543 G39
LTC2183: IOVDD vs Sample Rate,
5MHz, –1dBFS Sine Wave Input
on Each Channel
CMOS OUTPUTS
100
150
200
250
INPUT FREQUENCY (MHz)
110
3RD
85
LTC2183: IVDD vs Sample Rate,
5MHz, –1dBFS Sine Wave Input
on Each Channel
100
50
120
90
65
300
110
0
130
218543 G40
80
70
32841
LTC2183: 2nd, 3rd Harmonic vs
Input Frequency, –1dBFS, 80Msps,
1V Range
2ND AND 3RD HARMONIC (dBFS)
2ND AND 3RD HARMONIC (dBFS)
LTC2183: 2nd, 3rd Harmonic vs
Input Frequency, –1dBFS, 80Msps,
2V Range
3RD
73
218543 G38
218543 G37
90
DIFFERENTIAL
ENCODE
74
71
1000
0
75
72
SFDR (dBc AND dBFS)
–110
–120
SNR (dBFS)
–50
SINGLE-ENDED
ENCODE
76
7000
–40
COUNT
AMPLITUDE (dBFS)
LTC2183: SNR vs Input Frequency,
–1dBFS, 80Msps, 2V Range
71
1.2V CMOS
0
20
40
60
SAMPLE RATE (Msps)
80
218543 G44
70
0.6
0.7
0.8
0.9
1
1.1
SENSE PIN (V)
1.2
1.3
218543 G45
218543f
15
LTC2185/LTC2184/LTC2183
Pin Functions
Pins that are the same for all Digital
Output Modes
VDD (Pins 1, 16, 17, 64): Analog Power Supply, 1.7V to
1.9V. Bypass to ground with 0.1µF ceramic capacitors.
Adjacent pins can share a bypass capacitor.
VCM1 (Pin 2): Common Mode Bias Output, nominally equal
to VDD/2. VCM1 should be used to bias the common mode
of the analog inputs to channel 1. Bypass to ground with
a 0.1µF ceramic capacitor.
GND (Pins 3, 6, 14): ADC Power Ground.
AIN1+ (Pin 4): Channel 1 Positive Differential Analog
Input.
AIN1– (Pin 5): Channel 1 Negative Differential Analog
Input.
REFH (Pins 7, 9): ADC High Reference. See the Applications Information section for recommended bypassing
circuits for REFH and REFL.
REFL (Pins 8, 10): ADC Low Reference. See the Applications Information section for recommended bypassing
circuits for REFH and REFL.
PAR/SER (Pin 11): Programming Mode selection pin. Connect to ground to enable the Serial Programming Mode. CS,
SCK, SDI, SDO become a serial interface that control the
A/D operating modes. Connect to VDD to enable the Parallel
Programming Mode where CS, SCK, SDI, SDO become
parallel logic inputs that control a reduced set of the A/D
operating modes. PAR/SER should be connected directly
to ground or VDD and not be driven by a logic signal.
AIN2+ (Pin 12): Channel 2 Positive Differential Analog
Input.
AIN2– (Pin 13): Channel 2 Negative Differential Analog
Input.
VCM2 (Pin 15): Common Mode Bias Output, nominally
equal to VDD/2. VCM2 should be used to bias the common
mode of the analog inputs to channel 2. Bypass to ground
with a 0.1µF ceramic capacitor.
ENC+ (Pin 18): Encode Input. Conversion starts on the
rising edge.
ENC– (Pin 19): Encode Complement Input. Conversion
starts on the falling edge. Tie to GND for single-ended
encode mode.
CS (Pin 20): In Serial Programming Mode, (PAR/SER =
0V), CS is the Serial Interface Chip Select Input. When
CS is low, SCK is enabled for shifting data on SDI into
the mode control registers. In the Parallel Programming
Mode (PAR/SER = VDD), CS controls the Clock Duty Cycle
Stabilizer (See Table 2). CS can be driven with 1.8V to
3.3V logic.
SCK (Pin 21): In Serial Programming Mode, (PAR/SER =
0V), SCK is the Serial Interface Clock Input. In the Parallel
Programming Mode (PAR/SER = VDD), SCK controls the
Digital Output Mode (See Table 2). SCK can be driven with
1.8V to 3.3V logic.
SDI (Pin 22): In Serial Programming Mode, (PAR/SER =
0V), SDI is the Serial Interface Data Input. Data on SDI is
clocked into the mode control registers on the rising edge
of SCK. In the Parallel Programming Mode (PAR/SER =
VDD), SDI can be used together with SDO to power down
the part (see Table 2). SDI can be driven with 1.8V to
3.3V logic.
OGND (Pin 41): Output Driver Ground. Must be shorted
to the ground plane by a very low inductance path. Use
multiple vias close to the pin.
OVDD (Pin 42): Output Driver Supply. Bypass to ground
with a 0.1µF ceramic capacitor.
SDO (Pin 61): In Serial Programming Mode, (PAR/SER
= 0V), SDO is the optional Serial Interface Data Output.
Data on SDO is read back from the mode control registers and can be latched on the falling edge of SCK. SDO
is an open-drain NMOS output that requires an external
2k pull-up resistor to 1.8V – 3.3V. If read back from the
mode control registers is not needed, the pull-up resistor
is not necessary and SDO can be left unconnected. In the
Parallel Programming Mode (PAR/SER = VDD), SDO can
be used together with SDI to power down the part (see
Table 2). When used as an input, SDO can be driven with
1.8V to 3.3V logic through a 1k series resistor.
VREF (Pin 62): Reference Voltage Output. Bypass to
ground with a 2.2µF ceramic capacitor. The output voltage
is nominally 1.25V.
218543f
16
LTC2185/LTC2184/LTC2183
Pin Functions
SENSE (Pin 63): Reference Programming Pin. Connecting
SENSE to VDD selects the internal reference and a ±1V input
range. Connecting SENSE to ground selects the internal
reference and a ±0.5V input range. An external reference
between 0.625V and 1.3V applied to SENSE selects an
input range of ±0.8 • VSENSE.
Ground (Exposed Pad Pin 65): The exposed pad must be
soldered to the PCB ground.
FULL-RATE CMOS OUTPUT MODE
All Pins Below Have CMOS Output Levels
(OGND to OVDD)
D2_0 to D2_15 (Pins 23, 24, 25, 26, 27, 28, 29, 30, 31,
32, 33, 34, 35, 36, 37, 38): Channel 2 Digital Outputs.
D2_15 is the MSB.
CLKOUT– (Pin 39): Inverted version of CLKOUT+.
CLKOUT+ (Pin 40): Data Output Clock. The Digital Outputs
normally transition at the same time as the falling edge
of CLKOUT+. The phase of CLKOUT+ can also be delayed
relative to the Digital Outputs by programming the mode
control registers.
D1_0 to D1_15 (Pins 43, 44, 45, 46, 47, 48, 49, 50, 51,
52, 53, 54, 55, 56, 57, 58): Channel 1 Digital Outputs.
D1_15 is the MSB.
OF2 (Pin 59): Channel 2 Over/Under Flow Digital Output. OF2
is high when an overflow or underflow has occurred.
OF1 (Pin 60): Channel 1 Over/Under Flow Digital Output. OF1
is high when an overflow or underflow has occurred.
DOUBLE DATA RATE CMOS OUTPUT MODE
All Pins Below Have CMOS Output Levels
(OGND to OVDD)
D2_0_1 to D2_14_15 (Pins 24, 26, 28, 30, 32, 34, 36,
38): Channel 2 Double Data Rate Digital Outputs. Two data
bits are multiplexed onto each output pin. The even data
bits (D0, D2, D4, D6, D8, D10, D12, D14) appear when
CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9,
D11, D13, D15) appear when CLKOUT+ is high.
DNC (Pins 23, 25, 27, 29, 31, 33, 35, 37, 43, 45, 47,
49, 51, 53, 55, 57, 59): Do not connect these pins.
CLKOUT– (Pin 39): Inverted version of CLKOUT+.
CLKOUT+ (Pin 40): Data Output Clock. The Digital Outputs
normally transition at the same time as the falling and rising edges of CLKOUT+. The phase of CLKOUT+ can also
be delayed relative to the Digital Outputs by programming
the mode control registers.
D1_0_1 to D1_14_15 (Pins 44, 46, 48, 50, 52, 54, 56,
58): Channel 1 Double Data Rate Digital Outputs. Two data
bits are multiplexed onto each output pin. The even data
bits (D0, D2, D4, D6, D8, D10, D12, D14) appear when
CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9,
D11, D13, D15) appear when CLKOUT+ is high.
OF2_1 (Pin 60): Over/Under Flow Digital Output. OF2_1
is high when an overflow or underflow has occurred. The
over/under flow for both channels are multiplexed onto
this pin. Channel 2 appears when CLKOUT+ is low, and
Channel 1 appears when CLKOUT+ is high.
DOUBLE DATA RATE LVDS OUTPUT MODE
All Pins Below Have LVDS Output Levels. The Output
Current Level Is Programmable. There Is an Optional
Internal 100Ω Termination Resistor Between the Pins
of Each LVDS Output Pair.
D2_0_1–/D2_0_1+ to D2_14_15–/D2_14_15+ (Pins 23/24,
25/26, 27/28, 29/30, 31/32, 33/34, 35/36, 37/38): Channel 2 Double Data Rate Digital Outputs. Two data bits are
multiplexed onto each differential output pair. The even data
bits (D0, D2, D4, D6, D8, D10, D12, D14) appear when
CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9,
D11, D13, D15) appear when CLKOUT+ is high.
CLKOUT–/CLKOUT+ (Pins 39/40): Data Output Clock.
The Digital Outputs normally transition at the same time
as the falling and rising edges of CLKOUT+. The phase of
CLKOUT+ can also be delayed relative to the Digital Outputs
by programming the mode control registers.
218543f
17
LTC2185/LTC2184/LTC2183
Pin Functions
D1_0_1–/D1_0_1+ to D1_14_15–/D1_14_15+ (Pins 43/44,
45/46, 47/48, 49/50, 51/52, 53/54, 55/56, 57/58): Channel 2 Double Data Rate Digital Outputs. Two data bits are
multiplexed onto each differential output pair. The even data
bits (D0, D2, D4, D6, D8, D10, D12, D14) appear when
CLKOUT+ is low. The odd data bits (D1, D3, D5, D7, D9,
D11, D13, D15) appear when CLKOUT+ is high.
OF2_1–/OF2_1+ (Pins 59/60): Over/Under Flow Digital
Output. OF2_1+ is high when an overflow or underflow
has occurred. The over/under flow for both channels
are multiplexed onto this pin. Channel 2 appears when
CLKOUT+ is low, and Channel 1 appears when CLKOUT+
is high.
Functional Block Diagram
OVDD
CH 1
ANALOG
INPUT
OF1
16-BIT
ADC CORE
S/H
OF2
CORRECTION
LOGIC
CH 2
ANALOG
INPUT
16-BIT
ADC CORE
S/H
D1_15
•
•
•
D1_0
OUTPUT
DRIVERS
CLKOUT +
CLKOUT –
VREF
2.2µF
D2_15
•
•
•
D2_0
1.25V
REFERENCE
RANGE
SELECT
SENSE
VCM1
0.1µF
OGND
REFH
REF
BUF
VDD/2
REFL
INTERNAL CLOCK SIGNALS
VDD
DIFF
REF
AMP
CLOCK/DUTY
CYCLE
CONTROL
MODE
CONTROL
REGISTERS
VCM2
0.1µF
GND
REFH
REFL
ENC+
2.2µF
0.1µF
ENC–
PAR/SER CS SCK SDI SDO
218543 F01
0.1µF
Figure 1. Functional Block Diagram
218543f
18
LTC2185/LTC2184/LTC2183
Applications Information
Converter Operation
The LTC2185/LTC2184/LTC2183 are low power, two-channel, 16-bit, 125Msps/105Msps/80Msps A/D converters
that are powered by a single 1.8V supply. The analog
inputs should be driven differentially. The encode input
can be driven differentially, or single ended for lower
power consumption. The digital outputs can be CMOS,
double data rate CMOS (to halve the number of output
lines), or double data rate LVDS (to reduce digital noise
in the system.) Many additional features can be chosen
by programming the mode control registers through a
serial SPI port.
The two channels are simultaneously sampled by a shared
encode circuit (Figure 2).
Single-Ended Input
For applications less sensitive to harmonic distortion, the
AIN+ input can be driven single-ended with a 1VP-P signal
centered around VCM. The AIN– input should be connected
to VCM. With a single-ended input the harmonic distortion
and INL will degrade, but the noise and DNL will remain
unchanged.
Input Drive Circuits
Analog Input
Input filtering
The analog inputs are differential CMOS sample-and-hold
circuits (Figure 2). The inputs should be driven differentially around a common mode voltage set by the VCM1 or
VCM2 output pins, which are nominally VDD/2. For the 2V
input range, the inputs should swing from VCM – 0.5V
to VCM + 0.5V. There should be 180° phase difference
between the inputs.
If possible, there should be an RC lowpass filter right at
the analog inputs. This lowpass filter isolates the drive
circuitry from the A/D sample-and-hold switching, and
also limits wideband noise from the drive circuitry. Figure 3
shows an example of an input RC filter. The RC component
values should be chosen based on the application’s input
frequency.
Transformer Coupled Circuits
LTC2185
VDD
AIN+
RON
15Ω
10Ω
CPARASITIC
1.8pF
VDD
AIN–
CSAMPLE
5pF
RON
15Ω
10Ω
CSAMPLE
5pF
CPARASITIC
1.8pF
Figure 3 shows the analog input being driven by an RF
transformer with a center-tapped secondary. The center
tap is biased with VCM, setting the A/D input at its optimal
DC level. At higher input frequencies a transmission line
balun transformer (Figure 4 to Figure 6) has better balance,
resulting in lower A/D distortion.
50Ω
VDD
VCM
0.1µF
0.1µF
ANALOG
INPUT
1.2V
10k
T1
1:1
25Ω
25Ω
AIN+
LTC2185
0.1µF
12pF
ENC+
25Ω
ENC–
25Ω
T1: MA/COM MABAES0060
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
10k
1.2V
218543 F02
Figure 2. Equivalent Input Circuit. Only One of the Two
Analog Channels Is Shown
AIN–
218543 F03
Figure 3. Analog Input Circuit Using a Transformer.
Recommended for Input Frequencies from 5MHz to 70MHz
218543f
19
LTC2185/LTC2184/LTC2183
Applications Information
Amplifier Circuits
Reference
Figure 7 shows the analog input being driven by a high
speed differential amplifier. The output of the amplifier is ACcoupled to the A/D so the amplifier’s output common mode
voltage can be optimally set to minimize distortion.
The LTC2185/LTC2184/LTC2183 has an internal 1.25V
voltage reference. For a 2V input range using the internal
reference, connect SENSE to VDD. For a 1V input range
using the internal reference, connect SENSE to ground.
For a 2V input range with an external reference, apply a
1.25V reference voltage to SENSE (Figure 9).
At very high frequencies an RF gain block will often have
lower distortion than a differential amplifier. If the gain
block is single-ended, then a transformer circuit (Figure 4
to Figure 6) should convert the signal to differential before
driving the A/D.
50Ω
VCM
0.1µF
0.1µF
ANALOG
INPUT
12Ω
T2
T1
25Ω
AIN+
LTC2185
0.1µF
8.2pF
0.1µF
25Ω
12Ω
The input range can be adjusted by applying a voltage to
SENSE that is between 0.625V and 1.30V. The input range
will then be 1.6 • VSENSE.
The VREF, REFH and REFL pins should be bypassed as
shown in Figure 8. A low inductance 2.2µF interdigitated
capacitor is recommended for the bypass between REFH
and REFL. This type of capacitor is available at a low cost
from multiple suppliers.
AIN–
50Ω
0.1µF
218543 F04
T1: MA/COM MABA-007159-000000
T2: COILCRAFT WBC1-1TL
RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE
0.1µF
ANALOG
INPUT
T1
25Ω
25Ω
25Ω
VCM
4.7nH
AIN–
218543 F06
Figure 6. Recommended Front-End Circuit for Input
Frequencies Above 250MHz
LTC2185
0.1µF
25Ω
LTC2185
0.1µF
VCM
1.8pF
0.1µF
AIN+
T1: MA/COM ETC1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
AIN+
T2
T1
0.1µF
0.1µF
0.1µF
4.7nH
ANALOG
INPUT
Figure 4. Recommended Front-End Circuit for Input
Frequencies from 5MHz to 150MHz
50Ω
VCM
HIGH SPEED
DIFFERENTIAL
0.1µF
AMPLIFIER
AIN–
218543 F05
T1: MA/COM MABA-007159-000000
T2: COILCRAFT WBC1-1TL
RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE
Figure 5. Recommended Front-End Circuit for Input
Frequencies from 150MHz to 250MHz
ANALOG
INPUT
+
+
–
–
200Ω
200Ω
25Ω
0.1µF
AIN+
12pF
0.1µF
25Ω
LTC2185
AIN–
12pF
218543 F07
Figure 7. Front-End Circuit Using a High Speed
Differential Amplifier
218543f
20
LTC2185/LTC2184/LTC2183
Applications Information
in some vendors’ capacitors. In Figure 8d the REFH and
REFL pins are connected by short jumpers in an internal
layer. To minimize the inductance of these jumpers they
can be placed in a small hole in the GND plane on the
second board layer.
LTC2185
VREF
1.25V
5Ω
2.2µF
1.25V BANDGAP
REFERENCE
0.625V
TIE TO VDD FOR 2V RANGE;
TIE TO GND FOR 1V RANGE;
RANGE = 1.6 • VSENSE FOR
0.625V < VSENSE < 1.300V
RANGE
DETECT
AND
CONTROL
SENSE
BUFFER
INTERNAL ADC
HIGH REFERENCE
C2
0.1µF
+
REFH
–
REFL
–
+
REFH
+
–
REFL
–
+
Figure 8c. Recommended Layout for the REFH/REFL
Bypass Circuit in Figure 8a
0.8x
DIFF AMP
C1
C3
0.1µF
INTERNAL ADC
LOW REFERENCE
C1: 2.2µF LOW INDUCTANCE
INTERDIGITATED CAPACITOR
TDK CLLE1AX7S0G225M
MURATA LLA219C70G225M
AVX W2L14Z225M
OR EQUIVALENT
218543 F08a
Figure 8d. Recommended Layout for the REFH/REFL Bypass
Circuit in Figure 8b.
Figure 8a. Reference Circuit
At sample rates below 110Msps an interdigitated capacitor is not necessary for good performance and C1 can
be replaced by a standard 2.2µF capacitor between REFH
and REFL (see Figure 8b). The capacitors should be as
close to the pins as possible (not on the back side of the
circuit board).
Figure 8c and Figure 8d show the recommended circuit
board layout for the REFH/REFL bypass capacitors. Note
that in Figure 8c, every pin of the interdigitated capacitor
(C1) is connected since the pins are not internally connected
REFH
C3
0.1µF
REFL
C1
2.2µF
C2
0.1µF
LTC2185
REFH
REFL
CAPACITORS ARE 0402 PACKAGE SIZE
218543 F08b
VREF
2.2µF
1.25V
EXTERNAL
REFERENCE
LTC2185
SENSE
1µF
218543 F09
Figure 9. Using an External 1.25V Reference
Encode Input
The signal quality of the encode inputs strongly affects
the A/D noise performance. The encode inputs should
be treated as analog signals – do not route them next to
digital traces on the circuit board. There are two modes
of operation for the encode inputs: the differential encode
mode (Figure 10), and the single-ended encode mode
(Figure 11).
The differential encode mode is recommended for sinusoidal, PECL, or LVDS encode inputs (Figure 12 and
Figure 13). The encode inputs are internally biased to 1.2V
Figure 8b. Alternative REFH/REFL Bypass Circuit
218543f
21
LTC2185/LTC2184/LTC2183
Applications Information
LTC2185
through 10kΩ equivalent resistance. The encode inputs
can be taken above VDD (up to 3.6V), and the common
mode range is from 1.1V to 1.6V. In the differential encode
mode, ENC– should stay at least 200mV above ground to
avoid falsely triggering the single ended encode mode.
For good jitter performance ENC+ and ENC– should have
fast rise and fall times.
VDD
DIFFERENTIAL
COMPARATOR
VDD
15k
ENC+
ENC–
The single-ended encode mode should be used with CMOS
encode inputs. To select this mode, ENC– is connected
to ground and ENC+ is driven with a square wave encode
input. ENC+ can be taken above VDD (up to 3.6V) so 1.8V
to 3.3V CMOS logic levels can be used. The ENC+ threshold
is 0.9V. For good jitter performance ENC+ should have fast
rise and fall times.
30k
218543 F10
Figure 10. Equivalent Encode Input Circuit
for Differential Encode Mode
LTC2185
If the encode signal is turned off or drops below approximately 500kHz, the A/D enters nap mode.
ENC+
1.8V TO 3.3V
0V
ENC–
30k
CMOS LOGIC
BUFFER
Clock Duty Cycle Stabilizer
218543 F11
Figure 11. Equivalent Encode Input Circuit
for Single-Ended Encode Mode
0.1µF
ENC+
T1
50Ω
LTC2185
100Ω
50Ω
0.1µF
0.1µF
ENC–
218543 F12
T1 = MA/COM ETC1-1-13
RESISTORS AND CAPACITORS
ARE 0402 PACKAGE SIZE
Figure 12. Sinusoidal Encode Drive
0.1µF
PECL OR
LVDS
CLOCK
For applications where the sample rate needs to be changed
quickly, the clock duty cycle stabilizer can be disabled. If
the duty cycle stabilizer is disabled, care should be taken to
make the sampling clock have a 50% (±5%) duty cycle. The
duty cycle stabilizer should not be used below 5Msps.
Digital Outputs
ENC+
LTC2185
0.1µF
For good performance the encode signal should have a
50% (±5%) duty cycle. If the optional clock duty cycle
stabilizer circuit is enabled, the encode duty cycle can
vary from 30% to 70% and the duty cycle stabilizer will
maintain a constant 50% internal duty cycle. If the encode
signal changes frequency, the duty cycle stabilizer circuit
requires one hundred clock cycles to lock onto the input
clock. The duty cycle stabilizer is enabled by mode control
register A2 (Serial Programming Mode), or by CS (Parallel
Programming Mode).
ENC–
218543 F13
Figure 13. PECL or LVDS Encode Drive
Digital Output Modes
The LTC2185/LTC2184/LTC2183 can operate in three digital
output modes: full rate CMOS, double data rate CMOS (to
halve the number of output lines), or double data rate LVDS
(to reduce digital noise in the system.) The output mode
is set by mode control register A3 (Serial Programming
218543f
22
LTC2185/LTC2184/LTC2183
Applications Information
Mode), or by SCK (Parallel Programming Mode). Note that
double data rate CMOS cannot be selected in the Parallel
Programming Mode.
Full Rate CMOS Mode
In Full Rate CMOS Mode the data outputs (D1_0 to D1_15
and D2_0 to D2_15), overflow (OF2, OF1), and the data
output clocks (CLKOUT+, CLKOUT–) have CMOS output
levels. The outputs are powered by OVDD and OGND which
are isolated from the A/D core power and ground. OVDD
can range from 1.1V to 1.9V, allowing 1.2V through 1.8V
CMOS logic outputs.
For good performance the digital outputs should drive
minimal capacitive loads. If the load capacitance is larger
than 10pF a digital buffer should be used.
Double Data Rate CMOS Mode
In Double Data Rate CMOS Mode, two data bits are multiplexed and output on each data pin. This reduces the number of digital lines by seventeen, simplifying board routing
and reducing the number of input pins needed to receive
the data. The data outputs (D1_0_1, D1_2_3, D1_4_5,
D1_6_7, D1_8_9, D1_10_11, D1_12_13, D1_14_15,
D2_0_1, D2_2_3, D2_4_5, D2_6_7, D2_8_9, D2_10_11,
D2_12_13, D2_14_15), overflow (OF2_1), and the data
output clocks (CLKOUT+, CLKOUT–) have CMOS output
levels. The outputs are powered by OVDD and OGND which
are isolated from the A/D core power and ground. OVDD
can range from 1.1V to 1.9V, allowing 1.2V through 1.8V
CMOS logic outputs. Note that the overflow for both ADC
channels is multiplexed onto the OF2_1 pin.
For good performance the digital outputs should drive
minimal capacitive loads. If the load capacitance is larger
than 10pF a digital buffer should be used.
When using Double Data Rate CMOS at sample rates above
100Msps the SNR may degrade slightly, about 0.2dB to
0.5dB depending on load capacitance and board layout.
Double Data Rate LVDS Mode
In Double Data Rate LVDS Mode, two data bits are multiplexed and output on each differential output pair. There
are eight LVDS output pairs per ADC channel (D1_0_1+/
D1_0_1– through D1_14_15+/D1_14_15– and D2_0_1+/
D2_0_1– through D2_14_15+/D2_14_15–) for the digital
output data. Overflow (OF2_1+/OF2_1–) and the data
output clock (CLKOUT+/CLKOUT–) each have an LVDS
output pair. Note that the overflow for both ADC channels
is multiplexed onto the OF2_1+/OF2_1– output pair.
By default the outputs are standard LVDS levels: 3.5mA
output current and a 1.25V output common mode voltage. An external 100Ω differential termination resistor
is required for each LVDS output pair. The termination
resistors should be located as close as possible to the
LVDS receiver.
The outputs are powered by OVDD and OGND which are
isolated from the A/D core power and ground. In LVDS
mode, OVDD must be 1.8V.
Programmable LVDS Output Current
In LVDS Mode, the default output driver current is 3.5mA.
This current can be adjusted by serially programming mode
control register A3. Available current levels are 1.75mA,
2.1mA, 2.5mA, 3mA, 3.5mA, 4mA and 4.5mA.
Optional LVDS Driver Internal Termination
In most cases using just an external 100Ω termination
resistor will give excellent LVDS signal integrity. In addition, an optional internal 100Ω termination resistor can
be enabled by serially programming mode control register
A3. The internal termination helps absorb any reflections
caused by imperfect termination at the receiver. When the
internal termination is enabled, the output driver current
is doubled to maintain the same output voltage swing.
Overflow Bit
The overflow output bit outputs a logic high when the
analog input is either over-ranged or under-ranged. The
overflow bit has the same pipeline latency as the data bits.
In Full-Rate CMOS mode each ADC channel has its own
overflow pin (OF1 for channel 1, OF2 for channel 2). In
DDR CMOS or DDR LVDS mode the overflow for both ADC
channels is multiplexed onto the OF2_1 output.
218543f
23
LTC2185/LTC2184/LTC2183
Applications Information
Phase Shifting the Output Clock
Data Format
In Full Rate CMOS mode the data output bits normally
change at the same time as the falling edge of CLKOUT+,
so the rising edge of CLKOUT+ can be used to latch the
output data. In Double Data Rate CMOS and LVDS Modes
the data output bits normally change at the same time as
the falling and rising edges of CLKOUT+. To allow adequate
set-up and hold time when latching the data, the CLKOUT+
signal may need to be phase shifted relative to the data
output bits. Most FPGAs have this feature; this is generally
the best place to adjust the timing.
Table 1 shows the relationship between the analog input
voltage, the digital data output bits and the overflow bit.
By default the output data format is offset binary. The 2’s
complement format can be selected by serially programming mode control register A4.
The LTC2185/LTC2184/LTC2183 can also phase shift the
CLKOUT+/CLKOUT– signals by serially programming mode
control register A2. The output clock can be shifted by 0°,
45°, 90°, or 135°. To use the phase shifting feature the
Clock Duty Cycle Stabilizer must be turned on. Another
control register bit can invert the polarity of CLKOUT+ and
CLKOUT–, independently of the phase shift. The combination of these two features enables phase shifts of 45° up
to 315° (Figure 14).
Table 1. Output Codes vs Input Voltage
AIN+ – AIN–
(2V Range)
OF
D15-D0
(OFFSET BINARY)
D15-D0
(2’s COMPLEMENT)
>1.000000V
1
1111 1111 1111 1111
0111 1111 1111 1111
+0.999970V
0
1111 1111 1111 1111
0111 1111 1111 1111
+0.999939V
0
1111 1111 1111 1110
0111 1111 1111 1110
+0.000030V
0
1000 0000 0000 0001
0000 0000 0000 0001
+0.000000V
0
1000 0000 0000 0000
0000 0000 0000 0000
–0.000030V
0
0111 1111 1111 1111
1111 1111 1111 1111
–0.000061V
0
0111 1111 1111 1110
1111 1111 1111 1110
–0.999939V
0
0000 0000 0000 0001
1000 0000 0000 0001
–1.000000V
0
0000 0000 0000 0000
1000 0000 0000 0000
<–1.000000V
1
0000 0000 0000 0000
1000 0000 0000 0000
ENC+
D0-D15, OF
CLKOUT+
MODE CONTROL BITS
PHASE
SHIFT
CLKINV
CLKPHASE1
CLKPHASE0
0°
0
0
0
45°
0
0
1
90°
0
1
0
135°
0
1
1
180°
1
0
0
225°
1
0
1
270°
1
1
0
315°
1
1
1
218543 F14
Figure 14. Phase Shifting CLKOUT
218543f
24
LTC2185/LTC2184/LTC2183
Applications Information
Digital Output Randomizer
CLKOUT
Interference from the A/D digital outputs is sometimes
unavoidable. Digital interference may be from capacitive or
inductive coupling or coupling through the ground plane.
Even a tiny coupling factor can cause unwanted tones
in the ADC output spectrum. By randomizing the digital
output before it is transmitted off chip, these unwanted
tones can be randomized which reduces the unwanted
tone amplitude.
The digital output is randomized by applying an exclusiveOR logic operation between the LSB and all other data
output bits. To decode, the reverse operation is applied
– an exclusive-OR operation is applied between the LSB
and all other bits. The LSB, OF and CLKOUT outputs are
not affected. The output randomizer is enabled by serially
programming mode control register A4.
Alternate Bit Polarity
Another feature that reduces digital feedback on the circuit
board is the alternate bit polarity mode. When this mode is
enabled, all of the odd bits (D1, D3, D5, D7, D9, D11, D13,
D15) are inverted before the output buffers. The even bits
(D0, D2, D4, D6, D8, D10, D12, D14), OF and CLKOUT are
not affected. This can reduce digital currents in the circuit
board ground plane and reduce digital noise, particularly
for very small analog input signals.
When there is a very small signal at the input of the A/D
that is centered around mid-scale, the digital outputs toggle
between mostly 1’s and mostly 0’s. This simultaneous
switching of most of the bits will cause large currents in
the ground plane. By inverting every other bit, the Alternate
Bit Polarity Mode makes half of the bits transition high
while half of the bits transition low. This cancels current
flow in the ground plane, reducing the digital noise.
The digital output is decoded at the receiver by inverting
the odd bits (D1, D3, D5, D7, D9, D11, D13, D15.) The
Alternate Bit Polarity Mode is independent of the Digital
Output Randomizer – either, both or neither function can be
on at the same time. The Alternate Bit Polarity Mode is enabled by serially programming mode control register A4.
CLKOUT
OF
OF
D15
D15/D0
D14
D2
D14/D0
•
•
•
D2/D0
RANDOMIZER
ON
D1
D1/D0
D0
D0
218543 F15
Figure 15. Functional Equivalent of Digital Output Randomizer
PC BOARD
CLKOUT FPGA
OF
D15/D0
D15
D14/D0
LTC2185
D2/D0
•
•
•
D14
D2
D1/D0
D1
D0
D0
218543 F16
Figure 16. Unrandomizing a Randomized Digital
Output Signal
218543f
25
LTC2185/LTC2184/LTC2183
Applications Information
Digital Output Test Patterns
To allow in-circuit testing of the digital interface to the
A/D, there are several test modes that force the A/D data
outputs (OF, D15-D0) to known values:
All 1s: All outputs are 1
All 0s: All outputs are 0
Alternating: Outputs change from all 1s to all 0s on
alternating samples.
Checkerboard: Outputs change from
10101010101010101 to 01010101010101010 on
alternating samples.
The digital output test patterns are enabled by serially
programming mode control register A4. When enabled,
the Test Patterns override all other formatting modes: 2’s
complement, randomizer, alternate bit polarity.
Output Disable
The digital outputs may be disabled by serially programming mode control register A3. All digital outputs including
OF and CLKOUT are disabled. The high-impedance disabled
state is intended for in-circuit testing or long periods of
inactivity – it is too slow to multiplex a data bus between
multiple converters at full speed. When the outputs are
disabled both channels should be put into either sleep or
nap mode.
Sleep and Nap Modes
The A/D may be placed in sleep or nap modes to conserve
power. In sleep mode the entire device is powered down,
resulting in 1mW power consumption. The amount of
time required to recover from sleep mode depends on the
size of the bypass capacitors on VREF, REFH, and REFL.
For the suggested values in Fig. 8, the A/D will stabilize
after 2ms.
In nap mode the A/D core is powered down while the internal
reference circuits stay active, allowing faster wakeup than
from sleep mode. Recovering from nap mode requires at
least 100 clock cycles. If the application demands very
accurate DC settling then an additional 50µs should be
allowed so the on-chip references can settle from the
slight temperature shift caused by the change in supply
current as the A/D leaves nap mode. Either channel 2 or
both channels can be placed in nap mode; it is not possible
to have channel 1 in nap mode and channel 2 operating
normally.
Sleep mode and nap mode are enabled by mode control
register A1 (serial programming mode), or by SDI and
SDO (parallel programming mode).
Device Programming Modes
The operating modes of the LTC2185/LTC2184/LTC2183
can be programmed by either a parallel interface or a
simple serial interface. The serial interface has more flexibility and can program all available modes. The parallel
interface is more limited and can only program some of
the more commonly used modes.
Parallel Programming Mode
To use the parallel programming mode, PAR/SER should
be tied to VDD. The CS, SCK, SDI and SDO pins are binary
logic inputs that set certain operating modes. These pins
can be tied to VDD or ground, or driven by 1.8V, 2.5V, or
3.3V CMOS logic. When used as an input, SDO should
be driven through a 1k series resistor. Table 2 shows the
modes set by CS, SCK, SDI and SDO.
Table 2. Parallel Programming Mode Control Bits (PAR/SER = VDD)
PIN
DESCRIPTION
CS
Clock Duty Cycle Stabilizer Control Bit
0 = Clock Duty Cycle Stabilizer Off
1 = Clock Duty Cycle Stabilizer On
SCK
Digital Output Mode Control Bit
0 = Full-Rate CMOS Output Mode
1 = Double Data Rate LVDS Output Mode
(3.5mA LVDS Current, Internal Termination Off)
SDI/SDO Power Down Control Bit
00 = Normal Operation
01 = Channel 1 in Normal Operation, Channel 2 in Nap Mode
10 = Channel 1 and Channel 2 in Nap Mode
11 = Sleep Mode (Entire Device Powered Down)
218543f
26
LTC2185/LTC2184/LTC2183
Applications Information
Serial Programming Mode
Grounding And Bypassing
To use the serial programming mode, PAR/SER should be
tied to ground. The CS, SCK, SDI and SDO pins become
a serial interface that program the A/D mode control
registers. Data is written to a register with a 16-bit serial
word. Data can also be read back from a register to verify
its contents.
The LTC2185/LTC2184/LTC2183 requires a printed circuit
board with a clean unbroken ground plane. A multilayer
board with an internal ground plane in the first layer beneath the ADC is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
Serial data transfer starts when CS is taken low. The data
on the SDI pin is latched at the first 16 rising edges of
SCK. Any SCK rising edges after the first 16 are ignored.
The data transfer ends when CS is taken high again.
The first bit of the 16-bit input word is the R/W bit. The
next seven bits are the address of the register (A6:A0).
The final eight bits are the register data (D7:D0).
If the R/W bit is low, the serial data (D7:D0) will be written to the register set by the address bits (A6:A0). If the
R/W bit is high, data in the register set by the address bits
(A6:A0) will be read back on the SDO pin (see the timing
diagrams). During a read back command the register is
not updated and data on SDI is ignored.
The SDO pin is an open drain output that pulls to ground
with a 200Ω impedance. If register data is read back
through SDO, an external 2k pull-up resistor is required.
If serial data is only written and read back is not needed,
then SDO can be left floating and no pull-up resistor is
needed.
Table 3 shows a map of the mode control registers.
Software Reset
If serial programming is used, the mode control registers
should be programmed as soon as possible after the power
supplies turn on and are stable. The first serial command
must be a software reset which will reset all register data
bits to logic 0. To perform a software reset, bit D7 in the
reset register is written with a logic 1. After the reset is
complete, bit D7 is automatically set back to zero.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitors must be located as close to the pins as possible.
Size 0402 ceramic capacitors are recommended. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
Of particular importance is the capacitor between REFH
and REFL. This capacitor should be on the same side of
the circuit board as the A/D, and as close to the device
as possible. A low inductance interdigitated capacitor is
suggested for REFH/REFL if the sampling frequency is
greater than 110Msps.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground fill and
grounded vias should be used as barriers to isolate these
signals from each other.
Heat Transfer
Most of the heat generated by the LTC2185/LTC2184/
LTC2183 is transferred from the die through the bottomside exposed pad and package leads onto the printed circuit
board. For good electrical and thermal performance, the
exposed pad must be soldered to a large grounded pad
on the PC board. This pad should be connected to the
internal ground planes by an array of vias.
218543f
27
LTC2185/LTC2184/LTC2183
Applications Information
Table 3. Serial Programming Mode Register Map (PAR/SER = GND)
REGISTER A0: RESET REGISTER (ADDRESS 00h)
D7
D6
D5
D4
D3
D2
D1
D0
RESET
X
X
X
X
X
X
X
RESET
Bit 7
Software Reset Bit
0 = Not Used
1 = Software Reset. All Mode Control Registers Are Reset to 00h. The ADC Is Momentarily Placed in SLEEP Mode. This Bit Is
Automatically Set Back to Zero After the Reset Is Complete
Bits 6-0
Unused, Don’t Care Bits.
REGISTER A1: POWER-DOWN REGISTER (ADDRESS 01h)
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
X
X
X
PWROFF1
PWROFF0
Bits 7-2
Unused, Don’t Care Bits.
Bits 1-0
PWROFF1:PWROFF0
Power Down Control Bits
00 = Normal Operation
01 = Channel 1 in Normal Operation, Channel 2 in Nap Mode
10 = Channel 1 and Channel 2 in Nap Mode
11 = Sleep Mode
REGISTER A2: TIMING REGISTER (ADDRESS 02h)
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
X
CLKINV
CLKPHASE1
CLKPHASE0
DCS
Bits 7-4
Unused, Don’t Care Bits.
Bit 3
CLKINV
Output Clock Invert Bit
0 = Normal CLKOUT Polarity (As Shown in the Timing Diagrams)
1 = Inverted CLKOUT Polarity
Bits 2-1
CLKPHASE1:CLKPHASE0
Output Clock Phase Delay Bits
00 = No CLKOUT Delay (As Shown in the Timing Diagrams)
01 = CLKOUT+/CLKOUT– Delayed by 45° (Clock Period • 1/8)
10 = CLKOUT+/CLKOUT– Delayed by 90° (Clock Period • 1/4)
11 = CLKOUT+/CLKOUT– Delayed by 135° (Clock Period • 3/8)
Note: If the CLKOUT Phase Delay Feature Is Used, the Clock Duty Cycle Stabilizer Must Also Be Turned On
Bit 0
DCS
Clock Duty Cycle Stabilizer Bit
0 = Clock Duty Cycle Stabilizer Off
1 = Clock Duty Cycle Stabilizer On
218543f
28
LTC2185/LTC2184/LTC2183
Applications Information
REGISTER A3: OUTPUT MODE REGISTER (ADDRESS 03h)
D7
D6
D5
D4
D3
D2
D1
D0
X
ILVDS2
ILVDS1
ILVDS0
TERMON
OUTOFF
OUTMODE1
OUTMODE0
Bit 7
Unused, Don’t Care Bit.
Bits 6-4
ILVDS2:ILVDS0 LVDS Output Current Bits
000 = 3.5mA LVDS Output Driver Current
001 = 4.0mA LVDS Output Driver Current
010 = 4.5mA LVDS Output Driver Current
011 = Not Used
100 = 3.0mA LVDS Output Driver Current
101 = 2.5mA LVDS Output Driver Current
110 = 2.1mA LVDS Output Driver Current
111 = 1.75mA LVDS Output Driver Current
Bit 3
TERMON
LVDS Internal Termination Bit
0 = Internal Termination Off
1 = Internal Termination On. LVDS Output Driver Current is 2× the Current Set by ILVDS2:ILVDS0
Bit 2
OUTOFF
Output Disable Bit
0 = Digital Outputs Are Enabled
1 = Digital Outputs Are Disabled and Have High Output Impedance
Note: If the Digital Outputs Are Disabled the Part Should Also Be Put in Sleep or Nap Mode (Both Channels).
Bits 1-0
OUTMODE1:OUTMODE0
Digital Output Mode Control Bits
00 = Full-Rate CMOS Output Mode
01 = Double Data Rate LVDS Output Mode
10 = Double Data Rate CMOS Output Mode
11 = Not Used
REGISTER A4: DATA FORMAT REGISTER (ADDRESS 04h)
D7
D6
D5
D4
D3
D2
D1
D0
X
X
OUTTEST2
OUTTEST1
OUTTEST0
ABP
RAND
TWOSCOMP
Bit 7-6
Unused, Don’t Care Bits.
Bits 5-3
OUTTEST2:OUTTEST0
Digital Output Test Pattern Bits
000 = Digital Output Test Patterns Off
001 = All Digital Outputs = 0
011 = All Digital Outputs = 1
101 = Checkerboard Output Pattern. OF, D15-D0 Alternate Between 1 0101 0101 0101 0101 and 0 1010 1010 1010 1010
111 = Alternating Output Pattern. OF, D15-D0 Alternate Between 0 0000 0000 0000 0000 and 1 1111 1111 1111 1111
Note: Other Bit Combinations Are not Used
Bit 2
ABP
Alternate Bit Polarity Mode Control Bit
0 = Alternate Bit Polarity Mode Off
1 = Alternate Bit Polarity Mode On. Forces the Output Format to Be Offset Binary
Bit 1
Data Output Randomizer Mode Control Bit
RAND
0 = Data Output Randomizer Mode Off
1 = Data Output Randomizer Mode On
Bit 0
TWOSCOMP
Two’s Complement Mode Control Bit
0 = Offset Binary Data Format
1 = Two’s Complement Data Format
218543f
29
LTC2185/LTC2184/LTC2183
Typical Applications
Silkscreen Top
Top Side
218543f
30
LTC2185/LTC2184/LTC2183
TYPICAL APPLICATIONS
Inner Layer 2 GND
Inner Layer 3
218543f
31
LTC2185/LTC2184/LTC2183
TYPICAL APPLICATIONS
Inner Layer 4
Inner Layer 5 Power
218543f
32
LTC2185/LTC2184/LTC2183
TYPICAL APPLICATIONS
Bottom Side
218543f
33
LTC2185/LTC2184/LTC2183
TYPICAL APPLICATIONS
SDO
C23
2.2µF
SENSE
50
51
49
D1_6_7–
D1_6_7+
D1_8_9–
53
54
55
56
57
58
52
D1_8_9+
D1_10_11–
D1_10_11+
D1_12_13–
D1_12_13+
D1_14_15–
D1_14_15+
60
61
59
OF2_1–
OF2_1
+
SDO
62
PAR/SER
D2_14_15+
+
D2_14_15–
–
D2_12_13+
AIN2
AIN2
GND
D2_12_13–
VCM2
D2_10_11+
D2_10_11–
D2_8_9+
PAD
48
DIGITAL
OUTPUTS
47
46
45
44
43
42
C37
0.1µF
41
40
OVDD
39
38
37
36
35
34
33
DIGITAL
OUTPUTS
65
32
D2_8_9–
D2_6_7+
31
30
D2_6_7–
29
28
ENC+
VDD
17
C18
0.1µF
D2_4_5+
VDD
AIN2–
C67
0.1µF
VREF
CLKOUT–
REFL
AIN2+
VDD
CLKOUT+
D2_4_5–
PAR/SER
LTC2185
REFH
27
16
OGND
D2_2_3+
15
OVDD
REFL
26
14
REFH
D2_2_3–
13
GND
25
12
D1_0_1–
D2_0_1+
11
AIN1
D2_0_1–
+
–
D1_0_1+
24
C21
0.1µF
–
+
10
–
AIN1
23
9
CN1
D1_2_3–
SDI
8
+
19
–
+
6
GND
SCK
+
–
7
5
D1_2_3+
22
4
D1_4_5–
18
C15
0.1µF
AIN1+
AIN1–
D1_4_5+
VCM1
CS
3
21
2
VDD
20
1
SENSE
VDD
64
C19
C20 0.1µF
0.1µF
ENC–
VDD
63
C17
1µF
C78
0.1µF
C79
0.1µF
R51
100Ω
ENCODE
CLOCK
SPI BUS
LTC2185 Schematic
218543f
34
LTC2185/LTC2184/LTC2183
Package Description
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705 Rev C)
0.70 ±0.05
7.15 ±0.05
7.50 REF
8.10 ±0.05 9.50 ±0.05
(4 SIDES)
7.15 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
9 .00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.10
TYP
R = 0.115
TYP
63 64
0.40 ± 0.10
PIN 1 TOP MARK
(SEE NOTE 5)
1
2
PIN 1
CHAMFER
C = 0.35
7.50 REF
(4-SIDES)
7.15 ± 0.10
7.15 ± 0.10
(UP64) QFN 0406 REV C
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
218543f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
35
LTC2185/LTC2184/LTC2183
Typical Application
1.8V
1.8V
VDD
2-Tone FFT, fIN = 70MHz and 69MHz
OVDD
0
–10
CH 2
ANALOG
INPUT
D1_15
•
•
•
D1_0
16-BIT
ADC CORE
S/H
16-BIT
ADC CORE
S/H
125MHz
D2_15
•
•
•
D2_0
OUTPUT
DRIVERS
–30
CMOS
OR
LVDS
OUTPUTS
–40
–50
–60
–70
–80
–90
–100
–110
–120
CLOCK
CONTROL
CLOCK
–20
AMPLITUDE (dBFS)
CH 1
ANALOG
INPUT
0
10
20
30
40
FREQUENCY (MHz)
50
218543 TA03b
218543 TA03a
GND
60
OGND
Related Parts
PART NUMBER
DESCRIPTION
COMMENTS
ADCs
LTC2259-14/LTC2260-14/ 14-Bit, 80Msps/105Msps/125Msps
LTC2261-14
1.8V ADCs, Ultralow Power
89mW/106mW/127mW, 73.4dB SNR, 85dB SFDR, DDR LVDS/DDR CMOS/CMOS
Outputs, 6mm × 6mm QFN-40
LTC2266-14/LTC2267-14/ 14-Bit, 80Msps/105Msps/125Msps
LTC2268-14
1.8V Dual ADCs, Ultralow Power
216mW/250mW/293mW, 73.4dB SNR, 85dB SFDR, Serial LVDS Outputs,
6mm × 6mm QFN-40
LTC2266-12/LTC2267-12/ 12-Bit, 80Msps/105Msps/125Msps
LTC2268-12
1.8V Dual ADCs, Ultralow Power
216mW/250mW/293mW, 70.5dB SNR, 85dB SFDR, Serial LVDS Outputs,
6mm × 6mm QFN-40
RF Mixers/Demodulators
LTC5517
40MHz to 900MHz Direct Conversion
Quadrature Demodulator
High IIP3: 21dBm at 800MHz, Integrated LO Quadrature Generator
LTC5527
400MHz to 3.7GHz High Linearity
Downconverting Mixer
24.5dBm IIP3 at 900MHz, 23.5dBm IIP3 at 3.5GHz, NF = 12.5dB,
50Ω Single-Ended RF and LO Ports
LTC5557
400MHz to 3.8GHz High Linearity
Downconverting Mixer
23.7dBm IIP3 at 2.6GHz, 23.5dBm IIP3 at 3.5GHz, NF = 13.2dB, 3.3V Supply
Operation, Integrated Transformer
LTC5575
800MHz to 2.7GHz Direct Conversion
Quadrature Demodulator
High IIP3: 28dBm at 900MHz, Integrated LO Quadrature Generator, Integrated RF
and LO Transformer
Amplifiers/Filters
LTC6412
800MHz, 31dB Range, Analog-Controlled Continuously Adjustable Gain Control, 35dBm OIP3 at 240MHz, 10dB Noise Figure,
Variable Gain Amplifier
4mm × 4mm QFN-24
LTC6420-20
1.8GHz Dual Low Noise, Low Distortion
Differential ADC Drivers for 300MHz IF
Fixed Gain 10V/V, 1nV/√Hz Total Input Noise, 80mA Supply Current per Amplifier,
3mm × 4mm QFN-20
LTC6421-20
1.3GHz Dual Low Noise, Low Distortion
Differential ADC Drivers
Fixed Gain 10V/V, 1nV/√Hz Total Input Noise, 40mA Supply Current per Amplifier,
3mm × 4mm QFN-20
LTC6605-7/LTC6605-10/
LTC6605-14
Dual Matched 7MHz/10MHz/14MHz
Filters with ADC Drivers
Dual Matched 2nd Order Lowpass Filters with Differential Drivers,
Pin-Programmable Gain, 6mm × 3mm DFN-22
14-Bit Dual Channel IF/Baseband
Receiver Subsystem
Integrated High Speed ADC, Passive Filters and Fixed Gain Differential Amplifiers
Signal Chain Receivers
LTM9002
218543f
36 Linear Technology Corporation
LT 0111 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
 LINEAR TECHNOLOGY CORPORATION 2011

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