BGA Heat Sink - High Performance Device Specific - NXP ATS Part#: ATS-59001-C1-R0 Description: 28.00 x 45.00 x 11.00 mm BGA Heat Sink - High Performance Device Specific - NXP Heat Sink Type: NXP Heat Sink Attachment: maxiGRIP Equivalent Part Number: ATS-59001-C2-R0 Discontinued *Image above is for illustration purpose only. Features & Benefits Designed for flip-chip processors such as NXP MPCs maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Comes preassembled with high performance, phase changing, thermal interface material Thermal Performance @200 LFM 1.0 M/S @300 LFM 1.5 M/S @400 LFM 2.0 M/S @500 LFM 2.5 M/S @600 LFM 3.0 M/S @700 LFM 3.5 M/S @800 LFM 4.0 M/S Unducted Flow 4.5 °C/W 3.6 °C/W 3.2 °C/W 2.9 °C/W 2.7 °C/W 2.5 °C/W 2.4 °C/W Ducted Flow 3 N/A N/A N/A N/A N/A N/A AIR VELOCITY THERMAL RESISTANCE Product Detail Schematic Image Dimension A Dimension B Dimension C Dimension D TIM Finish 28.00 mm 45.00 mm 11.00 mm 59 mm T766 BLACK-ANODIZED Notes: Dimension A and B refer to component size. Dimension C is the heat sink height from the bottom of the base to the top of the fin field. ATS-59001-C2-R0 is the exact heat sink assembly with an equivalent thermal interface material (Saint Gobain C1100F). NOTE: Saint Gobain C1100F is discontinued effective 12/31/10. Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant. Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT170 Contact ATS to learn about custom options available. *Image above is for illustration purpose only. For more information, to find a distributor or to place an order, please contact us at 781-769-2800 (North America), [email protected] or www.qats.com. © 2013 Advanced Thermal Solutions, Inc. | 89-27 Access Road | Norwood MA | 02062 | USA Rev - 230517