MN101C70C Type MN101C70C MN101CF70D Mask ROM FLASH ROM (byte) 48K 64K RAM (byte) 2K LQFP080-P-1414A, TQFP080-P-1212D (Under planning) 0.1 µs (at 3.0 V to 3.6 V, 10 MHz) 0.235 µs (at 1.8 V to 3.6 V, 4.25 MHz) 62.5 µs (at 1.8 V to 3.6 V, 32 kHz) 4K LQFP080-P-1414A (Under development), TQFP080-P-1212D (Under planning) 0.25 µs (at 3.0 V to 3.6 V, 8 MHz) 0.50 µs (at 2.28 V to 3.6 V, 4 MHz) 62.5 µs (at 2.2 V to 3.6 V, 32 kHz) Internal ROM type Package (Lead-free) Minimum Instruction Execution Time Interrupts RESET, Watchdog, External 0 to 2, External 4 (key interrupt dedicated), Timer 0 to 3, Timer 6, Timer 7 (2 systems), Timer 8 (2 systems), Time base, Serial 0 (2 systems), Serial 2, A/D conversion finish, Automatic transfer finish Timer Counter Timer counter 0 : 8-bit × 1 (square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement, added pluse (2-bit) system PWM output, real time output control) (square-wave/PWM output to large current terminal P50 possible) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 0 Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event, serial transfer clock output) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 1 Timer counter 0, 1 can be cascade-connected. Timer counter 2 : 8-bit × 1 (square-wave output, added pluse (2-bit) system PWM output, PWM output, serial transfer clock output, real time output control, event count, synchronous output event, simple pulse width measurement) (square-wave/PWM output to large current terminal P52 possible) Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 2 Timer counter 3 : 8-bit × 1 (square-wave output, event count, generation of remote control carrier, serial transfer clock) Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ........... coincidence with compare register 3 Timer counter 2, 3 can be cascade-connected. Timer counter 6 : 8-bit freerun timer Clock source................ 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192 of XI oscillation clock frequency Interrupt source ........... coincidence with compare register 6 Timer counter 7 : 16-bit × 1 (square-wave output, 16-bit PWM output (cycle / duty continuous variable), event count, synchronous output event, pulse width measurement, input capture, real time output control, high performance IGBT output (Cycle/Duty can be changed constantly)) (square-wave/PWM output to large current terminal P51 possible) Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ........... coincidence with compare register 7 (2 lines), input capture register MAD00035JEM MN101C70C Timer counter 8 : 16 bit × 1 (square-wave/16-bit PWM output [duty continuous variable], event count, pulse width measurement, input capture)(square-wave/PWM output to large current terminal P53 possible) Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ........... coincidence with compare register 8 (2 lines), input capture register Timer counters 7, 8 can be cascade-connected. (square-wave output, PWM is possible as a 32-bit timer.) Time base timer (one-minute count setting) Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768, of clock source frequency Watchdog timer Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency Serial interface Serial 0 : synchronous type/UART (full-duplex) × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency, external clock Serial 2 : synchronous type/single-master I²C × 1 Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency, external clock DMA controller Max. Transfer cycles : 255 Starting factor : external request, various types of interrupt, software Transfer mode : 1-byte transfer, word transfer, burst transfer I/O Pins 66 I/O Common use , Specified pull-up resistor available, Input/output selectable (bit unit) A/D converter 10-bit × 16-ch. (with S/H) Display control function LCD 32 segments × 4 commons (static, 1/2, 1/3, or 1/4 duty) LCD power supply separated from VDD (usable if VDD ≤ VLCD ≤ 3.6 V) LCD power step-up circuit contained (3/2, 2 and 3 times) LCD power shunt resistance contained LCD reference voltage is contained. Special Ports Buzzer output, remote control carrier signal output, high-current drive port ROM Correction Correcting address designation : up to 3 addresses possible Electrical Charactreistics (Supply current) Parameter Operating supply current Supply current at HALT Symbol Condition Limit min typ max Unit IDD1 fosc = 4 MHz , VDD = 3 V 1 1.8 mA IDD2 fx = 32 kHz , VDD = 3 V 4 15 µA IDD3 fx = 32 kHz , VDD = 3 V, Ta = 25°C 2 5 µA IDD4 fx = 32 kHz , VDD = 3 V , Ta = –40°C to +85°C 10 µA Supply current at STOP IDD5 VDD = 3 V , Ta = 25°C 2 µA Supply current at STOP IDD6 VDD = 3 V , Ta = –40°C to +85°C 8 µA MAD00035JEM Development tools In-circuit Emulator PX-ICE101C/D+PX-PRB101C70-LQFP080-P-1414A-M PX-ICE101C/D+PX-PRB101C70-TQFP080-P-1212-M MN101C70C 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 TM8IO, P15 TM7IO, P14 TM3IO, P13 TM2IO, P12 TM1IO, P11 RMOUT, TM0IO, P10 SBT2, P07 SBI2, P06 SBO2, P05 SBT0A, P04 RXDA, SBI0A, P03 TXDA, SBO0A, P02 NBUZZERA, AN9, P01 BUZZERA, AN8, P00 AN7, PA7 AN6, PA6 AN5, PA5 AN4, PA4 AN3, PA3 AN2, PA2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 VLC3, P34 VLC2 VLC1 C2 TM0O, LED0, P50, C1 TM7O, LED1, P51 TM2O, LED2, P52 TM8O, LED3, P53 VSS OSC2 OSC1 SSTRT XI XO SOSCMD VDD NRST, P27 VREF+ AN0, PA0 AN1, PA1 P70, SEG15 P71, SEG14 P72, SEG13 P73, SEG12 P74, SEG11 P75, SEG10 P76, SEG9 P77, SEG8 P80, SEG7 P81, SEG6 P82, SEG5 P83, SEG4 P84, SEG3 P85, SEG2 P86, SEG1 P87, SEG0 P30, COM0 P31, COM1 P32, COM2 P33, COM3 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 P67, SEG16 P66, SEG17 P65, SEG18 P64, SEG19, SBT0B P63, SEG20, SBI0B, RXDB P62, SEG21, SBO0B, TXDB P61, SEG22, NBUZZERB P60, SEG23, BUZZERB P47, KEY7, SEG24, SDO7 P46, KEY6, SEG25, SDO6 P45, KEY5, SEG26, SDO5 P44, KEY4, SEG27, SDO4 P43, KEY3, SEG28, SDO3 P42, KEY2, SEG29, SDO2 P41, KEY1, SEG30, SDO1 P40, KEY0, SEG31, SDO0 VDD P22, IRQ2 P21, IRQ1, ACZ P20, IRQ0 Pin Assignment LQFP080-P-1414A TQFP080-P-1212D MAD00035JEM Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Industrial Co., Ltd.