Bourns CVH252009-3R3M Cvh252009 series multilayer power chip inductor Datasheet

PL
IA
NT
CO
M
*R
oH
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Features
Applications
■ Monolithic construction offering high
■ DC/DC converters for:
■
■
■
■
reliability
Magnetically shielded construction
providing low radiation
Low DC resistance
Low profile, 1008 size (2.5 x 2 x 0.9 mm)
RoHS compliant*
- Smart phones
- DVCs / DSCs
- Tablets
- HDDs / SSDs
- Mobile electronic devices
CVH252009 Series Multilayer Power Chip Inductors
Electrical Specifications
Bourns® Part No.
General Specifications
Inductance @ 1 MHz
SRF
(MHz)
DCR
(Ohms)
Max.
IDC
(mA)
L (µH)
Tol.
Typ.
CVH252009-R47M
0.47
±20 %
100
0.04
1800
CVH252009-1R0M
1.0
±20 %
60
0.055
1600
CVH252009-1R5M
1.5
±20 %
50
0.07
1500
CVH252009-2R2M
2.2
±20 %
40
0.08
1300
CVH252009-3R3M
3.3
±20 %
30
0.10
1200
CVH252009-4R7M
4.7
±20 %
25
0.11
1100
Operating Temperature
................................-55 °C to +125 °C
(Temperature rise included)
Storage Temperature
.....................+40 °C max. at 70 % RH
Resistance to Soldering Heat
...............................................+260 °C
Temperature Rise
......................... 40 °C at rated current
Materials
Core ..............................................Ferrite
Terminal ......................................... Ni/Sn
Packaging ....... 3000 pcs. per 7 inch reel
Soldering Profile (Lead Free Solder)
PRE-HEATING
SOLDERING
Product Dimensions
FERRITE
Temperature (°C)
260
TERMINAL
ELECTRODE
217
200
0.5 ± 0.3
(.020 ± .012)
2.5 ± 0.2
(.098 ± .008)
150
0.5 ± 0.3
(.020 ± .012)
25
≥30
SECONDS
60~120
SECONDS
60~150
SECONDS
0.9 ± 0.1
(.035 ± .004)
2.0 ± 0.20
(.079 ± .008)
Recommended Layout
Time (Seconds)
1.35
(.053)
1.75
(.069)
3.75
(.148)
DIMENSIONS:
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Schematic
MM
(INCHES)
CVH252009 Series Multilayer Power Chip Inductors
L vs. Idc
L vs. Frequency
10
10
L
-3R3M
Inductance (µH)
Inductance (µH)
-3R3M
-2R2M
-1R5M
1
L
-4R7M
-4R7M
-1R0M
-R47M
-2R2M
-1R5M
1 -1R0M
-R47M
0.1
0.1
1
10
1000
100
10000
1
10
100
Frequency (MHz)
DC Current (mA)
Packaging Specifications
DIA.
178 ± 1.0
(7.008 ± .039)
2.0 ± 0.5
(.079 ± .020)
12.0 ± 0.15
(.472 ± .006)
13.0 ± 0.2
(.512 ± .008)
DIA.
60.0 +0.5/-0.0
(2.362 +.020/-0)
13.0 ± 0.2
DIA.
(.512 ± .008)
9.0 ± 0.5
(.354 ± .020)
4.00 ± 0.1
(.157 ± .004)
END
2.00 ± 0.1
(.079 ± .004)
1.75 ± 0.1
(.069 ± .004)
DIA.
1.55 ± 0.05
(.061 ± .002)
0.22 ± 0.05
(.009 ± .002)
START
8.00 ± 0.1
(.315 ± .004)
3.5 ± 0.1
(.138 ± .004)
DIA.
1.00 ± 0.05
(.039 ± .002)
4.00 ± 0.1
(.157 ± .004)
NO COMPONENT
200
(7.874)
MIN.
4.00 ± 0.1
(.157 ± .004)
NO COMPONENT
COMPONENTS
2.80 ± 0.1
(.110 ± .004)
400
(15.748)
MIN.
1.35 ± 0.1
(.053 ± .004)
DIMENSIONS:
MM
(INCHES)
USER DIRECTION OF FEED
3000 PCS. PER REEL
06/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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