Material Content Data Sheet Sales Product Name BTS50060-1EGA MA# MA001080434 Package PG-DSO-12-16 Issued 29. August 2013 Weight* 396.04 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal noble metal non noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper gold aluminium carbon black epoxy resin silicondioxide tin silver polyimide silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-57-5 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7.100 1.79 0.230 0.06 wire encapsulation leadfinish plating glue solder *deviation 0.069 0.02 230.106 58.09 0.193 0.05 1.394 0.35 0.297 0.08 Sum [%] Average Mass [ppm] Sum [ppm] 1.79 17927 17927 582 175 58.17 581016 0.40 3521 2. 3. 4008 750 21.251 5.37 127.062 32.08 37.53 320830 53659 375239 4.235 1.07 1.07 10694 10694 0.610 0.15 0.15 1539 1539 0.150 0.04 0.04 379 379 0.084 0.02 0.067 0.02 3.193 0.81 211 169 0.85 Sum in total: 100,00 Important Remarks: 1. 581773 487 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 8061 8441 1000000