ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier Product Features • 1800 – 2500 MHz • +24 dBm P1dB • +41 dBm OIP3 • 15 dB Gain • 5 dB Noise Figure • Single Positive Supply (+8V) • Lead-free/Green/RoHS compliant SOT-89 Package Applications • • • • • Product Description Functional Diagram The ECG015 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve performance over a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power and is housed in a lead-free/green/RoHS-compliant SOT-89 SMT package. All devices are 100% RF and DC tested. GND 4 The product is targeted for use as a gain block/driver amplifier for various current and next generation wireless technologies such as CDMA, DCS1800 and CDMA2000, where high linearity and medium power is required. In addition, the ECG015 will work for numerous other applications within the 1800 to 2500 MHz frequency range. Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current 2 3 GND RF OUT Pin No. 1 3 2, 4 Mobile Infrastructure W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless Specifications (1) 1 RF IN Function Input Output/Bias Ground Typical Performance (3) Units Min MHz MHz dB dB dB dBm dBm dB V mA 1800 13.5 +22 +37.5 85 Typ 2140 15 20 10 +24 +41 5 5 100 Max Parameter 2500 Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure Units MHz dB dB dB dBm dBm dB Typical 1900 16.5 -9 -9.5 +24 +41 5 2140 15 -20 -10 +24 +41 5 2450 14.5 -12 -9 +23 +42 5 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +8 V, Icc = 100 mA, +25 °C, Rbias = 30 Ω. 135 1. Test conditions unless otherwise noted: 25°C, Vsupply = +8 V, in tuned application circuit with Rbias = 30 Ω. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Rating Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature -40 to +85 °C -55 to +150 °C 180 mA +15 dBm +250 °C Ordering Information Part No. Description ECG015B-G 0.2 Watt, High Linearity InGaP HBT Amplifier (lead-free/green/RoHS-compliant SOT-89 package) ECG015B-PCB1960 1960 MHz Fully Assembled Eval. Board ECG015B-PCB2140 2140 MHz Fully Assembled Eval. Board Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 1 of 5 October 2006 ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier Typical Device Data S-parameters (Vdevice = +5V, Icc = 100 mA, 25 °C, unmatched 50 ohm system) S11 0. 4 0.8 0 3. 25 Swp Max 2.50123GHz 2. 0 6 0. 2. 0 DB(GMax) 1.0 1.0 0.8 6 0. DB(|S[2,1]|) S22 Swp Max 2.50123GHz 0. 4 Gain / Maximum Stable Gain 30 3. 0 0 4. 0 4. 0 5. 5 .0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 10 .0 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 20 0 Gain (dB) 0.2 0. 2 10.0 -10.0 2 - 0. -10.0 2 -0 . -4 .0 -5. 0 -3 .0 .0 -2 Swp Min 1.79083GHz -1.0 Swp Min 1.79083GHz -0.8 2.5 -0 .6 2.4 .4 -0 .0 -2 2.3 -1.0 2.1 2.2 Frequency (GHz) -0.8 2 -0 .6 1.9 .0 1.8 -4 .0 -5. 0 .4 -0 10 -3 15 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 1800 – 2500 MHz, with markers placed at 1.8 – 2.5 GHz in 0.05 GHz increments. S-Parameters (Vdevice = +5 V, Icc = 100 mA, T = 25 °C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) 1800 1900 2000 2100 2200 2300 2400 2500 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -6.70 -7.55 -8.60 -9.85 -11.07 -11.69 -10.87 -9.15 80.76 68.30 53.47 35.06 10.07 -21.71 -56.13 -86.03 15.90 15.77 15.66 15.53 15.40 15.08 14.67 14.14 24.47 16.51 7.76 -1.19 -10.90 -20.90 -31.83 -43.53 -28.55 -28.96 -30.14 -31.49 -33.04 -36.28 -40.69 -42.21 -25.74 -32.29 -38.84 -45.79 -59.63 -78.21 -106.46 163.73 -5.34 -4.96 -4.56 -4.12 -3.67 -3.20 -2.80 -2.44 156.39 156.21 155.58 155.07 153.49 150.85 147.22 142.35 Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors. The markers and vias are spaced in .050” increments. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 2 of 5 October 2006 ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier 1960 MHz Application Circuit (ECG015B-PCB1960) Typical RF Performance at 25 °C Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3∗ 1960 MHz 16.5 dB 9 dB 9.5 dB +24 dBm Channel Power Noise Figure Device Voltage Quiescent Current CAP ID=C4 C=56 pF RES ID=R4 R=22 Ohm 5 dB +5 V 100 mA RES ID=R2 R=390 Ohm IND ID=L1 L=15 nH IND ID=L2 L=15 nH SUBCKT NET="ECG015" IND ID=L3 L=3.3 nH CAP ID=C7 C=1.2 pF CAP ID=C8 C=1.2 pF CAP ID=C6 C=56 pF PORT P=1 Z=50 Ohm +17 dBm (@-45 dBc ACPR, IS-95 9 channels fwd) CAP ID=C3 C=.1uF 8.2 v The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a D C regulator. R ES ID=R3 R =220 Ohm +41 dBm (+9 dBm / tone, 1 MHz spacing) RES ID=R1 R=30 Ohm +8 V DIODE1 ID=D1 CAP ID=C2 C=1000 pF CAP ID=C1 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C5 C=56 pF C8 is placed at silkscreen marker ‘7” or center of component placed at 32 deg. @ 1.9 GHz away from pin 3. C7 placed at silkscreen marker ‘A” or center of component placed at 3.9 deg. @ 1900 MHz away from pin 1. ∗ Please see note 2 on page 1. ACPR1 vs. Pout vs. Temperature at 1.96GHz 26 44 -40 24 43 -45 22 42 20 41 18 40 16 39 14 38 Gain 12 10 -40 P1dB OIP3 -50 dBc OIP3 (dBm) Gain P1dB Ssg, OIP3 & P1dB vs. Temperature @ 1.96GHz -60 -65 37 85°C 10 35 60 -40°C 25°C -70 36 -15 -55 11 85 13 15 17 Pout (dBm) Temperature (°C) 2140 MHz Application Circuit (ECG015B-PCB2140) Typical RF Performance at 25 °C Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3∗ (+9 dBm / tone, 1 MHz spacing) Noise Figure Device Voltage Quiescent Current 2140 MHz 15 dB 20 dB 10 dB +24 dBm +8 V DIODE1 ID=D1 RES ID=R1 R=30 Ohm CAP ID=C3 C=.1uF 8.2 v The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a D C regulator. R ES ID=R3 R =220 Ohm +41 dBm 5 dB +5 V 100 mA IND ID=L2 L=15 nH CAP ID=C6 C=56 pF PORT P=1 Z=50 Ohm IND ID=L3 L=3.3 nH CAP ID=C7 C=.7 pF CAP ID=C4 C=56 pF RES ID=R4 R=22 Ohm C7 placed at silkscreen marker ‘A” or center of component placed at 4.4 deg. @ 2.14 GHz away from pin 1. ∗ Please see note 2 on page 1. RES ID=R2 R=390 Ohm IND ID=L1 L=15 nH CAP ID=C2 C=1000 pF CAP ID=C1 C=56 pF PORT P=2 Z=50 Ohm SUBCKT NET="ECG015" CAP ID=C8 C=1 pF CAP ID=C5 C=56 pF C8 is placed at silkscreen marker ‘7” or center of component placed at 37 deg. @ 2.14 GHz away from pin 3. 24 42 22 41 20 40 18 39 16 38 14 OIP3 (dBm) Ssg & P1dB Ssg, OIP3, & P1dB vs. Temperature @ 2.14GHz 37 Ssg P1dB OIP3 12 36 -40 -15 10 35 60 85 Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 3 of 5 October 2006 ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier 2450 MHz Reference Design Typical RF Performance at 25 °C Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3∗ (+9 dBm / tone, 1 MHz spacing) Noise Figure Device Voltage Quiescent Current +8 V DIODE1 ID=D1 2450 MHz 14.5 dB 12 dB 9 dB +23 dBm RES ID=R1 R=30 Ohm CAP ID=C3 C=.1uF 8.2 v The diode D 1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. R ES ID=R3 R =220 Ohm PORT P=1 Z=50 Ohm +42 dBm 5 dB +5 V 100 mA IND ID=L2 L=15 nH CAP ID=C6 C=56 pF RES ID=L3 R=0 Ohm CAP ID=C4 C=56 pF RES ID=R4 R=22 Ohm RES ID=R2 R=390 Ohm IND ID=L1 L=15 nH SUBCKT NET="ECG015" CAP ID=C8 C=1 pF CAP ID=C2 C=1000 pF CAP ID=C1 C=56 pF PORT P=2 Z=50 Ohm CAP ID=C5 C=56 pF ∗ Please see note 2 on page 1. C8 placed half way between silkscreen marker ‘3’ and ‘4’ or center of component placed at 23 deg. @ 2.45 GHz away from pin 3. 26 44 24 43 22 42 20 41 18 Ssg P1dB 40 OIP3 16 OIP3 (dBm) Ssg & P1db Ssg, OIP3 and P1dB vs. Temperature at 2.45GHz 39 14 38 -40 -15 10 35 60 85 Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 4 of 5 October 2006 ECG015 The Communications Edge TM Product Information ¼ Watt, High Linearity InGaP HBT Amplifier ECG015B Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Outline Drawing Product Marking The component will be marked with an “E015G” designator with an alphanumeric lot code on the top surface of the package. The obsolete tin-lead package is marked with an “E015” designator followed by an alphanumeric lot code. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information Land Pattern ESD Rating: Class 1B Value: Passes at between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tj (2) -40 to +85 °C 128 °C / W 149 °C Notes: 1. The thermal resistance is referenced from the junction-tocase at a case temperature of 85 °C. Tj is a function of the voltage and the current applied to pin 3 and can be calculated by: Tj = Tcase + Rth * Vde * Icc 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 °C. 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 100000 10000 1000 100 60 70 80 90 100 110 120 Tab Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 5 of 5 October 2006