Freescale MC13202 2.4 ghz low power transceiver for the ieee 802.15.4 standard Datasheet

Freescale Semiconductor
Technical Data
Document Number: MC13202
Rev. 1.2, 05/2007
MC13202
MC13202
Package Information
Plastic Package
Case 1311-03
2.4 GHz Low Power Transceiver
for the IEEE® 802.15.4 Standard
1
Introduction
The MC13202 is a short range, low power, 2.4 GHz
Industrial, Scientific, and Medical (ISM) band
transceivers. The MC13202 contains a complete
802.15.4 physical layer (PHY) modem designed for the
IEEE® 802.15.4 Standard which supports peer-to-peer,
star, and mesh networking.
The MC13202 includes the 802.15.4 PHY/MAC for use
with the HCS08 Family of MCUs. The MC13202 can be
used with Freescale’s IEEE 802.15.4 MAC and
BeeStack, which is Freescale’s ZigBee 2006 compliant
protocol stack.
Ordering Information
Device
Device Marking
Package
MC13202
13202
QFN-32
Contents
1
2
3
4
5
6
7
8
9
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . 4
Data Transfer Modes . . . . . . . . . . . . . . . . . . . 5
Electrical Characteristics . . . . . . . . . . . . . . . 8
Functional Description . . . . . . . . . . . . . . . . 12
Pin Connections . . . . . . . . . . . . . . . . . . . . . . 15
Crystal Oscillator Reference Frequency . . 19
Transceiver RF Configurations and
External Connections
22
10Packaging Information . . . . . . . . . . . . . . . . 29
When combined with an appropriate microcontroller
(MCU), the MC13202 provides a cost-effective solution
for short-range data links and networks. Interface with
the MCU is accomplished using a four wire serial
peripheral interface (SPI) connection and an interrupt
request output which allows for the use of a variety of
processors. The software and processor can be scaled to
fit applications ranging from simple point-to-point
systems, through complete ZigBee™ networking. For
more detailed information about MC13202 operation,
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
© Freescale Semiconductor, Inc., 2005, 2006, 2007. All rights reserved.
refer to the MC13202 Reference Manual, (MC13202RM).
Applications include, but are not limited to, the following:
• Residential and commercial automation
— Lighting control
— Security
— Access control
— Heating, ventilation, air-conditioning (HVAC)
— Automated meter reading (AMR)
• Industrial Control
— Asset tracking and monitoring
— Homeland security
— Process management
— Environmental monitoring and control
— HVAC
— Automated meter reading
• Health Care
— Patient monitoring
— Fitness monitoring
• Consumer
— Human interface devices (keyboard, mice, etc.)
— Remote control
— Wireless toys
The transceiver includes a low noise amplifier, 1.0 mW power amplifiers (PA), onboard RF
transmit/receive (T/R) switch for single port use, PLL with internal voltage controlled oscillator (VCO),
on-board power supply regulation, and full spread-spectrum encoding and decoding. The device supports
250 kbps Offset-Quadrature Phase Shift Keying (O-QPSK) data in 2.0 MHz channels with 5.0 MHz
channel spacing per the 802.15.4 Standard. The SPI port and interrupt request output are used for receive
(RX) and transmit (TX) data transfer and control.
2
Features
•
•
•
•
•
Recommended power supply range: 2.0 to 3.4 V
Fully compliant 802.15.4 Standard transceiver supports 250 kbps O-QPSK data in 5.0 MHz
channels and full spread-spectrum encode and decode
Operates on one of 16 selectable channels in the 2.4 GHz band
-1 to 0 dBm nominal output power, programmable from -27 dBm to +3 dBm typical
Receive sensitivity of <-92 dBm (typical) at 1% PER, 20-byte packet, much better than the
802.15.4 Standard of -85 dBm
MC13202 Technical Data, Rev. 1.2
2
Freescale Semiconductor
•
•
•
•
•
•
•
•
•
•
•
2.1
Integrated transmit/receive switch
Dual PA output pairs which can be programmed for full differential single port or dual port
operation that supports an external LNA and/or PA
Three power down modes for increased battery life
— < 1 µA Off current
— 1.0 µA Typical Hibernate current
— 35 µA Typical Doze current (no CLKO)
Programmable frequency clock output (CLKO) for use by MCU
Onboard trim capability for 16 MHz crystal reference oscillator eliminates need for external
variable capacitors and allows for automated production frequency calibration
Four internal timer comparators available to supplement MCU timer resources
Supports both Packet Mode and Streaming Mode data transfer
Buffered transmit and receive data packets for simplified use with low cost MCUs
Seven GPIO to supplement MCU GPIO
Operating temperature range: -40 °C to 85 °C
Small form factor QFN-32 Package
— Meets moisture sensitivity level (MSL) 3
— 260 °C peak reflow temperature
— Meets lead-free requirements
Software Features
Freescale provides a wide range of software functionality to complement the MC13202 hardware. There
are three levels of application solutions:
1. Simple proprietary wireless connectivity.
2. User networks built on the 802.15.4 MAC standard.
3. ZigBee-compliant network stack.
2.1.1
•
•
•
•
Simple MAC (SMAC)
Small memory footprint (about 3 Kbytes typical)
Supports point-to-point and star network configurations
Proprietary networks
Source code and application examples provided
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
3
2.1.2
•
•
•
•
802.15.4 Standard-Compliant MAC
Supports star, mesh and cluster tree topologies
Supports beaconed networks
Supports GTS for low latency
Multiple power saving modes (idle doze, hibernate)
2.1.3
•
•
•
3
ZigBee-Compliant Network Stack
Supports ZigBee 1.0 specification
Supports star, mesh and tree networks
Advanced Encryption Standard (AES) 128-bit security
Block Diagrams
Figure 1 shows a simplified block diagram of the MC13202 which is an 802.15.4 Standard compatible
transceiver that provides the functions required in the physical layer (PHY) specification.
Analog
Regulator
CCA
DCD
Symbol
Synch & Det
Decimation Baseband Matched
Filter
Mix er
Filter
Correlator
1st IF Mix er
LNA IF = 65 MHz
2nd IF Mix er
IF = 1 MHz PMA
Pow er-Up
Control
Logic
Packet
Processor
VDDA
VBATT
Digital
Regulator L
VDDINT
Digital
Regulator H
VDDD
Cry stal
Regulator
RFIN_P
(PAO_P)
RFIN_M
(PAO_M)
Receiv e
Packet RAM
T/ R
AGC
VDDLO2
÷4
256 MHz
24 Bit Ev ent Timer
XTAL1
XTAL2
SERIAL
PERIPHERAL
INTERFACE
(SPI)
4 Programmable
Timer Comparators
Crystal
Oscillator
16 MHz
Transmit
Packet RAM 1
2.45 GHz
VCO
PAO_P
PAO_M
PA
Phase Shift Modulator
Transmit RAM
Arbiter
Sy mbol
Generation
IRQ
Arbiter
IRQ
CLKO
MUX
VDDLO1
CE
MOSI
MISO
SPICLK
ATTN
RST
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
Transmit
Packet RAM 2
Synthesizer
VDDVCO
RXTXEN
Sequence
Manager
(Control Logic)
CT_Bias
Programmable
Prescaler
VCO
Regulator
Receiv e RAM
Arbiter
FCS
Generation
Header
Generation
Figure 1. 802.15.4 Modem Simplified Block Diagram
MC13202 Technical Data, Rev. 1.2
4
Freescale Semiconductor
Figure 2 shows the basic system block diagram for the MC13202 in an application. Interface with the
transceiver is accomplished through a 4-wire SPI port and interrupt request line. The media access control
(MAC), drivers, and network and application software (as required) reside on the host processor. The host
can vary from a simple 8-bit device up to a sophisticated 32-bit processor depending on application
requirements.
MC13202
Microcontroller
ROM
(Flash)
SPI
Timer
RAM Arbiter
RAM
IRQ Arbiter
Digital Transceiver
Frequency
Generation
SPI
and GPIO
Timer
Control
Logic
Analog Receiver
CPU
A/D
Application
Analog
Transmitter
Network
Voltage
Regulators
Power Up
Management
MAC
Buffer RAM
PHY Driver
Figure 2. System Level Block Diagram
4
Data Transfer Modes
The MC13202 has two data transfer modes:
1. Packet Mode — Data is buffered in on-chip RAM
2. Streaming Mode — Data is processed word-by-word
The Freescale 802.15.4 MAC software only supports the streaming mode of data transfer. For proprietary
applications, packet mode can be used to conserve MCU resources.
4.1
Packet Structure
Figure 3 shows the packet structure of the MC13202. Payloads of up to 125 bytes are supported. The
MC13202 adds a four-byte preamble, a one-byte Start of Frame Delimiter (SFD), and a one-byte Frame
Length Indicator (FLI) before the data. A Frame Check Sequence (FCS) is calculated and appended to the
end of the data.
4 bytes
1 byte
1 byte
125 bytes maximum
2 bytes
Preamble
SFD
FLI
Payload Data
FCS
Figure 3. MC13202 Packet Structure
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
5
4.2
Receive Path Description
In the receive signal path, the RF input is converted to low IF In-phase and Quadrature (I & Q) signals
through two down-conversion stages. A Clear Channel Assessment (CCA) can be performed based upon
the baseband energy integrated over a specific time interval. The digital backend performs Differential
Chip Detection (DCD), the correlator “de-spreads” the Direct Sequence Spread Spectrum (DSSS) Offset
QPSK (O-QPSK) signal, determines the symbols and packets, and detects the data.
The preamble, SFD, and FLI are parsed and used to detect the payload data and FCS which are stored in
RAM. A two-byte FCS is calculated on the received data and compared to the FCS value appended to the
transmitted data, which generates a Cyclical Redundancy Check (CRC) result. Link Quality is measured
over a 64 µs period after the packet preamble and stored in RAM.
If the MC13202 is in packet mode, the data is processed as an entire packet. The MCU is notified that an
entire packet has been received via an interrupt.
If the MC13202 is in streaming mode, the MCU is notified by an interrupt on a word-by-word basis.
Figure 4 shows CCA reported power level versus input power. Note that CCA reported power saturates at
about -57 dBm input power which is well above 802.15.4 Standard requirements. Figure 5 shows energy
detection/LQI reported level versus input power.
NOTE
For both graphs, the required 802.15.4 Standard accuracy and range limits
are shown. A 3.5 dBm offset has been programmed into the CCA reporting
level to center the level over temperature in the graphs.
Reported Power Level (dBm)
-50
-60
-70
802.15.4 Ac curac y
and range Requirements
-80
-90
-100
-90
-80
-70
-60
-50
Input Pow er (dBm)
Figure 4. Reported Power Level versus Input Power in CCA Mode
MC13202 Technical Data, Rev. 1.2
6
Freescale Semiconductor
-15
Reported Power Level (dBm)
-25
-35
-45
-55
-65
802.15.4 Accuracy
and Range Requirements
-75
-85
-85
-75
-65
-55
-45
-35
-25
-15
Input Power Level (dBm)
Figure 5. Reported Power Level Versus Input Power for Energy Detect or Link Quality Indicator
4.3
Transmit Path Description
For the transmit path, the TX data that was previously stored in RAM is retrieved (packet mode) or the TX
data is clocked in via the SPI (stream mode), formed into packets per the 802.15.4 PHY, spread, and then
up-converted to the transmit frequency.
If the MC13202 is in packet mode, data is processed as an entire packet. The data are first loaded into the
TX buffer. The MCU then requests that the MC13202 transmit the data. The MCU is notified via an
interrupt when the whole packet has successfully been transmitted.
In streaming mode, the data is fed to the MC13202 on a word-by-word basis with an interrupt serving as
a notification that the MC13202 is ready for more data. This continues until the whole packet is
transmitted.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
7
5
Electrical Characteristics
5.1
Maximum Ratings
Table 1. Maximum Ratings
Rating
Symbol
Value
Unit
VBATT, VDDINT
-0.3 to 3.6
Vdc
Vin
-0.3 to (VDDINT + 0.3)
Pmax
10
dBm
Junction Temperature
TJ
125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Power Supply Voltage
Digital Input Voltage
RF Input Power
Note: Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
or Recommended Operating Conditions tables.
Note: Meets Human Body Model (HBM) = 2 kV. RF input/output pins have no ESD protection.
5.2
Recommended Operating Conditions
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
VBATT,
VDDINT
2.0
2.7
3.4
Vdc
Input Frequency
fin
2.405
-
2.480
GHz
Ambient Temperature Range
TA
-40
25
85
°C
Logic Input Voltage Low
VIL
0
-
30%
VDDINT
V
Logic Input Voltage High
VIH
70%
VDDINT
-
VDDINT
V
SPI Clock Rate
fSPI
-
-
8.0
MHz
RF Input Power
Pmax
-
-
10
dBm
Power Supply Voltage (VBATT = VDDINT)1
Crystal Reference Oscillator Frequency (±40 ppm over
operating conditions to meet the 802.15.4 Standard.)
1
fref
16 MHz Only
If the supply voltage is produced by a switching DC-DC converter, ripple should be less than 100 mV peak-to-peak.
MC13202 Technical Data, Rev. 1.2
8
Freescale Semiconductor
5.3
DC Electrical Characteristics
Table 3. DC Electrical Characteristics
(VBATT, VDDINT = 2.7 V, TA = 25 °C, unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Ileakage
ICCH
ICCD
ICCI
ICCT
ICCR
-
0.2
1.0
35
500
30
37
1.0
6.0
102
800
35
42
µA
µA
µA
µA
mA
mA
Input Current (VIN = 0 V or VDDINT) (All digital inputs)
IIN
-
-
±1
µA
Input Low Voltage (All digital inputs)
VIL
0
-
30%
VDDINT
V
Input High Voltage (all digital inputs)
VIH
70%
VDDINT
-
VDDINT
V
Output High Voltage (IOH = -1 mA) (All digital outputs)
VOH
80%
VDDINT
-
VDDINT
V
Output Low Voltage (IOL = 1 mA) (All digital outputs)
VOL
0
-
20%
VDDINT
V
Power Supply Current (VBATT + VDDINT)
Off1
Hibernate1
Doze (No CLKO)1 2
Idle
Transmit Mode (0 dBm nominal output power)
Receive Mode
1
To attain specified low power current, all GPIO and other digital IO must be handled properly. See Section 8.3, “Low
Power Considerations”.
2 CLKO frequency at default value of 32.786 kHz.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
9
5.4
AC Electrical Characteristics
Table 4. Receiver AC Electrical Characteristics
(VBATT, VDDINT = 2.7 V, TA = 25 °C, fref = 16 MHz, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
SENSper
-
-92
-
dBm
-
-92
-87
dBm
-
10
-
dBm
Channel Rejection for 1% PER (desired signal -82 dBm)
+5 MHz (adjacent channel)
-5 MHz (adjacent channel)
+10 MHz (alternate channel)
-10 MHz (alternate channel)
>= 15 MHz
-
31
30
43
41
53
-
dB
dB
dB
dB
dB
Frequency Error Tolerance
-
-
200
kHz
Symbol Rate Error Tolerance
-
-
80
ppm
Sensitivity for 1% Packet Error Rate (PER) (-40 to +85 °C)
Sensitivity for 1% Packet Error Rate (PER) (+25 °C)
Saturation (maximum input level)
SENSmax
Table 5. Transmitter AC Electrical Characteristics
(VBATT, VDDINT = 2.7 V, TA = 25 °C, fref = 16 MHz, unless otherwise noted.)
Characteristic
Min
Typ
Max
Unit
Power Spectral Density (-40 to +85 °C) Absolute limit
-
-47
-
dBm
Power Spectral Density (-40 to +85 °C) Relative limit
-
47
-
-4
-1
2
Nominal Output Power
1
Symbol
Pout
Maximum Output Power2
Error Vector Magnitude
4
dBm
-
20
35
%
Output Power Control Range
-
30
-
dB
Over the Air Data Rate
-
250
-
kbps
2nd Harmonic
-
TBD
-
dBc
3rd Harmonic
-
TBD
-
dBc
1
2
EVM
dBm
SPI Register 12 programmed to 0x00BC which sets output power to nominal (-1 dBm typical).
SPI Register 12 programmed to 0x00FF which sets output power to maximum.
MC13202 Technical Data, Rev. 1.2
10
Freescale Semiconductor
Table 6. Digital Timing Specifications
(VBATT, VDDINT = 2.7 V, TA = 25 °C, frequency = 16 MHz, unless otherwise noted.
SPI timing parameters are referenced to Figure 8.
Symbol
Parameter
Min
Typ
Max
Unit
T0
SPICLK period
125
nS
T1
Pulse width, SPICLK low
50
nS
T2
Pulse width, SPICLK high
50
nS
T3
Delay time, MISO data valid from falling SPICLK
15
nS
T4
Setup time, CE low to rising SPICLK
15
nS
T5
Delay time, MISO valid from CE low
15
nS
T6
Setup time, MOSI valid to rising SPICLK
15
nS
T7
Hold time, MOSI valid from rising SPICLK
15
nS
RST minimum pulse width low (asserted)
250
nS
Figure 6 shows a typical AC parameter evaluation circuit.
U5
L1
PAO_M
PAO_P
RFIN_P
RFIN_M
CT_Bias
6
5
2
1
3
L2
6.8nH
L4
MC1320x
R1
0R
Z1
1.8nH
3
1
2
5
4
6
LDB212G4005C-001
L3
3.9nH
C1
1.0pF
R2
0R
Not Mounted
ANT1
F_Antenna
1.8nH
2
3
4
5
1
C2
10pF
J1
SMA_edge_Receptac
Figure 6. RF Parametric Evaluation Circuit
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
11
6
Functional Description
The following sections provide a detailed description of the MC13202 functionality including the
operating modes and Serial Peripheral Interface (SPI).
6.1
MC13202 Operational Modes
The MC13202 has a number of operational modes that allow for low-current operation. Transition from
the Off to Idle mode occurs when RST is negated. Once in Idle, the SPI is active and is used to control the
IC. Transition to Hibernate and Doze modes is enabled via the SPI. These modes are summarized, along
with the transition times, in Table 7. Current drain in the various modes is listed in Table 3, DC Electrical
Characteristics.
Table 7. MC13202 Mode Definitions and Transition Times
Mode
Off
Hibernate
Doze
Idle
Transition Time
To or From Idle
Definition
All IC functions Off, Leakage only. RST asserted. Digital outputs are tri-stated
including IRQ
10 - 25 ms to Idle
Crystal Reference Oscillator Off. (SPI not functional.) IC Responds to ATTN. Data is 7 - 20 ms to Idle
retained.
Crystal Reference Oscillator On but CLKO output available only if Register 7, Bit 9 = (300 + 1/CLKO) µs to Idle
1 for frequencies of 1 MHz or less. (SPI not functional.) Responds to ATTN and can
be programmed to enter Idle Mode through an internal timer comparator.
Crystal Reference Oscillator On with CLKO output available. SPI active.
Receive
Crystal Reference Oscillator On. Receiver On.
144 µs from Idle
Transmit
Crystal Reference Oscillator On. Transmitter On.
144 µs from Idle
6.2
Serial Peripheral Interface (SPI)
The host microcontroller directs the MC13202, checks its status, and reads/writes data to the device
through the 4-wire SPI port. The transceiver operates as a SPI slave device only. A transaction between
the host and the MC13202 occurs as multiple 8-bit bursts on the SPI. The SPI signals are:
1. Chip Enable (CE) - A transaction on the SPI port is framed by the active low CE input signal. A
transaction is a minimum of 3 SPI bursts and can extend to a greater number of bursts.
2. SPI Clock (SPICLK) - The host drives the SPICLK input to the MC13202. Data is clocked into the
master or slave on the leading (rising) edge of the return-to-zero SPICLK and data out changes
state on the trailing (falling) edge of SPICLK.
NOTE
For Freescale microcontrollers, the SPI clock format is the clock phase
control bit CPHA = 0 and the clock polarity control bit CPOL = 0.
3. Master Out/Slave In (MOSI) - Incoming data from the host is presented on the MOSI input.
4. Master In/Slave Out (MISO) - The MC13202 presents data to the master on the MISO output.
MC13202 Technical Data, Rev. 1.2
12
Freescale Semiconductor
A typical interconnection to a microcontroller is shown in Figure 7.
MCU
MC13202
Shift Register
Baud Rate
Generator
RxD
MISO
TxD
MOSI
Sclk
SPICLK
Chip Enable (CE)
Shift Register
CE
Figure 7. SPI Interface
Although the SPI port is fully static, internal memory, timer and interrupt arbiters require an internal clock
(CLKcore), derived from the crystal reference oscillator, to communicate from the SPI registers to internal
registers and memory.
6.2.1
SPI Burst Operation
The SPI port of an MCU transfers data in bursts of 8 bits with most significant bit (MSB) first. The master
(MCU) can send a byte to the slave (transceiver) on the MOSI line and the slave can send a byte to the
master on the MISO line. Although an MC13202 transaction is three or more SPI bursts long, the timing
of a single SPI burst is shown in Figure 8.
SPI Burst
CE
1
2
3
4
5
6
7
8
SPIC L K
T4
V alid
T6
T5
T2
T1
T3
T0
T7
M ISO
M O SI
V alid
V alid
Figure 8. SPI Single Burst Timing Diagram
SPI digital timing specifications are shown in Table 6.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
13
6.2.2
SPI Transaction Operation
Although the SPI port of an MCU transfers data in bursts of 8 bits, the MC13202 requires that a complete
SPI transaction be framed by CE, and there will be three (3) or more bursts per transaction. The assertion
of CE to low signals the start of a transaction. The first SPI burst is a write of an 8-bit header to the
transceiver (MOSI is valid) that defines a 6-bit address of the internal resource being accessed and
identifies the access as being a read or write operation. In this context, a write is data written to the
MC13202 and a read is data written to the SPI master. The following SPI bursts will be either the write
data (MOSI is valid) to the transceiver or read data from the transceiver (MISO is valid).
Although the SPI bus is capable of sending data simultaneously between master and slave, the MC13202
never uses this mode. The number of data bytes (payload) will be a minimum of 2 bytes and can extend to
a larger number depending on the type of access. The number of payload bytes sent will always be an even
integer. After the final SPI burst, CE is negated to high to signal the end of the transaction. Refer to the
MC13202 Reference Manual, (MC13202RM) for more details on SPI registers and transaction types.
An example SPI read transaction with a 2-byte payload is shown in Figure 9.
CE
C lo c k B u rst
S P IC L K
M IS O
M O SI
V a lid
V a lid
V a lid
H eader
R e a d d a ta
Figure 9. SPI Read Transaction Diagram
MC13202 Technical Data, Rev. 1.2
14
Freescale Semiconductor
7
Pin Connections
Table 8. Pin Function Description
Pin #
Pin Name
Type
Description
Functionality
1
RFIN_M
RF Input
RF input/output negative.
When used with internal T/R switch, this is
a bi-directional RF port for the internal LNA
and PA
2
RFIN_P
RF Input
RF input/output positive.
When used with internal T/R switch, this is
a bi-directional RF port for the internal LNA
and PA
3
CT_Bias
Control voltage
Bias voltage/control signal for external When used with internal T/R switch,
RF components
provides RX ground reference and TX
VDDA reference for use with external
balun. Can also be used as a control signal
for external LNA, PA, or T/R switch.
4
NC
5
PAO_P
RF Output /DC Input RF Power Amplifier Output Positive.
6
PAO_M
RF Output/DC Input RF Power Amplifier Output Negative. Open drain. Connect to VDDA through a
bias network when used with an external
balun. Not used when internal T/R switch is
used.
7
SM
Input
8
GPIO41
Digital Input/ Output General Purpose Input/Output 4.
9
GPIO3
Digital Input/ Output General Purpose Input/Output 3.
10
GPIO2
Digital Input/ Output General Purpose Input/Output 2.
When gpio_alt_en, Register 9, Bit 7 =
1, GPIO2 functions as a “CRC Valid”
indicator.
11
GPIO1
Digital Input/ Output General Purpose Input/Output 1.
When gpio_alt_en, Register 9, Bit 7 =
1, GPIO1 functions as an “Out of Idle”
indicator.
12
RST
Digital Input
Tie to Ground.
Test mode pin.
Open drain. Connect to VDDA through a
bias network when used with an external
balun. Not used when internal T/R switch is
used.
Must be grounded for normal operation.
See Footnote 1
Active Low Reset. While held low, the
IC is in Off Mode and all internal
information is lost from RAM and SPI
registers. When high, IC goes to IDLE
Mode, with SPI in default state.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
15
Table 8. Pin Function Description (continued)
Pin #
Pin Name
Type
Description
Functionality
13
RXTXEN2
Digital Input
Active High. Low to high transition
initiates RX or TX sequence
depending on SPI setting. Should be
taken high after SPI programming to
start RX or TX sequence and should
be held high through the sequence.
After sequence is complete, return
RXTXEN to low. When held low,
forces Idle Mode.
14
ATTN2
Digital Input
Active Low Attention. Transitions IC
See Footnote 2
from either Hibernate or Doze Modes
to Idle.
15
CLKO
Digital Output
Clock output to host MCU.
Programmable frequencies of:
16 MHz, 8 MHz, 4 MHz, 2 MHz, 1
MHz, 62.5 kHz, 32.786+ kHz
(default),
and 16.393+ kHz.
16
SPICLK2
Digital Clock Input
External clock input for the SPI
interface.
See Footnote 2
17
MOSI2
Digital Input
Master Out/Slave In. Dedicated SPI
data input.
See Footnote 2
18
MISO3
Digital Output
Master In/Slave Out. Dedicated SPI
data output.
See Footnote 3
19
CE2
Digital Input
Active Low Chip Enable. Enables SPI See Footnote 2
transfers.
20
IRQ
Digital Output
Active Low Interrupt Request.
Open drain device.
Programmable 40 kΩ internal pull-up.
Interrupt can be serviced every 6 µs with
<20 pF load.
Optional external pull-up must be >4 kΩ.
21
VDDD
Power Output
Digital regulated supply bypass.
Decouple to ground.
22
VDDINT
Power Input
Digital interface supply & digital
regulator input. Connect to Battery.
2.0 to 3.4 V. Decouple to ground.
23
GPIO51
Digital Input/Output
General Purpose Input/Output 5.
See Footnote 1
24
GPIO6
Digital Input/Output
General Purpose Input/Output 6.
25
GPIO7
Digital Input/Output
General Purpose Input/Output 7.
26
XTAL1
Input
Crystal Reference oscillator input.
See Footnote 2
Connect to 16 MHz crystal and load
capacitor.
MC13202 Technical Data, Rev. 1.2
16
Freescale Semiconductor
Table 8. Pin Function Description (continued)
Pin #
Pin Name
Type
Description
Functionality
27
XTAL2
Input/Output
Crystal Reference oscillator output
Note: Do not load this pin by using it
as a 16 MHz source. Measure
16 MHz output at Pin 15,
CLKO, programmed for 16
MHz. See the MC13202
Reference Manual for details.
Connect to 16 MHz crystal and load
capacitor.
28
VDDLO2
Power Input
LO2 VDD supply. Connect to VDDA
externally.
29
VDDLO1
Power Input
LO1 VDD supply. Connect to VDDA
externally.
30
VDDVCO
Power Output
VCO regulated supply bypass.
Decouple to ground.
31
VBATT
Power Input
Analog voltage regulators Input.
Connect to Battery.
Decouple to ground.
32
VDDA
Power Output
Analog regulated supply Output.
Connect to directly VDDLO1 and
VDDLO2 externally and to PAO±
through a bias network.
Note: Do not use this pin to supply
circuitry external to the chip.
Decouple to ground.
EP
Ground
External paddle / flag ground.
Connect to ground.
1
The transceiver GPIO pins default to inputs at reset. There are no programmable pullups on these pins. Unused GPIO pins
should be tied to ground if left as inputs, or if left unconnected, they should be programmed as outputs set to the low state.
2 During low power modes, input must remain driven by MCU.
3 By default MISO is tri-stated when CE is negated. For low power operation, miso_hiz_en (Bit 11, Register 07) should be set
to zero so that MISO is driven low when CE is negated.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
17
GPIO7
XTAL1
XTAL2
VDDLO2
VDDLO1
VDDVCO
VBATT
GPIO6
VDDD
EP
PAO_P
IRQ
MC13202
PAO_M
CE
MISO
SM
GPIO4
9
10
11
12
13
14
15
SPICLK
8
25
NC
CLKO
7
26
VDDINT
ATTN
6
27
CT_Bias
RXTXEN
5
28
RST
4
29
GPIO5
GPIO1
3
30
RFIN_P
GPIO2
2
RFIN_M
GPIO3
1
31
VDDA
32
MOSI
24
23
22
21
20
19
18
17
16
Figure 10. Pin Connections (Top View)
MC13202 Technical Data, Rev. 1.2
18
Freescale Semiconductor
8
Crystal Oscillator Reference Frequency
This section provides application specific information regarding crystal oscillator reference design and
recommended crystal usage.
8.1
Crystal Oscillator Design Considerations
The 802.15.4 Standard requires that several frequency tolerances be kept within ± 40 ppm accuracy. This
means that a total offset up to 80 ppm between transmitter and receiver will still result in acceptable
performance. The MC13202 transceiver provides onboard crystal trim capacitors to assist in meeting this
performance.
The primary determining factor in meeting this specification is the tolerance of the crystal oscillator
reference frequency. A number of factors can contribute to this tolerance and a crystal specification will
quantify each of them:
1. The initial (or make) tolerance of the crystal resonant frequency itself.
2. The variation of the crystal resonant frequency with temperature.
3. The variation of the crystal resonant frequency with time, also commonly known as aging.
4. The variation of the crystal resonant frequency with load capacitance, also commonly known as
pulling. This is affected by:
a) The external load capacitor values - initial tolerance and variation with temperature.
b) The internal trim capacitor values - initial tolerance and variation with temperature.
c) Stray capacitance on the crystal pin nodes - including stray on-chip capacitance, stray package
capacitance and stray board capacitance; and its initial tolerance and variation with
temperature.
5. Whether or not a frequency trim step will be performed in production
Freescale requires the use of a 16 MHz crystal with a <9 pF load capacitance. The MC13202 does not
contain a reference divider, so 16 MHz is the only frequency that can be used. A crystal requiring higher
load capacitance is prohibited because a higher load on the amplifier circuit may compromise its
performance. The crystal manufacturer defines the load capacitance as that total external capacitance seen
across the two terminals of the crystal. The oscillator amplifier configuration used in the MC13202
requires two balanced load capacitors from each terminal of the crystal to ground. As such, the capacitors
are seen to be in series by the crystal, so each must be <18 pF for proper loading.
In the Figure 11 crystal reference schematic, the external load capacitors are shown as 6.8 pF each, used
in conjunction with a crystal that requires an 8 pF load capacitance. The default internal trim capacitor
value (2.4 pF) and stray capacitance total value (6.8 pF) sum up to 9.2 pF giving a total of 16 pF. The value
for the stray capacitance was determined empirically assuming the default internal trim capacitor value and
for a specific board layout. A different board layout may require a different external load capacitor value.
The on-chip trim capability may be used to determine the closest standard value by adjusting the trim value
via the SPI and observing the frequency at CLKO. Each internal trim load capacitor has a trim range of
approximately 5 pF in 20 fF steps.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
19
U6
XTAL1
26
Y1
16MHz
XTAL2
C10
6.8pF
27
MC1320x
C11
6.8pF
Y1 = Daishinku KDS - DSX321G ZD00882
Figure 11. MC13202 Modem Crystal Circuit
Initial tolerance for the internal trim capacitance is approximately ±15%.
Since the MC13202 contains an on-chip reference frequency trim capability, it is possible to trim out
virtually all of the initial tolerance factors and put the frequency within 0.12 ppm on a board-by-board
basis. Individual trimming of each board in a production environment allows use of the lowest cost crystal,
but requires that each board go through a trimming procedure. This step can be avoided by
using/specifying a crystal with a tighter stability tolerance, but the crystal will be slightly higher in cost.
A tolerance analysis budget may be created using all the previously stated factors. It is an engineering
judgment whether the worst case tolerance will assume that all factors will vary in the same direction or if
the various factors can be statistically rationalized using RSS (Root-Sum-Square) analysis. The aging
factor is usually specified in ppm/year and the product designer can determine how many years are to be
assumed for the product lifetime. Taking all of the factors into account, the product designer can determine
the needed specifications for the crystal and external load capacitors to meet the 802.15.4 Standard.
8.2
Crystal Requirements
The suggested crystal specification for the MC13202 is shown in Table 9. A number of the stated
parameters are related to desired package, desired temperature range and use of crystal capacitive load
trimming. For more design details and suggested crystals, see application note AN3251, Reference
Oscillator Crystal Requirements for MC1319x, MC1320x, and MC1321x.
Table 9. MC13202 Crystal Specifications1
Parameter
Frequency
Frequency tolerance (cut
tolerance)2
Frequency stability (temperature drift)3
Aging
4
Equivalent series resistance5
Load capacitance
6
Shunt capacitance
Mode of oscillation
1
2
Value
Unit
Condition
16.000000
MHz
± 10
ppm
at 25 °C
± 15
ppm
Over desired temperature range
±2
ppm
max
43
Ω
max
5-9
pF
<2
pF
max
fundamental
User must be sure manufacturer specifications apply to the desired package.
A wider frequency tolerance may acceptable if application uses trimming at production final test.
MC13202 Technical Data, Rev. 1.2
20
Freescale Semiconductor
3
A wider frequency stability may be acceptable if application uses trimming at production final test.
A wider aging tolerance may be acceptable if application uses trimming at production final test.
5
Higher ESR may be acceptable with lower load capacitance.
6
Lower load capacitance can allow higher ESR and is better for low temperature operation in Doze mode.
4
8.3
•
Low Power Considerations
Program and use the modem IO pins properly for low power operation
— All unused modem GPIOx signals must be used one of 2 ways:
– If the Off mode is to be used as a long term low power mode, unused GPIO should be tied
to ground. The default GPIO mode is an input and there will be no conflict.
– If only Hibernate and/or Doze modes are used as long term low power modes, the GPIO
should programmed as outputs in the low state.
— When modem GPIO are used as outputs:
– Pullup resistors should be provided (can be provided by the MCU IO pin if tied to the MCU)
if the modem Off condition is to be used as a long term low power mode.
– During Hibernate and/or Doze modes, the GPIO will retain its programmed output state.
— If the modem GPIO is used as an input, the GPIO should be driven by its source during all low
power modes or a pullup resistor should be provided.
— Digital outputs IRQ, MISO, and CLKO:
– MISO - is always an output. During Hibernate, Doze, and active modes, the default
condition is for the MISO output to go to tristate when CE is de-asserted, and this can cause
a problem with the MCU because one of its inputs can float. Program Control_B Register
07, Bit 11, miso_hiz_en = 0 so that MISO is driven low when CE is de-asserted. As a result,
MISO will not float when Doze or Hibernate Mode is enabled.
– IRQ - is an open drain output (OD) and should always have a pullup resistor (typically
provided by the MCU IO). IRQ acts as the interrupt request output.
NOTE
It is good practice to have the IRQ interrupt input to the MCU disabled
during the hardware reset to the modem. After releasing the modem
hardware reset, the interrupt request input to the MCU can then be enabled
to await the IRQ that signifies the modem is ready and in Idle mode; this can
prevent a possible extraneous false interrupt request.
•
– CLKO - is always an output. During Hibernate CLKO retains its output state, but does not
toggle. During Doze, CLKO may toggle depending on whether it is being used.
If the MCU is also going to be used in low power modes, be sure that all unused IO are programmed
properly for low power operation (typically best case is as outputs in the low state). The MC13202
is commonly used with the Freescale MC9S08GT/GB 8-bit devices. For these MCUs:
— Use only STOP2 and STOP3 modes (not STOP1) with these devices where the GPIO states are
retained. The MCU must retain control of the MC13202 IO during low power operation.
— As stated above all unused GPIO should be programmed as outputs low for lowest power and
no floating inputs.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
21
— MC9S08GT devices have IO signals that are not pinned-out on the package. These signals must
also be initialized (even though they cannot be used) to prevent floating inputs.
9
Transceiver RF Configurations and External
Connections
The MC13202 radio has features that allow for a flexible as well as low cost RF interface:
• Programmable output power — 0 dBm nominal output power, programmable from -27 dBm to +4
dBm typical
• <-94 dBm (typical) receive sensitivity — At 1% PER, 20-byte packet (well above 802.15.4
Standard of -85 dBm)
• Optional integrated transmit/receive (T/R) switch for low cost operation — With internal PAs and
LNA, the internal T/R switch allows a minimal part count radio interface using only a single balun
to interface to a single-ended antenna
• Maximum flexibility — There are full differential RF I/O pins for use with the internal T/R switch.
Optionally, these pins become the RF_IN signals and a separate set of full differential PA outputs
are also provided. Separate inputs and outputs allow for a variety of RF configurations including
external LNA and PA for increased range
• CT_Bias Output — The CT_Bias signal provides a switched bias reference for use with the internal
T/R switch, and alternatively can be programmed as an antenna switch signal for use with an
external antenna switch
• Onboard trim capability for 16 MHz crystal reference oscillator — The 802.15.4 Standard puts a
+/- 40 ppm requirement on the carrier frequency. The onboard trim capability of the modem crystal
oscillator eliminates need for external variable capacitors and allows for automated production
frequency calibration. Also tighter tolerance can produce greater receive sensitivity
9.1
RF Interface Pins
Figure 12 shows the RF interface pins and the associated analog blocks. Notice that separate PA blocks
are associated with RFIN_x and PAO_x signal pairs. The RF interface allows both single port differential
operation and dual port differential operation.
MC13202 Technical Data, Rev. 1.2
22
Freescale Semiconductor
2
RFIN_P (PAO_P)
1
RFIN_M (PAO_M)
RX
SW ITCH
LNA
RX
SIGNAL
RX ENABLE
PA2
3
PA2 ENABLE
CT_Bias
CT_Bias Generator
CT_Bias CONTROL
5
PAO_P
6
PAO_M
FROM TX PSM
PA1
PA1 ENABLE
Figure 12. RF Interface Pins
9.1.1
Single Port Operation
The integrated RF switch allows users to operate in a single port configuration. In Single Port Mode, an
internal RX switch and separate PA are used and pins RFIN_P (PAO_P) and RFIN_M (PAO_M) become
bidirectional and connect both for TX and RX. When receiving, the RX switch is enabled to the internal
LNA and the TX PA is disabled. When transmitting, the RX switch is disabled (isolating the LNA) and a
TX PA is enabled. The optional CT_Bias pin provides a reference or bias voltage which is at VDDA for
transmit and is at ground for receive. This signal can be used to provide the proper bias voltage to a balun
that converts a single-ended antenna to the differential interface required by the transceiver.
Figure 13 shows a single port example with a balun.
MC13202/03
RFIN_P (PAO_P)
Balun
L1
RFIN_M (PAO_M)
CT_Bias
Bypass
PAO_P
PAO_M
Figure 13. Single Port RF Operation with a Balun
The CT_Bias is connected to the balun center-tap providing the proper DC bias voltage to the balun
depending on RX or TX.
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
23
9.1.2
Dual Port Operation
A second set of pins designated PAO_P and PAO_N allow operation in a dual port configuration. There
are separate paths for transmit and receive with the optional CT_Bias pin providing a signal that indicates
if the radio is in TX or RX Mode which then can be used to drive an external low noise amplifier, power
amplifier, or antenna switch.
In dual port operation, the RFIN_P and RFIN_N are inputs only, the internal RX switch to the LNA is
enabled to receive, and the associated TX PA stays disabled. Pins PAO_P and PAO_N become the
differential output pins and the associated TX PA is enabled for transmit.
Figure 14 shows two dual port configurations. First is a single antenna configuration with an external low
noise amplifier (LNA) for greater range. An external antenna switch is used to multiplex the antenna
between receive and transmit. An LNA is in the receive path to add gain for greater receive sensitivity.
Two external baluns are required to convert the single-ended antenna switch signals to the differential
signals required by the radio. Separate RFIN and PAO signals are provided for connection with the baluns,
and the CT_bias signal is programmed to provide the external switch control. The polarity of the external
switch control is selectable.
Figure 14 also shows a dual antenna configuration where there is a RX antenna and a TX antenna. For the
receive side, the RX antenna is ac-coupled to the differential RFIN inputs and these capacitors along with
inductor L1 form a matching network. Inductors L2 and L3 are ac-coupled to ground to form a frequency
trap. For the transmit side, the TX antenna is connected to the differential PAO outputs, and inductors L4
and L5 provide DC-biasing to VDDA but are ac-isolated. CT_Bias is not required or used.
MC13202 Technical Data, Rev. 1.2
24
Freescale Semiconductor
VDD
A nt
Sw
R F IN _ P (P A O _P )
LN A
B a lun
L1
R F IN _ M (P A O _ M )
B yp ass
M C 1320 2/03
VDDA
C T _ B ias
(A nt S w C tl)
PAO_P
B a lun
PAO_M
B yp ass
Using External Antenna Switch with LNA
RX Antenna
L2
L3
L1
RFIN_P (PAO_P)
RFIN_M (PAO_M)
TX Antenna
MC13202/03
VDDA
Bypass
L4
Bypass
L5
CT_Bias
PAO_P
PAO_M
Using Dual Antenna
Figure 14. Dual Port RF Configuration Examples
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
25
9.2
Controlling RF Modes of Operation
Use of the RF interface pins and RF modes of operation are controlled through several bits of modem
Control_B Register 07. Figure 15 shows the model for Register 07 with the RF interface control bits
highlighted.
0
0
0
1
1
7
6
5
r/w
0
8
0
4
3
2
1
0
doze_en
miso_hiz_en
0
9
hib_en
RF_switch_mode
r/w r/w r/w r/w r/w
10
use_strm_mode
11
rx_done_mask
12
tx_done_mask
13
0x07
clko_doze_en
14
ct_bias_inv
TYPE
15
ct_bias_en
BIT
tmr_load
Register 07
r/w r/w r/w
r/w
r/w
0
0
0
0
0
0
0
0
RESET
0x0C00
Figure 15. Control_B Register 07 Model
The RF interface control bits include:
• RF_switch_mode (Bit 12) — This bit selects Dual Port Mode versus Single Port Mode:
— The default condition (Bit 12 = 0) is Dual Port Mode where the RF inputs are RFIN_M and
RFIN_P and the RF outputs are PAO_M and PAO_P, and operation is as described in
Section 9.1.2, “Dual Port Operation”. The use of CT_Bias pin in Dual Port Mode is controlled
by Bit 13 and Bit 12.
— When Bit = 1, the Single Port Mode is selected where RFIN_M (PAO_M) and RFIN_P
(PAO_P) become bidirectional pins and operation is as described in Section 9.1.1, “Single Port
Operation”. The use of CT_Bias pin in Dual Port Mode in controlled by Bit 13 and Bit 12.
• Ct_bias_en (Bit 14) — This bit is the enable for the CT_Bias output. When Bit 14 = 0 (default),
the CT_Bias is disabled and stays in a Hi-Z or tri-stated condition. When Bit 14 = 1, the CT_Bias
output is active and its state is controlled by the selected mode (Bit 12), ct_bias_inv, and operation
of the radio.
• Ct_bias_inv (Bit 13) — This bit only affects the state of CT_Bias when Dual Port Mode is selected
and CT_bias is active. The CT_Bias changes state in Dual Port Mode based on the TX or RX state
of the radio. The ct_bias_inv bit causes the sense of the active state to change or invert based on
Bit 13’s setting. In this manner, the user can select the CT_Bias as a control signal for external
components and make the control signal active high or active low.
MC13202 Technical Data, Rev. 1.2
26
Freescale Semiconductor
Table 10 summarizes the operation of the RF interface control bits.
Table 10. RF Interface Control Bits
Bit
Designation
Default
Operation
14
ct_bias_en
0
1 = CT_Bias enabled. Output state is defined by Table 11.
0 = CT_Bias disabled. Output state is tri-stated.
13
ct_bias_inv
0
The output state of CT_Bias under varying conditions is defined in Table 11. This bit only
has effect for dual port operation.
1 = CT_Bias inverted.
0 = CT_Bias not inverted
12
RF_switch_mode
0
1= Single Port Mode selected where RF switch is active and RFIN_M and RFIN_P and
bidirectional signals.
0 = Dual Port Mode selected where RFIN_M and RFIN_P are inputs only and PAO_P
and PAO_N are separate outputs.
(This is default operation).
9.3
RF Control Output CT_Bias
CT_Bias is a useful signal for interface with external RF components. It must be enabled via the ct_bias_en
control bit, and then its state is determined first by the selected RF mode and then by the active state of the
radio, i.e., whether a TX or RX operation is active:
• Single Port Operation — In this mode, the CT_Bias can be used to establish the proper DC bias
voltage to a balun depending on the RX state versus TX state as described in Section 9.1.1, “Single
Port Operation”. Note that in single port operation, the ct_bias_inv has no effect and CT_Bias is at
VDDA for TX and is at ground for RX
• Dual Port Operation — In this mode, the CT_Bias can be used as a control signal to enable a LNA
or PA or to determine the direction of an antenna switch as described in Section 9.1.2, “Dual Port
Operation”. In dual port operation, ct-bias_inv is used to control the sense of the output control,
i.e., CT_Bias can be active high or active low for TX and vice-versa for RX
Table 11 defines the CT_Bias output state depending on control bits and operation mode of the modem.
Note that the output state is also defined in Idle, Hibernate, and Doze state as well as RX and TX operation.
Table 11. CT_Bias Output vs. Register Settings
Mode
CT_Bias_en
RF_switch_mode
CT_Bias_inv
CT_Bias
RX
1
1
0
0
RX
1
1
1
0
RX
1
0
0
0
RX
0
X
X
Hi-Z
RX
1
1
0
1
TX
1
1
0
1
TX
1
1
1
1
TX
1
0
0
1
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
27
Table 11. CT_Bias Output vs. Register Settings (continued)
9.4
Mode
CT_Bias_en
RF_switch_mode
CT_Bias_inv
CT_Bias
TX
1
0
1
0
TX
0
X
X
Hi-Z
Idle
1
X
X
0
Idle
0
X
X
Hi-Z
Doze
1
X
X
0
Doze
0
X
X
Hi-Z
Hibernate
1
X
X
0 (Low-Z)
Hibernate
0
X
X
Hi-Z
Off
X
X
X
Unknown
RF Single Port Application with an F Antenna
Figure 16 shows a typical single port RF application in which part count is minimized and a printed copper
F antenna is used for low cost. Only the RFIN port of the MC13202 is required because the differential
port is bi-directional and uses the on-chip T/R switch. Matching to near 50 Ohms is accomplished with L1,
L2, L3, and the traces on the PCB. A balun transforms the differential signal to single-ended to interface
with the F antenna.
The proper DC bias to the RFIN_x (PAO_x) pins is provided through the balun. The CT_Bias pin provides
the proper bias voltage point to the balun depending on operation, that is, CT_Bias is at VDDA voltage for
transmit and is at ground for receive. CT_Bias is switched between these two voltages based on the
operation. Capacitor C2 provides some high frequency bypass to the DC bias point. The L3/C1 network
provides a simple bandpass filter to limit out-of-band harmonics from the transmitter.
U5
L1
PAO_M
PAO_P
RFIN_P
RFIN_M
CT_Bias
6
5
2
1
3
L2
6.8nH
L4
MC1320x
R1
0R
Z1
1.8nH
3
1
2
5
4
6
LDB212G4005C-001
L3
3.9nH
C1
1.0pF
R2
0R
Not Mounted
ANT1
F_Antenna
1.8nH
2
3
4
5
1
C2
10pF
J1
SMA_edge_Receptac
Figure 16. RF Single Port Application with an F-Antenna
MC13202 Technical Data, Rev. 1.2
28
Freescale Semiconductor
10 Packaging Information
PIN 1
INDEX AREA
0.1
0.1
C
2X
5
A
M
C
0.1
2X
C
G
1.0
0.8
1.00
0.75
0.05
C
5
5
(0.25)
0.05
0.00
(0.5)
C
SEATING PLANE
DETAIL G
VIEW ROTATED 90° CLOCKWISE
M
B
0.1
C
A
DETAIL M
PIN 1 INDEX
3.25
2.95
EXPOSED DIE
ATTACH PAD
25
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
3. THE COMPLETE JEDEC DESIGNATOR FOR THIS
PACKAGE IS: HF-PQFP-N.
4. CORNER CHAMFER MAY NOT BE PRESENT.
DIMENSIONS OF OPTIONAL FEATURES ARE FOR
REFERENCE ONLY.
5. COPLANARITY APPLIES TO LEADS, CORNER
LEADS, AND DIE ATTACH PAD.
6. FOR ANVIL SINGULATED QFN PACKAGES,
MAXIMUM DRAFT ANGLE IS 12°.
B
32
24
1
0.25
3.25
2.95
0.1
A
C
B
0.217
0.137
16
32X
0.5
8
17
32X
0.3
VIEW M-M
0.217
0.137
N
9
0.5
28X
0.30
0.18
(0.25)
0.1
M
C
0.05
M
C
A
(0.1)
B
DETAIL S
PREFERRED BACKSIDE PIN 1 INDEX
(45 5)
32X
0.065
0.015
DETAIL S
0.60
0.24
(1.73)
0.60
0.24
(0.25)
DETAIL N
DETAIL N
PREFERRED CORNER CONFIGURATION
DETAIL M
PREFERRED BACKSIDE PIN 1 INDEX
CORNER CONFIGURATION OPTION
4
4
5
1.6
1.5
DETAIL T
BACKSIDE
PIN 1 INDEX
(90 )
0.475
0.425
2X
R
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
0.39
0.31
0.25
0.15
DETAIL M
BACKSIDE PIN 1 INDEX OPTION
2X
0.1
0.0
DETAIL T
BACKSIDE PIN 1 INDEX OPTION
Figure 17. Outline Dimensions for QFN-32, 5x5 mm
(Case 1311-03, Issue E)
MC13202 Technical Data, Rev. 1.2
Freescale Semiconductor
29
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Document Number: MC13202
Rev. 1.2
05/2007
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