AOSMD AO7413 P-channel enhancement mode field effect transistor Datasheet

AO7413
P-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AO7413 uses advanced trench technology to provide
excellent RDS(ON), low gate charge, and operation with gate
voltages as low as 1.8V, in the small SOT323 footprint. It
can be used for a wide variety of applications, including load
switching, low current inverters and low current DC-DC
converters. It is ESD protected to 2KV HBM. Standard
Product AO7413 is Pb-free (meets ROHS & Sony 259
specifications). AO7413L is a Green Product ordering
option. AO7413 and AO7413L are electrically identical.
VDS (V) = -20V
ID = -1.4A (VGS = -10V)
RDS(ON) < 113mΩ (VGS = -10V)
RDS(ON) < 135mΩ (VGS = -4.5V)
RDS(ON) < 180mΩ (VGS = -2.5V)
D
SC-70
(SOT-323)
Top View
G
G
D
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
TA=25°C
Continuous Drain
Current A
Pulsed Drain Current
ID
IDM
TA=70°C
B
Junction and Storage Temperature Range
Alpha & Omega Semiconductor, Ltd.
±12
V
-3
0.35
W
0.22
TJ, TSTG
°C
-55 to 150
Symbol
t ≤ 10s
Steady-State
Steady-State
A
-1.2
PD
TA=70°C
Thermal Characteristics
Parameter
Maximum Junction-to-Ambient A
Maximum Junction-to-Ambient A
Maximum Junction-to-Lead C
Units
V
-1.4
TA=25°C
Power Dissipation A
Maximum
-20
RθJA
RθJL
Typ
300
350
280
Max
360
425
320
Units
°C/W
°C/W
°C/W
AO7413
Electrical Characteristics (T J=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
Conditions
Min
ID=-250µA, VGS=0V
-20
-2.5
±1
µA
VDS=0V, VGS=±12V
±10
µA
-1.4
V
Gate Threshold Voltage
VDS=VGS ID=-250µA
-0.7
VGS=-4.5V, V DS=-5V
-15
VGS=-10V, I D=-1.4A
TJ=125°C
VGS=-4.5V, I D=-1.3A
VGS=-2.5V, I D=-1.1A
gFS
Forward Transconductance
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
Maximum Body-Diode Continuous Current
VDS=-5V, ID=-1.4A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg
Total Gate Charge
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
-0.9
A
94
113
130
160
111
135
mΩ
180
mΩ
150
5
-0.84
512
VGS=0V, VDS=-10V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
VGS=-4.5V, VDS=-10V, ID=-1.4A
VGS=-4.5V, VDS=-10V, RL=7.1Ω,
RGEN=3Ω
-0.95
V
0.6
A
620
pF
77
pF
62
pF
9.2
13
Ω
4.9
6
nC
3.5
nC
3.7
nC
11
13
ns
8
10
ns
34
41
ns
12
15
ns
ns
nC
Turn-Off DelayTime
tf
Turn-Off Fall Time
trr
Body Diode Reverse Recovery Time
IF=-1.4A, dI/dt=100A/µs
12.9
16
Body Diode Reverse Recovery Charge
IF=-1.4A, dI/dt=100A/µs
3.9
5
A: The value of R θJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using 80µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The SOA
curve provides a single pulse rating.
Rev3: August 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
mΩ
S
tD(off)
Qrr
µA
VDS=0V, VGS=±10V
On state drain current
IS
Units
-0.5
TJ=55°C
ID(ON)
Static Drain-Source On-Resistance
Max
V
VDS=-16V, VGS=0V
VGS(th)
RDS(ON)
Typ
AO7413
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
-5V
-9V
-8V
-7V
-6V
20
-ID (A)
10
-10V
15
-4V
VDS=-5V
8
-3.5V
6
-ID(A)
25
-3V
10
-2.5V
125°C
-2V
5
4
2
25°C
VGS=-1.5V
0
0
0
1
2
3
4
5
0
0.5
180
VGS=-2.5V
Normalized On-Resistance
RDS(ON) (mΩ)
1.5
1.6
160
140
VGS=-4.5V
120
VGS=-10V
100
80
2
2.5
3
3.5
VGS=-2.5V
ID=-1.1A
1.4
VGS=-4.5V
ID=-1.3A
1.2
VGS=-10V
ID=-1.4A
1
0.8
0
1
2
3
4
0
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+01
360
ID=-1.4A
320
1.0E+00
280
1.0E-01
240
1.0E-02
200
-IS (A)
RDS(ON) (mΩ)
1
-VGS(Volts)
Figure 2: Transfer Characteristics
-VDS (Volts)
Fig 1: On-Region Characteristics
125°C
125°C
25°C
1.0E-03
1.0E-04
160
25°C
1.0E-05
120
1.0E-06
80
0
2
4
6
8
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
0.0
0.4
0.8
-VSD (Volts)
Figure 6: Body-Diode Characteristics
1.2
AO7413
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
5
800
VDS=-10V
ID=-1.4A
Capacitance (pF)
-VGS (Volts)
4
3
2
1
Ciss
600
400
Coss
Crss
200
0
0
0.0
1.0
2.0
3.0
4.0
5.0
0
6.0
RDS(ON)
limited
100µs
0.1s
10ms
10s
0
0.001
1
10
100
Figure 9: Maximum Forward Biased Safe
Operating Area (Note E)
ZθJA Normalized Transient
Thermal Resistance
D=Ton/T
TJ,PK=TA+PDM.ZθJA.RθJA
RθJA=360°C/W
0.01
0.1
1
10
100
1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toAmbient (Note E)
-VDS (Volts)
10
6
2
DC
0.01
0.1
8
4
1s
0.10
20
10
10µs
1ms
1.00
15
TJ(Max)=150°C
TA=25°C
12
Power (W)
-ID (Amps)
14
TJ(Max)=150°C
TA=25°C
10.00
10
-VDS (Volts)
Figure 8: Capacitance Characteristics
-Qg (nC)
Figure 7: Gate-Charge Characteristics
100.00
5
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
PD
0.1
Ton
T
Single Pulse
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.
100
1000
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