GDU 90 20722 GDU 90-20722 Gate Drive Unit Replaces March 1998 version, DS4568-3.1 DS4568-4.0 January 2000 This datasheet should be used in conjunction with the application note AN4571, GDU9X-XXXXX Series, Gate Drive Unit. KEY PARAMETERS APPLICATIONS IFGM IG(ON) dIGQ/dt ■ Used with Gate Turn-Off Thyristors in high current switching applications 40A 10A 50A/µs CONDITIONS - (UNLESS STATED OTHERWISE) V1 = +5V V2 = +15V V3 = -15V Test circuit GTO DG858BW GDU connection to GTO 500mm CO - AX cable type RC5327230 (2 cables in parallel) Test circuit emitter and gate drive emitter Honeywell sweetspot HFE 4020 - 013 Test circuit emitter current 30mA Test circuit receiver and gate drive receiver Honeywell sweetspot HFD 3029 - 002 ELECTRICAL CHARACTERISTICS Symbol Conditions Parameter Min. Typ. Max. Units IV1 +5V PSU current 500Hz, 50% duty cycle - - 5.5 A IV2 +15V PSU current 500Hz - - 0.70 A IV3 -15V PSU current 500Hz, IT = 3000A GTO Tj= 125˚C - - 12 A V1(Min) +5V PSU minimum - 3.8 - - V V2(Min) +15V PSU minimum - 14.0 - - V V3(Min) -15V PSU minimum - 14.0 - - V IFGM Peak forward gate current - 40 - - A IG(ON) On-state gate current - - 10 - A dIFG/dt Rate of rise of positive gate current Measured 10 - 75% IFGM - 40 - A/µs dIGQ/dt Rate of rise of negative gate current IT = 3000A, 90% IG(ON) - 50% IGQM - 50 - A/µs 1/4 GDU 90 20722 TIMING CHARACTERISTICS Symbol t1*† Conditions Min. Typ. Max. Units Adjustable by R81 + R82 2 - 3 µs Parameter No response pulse width of input signal t2 Delay time emitter current to receiver o/p - 0.4 - 0.8 µs t3*† Turn-on delay emitter current to 10% IFGM - 5.2 - 6.2 µs t4 IFGM pulse width - - 25 - µs t5* Minimum on time 10% IFGM to 90% IG(ON) Adjustable by R37 80 - 110 µs t6 Receiver storage time - 0.5 - 0.9 µs t7 Turn-off delay. Emitter current to 90% IG(ON) - 1.5 - 2.3 µs t8* Minimum off time 90% IG(ON) to 10% IFGM Adjustable by R38 80 - 110 µs t9 Delay time Gate volts to o/p emitter current - - 0.1 - µs t10 Turn-off delay Gate volts to test receiver o/p - - 0.7 - µs t11 Storage time Gate volts to o/p emitter current Measured at low IGQM - 0.11 - µs t12 Turn-on delay Gate volts to test receiver o/p Measured at low IGQM - 0.81 - µs * t1,t3,t5,t8 are factory settings. † Adjustment of t1 alters t3. 1. Varies with IGQM due to gate lead impedance. t1 Test circuit emitter current t2 t6 10µs t7 dIFG/dt 10% t4 t3 t5 Min. ON time dIGQ/dt t8 0V Gate voltage Control card emitter current Test circuit receiver output 2/4 90% IG(ON) QGQT IGQM Gate current IFGM Gate Drive Unit Waveforms Control card receiver output Min. OFF -8V -8V t9 t11 t10 t12 GDU 90 20722 OUTLINE Clearance underneath P.C.B. for mounting nuts etc. 13 0V V3 V2 V1 5 10 200 centres 220 I/P Gate Fibre optics Cathode O/P 4 holes Ø4.4 72 253 centres 279 Weight: 2.12Kg All dimensions in mm, unless stated otherwise. DO NOT SCALE. 3/4 GDU 90 20722 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS4568-4 Issue No. 4.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 4/4