Intersil ISL6295 Low voltage fuel gauge Datasheet

ISL6295
®
Data Sheet
October 25, 2005
FN9074.0
Low Voltage Fuel Gauge
Features
The ISL6295 is a cost-effective, highly accurate IC that
measures, stores, and reports all of the critical parameters
required for rechargeable battery monitoring with a minimum
of external components. It precisely measures charge/
discharge current as well as voltage and temperature of a
battery pack. In addition, the ISL6295 accurately
accumulates both charge and discharge current as
independent parameters. Temperature history can also be
maintained for calculating self-discharge effects.
• Measures, maintains, and reports all critical rechargeable
battery parameters with high accuracy
The ISL6295 integrates a highly accurate 16-bit (15-bit plus
sign) integrating A/D converter that performs calibrated
current measurement to within ±0.5% error. On-chip
counters precisely track battery charge/discharge and
temperature history. Also included are an on-chip voltage
regulation circuit, non-crystal time base, and on-chip
temperature sensor. The operating voltage range of the
ISL6295 is optimized to allow a direct interface to a single
cell Li-Ion/Li-Poly pack. 256 bytes of general-purpose
nonvolatile EEPROM storage are provided to store factory
programmed, measured, and user defined parameters.
• Accumulation of charge current, discharge current,
temperature, and voltage in independent 32-bit registers
Efficient communication is provided through an industry
standard SMBus/I2C™ compatible 2-wire communications
interface. This interface allows the host to determine
accurate battery status for effective system power
management and for communication to the end user. A
battery management solution utilizing the ISL6295 delivers
both space and total system component cost savings for a
wide variety of battery operated applications.
• NTC pin can be configured as a thermistor input or GPIO
Ordering Information
PART
NUMBER
TEMP
RANGE (°C)
PKG.
PACKAGE DWG. #
6295CV
-20°C to 85
8 Ld TSSOP M8.173
ISL6295CV-T 6295CV
-20°C to 85
8 Ld TSSOP M8.173
ISL6295CV
PART
MARKING
• Supports Lithium Ion and Lithium Polymer battery packs
• Current measurement with 16-bit (15-bit plus sign)
integrating A/D accurate to less than ±0.5% error
• Calibrated temperature measurement accurate to within
±3°C absolute using on-chip temp sensor or external
thermistor
• 256-byte nonvolatile EEPROM stores factory
programmed, measured, and user-defined parameters
• In-system offset calibration compensates for offset error in
current measurement
• Industry standard SMBus/I2C™ compatible 2-wire
communications interface
- SMBus V1.1 with PEC/CRC-8 communication
• -20°C to +85°C operating temperature range
• GPAD pin can be configured as an independent A/D input
or GPIO
• Flexible power operating modes allow low-power
monitoring of battery conditions during system full
operating and standby conditions:
- Run: Continuous Conversion; 85µA typ.
- Sample: Sample interval from 0.5-64s @ 45µA typ.
- Sample-Sleep: Sample interval from 0.5-138s min. @
20µA typ.
• Shelf-Sleep mode reduces power consumption to pack
storage conditions to 300nA typ., with automatic wake-up
upon pack insertion.
Applications
• Notebook PC, PDAs, Hand Held Devices
Pinout
ISL6295 (TSSOP)
TOP VIEW
1
GPAD/IO1
1
8
SR
VP
2
7
GND
SCL
3
6
NTC/IO0
SDA
4
5
ROSC
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL6295
Absolute Maximum Ratings
Thermal Information
Supply Voltage VP . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 10V
Input Voltage or IO Voltage . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Thermal Resistance (Typical, Note 1)
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-20°C to 85°C
Operating Supply Voltage (VP Pin) . . . . . . . . . . . . . . . . . 2.8V to 7V
θJA (°C/W)
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
115
Maximum Junction Temperature (Plastic Package) . . . . . . . . 120°C
Maximum Storage Temperature Range . . . . . . . . . . . -35°C to 120°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational section of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Typical Values Are Tested at VP = 5V and ambient temperature is at 25°C, All Maximum and Minimum Values
Are Guaranteed Under the Recommended Operating Conditions., Unless Otherwise Noted.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Supply Voltage
VP
Supply Current Run Mode
IDD
For SMBus and register access
2.8
7.0
V
For EEPROM write
3.3
7.0
V
For guaranteed analog parametrics
3.0
7.0
V
A/D Active (Note 1)
85
120
µA
Supply Current Sample Mode
IDDINS
A/D Inactive (Notes 1, 2)
45
85
µA
Supply Current Sample - Sleep Mode
IDDSLP
Sample -Sleep Mode (Note 1)
20
40
µA
Shelf Sleep Mode (Note 1)
400
800
nA
0.6
V
Supply Current Shelf Sleep Mode
IDDSSLP
Input Low Voltage IO0, IO1
VIL
Input High Voltage IO0, IO1
VIH
2.4
V
GPIO Input Low Current Pull-up mode
IIL-IO0PU
7
Leakage Current IO pin programmed
as outputs or inputs without pullup
IL-IO
1
Output low voltage for IO0, IO1
VOL-IO
IOL = 0.5mA
Output high voltage for IO0 configured
as push-pull
VOH-IO
IOH = 100µA
Thermistor Output Current
INTC
ROSC = 221kΩ ± 0.1%
Input Low Voltage for SMBus pins
VIL-SMB
Input High Voltage for SMBus pins
VIH-SMB
Output Low Voltage for SMBus pins
VOL-SMB
IPULLUP = 4mA
Output High Voltage for SMBus pins
VOH-SMB
(Note 3)
Input leakage current SMBus pins
600
nA
0.4
V
2.1
V
16
µA
0.8
V
5.5
V
0.4
V
2.1
5.5
V
-5.0
+5.0
µA
8
13
2.0
ILEAK-SMB
µA
AC CHARACTERISTICS (TA = -20°C to +85°C; VP = 3.0V to 7.0V; ROSC = 221kΩ ± 0.1%)
Internal main oscillator frequency
fRC
Internal auxiliary oscillator frequency
fAUX
Accumulator Time Base Accuracy
(internal 2Hz clock)
fACC
Internal A/D operating clock
fA/D
Power-on-Reset Threshold
VPOR
Delay to entry of Shelf-Sleep mode
2
tSHELF
ROSC = 221kΩ ± 0.1%
130.8
131.5
132.2
kHz
118
131
144
kHz
During Run and Sample mode
(Note 3)
-0.6
+0.6
%
During Sample-Sleep mode (Note 3)
-10
+10
%
fRC/4
(Note 3)
Voltage at VP
(Shent = 1 or VP < VPtrip) and (SDA
and SCL go low)
2.4
kHz
2.75
10
V
ms
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ISL6295
Electrical Specifications
Typical Values Are Tested at VP = 5V and ambient temperature is at 25°C, All Maximum and Minimum Values
Are Guaranteed Under the Recommended Operating Conditions., Unless Otherwise Noted. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
15
bits
-152
+152
mV
0
309
mV
-3
3
°K
A/D CONVERTER CHARACTERISTICS (TA = -20°C to +85°C; VP = 3.0V to 7.0V, Note 3, 4)
A/D Converter Resolution
N
Magnitude only (Note 5)
A/D Conversion Measurement Time
tconv
N-bit + sign
A/D Converter Input Voltage Range
(internal)
VADIN
Differential
Internal Temperature Accuracy
TACC
Single-Ended
8
2(N+1)/fA/D
s
Calibrated Voltage Measurement
Gain Error
EVGAIN
Max deviation over supply voltage
and temperature range (assumed
ideal under the calibration condition)
0.60
%
Calibrated Current Measurement
Gain Error (with ideal ZTC current
sense resistor)
EIGAIN
Max deviation over supply voltage
and temperature range (assumed
ideal under the calibration condition)
0.50
%
Calibrated Temperature Measurement
Gain Error (internal sensor)
ETEMP
Max deviation over supply voltage
and temperature range (assumed
ideal under the calibration condition)
0.60
%
EVOFFSET
Max deviation over supply voltage
and temperature range (assumed
ideal under the calibration condition)
VREF = 170mV
0.30
%
VREF = 340mV
0.15
%
0.01
%
Calibrated ADC Offset Error
Integrated Nonlinearity Error
EINL
NOTES:
1. Does not include current consumption due to external loading on pins. No EEPROM access.
2. Sample mode current is specified during an A/D inactive cycle. Sample mode average current can be calculated using the formula: Average
Sample Mode Supply Current = (IDDRUN + (n-1)*IDDINS)/Ns; where Ns is the programmed sample rate.
3. Guaranteed by characterization or correlation to other test.
4. The max calibrated gain and offset errors are based on a 15-bit calibration procedure to generate the calibration factors. These calibration
factors are then applied to correct the ADC results.
5. Voltage is internal at A/D converter inputs. VSR is measured directly. VP and GPAD inputs are measured using internal level-translation circuitry
that scales the input voltage range appropriately for the converter.
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ISL6295
1
Cell +
R1
1K
U2
MM3077DN
CELL CONNECTION
5
C1
100nF
4
6
VDD
VCOUT
3
VSS DOUT
1
DS
RT1
THERMISTOR
2
t
C3
C2
100nF 1.0nF
J2
1
F1
5
4
R4
221K 0.1%
2
3
1
8
Cell PLACE THERMAL
FUSE NEXT TO Q1
ON PCB LAYOUT
J3B+
1
2
U1
ISL6295
VP
SCL
3
6
NTC
SDA
4
5
ROSC
1
GPAD
7
GND
SR
R6
680
R7
680
D1
CMSZDA5V6
8
J4 C
1
J5D
1
J6 B
1
R2
1K
6
7
Q1
SI6880EDQ
R5
0.020 1%
Note: Connect NTC pin to ground if thermister is not used
FIGURE 1. ISL6295 APPLICATIONS SCHEMATIC
Functional Pin Descriptions
Theory of Operation
GPAD/IO1 (Pin 1)
The ISL6295 contains a complete analog "front-end" for
battery monitoring as well as digital logic for control,
measurement accumulation, timing, and communications.
Major functions within the ISL6295 include:
General purpose A/D input or general purpose input/output
pin. Grounded if not used.
VP (Pin 2)
Cell input connection for the positive terminal of the Li-Ion
cell. Connects to the positive terminal of 1-cell series packs.
VP serves as the power supply input for the ISL6295.
SCL (Pin 3)
SMBus/I2C™ clock line connection
SDA (Pin 4)
SMBus/I2C™ data line connection
ROSC (Pin 5)
External bias resistor. 221kΩ (±0.1%) oscillator reference
setting resistor connected between this pin and GND.
NTC/IO0 (Pin 6)
Connection for an external temperature sensor using a
thermistor. Can also be configured as an open drain general
purpose input/output pin. Grounded if not used.
• Voltage Regulator
• Precision Time Base
• Temperature Sensor
• 256 Byte NV-EEPROM
• 32 Byte general purpose SRAM
• Analog-to-Digital (A/D) Converter
• 32-bit Accumulators/Timers
• SMBus/I2C™ Communications Interface
Figure 2 is a block diagram of the internal circuitry of the
ISL6295. Figure 1 is a schematic diagram that depicts the
ISL6295 in a typical single cell Lithium-ion application. The
function of each of the blocks listed above is summarized in
the following sections.
GND (Pin 7)
Analog and digital ground
SR (Pin 8)
Current measurement A/D input. Connects to the other
terminal of a grounded current sense resistor.
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ISL6295
ANALOG SECTION
DIGITAL SECTION
32-BIT
ACCUMULATORS/
TIMERS
256
EEPROM
SDA
SCL
REGISTERS
COMM
INTERFACE
VOLTAGE
REFERENCE AND
TEMP SENSOR
16-BIT
SIGMA-DELTA
INTEGRATING
A/D CONVERTER
VOLTAGE
REGULATOR
ANALOG
INPUT MUX
VP
SR
CONTROL
AND
STATUS
RUN
OSCILLATOR
SLEEP
OSCILLATOR
NTC/IO0
GPAD/IO1
ROSC
GND
FIGURE 2. BLOCK DIAGRAM
Internal Voltage Regulator
A/D Converter
The ISL6295 incorporates an internal voltage regulator that
supports 1-cell series lithium pack configurations. The
internal regulator draws power directly from the VP input. No
other external components are required to regulate circuit
voltage.
The ISL6295 incorporates an integrating sigma-delta A/D
converter together with an analog MUX that has inputs for
charge and discharge currents, pack voltage, GPAD voltage,
the on-chip temperature sensor, and an off-chip thermistor.
The converter can be programmed to perform a conversion
with magnitude resolution of 8- to 15-bits while using either a
single 170mV or 340mV reference.
Precision Time Base
The integrated precision time base is a highly accurate RC
oscillator that provides precise timing for the sigma-delta A/D
and for the on-chip elapsed time counters without the need
for an external crystal. This time base is trimmed during
manufacturing to a nominal frequency of 131.072kHz.
Temperature Sensor
An integrated temperature sensor is provided that can
eliminate the need for an external thermistor. As an option, a
connection is provided for an external thermistor for
applications where the battery pack is physically located at a
distance from the ISL6295.
EEPROM
256 bytes of EEPROM memory is incorporated for storage
of non-volatile parameters such as cell models for use with
Intersil’s host driver firmware. An an initialization block with
values that are loaded into ISL6295 registers following a
power on condition. Included in this block is 16 bytes for
battery ID information.
32-Bit Accumulator/Timers
The ISL6295 incorporates four 32-bit accumulators and four
32-bit elapsed time counters. The Discharge Current
Accumulator (DCA) and the Charge Current Accumulator
(CCA) are intended to record discharge and charge capacity
values. The Discharge Time Counter (DTC) and the Charge
Time Counter (CTC) are intended to maintain the total
discharge time and charge time. Accumulated charge and
discharge values can be used to determine state of charge
of the battery as well as cycle count information. With
information provided by the elapsed time counters, average
charge and discharge currents over an extended period of
time can be calculated.
SMBus/I2C™ Communications Interface
This communications port for the ISL6295 is a 2-wire
industry-standard SMBus/I2C™ interface. All commands,
status, and data is read or written from the host system via
this interface.
RAM
A/D and Accumulator/Timer Operation
32 bytes of general purpose RAM memory are provided for
storage of temporary parameters.
A/D CONVERSION CYCLE
5
When the A/D converter is enabled and active, it repeatedly
performs a cycle of 1 to 8 conversions as programmed by
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the user through 8 A/D control registers. These registers
determine the input source, conversion resolution, reference
voltage, and sequence of conversions during an A/D
conversion cycle. During the cycle, the A/D logic accesses
each register in sequence and performs the conversion
specified by the bits within the registers. Each register
contains an enable bit, a resolution field, a select bit for
single-ended (340mV reference) or differential (170mV
reference) conversion, and a select field for the analog input
multiplexer. The result from each conversion is stored in one
of eight corresponding 16-bit result registers.
If the “Enable” bit is set within a control register, a conversion
will be performed. If it is disabled, that conversion will be
skipped and the logic will move on to the next register. In this
manner, the user can specify a sequence of conversions that
will be performed during each A/D cycle.
As stated above, the input source for each of the registers is
programmable. The 3-bit MUX field within each control
register selects one of seven possible input sources for the
A/D conversion. The list of input sources is as follows:
• Charge/discharge Current (Voltage from SR pin to GND)
• Internal temperature sensor
• External thermistor (Constant current source on NTC pin)
• Battery pack voltage
• Reserved
The 3-bit “resolution” field in each A/D control register
determines the magnitude resolution of the conversion, from
a minimum of 8-bits to a maximum of 15-bits. The time
required to complete the conversion is a function of the
number of bits of resolution selected. The conversion time
can be calculated as follows:
TADC = 30.52µs * 2(N+1)
where “N” is the number of bits of magnitude resolution
selected
The “Ref” bit selects either a differential or single-ended
conversion. For differential conversions, the 170mV
reference is used. For single-ended conversion the 340mV
reference is selected. Single-ended conversions would be
used for measurements of pack voltage while a differential
conversion is required for current measurement.
The value of the LSB in the result register is as follows:
For single-ended conversion,
A/D LSB = 340 mV/215 = 10.38µV
For differential conversion,
A/D LSB = 170 mV/215 = 5.19µV
For both differential and single-ended conversions, the result
value is given in sign-magnitude format (i.e. a sign bit and 15
magnitude bits). When N less than 15 is selected, the
conversion result is padded with trailing zeroes. Note that
15
• General purpose A/D voltage
S
• ADC offset (Conversion performed with ADC input
internally shorted to ground) to determine offset error
associated with the converter
However, the accumulator/timer functions are “hard-wired” to
specific A/D result registers. For this reason, the control/
result registers are given names which indicate their primary
intended usage:
A/D
CONTROL RESULT
REGISTER REGISTER REGISTER
INTENDED
INPUT SOURCE
0
Ictrl
Ires
Battery Pack Current
(via sense resistor)
1
ITctrl
ITres
Internal Temperature Sensor
2
ETctrl
ETres
External Temperature
Sensor
3
VPctrl
VPres
Battery Pack Voltage
4
Reserved
5
GPADctrl
GPADres
General Purpose A/D Input
6
OFFSctrl
OFFSres
Internal ADC offset voltage
(with input grounded)
7
AUXctrl
AUXres
Any
14
0
Magnitude
the single-ended reference should not be used for a
negative measurement. Though the sign-magnitude value
presented may still look valid, the accumulator will not be
able to interpret the result for proper accumulation.
CURRENT MEASUREMENT
Charge and discharge currents are measured using a 5 to
600mΩ sense resistor that is connected between the SR and
GND pins. The sense resistor value chosen must
accommodate the system’s lowest and highest expected
charge and discharge currents, including suspend and
standby currents, while maintaining a voltage of no more
than +152mV presented at the SR pin.
In order to perform charge and discharge current
measurements, the Ictrl register must be programmed with
the SR pin as the analog input source. If charge and
discharge accumulation is desired, the Ictrl and
corresponding Ires registers should be used to select current
measurement since the DCA, DTC, CCA, and CTC registers
are updated by the measurement results from the Ires
register.
When a 20mΩ sense resistor is used, the value of the LSB in
units of current is:
5.19µV/20mΩ = 259.5µA
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Ictrl programming in a typical application is as follows:
BIT(s)
NAME
VALUE
FUNCTION
7
EN
1
6-4
Res
111
3
Ref
0
Selects 170mV Reference
2-0
Sel
000
Selects VSR as ADC input
ENABLES A/D CONVERSION
Selects 15-bit resolution
VOLTAGE MEASUREMENTS
An analog multiplexer and divider network is provided to
support measurement of battery pack voltages. The A/D
control registers VPctrl and GPADctrl are used to specify the
measurement to be made. In typical applications, voltage
measurement a pack level is done using the 340mV
reference and a 10-bit magnitude resolution.
The value of the LSB in a pack voltage measurement using
the 340mV reference voltage and 15 bit resolution is given
by the formula:
VPACK LSB = 10.2V/215 = 311.3µV
VPctrl programming in a typical application is as follows:
BIT(s)
NAME VALUE
FUNCTION
For temperature measurement using an external sensor, the
NTC pin sources a current of 12.5µA. For proper operation,
an industry standard 10kΩ at 25°C negative temperature
coefficient (NTC) device with a proper resistance range
should be connected between the NTC and GND pins. The
NTC reference output is only enabled during an external
temperature measurement in order to minimize power
consumption.
Defined within the ETctrl register are settings for the
reference utilized and the resolution desired for
measurement of temperature using the external temperature
sensor. The accuracy of temperature measurement using
the external thermistor is directly determined by the
characteristic of the NTC device used. It is suggested that
temperature measurements be thoroughly characterized to
extract the best-fit equation for temperature determination.
Internal to the ISL6295, a voltage inverter is provided to
translate the NTC voltage to a PTC voltage so that a larger
A/D conversion result would correspond to a higher
temperature reading. The actual voltage presented to the
ADC is as follows:
VADC = VREF - VNTC
7
En
1
Enables A/D conversion
where VREF is the reference voltage selected.
6-4
Res
010
Selects 10-bit resolution
3
Ref
1
2-0
Sel
011
For typical NTC devices, the 340mV reference should be
used to cover the expected operational temperature range of
the battery pack. For a NTC with a 10kΩ resistance at 25°C,
the voltage at the NTC pin will be 125mV, which corresponds
to an ADC input of (340-125)mV = 215mV. The expected
conversion result would be 215/340 * 215 = 20721.
Selects 340mV Reference
Selects Vpack (VP) as ADC input
The input source fields for the VPctrl, and GPADctrl registers
must be programmed to select the pack voltage VP and the
general purpose A/D input voltage GPAD in order for these
registers to control their intended measurements.
The measurable input range for VP is from 2.8V to 7V. The
measurable input range for GPAD is from 0V to 6.2V.
TEMPERATURE MEASUREMENTS
A/D input channels are provided for temperature
measurement using either the internal temperature sensor
or an external thermistor.
Defined within the ITctrl register is settings for the reference
utilized and the resolution desired for measurement of
temperature using the internal temperature sensor. Due to
the voltage output range of the temperature sensor, the
340mV reference must be selected.
The temperature measurement given by the internal
temperature sensor is derived using the following equation:
IT(°C) = (ITres – 22421)/78.95 °C
Typically, 10-bit resolution is selected, which results in the
following temperature measurement resolution:
OFFSET COMPENSATION
The host software can perform offset compensation by using
an offset measurement value read from the ISL6295. When
the offset calibration is enabled within the OFFSctrl register,
the converter input is internally shorted to ground and an A/D
conversion is performed at the specified resolution. The
offset value is stored in the OFFSres register.
ACCUMULATION/TIMING
The ISL6295 incorporates four 32-bit accumulators and four
32-bit elapsed time counters. The Discharge Current
Accumulator (DCA) and the Charge Current Accumulator
(CCA) are intended to record discharge and charge capacity
values. The Discharge Time Counter (DTC) and the Charge
Time Counter (CTC) are intended to maintain the total
discharge time and charge time. Accumulated charge and
discharge values can be used to determine state of charge
of the battery as well as cycle count information. With
information provided by the elapsed time counters, average
charge and discharge currents over an extended period of
time can be calculated.
Each of the four 32-bit accumulator registers is assigned a
fixed “source” A/D result register. When the accumulator is
IT(∆) = 0.405°C/LSB
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enabled, it is updated every 0.5s by adding the contents of
the assigned result register value to the previous
accumulated value. The accumulators are listed below with
their assigned source registers:
ABBR.
DCAIres
CCA
TA
GPADA
ACCUMULATOR NAME
SOURCE
Discharge Current Accumulator
Ires (Sign bit = 1)
Charge Current Accumulator
Ires (Sign bit = 0)
Temperature Accumulator
ITres or ETres
GPAD Accumulator
GPADres
The measurement resolution of the accumulated value is
equal to that selected for the associated conversion, up to a
converter resolution of 15-bits. If a 15-bit A/D value is being
accumulated, then the accumulator resolution in microvolt
seconds is:
Accumulator LSB (µVs) = (VREF/215) µV * 0.5s
When the 170mV reference is selected, this value equates
to 2.59µVs per LSB.
CHARGE/DISCHARGE ACCUMULATORS
The DCA accumulator is intended to accumulate discharge
current, and the CCA accumulator is intended to accumulate
charge current. Both accumulators use the Ires register as
its source. For this reason, the lres register should be
programmed for current measurement by selecting the SR
pin as the multiplexed ADC input source.
During charging, the voltage at the SR pin will be negative.
This translates to a positive voltage measurement with the
sign bit set to ‘0’. Whenever the sign bit equals ‘0’, the
measured result will be added to the CCA register contents
and the sum is returned to CCA. In this way, total charge
current is accumulated in the CCA.
Similarly, during discharge, a positive voltage will exist at the
SR pin. In this case, the conversion will result in the sign bit
being set to ‘1’ in the Ires register, indicating a negative
value or discharge current condition. Under this condition,
the DCA register will be updated with the discharge current
measured during that conversion.
The value stored in the DCA or CCA register can be
interpreted as illustrated in the following example. Using a
20mΩ sense resistor, the LSB can expressed in units of
current as follows:
Accumulator LSB (µAs) = Voltage LSB/RSENSE
= 129.5µAs
The “Accum” bit in the AccumCtrl register must be enabled for
accumulation to occur in both the CCA and DCA registers.
CHARGE/DISCHARGE TIME COUNTERS
The Charge Time Counter (CTC) will increment at the rate of
2 counts every second as long as a negative voltage is
measured at the SR pin. The CTC can thereby maintain a
8
time count representing the total time that charge current
has flowed into the battery.
The Discharge Time Counter (DTC) will increment at the rate
of 2 counts every second as long as a positive voltage is
measured at the SR pin. The DTC can thereby maintain a
time count representing the total time that discharge current
has flowed from the battery.
Power Modes
The ISL6295 has five operational power modes: Power-on
Reset, Run, Sample, Sample-Sleep, and Shelf-Sleep. Each
consumes power according to the configuration settings as
described below:
POWER-ON RESET
When power is first applied to the V input, the ISL6295
automatically executes a Power-on Reset sequence. The
device is held in a RESET state while the voltage is below
the minimum operating threshold, VPOR. When the voltage
on the VP pin rises above the VPOR threshold, the ISL6295
will initialize itself by loading the internal counters, data and
control registers with default values pre-written into the nonvolatile EEPROM memory. Please refer to “Register
Initialization” and “Factory Register Initialization” sections for
a detailed description of the register initialization operation.
When this is complete, the ISL6295 will enter the Run Mode.
RUN MODE
During Run mode, the ISL6295 performs continuous A/D
conversion cycles per the programming of the A/D
conversion cycle described in the “A/D Conversion Cycle”
section. During each cycle, one to eight conversions are
performed, and the respective accumulators/time counters
are updated at 0.5s interval using the most recent A/D
conversion results.
Run Mode is entered following a Power-on Reset when the
pack voltage (VPACK) applied to the VP pin rises above the
VPOR threshold. Run Mode can also be entered from the
Sample, Sample-Sleep, and Shelf-Sleep modes as to be
described.
The ISL6295 will remain in RUN mode as long as the pack
voltage is above the VPOR threshold and Sample, SampleSleep, and Shelf-Sleep modes are not active.
SAMPLE MODE
In Sample Mode, A/D measurements are not continuously
performed as in Run Mode. Instead, they are performed at a
user selectable rate. The purpose of Sample Mode is to
reduce power consumption during periods of low rate
change (charge or discharge). The power advantage of
Sample Mode comes from the reduction in frequency of A/D
measurements. The accumulation counters and timers will
continue to run at the rate of 0.5s per update.
Sample Mode is entered by programming the "Samp" bit to
‘1’ in the A/D Configuration register. The ISL6295 will remain
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ISL6295
in Sample mode as long as "Samp" bit equals ‘1’, the VP
voltage is above the VPOR threshold, and the Sample-Sleep
and Shelf-Sleep modes are not active. Run mode will be
resumed when the Samp bit is cleared to ‘0’.
The Sample mode rate is selected using the "SampDiv" bits
within the A/D Configuration Register. The sample interval is
given by (2SampDiv x 0.5) sec. The possible sample rate
intervals are as follows:
"SAMPDIV"
SAMPLE INTERVAL
Value = 0
0.5s
Value = 1
1.0s
Value = 2
2.0s
Value = 3
4.0s
Value = 4
8.0s
Value = 5
16.0s
Value = 6
32.0s
Value = 7
64.0s
In Sample mode, much of the analog circuitry remains on.
Therefore, the power savings is not as great as in SampleSleep Mode described below.
SAMPLE-SLEEP MODE
In Sample-Sleep Mode, the ISL6295 goes into sleep mode and
wakes up at a user-programmed interval to perform a set of
conversions as programmed for the A/D cycle. The purpose of
Sample-Sleep is to achieve the minimum power consumption
possible while periodically measuring specified parameters.
While the ISL6295 is in the sleep portion of the Sample-Sleep
interval, all of the analog circuitry is shut off, and the Sleep
interval time is derived from a less accurate ultra low power onchip oscillator that is separate from the primary oscillator.
During the active portion of Sample-Sleep Mode, a single set of
conversions is performed and RUN mode current will be
consumed for the duration of the measurements. While in
Sample-Sleep mode, the accumulation counters and timers will
still continue to run at an uninterrupted rate of 0.5s per update.
Sample-Sleep Mode is invoked by one of the following actions:
1. Cell voltage on VP drops below the trip point programmed
in the VCtrip register with the corresponding "VPent" bit set
in the TRIPctrl register (If GPAD is grounded). This action
can be used to prevent excessive battery discharge in the
event of a dangerously low cell voltage.
2. If GPAD is used for other analog input, the GPAD voltage
drops below the trip ponit programmed in the VCtrip register
with the corresponding “GPADent” bit set in the TRIPctrl
register.
3. Setting the “SSLP” bit in the OpMode register. The host can
take this action when the system is entering a low power
standby condition, and it is desireable to periodically update
measurements for current, voltage, and/or temperature
accumulation.
4. Magnitude of current measurement is less than the I-trip
register value when "Ient" bit is set in the Tripctrl register.
9
The Sample-Sleep interval is determined by the programming
of the "SampDiv" bits within the ADconfig register, together with
the "SSLPdiv" bits within the OpMode register. The sample
interval is 2SampDivx 2SSLPdivx 0.5sec. The possible SampleSleep interval time therefore ranges from a minimum of 0.5sec
to over 136 minutes.
Exit from Sample-Sleep Mode to Run mode can be
accomplished by clearing the "SSLP" bit or by programming a
wake up based on pack voltage or current. Wake up based on
charge current will occur when the "Iex" bit is set in the TRIPcntl
register and the charging current value is above the threshold
programmed in the I+trip register. Wake up based on pack
voltage will occur when the "VPex" bit is set in the TRIPctrl
register and the pack voltage rises above the threshold
programmed in the VPtrip register.
SHELF-SLEEP MODE
Shelf-Sleep Mode is the lowest power mode and is intended to
preserve battery capacity when the battery pack is shipped or
stored or if the battery voltage drops below a specified
threshold. While in Shelf-Sleep mode, no ADC measurement is
taken, no accumulation is performed, and no SMBus
communications are recognized. In addition, volatile memory is
not maintained.
Entry to Shelf-Sleep Mode is enabled by programming the
“SHELF” bit in the OPmode register to ‘1’ or "Shent" bit in the
TRIPctrl register to ‘1’ and when VP is less than SStrip. The
Shelf Sleep mode will then be entered when the SMBus pins
(both SDA and SCL) drop from a high to a low level for a
minimum time period specified by tSHELF. This action will also
occur if the battery pack is physically disconnected from the
system.
Exit from the Shelf-Sleep mode back to Run mode will occur
when the SMBus pins (both SDA and SCL) are both pulled
from a low to a high state, and remain high for a minimum time
of tWAKE to signify system activity or connection of the pack to
the host.
General Purpose Input/Output
The NTC and GPAD pins have alternate functions of general
purpose I/O. IO0 and IO1 respectively. These pins can be
configured as digital General Purpose Inputs/Outputs if their
normal application functions of temperature and voltage
monitoring are not needed. Their configuration is controlled in
the GPIOctrl register.
The NTC/IO0 pin may be configured as a push-pull output, an
open-drain driver with internal pull-up, or as a three-stated pin.
When configured as a push-pull or open drain output, the
output high voltage is equal to the internally regulated supply
voltage, which is nominally at 3.3V. When the output function is
disabled, an external circuit may drive the pin as an input with a
voltage range of 0-3.3V. The input function may be used
whether or not the pin is driven by the ISL6295. In addition, the
input function may be disabled, in which case, the input buffer is
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ISL6295
powered down to prevent static current drain if the NTC pin
rests at an intermediate level.
and they will inter-operate flawlessly as long as they adhere to
the SMBus electrical specifications.
The GPAD/IO1 pin is similar to that of the NTC/IO0 except it is
an open train only output with no resistive pull-up. Therefore, if
the output is set to a logic 1, the internal pull-down is turned off
and the pin is three-stated. The input function is the same as
IO0.
SMBus DATA TRANSFERS
NOTE: If the IO0 and/or IO1 pins are being used for their analog
functions, their respective GPIO output and input functions must be
disabled. The GPIO function may be totally disabled by clearing the
appropriate GPIOctrl bit.
General Purpose A/D Input
The GPAD/IO1 pin can be used as a general purpose A/D input
as needed. The configuration is controlled in the GPAD A/D
control register similar to the VP A/D control register. This pin
should be connected to ground if not used.
SMBus/I2C™ Interface
The ISL6295 supports a 2-wire bidirectional bus and data
transmission protocol that is fully compatible with the industrystandard SMBus V1.1 Packet Error Checking (PEC) CRC-8
error correction protocols based on the I2C™ interface. This
interface is used to read and write data from/to the on-chip
registers and EEPROM. The device responds to the same
SMBus slave address for access to all functions. The following
is a brief overview of the SMBus/I2C™ operational
implementation in the ISL6295. Please refer to the SMBus V1.1
specification for complete operational details of this industry
standard interface. This specification can be obtained at the
SMBus Implementer's Forum web site at www.smbus.org.
SMBus OVERVIEW
SMBus is a two-wire multi-master bus, meaning that more than
one device capable of controlling the bus can be connected to
it. A master device initiates a bus transfer and provides the
clock signals. A slave device can receive data provided by the
master or can in return provide data to the master.
Since more than one device may attempt to take control of the
bus as a master, SMBus provides an arbitration mechanism,
based on I2C™ and relying on the wired-AND connection of all
SMBus devices residing on the bus. If two or more masters try
to place information on the bus, the first to produce a "ONE"
when the other(s) produce a "ZERO" loses arbitration and has
to release the bus.
The clock signals during arbitration are a wired-AND
combination of all the clocks provided by SMBus masters. Bus
clock signals from a master can only be altered by clock
stretching or by other masters and only during a bus arbitration
situation. In addition to bus arbitration, SMBus implements the
I2C™ method of clock low extending in order to accommodate
devices of different speeds on the same bus.
SMBus version 1.1 can be implemented at any voltage
between 3V and 5V +10%. Devices can be powered by the bus
VDD or by their own power source (such as Smart Batteries)
10
A device that sends data onto the SMBus is defined as a
transmitter, and a device receiving data as a receiver. The
device that controls the message is called a "master". The
devices that are controlled by the master are "slaves". The
SMBus must be controlled by a master device that generates
the serial clock (SCL), controls the bus access, and generates
START and STOP conditions. The ISL6295 operates as a
slave on the two-wire bus. Connections to the bus are made via
the open drain I/O lines SDA and SCL.
SMBus operates according to the following bus protocol:
• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable
whenever the clock line is HIGH. Changes in the data line
while the clock line is high will be interpreted as control
signals.
The SMBus specification defines the following bus
conditions:
Bus Not Busy Both data and clock lines remain HIGH.
Start Data
Transfer
A change in the state of the data line, from HIGH to
LOW, while the clock is HIGH, defines a START
condition.
Stop Data
Transfer
A change in the state of the data line, from LOW to
HIGH, while the clock line is HIGH, defines a STOP
condition.
Data Valid
The state of the data line represents valid data when,
after a START condition, the data line is stable for the
duration of the HIGH period of the clock signal. The
data on the line must be changed during the LOW
period of the clock signal. There is one clock pulse
per bit of data. Each data transfer is initiated with a
START condition and terminated with a STOP
condition. The number of data bytes transferred
between START and STOP conditions is not limited,
and is determined by the master device. The
information is transferred byte-wise and each
receiver acknowledges with a ninth bit.
Acknowledge Each receiving device, when addressed, is obliged
to generate an Acknowledge bit after the reception of
each byte. The master device must generate an
extra clock pulse which is associated with this
acknowledge bit.
A device that acknowledges must pull down the SDA
line during the acknowledge clock pulse in such a
way that the SDA line is stable LOW during the HIGH
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an acknowledge bit on the
last byte that has been clocked out of the slave. In
this case, the slave must leave the data line HIGH to
enable the master to generate the STOP condition.
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SCL
SDA
Data Stable
Data Change
Data Stable
FIGURE 3. VALID DATA CHANGES ON THE SDA BUS
SCL
SDA
Start
Stop
FIGURE 4. VALID START AND STOP CONDITIONS
SCL from
Master
1
8
9
Data Output
from Transmitter
Data Output
from Receiver
Start
Acknowledge
FIGURE 5. ACKNOWLEDGE RESPONSE FROM RECEIVER
START
tHIGH
S
SCL
tR
tF
STOP
START
P
S
VIH
VIL
tSU:STA
SDA
tLOW
tHD:STA
tSU:DAT
tHD:DAT
tSU:STO
VIH
VIL
tBUF
FIGURE 6. BUS TIMING
11
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ISL6295
Figures 3 through 6 detail how data transfer is accomplished
on the SMBus. Depending upon the state of the R/W bit, two
types of data transfer are possible:
with a STOP condition or with a Repeated START condition.
Since a Repeated START condition is also the beginning of
the next serial transfer, the bus will not be released.
1. Data transfer from a master transmitter to a slave
receiver: The first byte transmitted by the master is the
slave address. Next follows a number of data bytes. The
slave returns an Acknowledge bit after each received
byte.
The ISL6295 may operate in the following two modes:
1. Slave receiver mode: Serial data and clock are received
through SDA and SCL. After each byte is received, an
acknowledge bit is transmitted. START and STOP
conditions are recognized as the beginning and end of a
serial transfer. Address recognition is performed by
hardware after reception of the slave address and
direction bit.
2. Data transfer from a slave transmitter to a master
receiver: The first byte (slave address) is transmitted by
the master. The slave then returns an Acknowledge bit.
Next follows a number of data bytes transmitted by the
slave to the master. The master returns an Acknowledge
bit after all received bytes other than the last byte. At the
end of the last received byte, a 'Not Acknowledge' is
returned.
2. Slave transmitter mode: The first byte is received and
handled as in the Slave Receiver mode. However, in this
mode, the direction bit will indicate that the transfer
direction is reversed. Serial data is transmitted on SDA by
the ISL6295 while the serial clock is input on SCL. START
and STOP conditions are recognized as the beginning
and end of a serial transfer.
The master device generates all of the serial clock pulses
and the START and STOP conditions. A transfer is ended
Ā
7
S
1
S MBus Address
7
0
7
0
BT
A
0
6
4
X
3
2
1
Bank
7
Address Low
A
# of Bytes (only if BT = 1)
A
0
Last write data byte
(Additional data bytes if BT =1)
A
0
PEC (optional)
A/
A
P
Master controls SDA
ISL6295 controls SDA
Legend:
S
-Start
P
- Stop
RS
- Repeated start
A
- Acknowdedge
A
-
BT
Bank
Negative Acknowledge (terminates transaction)
Block mode indicator bit
Controls selection of bank:
00: EEPROM
01: RAM / Registers
-
PEC
AH
Add
A
0
7
7
0
AH
l
-
10: Reserved
11: Reserved
Packet Error Code
High order address bits (2)
FIGURE 7. ISL6295 SMBus WRITE TRANSACTION
12
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ISL6295
7
1
S
SMBus Address
7
0
7
0 A
BT
0
7
1
2
Bank
1
0
AH
A
0
0
SMBus Address
1 A
0
7
(Additional data bytes if BT =1)
7
X
3
# of Bytes (only if BT = 1) A
A
7
4
7
Address Low
RS
6
0
Last Read Data Byte
A/A
0
PEC (optional)
A
P
Master controls SDA
ISL6295 controls SDA
Legend:
S
P
- Start
- Stop
- Repeated start
- Acknowdedge
- Negative Acknowledge (terminates transaction)
- Block mode indicator bit
- Controls selection of bank:
RS
A
A
BT
Bank
00: EEPROM
01: RAM / Registers
PEC
- Packet Error Code
AH
Address low
- High order address bits (2)
- Low order address bits (8)
10: Test Mode Registers
11: Reserved
FIGURE 8. ISL6295 SMBus READ TRANSACTION
Memory/Operational Register Description
Memory/Register Map
The ISL6295 internal structure is accessible on a strict
memory mapped basis. The only action directly taken by the
ISL6295 in response to an SMBus command is to read or
write registers, SRAM, or EEPROM locations. Any actions
taken by ISL6295 happen as a result of values written to
internal control registers.
Addressing in ISL6295 consists of 10 bits plus two bank
select bits. Therefore, there are a total of 4K byte locations
that are addressable within the ISL6295, organized as 4
banks of 1024 locations each. Bank 0 is dedicated for the
EEPROM. Bank 1 contains the general-purpose SRAM and
the data, status and control registers. Bank 2 contains test
registers, and Bank 3 is reserved.
13
Table 1 describes the ISL6295 memory map. The notation is
y:0xzzz where y is the bank number and zzz is the register
address in HEX.
EEPROM
The 256 byte EEPROM is located in bank 0 and occupies
address 0:0x000 to 0:0x0FF. The EEPROM can be read
using Byte or Block transfer modes, but can only be written a
byte at a time. Writing the EEPROM takes approximately
4ms/byte. An EEPROM write cycle command from the
SMBus is immediately acknowledged by the ISL6295 if no
other EEPROM write cycles are in progress. If an EEPROM
read or write cycle is attempted while a previous request to
write is in progress, a negative Acknowledge will be returned
until the previous write cycle is completed.
A read or write to a register or SRAM location will not be
affected by an EEPROM write cycle in progress.
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ISL6295
General Purpose SRAM
32 bytes of General Purpose SRAM are provided as
temporary storage and is located in Bank 1 at 1:0x000
through 1:0x01F. The RAM may be read or written using
either the Byte or Block transfer modes.
Operational Registers
The following is a detailed description of all registers within
the ISL6295 including all control, status and result bits, and
fields that are contained therein.
DCA - DISCHARGE COUNT ACCUMULATOR
The DCA is a 32-bit register that holds the total accumulated
current discharged from the battery. While current
accumulation is enabled, the DCA is updated every 0.5s by
adding the magnitude of the latest current conversion result
to the previous accumulated value as long as the sign bit of
the lres register is ‘1’, indicating a discharge condition. When
the sign bit is ‘0’, no accumulation is performed by the DCA.
The DCA register will rollover if it is allowed be updated
beyond 0xFFFFFFFF, so proper register maintenance by the
host system is necessary. The DCA register may be cleared
by setting the "CLR0" bit in the ACCclr register.
DTC - DISCHARGE TIME COUNT REGISTER
The DTC records the length of time that the battery is in a
discharge condition. This register is incremented at a rate of
2Hz for as long as current accumulation is enabled and the
sign bit of the Ires register returns a ‘1’ following a current
conversion.
Time accumulation in the DTC register is not expected to
rollover over the life of the battery pack. If desired, the DTC
register may be cleared by setting the “CLR1” bit in the
ACCclr register.
CCA - CHARGE COUNT ACCUMULATOR
The CCA is a 32-bit register that holds the total accumulated
charging current delivered to the battery. While current
accumulation is enabled, the CCA is updated every 0.5s by
adding the magnitude of the latest current conversion result
to the previous accumulated value as long as the sign bit of
the lres register is ‘0’, indicating a charge condition. When
the sign bit is ‘1’, no accumulation is performed by the CCA.
14
The CCA register will rollover if it is allowed to be updated
beyond 0xFFFFFFFF, so proper register maintenance by the
host system is necessary. The CCA register may be cleared
by setting the "CLR2" bit in the ACCclr register.
CTC - CHARGE TIME COUNT REGISTER
The CTC records the length of time that the battery is in a
charge condition. This register is incremented at a rate of
2Hz for as long as current accumulation is enabled and the
sign bit of the Ires register returns a ‘0’ following a current
conversion.
Time accumulation in the CTC register is not expected to
rollover over the life of the battery pack. If desired, the CTC
register may be cleared by setting the “CLR3” bit in the
ACCclr register.
TA - TEMPERATURE ACCUMULATOR
TA is the accumulated 32-bit value of temperature
measurements from the internal or external temperature
sensor. TA is updated by the Itres or Etres register. Selection
of the internal temperature sensor or external thermistor for
temperature accumulation is made through the “tsel” bit in
the AccumCtrl register.
The TA register will rollover if it is allowed be updated
beyond 0xFFFFFFFF, so proper register maintenance by the
host system is necessary. The TA register may be cleared by
setting the "CLR4" bit in the ACCclr register.
TAT - TEMPERATURE TIME COUNT REGISTER
The TAT register records the length of time that the ISL6295
is sensing temperature and accumulating the value in
register TA. TAT is incremented at a rate of 2Hz for as long
as temperature accumulation is enabled.
Time accumulation in the TAT register is not expected to
rollover over the life of the battery pack. If desired, the TAT
register may be cleared by setting the “CLR5” bit in the
ACCclr register.
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ISL6295
TABLE 1. ISL6295 MEMORY MAP
FUNCTION
BYTE 3
BYTE 2
BYTE 1
BYTE 0
↓↓↓ Battery Pack Information (unassigned) ↓↓↓
//
//
BANK:ADDRESS
(BYTE 0)
0:0x000
//
↑↑↑ Battery Pack Information (unassigned) ↑↑↑
0:0x01C
↓↓↓ Operational Registers Initialization Values ↓↓↓
0:0x020
//
//
//
↑↑↑ Operational Registers Initialization Values ↑↑↑
EEPROM
0:0x078
0:0x07C
Cal / Set-up Register 1 Initialization Values
0:0x080
Cal / Set-up Register 2 Initialization Values
0:0x084
↓↓↓ Cell Look-up Tables (unassigned) ↓↓↓
0:0x088
//
//
//
↑↑↑ Cell Look-up Tables (unassigned) ↑↑↑
0:0x0FC
1:0x000
General Purpose
//
SRAM
//
//
1:0x01C
Operational
Registers:
Accumulators,
Timers, A/D Registers
and Mode Control
ADconfig
Reserved
0x00h
GPIOctrl
Reserved
0x00h
ACCctrl
15
DCA
1:0x020
DTC
1:0x024
CCA
1:0x028
CTC
1:0x02C
TA
1:0x030
TAT
1:0x034
GPADA
1:0x038
GPADT
1:0x03C
Ictrl (ADc0)
Ires (ADr0)
1:0x040
ITctrl (ADc1)
ITres (ADr1)
1:0x044
ETctrl (ADc2)
Etres (ADr2)
1:0x048
VPctrl (ADc3)
VPres (ADr3)
1:0x04C
Reserved
Reserved
1:0x050
GPADctrl (ADc5)
GPADres (ADr5)
1:0x054
OFFSctrl (ADc6)
OFFSres (ADr6)
1:0x058
AUXctrl (ADc7)
AUXres (ADr7)
1:0x05C
ACCclr
I+trip
1:0x060
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TABLE 1. ISL6295 MEMORY MAP (Continued)
FUNCTION
BYTE 3
Operational
Registers:
Accumulators,
Timers, A/D Registers
and Mode Control
BYTE 2
BYTE 1
BYTE 0
I-trip
1:0x064
Reserved
VPtrip
1:0x068
0x00h
VCtrip
1:0x06C
SStrip
1:0x070
Reserved
0x00h
TRIPctrl
(Continued)
BANK:ADDRESS
(BYTE 0)
1:0x074
OPmode
Reserved
0x00h
1:0x078
Reserved
1:0x07C
2:0x000
//
Reserved
//
//
2:0x0FC
Cal/Setup
MOSCT
VREFT
VBGT
SMBaddr
2:0x080
Registers
Reserved
AOSCT
TestMuxSel
ClkTM
2:0x084
16
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GPADA - GPAD ACCUMULATOR
GPADA is a 32 bit register that holds the total accumulated
value measured on the GPAD/IO1 pin. GPADA is
incremented by the value in GPADres every 0.5s as long as
the function is enabled by the AccV bit in the AccumCtrl
register.
The GAPDA register will rollover if it is allowed to count
beyond 0xFFFFFFFF, so proper register maintenance by the
host system is necessary. The GAPDA register may be
cleared by setting the “CLR6” bit in the ACCclr register.
ACCUMULATOR CONTROL REGISTER – AccCtrl
(Address - 63 Hex/99 Decimal)
7
6
5
4
3
Accum
Accl
AccT
AccV
tsel
7
6
ADEN
Samp
ADEN
Samp
5
4
3
Reserved
2
1
Current Accumulation enable: When set to ‘1’,
current accumulation is enabled. The DCA and
CCA registers will periodically add the value of
the Ires register to its accumulated result. Also,
the DTC and CTC elapsed time counters will
count during discharge and charge respectively.
When “AccI” is cleared to ‘0’, current
accumulation is disabled.
AccT
Temperature Accumulation enable: When set to
‘1’, accumulation will be enabled in the TA. TA
will accumulate results from either ITres or
ETres register, depending on the setting of the
“tsel” bit. While enabled, the TAT eapsed time
counter will increment. When “AccT” is cleared
to ‘0’, TA accumulation will be disabled.
AccV
GPAD Voltage Accumulation enable: When set
to ‘1’, accumulation in GPADA will be updated
by results from the GPADres register. While
enabled, the GPADT elapsed time counter will
increment. When “AccV” is cleared to ‘0’,
GPADA accumulation will be disabled.
tsel
Temperature Accumulation selection: Selects
temperature sensing source used for
accumulation.
0 = internal temperature sensor is used
1 = external temperature sensor is used
SampDiv (2:0)
Sample Mode enable: This bit controls the
enabling of Sample mode when the ISL6295 is
not in a Power-on Reset, Sample-Sleep, or
Shelf-Sleep mode. When set to ‘1’, Sample
Mode is enabled and conversions will be
performed at a periodic rate determined by the
programming of the “SampDiv” bits. When
cleared, Sample Mode is disabled and the
ISL6295 will operate in Run Mode.
Reserved Reserved bit.
SampDiv
The SampDiv bits define the time interval
between executing an A/D conversion cycle
sequence during Sample mode. The time
interval between each conversion cycle is
defined by: 2^(SampDiv) * 0.5s
Reserved
Accl
0
Master A/D enable: When set to a ‘1’, A/D
conversions can be performed. All A/D
conversions are disabled when it is cleared to ‘0’.
0
Accumulator Master Enable: Master enable
control for all accumulators. If any combination
of “Accl”, “AccT” and “AccV” are enabled,
“Accum” must also be enabled to permit
accumulation. If “Accum” is ‘0’, no accumulation
will occur regardless of the settings of “Accl”,
“AccT” and “AccV”.
Time accumulation in the GPADT register is not expected to
rollover over the life of the battery pack. If desired, the
GPADT register may be cleared by setting the “CLR7” bit in
the ACCclr register.
A/D CONFIGURATION REGISTER – ADconfig
(Address - 43 Hex/67 Decimal)
1
Accum
GPADT - GPAD TIME COUNT REGISTER
GPADT records elapsed time for which measurements are
taken on the GPAD pin. GPADT is incremented at a rate of
2Hz for as long as GPAD accumulation is enabled.
2
Reserved Reserved bit.
Note that if the time taken to complete an A/D
conversion cycle is more than the defined
interval, the time-overlapped pending
conversion cycle(s) will be skipped until the
previous conversion cycle is complete. For
example, if SampDiv = 2, but the time taken to
complete a conversion cycle is 5s, then the
effective conversion time interval will be 6s.
17
FN9074.0
October 25, 2005
ISL6295
A/D CONTROL REGISTERS
A/D Input selection: Selects the analog
multiplexer input for the pending A/D conversion
as follows:
Select
The eight A/D control registers are defined as follows:
A/D Reg
NAME
FUNCTION
Addr
ADc0
Ictrl
Current measurement control
42h
Select = 0: Current (SR pin voltage)
ADc1
Itctrl
Internal temperature
measurement control
46h
Select = 1: Internal temperature sensor
ADc2
Etctrl
External temperature
measurement control
4Ah
Select = 2: External temperature sensor (NTC
pin voltage)
ADc3
VPctrl
Pack voltage measurement
control
4Eh
ADc4
Reserved
ADc5
GPADctrl
ADc6
OFFSctrl
ADc7
AUXctrl
Select = 3: Pack Voltage
Enable
Enable
6
Select = 5: GPAD Voltage
52h
GPAD voltage measurement
control
56h
Offset measurement control
5Ah
Auxiliary measurement control
5Eh
5
4
Resolution
3
2
Reference
Select = 6: Offset voltage
Select = 7: Offset voltage
The eight A/D control registers contain the following bits:
7
Select = 4: Reserved
1
0
In order for the A/D control registers to function according to
their names, their select fields should be programmed as
follows:
A/D REG. #
NAME
SELECT VALUE
ADc0
Ictrl
0
ADc1
Itctrl
1
ADc2
Etctrl
2
ADc3
VPctrl
3
ADc4
Rsvd
ADc5
GPADctrl
5
ADc6
OFFSctrl
6
ADc7
AUXctrl
X
Select
A/D Measurement enable: Setting this bit
enables the A/D measurements defined by bits
0-6.
Resolution A/D Resolution selection: These 3 bits control
the magnitude resolution of the A/D
measurement performed for the corresponding
A/D result register as follows:
RESOLUTION
# BIT CONVERSION
0
8-bit conversion
A/D RESULT REGISTERS
1
9-bit conversion
The eight 16-bit A/D result registers are defined as follows:
2
10-bit conversion
15
3
11-bit conversion
Sign
4
12-bit conversion
5
13-bit conversion
A/D
REG
NAME
6
14-bit conversion
ADr0
Ictrl
Current measurement result
40h
7
15-bit conversion
ADr1
Itctrl
Internal temperature measurement
result
44h
ADr2
Etctrl
External temperature measurement
result
48h
ADr3
VPctrl
Pack voltage measurement result
4Ch
ADr4
Reserved
ADr5
GPADctrl GPAD Voltage measurement result
54h
ADr6
OFFSctrl
Offset measurement result
58h
ADr7
AUXctrl
Auxiliary measurement result
5Ch
Reference A/D Reference selection: Selects the reference
voltage used for the pending A/D conversion.
0 = 170mV reference (for differential conversion)
1 = 340mV reference (for single-ended
conversion)
18
14
13 12 11 10 9
8
7
6
5
4
3
2
1
0
Magnitude
FUNCTION
ADDR
FN9074.0
October 25, 2005
ISL6295
The eight A/D result registers contain the following:
Magnitude Magnitude of A/D output: Reports the
magnitude value of the A/D measurement with
00h representing a zero value and 7Fh
representing full scale (magnitude of ADC input
voltage equals VREF). The magnitude value is
left-justified, meaning that result from a N-bit
conversion, as defined by the resolution
specified within the A/D Control register, will
occupy bit locations from bit 14 to bit (15-N).
Polarity of the A/D measurement: The sign bit
shows the polarity of the A/D measurement.
0 = positive value
1 = negative value
Sign
GPIO CONTROL REGISTER - GPIOctrl
(Address 53 Hex/83 Decimal)
IN1
IO1 Input Data: Current logic state of the IO1
pin (read- only).
IN0
IO0 Input Data: Current logic state of the IO0
pin (read- only).
ACCUMULATOR CLEAR REGISTER - ACCclr
(Address - 62 Hex/98 Decimal)
7
6
5
4
3
2
1
0
CLR7
CLR6
CLR5
CLR4
CLR3
CLR2
CLR1
CLR0
A ‘1’ in any of the “CLRn” bits will clear the associated
accumulator. Following the clear operation, all of the bits in
the AccClr register will be reset to 0.
CLR7
Clear GPADT Timer
CLR6
Clear GPADA Accumulator
CLR5
Clear TAT Timer
7
6
5
4
3
2
1
0
CLR4
Clear TA Accumulator
PP0
OE0
IE1
IE0
OUT1
OUT0
IN1
IN0
CLR3
Clear CTC Timer
CLR2
Clear CCA Accumulator
CLR1
Clear DTC Timer
CLR0
Clear DCA Accumulator
These GPIO control bits are relevent only when the
respective GPIO enable bit (contained within the VREFT
register) is set.
PP0
OE0
IE1
IE0
IO0 Push-Pull Output mode: Setting this bit to
‘1’ will configure the IO0 pin as a push-pull digital
output. If set to ‘0’, the IO0 pin will become an
open drain output with a 300kΩ pull-up to the
internal regulated supply. To be used in
conjunction with the “OE0” bit.
IO0 Output Enable: Setting this bit to ‘1’ will
configure the IO0 pin to be either a push-pull
output (when PP0 = ’1’) or open drain output
(when PP0 = ‘0’). If “OE0” is reset to ‘0’, the IO0
pin is three-stated (when PP0 = ‘1’) or pulled up
to the internal regulated supply through a 300kΩ
resistor (when PP0 = ‘0’).
IO1 Input enable: Setting this bit to ‘1’ enables
the IO1 pin to be used as a digital input. If reset
to ‘0’, the digital input buffer on IO1 is powered
down and the “IN1” bit will always read logic 0.
IO0 Input enable: Setting this bit to ‘1’ enables
the IO0 pin to be used as a digital input. If reset
to ‘0’, the digital input buffer on IO0 is powered
down and the “IN0” bit will always read logic 0.
OUT1
IO1 Output Data: Controls the open drain pulldown device. When “0” is written, the pull-down
device is enabled and the IO1 pin outputs a logic
0. When set to “1”, the pull-down device is
disabled and the IO1 is three-stated.
OUT0
IO0 Output Data: Sets the logic level driven on
the IO0 pin. Relevant only when Output Enable
bit “OE0” is set.
19
TRIP POINT VALUE REGISTERS
There are 5 registers that are utilized to set up Trip Point
Values. These registers are used when enabled by the
TRIPctrl register to enter or exit various power modes. Three
of these trip point value registers contain voltage values and
two contain current values. Locations of the trip point
detection enable bit and the corresponding compare and trip
point value registers are listed below:
TPV
REGISTER
LOCATION
COMPARISON
REGISTER
ENABLE
BIT
I+trip
60h
Ires
Iex
I-trip
64h
Ires
Ient
VPtrip
68h
VPres
VPex
VCtrip
6Ch
VPres or GPADres
VPent or
GPADent
SStrip
70h
VPres
Shent
15
Sign
14 13 12 11 10 9
8
7
6
5
4
3
2
1
0
Magnitude
VPtrip, VCtrip and SStrip are used as voltage values to be
compared to VPres, GPADres and VPres respectively for
transitioning in and out of various power modes. I+trip and
I-trip are used as current values to be compared to Ires for
transitioning in and out of various power modes. The data
format in these registers is left justified. For the purpose of
trip point detection, only magnitude is compared and the sign
is ignored.
FN9074.0
October 25, 2005
ISL6295
OPERATION MODE CONTROL REGISTER - OPmode
(Address 7A Hex/122 Decimal)
7
6
SSLP
RESERVED
SSLP
5
4
SSLPdiv
3
TRIP CONTROL REGISTER - TRIPctrl
(Address 76 Hex/118 Decimal)
2
1
0
7
6
5
SHELF
POR
sPOR
lex
lent
VPex
Sample-Sleep Mode enable: Setting this bit to
‘1’ immediately enables Sample-Sleep Mode.
Clearing this bit immediately disables SampleSleep mode.
Iex
Note1
4
3
2
VPent GPADent Shent
1
0
Rsvd
Oflow
Exit from Sample-Sleep Mode on current: A ‘1’ in
this bit will enable an exit from Sample-Sleep
Mode upon the following condition: |current|
>I+Trip
Reserved Reserved bit.
SSLPdiv
Sample-Sleep Divider setting: Sets the interval
between executing an A/D conversion cycle
during Sample-Sleep mode. The time interval
between each conversion cycle is defined by:
Ient
Enter Sample-Sleep Mode on current: A ‘1’ in
this bit will enable entry to Sample-Sleep Mode
under the following condition: |current| <I-Trip
VPex
Note1
Note that if the time taken to complete an A/D
conversion cycle is more than the defined
interval, the time-overlapped pending
conversion cycle(s) will be skipped until the
previous conversion cycle is complete.
Exit from Sample-Sleep Mode on Pack voltage:
A ‘1’ in this bit will enable an exit from SampleSleep Mode upon the following condition: VP >
VPtrip
VPent
Shelf-Sleep Mode enable: Setting this bit to ‘1’
will prepare the device for Shelf-Sleep mode. The
Shelf- Sleep mode will not be entered until a
SMBus Stop condition occurs, when both SDA
and SCL pins go low.
Enter Sample-Sleep Mode on Pack voltage:
(Use VPent only if GPAD is not used and
grouned) A ‘1’ in this bit will enable entry to
Sample-Sleep Mode upon the following
condition: VP < VCtrip
GPADent
POR
Power-on Reset Flag: This bit will read a ‘1’
when a Power-on Reset has occurred. Writing a
‘0’ to this bit will clear the POR flag.
Enter Sample-Sleep Mode on GPAD voltage: A
‘1’ in this bit will enable entry to Sample-Sleep
Mode upon the following condition: GPAD <
VCtrip
Shent
sPOR
Soft Reset: Writing a ‘1’ to this bit will cause the
device to re-initialize by reloading EEPROM
contents into all working registers. This function
has the same effect as the initial Power-on
Reset.
Enter Shelf-Sleep Mode on Pack voltage: A ‘1’
in this bit will enable entry to Shelf-Sleep mode
upon the following condition: VP < SStrip
Rsvd
Reserved bit.
Oflow
ADC Overflow flag: This bit is set when the ADC
input voltage is beyond the designed voltage
range of the ADC. This bit will remain set until a
‘0’ is written to it.
2^(SampDiv) * 2^(SSLPdiv) * 0.5 sec
SHELF
Note1: The exit conditions are verifyed by design but not
tested in production.
20
FN9074.0
October 25, 2005
ISL6295
Register Initialization
During the Power-on Reset sequence, all registers are
loaded with initial values from EEPROM locations
0x020-0x087. These EEPROM locations are reserved to
contain register initialization values. In a battery pack
application, a Power-on Reset typically happens only at the
time of pack manufacture, when the cells are first connected
to the battery monitoring PCB containing the ISL6295.
Data in the EEPROM locations 0:0x020-0:0x07F will be
loaded into the corresponding register locations
1:0x020-1:0x07F in Bank 1. Data in the EEPROM locations,
0:0x080-0:0x087 will be loaded into the corresponding Cal/
Setup register locations 2:0x080-2:0x087 in Bank 2. In all
cases, EEPROM register initialization locations
corresponding to “Reserved” register locations must contain
the value of 0x00h in order to insure proper operation
following a Power-on Reset.
Factory Register Initialization
The EEPROM register initialization locations are
programmed with a set of default values at the time that the
ISL6295 is manufactured. This programming results in the
following operational state following a Power-on Reset:
• All Accumulators and Time Counters disabled and reset to
zero
Table 2 lists in detail the values that are programmed into the
EEPROM register initialization locations.
CAUTION: Some critical calibration and initialization data is
programmed into the EEPROM locations with default values at the
time of the ISL6295 manufacture. Any modification to these values
may cause incorrect operation or malfunction of the part. The
following table sumarises the critical control registers where the
default settings must be kept.
TABLE 2. CRITICAL CONTROL REGISTERS
Name
Address
Default Setting
SMB Address
0x80
0x26 (Bits 0-7)
(0 0 1 0 0 1 1 0)
7
0
Band Gap Trim
0x81
Factory Trimmed
Value
Voltage Reference
Trim
0x82
Factory Trimmed
Value
Main Oscillator
0x83
Factory Trimmed
Value
clkTM
(Clock Test Mode)
0x84
Test Mux
0x85
0x00
Aux Oscillator
0x86
Factory Trimmed
Value
0x00
• All A/D Conversion disabled
• A/D registers programmed with zeroes
• Sample and Shelf-Sleep modes disabled
• All Sample-Sleep mode entry methods disabled and trip
point values reset to zero
• GPIO mode disabled on GPAD and NTC pins
• SMBus address = 0x26
• Factory calibrated trim values for bandgap, voltage
reference, and main and auxiliary oscillators.
21
FN9074.0
October 25, 2005
ISL6295
TABLE 3. ISL6295 REGISTER INITIALIZATION
FUNCTION
BYTE 3
ADconfig:
00000000b = 0x00
Reserved
0x00
Operational Registers:
Accumulators, Timers,
A/D Registers and Mode
Control
Reserved:
0x00
ACCctrl:
00000000b = 0x00
BYTE 2
BYTE 1
BYTE 0
DCA: 0x00000000
1:0x020
DTC: 0x00000000
1:0x024
CCA: 0x00000000
1:0x028
CTC: 0X00000000
1:0x2C
TA: 0X00000000
1:0x30
GPADA: 0X00000000
1:0x34
GPADT: 0X00000000
1:0x38
CTC: 0x00000000
1:0x3C
Ictrl (ADc0):
01110000b = 0x70
Ires (ADr0):
0x0000
1:0x040
ITctrl (ADc1):
00101001b = 0x29
ITres (ADr1):
0x0000
1:0x044
ETctrl (Adc2):
00101010b = 0x2A
Etres (ADr2):
0x0000
1:0x048
VPctrl (ADc3):
00101011b = 0x2B
VPres (ADr3):
0x0000
1:0x04C
GPADctrl (ADc5):
00100101b = 0x25
GPADres (ADr5):
0x0000
1:0x054
OFFSctrl (ADc6):
01110110b = 0x76
OFFSres (ADr6):
0x0000
1:0x058
AUXctrl (ADc7):
00000110b = 0x06
AUXres (ADr7):
0x0000
1:0x05C
ACCclr:
00000000b = 0x00
I+trip:
0x0000
1:0x060
I-trip:
0x0000
1:0x064
VPtrip:
0x0000
1:0x068
VCtrip
1:0x06C
SStrip:
0x0000
1:0x070
Reserved:
0x00
Reserved:
0x00
1:0x074
TRIPctrl:
00000000b = 0x00
OPmode:
00000000b = 0x00
1:0x078
Reserved:
0x00
Reserved:
0x00
Cal/Setup Registers
BANK:ADDRESS
(BYTE 0)
1:0x07C
MOSCT:
0xxxxxxxb
(‘xxxxxxx’ = factory
trim value)
VREFT:
00xxxxxxb
(‘xxxxxx’ = factory trim
value)
VBGT
0000xxxxb
(‘xxxx’ = factory
trim value)
SMBaddr:
00100110b
2:0x080
Reserved:
0x00
AOSCT:
000xxxxxb
(‘xxxxx’ = factory
trim value)
TestMuxSel:
00000000b
clkTM:
00000000b
2:0x084
22
FN9074.0
October 25, 2005
ISL6295
Cal/Setup Mode AND Registers
GPIOen0
Cal/Setup mode allows the pack designer to re-program the
default SMBus address and/or change the calibration
parameters programmed at the factory for bandgap, voltage
reference, and oscillators trim values.
IO0 pin GPIO enable: Setting this bit to ‘1’ configures
the NTC pin to be used as a GPIO. When enabled as
GPIO, the external temperature accumulation function
in the ACCctrl register must be disabled.
Vreft
Voltage Reference trim setting:
Nominal setting = 011111
LSB voltage step = 0.2%
Entering Cal/Setup requires the host to request three
consecutive and specific incorrect SMBus addresses with no
interruptions between requests. These addresses are:
Addr1
Addr2
Addr3
hex 50
hex 52
hex 74
7
After each address is sent, the ISL6295 will NACK the
address. Once the sequence is complete, the ISL6295 will
enter Cal/Setup mode and allow access to the test mode
registers located in memory bank 2.
To exit Cal/Setup mode, re-enter the same address
sequence or power down the device. The ISL6295 will
always power up with test mode disabled.
5
4
3
2
0
SMBadd
5
4
3
2
1
0
Vbgt
Reserved Reserved bits
Band-gap Voltage trim setting:
Nominal setting = 0111
LSB voltage step = 4mV
VOLTAGE REFERENCE TRIM REGISTER - VREFT
(Address 82Hex/130 Decimal)
7
6
GPIOen1
GPIOen0
5
4
6
5
4
3
2
1
ExtClk
0
clkTM
This is a read-only register identifying the silicon
revision number of the device.
ExtClk
External Clock enable: When set, the clock input
to the accumulators and digital control logic within
the ISL6295 is taken from the NTC pin.
3
2
1
Clock Test Mode control: These bits can be
used to speed up testing of the clock divider
chain used to generate the internal 2Hz
accumulator clock (Tacc). This test mode can
also be used to speed up the accumulator clock
for faster accumulator test time. During normal
operation, the 2Hz clock is derived by dividing
the main 131kHz reference clock through a
16-bit divider chain. The divider chain can be
bypassed as follows:
clkTM = 00: Normal operation (Tacc = 2Hz)
0
Vreft
GPIOen1 ‘ IO1 pin GPIO enable: Setting this bit to ‘1’ configures
the GPAD/IO1 pin to be used as a GPIO. When
enabled as GPIO, the GPAD accumulation function in
the ACCctrl register and the trip function in the TRIPctrl
register must be disabled.
23
0
Revision
clkTM
Reserved
Vbgt
1
For production test only. Must be set to ‘0’ during
normal operation.
BAND-GAP TRIM REGISTER - VBGT
(Address 81 Hex/129 Decimal)
6
2
Main Oscillator trim setting:
Nominal setting = 0111111
LSB frequency step = 0.25%
MOsct
Reserved Reserved bit
7
3
Reserved Reserved bit. Must be set to ‘0’.
Reserved
SMBus Address: Defines the SMBus address
for this device.
SMBAdd
4
MOsct
Revision
1
5
Reserved
7
SMBUS ADDRESS REGISTERS - SMBaddr
(Address 80 Hex/128 Decimal)
6
6
CLOCK TEST MODE REGISTER - clkTM
(Address 84 Hex/132 Decimal)
The following registers are only available in test mode.
7
MAIN OSCILLATOR TRIM REGISTER - MOSCT
(Address 83 Hex/131 Decimal)
clkTM = 01: Use only divider bits 0-5
(Tacc = 2kHz)
clkTM = 10: Use only divider bits 6-11
(Tacc = 2kHz)
clkTM = 11: Use only divider bits 12-15
(Tacc = 8.2kHz)
For production test only. Must be set to ‘00’
during normal operation.
FN9074.0
October 25, 2005
ISL6295
Fuel Gauge Operation
accumulate a measure of charge and discharge currents for
the capacity calculation and cycle count. The Charge Time
Counter (CTC) and Discharge Time Counter (DTC) are
intended to maintain the total charge time and discharge
time for the self-discharge, average charge, and discharge
currents over an extended period of time.
The operation overview diagram in Figure 9 illustrates the
fuel gauge operation of the ISL6295. The ISL6295
incorporates four 32-bit accumulators and four 32-bit
elapsed time counters. The Charge Current Accumulator
(CCA) and Discharge Current Accumulator (DCA)
Input
Charge Current
CCA
(Charge Current
Accumulator)
Voltage
Temperature
VPCtrl
(Voltage ADC)
ItCtrl/EtCtrl
(Temperature ADC)
Discharge Current
CTC
(Charge Time
Counter)
DCA
DTC
(Discharge Current (Discharge
Accumulator)
Time Counter)
Host
I2C
C omm un i c a t i o n
ISL6295 IC
Capacity Calculation
Delta_Capacity_Count = CCA - DCA
Delta_Time_Count = CTC + DTC
Gross_Capacity (mAh) = (Delta_Capacity_Count *
130µAs) / (1000 * 3600)
SelfDischarge_Loss (mAh) = SelfDischarge_LookupTable
[ItCtrl/EtCtrl] * ((Delta_Time_Count * 0.5)/3600)
Adjusted_Capacity = Gross_Capacity - SelfDischarge_Loss
NOTES: 1. 130µAs is the Accumulator LSB based upon 20mΩ sensor
resistor and 15-bit resolution;
2. The length of CCA, DCA, CTC, and DTC are 32-bit long;
3. CCA, DCA, CTC, and DTC will be updated every 0.5 second;
FIGURE 9. FUEL GAUGE OPERATION
24
FN9074.0
October 25, 2005
ISL6295
Thin Shrink Small Outline Plastic Packages (TSSOP)
M8.173
N
INDEX
AREA
E
0.25(0.010) M
E1
2
INCHES
GAUGE
PLANE
-B1
8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
B M
SYMBOL
3
L
0.05(0.002)
-A-
0.25
0.010
SEATING PLANE
MIN
MAX
MILLIMETERS
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
A
D
-C-
α
e
A2
A1
b
c
0.10(0.004)
0.10(0.004) M
C A M
B S
c
0.0035
0.0079
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
8o
0o
N
NOTES:
0.65 BSC
α
8
0o
8
7
8o
Rev. 1 12/00
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
25
FN9074.0
October 25, 2005