TI1 MAX3318CDB Transceiver with esd protection Datasheet

MAX3318
www.ti.com
SLLS687A – OCTOBER 2005 – REVISED OCTOBER 2013
2.5-V 460-kbps RS-232 TRANSCEIVER
WITH ±15-kV ESD PROTECTION
Check for Samples: MAX3318
FEATURES
DESCRIPTION
•
The MAX3318 is a dual-driver, dual-receiver, RS-232
compatible transceiver. The device features autopower-down plus and enhanced electrostatic
discharge (ESD) protection integrated into the chip.
Driver output and receiver input are protected to ±8
kV using the IEC 61000-4-2 Air-Gap Discharge
method, ±8 kV using the IEC 61000-4-2 Contact
Discharge method, and ±15 kV using the HumanBody Model (HBM).
1
•
•
•
•
•
ESD Protection for RS-232 I/O Pins
– ±15 kV (Human-Body Model)
– ±8 kV (IEC 61000-4-2, Contact Discharge)
– ±8 kV (IEC 61000-4-2, Air-Gap Discharge)
300-μA Operating Supply Current
1-μA Low-Power Standby (With Receivers
Active) Mode
Designed to Transmit at a Data Rate of
460 kbps
Auto-Power-Down Plus Option Features
Flexible Power-Saving Mode
Operates From a Single 2.25-V to 3-V VCC
Supply
The device operates at a data rate of 460 kbps. The
transceiver has a proprietary low-dropout driver
output stage enabling RS-232-compatible operation
from a 2.25-V to 3-V supply with a dual charge pump.
The charge pump requires only four 0.1-μF
capacitors and features a logic-level output (READY)
that asserts when the charge pump is regulating and
the device is ready to begin transmitting.
APPLICATIONS
•
•
•
•
•
•
The MAX3318 achieves a 1-μA supply current using
the
auto-power-down
feature.
This
device
automatically enters a low-power power-down mode
when the RS-232 cable is disconnected or the drivers
of the connected peripherals are inactive for more
than 30 s. The device turns on again when it senses
a valid transition at any driver or receiver input. Auto
power down saves power without changes to the
existing BIOS or operating system.
Battery-Powered Systems
PDAs
Cellular Phones
Notebooks
Hand-Held Equipment
Pagers
This device is available in two space-saving
packages: 20-pin SSOP and 20-pin TSSOP.
DB OR PW PACKAGE
(TOP VIEW)
READY
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2013, Texas Instruments Incorporated
MAX3318
SLLS687A – OCTOBER 2005 – REVISED OCTOBER 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DETAILED DESCRIPTION
Flexible control options for power management are featured when the serial port and driver inputs are inactive.
The auto-power-down plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for
approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to 1 μA.
By disconnecting the serial port or placing the peripheral drivers off, auto-power-down plus can be disabled when
FORCEON and FORCEOFF are high. With auto-power-down plus enabled, the device activates automatically
when a valid signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input
voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 μs
(typical number). INVALID is low (invalid data) if all receiver input voltage are between –0.3 V and 0.3 V for more
than 30 μs (typical number).
FUNCTION TABLE (1)
INPUT CONDITIONS
FORCEON
FORCEOFF
RECEIVER
OR DRIVER
EDGE
WITHIN 30 s
OUTPUT STATES
VALID
RS-232
LEVEL
PRESENT AT
RECEIVER
DRIVER
RECEIVER
INVALID
READY
OPERATING
MODE
Auto-Power-Down Plus Conditions
H
H
No
No
Active
Active
L
H
Normal operation,
auto-power-down
plus disabled
H
H
No
Yes
Active
Active
H
H
Normal operation,
auto-power-down
plus disabled
L
H
Yes
No
Active
Active
L
H
Normal operation,
auto-power-down
plus enabled
L
H
Yes
Yes
Active
Active
H
H
Normal operation,
auto-power-down
plus enabled
L
H
No
No
Z
Active
L
L
Power down,
auto-power-down
plus enabled
L
H
No
Yes
Z
Active
H
L
Power down,
auto-power-down
plus enabled
X
L
X
No
Z
Active
L
L
Manual power
down
X
L
X
Yes
Z
Active
H
L
Manual power
down
Auto-Power-Down Conditions
(1)
2
INVALID
INVALID
X
No
Z
Active
L
L
Power down, auto
power down
enabled
INVALID
INVALID
X
Yes
Active
Active
H
H
Normal operation,
auto power down
enabled
H = high level, L = low level, X = irrelevant, Z = high impedance
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LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
FORCEOFF
FORCEON
ROUT1
13
17
12
8
20
11
14
Auto-Power-Down Plus
15
DOUT1
DOUT2
INVALID
1
READY
16
RIN1
5 kΩ
ROUT2
10
9
RIN2
5 kΩ
TERMINAL FUNCTIONS
TERMINAL
NAME
DESCRIPTION
NO.
C1+
2
Positive voltage-doubler charge-pump capacitor
C1–
4
Negative voltage-doubler charge-pump capacitor
C2+
5
Positive inverting charge-pump capacitor
C2–
6
Negative inverting charge-pump capacitor
DIN
12, 13
CMOS driver inputs
DOUT
8, 17
RS-232 driver outputs
FORCEOFF
20
Force-off input, active low. Drive low to power down transmitters and charge pump. This overrides auto power
down and FORCEON (see Function Table).
FORCEON
14
Force-on input, active high. Drive high to override auto power down, keeping transmitters on (FORCEOFF
must be high) (see Function Table).
GND
18
Ground
INVALID
11
Valid signal detector output, active low. A logic high indicates that a valid RS-232 level is present on a receiver
input.
READY
1
Ready to transmit output, active high. READY is enabled high when V– goes below –3.5 V and the device is
ready to transmit.
RIN
9, 16
RS-232 receiver inputs
ROUT
10, 15
CMOS receiver outputs
V+
3
2 × VCC generated by the charge pump
V–
7
–2 × VCC generated by the charge pump
VCC
19
2.25-V to 3-V single-supply voltage
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Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC to GND
–0.3
6
V
V+ to GND (2)
–0.3
7
V
V– to GND (2)
–7
0.3
V
13
V
V+ + IV-I (2)
Input voltage
Output voltage
Short-circuit duration
Continuous power dissipation (TA = 70°C)
DIN, FORCEON, FORCEOFF to GND
–0.3
6
RIN to GND
DOUT to GND
±13.2
ROUT, INVALID, READY to GND
–0.3
DOUT to GND
V
VCC + 0.3
Continuous
16-pin SSOP (derate 7.14 mW/°C above 70°C)
571
20-pin SSOP (derate 8 mW/°C above 70°C
640
20-pin TSSOP (derate 7 mW/°C above 70°C)
559
–65
Lead temperature (soldering, 10 s)
(2)
V
±25
Storage temperature range
(1)
UNIT
mW
150
°C
300
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
Recommended Operating Conditions
See Figure 4
MIN NOM
Supply voltage
2.25
2.5
MAX UNIT
3
V
VIH
Driver and control high-level input voltage
DIN, FORCEOFF,
FORCEON
VCC = 2.5 V to 3 V
0.7 × VCC
5.5
V
VIL
Driver and control low-level input voltage
DIN, FORCEOFF,
FORCEON
VCC = 2.5 V to 3 V
0
0.3 × VCC
V
VI
Receiver input voltage
–25
25
V
0
70
–40
85
TA
4
Operating free-air temperature
MAX3318C
MAX3318I
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°C
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Supply Current Section Electrical Characteristics
VCC = 2.25 V to 3 V, C1–C4 = 0.1 μF, TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1) MAX
UNIT
DC Characteristics (VCC = 2.5 V, TA = 25°C)
μA
Auto-power-down plus supply current FORCEON = GND, FORCEOFF = VCC, All RIN and DIN idle
1
10
Auto-power-down supply current
FORCEOFF = GND
1
10
μA
Supply current
FORCEON = FORCEOFF = VCC, No load
0.3
2
mA
(1)
Typical values are at VCC = 2.5 V, TA = 25°C.
ESD Protection
PARAMETER
TEST CONDITIONS
TYP
Human-Body Model (HBM)
RIN, DOUT
UNIT
±15
IEC 61000-4-2 Air-Gap Discharge method
±8
IEC 61000-4-2 Contact Discharge method
±8
kV
Driver Section Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 μF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
MIN TYP (1)
TEST CONDITIONS
Driver input hysteresis
0.3
Input leakage current
FORCEON, DIN, FORCEOFF
Output voltage swing
All driver outputs loaded with 3 kΩ to ground
±3.7
±4
Output resistance
±0.01
VCC = 0, Driver output = ±2 V
300
10M
Output short-circuit current (2)
Output leakage current
(1)
(2)
MAX
±25
VCC = 0 or 2.25 V to 3 V, VOUT = ±12 V, Drivers disabled
UNIT
V
±1
μA
V
Ω
±60
mA
±25
μA
Typical values are at VCC = 2.5 V, TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Driver Section Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 μF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 1)
PARAMETER
Maximum data rate
TEST CONDITIONS
MIN
RL = 3 kΩ, CL = 1000 pF, One transmitter switching
(1)
(2)
MAX
460
|tPHL – tPLH| Driver skew (2)
Transition-region slew rate
TYP (1)
kbps
100
VCC = 2.5 V, TA = 25°C, RL = 3 kΩ to 7 kΩ,
Measured from 3 V to –3 V or –3 V to 3 V,
CL = 150 pF to 2500 pF
4
UNIT
ns
30
V/μs
Typical values are at VCC = 2.5 V, TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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Receiver Section Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 μF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
MIN TYP (1)
TEST CONDITIONS
Input voltage range
Input threshold low
TA = 25°C
Input threshold high
TA = 25°C
V
0.3 × VCC
V
V
0.3
Input resistance
TA = 25°C
3
Output leakage current
V
5
7
kΩ
±10
μA
0.1 × VCC
V
±0.05
Output voltage low
IOUT = 0.5 mA
Output voltage high
IOUT = –0.5 mA
UNIT
25
0.7 × VCC
Input hysteresis
(1)
MAX
–25
0.9 × VCC
V
Typical values are at VCC = 2.5 V, TA = 25°C.
Receiver Section Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 μF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
tPHL
Receiver propagation delay
tPLH
|tPHL – tPLH|
(1)
(2)
TYP (1)
TEST CONDITIONS
0.175
RIN to ROUT, CL = 150 pF
0.175
Receiver skew (2)
50
UNIT
μs
ns
Typical values are at VCC = 2.5 V, TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
Auto-Power-Down Plus Section Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 μF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
MAX
Positive threshold
Receiver input threshold to INVALID high
2.7
Negative threshold
–2.7
Receiver input threshold INVALID low
–0.3
INVALID, READY voltage low
IOUT = 0.5 mA
INVALID, READY voltage high
IOUT = –0.5 mA
UNIT
V
0.3
V
0.1 × VCC
V
0.8 × VCC
V
Auto-Power-Down Plus Section Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature,
VCC = 2.25 V to 3 V, C1–C4 = 0.1 μF, TA = TMIN to TMAX (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MAX
UNIT
μs
VCC = 2.5 V
30
μs
VCC = 2.5 V
100
Receiver positive or negative threshold to INVALID high
VCC = 2.5 V
tINVL
Receiver positive or negative threshold to INVALID low
tWU
Receiver or driver edge to driver enabled
tAUTOPRDN
Receiver or driver edge to driver shutdown
VCC = 2.5 V
6
TYP (1)
1
tINVH
(1)
MIN
15
30
μs
60
s
Typical values are at VCC = 2.5 V,TA = 25°C.
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PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
tTLH
tTHL
Output
6V
SR(tr) +
t THL or tTLH
VOH
3V
3V
−3 V
−3 V
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
2.25 V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.125 V
1.125 V
0V
CL
(see Note A)
tPLH
tPHL
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3V
Input
0V
0V
−3 V
Output
Generator
(see Note B)
tPHL
50 Ω
tPLH
CL
(see Note A)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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PARAMETER MEASUREMENT INFORMATION
Receiver
Inputs
}
Invalid
Region
Driver
Inputs
Driver
Outputs
VCC
INVALID
Output
tINVL
tINVH
0
tWU
tWU
VCC
Ready
Output
0
V+
VCC
0
V−
VOLTAGE WAVEFORMS
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
Valid RS-232 Level, INVALID High
ROUT
Generator
(see Note B)
2.7 V
50 Ω
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
−0.3 V
Auto-PowerDown Plus
Indeterminate
INVALID
−2.7 V
CL = 30 pF
(see Note A)
†
FORCEON
FORCEOFF
Valid RS-232 Level, INVALID High
DIN
DOUT
Auto power down disables drivers and reduces supply
current to 1 µA.
TEST CIRCUIT
Figure 4. INVALID Propagation Delay Times and Supply Enabling Time
8
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PARAMETER MEASUREMENT INFORMATION
2.5 V
+ 0.1 mF
19
CBYPASS
2
C1
0.1 mF
C2
0.1 mF
+
4
+
5
6
VCC
C1+
V+
3
+
C1−
V−
C2+
7
C4
+ 0.1 mF
C2−
13 DIN1
DOUT1 17
12 DIN2
DOUT2 8
RS-232-Compatible
Outputs
RS-232-Compatible
Inputs
RIN1 16
15 ROUT1
C3
0.1 mF
5k
10 ROUT2
1
RIN2 9
5k
READY
To Power-Management Unit
Auto-Power- INVALID 11
Down Plus
VCC
FORCEOFF 20
14
FORCEON
GND
18
Figure 5. Typical Application Circuit
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REVISION HISTORY
Changes from Original (June 2006) to Revision A
Page
•
Updated document to new TI datasheet format - no specification changes. ....................................................................... 1
•
Removed Ordering Information Table. ................................................................................................................................. 2
•
Updated TERMINAL FUNCTIONS table to fix inconsistency. .............................................................................................. 3
10
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PACKAGE OPTION ADDENDUM
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10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX3318CDB
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP318C
MAX3318CDBG4
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP318C
MAX3318CDBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP318C
MAX3318CDBRG4
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP318C
MAX3318CPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP318C
MAX3318CPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP318C
MAX3318IDB
ACTIVE
SSOP
DB
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP318I
MAX3318IDBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP318I
MAX3318IPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP318I
MAX3318IPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP318I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
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10-Jun-2014
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
12.0
16.0
Q1
MAX3318CDBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
MAX3318CPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
MAX3318IDBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
MAX3318IPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3318CDBR
SSOP
DB
20
2000
367.0
367.0
38.0
MAX3318CPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
MAX3318IDBR
SSOP
DB
20
2000
367.0
367.0
38.0
MAX3318IPWR
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
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