AIC1730 150mA, Low Noise, Low Dropout Linear Regulator FEATURES z z z z z z z z DESCRIPTION Very Low Quiescent Current, 55μA Very Low Dropout Voltage, 90mV @ 50mA. Short Circuit and Thermal Protection. Available in ±2% Output Tolerance. 1.8V to 3.3V Output Voltage with 0.1V Increment. Active Low Shutdown Control. Low Noise. Low Profile Package: SOT-23-5 The AIC1730 is a low noise, low dropout linear regulator, and is housed in a small SOT-23-5 package. The device is in the “ON” state when the SHDN pin is set to logic high level. A low dropout voltage of 90mV at 50mA load current is performed. It offers high precision output voltage of ±2%. The quality of low quiescent current and APPLICATIONS z z z z z z z z z low dropout voltage makes this device ideal for battery power applications. The internal reverse Cellular Telephones. Pagers. Personal Communication Equipment. Cordless Telephones. Portable Instrumentation. Portable Consumer Equipment. Radio Control Systems. Low Voltage Systems. Battery Powered Systems. bias protection eliminates the requirement for a reverse voltage protection diode. The high ripple rejection and low noise provide enhanced performance for critical applications. The noise bypass pin can be connected an external capacitor to reduce the output noise level. TYPICAL APPLICATION CIRCUIT VIN VIN CIN VOUT + + 1μF GND VOUT COUT 1μF BP SHDN CBP V SHDN AIC1730 0.1μF Low Noise Low Dropout Linear Regulator Analog Integrations Corporation Si-Soft Research Center DS-1730G-01 20100118 3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw 1 AIC1730 ORDERING INFORMATION AIC1730-XXXXXX PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL BG: BAG PACKAGE TYPE V: SOT-23-5 C: COMMERCIAL P: LEAD FREE COMMERCIAL G:GREEN PACKAGE SOT-23-5 TOP VIEW 1: VIN 2: GND 3: SH DN 4: BP 5: VOUT 4 5 1 2 3 OUTPU T VOLTAGE 18: 1.8V : 285: 2.85V : 33: 3.3V The output voltage is available by 0.1V per step. Example: AIC1730-18CVTR Æ 1.8V version in SOT-23-5 Package & Taping & Reel Packing Type AIC1730-18PVTR Æ 1.8V version in SOT-23-5 Lead Free Package & Taping & Reel Packing Type AIC1730-18GVTR Æ z 1.8V version in SOT-23-5 Green Package & Taping & Reel Packing Type SOT-23-5 Marking Part No. AIC1730-18 AIC1730-19 AIC1730-20 AIC1730-21 AIC1730-22 AIC1730-23 AIC1730-24 AIC1730-25 AIC1730-26 CV EC18 EC19 EC20 EC21 EC22 EC23 EC24 EC25 EC26 PV EC18P EC19P EC20P EC21P EC22P EC23P EC24P EC25P EC26P GV EC18G EC19G EC20G EC21G EC22G EC23G EC24G EC25G EC26G Part No. AIC1730-27 AIC1730-28 AIC1730-285 AIC1730-29 AIC1730-30 AIC1730-31 AIC1730-32 AIC1730-33 CV EC27 EC28 EC2J EC29 EC30 EC31 EC32 EC33 PV EC27P EC28P EC2JP EC29P EC30P EC31P EC32P EC33P GV EC27G EC28G EC2JG EC29G EC30G EC31G EC32G EC33G 2 AIC1730 ABSOLUTE MAXIMUM RATINGS Supply Voltage 12V Shutdown Terminal Voltage 12V Noise Bypass Terminal Voltage 5V Operating Temperature Range -40ºC~85ºC Maximum Junction Temperature 125°C Storage Temperature Range .-65ºC~150ºC Lead Temperature (Soldering, 10 sec) 260°C Thermal Resistance Junction to Case SOT-23-5 .130°C /W Thermal Resistance Junction to Ambient SOT-23-5 ..220°C /W (Assume no ambient airflow, no heatsink) Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. TEST CIRCUIT Refer to TYPICAL APPLICATION CIRCUIT 3 AIC1730 ELECTRICAL CHARACTERISTICS (CIN=1μF, COUT=10μF, TJ=25°C, unless otherwise specified) (Note1) PARAMETER TEST CONDITIONS SYMBOL Quiescent Current IOUT = 0mA, VIN = 3.6~12V IQ Standby Current VIN = 3.6~8V, output OFF ISTBY GND Pin Current IOUT = 0.1~150mA IGND Continuous Output Current VIN = VOUT + 1V IOUT Output Current Limit VIN = VOUT + 1V, VOUT = 0V Output Voltage Tolerance VIN = VOUT + 1V, no load Temperature Coefficient Line Regulation VIN = VOUT(TYP) + 1V to VOUT(TYP) + 6V Load Regulation VIN = 5V, IOUT = 0.1~150mA MIN. IOUT = 100 mA VOUT≥2.5V IIL 150 VOUT -2 IOUT=150 mA VOUT <2.5V Noise Bypass Terminal Voltage Output Noise CBP = 0.1μF, f = 1KHz UNIT 55 80 μA 0.1 μA 80 μA 150 mA 220 mA 2 % TC 50 150 ppm/ºC ΔVLIR 2 7 mV ΔVLOR 7 25 mV 90 160 mV 140 230 mV 200 350 mV 700 mV VDROP1 IOUT = 150 mA Dropout Voltage (2) MAX. 55 IOUT = 50 mA Dropout Voltage (1) TYP. VDROP2 VREF 1.23 Δn 0.46 V μV Hz VIN = 5V SHUTDOWN TERMINAL SPECIFICATIONS Shutdown Pin Current I SHDN Shutdown Pin Voltage (ON) Output ON V SHDN (ON） Shutdown Pin Voltage (OFF) Output OFF V SHDN (OFF) Shutdown Exit Delay Time CBP = 0.1μF, COUT = 1μF, IOUT=30mA 0.1 1.6 μA V 0.6 V Δt 300 μS TSD 155 ºC THYST 20 ºC THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis Guaranteed by design Note 1: Specifications are production tested at TA=25°C. Specifications over the -40°C to 85°C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). 4 AIC1730 TYPICAL PERFORMANCE CHARACTERISTICS IOUT=1mA,CBP=0.1μF IOUT=1mA,CBP=0.1μF COUT=10μF COUT=1μF VOUT VOUT 50mV/DIV 50mV/DIV VOUT+3V VOUT+3V VOUT+1V VOUT+1V VIN VIN 2V/DIV 2V/DIV Time (100μS/DIV) TIME (100μS/DIV) Fig. 1 Line Transient Response Fig. 2 Line Transient Response IOUT=1mA,CBP=1μF IOUT=1mA,CBP=1μF COUT=1μF COUT=10μF VOUT VOUT 50mV/DIV 50mV/DIV VOUT+3V VOUT+1V VOUT+3V VIN VOUT+1V VIN 2V/DIV 2V/DIV Time (100μS/DIV) Time (100μS/DIV) Fig. 3 Line Transient Response Fig. 4 Line Transient Response IOUT=30mA,CBP=0.01μF VOUT IOUT=30mA,CBP=0.1μF VOUT COUT=3.3μF 2V/DIV COUT=3.3μF 2V/DIV Time (250μS/DIV) Fig. 5 Shutdown Exit Delay VSHDN VSHDN 2V/DIV 2V/DIV Time (250μS/DIV) Fig. 6 Shutdown Exit Delay 5 AIC1730 TYPICAL PERFORMANCE CHARACTERISTICS IOUT=10mA,CBP=0.1μF VOUT COUT=1μF 2V/DIV (Continued) IOUT=10mA,CBP=0.1μF VOUT COUT=10μF 2V/DIV VSHDN VSHDN 2V/DIV 2V/DIV Time (250μS/DIV) TIME (250μS/DIV) Fig. 7 Shutdown Exit Delay Fig. 8 Shutdown Exit Delay CBP=0.1μF CBP=0.1μF COUT=1μF COUT=10μF VOUT VOUT 20mV/DIV 20mV/DIV IOUT=60mA IOUT=60mA IOUT=0mA IOUT=0mA IOUT IOUT TIME (1mS/DIV) Time (1mS/DIV) Fig. 9 Fig. 10 Load Transient Response Load Transient Response CBP=0.1μF CBP=0.1μF COUT=1μF COUT=10μF VOUT VOUT 20mV/DIV 20mV/DIV IOUT=90mA IOUT=90mA IOUT=0mA IOUT=0mA IOUT IOUT Time (1mS/DIV) Fig. 11 Load Transient Response Time (1mS/DIV) Fig. 12 Load Transient Response 6 AIC1730 TYPICAL PERFORMANCE CHARACTERISTICS 250 (Continued) 500 AIC1730-20 450 VOUT=3.0V 200 400 vDROP (mV) VDROP (mV) 350 150 100 300 250 200 150 50 100 50 0 0 50 100 0 150 20 0 40 60 Fig. 14 Fig. 13 Dropout Voltage vs. Output Current 70 100 120 140 Dropout Voltage vs. Output Current 80 IOUT=50mA 70 60 IOUT=0mA 50 60 50 40 IQ (μA) IGND (uA) 80 ILOAD (mA) IOUT (mA) 30 IOUT=0mA 40 30 20 20 10 10 0 0 0 1 2 3 4 5 6 0 2 4 6 Fig. 15 8 10 12 14 16 VIN (V) VIN (V) Ground Current vs. Input Voltage (VOUT=3.0V) Fig. 16 Quiescent Current (ON Mode) vs. Input Voltage 2.0 70 IOUT=90mA 68 66 1.5 64 Output ON IOUT=60mA 62 60 VSHDN (V) IGND (mA) IOUT=30mA 58 56 1.0 0.5 54 Output 52 50 -40 0.0 -20 0 20 40 60 80 100 120 140 160 -40 0 TA (°C) Fig. 17 Ground Current vs. Temperature 40 80 120 TA (°C) Fig. 18 Shutdown Voltage vs. Temperature 7 AIC1730 TYPICAL PERFORMANCE CHARACTERISTICS 400 (Continued) 70 65 IGND (μA) IOUT (mA) 300 200 60 VOUT is connected to GND 100 0 0 2 4 6 55 8 0 50 Fig. 19 100 150 IOUT (mA) VIN (V) Short Circuit Current vs. Input Voltage Fig. 20 Ground Current vs. Output Current BLOCK DIAGRAM VIN Current Limiting BP VREF 1.23V SHDN Power Shutdown + Error Amp. VOUT Thermal Limiting GND 8 AIC1730 PIN DESCRIPTIONS PIN 1 : VIN Power supply input pin. Bypass with a 1μF capacitor to GND PIN 2 : GND - Ground pin. PIN 3 : SHDN - Active-Low shutdown input pin. PIN 4 : BP - Noise bypass pin. An external bypass capacitor connecting to - BP pin to reduce noises at the output. PIN 5 : VOUT - Output pin. Sources up to 150 mA. DETAILED DESCRIPTION OF TECHNICAL TERMS DROPOUT VOLTAGE (VDROP) GROUND CURRENT (IGND) The dropout voltage is defined as the difference Ground current is the current flowing through the between the input voltage and output voltage at ground pin with output load. which the output voltage drops 100mV. Below this value, the output voltage will fall as the input voltage reduces. It depends on the load current and junction temperature. LINE REGULATION Line regulation is the ability of the regulator to maintain a constant output voltage as the input voltage changes. The line regulation is specified as the input voltage changes from VIN = VOUT + 1V STANDBY CURRENT (ISTBY) Standby current is the current flowing into the regulator when the output is shutdown by setting V SHDN at 0V and VIN at 8 V. CURRENT LIMIT (IIL) Current limiting of AIC1730 monitors and controls the maximum output current, in case of a shorted output. It protects device from the damage resulting from any unexpected current. to VIN = 8V and IOUT = 1mA. LOAD REGULATION Load regulation is the ability of the regulator to maintain a constant output voltage as the load current changes. A pulsed measurement with an input voltage set to VIN = VOUT + VDROP can minimize temperature effects. The load regulation is specified by the output current ranging from 0.1mA to 150mA. THERMAL PROTECTION Thermal sensor protects device when the junction temperature exceeds TJ= +155ºC. It signals shutdown logic, turning off pass transistor and allowing IC to cool down. After the IC’s junction temperature cools by 20ºC, the thermal sensor will turn the pass transistor back on. Thermal protection is designed to protect the device in the event of fault conditions. For a QUIESCENT CURRENT (IQ) continuous operation, do not exceed the absolute Quiescent current is the current flowing through maximum junction-temperature rating of TJ= ground pin with no output load. 150ºC, or damage may occur to the device. 9 AIC1730 APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1μF with 1uF aluminum electrolytic output capacitor is recommended. And it should be selected within the Equivalent Series Resistance (ESR) range as shown in the figure 21, 22, 23, and 24. ESR of ceramic capacitor is lower and its electrical characteristics (capacitance and ESR) vary widely over temperature. In general, tantalum or electric output capacitor is and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: PMAX = (TJ − TA) (RθJB + RθBA) suggested for heavy load. Normally, the output capacitor should be 1μF (aluminum electrolytic) at least and rates for operating temperature range. Note that it’s important to check selected manufactures electrical characteristics (capacitance and ESR) over temperature. NOISE BYPASS CAPACITOR 0.1μF bypass capacitor at BP pin reduces output voltage noise. And the BP pin has to connect a capacitor to GND. Where TJ-TA is the temperature difference between the die junction and the surrounding air, RθJB is the thermal resistance of the package, and RθBA is the thermal resistance through the PCB, copper traces, and other materials to the surrounding air. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function of providing an electrical connection to ground and channeling heat away. Therefore, connecting the POWER DISSIPATION GND pin to ground with a large pad or ground The maximum power dissipation of AIC1742 depends on the thermal resistance of its case plane would increase the power dissipation and reduce the device temperature. 10 AIC1730 100 100 COUT=1μF COUT=2.2μF 10 1 ESR (Ω) ESR(Ω) 10 STABLE REGION 1 Stable Region 0.1 0.1 0.01 50 100 IOUT (mA) Fig. 21 150 0.01 50 Max Power Dissipation, COUT=1μF Fig. 22 100 IOUT (mA) 100 150 Max Power Dissipation, COUT=2.2μF 100 COUT=10μF COUT=3.3μF 10 ESR(Ω) ESR(Ω) 10 1 1 Stable Region Stable Region 0.1 0.1 0.01 100 50 150 0.01 Fig. 23 Max Power Dissipation, COUT=3.3μF 100 50 150 IOUT (mA) IOUT (mA) Fig. 24 Max Power Dissipation, COUT=10μF 11 AIC1730 PHYSICAL DIMENSIONS z SOT-23-5 (unit: mm) D A A E E1 S Y M B O L e e1 SEE VIEW B c A A2 MAX. 0.95 1.45 A1 0.05 0.15 A2 0.90 1.30 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 1.70 e 0.95 BSC e1 1.90 BSC 0.30 L1 WITH PLATING q 0.60 0.60 REF 0° 8° SECTION A-A 0.25 A1 BASE METAL MIN. A L b SOT-23-5 MILLIMETERS GAUGE PLANE SEATING PLANE L L1 θ VIEW B Note : 1. Refer to JEDEC MO-178AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 12