TI CDCLVD110AVFRG4 Programmable low-voltage 1:10 lvds clock driver Datasheet

CDCLVD110A
www.ti.com
SCAS841C – FEBRUARY 2007 – REVISED NOVEMBER 2009
PROGRAMMABLE LOW-VOLTAGE 1:10 LVDS CLOCK DRIVER
Check for Samples: CDCLVD110A
FEATURES
1
•
2
•
•
•
•
•
•
•
•
Low-Output Skew <30 ps (Typical) for
Clock-Distribution Applications
Distributes One Differential Clock Input to
10 LVDS Differential Clock Outputs
VCC range 2.5 V ±5%
Typical Signaling Rate Capability of Up to
1.1 GHz
Configurable Register (SI/CK) Individually
Enables Disables Outputs, Selectable CLK0,
CLK0 or CLK1, CLK1 Inputs
Full Rail-to-Rail Common-Mode Input Range
Receiver Input Threshold ±100 mV
Available in 32-Pin LQFP and QFN Package
Fail-Safe I/O-Pins for VDD = 0 V (Power Down)
LQFP and QFN PACKAGE
(TOP VIEW)
PowerPAD
(0)
APPLICATIONS
•
General purpose Industrial, Communication
and Consumer Applications
DESCRIPTION
The CDCLVD110A clock driver distributes one pair of differential LVDS clock inputs (either CLK0 or CLK1) to 10
pairs of differential clock outputs (Q0–Q9) with minimum skew for clock distribution. The CDCLVD110A is
specifically designed to drive 50-Ω transmission lines.
When the control enable is high (EN = 1), the 10 differential outputs are programmable in that each output can
be individually enabled/disabled (3-stated) according to the first 10 bits loaded into the shift register. Once the
shift register is loaded, the last bit selects either CLK0 or CLK1 as the clock input. However, when EN = 0, the
outputs are not programmable and all outputs are enabled.
The CDCLVD110A has an improved startup circuit that minimizes enabling time in AC- and DC-coupled systems.
The CDCLVD110A is characterized for operation from –40°C to 85°C.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2009, Texas Instruments Incorporated
CDCLVD110A
SCAS841C – FEBRUARY 2007 – REVISED NOVEMBER 2009
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
FUNCTIONAL BLOCK DIAGRAM
2
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PIN FUNCTIONS
PIN
NAME
NO.
I/O
DESCRIPTION
CK
1
I
Control register input clock, features a 120-k. pullup resistor
SI
2
I
Control register serial input/CLK Select, features a 120-k. pulldown resistor
CLK0
3
I
True differential input, LVDS
CLK0
4
I
Complementary differential input, LVDS
VBB
5
O
Reference voltage output
CLK1
6
I
True differential input, LVDS
CLK1
7
I
Complementary differential input, LVDS
EN
8
I
Control enable (for programmability), features a 120-k. pulldown resistor, input
VSS
9, 25
Device ground
16, 32
Supply voltage
VDD
Q [9:0]
11, 13, 15, 18, 20, 22,
24, 27, 29, 31
O
Clock outputs, these outputs provide low-skew copies of CLKIN
Q[9:0]
10, 12, 14, 17, 19,
21,23, 26, 28, 30
O
Complementary clock outputs, these outputs provide low-skew copies of CLKIN
0
I/O
The PowerPAD of the QFN32 package is thermally connected to the die to improve the
heat transfer out of the package. This pad is connected to GND.
PowerPAD™
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
UNIT
–0.3 to 2.8
V
Input voltage
–0.2 to (VDD + 0.2)
V
VI Output voltage
–0.2 to (VDD + 0.2)
V
VDD
Supply voltage
VI
VO
IOSD
Driver short circuit current, Qn, Qn
ESD
Electrostatic discharge (HBM 1.5 kΩ, 100 pF)
(1)
Continuous
>2000
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
VDD
Supply voltage
VIC
Receiver common-mode input voltage
TA
Operating free-air temperature
MIN
NOM
MAX
UNIT
2.375
2.5
2.625
V
0.5|VID|
VDD – 0.5|VID|
V
–40
85
°C
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CDCLVD110A
SCAS841C – FEBRUARY 2007 – REVISED NOVEMBER 2009
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ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
250
450
600
mV
50
mV
DRIVER
|VOD|
Differential output voltage
ΔVOD
VOD magnitude change
RL = 100Ω
VOS
Offset voltage
ΔVOS
VOS magnitude change
IOS
Output short circuit current
VBB
Reference output voltage
VDD = 2.5 V, IBB = –100 μA
CO
Output capacitance
VO = VDD or GND
–40°C to 85°C
0.95
1.2
VO = 0 V
1.45
V
350
mV
–20
|VOD| = 0 V
mA
20
1.15
1.25
1.35
V
3
pF
RECEIVER
VIDH
Input threshold high
VIDL
Input threshold low
|VID|
Input differential voltage
IIH
100
IIL
Input current, CLK0/CLK0,
CLK1/CLK1
VI = VDD
CI
Input capacitance
VI = VDD or GND
–100
mV
200
mV
–5
VI = 0 V
mV
μA
5
3
pF
SUPPLY CURRENT
Full loaded
IDD
Supply current
IDDZ
All outputs enabled and loaded, RL = 100 Ω, f = 100 MHz
100
110
All outputs enabled and loaded, RL = 100 Ω, f = 800 MHz
150
160
No load
Outputs enabled, no output load, f = 0 Hz
35
3-State
All outputs 3-state by control logic, f = 0 Hz
35
mA
JITTER CHARACTERISTICS
characterized with CDCLVD110 performance EVM, VDD = 3.3 V, OUTPUTS NOT UNDER TEST are terminated to 50Ω
PARAMETER
tjitterLVDS
4
Additive phase jitter from input to
LVDS output Q3 and Q3
TEST CONDITIONS
MIN
TYP
12 kHz to 5 MHz, fout = 30.72 MHz
281
12 kHz to 20 MHz, fout = 125 MHz
111
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MAX
UNIT
fs rms
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): CDCLVD110A
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SCAS841C – FEBRUARY 2007 – REVISED NOVEMBER 2009
LVDS — SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VDD = 2.5 V ±5%
PARAMETER
tPLH
tPHL
Propagation delay low-to-high
Propagation delay high-to-low
FROM
(INPUT)
TO
(OUTPUT)
CLK0, CLK0
CLK1, CLK1
MIN
TYP
MAX
Qn, Qn
2
3
ns
CLK0, CLK0
CLK1, CLK1
Qn, Qn
2
3
ns
CLK0, CLK0
CLK1, CLK1
Qn, Qn
tduty
Duty cycle
tsk(o)
Output skew
Any Qn, Qn
tsk(p)
Pulse skew
Any Qn, Qn
50
ps
tsk(pp)
Part-to-part skew
Any Qn, Qn
600
ps
tr
Output rise time, 20% to 80%, RL = 100 Ω, CL = 5 pF
Any Qn, Qn
350
ps
tf
Output fall time, 20% to 80%, RL = 100 Ω, CL = 5 pF
Any Qn, Qn
350
ps
fclk
Max input frequency
CLK0, CLK0
CLK1, CLK1
45%
UNIT
55%
30
Any Qn, Qn
ps
900 1100
MHz
CONTROL REGISTER CHARACTERISTICS
over recommended operating free-air temperature range, VDD = 2.5 V ±5% (unless otherwise noted)
PARAMETER
fMAX
Maximum frequency of shift register
tsu
Setup time, clock to SI
th
TEST CONDITIONS
MIN
TYP
100
150
MAX
UNIT
MHz
2
ns
Hold time, clock to SI
1.5
ns
tremoval
Removal time, enable to clock
1.5
ns
tstartup
Startup time after disable through SI
1.0
μs
tw
Clock pulse width, minimum
VIH
Logic input high
VDD = 2.5 V
VIL
Logic input low
VDD = 2.5 V
IIH
IIL
Input current, CK pin
Input current, SI and EN pins
Input current, CK pin
Input current, SI and EN pins
VI = VDD
VI = GND
3
ns
2
V
0.8
–5
5
10
–30
–10
30
–5
5
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V
μA
μA
5
CDCLVD110A
SCAS841C – FEBRUARY 2007 – REVISED NOVEMBER 2009
www.ti.com
SPECIFICATION OF CONTROL REGISTER
The CDCLVD110A has an 11-bit, serial-in shift register and an 11-bit control register. The control Register
enables/disables each output clock, and selects either CLK0 or CLK1 as the input clock. The CDCLVD110A has
two modes of operation:
Programmable Mode (EN=1)
The shift register uses a serial input (SI) and a clock input (CK). Once the shift register is loaded with 11
clock pulses, the 12th clock pulse loads the control register. The first bit (bit 0) on SI enables the Q9-Q9
output pair, and the 10th bit (bit 9) enables the Q0-Q0 pair. The 11th bit (bit 10) on SI selects either CLK0 or
CLK1 as the input clock; a bit value of 0 selects CLK0, whereas a bit value of 1 selects CLK1. To restart the
control register configuration, a reset of the state machine must be done with a clock pulse on CK (shift
register clock input) and EN set to low. The control register can be configured only once after each reset.
Standard Mode (EN=0)
In this mode, the CDCLVD110A is not programmable and all the clock outputs are enabled. The clock input
(CLK0 or CLK1) is selected with the SI pin, as is shown in the table entitled control register.
STATE-MACHINE INPUTS
EN
SI
CK
OUTPUT
L
L
X
All outputs enabled, CLK0 selected, control register disabled, default state
L
H
X
All outputs enabled, CLK1 selected, control register disabled
H
L
↑
First stage stores L, other stage stores data of previous stage
H
H
First stage stores H, other stage stores data of previous stage
L
X
Reset of state machine, shift and control registers
CONTROL REGISTER
BIT 10
BITS [0-9]
QN[0-9]
CLK0
L
H
H
H
CLK1
X
L
Outputs disabled
SERIAL INPUT (SI) SEQUENCE
BIT 10
BIT 9
BIT 8
CLK_SEL
Q0
Q1
BIT 7
Q2
TRUTH TABLE FOR CONTROL LOGIC
CK
EN
SI
L
L
L
L
L
L
L
L
L
L
L
H
L
L
H
L
L
H
All outputs enabled
6
BIT 6
Q3
CLK0
L
H
Open
X
X
X
BIT 5
Q4
CLK0
H
L
Open
X
X
X
BIT 4
Q5
BIT 3
Q6
CLK1
X
X
X
L
H
Open
X = Don't care
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BIT 2
Q7
CLK1
X
X
X
H
L
Open
BIT 1
Q8
Q(0-9)
L
H
L
L
H
L
BIT 0
Q9
Q(0-9)
H
L
H
H
L
H
Copyright © 2007–2009, Texas Instruments Incorporated
Product Folder Link(s): CDCLVD110A
CDCLVD110A
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SCAS841C – FEBRUARY 2007 – REVISED NOVEMBER 2009
APPLICATION INFORMATION
Fall-Safe Information
For VDD = 0 V (power-down mode) the CDCLVD110A has fail-safe input and output pins. In power-on mode,
fail-safe biasing at input pins can be accomplished with a 10-kΩ pullup resistor from CLK0/CLK1 to VDD and a
10-kΩ pulldown resistor from CLK0/CLK1 to GND.
LVDS Receiver Input Termination
The LVDS receiver inputs require 100-Ω termination resistors placed as close as possible across the input pins.
Control Inputs Termination
No external termination is required. The CK control input has an internal 120-kΩ pullup resistor, while the SI–
and EN–control inputs each have an internal 120-kΩ pulldown resistor. If the control pins are left open per the
default, all outputs are enabled, CLK0, CLK0 is selected, and the control register is disabled.
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CDCLVD110A
SCAS841C – FEBRUARY 2007 – REVISED NOVEMBER 2009
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PARAMETER MEASUREMENT INFORMATION
A.
Output skew, tsk(o), is calculated as the greater of:
– The difference between the fastest and the slowest tPLHn (n = 1, 2,...10)
– The difference between the fastest and the slowest tPHLn (n = 1, 2,...10)
B.
Part-to-part skew, tsk(pp), is calculated as the greater of:
– The difference between the fastest and the slowest tPLHn (n = 1, 2,...10) across multiple devices
– The difference between the fastest and the slowest tPHLn (n = 1, 2,...10) across multiple devices
C.
Pulse skew, tsk(p), is calculated as the magnitude of the absolute time difference between the high-to-low (tPHL) and
the low-to-high (tPLH) propagation delays when a single switching input causes one or more outputs to switch, tsk(p) = |
tPHL – tPLH |. Pulse skew is sometimes referred to as pulse-width distortion or duty-cycle skew.
Figure 1. Waveforms for Calculation of tsk(o) and tsk(pp)
8
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PARAMETER MEASUREMENT INFORMATION (continued)
Figure 2. Test Criteria for fclk, Duty Cycle, tr, tf, VOD
Spacer
REVISION HISTORY
Changes from Original (February 2007) to Revision A
•
Page
Changed Pinout Package title From: TQFP PACKAGE and QFN PACKAGE To: LQFP PACKAGE and QFN
PACKAGE ............................................................................................................................................................................. 1
Changes from Revision A (January 2008) to Revision B
Page
•
Changed Feature From: Available in 32-Pin LQFP Package To: Available in 32-Pin LQFP and QFN Package ................ 1
•
Added Applications ............................................................................................................................................................... 1
Changes from Revision B (October 2008) to Revision C
Page
•
Added PowerPAD information to the Pinout Package .......................................................................................................... 1
•
Added PowerPAD information to the PIn FUNCTIONS table ............................................................................................... 3
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
CDCLVD110ARHBR
ACTIVE
VQFN
RHB
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LVD110A
CDCLVD110ARHBRG4
ACTIVE
VQFN
RHB
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LVD110A
CDCLVD110ARHBT
ACTIVE
VQFN
RHB
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LVD110A
CDCLVD110ARHBTG4
ACTIVE
VQFN
RHB
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LVD110A
CDCLVD110AVF
ACTIVE
LQFP
VF
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CKLVD110A
CDCLVD110AVFG4
ACTIVE
LQFP
VF
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CKLVD110A
CDCLVD110AVFR
ACTIVE
LQFP
VF
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CKLVD110A
CDCLVD110AVFRG4
ACTIVE
LQFP
VF
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
CKLVD110A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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(4)
27-Jul-2013
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
CDCLVD110ARHBR
VQFN
RHB
32
CDCLVD110ARHBT
VQFN
RHB
CDCLVD110AVFR
LQFP
VF
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.0
12.0
Q2
3000
330.0
12.4
5.3
5.3
1.5
32
250
180.0
12.4
5.3
5.3
1.5
8.0
12.0
Q2
32
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCLVD110ARHBR
VQFN
RHB
32
3000
338.1
338.1
20.6
CDCLVD110ARHBT
VQFN
RHB
32
250
210.0
185.0
35.0
CDCLVD110AVFR
LQFP
VF
32
1000
341.0
159.0
123.5
Pack Materials-Page 2
MECHANICAL DATA
MTQF002B – JANUARY 1995 – REVISED MAY 2000
VF (S-PQFP-G32)
PLASTIC QUAD FLATPACK
0,45
0,25
0,80
24
0,20 M
17
25
16
32
9
0,13 NOM
1
8
5,60 TYP
7,20
SQ
6,80
9,20
SQ
8,80
Gage Plane
0,05 MIN
0,25
0°– 7°
1,45
1,35
Seating Plane
0,75
0,45
0,10
1,60 MAX
4040172/D 04/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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www.ti.com/audio
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www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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