BZT52C2V4S-BZT52C39S ZENER DIODE SOD-323 FEATURES 1.35(0.053) 1.26(.050) 1.15(0.045) 1.24(.048) Planar die construction Ultra-Small surface mount package Ideally suited for automated assembly processes 2.75(0.108) 1.80(0.071) 2.75(0.108) 1.80(0.071) 2.30(0.091) 1.60(0.063) 2.30(0.091) 1.60(0.063) MECHANICAL DATA 0.4(0.016) .305(0.012) .25(0.010) .295(0.010) .177(.007) .089(.003) 1.00(.040) 0.1(0.004) 0.80(.031) MIN .72(0.028) .69(0.027) Case: Molded plastic body Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Polarity: Polarity symbols marked on case .08(.003) MIN Dimensions in millimeters and (inches) Maximum ratings (Tamb=25C unless otherwise specified) PARAMETER Forward voltage (Note 2) @IF=10mA Power dissipation (Note1) Thermal resistance, Junction to ambient air (Note1) Operating and storage temperature range Limits VF 0.9 V Pd 200 mW RΘJA 625 C/W TJ,TSTG -65 to +150 C NOTES: 1.Valid provided that device terminals are kept at ambient temperature. 2.Short duration test pulse used in minimize self-heating effect. 3.f=1KHz. UNITS SYMBOLS ELECTRICAL CHARACTERISTICS (@ TA=25C unless otherwise specified) Type Number Type Code Zener Voltage Range (Note 2) Vz@Izr Izr Nom(V) Min(V) Max(V) mA 2.2 5 2.4 2.6 2.5 5 2.7 2.9 2.8 5 3.0 3.2 3.1 5 3.3 3.5 3.4 5 3.6 3.8 3.7 5 3.9 4.1 4.0 5 4.3 4.6 4.4 5 4.7 5.0 4.8 5 5.1 5.4 5.2 5 5.6 6.0 5.8 5 6.2 6.6 6.4 5 6.8 7.2 7.0 5 7.5 7.9 7.7 5 8.2 8.7 8.5 5 9.1 9.6 9.4 10 10.6 5 10.4 11.6 5 11 11.4 12.7 5 12 12.4 14.1 5 13 13.8 15.6 5 15 15.3 17.1 5 16 16.8 19.1 5 18 18.8 21.2 5 20 20.8 23.3 5 22 22.8 25.6 5 24 25.1 28.9 2 27 28.0 32.0 2 30 31.0 35.0 2 33 34.0 38.0 2 36 37.0 41.0 2 39 Maximum Zener Impedance (Note 3) Zzr@Izr Zzr@Izk BZT52C2V4S WX 100 W1 BZT52C2V7S 100 W2 BZT52C3V0S 95 W3 BZT52C3V3S 95 W4 BZT52C3V6S 90 W5 BZT52C3V9S 90 W6 BZT52C4V3S 90 W7 BZT52C4V7S 80 W8 BZT52C5V1S 60 W9 BZT52C5V6S 40 BZT52C6V2S WA 10 BZT52C6V8S WB 15 BZT52C7V5S WC 15 BZT52C8V2S WD 15 BZT52C9V1S WE 15 WF BZT52C10S 20 WG BZT52C11S 20 WH BZT52C12S 25 WI BZT52C13S 30 WJ BZT52C15S 30 WK BZT52C16S 40 WL BZT52C18S 45 WM BZT52C20S 55 WN BZT52C22S 55 WO BZT52C24S 70 WP BZT52C27S 80 WQ BZT52C30S 80 WR BZT52C33S 80 WS BZT52C36S 90 WT BZT52C39S 130 Note: 1.Valid prvided device terminals are kept at ambient temperatrue 2.Test with pluses, period=5ms,pluse width=300us. 3.f=1KHz 600 600 600 600 600 600 600 500 480 400 150 80 80 80 100 150 150 150 170 200 200 225 225 250 250 300 300 325 350 350 Izk mA 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 0.5 0.5 0.5 0.5 0.5 Maximum Reverse Current (Note 2) IR uA 50 20 10 5 5 3 3 3 2 1 3 2 1 0.7 0.5 0.2 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 VR V 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 2.0 4.0 4.0 5.0 5.0 6.0 7.0 8.0 8.0 8.0 10.5 11.2 12.6 14.0 15.4 16.8 18.9 21.0 23.1 25.2 27.3 Temperature Coefficent of zener voltage @IZT=5mA mV / C Min -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -3.5 -2.7 -2.0 0.4 1.2 2.5 3.2 3.8 4.5 5.4 6.0 7.0 9.2 10.4 12.4 14.4 16.4 18.4 21.4 24.4 27.4 30.4 33.4 Max 0 0 0 0 0 0 0 0.2 1.2 2.5 3.7 4.5 5.3 6.2 7.0 8.0 9.0 10.0 11.0 13.0 14.0 16.0 18.0 20.0 22.0 25.3 29.4 33.4 37.4 41.2 RATINGS AND CHARACTERISTIC CURVES BZT52C2V4S-BZT52C39S FIG. 1- POWER DERATING CURVE FIG. 2-ZENER BREAKDOWN CHARACTERISTICS 500 400 300 200 C3V3 40 Tj=25 C5V6 C6V6 C4V7 C8V2 30 20 Test current Iz 5mA 10 100 0 0 100 0 0 200 1 FIG. 3-ZENER BREAKDOWN CHARACTERISTICS 4 5 6 7 8 9 10 1000 C10 Tj=25 C12 C15 20 C18 C22 Test current Iz 2mA C27 10 Test current Iz 5mA C33 C36 0 0 3 FIG. 4-JUNCTION CAPACITANCE VS NOMINAL ZENER VOLTAGE CJ, JUNCTION CAPACITANCE (pF) 30 2 VZ,ZENER VOLTAGE (V) TA, AMBIENT TEMPERATURE( C) Vz, ZENER CURRENT (mA) C3V9 C2V7 See Note1 Iz, ZENER CURRENT (mA) Pd, POWER DISSPATION (mW) 50 Tj=25 Va=1V Va=2V 100 Va=1V Va=2V 10 10 20 VZ,ZENER VOLTAGE (V) 30 40 0 10 Vz, NOMINAL ZENER VOLTAGE(V) The cruve graph is for reference only, can't be the basis for judgment(曲线图仅供参考)! 100 RATINGS AND CHARACTERISTIC CURVES BZT52C2V4S-BZT52C39S PACKAGE OUTLINE Plastic surface mounted package SOD-323 SOD-323 K B C A D J E Dim Min Max A 1.275 1.325 B 1.675 1.725 C D 0.25 0.35 E 0.27 0.37 H 0.02 0.1 J H 0.9 Typical K 0.1 Typical 2.6 2.7 All Dimensions in mm SOLDERING FOOTPRINT Unit : mm PACKAGE INFORMATION Device Package Shipping BZT52C2V0S-BZT52C39S SOD-323 3000/Tape&Reel