AP6800GEO Pb Free Plating Product Advanced Power Electronics Corp. N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Low on-resistance G2 S2 ▼ Capable of 2.5V gate drive D2 ▼ Optimal DC/DC battery application S2 S1 TSSOP-8 G1 S1 BVDSS 20V RDS(ON) 20mΩ ID D1 6 ▼ RoHS compliant Description D1 The Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, ultra low on-resistance and cost-effectiveness. G1 D2 G2 S1 S2 Absolute Maximum Ratings Parameter Symbol Rating Units VDS Drain-Source Voltage 20 V VGS Gate-Source Voltage ±10 V 3 ID@TA=25℃ Drain Current , VGS @ 4.5V 6.0 A ID@TA=70℃ 3 4.7 A Drain Current , VGS @ 4.5V 1 IDM Pulsed Drain Current 30 A PD@TA=25℃ Total Power Dissipation 1 W 0.008 W/℃ TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Linear Derating Factor Thermal Data Symbol Rthj-a Parameter Thermal Resistance Junction-ambient Data and specifications subject to change without notice 3 Max. Value Unit 125 ℃/W 200109061-1/4 AP6800GEO Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. 20 - - V - 0.02 - V/℃ VGS=4.5V, ID=6A - - 20 mΩ VGS=4V, ID=4A - - 21 mΩ VGS=2.5V, ID=2A - - 25 mΩ 0.5 - 1.2 V - 6 - S BVDSS Drain-Source Breakdown Voltage ΔBVDSS/ΔTj Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA RDS(ON) Static Drain-Source On-Resistance VGS=0V, ID=250uA 2 Max. Units Gate Threshold Voltage VDS=VGS, ID=250uA gfs Forward Transconductance VDS=10V, ID=6A IDSS Drain-Source Leakage Current (Tj=25oC) VDS=20V, VGS=0V - - 1 uA Drain-Source Leakage Current (Tj=70oC) VDS=16V ,VGS=0V - - 25 uA Gate-Source Leakage VGS=±10V - - ±30 uA ID=6A - 23.4 37 nC VGS(th) IGSS 2 Qg Total Gate Charge Qgs Gate-Source Charge VDS=15V - 2.5 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 11.1 - nC VDS=10V - 8.2 - ns 2 td(on) Turn-on Delay Time tr Rise Time ID=1A - 18.4 - ns td(off) Turn-off Delay Time RG=3.3Ω,VGS=5V - 19.6 - ns tf Fall Time RD=10Ω - 58 - ns Ciss Input Capacitance VGS=0V - 580 930 pF Coss Output Capacitance VDS=20V - 315 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 165 - pF Rg Gate Resistance f=1.0MHz - 2 3 Ω Source-Drain Diode Symbol VSD Parameter Forward On Voltage2 2 trr Reverse Recovery Time Qrr Reverse Recovery Charge Min. Typ. IS=0.84A, VGS=0V Test Conditions - - Max. Units 1.2 V IS=6A, VGS=0V, - 40 - ns dI/dt=100A/µs - 39 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse width <300us , duty cycle <2%. 3.Surface mounted on 1 in2 copper pad of FR4 board ; 208℃/W when mounted on Min. copper pad. 2/4 AP6800GEO 40 40 o T A =150 C ID , Drain Current (A) ID , Drain Current (A) 30 V G =2.0V 20 4.5V 3.5V 3.0V 2.5V o 4.5V 3.5V 3.0V 2.5V T A =25 C 10 30 V G =2.0V 20 10 0 0 0 1 2 3 4 0 1 2 3 4 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 1.9 70 I D = 4A I D = 6A V G = 4.5V T A =25 o C Normalized RDS(ON) RDS(ON) (mΩ ) 1.5 40 1.1 0.7 0.3 10 0 2 4 6 8 -50 10 V GS , Gate-to-Source Voltage (V) 0 50 100 150 o T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance 5 1.6 4 1.2 o T j =150 C T j =25 C IS (A) 3 VGS(th) (V) o 0.8 2 0.4 1 200109061-1/4 0 0 0 0.2 0.4 0.6 0.8 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1 -50 0 50 100 150 T j , Junction Temperature ( o C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3/4 AP6800GEO f=1.0MHz 12 10000 ID=6A V DS =10V V DS =12V V DS =15V 8 C (pF) VGS , Gate to Source Voltage (V) 10 6 1000 C iss 4 C oss 2 C rss 0 100 0 5 10 15 20 25 30 35 40 45 1 50 5 Q G , Total Gate Charge (nC) 9 13 17 21 25 29 V DS , Drain-to-Source Voltage (V) Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics 1 100 Normalized Thermal Response (Rthja) Duty factor = 0.5 100us 10 ID (A) 1ms 10ms 1 100ms 0.1 1s o T A =25 C Single Pulse DC 0.2 0.1 0.1 0.05 0.02 0.01 PDM t 0.01 T Single Pulse Duty Factor = t/T Peak Tj = PDM x Rthja + Ta Rthja=208 oC/W 0.001 0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100 1000 t , Pulse Width (s) V DS , Drain-to-Source Voltage (V) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 70 VG V DS = 5V 60 QG ID , Drain Current (A) 50 T j =25 o C 5V T j =150 o C 40 QGS QGD 30 20 10 Charge Q 0 0 2 4 6 V GS , Gate-to-Source Voltage (V) Fig 11. Transfer Characteristics Fig 12. Gate Charge Waveform 4/4