MBRB2535CTL Preferred Device SWITCHMODE™ Power Rectifier D2PAK Surface Mount Power Package The D2PAK Power Rectifier employs the Schottky Barrier principle in a large metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. These state−of−the−art devices have the following features: http://onsemi.com SCHOTTKY BARRIER RECTIFIER 25 AMPERES, 35 VOLTS 1 Features • • • • • • • • 4 3 Center−Tap Configuration Guardring for Stress Protection Low Forward Voltage 125°C Operating Junction Temperature Epoxy Meets UL 94, V−0 @ 0.125 in Short Heatsink Tab Manufactured − Not Sheared Similar in Size to the Industry Standard TO−220 Package Pb−Free Packages are Available 4 1 3 MARKING DIAGRAM Mechanical Characteristics AYWW B2535LG AKA • Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 • Weight: 1.7 grams (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • • • D2PAK CASE 418B STYLE 3 Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V) A Y WW B2535L G AKA = Assembly Location = Year = Work Week = Device Code = Pb−Free Package = Diode Polarity ORDERING INFORMATION Device Package Shipping† MBRB2535CTL D2PAK 50 Units/Rail MBRB2535CTLG D2PAK (Pb−Free) 50 Units/Rail MBRB2535CTLT4 D2PAK 800/Tape & Reel MBRB2535CTLT4G D2PAK 800 Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. © Semiconductor Components Industries, LLC, 2007 January, 2007 − Rev. 6 1 Publication Order Number: MBRB2535CTL/D MBRB2535CTL MAXIMUM RATINGS (Per Leg) Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 35 V Average Rectified Forward Current, (Rated VR, TC = 110°C) IF(AV) 12.5 A Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 90°C) IFRM 25 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 150 A Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) IRRM 1.0 A Storage Temperature Range Tstg −65 to +150 °C Operating Junction Temperature TJ −65 to +125 °C dv/dt 10,000 V/ms Rating Voltage Rate of Change (Rated VR) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS (Per Leg) Characteristic Thermal Resistance, Junction−to−Case Junction−to−Ambient (Note 1) Symbol Value Unit RqJC RqJA 1.0 84 °C/W ELECTRICAL CHARACTERISTICS (Per Leg) Maximum Instantaneous Forward Voltage (Note 2) (iF = 25 A, TJ = 25°C) (iF = 12.5 A, TJ = 125°C) (iF = 12.5 A, TJ = 25°C) vF Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TJ = 125°C) (Rated dc Voltage, TJ = 25°C) IR V 0.55 0.41 0.47 mA 500 10 1. When mounted using minimum recommended pad size on FR−4 board. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. http://onsemi.com 2 1000 50 20 I R, REVERSE LEAKAGE CURRENT (mA) I F, INSTANTANEOUS FORWARD CURRENT (AMP) MBRB2535CTL TJ = 125°C 10 5 TJ = 25°C 2 1 0.5 0.2 0.1 0 0.1 TJ = 125°C 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.9 TJ = 100°C 10 1 TJ = 25°C 0.1 10 0 40 TJ = 125°C 35 SQUARE WAVE 30 25 SINE WAVE (RESISTIVE LOAD) 20 DC 15 10 5 0 0 5 10 15 20 25 30 35 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 10 15 20 25 VR, REVERSE VOLTAGE (VOLTS) 30 35 Figure 2. Typical Reverse Current, Per Leg 40 IF(AV), AVERAGE FORWARD CURRENT (AMPS) PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS) Figure 1. Typical Forward Voltage, Per Leg 5 32 (RATED Vr APPLIED) RqJC = 2°C/W 28 24 20 DC 16 SQUARE 12 8 4 0 85 Figure 3. Typical Forward Power Dissipation 95 105 115 TC, CASE TEMPERATURE (°C) Figure 4. Current Derating, Case http://onsemi.com 3 125 MBRB2535CTL PACKAGE DIMENSIONS D2PAK CASE 418B−04 ISSUE J C −B− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. E 4 V W 1 2 S 3 DIM A B C D E F G H J K L M N P R S V A −T− SEATING PLANE G K D 3 PL 0.13 (0.005) VARIABLE CONFIGURATION ZONE M T B W J M H N R L M P U L M STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE L M F F F VIEW W−W 1 VIEW W−W 2 VIEW W−W 3 SOLDERING FOOTPRINT* 8.38 0.33 1.016 0.04 10.66 0.42 5.08 0.20 3.05 0.12 17.02 0.67 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4 INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40 MBRB2535CTL SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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