MCP1642B/D 1.8A Input Current Switch, 1 MHz Low-Voltage Start-Up Synchronous Boost Regulator Features General Description • Up to 96% Typical Efficiency • 1.8A Typical Peak Input Current Limit: - IOUT > 175 mA @ 1.2V VIN, 3.3V VOUT - IOUT > 600 mA @ 2.4V VIN, 3.3V VOUT - IOUT > 800 mA @ 3.3V VIN, 5.0V VOUT - IOUT > 1A @ VIN > 3.6V, 5.0V VOUT • Low Start-Up Voltage: 0.65V, typical 3.3V VOUT @ 1 mA • Low Operating Input Voltage: 0.35V, typical 3.3V VOUT @ 1 mA • Output Voltage Range: - Reference Voltage, VFB = 1.21V - 1.8V to 5.5V for the adjustable device option - 1.8V, 3.0V, 3.3V and 5.0V for fixed VOUT options • Maximum Input Voltage VOUT < 5.5V • PWM Operation: 1 MHz - Low Noise, Anti-Ringing Control • Power Good Open-Drain Output • Internal Synchronous Rectifier • Internal Compensation • Inrush Current Limiting and Internal Soft-Start • Selectable, Logic-Controlled Shutdown States: - True Load Disconnect Option (MCP1642B) - Input-to-Output Bypass Option (MCP1642D) • Shutdown Current (All States): 1 µA • Overtemperature Protection • Available Packages: - 8-Lead MSOP - 8-Lead 2x3 DFN The MCP1642B/D devices are compact, high-efficiency, fixed-frequency, synchronous step-up DC-DC converters. This family of devices provides an easy-to-use power supply solution for applications powered by either one-cell, two-cell, or three-cell alkaline, Ultimate Lithium, NiCd, NiMH, one-cell Li-Ion or Li-Polymer batteries. Low-voltage technology allows the regulator to start-up without high inrush current or output voltage overshoot from a low voltage input. High efficiency is accomplished by integrating the low-resistance N-Channel Boost switch and synchronous P-Channel switch. All compensation and protection circuitry are integrated to minimize the number of external components. An open-drain Power Good output is provided to indicate when the output voltage is within 10% of regulation and facilitates the interface with an MCU. For standby applications, MCP1642B provides a “true output disconnect” from input to output while in shutdown (EN = GND). An additional device option (MCP1642D) is available and connects “input to output bypass” while in shutdown. Both options consume less than 1 µA of input current. For the adjustable (ADJ) device options, the output voltage is set by a small external resistor divider. Fixed VOUT device options do not require external divider resistors. Two package options, 8-lead MSOP and 8lead 2x3 DFN, are available. Applications • One, Two and Three-Cell Alkaline, Lithium Ultimate and NiMH/NiCd Portable Products • Single-Cell Li-Ion to 5V Converters • PIC® MCU Power • USB Emergency Backup Charger from Batteries • Personal Medical Products • Wireless Sensors • Hand-Held Instruments • GPS Receivers • +3.3V to +5.0V Distributed Power Supply Package Types MCP1642B/D-xx MSOP MCP1642B/D-xx 2x3 DFN* EN 1 8 VIN NC 2 7 SGND NC 2 PG 3 6 PGND PG 3 VOUT 4 VOUT 4 5 SW MCP1642B/D-ADJ MSOP EN 1 8 VIN VFB 2 7 SGND VFB 2 PG 3 6 PGND PG 3 VOUT 4 5 SW EP 9 7 SGND 6 PGND 5 SW MCP1642B/D-ADJ 2x3 DFN* EN 1 VOUT 4 8 VIN 8 VIN EN 1 EP 9 7 SGND 6 PGND 5 SW * Includes Exposed Thermal Pad (EP); see Table 3-1. 2014 Microchip Technology Inc. DS20005253A-page 1 MCP1642B/D Typical Application L1 4.7 µH VOUT 3.3V CIN 4.7...10 µF VIN= 0.9 to 1.6V VIN + SW VOUT COUT 4.7...10 µF ALKALINE MCP1642B-33 NC PG EN - GND ON OFF L 4.7 µH VOUT CIN 4.7...10 µF 5.0V SW VOUT VIN VIN= 1.8 to 3.2V MCP1642D-ADJ VFB ALKALINE + RTOP 976 k RBOT 309 k EN - COUT 4.7...10 µF RPG 1 M ON ALKALINE + OFF ® From PIC MCU I/O GND PG To PIC MCU I/O - 100 90 VIN = 1.2V, VOUT = 3.3V Efficiency (%) 80 70 VIN = 2.5V, VOUT = 5.0V 60 50 40 30 20 10 0 1 10 100 1000 IOUT (mA) DS20005253A-page 2 2014 Microchip Technology Inc. MCP1642B/D 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † EN, FB, VIN, VSW, VOUT – GND .......................... +6.5V EN, FB ......<maximum of VOUT or VIN > (GND – 0.3V) Output Short-Circuit Current ...................... Continuous Output Current Bypass Mode........................... 800 mA Power Dissipation ............................ Internally Limited Storage Temperature ..........................-65°C to +150°C Ambient Temp. with Power Applied.......-40°C to +85°C Operating Junction Temperature.........-40°C to +125°C ESD Protection On All Pins: HBM........................................................ 4 kV MM......................................................... 300V DC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Conditions Minimum Start-Up Voltage VIN — 0.65 0.8 V Note 1 — 0.9 1.8 V MCP1642B/D-50, Note 1 Minimum Input Voltage After Start-Up VIN — 0.35 — V Note 1, Note 5 — 0.5 — V Note 1, Note 5, MCP1642B/D-50 Output Voltage Adjust. Range (MCP1642B/D-ADJ) VOUT 1.8 — 5.5 V VOUT VIN (MCP1642B/D-ADJ); Note 2 Output Voltage (MCP1642B/D-XX) VOUT — 1.8 — V VIN < 1.8V, MCP1642B/D-18, Note 2 — 3.0 — V VIN < 3.0V, MCP1642B/D-30, Note 2 — 3.3 — V VIN < 3.3V, MCP1642B/D-33, Note 2 — 5.0 — V VIN < 5.0V, MCP1642B/D-50, Note 2 — 175 — mA 1.2V VIN, 1.8V VOUT, Note 5 — 300 — mA 1.5V VIN, 3.3V VOUT, Note 5 — 800 — mA 3.3V VIN, 5.0V VOUT, Note 5 Input Characteristics Maximum Output Current IOUT Feedback Voltage VFB 1.173 1.21 1.247 V Feedback Input Bias Current IVFB — 1.0 — nA Note 1: 2: 3: 4: 5: Note 5 Resistive load, 1 mA. For VIN > VOUT, VOUT will not remain in regulation. IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPWM * (VOUT/VIN)). 220 resistive load, 3.3V VOUT (15 mA). Determined by characterization, not production tested. 2014 Microchip Technology Inc. DS20005253A-page 3 MCP1642B/D DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Quiescent Current – PWM Mode IQPWM — 400 500 µA Measured at VOUT, EN = VIN, IOUT = 0 mA, Note 3 Quiescent Current – Shutdown IQSHDN — 1 — µA VOUT = EN = GND, IOUT = 0 mA includes N-Channel and P-Channel Switch Leakage NMOS Switch Leakage INLK — 0.5 — µA VIN = VSW = 5V, VOUT = 5.5V, VEN = VFB = GND PMOS Switch Leakage IPLK — 0.2 — µA VIN = VSW = GND, VOUT = 5.5V NMOS Switch ON Resistance RDS(ON)N — 0.15 — VIN = 3.3V, ISW = 250 mA, Note 5 PMOS Switch ON Resistance RDS(ON)P — 0.3 — VIN = 3.3V, ISW = 250 mA, Note 5 IN(MAX) — 1.8 — A Note 5 NMOS Peak Switch Current Limit Accuracy Line Regulation Load Regulation Note 1: 2: 3: 4: 5: Conditions VFB% -3 — 3 % MCP1642B/D-ADJ, VIN = 1.2V VOUT% -3 — 3 % MCP1642B/D-18, VIN = 1.2V -3 — 3 % MCP1642B/D-30, VIN = 1.2V -3 — 3 % MCP1642B/D-33, VIN = 1.2V -3 — 3 % VFB/VFB) /VIN| -0.5 0.01 0.5 %/V MCP1642B/D-ADJ, VIN = 1.5V to 3.0V, IOUT = 25 mA MCP1642B/D-50, VIN = 2.5V VOUT/VOUT) /VIN| -0.5 0.05 0.5 %/V MCP1642B/D-18, VIN = 1.0V to 1.5V, IOUT = 25 mA -0.5 0.01 0.5 %/V MCP1642B/D-30, VIN = 1.5V to 2.5V, IOUT = 25 mA -0.5 0.01 0.5 %/V MCP1642B/D-33, VIN = 1.5V to 3.0V, IOUT = 25 mA -0.5 0.01 0.5 %/V MCP1642B/D-50, VIN = 2.5V to 4.2V, IOUT = 25 mA VFB/VFB| -1.5 0.05 1.5 % IOUT = 25 mA to 150 mA, VIN = 1.5V VOUT/VOUT| -1.5 0.1 1.5 % MCP1642B/D-18, VIN = 1.5V, IOUT = 25 mA to 75 mA -1.5 0.1 1.5 % MCP1642B/D-30, VIN = 1.5V, IOUT = 25 mA to 125 mA -1.5 0.1 1.5 % MCP1642B/D-33, VIN = 1.5V, IOUT = 25 mA to 150 mA — 0.5 — % MCP1642B/D-50, VIN = 3.0V, IOUT = 25 mA to 500 mA, Note 5 Resistive load, 1 mA. For VIN > VOUT, VOUT will not remain in regulation. IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPWM * (VOUT/VIN)). 220 resistive load, 3.3V VOUT (15 mA). Determined by characterization, not production tested. DS20005253A-page 4 2014 Microchip Technology Inc. MCP1642B/D DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Maximum Duty Cycle DCMAX — 90 — % Switching Frequency fSW 0.85 1.0 1.15 MHz EN Input Logic High VIH 75 — — % of VIN IOUT = 1 mA, for MCP1642B/D-50 VIN = 2.5V EN Input Logic Low VIL — — 20 % of VIN IOUT = 1 mA, for MCP1642B/D-50 VIN = 2.5V EN Input Leakage Current Conditions Note 5 Note 5, IOUT = 65 mA, for MCP1642B/D-50 VIN = 2.5V IENLK — 0.1 — µA VEN = 1.2V Power Good Threshold PGTHF — 90 — % VFB Falling, Note 5 Power Good Hysteresis PGHYS — 3 — % Note 5 Power Good Output Low PGLOW — 0.4 — V ISINK = 5 mA, VFB = 0V, Note 5 PGDELAY — 600 — µs Note 5 Power Good Output Response Power Good Output Delay PGRES — 250 — µs Note 5 Power Good Input Voltage Operating Range VPG_VIN 0.9 — 5.5 V ISINK = 5 mA, VFB = 0V, Note 5 Power Good Leakage Current PGLEAK — 0.01 — µA VPG = 5.5V, VOUT in Regulation, Note 5 Soft Start Time tSS — 550 — µs Thermal Shutdown Die Temperature TSD — 150 — C EN Low to High, 90% of VOUT, Note 4, Note 5 Note 5 TSDHYS — 35 — C Note 5 Die Temperature Hysteresis Note 1: 2: 3: 4: 5: Resistive load, 1 mA. For VIN > VOUT, VOUT will not remain in regulation. IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPWM * (VOUT/VIN)). 220 resistive load, 3.3V VOUT (15 mA). Determined by characterization, not production tested. TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C. Parameters Sym. Min. Typ. Max. Units Operating Ambient Temperature Range TA -40 — +85 °C Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Thermal Resistance, 8L-MSOP JA — 211 — °C/W Thermal Resistance, 8L-2x3 DFN JA — 68 — °C/W Conditions Temperature Ranges Steady State Transient Package Thermal Resistances 2014 Microchip Technology Inc. DS20005253A-page 5 MCP1642B/D NOTES: DS20005253A-page 6 2014 Microchip Technology Inc. MCP1642B/D 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). 100 500 80 450 Efficiency (%) IQ PWM Mode (µA) 475 425 VOUT = 5.0V 400 375 VOUT = 3.3V VIN = 1.6V 70 VIN = 1.2V 60 50 40 30 350 VOUT = 2.0V 20 325 10 300 0 -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) FIGURE 2-1: Temperature. 80 VOUT IQPWM vs. Ambient 0.1 100 IOUT = 50 mA VIN = 1.8V 90 3.312 Efficiency (%) 3.310 3.308 3.306 10 IOUT (mA) 100 1000 2.0V VOUT Mode Efficiency VOUT = 3.3V VIN = 2.5V 80 VIN = 1.2V 1 FIGURE 2-4: vs. IOUT. 3.314 VOUT (V) VOUT = 2.0V 90 VIN = 1.2V VIN = 1.2V 70 60 50 40 30 20 10 3.304 -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) 3.3V VOUT vs. Ambient FIGURE 2-2: Temperature. 0 80 0.1 90 IOUT = 50 mA 5.000 VIN = 2.5V 4.995 4.990 4.985 100 1000 VOUT = 5.0V 80 Efficiency (%) VOUT (V) 5.005 10 IOUT (mA) 3.3V VOUT Mode Efficiency FIGURE 2-5: vs. IOUT. 100 5.010 1 VIN = 3.6V 70 VIN = 2.5V 60 50 40 30 20 VIN = 1.8V 10 4.980 -40 FIGURE 2-3: Temperature. -25 -10 5 20 35 50 65 Ambient Temperature (°C) 80 5.0V VOUT vs. Ambient 2014 Microchip Technology Inc. 0 0.1 FIGURE 2-6: vs. IOUT. 1 10 IOUT (mA) 100 1000 5.0V VOUT Mode Efficiency DS20005253A-page 7 MCP1642B/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). 1.50 1400 VOUT = 5.0V 1200 1.30 VOUT = 3.3V 1.10 VIN (V) IOUT (mA) 1000 VOUT = 5.0V 800 600 VOUT = 2.0V Start-up 0.70 400 Shutdown 0.50 TA = +25°C TA = +85°C 200 0.30 0 0.8 1.2 1.6 FIGURE 2-7: 2 2.4 2.8 VIN (V) 3.2 3.6 4 0 4.4 Maximum IOUT vs. VIN. 20 80 100 Switching Frequency (kHz) 1004 IOUT = 15 mA 3.302 TA = 25°C 3.300 3.298 3.296 TA = 85°C 3.294 TA = -40°C 3.292 VOUT = 3.3V 1000 996 992 988 3.290 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 -40 3 -25 -10 5 20 35 50 65 Ambient Temperature (°C) VIN (V) FIGURE 2-8: 4.5 VOUT = 3.3V 0.65 80 fSW vs. Ambient FIGURE 2-11: Temperature. 3.3V VOUT vs. VIN. 0.70 VOUT = 5.0V 4 Start-up 3.5 0.60 0.55 VIN (V) VIN (V) 40 60 IOUT (mA) FIGURE 2-10: 5.0V VOUT Minimum Start-Up and Shutdown VIN into Resistive Load vs. IOUT. 3.304 VOUT (V) 0.90 0.50 Shutdown 0.45 3 VOUT = 3.3V 2.5 VOUT = 2.0V 2 1.5 0.40 1 0.35 0.5 0.30 0 0 20 40 60 IOUT (mA) 80 100 FIGURE 2-9: 3.3V VOUT Minimum Start-Up and Shutdown VIN into Resistive Load vs. IOUT. DS20005253A-page 8 0 5 10 15 IOUT (mA) 20 25 FIGURE 2-12: PWM Pulse-Skipping Mode Threshold vs. IOUT. 2014 Microchip Technology Inc. MCP1642B/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). IIN (mA) 100 VOUT 20 mV/div AC coupled IOUT = 100 mA 10 VOUT = 5.0V VOUT = 3.3V 1 VSW 2V/div VOUT = 2.0V 0.1 0.8 1.2 1.6 2 FIGURE 2-13: Current vs. VIN. 2.4 2.8 VIN (V) 3.2 3.6 4 4.4 1 µs/div Average of No Load Input 2.5 Switch Resistance (:) IL 200 mA/div FIGURE 2-16: MCP1642B/D High Load PWM Mode Waveforms. 0.25 2 IOUT = 15 mA 0.2 N - Channel 1.5 0.15 1 0.1 VOUT 1V/div P - Channel 0.5 VIN 1V/div 0.05 0 0 1 1.4 1.8 2.2 2.6 3 3.4 > VIN or VOUT 3.8 VEN 1V/div 4.2 FIGURE 2-14: N-Channel and P-Channel RDSON vs. > of VIN or VOUT. 200 µs/div FIGURE 2-17: 3.3V Start-Up After Enable. IOUT = 1 mA VOUT 20 mV/div AC coupled I OUT = 15 mA VOUT 2V/div VSW 1V/div IL 100 mA/div VIN 1V/div IL 200 mA/div 200 µs/div 1 µs/div FIGURE 2-15: MCP1642B/D 3.3V VOUT Light Load PWM Mode Waveforms. 2014 Microchip Technology Inc. FIGURE 2-18: VIN = VENABLE. 3.3V Start-Up When DS20005253A-page 9 MCP1642B/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). VOUT 100 mV/div AC coupled IOUT 100 mA/div Step from 20 mA to 150 mA 400 µs/div FIGURE 2-19: MCP1642B 3.3V VOUT Load Transient Waveforms. VOUT 100 mV/div AC coupled VIN 1V/div Step from 1.2V to 2.4V 400 µs/div FIGURE 2-20: Waveforms. DS20005253A-page 10 3.3V VOUT Line Transient 2014 Microchip Technology Inc. MCP1642B/D 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP1642B/D-XX MCP1642B/D-ADJ MSOP, 2x3 DFN MSOP, 2x3 DFN 3.1 1 1 Symbol Description EN Enable pin. Logic high enables operation. Do not allow this pin to float. 2 — NC Not Connected. — 2 VFB Reference Voltage pin. Connect VFB to an external resistor divider to set the output voltage (for fixed VOUT options, this pin is not connected). 3 3 PG Open-Drain Power Good pin. Indicates when the output voltage is within regulation. 4 4 VOUT 5 5 SW 6 6 PGND Power Ground reference. 7 7 SGND Signal Ground reference. 8 8 VIN Input supply voltage. Local bypass capacitor required. 9 9 EP Exposed Thermal Pad (2x3 DFN only). Boost Converter Output. Boost and Rectifier Switch input. Connect boost inductor between SW and VIN. Enable Pin (EN) The EN pin is a logic-level input used to enable or disable device switching and lower quiescent current while disabled. A logic high (>75% of VIN) will enable the regulator output. A logic low (<20% of VIN) will ensure that the regulator is disabled. 3.2 Feedback Voltage Pin (VFB) The VFB pin is used to provide output voltage regulation by using a resistor divider for the ADJ device option. The typical feedback voltage will be 1.21V, with the output voltage in regulation. 3.3 Power Good Pin (PG) The Power Good pin is an open-drain output which can be tied to VOUT using a pull-up resistor. It turns low when VOUT drops below 10% of its nominal value. 3.4 Output Voltage Pin (VOUT) 3.6 Power Ground Pin (PGND) The power ground pin is used as a return for the high-current N-Channel switch. The PGND and SGND pins are connected externally. 3.7 Signal Ground Pin (SGND) The signal ground pin is used as a return for the integrated VREF and error amplifier. The SGND and power ground (PGND) pins are connected externally. 3.8 Power Supply Input Voltage Pin (VIN) Connect the input voltage source to VIN. The input source should be decoupled to GND with a 4.7 µF minimum capacitor. 3.9 Exposed Thermal Pad (EP) There is no internal electrical connection between the Exposed Thermal Pad (EP) and the SGND and PGND pins. They must be connected to the same electric potential on the Printed Circuit Board (PCB). The output voltage pin connects the integrated P-Channel MOSFET to the output capacitor. The FB voltage divider is also connected to the VOUT pin for voltage regulation for the “ADJ” option. 3.5 Switch Node Pin (SW) Connect the inductor from the input voltage to the SW pin. The SW pin carries inductor current and can be as high as 1.8A peak. The integrated N-Channel switch drain and integrated P-Channel switch source are internally connected at the SW node. 2014 Microchip Technology Inc. DS20005253A-page 11 MCP1642B/D NOTES: DS20005253A-page 12 2014 Microchip Technology Inc. MCP1642B/D 4.0 DETAILED DESCRIPTION 4.1.3 4.1 Device Option Overview For the MCP1642B/D ADJ option, the output voltage is adjustable with a resistor divider over a 1.8V minimum to 5.5V maximum range. The middle point of the resistor divider connects to the VFB pin. High-value resistors are recommended to minimize quiescent current to keep efficiency high at light loads. The reference voltage is VFB = 1.21V. The MCP1642B/D family of devices is capable of low start-up voltage and delivers high efficiency over a wide load range for single-cell, two-cell, three-cell alkaline, Ultimate Lithium, NiMH, NiCd and single-cell Li-Ion battery inputs. A high level of integration lowers total system cost, eases implementation and reduces board area. 4.1.4 ADJUSTABLE OUTPUT VOLTAGE OPTION FIXED OUTPUT VOLTAGE OPTION The devices feature low start-up voltage, fixed and adjustable output voltage, PWM mode operation, integrated synchronous switch, internal compensation, low noise anti-ringing control, inrush current limit and soft start. For the fixed output voltage option of the MCP1642B/D devices, the VFB pin is not connected. There is an internal feedback divider which minimizes quiescent current to keep efficiency high at light loads. There are two shutdown options for the MCP1642B/D family: The fixed set values are: 1.8V, 3.0V, 3.3V and 5.0V. • True Output Disconnect mode (MCP1642B) • Input-to-Output Bypass mode (MCP1642D) 4.1.1 TRUE OUTPUT DISCONNECT MODE OPTION The MCP1642B device incorporates a true output disconnect feature. With the EN pin pulled low, the output of the MCP1642B is isolated or disconnected from the input by turning off the integrated P-Channel switch and removing the switch bulk diode connection. This removes the DC path that is typical in boost converters, which allows the output to be disconnected from the input. During this mode, less than 1 µA of current is consumed from the input (battery). True output disconnect does not discharge the output. 4.1.2 The value of the internal divider is 815 k typical. TABLE 4-1: PART NUMBER SELECTION BY SHUTDOWN OPTION Part Number True Output Input-to-Output Disconnect Bypass MCP1642B-ADJ (or -18; 30; 33; 50) X — MCP1642D-ADJ (or -18; 30; 33; 50) — X INPUT-TO-OUTPUT BYPASS MODE OPTION The MCP1642D device incorporates the Input-to-Output Bypass shutdown option. With the EN input pulled low, the output is connected to the input using the internal P-Channel MOSFET. In this mode, the current drawn from the input (battery) is less than 1 µA with no load. The Input-to-Output Bypass mode is used when the input voltage is high enough for the load to operate (e.g. PIC MCU operating in sleep mode). When a higher regulated output voltage and load current are necessary, the EN pin must be pulled high, enabling the boost converter. 2014 Microchip Technology Inc. DS20005253A-page 13 MCP1642B/D 4.2 Functional Description The MCP1642B/D devices are compact, high-efficiency, fixed-frequency, step-up DC-DC converters that provide an easy-to-use power supply solution for applications powered by either one-cell, two-cell, or three-cell alkaline, Ultimate Lithium, NiCd, or NiMH, or one-cell Li-Ion or Li-Polymer batteries. Figure 4-1 depicts the functional block diagram of the MCP1642B/D devices. VOUT VIN Internal Bias IZERO Direction Control Soft-Start SW EN Gate Drive and Shutdown Control Logic 0V OCREF ILIMIT ISENSE PGND Oscillator Slope Compensation S SGND * VOUT PWM Logic EA 1.21V VFB (NC) 0.9 x VREF VFB PG * Available in Fixed Output option Section 4.2.4 “Fixed Output Voltage”. FIGURE 4-1: DS20005253A-page 14 only. See MCP1642B/D Block Diagram. 2014 Microchip Technology Inc. MCP1642B/D 4.2.1 LOW-VOLTAGE START-UP The MCP1642B/D devices are capable of starting from a low input voltage. Start-up voltage is typically 0.65V for a 3.3V output and 1 mA resistive load. When enabled, the internal start-up logic turns the rectifying P-Channel switch on until the output capacitor is charged to a value close to the input voltage. During this period, the rectifying switch is current-limited at approximately 125 mA, which limits the start-up under heavy resistive load condition. After charging the output capacitor to the input voltage, the device starts switching. A ring oscillator is only used until the main RC oscillator has enough bias and is ready. The device runs open-loop until the output rises enough to start the RC oscillator. During this time, the boost switch current is limited to 50% of its nominal value. Once the output voltage reaches a high value, normal closed-loop PWM operation is initiated. Then, during the end sequence of the start-up, the MCP1642B/D devices charge an internal capacitor with a very weak current source. The voltage on this capacitor, in turn, slowly ramps the current limit of the boost switch to its nominal value (1.8A typical). The soft-start capacitor is completely discharged in the event of a commanded shutdown or a thermal shutdown. There is no undervoltage lockout feature for the MCP1642B/D devices. The devices will start up at the lowest possible voltage and run down to the lowest possible voltage. For typical battery applications, deeply discharged batteries may result in "motor-boating" (emission of a low-frequency tone). 4.2.2 PWM MODE OPERATION In normal PWM operation, the MCP1642B/D devices operate as fixed-frequency, synchronous boost converters. The switching frequency is internally maintained with a precision oscillator typically set to 1 MHz. At light loads, the MCP1642B/D devices begin to skip pulses. Figure 2-12 represents the input voltage versus load current for the pulse-skipping threshold in PWM mode. By operating in PWM-only mode, the output ripple remains low and the frequency is constant. Operating in fixed PWM mode results in low efficiency during light load operation but has low output ripple and noise for the supplied load. Lossless current sensing converts the peak current signal to a voltage to sum with the internal slope compensation. This summed signal is compared to the voltage error amplifier output to provide a peak current control command for the PWM signal. The slope compensation is adaptive to the input and output voltage. Therefore, the converter provides the proper amount of slope compensation to ensure stability, but is not excessive, which causes a loss of phase margin. The peak current limit is set to 1.8A typical. 2014 Microchip Technology Inc. 4.2.3 ADJUSTABLE OUTPUT VOLTAGE The MCP1642B/D-ADJ output voltage is adjustable with a resistor divider over a 1.8V minimum to 5.5V maximum range. High-value resistors are recommended to minimize quiescent current to keep efficiency high at light loads. 4.2.4 FIXED OUTPUT VOLTAGE MCP1642B/D-XX has the feedback divider included. Four output values are available: 1.8V, 3.0V, 3.3V and 5.0V. For this option, pin 2 remains unconnected. The value of the internal divider is 815 k typical. 4.2.5 MAXIMUM OUTPUT VOLTAGE The maximum output current of the devices is dependent upon the input and output voltage. For example, to ensure a 200 mA load current for VOUT = 3.3V, a typical value of 1.3V input voltage is necessary. If an application is powered by one Li-Ion battery (VIN from 3.0V to 4.2V), the typical load current the MCP1642B/D devices can deliver is close to 800 mA at 5.0V output (see Figure 2-7). 4.2.6 ENABLE PIN The enable pin is used to turn the boost converter on and off. The enable threshold voltage varies with input voltage. To enable the boost converter, the EN voltage level must be greater than 75% of the VIN voltage. To disable the boost converter, the EN voltage must be less than 20% of the VIN voltage. 4.2.7 POWER GOOD OUTPUT PIN The MCP1642B/D devices have an internal comparator which is triggered when VOUT reaches 90% of regulation. An open-drain transistor allows interfacing with an MCU. It can sink up to a few mA from the power line at which the pull-up resistor is connected. See the DC Characteristics table for details. 4.2.8 INTERNAL BIAS The MCP1642B/D devices get their start-up bias from VIN. Once the output exceeds the input, bias comes from the output. Therefore, once started, operation is completely independent of VIN. Operation is only limited by the output power level and the input source series resistance. When started, the output will remain in regulation down to 0.35V typical with 1 mA output current for low source impedance inputs. DS20005253A-page 15 MCP1642B/D 4.2.9 INTERNAL COMPENSATION The error amplifier, with its associated compensation network, completes the closed-loop system by comparing the output voltage to a reference at the input of the error amplifier, and feeding the amplified and inverted signal to the control input of the inner current loop. The compensation network provides phase leads and lags at appropriate frequencies to cancel excessive phase lags and leads of the power circuit. All necessary compensation components and slope compensation are integrated. 4.2.10 SHORT-CIRCUIT PROTECTION Unlike most boost converters, the MCP1642B/D devices allow their output to be shorted during normal operation. The internal current limit and overtemperature protection limit excessive stress and protect the device during periods of short circuit, overcurrent and overtemperature. While operating in the Input-to-Output Bypass mode, the P-Channel current limit is inhibited to minimize quiescent current. 4.2.11 LOW NOISE OPERATION The MCP1642B/D devices integrate a low-noise anti-ring switch that damps the oscillations typically observed at the switch node of a boost converter when operating in the Discontinuous Inductor Current mode. This removes the high-frequency radiated noise. 4.2.12 OVERTEMPERATURE PROTECTION Overtemperature protection circuitry is integrated into the MCP1642B/D devices. This circuitry monitors the device junction temperature and shuts the device off if the junction temperature exceeds the typical +150°C threshold. If this threshold is exceeded, the device will automatically restart when the junction temperature drops by 35°C. The soft start is reset during an overtemperature condition. DS20005253A-page 16 2014 Microchip Technology Inc. MCP1642B/D 5.0 APPLICATION INFORMATION 5.1 Typical Applications The MCP1642B/D synchronous boost regulators operate over a wide input and output voltage range. The power efficiency is high for several decades of load range. Output current capability increases with the input voltage and decreases with the increasing output voltage. The maximum output current is based on the N-Channel peak current limit. Typical characterization curves in this data sheet are presented to display the typical output current capability. Overshoots and undershoots on pulsed load applications are reduced by adding a zero in the compensation loop. A small capacitance (for example, 27 or 33 pF) in parallel with an upper feedback resistor will reduce output spikes. This small capacitance also attenuates the low-frequency component on the output ripple that might appear when the device supplies light loads (ranging from 75 to 150 mA) and on condition that (VOUT – VIN) < 0.6V (see the application example in Figure 6-1). 5.2.1 VIN > VOUT SITUATION To calculate the resistor divider values for the MCP1642B/D, the following equation can be used. Where RTOP is connected to VOUT, RBOT is connected to GND and both are connected to the VFB input pin: For VIN > VOUT, the output voltage will not remain in regulation. VIN > VOUT is an unusual situation for a boost converter, and there is a common issue when two alkaline cells (2 x 1.6V typical) are used to boost to 3.0V output. A minimum headroom of approximately 200 to 300 mV between VOUT and VIN must be ensured, unless a low frequency higher than the PWM output ripple on VOUT is expected. This ripple and its frequency are VIN dependent. EQUATION 5-1: 5.3 5.2 Adjustable Output Voltage Calculations R TOP V OUT = R BOT ------------- – 1 V FB EXAMPLE 1: VOUT = 3.3V VFB = 1.21V RBOT = 309 k RTOP = 533.7 k (standard value = 536 k) EXAMPLE 2: VOUT = 5.0V VFB = 1.21V RBOT = 309 k RTOP = 967.9 k (standard value = 976 k) There are some potential issues with higher-value resistors. For small surface-mount resistors, environment contamination can create leakage paths that significantly change the resistive divider ratio, which in turn affects the output voltage. The FB input leakage current can also impact the divider and change the output voltage tolerance. For boost converters, the removal of the feedback resistors during operation must be avoided. In this case, the output voltage will increase above the absolute maximum output limits of the MCP1642B/D and damage the device (for additional information, see Application Note AN1337). 2014 Microchip Technology Inc. Power Good Output The Power Good output is meant to provide a method that gives information about the output state of the device. The Power Good comparator is triggered when VOUT reaches approximately 90% of regulation (on the falling edge). The PG pin is an open-drain output, which should be connected to VOUT through an external pull-up resistor. It is recommended to use a high-value resistor (to sink µA from output) in order to use less power while interfacing with an I/O PIC MCU port. The Power Good block is internally supplied by the maximum between the input and output voltage, and the minimum voltage necessary is 0.9V. This is important for applications in which the Power Good pin is pulled-up to an external supply. If the output voltage is less than 0.9V (e.g., due to an overcurrent situation or an output short circuit, and also if the device is in Shutdown - EN = GND), the input voltage has to be high enough to drive the Power Good circuitry. Power Good delay time is measured between the time when VOUT starts to regulate and the time when there is a response from Power Good output. Power Good response time is measured between the time when VOUT goes out of regulation with a 10% drop, and the time when Power Good output gets to a low level. Both Power Good delay time and Power Good response time are specified in the DC Characteristics table. Additionally, there are no blanking time or delays; there is only a 3% hysteresis of the Power Good comparator. Due to the dynamic response, MCU must interpret longer transients. DS20005253A-page 17 MCP1642B/D When VOUT resumes to a value higher than 93%, the PG pin switches to high level. 600 µs (typ.) 250 µs (typ.) VOUT PG DELAY PG RESPONSE PG Where: dV = Ripple voltage dt = ON time of the N-Channel switch (DC x 1/FSW) Table 5-1 contains the recommended range for the input and output capacitor value. Power Good Timing Diagram. Input Capacitor Selection The boost input current is smoothed by the boost inductor, reducing the amount of filtering necessary at the input. Some capacitance is recommended to provide decoupling from the source. Low ESR X5R or X7R are well suited, since they have a low temperature coefficient and small size. For light-load applications, 4.7 µF of capacitance is sufficient at the input. For high-power applications that have high source impedance or long leads which connect the battery to the input, 10 µF of capacitance is recommended. Additional input capacitance can be added to provide a stable input voltage. Table 5-1 contains the recommended range for the input capacitor value. 5.5 dV IOUT = C OUT ------- dt TABLE 5-1: FIGURE 5-1: 5.4 EQUATION 5-2: Output Capacitor Selection The output capacitor helps provide a stable output voltage during sudden load transients and reduces the output voltage ripple. As with the input capacitor, X5R and X7R ceramic capacitors are well suited for this application. Using other capacitor types (aluminum or tantalum) with large ESR has impact on the converter's efficiency (see AN1337) and maximum output power. The MCP1642B/D devices are internally compensated, so output capacitance range is limited. See Table 5-1 for the recommended output capacitor range. An output capacitance higher than 10 µF adds a better load step response and high-frequency noise attenuation, especially while stepping from light current loads to heavy current loads. In addition, 2 x 10 µF output capacitors ensure a better recovery of the output after a short period of overloading. While the N-Channel switch is on, the output current is supplied by the output capacitor COUT. The amount of output capacitance and equivalent series resistance will have a significant effect on the output ripple voltage. While COUT provides load current, a voltage drop also appears across its internal ESR that results in ripple voltage. DS20005253A-page 18 CAPACITOR VALUE RANGE CIN COUT Minimum 4.7 µF 10 µF Maximum — 100 µF 5.6 Inductor Selection The MCP1642B/D devices are designed to be used with small surface-mount inductors; the inductance value can range from 2.2 µH to 6.8 µH. An inductance value of 4.7 µH is recommended to achieve a good balance between the inductor size, the converter load transient response and the minimized noise. TABLE 5-2: MCP1642B/D RECOMMENDED INDUCTORS Part Number Value DCR (µH) (typ.) ISAT (A) Size WxLxH (mm) Coilcraft LPS4018-472 4.7 0.125 1.9 4.1x4.1x1.8 XFL4020-472 4.7 0.057 2.7 4.2x4.2x2.1 LPS5030-472 4.7 0.083 2 5x5x3 LPS6225-472 4.7 0.065 3.2 6.2x6.2x2.5 MSS6132-472 4.7 0.043 2.84 6.1x6.1x3.2 Würth Elektronik 744025004 Type WE-TPC 4.7 0.1 1.7 2.8x2.8x2.8 744042004 WE-TPC 4.7 0.07 1.65 4.8x4.8x1.8 744052005 WE-TPC 5 0.047 1.8 5.8x5.8x1.8 7447785004 WE-PD 4.7 0.06 2.5 6.2x5.9x3.3 B82462A2472M000 4.7 0.084 2.00 6.0x6.0x2.5 B82462G4472M 4.7 0.04 1.8 6.3x6.3x3.0 TDK/EPCOS Several parameters are used to select the correct inductor: maximum rated current, saturation current and copper resistance (ESR). For boost converters, the inductor current can be much higher than the output current. The lower the inductor ESR, the higher the efficiency of the converter: a common trade-off in size versus efficiency. The saturation current typically specifies a point at which the inductance has rolled off a percentage of the rated value. This can range from a 20% to 40% reduction in inductance. As inductance rolls off, the inductor ripple current increases, as does the peak switch current. It is important to keep the inductance from rolling off too much, causing switch current to reach the peak limit. 2014 Microchip Technology Inc. MCP1642B/D 5.7 Thermal Calculations The MCP1642B/D devices are available in two different packages (MSOP-8 and 2 x 3 DFN-8). By calculating the power dissipation and applying the package thermal resistance (JA), the junction temperature is estimated. The maximum continuous junction temperature rating for the MCP1642B/D family of devices is +125°C. To quickly estimate the internal power dissipation for the switching boost regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated by Equation 5-3. EQUATION 5-3: V OUT I OUT ------------------------------- – VOUT I OUT = P Dis Efficiency The difference between the first term, input power, and the second term, power delivered, is the power dissipation of the MCP1642B/D devices. This is an estimate assuming that most of the power lost is internal to the MCP1642B/D and not CIN, COUT and the inductor. There is some percentage of power lost in the boost inductor, with very little loss in the input and output capacitors. For a more accurate estimation of internal power dissipation, subtract the IINRMS2 x LESR power dissipation. 5.8 PCB Layout Information Good printed circuit board layout techniques are important to any switching circuitry, and switching power supplies are no different. When wiring the switching high-current paths, short and wide traces should be used. Therefore, it is important that the input and output capacitors be placed as close as possible to the MCP1642B/D to minimize the loop area. The feedback resistors and feedback signal should be routed away from the switching node and the switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. +VIN L CIN GND MCP1642 COUT 1 RTOP RBOT +VOUT Via To Bottom Plane Enable FIGURE 5-2: Power Good MCP1642B/D Recommended Layout, Applicable to Both Packages. 2014 Microchip Technology Inc. DS20005253A-page 19 MCP1642B/D 6.0 TYPICAL APPLICATION CIRCUITS L 4.7 µH VOUT VIN 5.0V @ min. 500 mA SW 3.3V to 4.2V VOUT VIN LI-ION + MCP1642B-ADJ CIN 10 µF EN FIGURE 6-1: VFB PGND CC 27 pF COUT 10 µF RBOT 309 k PG - RTOP 976 k SGND Portable USB Powered by Li-Ion. L 4.7 µH VIN 1.8V to 3.6V SW VOUT 5.0V @ min. 500 mA VOUT VIN + CIN 10 µF COUT 10 µF MCP1642B-50 EN PG NC PGND SGND + 28.7 Service Estimate (hours) 30.0 - ® AA Energizer® MAX® AA Energizer® MAX Energizer® UltimateLithium LithiumAA AA Energizer® Ultimate 25.0 20.0 15.0 12.7 10.0 5.8 5.0 1.8 0.3 0.0 50 mA 250 mA 2.3 500 mA Constant Output Current with 5V DC VOUT Note: Service estimates apply to using two Energizer® MAX® AA or Energizer® Ultimate Lithium AA batteries as the power source. Note that, if PG or feedback divider network is used, some additional input drain current should be included, but there will be negligible effects on the service estimates at these three load currents. FIGURE 6-2: Portable USB Powered by Two Energizer® MAX® AA or Energizer® Ultimate Lithium AA Batteries with the 5.0V Fixed Option of the MCP1642B. DS20005253A-page 20 2014 Microchip Technology Inc. MCP1642B/D 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 8-Lead DFN (2x3x0.9 mm) Example Part Number Code MCP1642B-18I/MC AJY MCP1642BT-18I/MC AJY MCP1642B-30I/MC AJU MCP1642BT-30I/MC AJU MCP1642B-33I/MC AJQ MCP1642BT-33I/MC AJQ MCP1642B-50I/MC AJL MCP1642BT-50I/MC AJL MCP1642B-ADJI/MC AKC MCP1642BT-ADJI/MC AKC MCP1642D-18I/MC AKA MCP1642DT-18I/MC AKA MCP1642D-30I/MC AJW MCP1642DT-30I/MC AJW MCP1642D-33I/MC AJS MCP1642DT-33I/MC AJS MCP1642D-50I/MC AJN MCP1642DT-50I/MC AJN MCP1642D-ADJI/MC AKE MCP1642DT-ADJI/MC AKE 8-Lead MSOP (3x3 mm) AJY 348 25 Example 42B50I 348256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2014 Microchip Technology Inc. DS20005253A-page 21 MCP1642B/D ' !""#$%& )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 1 2 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ 6WDQGRII $ &RQWDFW7KLFNQHVV $ 5() 2YHUDOO/HQJWK ' %6& 2YHUDOO:LGWK ( ([SRVHG3DG/HQJWK ' ± ([SRVHG3DG:LGWK ( ± E &RQWDFW/HQJWK / &RQWDFWWR([SRVHG3DG . ± ± &RQWDFW:LGWK %6& %6& ' 3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD 3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV 3DFNDJHLVVDZVLQJXODWHG 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 5() 5HIHUHQFH'LPHQVLRQXVXDOO\ZLWKRXWWROHUDQFHIRULQIRUPDWLRQSXUSRVHVRQO\ 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ && DS20005253A-page 22 2014 Microchip Technology Inc. MCP1642B/D Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014 Microchip Technology Inc. DS20005253A-page 23 MCP1642B/D Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005253A-page 24 2014 Microchip Technology Inc. MCP1642B/D Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2014 Microchip Technology Inc. DS20005253A-page 25 MCP1642B/D Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005253A-page 26 2014 Microchip Technology Inc. MCP1642B/D APPENDIX A: REVISION HISTORY Revision A (December 2014) • Original Release of this Document. 2014 Microchip Technology Inc. DS20005253A-page 27 MCP1642B/D NOTES: DS20005253A-page 28 2014 Microchip Technology Inc. MCP1642B/D PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device [X](1) Tape and Reel X X /XX Output Voltage Temperature Range Package Examples: a) b) Device: MCP1642B: 1A, 1 MHz Low Voltage Start-up Synchronous Boost Regulator With True Disconnect Output MCP1642D: 1A, 1 MHz Low Voltage Start-up Synchronous Boost Regulator With Input to Output Bypass c) d) Output Voltage: 18 30 33 50 ADJ = = = = = 1.8V 3.0V 3.3V 5.0V Adjustable Output Voltage e) f) Temperature Range: I = Package: MC = MS = -40C to +85C (Industrial) g) Plastic Dual Flat, No Lead – 2x3x0.9 mm Body (DFN) Plastic Micro Small Outline (MSOP) h) a) b) c) d) e) f) g) h) MCP1642B-18I/MC: Industrial temperature, 8LD 2x3 DFN package MCP1642BT-18I/MC: Tape and Reel, Industrial temperature, 8LD 2x3 DFN package MCP1642B-ADJI/MC: Industrial temperature, 8LD 2x3 DFN package MCP1642BT-ADJI/MC: Tape and Reel, Industrial temperature, 8LD 2x3 DFN package MCP1642B-18I/MS: Industrial temperature, 8LD MSOP package MCP1642BT-18I/MS: Tape and Reel, Industrial temperature, 8LD MSOP package MCP1642B-ADJI/MS: Industrial temperature, 8LD MSOP package MCP1642BT-ADJI/MS: Tape and Reel, Industrial temperature, 8LD MSOP package MCP1642D-18I/MC: Industrial temperature, 8LD 2x3 DFN package MCP1642DT-18I/MC: Tape and Reel, Industrial temperature, 8LD 2x3 DFN package MCP1642D-ADJI/MC: Industrial temperature, 8LD 2x3 DFN package MCP1642DT-ADJI/MC: Tape and Reel, Industrial temperature, 8LD 2x3 DFN package MCP1642D-18I/MS: Industrial temperature, 8LD MSOP package MCP1642DT-18I/MS: Tape and Reel, Industrial temperature, 8LD MSOP package MCP1642D-ADJI/MS: Industrial temperature, 8LD MSOP package MCP1642DT-ADJI/MS: Tape and Reel, Industrial temperature, 8LD 2x3 MSOP package Note 1: 2014 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005253A-page 29 MCP1642B/D NOTES: DS20005253A-page 30 2014 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-905-3 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2014 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS20005253A-page 31 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 DS20005253A-page 32 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Poland - Warsaw Tel: 48-22-3325737 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 03/25/14 2014 Microchip Technology Inc.