Cypress BCM20733 Single-chip bluetooth transceiver wireless input device Datasheet

CYW20733
Single-Chip Bluetooth Transceiver
Wireless Input Devices
The Cypress CYW20733 is a Bluetooth 3.0 + EDR compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. The device is ideal for applications in wireless input devices including game controllers, keyboards, and joysticks. Built-in
firmware adheres to the Bluetooth Human Interface Device (HID) profile and Bluetooth Device ID profile specifications. The
CYW20733 radio has been designed to provide low power, low cost, and robust communications for applications operating in the
globally available 2.4 GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification 3.0 + EDR. The singlechip Bluetooth transceiver is a monolithic component implemented in a standard digital CMOS process and requires minimal external components to make a fully compliant Bluetooth device. The CYW20733 is available in three package options: a 81-pin, 8 mm ×
8 mm FBGA, a 121-pin, 9 mm × 9 mm FBGA, and a 56-pin, 7 mm x 7 mm QFN.
Cypress Part Numbering Scheme
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides
Cypress ordering part number that matches an existing IoT part number.
Table 1. Mapping Table for Part Number between Broadcom and Cypress
Broadcom Part Number
Cypress Part Number
BCM20733
CYW20733
BCM20733A3KFB1G
CYW20733A3KFB1G
BCM20733A3KFB2G
CYW20733A3KFB2G
BCM20733A3KML1G
CYW20733A3KML1G
Features
Integrated LDO to reduce BOM cost
■ Bluetooth specification 3.0 + EDR compatible
■ Bluetooth HID profile version 1.1 compliant
■ Bluetooth Device ID profile version 1.3 compliant
■ Supports AFH
■ Excellent receiver sensitivity
■ On-chip support for common keyboard and mouse interfaces eliminates external processor
■ Infrared (IR) modulator
■ IR learning
■ Integrated 200 mW filterless Class-D audio amplifier
■ Triac control
■ Triggered Broadcom Fast Connect
■ One I/O capable of sinking 100 mA for high- current drive
applications
■ Programmable key scan matrix interface, up to 8 × 20 keyscanning matrix
■ Three-axis quadrature signal decoder
■
On-chip support for serial peripheral interface (master and
slave modes)
■ Broadcom Serial Communications Interface (compatible
with Philips® I2C slaves)
■ Two independent half-duplex PCM/I2S interfaces
■ Real-time clock supported with 32.768 kHz oscillator
■ Programmable output power control meets Class 2 or
Class 3 requirements
■ On-chip PA with a maximum output power of +10dBm without external component
■ Integrated ARM7TDMI-S™-based microprocessor core
■ On-chip power on reset (POR)
■ On-chip software control power management unit
■ Three package types available:
❐ 81-pin FBGA package (8 mm × 8 mm)
❐ 121-pin FBGA package (9 mm × 9 mm)
❐ 56-pin QFN package (7 mm x 7 mm)
■ RoHS compliant
■
Applications
■
■
■
■
Game controllers
Wireless pointing devices: mice, trackballs
Wireless keyboards
Joysticks
Cypress Semiconductor Corporation
Document No. 002-14859 Rev. *R
•
■
■
■
■
198 Champion Court
Point-of-sale (POS) input devices
Remote controls
Home automation
3D glasses
•
San Jose, CA 95134-1709
•
408-943-2600
Revised October 21, 2016
CYW20733
Figure 1. Functional Block Diagram
Muxed on GPIO
Tx
Rx
Tx
RTSN
CTSN Rx
RTSN
MISO
SDA/
CTSN
MOSI
SCK
WDT
Processing
Unit
(ARM7)
Test
UART
Periph
UART
1.2V
VDDC
VSS,
VDDO,
VDDC
BSC/SPI
Master
Interface
(BSC is I2Ccompat)
28 ADC
Inputs
CT ɇ ѐ
ADC
Speaker
Digital
Audio
Block
1.2V
POR
Class-D
Driver
1.2V VDDC
Domain
MIA
POR
System Bus
32 kHz
LPCLK
24 MHz
384K
ROM
Peripheral
Interface
Block
80K
RAM
RF Control
and Data
2.4 GHz
Radio
T/R
Switch
1.2V
LDO
LDO
CTRL
Bluetooth
Baseband
Core
1.2V
32 kHz
LPCLK
I/O Ring Bus
GPIO
Control/
Status
Registers
IR
Mod.
and
Learning
Keyboard
Matrix
Scanner
w/FIFO
3-Axis
Mouse
Signal
Controller
SPI
M/S
Frequency
Synthesizer
PMU
WAKE
1.2V VDDRF
Domain
28 ADC
Inputs
Ref Xtal
PWM
8 x 20 6 quadrature inputs
Scan (3 pair) + Hi -current
Matrix Driver Controls
IR
57 GPIO I/O
AutoCal
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1.62V -3.6V
Power
24 MHz
RF I/O
I/O Ring
Control
Registers
Volt. Trans
3V
Speaker
Out
High
Sink IO
57 GPIO Pins
VDDO Domain
÷4
128 kHz
LPCLK
128 kHz
LPO
32 kHz Xtal (opƟonal)
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CYW20733
Contents
1.Functional Description ....................................... 4
1.1
1.2
Integrated Radio Transceiver .............................. 4
1.1.1 Transmitter Path ...................................... 4
1.1.2 Receiver Path .......................................... 4
1.1.3 Local Oscillator ........................................ 4
1.1.4 Calibration ............................................... 4
1.1.5 Internal LDO Regulator ............................ 4
1.15 Infrared Learning ................................................19
Microprocessor Unit ............................................ 5
1.2.1 EEPROM Interface .................................. 5
1.2.2 Serial Flash Interface ............................... 5
1.19 Integrated Filterless Class-D Audio Amplifier .....20
1.2.3 Internal Reset .......................................... 5
1.2.4 External Reset ......................................... 6
1.3
Bluetooth Baseband Core ................................... 6
1.3.1 Frequency Hopping Generator ................ 6
1.3.2 E0 Encryption .......................................... 6
1.3.3 Link Control Layer ................................... 6
1.3.4 Adaptive Frequency Hopping .................. 6
1.3.5 Bluetooth Version 3.0 Features ............... 6
1.3.6 Test Mode Support .................................. 7
1.4
1.5
1.14 Infrared Modulator ..............................................18
Peripheral Transport Unit (PTU) ......................... 7
1.4.1 Broadcom Serial Control Interface .......... 7
1.16 Shutter Control for 3D Glasses ..........................19
1.17 Triac Control .......................................................20
1.18 Cypress Proprietary Control Signalling
and Triggered Broadcom Fast Connect .............20
1.20 High-Current I/O .................................................21
1.21 Power Management Unit ....................................22
1.21.1 RF Power Management ..........................22
1.21.2 Host Controller Power Management ......22
1.21.3 BBC Power Management .......................22
2.Pin Assignments............................................... 23
2.1
Ball Maps ...........................................................29
2.1.1 81-Pin FBGA Ball Map ...........................29
2.1.2 121-Pin FBGA Ball Map .........................31
2.1.3 56-Pin QFN Diagram ..............................32
3.Specifications.................................................... 33
3.1
Electrical Characteristics ....................................33
1.4.2 UART Interface ........................................ 8
3.2
RF Specifications ...............................................37
PCM Interface ..................................................... 9
1.5.1 System Diagram ...................................... 9
3.3
Timing and AC Characteristics ...........................39
3.3.1 UART Timing ..........................................39
1.5.2 Slot Mapping .......................................... 10
1.5.3 Frame Synchronization .......................... 10
1.5.4 Data Formatting ..................................... 10
3.3.2 SPI Timing ..............................................40
3.3.3 BSC Interface Timing .............................41
3.3.4 PCM Interface Timing .............................43
1.6
I2S Interface ...................................................... 10
1.7
Clock Frequencies ............................................ 10
1.7.1 Crystal Oscillator ................................... 10
4.Mechanical Information.................................... 53
1.8
GPIO Port .......................................................... 12
1.9
Keyboard Scanner ............................................ 12
1.9.1 Theory of Operation ............................... 13
4.0.1 Tape Reel and Packaging
Specifications .........................................56
5.Ordering Information ........................................ 62
1.10 Mouse Quadrature Signal Decoder ................... 13
1.10.1 Theory of Operation ............................... 13
6.IoT Resources ................................................... 62
1.11 ADC Port ........................................................... 13
A.Acronyms and Abbreviations.......................... 62
1.12 PWM ................................................................. 14
Document History........................................................... 64
1.13 Serial Peripheral Interface ................................. 15
Sales, Solutions, and Legal Information ...................... 67
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3.3.5 I2S Timing ...............................................48
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CYW20733
1. Functional Description
1.1 Integrated Radio Transceiver
The CYW20733 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has
been designed to provide low power, low cost, robust communications for applications operating in the globally available 2.4 GHz
unlicensed ISM band. It is fully compliant with Bluetooth Radio Specification 3.0 + EDR and meets or exceeds the requirements to
provide the highest communication link quality of service.
1.1.1 Transmitter Path
The CYW20733 features a fully integrated zero IF transmitter. The baseband transmit data is GFSK modulated in the modem block
and upconverted to the 2.4 GHz ISM band. The transmit path consists of signal filtering,
I/Q upconversion, output power amplification, and RF filtering. It also incorporates the /4-DQPSK and 8-DPSK modulation schemes,
which support the 2 Mbps and 3 Mbps enhanced data rates, respectively.
Digital Modulator
The digital modulator performs the data modulation and filtering required for the GFSK, /4-DQPSK, and
8-DPSK signals. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the
transmitted signal and is much more stable than direct VCO modulation schemes.
Power Amplifier
The integrated power amplifier (PA) for the CYW20733 can transmit at a maximum power of +4 dBm for class 2 operation. The transmit
power levels are for basic rate and EDR. Due to the linear nature of the PA, combined with some integrated filtering, no external filters
are required for meeting Bluetooth and regulatory harmonic and spurious requirements.
The CYW20733 internal PA can deliver a maximum output power of +10 dBm for basic rate and +8 dBm for EDR with a flexible supply
range of 2.5V to 3.0V.
1.1.2 Receiver Path
The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit
synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high-order on-chip channel
filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology with built-in out-of-band attenuation
enables the CYW20733 to be used in most applications without off-chip filtering.
Digital Demodulator and Bit Synchronizer
The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit
synchronization algorithm.
Receiver Signal Strength Indicator
The radio portion of the CYW20733 provides a receiver signal strength indicator (RSSI) to the baseband. This enables the controller
to take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the
transmitter should increase or decrease its output power.
1.1.3 Local Oscillator
The local oscillator (LO) provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels. The LO
subblock employs an architecture for high immunity to LO pulling during PA operation. The CYW20733 uses an internal RF and IF
loop filter.
1.1.4 Calibration
The CYW20733 radio transceiver features an automated calibration scheme that is self-contained in the radio. No user interaction is
required during normal operation or during manufacturing to provide the optimal performance. Calibration will optimize the gain and
phase performance of all the major blocks within the radio to within 2% of optimal conditions. Calibrated blocks include filters, the
matching networks between key components, and key gain blocks. The calibration process corrects for both process and temperature
variations. It occurs transparently during normal operation and the setting time of the hops and will calibrate for temperature variations
as the device cools and heats during normal operation in its environment.
1.1.5 Internal LDO Regulator
To reduce the external BOM, the CYW20733 has an integrated 1.2V LDO regulator to provide power to the digital and RF circuits and
system components. The 1.2V LDO regulator operates from a 1.62V to 3.63V input supply with a 60 mA maximum load current.
In noisy environments, a ferrite bead may be needed between the digital and RF supply pins to isolate noise coupling and suppress
noise into the RF circuits.
Note: Always place the decoupling capacitors near the pins as close together as possible.
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CYW20733
1.2 Microprocessor Unit
The CYW20733 microprocessor unit (µPU) runs software from the link control (LC) layer up to the Human Interface Device (HID). The
microprocessor is based on an ARM7™ 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The µPU
has 320 KB of ROM for program storage and boot-up, 80 KB of RAM for scratch-pad data, and patch RAM code.
The internal boot ROM allows for flexibility during power-on reset to enable the same device to be used in various configurations,
including UART, and with an external serial EEPROM or with an external flash memory. At power-up, the lower layer protocol stack
is executed from the internal ROM memory.
External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes and feature additions. The device can
also support the integration of user applications.
1.2.1 EEPROM Interface
The CYW20733 provides the BSC (Broadcom Serial Control) master interface; the BSC is programmed by the CPU to generate four
different types of BSC transfers on the bus: read-only, write-only, combined read/write, and combined write/read. BSC supports both
low-speed and fast mode devices. The BSC is compatible with a Philips® I2C slave device, except that master arbitration (multiple
I2C masters contending for the bus) is not supported. Native support for Microchip® 24LC128, Microchip 24AA128, and STMicroelectronics® M24128-BR is included.
The EEPROM can contain customer application configuration information, including: application code, configuration data, patches,
pairing information, BD_ADDR, baud rate, SDP service record, and file system information used for code.
1.2.2 Serial Flash Interface
The CYW20733 includes an SPI master controller that can be used to access serial flash memory. The SPI master contains an AHB
slave interface, transmit and receive FIFOs, and the SPI core PHY logic.
Devices natively supported include the following:
■
Atmel® AT25BCM512B
■
MXIC MX25V512ZUI-20G
1.2.3 Internal Reset
The CYW20733 has an integrated power-on reset circuit that resets all circuits to a known power-on state.
Figure 1. Internal Reset Timing
VDDO POR delay
~ 2 ms
VDDO
VDDO POR threshold
VDDO POR
VDDC POR threshold
VDDC
VDDC POR delay
~ 2 ms
VDDC POR
Crystal
warm‐up
delay:
~ 5 ms
Baseband Reset
Start reading EEPROM and firmware boot.
Crystal Enable
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CYW20733
1.2.4 External Reset
An external active-low reset signal, RESET_N, can be used to put the CYW20733 in the reset state. The RESET_N pin has an internal
pull-up resistor and, in most applications, it does not require that anything be connected to it. RESET_N should only be released after
the VDDO supply voltage level has been stabilized.
Figure 2. External Reset Timing
RESET_N
Pulse width
>20 µs
Crystal
warm‐up
delay:
~ 5 ms
Baseband Reset
Start reading EEPROM and firmware boot.
Crystal Enable
1.3 Bluetooth Baseband Core
The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation.
The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it,
handles data flow control, schedules ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data
into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these
functions, it independently handles HCI event types and HCI command types.
The following transmit and receive functions are also implemented in the BBC hardware to increase reliability and security of the TX/
RX data before sending over the air:
■
Receive Functions: Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic
redundancy check (CRC), data decryption, and data de-whitening.
■
Transmit Functions: Data framing, FEC generation, HEC generation, CRC generation, link key generation, data encryption, and
data whitening.
1.3.1 Frequency Hopping Generator
The frequency hopping sequence generator selects the correct hopping channel number depending on the link controller state,
Bluetooth clock, and the device address.
1.3.2 E0 Encryption
The encryption key and the encryption engine are implemented using dedicated hardware to reduce software complexity and provide
minimal intervention.
1.3.3 Link Control Layer
The Link Control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the Link Control Unit
(LCU). This layer consists of the command controller, which takes commands from the software, and other controllers that are
activated or configured by the command controller to perform the link control tasks. Each task performs in a different state in the
Bluetooth link controller. STANDBY and CONNECTION are the two major states. In addition, there are five substates: page, page
scan, inquiry, inquiry scan, and sniff.
1.3.4 Adaptive Frequency Hopping
The CYW20733 gathers link quality statistics on a channel-by-channel basis to facilitate channel assessment and channel map
selection. The link quality is determined using both RF and baseband signal processing to provide a more accurate frequency-hop
map.
1.3.5 Bluetooth Version 3.0 Features
The CYW20733 is fully compliant with the Bluetooth 3.0 standard, including the following options:
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CYW20733
■
Enhanced power control
■
HCI read, encryption key size command
The CYW20733 supports all of the new Bluetooth version 2.1 features:
■
Extended inquiry response
■
Sniff subrating
■
Encryption pause and resume
■
Secure simple pairing
■
Link supervision timeout changed event
■
Erroneous data reporting
■
Non-automatically flushable packet boundary flag
■
Security Mode 4
1.3.6 Test Mode Support
The CYW20733 fully supports Bluetooth Test Mode, as described in Part 1 of the Bluetooth System Version 2.1 specification. This
includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence.
In addition to the standard Bluetooth test mode, the device supports enhanced testing features to simplify RF debugging and qualification and type approval testing. These features include:
■
Fixed frequency carrier wave (unmodulated) transmission
■
Simplified type approval measurements (Japan)
■
Aid in transmitter performance analysis
■
Fixed frequency constant receiver mode
■
Receiver output directed to I/O pin
■
Direct BER measurements using standard RF test equipment
■
Facilitated spurious emissions testing for receive mode
■
Fixed frequency constant transmission
■
8-bit fixed pattern or PRBS-9
■
Modulated signal measurements with standard RF test equipment
■
Connectionless transmitter test
■
Hopping or fixed frequency
■
Multiple packet types
■
Multiple data patterns
■
Connectionless receiver test
1.4 Peripheral Transport Unit (PTU)
1.4.1 Broadcom Serial Control Interface
The CYW20733 provides a 2-pin master BSC interface that can be used to retrieve configuration information from an external
EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse
devices. The BSC interface is compatible with I2C slave devices. The BSC does not support multimaster capability or flexible waitstate insertion by either master or slave devices.
Listed below are the transfer clock rates supported by the BSC:
■
100 kHz
■
400 kHz
■
800 kHz (Not a standard I2C-compatible speed.)
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CYW20733
■
4 MHz maximum (Compatibility with high-speed I2C-compatible devices is not guaranteed.)
The following transfer types are supported by the BSC:
■
Read (up to 127 bytes can be read)
■
Write (up to 127 bytes can be written)
■
Read-then-Write (Up to 127 bytes can be read, and up to 127 bytes can be written.)
■
Write-then-Read (Up to 127 bytes can be written, and up to 127 bytes can be read.)
Hardware controls the transfers, requiring minimal firmware setup and supervision.
The clock pin (SCL) and data pin (SDA) are both open-drain I/O pins. Pull-up resistors external to the CYW20733 are required on
both SCL and SDA for proper operation.
1.4.2 UART Interface
The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 9600 bps to 1.5
Mbps. During initial boot, UART speeds may be limited to 750 kbps. The baud rate may be selected via a vendor-specific UART HCI
command. The CYW20733 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support enhanced data rates. The
interface supports the Bluetooth 3.0 UART HCI (H4) specification. The default baud rate for H4 is 115.2 kbaud.
The UART clock is 24 MHz. The baud rate of the CYW20733 UART is controlled by two values. The first is a UART clock divisor (also
called the DLBR register) that divides the UART clock by an integer multiple of 16. The second is a baud rate adjustment (also called
the DHBR register) that is used to specify a number of UART clock cycles to stuff in the first or second half of each bit time. Up to
eight UART cycles can be inserted into the first half of each bit time, and up to eight UART clock cycles can be inserted into the end
of each bit time.
When setting the baud rate manually, the UART clock divisor is an 8-bit value that is stored as 256 minus the chosen divisor. For
example, a divisor of 13 is stored as 256 – 13 = 243 = 0xF3.
The baud rate adjustment is also an 8-bit value, of which the four MSBs are the number of additional clock cycles to insert in the first
half of each bit time, and the four LSBs are the number of clock cycles to insert in the second half of each bit time. If either of these
two values is over eight, it is rounded to eight.
To compute the baud rate, the calculation is expressed as:
24 MHz ÷ ((16 × UART clock divisor) + total inserted 24-MHz clock cycles)
Table 2 contains example values to generate common baud rates.
Table 2. Common Baud Rate Examples
Desired Baud Rate UART Clock Divi(bps)
sor
1500000
921600
460800
230400
115200
57600
38400
28800
19200
14400
9600
0xFF
0xFF
0xFD
0xFA
0xF3
0xE6
0xD9
0xCC
0xB2
0x98
0x64
Baud Rate Adjustment
High Nibble
Low Nibble
0x00
0x05
0x02
0x04
0x00
0x00
0x01
0x00
0x01
0x00
0x02
0x00
0x05
0x02
0x04
0x00
0x00
0x00
0x00
0x01
0x00
0x02
Actual Baud Rate
(bps)
1500000
923077
461538
230769
115385
57692
38400
28846
19200
14423
9600
Error
(%)
0.00
0.16
0.16
0.16
0.16
0.16
0.00
0.16
0.00
0.16
0.00
Normally, the UART baud rate is set by a configuration record downloaded after reset. Support for changing the baud rate during
normal HCI UART operation is included through a vendor-specific command that allows the host to adjust the contents of the baud
rate registers.
The CYW20733 UART operates correctly with the host UART as long as the combined baud rate error of the two devices is within ±5%.
Peripheral UART Interface
The CYW20733 has a second UART that may be used to interface to other peripherals. This peripheral UART is accessed through
the optional I/O ports, which can be configured individually and separately for each functional pin as shown in Table 3.
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CYW20733
Table 3. CYW20733 Peripheral UART
Pin Name
Configured pin name
pUART_TX
P0
pUART_RX
P2
pUART_CTS_N
P3
pUART_RTS_N
P1
P5
P4
P7
P6
P24
P25
P35
P30
P31
P33
–
–
P32
P34
–
–
1.5 PCM Interface
The CYW20733 PCM interface can connect to linear PCM codec devices in master or slave mode. In master mode, the device
generates the PCM_BCLK and PCM_SYNC signals. In slave mode, these signals are provided by another master on the PCM
interface as inputs to the device.
The channels can be configured to either transmit or receive, but they must be assigned to different time slots. The two half-duplex
channels cannot be combined to form a single full-duplex channel.
1.5.1 System Diagram
Figure 3 shows options for connecting the device to a PCM codec device as a master or a slave.
Figure 3. PCM Interface with Linear PCM Codec
PCM_IN
PCM Codec
(Master)
PCM_OUT
PCM_BCLK
CYW20733
(Slave)
PCM_SYNC
PCM Interface Slave Mode
PCM_IN
PCM Codec
(Slave)
PCM_OUT
PCM_BCLK
CYW20733
(Master)
PCM_SYNC
PCM Interface Master Mode
PCM_IN
PCM Codec
(Hybrid)
PCM_OUT
PCM_BCLK
CYW20733
(Hybrid)
PCM_SYNC
PCM Interface Hybrid Mode
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CYW20733
1.5.2 Slot Mapping
Table 4. PCM Interface Time-Slotting Scheme
Audio Sample Rate
Time-Slotting Scheme
8 kHz
The number of slots depends on the selected interface rate, as follows:
Interface rate
Slot
1281
2562
5124
10248
204816
16 kHz
The number of slots depends on the selected interface rate, as follows:
Interface rate
Slot
2561
5122
10244
20488
The PCM data output driver tri-states its output on unused slots to allow other devices to share the same PCM interface signals. The
data output driver tristates its output after the falling edge of the PCM clock during the last bit of the slot.
1.5.3 Frame Synchronization
The device supports both short and long frame synchronization types in both master and slave configurations. In short frame synchronization mode, the frame synchronization signal is an active-high pulse at the 8 kHz audio frame rate (which is a single bit period in
width) and synchronized to the rising edge of the bit clock. The PCM slave expects PCM_SYNC to be high on the falling edge of the
bit clock and the first bit of the first slot to start at the next rising edge of the clock. In the long frame synchronization mode, the frame
synchronization signal is an active-high pulse at the 8 kHz audio frame rate. However, the duration is 3-bit periods, and the pulse
starts coincident with the first bit of the first slot.
1.5.4 Data Formatting
The device can be configured to generate and accept several different data formats. The device uses 13 of the 16 bits in each PCM
frame. The location and order of these 13 bits is configurable to support various data formats on the PCM interface. The remaining
three bits are ignored on the input and may be filled with zeros, ones, a sign bit, or a programmed value on the output. The default
format is 13-bit two’s complement data, left justified, and clocked most significant bit first.
1.6 I2S Interface
The I2S interface supports up to two half-duplex channels. The channels can be configured to either transmit or receive, but they must
be assigned to different time slots (left or right). The two half-duplex channels cannot be combined to form a single full-duplex channel.
The I2S interface is capable of operating in either slave or master mode. The device supports a 16-bit data width with 8-kHz and 16kHz frame rates.
1.7 Clock Frequencies
The CYW20733 is set with a crystal frequency of 24 MHz.
1.7.1 Crystal Oscillator
The crystal oscillator requires a crystal with an accuracy of ±20 ppm as defined by the Bluetooth specification. Two external load
capacitors in the 5 pF to 30 pF range are required to work with the crystal oscillator. The selection of the load capacitors is crystal
dependent. Table 5 shows the recommended crystal specification.
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Figure 4. Recommended Oscillator Configuration—12 pF Load Crystal
Table 5. Reference Crystal Electrical Specifications
Parameter
Input signal amplitude
Conditions
–
Min
Typ
Max
400
–
2000
24.000
–
Nominal frequency
–
–
Oscillation mode
–
Fundamental
Unit
mVp-p
MHz
–
Frequency tolerance
@25°C
–
±10
–
ppm
Tolerance stability over temp
@0°C to +70°C
–
±10
–
ppm
Equivalent series resistance
–
–
–
50
Ω
Load capacitance
–
–
12
–
pF
Operating temperature range
–
0
–
+70
°C
Storage temperature range
–
–40
–
+125
°C
Drive level
–
–
–
200
W
Aging
–
–
–
±10
ppm/year
Shunt capacitance
–
–
–
2
pF
HID Peripheral Block
The peripheral blocks of the CYW20733 all run from a single 128-kHz low-power RC oscillator. The oscillator can be turned on at the
request of any of the peripherals. If a peripheral is not enabled, it shall not assert its clock request line.
The keyboard scanner is a special case in that it may drop its clock request line even when enabled and then reassert the clock
request line if a key-press is detected.
Real-Time Clock and 32 kHz Crystal Oscillator
The CYW20733 has a 48-bit counter that can be configured to be clocked directly from a 32.768 kHz or 32.000 kHz crystal oscillator.
The real-time clock counter value is accessible via firmware.
Figure 5 shows the 32 kHz crystal (XTAL) oscillator with external components, and Table 6 lists the oscillator’s characteristics. It is a
standard Pierce oscillator using a comparator with hysteresis on the output to create a single-ended digital output. The hysteresis was
added to eliminate any chatter when the input is around the threshold of the comparator and is ~100 mV. This circuit can be operated
with a 32 kHz or 32.768 kHz crystal oscillator or be driven with a clock input at a similar frequency. The default component values are:
R1 = 10 M, C1 = C2 = ~10 pF. The values of C1 and C2 are used to fine-tune the oscillator.
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Figure 5. 32-kHz Oscillator Block Diagram
C2
32.768 kHz
XTAL
R1
C1
Table 6. XTAL Oscillator Characteristics
Parameter
Symbol
Conditions
Minimum
Typical
Maximum
Unit
Output frequency
Foscout
–
–
32.768
–
kHz
Frequency tolerance
–
Crystal
dependent
–
100
–
ppm
Start-up time
Tstartup
–
–
–
500
ms
XTAL drive level
Pdrv
For crystal
selection
0.5
–
–
W
XTAL series resistance
Rseries
For crystal
selection
–
–
70
k
XTAL shunt capacitance
Cshunt
For crystal
selection
–
–
1.3
pF
1.8 GPIO Port
The CYW20733 has 40 general-purpose I/Os (GPIOs) in the 81-pin package and 58 GPIOs in the 121-pin package. All GPIOs support
programmable pull-ups and are capable of driving up to 8 mA at 3.3V or 4 mA at 1.8V, except P26, P27, P28, and P29, which are
capable of driving up to 16 mA at 3.3V or 8 mA at 1.8V. GPIO P57 is capable of sinking 100 mA for VDDIO = 3.0V and 60 mA for
VDDIO = 1.62V.
Port 0–Port 1, Port 8–Port 18, Port 20–Port 23, and Port 28–Port 38
All of these pins can be programmed as ADC inputs.
Port 26–Port 29
P[26:29] consist of four pins. All pins are capable of sinking up to 16 mA for LEDs. These pins also have the PWM function, which
can be used for LED dimming.
1.9 Keyboard Scanner
The keyboard scanner is designed to autonomously sample keys and store them into buffer registers without the need for the host
microcontroller to intervene. The scanner has the following features:
■
Ability to turn off its clock if no keys are pressed.
■
Sequential scanning of up to 160 keys in an 8 × 20 matrix.
■
Programmable number of columns from 1 to 20.
■
Programmable number of rows from 1 to 8.
■
16-byte key-code buffer (can be augmented by firmware).
■
128 kHz clock—allows scanning of full 160-key matrix in about 1.2 ms.
■
N-key rollover with selective 2-key lockout if ghost is detected.
■
Keys are buffered until host microcontroller has a chance to read it, or until overflow occurs.
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CYW20733
■
Hardware debouncing and noise/glitch filtering.
■
Low-power consumption. Single-digit µA-level sleep current.
1.9.1 Theory of Operation
The key scan block is controlled by a state machine with the following states:
Idle
The state machine begins in the idle state. In this state, all column outputs are driven high. If any key is pressed, a transition occurs
on one of the row inputs. This transition causes the 128 kHz clock to be enabled (if it is not already enabled by another peripheral)
and the state machine to enter the scan state. Also in this state, an 8-bit row-hit register and an 8-bit key-index counter is reset to 0.
Scan
In the scan state, a row counter counts from 0 up to a programmable number of rows minus 1. After the last row is reached, the row
counter is reset and the column counter is incremented. This cycle repeats until the row and column counters are both at their
respective terminal count values. At that point, the state machine moves into the Scan-End state.
As the keys are being scanned, the key-index counter is incremented. This counter is the value compared to the modifier key codes
stored, or in the key-code buffer if the key is not a modifier key. It can be used by the microprocessor as an index into a lookup table
of usage codes.
Also, as the nth row is scanned, the row-hit register is ORed with the current 8-bit row input values if the current column contains two
or more row hits. During the scan of any column, if a key is detected at the current row, and the row-hit register indicates that a hit
was detected in that same row on a previous column, then a ghost condition may have occurred, and a bit in the status register is set
to indicate this.
Scan End
This state determines whether any keys were detected while in the scan state. If yes, the state machine returns to the scan state. If
no, the state machine returns to the idle state, and the 128 kHz clock request signal is made inactive.
The microcontroller can poll the key status register.
1.10 Mouse Quadrature Signal Decoder
The mouse signal decoder is designed to autonomously sample two quadrature signals commonly generated by an optomechanical
mouse. The decoder has the following features:
■
Three pairs of inputs for X, Y, and Z (typical scroll wheel) axis signals. Each axis has two options:
For the X axis, choose P2 or P32 as X0 and P3 or P33 as X1.
❐ For the Y axis, choose P4 or P34 as Y0 and P5 or P35 as Y1.
❐ For the Z axis, choose P6 or P36 as Z0 and P7 or P37 as Z1.
❐
■
Control of up to four external high-current GPIOs to power external optoelectronics:
Turn-on and turn-off time can be staggered for each HC-GPIO to avoid simultaneous switching of high currents and having multiple
high-current devices on at the same time.
❐ Sample time can be staggered for each axis.
❐ Sense of the control signal can be active high or active low.
❐ Control signal can be tristated for off condition or driven high or low, as appropriate.
❐
1.10.1 Theory of Operation
The mouse decoder block has four 10-bit PWMs for controlling external quadrature devices and sampling the quadrature inputs at its
core.
The GPIO signals may be used to control such items as LEDs, external ICs that may emulate quadrature signals, photodiodes, and
photodetectors.
1.11 ADC Port
The CYW20733 contains a 16-bit ADC.
Additionally:
■
There are 28 analog input channels. All channels are multiplexed on various GPIOs.
■
There is a built-in reference with bandgap-based reference modes.
■
The maximum conversion rate is 187 kHz.
■
There is a rail-to-rail input swing.
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CYW20733
The ADC consists of an analog ADC core that performs the actual analog-to-digital conversion and digital hardware that processes
the output of the ADC core into valid ADC output samples. Directed by the firmware, the digital hardware also controls the input
multiplexers that select the ADC input signal (Vinp) and the ADC reference signals (Vref).
Table 7. Sampling Rate and Effective Number of Bits
Effective Number of Bits (ENOB)
Mode
Minimum
0
10.4
1
2
Typical
Latencya (μs)
Sampling Rate (kHz)
13.0
5.859
171
10.2
12.6
11.7
85
9.7
12.0
46.875
21
3
9.3
11.5
93.75
11
4
7.9
10.0
187
5
a. Settling time of the ADC and filter after switching channels.
1.12 PWM
The CYW20733 has four internal PWMs. The PWM module consists of the following:
■
■
PWM1–4
Each of the four PWM channels, PWM1–4, contains the following registers:
10-bit initial value register (read/write)
❐ 10-bit toggle register (read/write)
❐ 10-bit PWM counter value register (read)
❐
PWM configuration register shared among PWM1–4 (read/write). This 12-bit register is used:
To configure each PWM channel
❐ To select the clock of each PWM channel
❐ To change the phase of each PWM channel
Figure 6 on page 15 shows the structure of one PWM.
■
❐
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CYW20733
Figure 6. PWM Block Diagram
pwm_cfg_adr register
pwm#_init_val_adr register
pwm#_togg_val_adr register
enable
clk_sel
o_flip
10
10
pwm#_cntr_adr
10
cntr value is ARM readable
pwm_out
Example: PWM cntr w/ pwm#_init_val = 0 (dashed line)
PWM cntr w/ pwm#_init_val = x (solid line)
10'H3FF
pwm_togg_val_adr
10'Hx
10'H000
pwm_out
1.13 Serial Peripheral Interface
The CYW20733 has two independent SPI interfaces. One is a master-only interface (SPI_1) and the other (SPI_2) can be either a
master or a slave. Each interface has a 64-byte transmit buffer and a 64-byte receive buffer. To support more flexibility for user
applications, the CYW20733 has optional I/O ports that can be configured individually and separately for each functional pin, as shown
in Table 8. The CYW20733 acts as an SPI master device that supports 1.8V or 3.3V SPI slaves. The CYW20733 can also act as an
SPI slave device that supports a 1.8V or 3.3V SPI master.
Note: SPI voltage depends on VDDO/VDDM; therefore, it defines the type of devices that can be supported.
Table 8. CYW20733 First SPI Set (Master Mode)
Pin Name
Configured Pin Name
SPI_CLK
SPI_MOSI
SPI_CSa
SPI_MISO
SCL
SDA
P24
–
–
–
P26
–
–
–
P32b
P33b
–
–
P39
–
a. Any GPIO can be used as SPI_CS when SPI is in master mode.
b. Default for serial flash.
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Table 9. CYW20733 Second SPI Set (Master Mode)
Configuration
SPI_CLK
SPI_MOSI
SPI_CSa
SPI_MISO
1
p3
p0
p1
–
2
p3
p0
p5
–
3
p3
p4
p1
–
4
p3
p4
p5
–
5
p3
p27
p1
–
6
p3
p27
p5
–
7
p3
p38
p1
–
8
p3
p38
p5
–
9
p7
p0
p1
–
10
p7
p0
p5
–
11
p7
p4
p1
–
12
p7
p4
p5
–
13
p7
p27
p1
–
14
p7
p27
p5
–
15
p7
p38
p1
–
16
p7
p38
p5
–
17
p24
p0
p25
–
18
p24
p4
p25
–
19
p24
p27
p25
–
20
P24
P38
P25
–
21
p36
p0
p25
–
22
p36
p4
p25
–
23
p36
p27
p25
–
24
P36
P38
p25
–
a. Any GPIO can be used as SPI_CS when SPI is in master mode.
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Table 10. CYW20733 Second SPI Set (Slave Mode)
Configuration
SPI_CLK
SPI_MOSI
SPI_MISO
SPI_CS
1
p3
p0
p1
p6
2
p3
p0
p1
p2
3
p3
p0
p5
p6
4
p3
p0
p5
p2
5
p3
p0
p25
p6
6
p3
p0
p25
p2
7
p3
p4
p1
p6
8
p3
p4
p1
p2
9
p3
p4
p5
p6
10
p3
p4
p5
p2
11
p3
p4
p25
p6
12
p3
p4
p25
p2
13
p7
p0
p1
p2
14
p7
p0
p1
p6
15
p7
p0
p5
p6
16
p7
p0
p5
p2
17
p7
p0
p25
p2
18
p7
p0
p25
p6
19
p7
p4
p1
p6
20
p7
p4
p1
p2
21
p7
p4
p5
p6
22
p7
p4
p5
p2
23
p7
p4
p25
p2
24
p7
p4
p25
p6
25
p24
p27
p1
p26
26
p24
p27
p1
p32
27
p24
p27
p1
p39
28
p24
p27
p5
p26
29
p24
p27
p5
p32
30
p24
p27
p5
p39
31
P24
P27
P25
P26
32
p24
p27
p25
p32
33
P24
P27
P25
P39
34
p24
p33
p1
p26
35
p24
p33
p1
p32
36
p24
p33
p1
p39
37
p24
p33
p5
p26
38
p24
p33
p5
p32
39
p24
p33
p5
p39
40
P24
P33
P25
P26
41
p24
p33
p25
p32
42
P24
P33
P25
P39
43
p24
p38
p1
p26
44
p24
p38
p1
p32
45
p24
p38
p1
p39
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CYW20733
Table 10. CYW20733 Second SPI Set (Slave Mode) (Cont.)
Configuration
SPI_CLK
SPI_MOSI
SPI_MISO
SPI_CS
46
p24
p38
p5
p26
47
p24
p38
p5
p32
48
p24
p38
p5
p39
49
P24
P38
P25
P26
50
p24
p38
p25
p32
51
P24
P38
P25
P39
52
p36
p27
p1
p26
53
p36
p27
p1
p32
54
p36
p27
p1
p39
55
p36
p27
p5
p26
56
p36
p27
p5
p32
57
p36
p27
p5
p39
58
P36
P27
P25
P26
59
p36
p27
p25
p32
60
P36
P27
P25
P39
61
p36
p33
p1
p26
62
p36
p33
p1
p32
63
p36
p33
p1
p39
64
p36
p33
p5
p26
65
p36
p33
p5
p32
66
p36
p33
p5
p39
67
P36
P33
P25
P26
68
p36
p33
p25
p32
69
P36
P33
P25
P39
70
p36
p38
p1
p26
71
p36
p38
p1
p32
72
p36
p38
p1
p39
73
p36
p38
p5
p26
74
p36
p38
p5
p32
75
p36
p38
p5
p39
76
P36
P38
P25
P26
77
p36
p38
p25
p32
78
P36
P38
P25
P39
1.14 Infrared Modulator
The CYW20733 includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated waveforms.
For modulated waveforms, hardware inserts the desired carrier frequency into all IR transmissions. IR TX can be sourced from
firmware-supplied descriptors, a programmable bit, or the peripheral UART transmitter.
If descriptors are used, they include IR on/off state and the duration between 1–32767 µsec. The CYW20733 IR TX firmware driver
inserts this information in a hardware FIFO and makes sure that all descriptors are played out without an underrun glitch. See Figure 7.
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CYW20733
Figure 7. Infrared TX
VCC
R1
Infrared‐LD
D1
U1
CYW20733
R2
Q1
IR TX
1.15 Infrared Learning
The CYW20733 includes hardware support for infrared learning. The hardware can detect both modulated and unmodulated signals.
For modulated signals, the CYW20733 can detect carrier frequencies between
10–500 kHz and the duration that the signal is present or absent. The CYW20733 firmware driver supports further analysis and
compression of a learned signal. A learned signal can then be played back through the CYW20733 IR TX subsystem. See Figure 8.
Figure 8. Infrared RX
VCC
U3
CYW20733
D2
Photodiode
IR RX
1.16 Shutter Control for 3D Glasses
The CYW20733, combined with the CYW20702, provides full system support for 3D glasses on televisions. The CYW20702 gets
frame synchronization signals from the TV, converts them into proprietary timing control messages, then passes the messages to the
CYW20733. The CYW20733 uses these messages to synchronize the shutter control for the 3D glasses with the television frames.
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The CYW20733 can provide up to four synchronized control signals for left and right eye shutter control. These four lines can output
pulses with microsecond resolution for on and off timing. The total cycle time can be set for any period up to 65535 msec. The pulses
are synchronized to each other for left and right eye shutters.
The CYW20733 seamlessly adjusts the timing of the control signals based on control messages from the CYW20702, ensuring that
the 3D glasses remain synchronized to the TV display frame.
3D hardware control on the CYW20733 works independently of the rest of the system. The CYW20733 negotiates sniff with the
CYW20702 and, except for sniff resynchronization periods, most of the CYW20733 circuitry remains in a low power state while the
3D glasses subsystem continues to provide shutter timing and control pulses. This significantly reduces total system power
consumption.
1.17 Triac Control
The CYW20733 includes hardware support for zero-crossing detection and trigger control for up to four triacs. The CYW20733 detects
zero-crossing on the AC zero detection line and uses that to provide a pulse that is offset from the zero crossing. This allows the
CYW20733 to be used in dimmer applications, as well as any other applications that require a control signal that is offset from an
input event.
The zero-crossing hardware includes an option to suppress glitches. See Figure .
Figure 9. Triac Control (TBD)
1.18 Cypress Proprietary Control Signalling and Triggered Broadcom Fast Connect
Cypress Proprietary Control Signaling (BPCS) and Triggered Broadcom Fast Connect (TBFC) are Cypress-proprietary baseband
(ACL) suspension and low-latency reconnection mechanisms that reestablish the baseband connection with the peer controller that
also supports BPCS/TBFC.
The CYW20733 uses BPCS primitives to allow a Human Interface Device (HID) to suspend all RF traffic after a configurable idle
period with no reportable activity. To conserve power, it can then enter one of its low power states while still logically remaining
connected at the L2CAP and HID layers with the peer device. When an event requires the HID to deliver a report to the peer device,
the CYW20733 uses the TBFC and BPCS mechanisms to reestablish the baseband connection and immediately resume L2CAP
traffic, greatly reducing latency between the event and delivery of the report to the peer device.
To achieve power savings and low latencies that cannot be achieved using long sniff intervals, certain applications may make use of
the CYW20733 Broadcom Fast Connect (BFC) mechanism, which will eliminate the need to maintain an RF link, while still being able
to establish ACL and L2CAP connections much faster than regular methods.
1.19 Integrated Filterless Class-D Audio Amplifier
The CYW20733 has an integrated speaker driver that includes both the digital path and an internal audio amplifier. The digital audio
path includes a FIFO, LPF, rate adapter, and PWM modulator. The output of the PWM modulator drives an on-chip class-D high
efficiency audio amplifier as shown in the figure below.
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CYW20733
Figure 10. Class-D Block Diagram
667 kHz or 1.33 MHz
PWM Modulator
150 kHz
From FIFO
16
Hi-Fi Rate
Adapter
16 LPF
8 kHz
16 kHz
22.05 kHz
44.1 kHz
48 kHz
16
22
M
128 kHz
256 kHz
352.8 kHz
705.6 kHz
768 kHz
To Class-D
audio amplifier
ΔΣMOD.
M = 160 or 320
AP Interface
3
The on-chip Class-D audio amplifier is designed to drive up to 200 mW into an 8 load and has a range of 20 Hz to 20 kHz, covering
the entire audio spectrum. The amplifier is designed to deliver maximum dynamic range and power efficiency while minimizing
quiescent current. The amplifier has two nonoverlapping switch drivers and a pair of MOSFET power switches for bridge-tie load. The
digital Class-D modulator converts the audio input to a PWM signal that drives the switch driver. The modulator bitstream is retimed
by a low-jitter 24/48 MHz clock at the input of the nonoverlapping switch drivers, used to prevent large crowbar currents during
switching. A large W/L aspect ratio of the power transistor is used to minimize the on-resistance of the devices for improved efficiency.
The integrated audio amplifier requires a 3.0V regulated power supply. The required LDO characteristic is shown in Table 11.
Table 11. LDO Requirement for the Integrated Audio Amplifier
Parameter
Condition
Minimum
Typical
Maximum
Unit
Output voltage
–
2.9
–
3.1
V
Output load current
–
–
–
200
mA rms
Load regulation
Vin = 2.9V and load current = 200 mA –
–
40
mV
Power supply rejection ration (PSRR)
–
60
–
–
dB
Output impedance
–
–
–
20
m
Output spot noise
At 1 kHz
–
–
1.5
Vrms/
sqrt (Hz)
Output noise
–
–
–
50
Vrms
1.20 High-Current I/O
The CYW20733 has one high-current I/O pin (GPIO P57) capable of sinking up to 100 mA with a maximum output voltage of 0.4V
(VDDIO = 3.0V). For VDDIO = 1.62V, GPIO P57 is limited to sinking up to 60 mA. This pin can be used for LEDs, motors, or other
high current devices. This pin can also be used as a GPIO if high current sink capability is not required. An example usage for driving
a motor/vibrator is shown in Figure 11.
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Figure 11. Motor/Vibrator Circuit
D1
VCC
MA2S111
U1
CYW20733
MG1
P57
1
1
2
2
Motor
C1
10 uF
1.21 Power Management Unit
The Power Management Unit (PMU) provides power management features that can be invoked by software through power
management registers or packet handling in the baseband core.
1.21.1 RF Power Management
The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz transceiver, which then processes the power-down functions accordingly.
1.21.2 Host Controller Power Management
Power is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the
disabling of the on-chip regulator when in Deep-sleep mode.
1.21.3 BBC Power Management
There are several low-power operations for the BBC:
■
Physical layer packet handling turns RF on and off dynamically within packet TX and RX.
■
Bluetooth-specified low-power connection sniff mode. While in these low-power connection modes, the CYW20733 runs on the
Low-Power Oscillator (LPO) and wakes up after a predefined time period.
The CYW20733 automatically adjusts its power dissipation based on user activity. The following power modes are supported:
■
Active mode
■
Idle mode
■
Suspend mode
■
Power-down mode
■
HIDOFF mode
The CYW20733 transitions to the next lower state after a programmable period of user inactivity. Busy mode is immediately entered
when user activity resumes.
HIDOFF mode is one of the power modes in which the core is powered down and only supervisory circuits running directly from the
battery retain power.
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2. Pin Assignments
Table 12. Pin Descriptions
Pin Number
81-pin
FBGA
121-pin
FBGA
56-pin
QFN
Pin Name
I/O
Power Domain
Description
Radio I/O
D1
E1
9
RFP
I/O
VDDTF
RF antenna port
RF Power Supplies
B1
C1
6
VDDIF
I
VDDIF
IFPLL power supply
E1
F1
11
VDDLNA
I
VDDLNA
RF front-end supply
F1
G1
12
VDDRF
I
VDDRF
VCO, LOGEN supply
G1
H1
13
VDDPX
I
VDDPX
RFPLL and crystal oscillator supply
C1
D1
7
VDDTF
I
VDDTF
PA supply
Power Supplies
A3, J7
A2, L7
5
VDDC
I
VDDC
Baseband core supply
A7
B4, A8, E11
54
VDDO
I
VDDO
I/O pad and core supply
J6
L8
28
VDDM
I
VDDM
I/O pad supply
–
L3
–
VDD1P2
I
VDD1P2
Speaker differential clock conversion power supply
–
K10, L10
–
VDDSP
I
VDDSP
Speaker analog power supply
Ground
C2, D2, E2, F2,
G2, E3, F3, H3,
J3, E4, E5, E6,
E7
F8, H7, G7, F7, Center
H6, G6, H5, G5, paddle
F5, H4, G4, J3,
H3, G3, K2, J2,
H2, G2, F2, E2,
D2
VSS
I
VSS
Ground
–
K3
–
VSS1P2
I
–
Speaker differential clock conversion ground
–
J9, J10, J11
–
VSSSP
I
–
Speaker analog ground
Clock Generator and Crystal Interface
J1
K1
16
XTALI
I
VDDRF
Crystal oscillator input. See “Crystal Oscillator”
on page 10 for options.
J2
L1
15
XTALO
O
VDDPX
Crystal oscillator output.
–
C2
–
TP1
I
VDDPX
XTAL divide by 2.
Connect to GND if main XTAL = 24 MHz.
H1
J1
14
RES
O
VDDPX
External calibration resistor, 15 k at 1%
B4
A3
–
XTALI32K
I
VDDPX
Low-power oscillator (LPO) input.
Alternate function:
• P39 (FBGA-81 only)
D5
B3
–
XTALO32K
O
VDDPX
LPO output.
Alternate function:
• P38 (FBGA-81 only)
B2
C3
2
RESET_N
I/O PU VDDO
Active-low system reset with open-drain output
and internal pull-up resistor.
G3
B2
1
TMC
I
VDDO
Device test mode control.
Connect to GND for all applications.
H2
L2
17
TMA
I
VDDM
ARM JTAG debug mode control.
Connect to GND for all applications.
–
L11
–
AMPLP
O
VDDSP
Speaker driver positive output
–
K11
–
AMPLN
O
VDDSP
Speaker driver negative output
Core
Speaker
Document No. 002-14859 Rev. *R
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CYW20733
Table 12. Pin Descriptions (Cont.)
Pin Number
81-pin
FBGA
121-pin
FBGA
56-pin
QFN
Pin Name
I/O
Power Domain
Description
PCM2/I2S
G5
J8
24
PCM_SYNC
I/O, PD VDDM
Frame synchronization for PCM interface.
Alternate function:
•
G4
J7
23
PCM_CLK
I/O, PD VDDM
Clock for PCM interface.
Alternate function:
•
F4
K7
22
PCM_IN
I, PU
VDDM
K8
25
PCM_OUT
O, PD
VDDM
I2S clock
Data input for PCM interface.
Alternate function:
•
F5
I2S word select
I2S data input
Data output for PCM interface.
Alternate function:
•
I2S data output
UART
J4
K6
20
UART_RXD
I
VDDM
UART serial input – Serial data input for the HCI
UART interface.
J5
L6
21
UART_TXD
O, PU
VDDM
UART serial output – Serial data output for the HCI
UART interface.
H4
L5
19
UART_RTS_N
O, PU
VDDM
Request to send (RTS) for HCI UART interface.
Leave unconnected if not used.
H5
K5
18
UART_CTS_N
I, PU
VDDM
Clear to send (CTS) for HCI UART interface. Leave
unconnected if not used.
H6
L9
26
SDA
I/O, PU VDDM
Data signal for an external I2C device.
Alternate function:
• SPI_1: MOSI (master only)
H7
K9
27
SCL
I/O, PU VDDM
Clock signal for an external I2C device.
Alternate function:
• SPI_1: SPI_CLK (master only)
BSC
LDO Regulator Power Supplies
A2
A1
3
LDOIN
I
LDOIN
Battery input supply for the LDO
A1
B1
4
LDOOUT
O
LDOOUT
LDO output
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CYW20733
Table 13. GPIO Pin Descriptionsa
Pin Number
81-pin
FBGA
121-pin
FBGA
Default Di56-pin Pin Name rection
QFN
POR
State
Power
Domain
Alternate Function Description
H8
H9
29
P0
Input
Floating
VDDO
•
•
•
•
•
•
•
GPIO: P0
Keyboard scan input (row): KSI0
A/D converter input 29
Peripheral UART: puart_tx
SPI_2: MOSI (master and slave)
IR_RX
60Hz_main
J8
G9
31
P1
Input
Floating
VDDO
•
•
•
•
•
•
GPIO: P1
Keyboard scan input (row): KSI1
A/D converter input 28
Peripheral UART: puart_rts
SPI_2: MISO (master and slave)
IR_TX
J9
H10
30
P2
Input
Floating
VDDO
•
•
•
•
•
GPIO: P2
Keyboard scan input (row): KSI2
Quadrature: QDX0
Peripheral UART: puart_rx
SPI_2: SPI_CS (slave only)
H9
H11
32
P3
Input
Floating
VDDO
•
•
•
•
•
GPIO: P3
Keyboard scan input (row): KSI3
Quadrature: QDX1
Peripheral UART: puart_cts
SPI_2: SPI_CLK (master and slave)
G8
G10
34
P4
Input
Floating
VDDO
•
•
•
•
•
•
GPIO: P4
Keyboard scan input (row): KSI4
Quadrature: QDY0
Peripheral UART: puart_rx
SPI_2: MOSI (master and slave)
IR_TX
G9
F10
33
P5
Input
Floating
VDDO
•
•
•
•
•
GPIO: P5
Keyboard scan input (row): KSI5
Quadrature: QDY1
Peripheral UART: puart_tx
SPI_2: MISO (master and slave)
F8
F11
35
P6
Input
Floating
VDDO
•
•
•
•
•
•
GPIO: P6
Keyboard scan input (row): KSI6
Quadrature: QDZ0
Peripheral UART: puart_rts
SPI_2: SPI_CS (slave only)
60Hz_main
F9
E10
36
P7
Input
Floating
VDDO
•
•
•
•
•
GPIO: P7
Keyboard scan input (row): KSI7
Quadrature: QDZ1
Peripheral UART: puart_cts
SPI_2: SPI_CLK (master and slave)
E8
D11
37
P8
Input
Floating
VDDO
•
•
•
•
GPIO: P8
Keyboard scan output (column): KSO0
A/D converter input 27
External T/R switch control: ~tx_pd
Note: Not available during TMC = 1.
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CYW20733
Table 13. GPIO Pin Descriptionsa (Cont.)
Pin Number
81-pin
FBGA
121-pin
FBGA
Default Di56-pin Pin Name rection
QFN
POR
State
Power
Domain
Alternate Function Description
E9
D10
38
P9
Input
Floating
VDDO
•
•
•
•
GPIO: P9
Keyboard scan output (column): KSO1
A/D converter input 26
External T/R switch control: tx_pd
D8
E9
39
P10
Input
Floating
VDDO
•
•
•
•
GPIO: P10
Keyboard scan output (column): KSO2
A/D converter input 25
External PA ramp control: ~PA_Ramp
D9
C11
41
P11
Input
Floating
VDDO
•
•
•
GPIO: P11
Keyboard scan output (column): KSO3
A/D converter input 24
C9
C10
40
P12
Input
Floating
VDDO
•
•
•
GPIO: P12
Keyboard scan output (column): KSO4
A/D converter input 23
C8
B11
43
P13
Input
Floating
VDDO
•
•
•
•
•
GPIO: P13
Keyboard scan output (column): KSO5
A/D converter input 22
External PA ramp control: ~PA_Ramp
Triac control 3
B9
B10
44
P14
Input
Floating
VDDO
•
•
•
•
•
GPIO: P14
Keyboard scan output (column): KSO6
A/D converter input 21
External T/R switch control: ~tx_pd
Triac control 4
A9
A11
42
P15
Input
Floating
VDDO
•
•
•
•
•
GPIO: P15
Keyboard scan output (column): KSO7
A/D converter input 20
IR_RX
60Hz_main
B7
A9
–
P16
Input
Floating
VDDO
•
•
•
GPIO: P16
Keyboard scan output (column): KSO8
A/D converter input 19
B8
A10
–
P17
Input
Floating
VDDO
•
•
•
GPIO: P17
Keyboard scan output (column): KSO9
A/D converter input 18
C7
B9
–
P18
Input
Floating
VDDO
•
•
•
GPIO: P18
Keyboard scan output (column): KSO10
A/D converter input 17
G7
C9
–
P19
Input
Floating
VDDO
•
•
GPIO: P19
Keyboard scan output (column): KSO11
F7
D9
–
P20
Input
Floating
VDDO
•
•
•
GPIO: P20
Keyboard scan output (column): KSO12
A/D converter input 15
D7
E8
–
P21
Input
Floating
VDDO
•
•
•
•
GPIO: P21
Keyboard scan output (column): KSO13
A/D converter input 14
Triac control 3
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CYW20733
Table 13. GPIO Pin Descriptionsa (Cont.)
Pin Number
81-pin
FBGA
121-pin
FBGA
Default Di56-pin Pin Name rection
QFN
POR
State
Power
Domain
Alternate Function Description
A8
G8
–
P22
Input
Floating
VDDO
•
•
•
•
GPIO: P22
Keyboard scan output (column): KSO14
A/D converter input 13
Triac control 4
D6
C6
–
P23
Input
Floating
VDDO
•
•
•
GPIO: P23
Keyboard scan output (column): KSO15
A/D converter input 12
G6
F9
45
P24
Input
Floating
VDDO
•
•
•
•
•
GPIO: P24
Keyboard scan output (column): KSO16
SPI_2: SPI_CLK (master and slave)
SPI_1: MISO (master only)
Peripheral UART: puart_tx
F6
D8
46
P25
Input
Floating
VDDO
•
•
•
•
GPIO: P25
Keyboard scan output (column): KSO17
SPI_2: MISO (master and slave)
Peripheral UART: puart_rx
A4
A5
56
P26
PWM0
Input
Floating
VDDO
• GPIO: P26
• Keyboard scan output (column): KSO18
• SPI_2: SPI_CS (slave only)
• SPI_1: MISO (master only)
• Optical control output: QOC0
• Triac control 1
Current: 16 mA sink
B3
B5
55
P27
PWM1
Input
Floating
VDDO
• GPIO: P27
• Keyboard scan output (column): KSO19
• SPI_2: MOSI (master and slave)
• Optical control output: QOC1
• Triac control 2
Current: 16 mA sink
C3
A4
–
P28
PWM2
Input
Floating
VDDO
• GPIO: P28
• Optical control output: QOC2
• A/D converter input 11
• LED1
Current: 16 mA sink
D3
C4
–
P29
PWM3
Input
Floating
VDDO
• GPIO: P29
• Optical control output: QOC3
• A/D converter input 10
• LED2
Current: 16 mA sink
C6
C8
47
P30
Input
Floating
VDDO
•
•
•
•
GPIO: P30
A/D converter input 9
Pairing button pin in default FW
Peripheral UART: puart_rts
B6
B8
–
P31
Input
Floating
VDDO
•
•
•
•
GPIO: P31
A/D converter input 8
EEPROM WP pin in default FW
Peripheral UART: puart_tx
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CYW20733
Table 13. GPIO Pin Descriptionsa (Cont.)
Pin Number
81-pin
FBGA
121-pin
FBGA
Default Di56-pin Pin Name rection
QFN
POR
State
Power
Domain
Alternate Function Description
A6
B7
48
P32
Input
Floating
VDDO
•
•
•
•
•
•
•
GPIO: P32
A/D converter input 7
Quadrature: QDX0
SPI_2: SPI_CS (slave only)
SPI_1: MISO (master only)
Auxiliary clock output: ACLK0
Peripheral UART: puart_tx
C4
B6
53
P33
Input
Floating
VDDO
•
•
•
•
•
•
GPIO: P33
A/D converter input 6
Quadrature: QDX1
SPI_2: MOSI (slave only)
Auxiliary clock output: ACLK1
Peripheral UART: puart_rx
C5
C7
–
P34
Input
Floating
VDDO
•
•
•
•
•
GPIO: P34
A/D converter input 5
Quadrature: QDY0
Peripheral UART: puart_rx
External T/R switch control: tx_pd
B5
D7
49
P35
Input
Floating
VDDO
•
•
•
•
GPIO: P35
A/D converter input 4
Quadrature: QDY1
Peripheral UART: puart_cts
A5
A7
50
P36
Input
Floating
VDDO
•
•
•
•
•
•
•
GPIO: P36
A/D converter input 3
Quadrature: QDZ0
SPI_2: SPI_CLK (master and slave)
Auxiliary Clock Output: ACLK0
Battery detect pin in default FW
External T/R switch control: ~tx_pd
D4
A6
–
P37
Input
Floating
VDDO
•
•
•
•
•
GPIO: P37
A/D converter input 2
Quadrature: QDZ1
SPI_2: MISO (slave only)
Auxiliary clock output: ACLK1
D5
C5
51
P38
Input
Floating
VDDO
•
•
•
•
•
GPIO: P38
A/D converter input 1
SPI_2: MOSI (master and slave)
IR_TX
XTALO32K (FBGA-81 only)
B4
D4
52
P39
Input
Floating
VDDO
•
•
•
•
•
•
•
GPIO: P39
SPI_2: SPI_CS (slave only)
SPI_1: MISO (master only)
Infrared control: IR_RX
External PA ramp control: PA_Ramp
60Hz_main
XTALI32K (FBGA-81 only)
–
H8
–
P40
Input
Floating
VDDO
•
•
GPIO: P40
pcm2_clk
Document No. 002-14859 Rev. *R
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CYW20733
Table 13. GPIO Pin Descriptionsa (Cont.)
Pin Number
81-pin
FBGA
121-pin
FBGA
Default Di56-pin Pin Name rection
QFN
POR
State
Power
Domain
Alternate Function Description
–
K4
–
P41
Input
Floating
VDDO
•
•
GPIO: P41
pcm2_sync
–
F6
–
P42
Input
Floating
VDDO
•
•
GPIO: P42
pcm2_di
–
J5
–
P43
Input
Floating
VDDO
•
•
GPIO: P43
pcm2_do
–
J4
–
P44
Input
Floating
VDDO
•
GPIO: P44
–
J6
–
P45
Input
Floating
VDDO
•
GPIO: P45
–
L4
–
P46
Input
Floating
VDDO
•
GPIO: P46
–
E7
–
P47
Input
Floating
VDDO
•
GPIO: P47
–
E6
–
P48
Input
Floating
VDDO
•
GPIO: P48
–
D6
–
P49
Input
Floating
VDDO
•
GPIO: P49
–
E5
–
P50
Input
Floating
VDDO
•
GPIO: P50
–
D5
–
P51
Input
Floating
VDDO
•
GPIO: P51
–
F4
–
P52
Input
Floating
VDDO
•
GPIO: P52
–
F3
–
P53
Input
Floating
VDDO
•
GPIO: P53
–
E4
–
P54
Input
Floating
VDDO
•
GPIO: P54
–
E3
–
P55
Input
Floating
VDDO
•
GPIO: P55
–
D3
–
P56
Input
Floating
VDDO
•
GPIO: P56
–
G11
–
P57
Input
Floating
VDDO
•
•
GPIO: P57
PWM3
a. During power-on reset, all inputs are disabled.
2.1 Ball Maps
This section presents the CYW20733 ball maps.
2.1.1 81-Pin FBGA Ball Map
Figure 12 shows the 81-pin FBGA package ball map.
Document No. 002-14859 Rev. *R
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CYW20733
Figure 12. 81-Pin FBGA Ball Map
1
2
3
4
5
6
7
8
9
A
LDOOUT
LDOIN
VDDC
P26
PWM0
P36
P32
VDDO
P22
P15
A
B
VDDIF
RESET_N
P27
PWM1
P39/
XTALI32K
P35
P31
P16
P17
P14
B
C
VDDTF
VSS
P28
PWM2
P33
P34
P30
P18
P13
P12
C
D
RFP
VSS
P29
PWM3
P37
P38/
XTALO32K
P23
P21
P10
P11
D
E
VDDLNA
VSS
VSS
VSS
VSS
VSS
VSS
P8
P9
E
F
VDDRF
VSS
VSS
PCM_IN
PCM_
OUT
P25
P20
P6
P7
F
G
VDDPX
VSS
TMC
PCM_
CLK
PCM_
SYNC
P24
P19
P4
P5
G
H
RES
TMA
VSS
UART_
RTS_N
UART_
CTS_N
SDA
SCL
P0
P3
H
J
XTALI
XTALO
VSS
UART_
RXD
UART_
TXD
VDDM
VDDC
P1
P2
J
1
2
3
4
5
6
7
8
9
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CYW20733
2.1.2 121-Pin FBGA Ball Map
Figure 13 shows the 121-pin FBGA package ball map.
Figure 13. 121-Pin FBGA Ball Map
1
2
3
4
5
6
7
8
9
10
11
A
LDOIN
VDDC
XTALI32K
P28
PWM2
P26
PWM0
P37
P36
VDDO
P16
P17
P15
A
B
LDOOUT
TMC
XTALO32K
VDDO
P27
PWM1
P33
P32
P31
P18
P14
P13
B
C
VDDIF
TP1
RESET_N
P29
PWM3
P38
P23
P34
P30
P19
P12
P11
C
D
VDDTF
VSS
P56
P39
P51
P49
P35
P25
P20
P9
P8
D
E
RFP
VSS
P55
P54
P50
P48
P47
P21
P10
P7
VDDO
E
F
VDDLNA
VSS
P53
P52
VSS
P42
VSS
VSS
P24
P5
P6
F
G
VDDRF
VSS
VSS
VSS
VSS
VSS
VSS
P22
P1
P4
P57
G
H
VDDPX
VSS
VSS
VSS
VSS
VSS
VSS
P40
P0
P2
P3
H
J
RES
VSS
VSS
P44
P43
P45
PCM_CLK
PCM_
SYNC
VSSSP
VSSSP
VSSSP
J
K
XTALI
VSS
VSS1P2
P41
UART_
CTS_N
UART_
RXD
PCM_IN
PCM_OUT
SCL
VDDSP
AMPLN
K
L
XTALO
TMA
VDD1P2
P46
UART_
RTS_N
UART_
TXD
VDDC
VDDM
SDA
VDDSP
AMPLP
L
1
2
3
4
5
6
7
8
9
10
11
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CYW20733
2.1.3 56-Pin QFN Diagram
Figure 14 shows the 56-pin QFN package.
VDDO
P33
P39
P38
P36
P35
P32
P30
P25
P24
P14
54
53
52
51
50
49
48
47
46
45
44
P13
P27
55
43
P26
56
Figure 14. 56-Pin QFN Diagram
NC
8
35
P6
RFP
9
34
P4
NC
10
33
P5
VDDLNA
11
32
P3
VDDRF
12
31
P1
VDDPX
13
30
P2
RES
14
29
P0
28
P7
VDDM
36
27
7
SCL
VDDTF
26
P8
SDA
37
25
6
PCM_OUT
VDDIF
24
P9
PCM_SYNC
38
23
5
PCM_CLK
VDDC
22
P10
PCM_IN
39
21
4
UART_TXD
LDOOUT
20
P12
UART_RXD
40
19
3
UART_RTS_N
LDOIN
18
P11
UART_CTS_N
41
17
2
TMA
RESET_N
16
P15
XTALI
42
15
1
XTALO
TMC
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CYW20733
3. Specifications
3.1 Electrical Characteristics
Table 14 shows the maximum electrical rating for voltages referenced to the VDD pin.
Table 14. Maximum Electrical Rating
Rating
Symbol
DC supply voltage for RF domain
DC supply voltage for Core domain
DC supply voltage for VDDM domain (UART/I2C)
DC supply voltage for VDDO domain
DC supply voltage for LDOIN
DC supply voltage for VDDLNA
DC supply voltage for VDDTF
Voltage on input or output pin
Operating ambient temperature range
Storage temperature range
Value
–
–
–
–
–
–
–
–
Topr
Tstg
Unit
1.32
1.4
3.8
3.8
3.8
1.4
3.3
VSS – 0.3 to VDD + 0.3
0 to +70
–40 to +125
V
V
V
V
V
V
V
V
°C
°C
Table 15 shows the power supply characteristics for the range TJ = 0 to 125°C.
Table 15. Power Supply
Minimuma
Parameter
DC supply voltage for RF
DC supply voltage for Core
DC supply voltage for VDDM (UART/I2C)
DC supply voltage for VDDO
DC supply voltage for LDOIN
DC supply voltage for VDDLNA
DC supply voltage for VDDTF
Maximuma
Typical
1.14
1.14
1.62
1.62
1.62
1.14
1.14
1.2
1.2
–
–
–
1.2b
1.2b
Unit
1.26
1.26
3.63
3.63
3.63
1.26
3.3
V
V
V
V
V
V
V
a. Overall performance degrades beyond minimum and maximum supply voltages.
b. 1.2V for Class 2 output with internal VREG.
Table 16 shows the digital level characteristics for the LDO (VSS = 0V).
Table 16. LDO Regulator Electrical Specifications
Parameter
Conditions
Min
Typ
Max
Unit
Input voltage range
–
1.62
–
3.63
Default output voltage
–
–
1.2
–
V
V
Output voltage
Range
0.88
–
1.32
V
Step size
–
40
80
mV
Accuracy at any step
–5
–
+5
%
Load current
–
–
–
60
mA
Line regulation
Vin from 1.62 to 3.63V, Iload = 30 mA
–0.5
–
0.5
%VO/V
Load regulation
Iload from 1 µA to 30 mA, Vin = 3.3V,
Bonding R = 0.3
–
0.1
0.15
%VO/mA
Quiescent current
No load @Vin = 3.3V
*Current limit enabled
–
6a
12a
µA
Power-down current
Vin = 3.3V, [email protected]°C
–
–
200
nA
a. Includes the bandgap quiescent current.
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CYW20733
Table 17. ADC Specifications
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
ADC Characteristics
Number of Input channels
–
–
–
28
–
–
Channel switching rate
fch
–
–
–
187
kHz
V
Input signal range
Vinp
–
0
–
3.63
Reference settling time
–
–
7.5
–
–
s
Input resistance
Rinp
Single-ended, input range of 0–1.2V
–
680
–
k
Single-ended, input range of 0–2.4V
–
1.84
–
M
Single-ended, input range of 0–3.6V
–
3
–
M
Input capacitance
Cinp
–
–
–
5
pF
Conversion rate
fC
–
5.859
–
187
kHz
Resolution
R
–
–
16
–
bits
Effective number of bits
–
In guaranteed performance range
–
See Table 7
–
bits
Using on-chip ADC firmware driver
–
±2
INL
In guaranteed performance range
–1
–
1
LSB1
DNL
In guaranteed performance range
–1
–
1
LSB1
Absolute voltage measurement
error
Integral nonlinearity1
Differential
nonlinearity1
on page 14
%
Notes:
1. LSBs are expressed at the 10-bit level.
Table 18. Integrated Audio Amplifier Electrical Specifications
Parameter
Conditions
Min
Typ
Max
Unit
Analog supply voltage
–
2.9
3.0
3.1
V
Digital supply voltage
–
1.08
1.2
1.32
V
Quiescent current
Zero digital input
–
2
–
mA
Power down current
–
–
0.5
–
A
Output power
RL = 8Ω
200
240
–
mW
Maximum efficiency
At 200 mW output power
–
70
–
%
Dynamic range (DR)
At –60 dBFs input
65
68
–
dB
Signal-to-noise plus distortion ratio
(SNDR)
At 200 mW output power
–
40
–
dB
Table 19. Digital Levela
Characteristics
Symbol
Min
Typ
Max
Unit
Input low voltage
VIL
–
–
0.4
V
Input high voltage
VIH
0.75 × VDDO
–
–
V
Input low voltage (VDDO = 1.62V)
VIL
–
–
0.4
V
Input high voltage (VDDO = 1.62V)
VIH
1.2
–
–
V
V
Output low voltage
b
VOL
–
–
0.4
Output high voltageb
VOH
VDDO – 0.4
–
–
V
Input capacitance (VDDMEM domain)
CIN
–
0.12
–
pF
a. This table is also applicable to VDDMEM domain.
b. At the specified drive current for the pad.
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Table 20. Current Consumption, Class 1a
Operational Mode
Conditions
Typ
Unit
Receive (1 Mbps)
Peak current level during reception of a basic-rate packet.
28.2
mA
Transmit (1 Mbps)
Peak current level during the transmission of a basic-rate packet: GFSK
output power = 10 dBm.
63.1
mA
Receive (EDR)
Peak current level during the reception of a 2 or 3 Mbps rate packet.
28.6
mA
Transmit (EDR)
Peak current level during the transmission of a 2 or 3 Mbps rate packet: EDR 63.7
output power = 8 dBm.
mA
DM1/DH1 (RX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
24.3
mA
DM5/DH5 (RX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
26.3
mA
3DH1 (RX)
Average current during extended data rate maximum throughput connection 24.9
which includes only this packet type.
mA
3DH5 (RX)
Average current during extended data rate maximum throughput connection, 26.4
which includes only this packet type.
mA
DM1/DH1 (TX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
29.6
mA
DM5/DH5 (TX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
47.2
mA
3DH1 (TX)
Average current during extended data rate maximum throughput connection, 29.7
which includes only this packet type.
mA
3DH5 (TX)
Average current during extended data rate maximum throughput connection, 44.8
which includes only this packet type.
mA
Paging
–
23.7
mA
Sniff slave (495 ms)
Based on one attempt and no timeout parameter. Quality connection that
rarely requires more than minimum packet exchange. Sniff master follows
the optimal sniff protocol of the CYW20702 master.
290
A
Sniff slave (22.5 ms)
–
2.57
mA
Sniff slave (11.25 ms)
–
4.93
mA
Average Current
a. Current consumption measurements are taken at LDOIN. LDOIN = VDDIO = 2.6V, VDDPA = 3.0V.
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CYW20733
Table 21. Current Consumption, Class 2 (0 dBm)a
Operational Mode
Conditions
Typ
Unit
Receive (1 Mbps)
Peak current level during the reception of a basic-rate packet.
29.0
mA
Transmit (1 Mbps)
Peak current level during the transmission of a basic-rate packet: GFSK
output power = 0 dBm.
39.3
mA
Receive (EDR)
Peak current level during the reception of a 2 or 3 Mbps rate packet.
30.5
mA
Transmit (EDR)
Peak current level during the transmission of a 2 or 3 Mbps rate packet: EDR 39.3
output power = 0 dBm.
mA
DM1/DH1 (RX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
22.1
mA
DM5/DH5 (RX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
25.8
mA
3DH1 (RX)
Average current during extended data rate maximum throughput connection, 22.8
which includes only this packet type.
mA
3DH5 (RX)
Average current during extended data rate maximum throughput connection, 24.7
which includes only this packet type.
mA
DM1/DH1 (TX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
22.0
mA
DM5/DH5 (TX)
Average current during basic rate maximum throughput connection, which
includes only this packet type.
30.9
mA
3DH1 (TX)
Average current during extended data rate maximum throughput connection, 22.1
which includes only this packet type.
mA
3DH5 (TX)
Average current during extended data rate maximum throughput connection, 31.6
which includes only this packet type.
mA
Paging
–
22.9
mA
Sniff slave (495 ms)
Based on one attempt and no timeout parameter. Quality connection that
rarely requires more than minimum packet exchange. Sniff master follows
optimal sniff protocol of CYW20702 master.
240
A
Sniff slave (22.5 ms)
–
2.27
mA
Sniff slave (11.25 ms)
–
4.46
mA
Average Current
a. Current consumption measurements are taken at LDOIN. LDOIN = VDDIO = 2.6V, VDDPA = 1.2V.
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Table 22. Current Consumption
Operational Mode
Conditions
Typ
Unit
Sleep
Internal LPO is in use.
46.5
A
HIDOFF
–
1.1
A
Inquiry scan (1.28 sec.)
Periodic scan rate is R1 (1.28 seconds).
540
A
Page Scan (R1)
Periodic scan rate is R1 (1.28 seconds).
490
A
Inquiry Scan + Page Scan (R1)
Both inquiry and page scans are interlaced together at a
periodic scan rate of 1.28 seconds.
940
A
3.2 RF Specifications
Table 23. Receiver RF Specificationsa,b
Parameter
Conditions
Minimum
Typical c
Maximum
Unit
General
Frequency range
–
2402
–
2480
MHz
RX sensitivity d
GFSK, 0.1% BER, 1 Mbps
/4-DQPSK, 0.01% BER, 2 Mbps
–
–89
–85
dBm
–
–91
–85
dBm
8-DPSK, 0.01% BER, 3 Mbps
–
–86
–81
dBm
Maximum input
GFSK, 1 Mbps
/4-DQPSK, 8-DPSK, 2/3 Mbps
–
–
–20
dBm
–
–
–20
dBm
C/I cochannel
GFSK, 0.1% BER
–
–
11
dB
C/I 1 MHz adjacent channel
GFSK, 0.1% BER
–
–
0
dB
C/I 2 MHz adjacent channel
GFSK, 0.1% BER
–
–
–30.0
dB
C/I > 3 MHz adjacent channel
GFSK, 0.1% BER
–
–
–40.0
dB
C/I image channel
GFSK, 0.1% BER
–
–
–9.0
dB
Maximum input
Interference Performance
C/I 1 MHz adjacent to image channel
GFSK, 0.1% BER
–
–
–20.0
dB
–
–
13
dB
C/I 1 MHz adjacent to image channel
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
/4-DQPSK, 0.1% BER
C/I cochannel
8-DPSK, 0.1% BER
C/I 1 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
5
dB
C/I 2 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
–25.0
dB
C/I cochannel
C/I 1 MHz adjacent channel
C/I 2 MHz adjacent channel
C/I > 3 MHz adjacent channel
C/I image channel
–
–
0
dB
–
–
–30.0
dB
–
–
–40.0
dB
–
–
–7.0
dB
–
–
–20.0
dB
–
–
21
dB
C/I > 3 MHz adjacent channel
8-DPSK, 0.1% BER
–
–
–33.0
dB
C/I image channel
8-DPSK, 0.1% BER
–
–
0
dB
C/I 1 MHz adjacent to image channel
8-DPSK, 0.1% BER
–
–
–13.0
dB
Out-of-Band Blocking Performance (CW) e
30–2000 MHz
0.1% BER
–
–10.0
–
dBm
2000–2399 MHz
0.1% BER
–
–27
–
dBm
2498–3000 MHz
0.1% BER
–
–27
–
dBm
3000 MHz–12.75 GHz
0.1% BER
–
–10.0
–
dBm
–
–39.0
–
–
dBm
Intermodulation Performance
f
BT, ∆f = 5 MHz
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Table 23. Receiver RF Specificationsa,b (Cont.)
Parameter
Spurious Emissions
Conditions
Minimum
Typical c
Maximum
Unit
g
30 MHz to 1 GHz
–
–
–
–57
dBm
1 GHz to 12.75 GHz
–
–
–
–47
dBm
a.
b.
c.
d.
e.
f.
All specifications are single ended. Unused inputs are left open.
All specifications, except typical, are for commercial temperatures.
Typical operating conditions are 1.22V operating voltage and 25°C ambient temperature.
The receiver sensitivity is measured at a BER of 0.1% on the device interface.
Meets this specification using front-end band-pass filter.
f0 = –64 dBm Bluetooth-modulated signal, f1 = –39 dBm sine wave, f2 = –39 dBm Bluetooth-modulated signal, f0 = 2f1 – f2, and |f2 – f1| = n × 1 MHz, where
n is 3, 4, or 5. For the typical case, n = 5.
g. Includes baseband radiated emissions.
Table 24. Transmitter RF Specifications a,b
Parameter
Conditions
Minimum
Typical
Maximum
Unit
General
Frequency range
–
2402
–
2480
MHz
Class1: GFSK Tx powercd
–
6.5
10
–
dBm
Class1: EDR Tx powerde
–
4.5
8
–
dBm
Class 2: GFSK Tx powerd
–
–0.5
3
–
dBm
Power control step
–
2
4
6
dB
Modulation Accuracy
/4-DQPSK frequency stability
/4-DQPSK RMS DEVM
/4-QPSK peak DEVM
/4-DQPSK 99% DEVM
–
–10
–
10
kHz
–
–
–
20
%
–
–
–
35
%
–
–
–
30
%
8-DPSK frequency stability
–
–10
–
10
kHz
8-DPSK RMS DEVM
–
–
–
13
%
8-DPSK peak DEVM
–
–
–
25
%
8-DPSK 99% DEVM
–
–
–
20
%
+500 kHz
–
–
–
–20
dBc
1.0 MHz < |M – N| < 1.5 MHz
–
–
–
–26
dBc
1.5 MHz < |M – N| < 2.5 MHz
–
–
–
–20
dBm
|M – N| > 2.5 MHz
–
–
–
–40
dBm
30 MHz to 1 GHz
–
–
–
–36.0 f
dBm
1 GHz to 12.75 GHz
–
–
–
–30.0 f, g
dBm
1.8 GHz to 1.9 GHz
–
–
–
–47.0
dBm
5.15 GHz to 5.3 GHz
–
–
–
–47.0
dBm
In-Band Spurious Emissions
Out-of-Band Spurious Emissions
a. All specifications are for commercial temperatures.
b. All specifications are single-ended. Unused inputs are left open.
c. +10 dBm output for GFSK measured with VDDTF = 2.9 V.
d. Power output is measured at the device without a front-end band-pass filter.
e. +8 dBm output for EDR measured with VDDTF = 2.9 V.
f. Maximum value is the value required for Bluetooth qualification.
g. Meets this specification using a front-end band-pass filter.
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3.3 Timing and AC Characteristics
In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams.
3.3.1 UART Timing
Table 25. UART Timing Specifications
Reference
Characteristics
Min
Max
Unit
1
Delay time, UART_CTS_N low to UART_TXD valid
–
24
Baud out
cycles
2
Setup time, UART_CTS_N high before midpoint of
stop bit
–
10
ns
3
Delay time, midpoint of stop bit to UART_RTS_N
high
–
2
Baud out
cycles
Figure 15. UART Timing
UART_CTS_N
UART_TXD
1
2
Midpoint of
STOP bit
UART_RXD
3
UART_RTS_N
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3.3.2 SPI Timing
Figure 16. SPI Timing Diagram
5
CS
6
SCLK
Mode 1
SCLK
Mode 3
2
1
MSB
MOSI
LSB
4
3
Invalid bit
MISO
MSB
LSB
Table 26. SPI1 Timing Values—SCLK = 12 MHz and VDDM = 1.8Va
Reference
Characteristics
Symbol
Typicalb
Min
Max
Unit
1
Output setup time, from MOSI
data valid to sample edge of SCLK
Tds_mo
–
23
–
ns
2
Output hold time, from sample
edge of SCLK to MOSI data update
Tdh_mo
–
60
–
ns
3
Input setup time, from MISO data valid to
sample edge of SCLK
Tds_mi
–
TBD
–
ns
4
Input hold time, from sample
edge of SCLK to MISO data update
Tdh_mi
–
TBD
–
ns
Time from CS assert to first SCLK edge
Tsu_cs
½ SCLK period – 1
–
–
ns
Time from first SCLK edge to CS deassert
Thd_cs
½ SCLK period
–
–
ns
5c
6
c
a. The SCLK period is based on the limitation of Tds_mi. SCLK is designed for a maximum speed of 12 MHz. The speed can be adjusted to as low as 400
Hz by configuring the firmware.
b. Typical timing based on 20 pF//1 MΩ load and SCLK = 12 MHz.
c. CS timing is firmware controlled.
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Table 27. SPI1 Timing Values—SCLK = 12 MHz and VDDM = 3.3Va
Reference
Characteristics
Symbol
Typicalb
Min
Max
Unit
1
Output setup time, from MOSI data valid to
sample edge of SCLK
Tds_mo
–
34
–
ns
2
Output hold time, from sample
edge of SCLK to MOSI data update
Tdh_mo
–
49
–
ns
3
Input setup time, from MISO
data valid to sample edge of SCLK
Tds_mi
–
TBD
–
ns
4
Input hold time, from sample
edge of SCLK to MISO data update
Tdh_mi
–
TBD
–
ns
5c
Time from CS assert to first SCLK edge
Tsu_cs
½ SCLK period – 1
–
–
ns
6c
Time from first SCLK edge to CS deassert
Thd_cs
½ SCLK period
–
–
ns
a. The SCLK period is based on the limitation of Tds_mi. SCLK is designed for a maximum speed of 12 MHz. The speed can be adjusted to as low as
400 Hz by configuring the firmware.
b. Typical timing based on 20 pF//1 MΩ load and SCLK = 12 MHz.
c. CS timing is firmware controlled.
Table 28. SPI2 Timing Values—SCLK = 6 MHz and VDDM = 3.3Va
Reference
Characteristics
Symbol
Typicalb
Min
Max
Unit
1
Output setup time, from MOSI
data valid to sample edge of SCLK
Tds_mo
–
67
–
ns
2
Output hold time, from sample
edge of SCLK to MOSI data update
Tdh_mo
–
99
–
ns
3
Input setup time, from MISO
data valid to sample edge of SCLK
Tds_mi
–
TBD
–
ns
4
Input hold time, from sample
edge of SCLK to MISO data update
Tdh_mi
–
TBD
–
ns
Time from CS assert to first SCLK edge
Tsu_cs
½ SCLK period – 1
–
–
ns
Time from first SCLK edge to CS deassert
Thd_cs
½ SCLK period
–
–
ns
5c
6
c
a. The SCLK period is based on the limitation of Tds_mi. SCLK is designed for a maximum speed of 6 MHz. The speed can be adjusted to as low as 400
Hz by configuring the firmware.
b. Typical timing based on 20 pF//1 MΩ load and SCLK = 6 MHz.
c. CS timing is firmware controlled in master mode and can be adjusted as required in slave mode.
3.3.3 BSC Interface Timing
The specifications in Table 29 and Table 30 on page 43 reference Figure 17 on page 43.
Table 29. BSC Interface Timing Specifications (up to 1 MHz)
Reference
1
Characteristics
Min
Clock frequency
Max
Unit
100
–
400
800
kHz
1000
2
START condition setup time
3
START condition hold time
280
–
ns
4
Clock low time
650
–
ns
5
Clock high time
280
–
ns
6
Data input hold timea
0
–
ns
7
Data input setup time
100
–
ns
Document No. 002-14859 Rev. *R
650
–
ns
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CYW20733
Table 29. BSC Interface Timing Specifications (up to 1 MHz)
Reference
Characteristics
Min
Max
Unit
8
STOP condition setup time
280
–
ns
9
Output valid from clock
–
400
ns
10
Bus free timeb
650
–
ns
a. As a transmitter, 125 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP
conditions.
b. Time that the CBUS must be free before a new transaction can start.
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CYW20733
Table 30. BSC Interface Timing Specification (1 MHz through 4 MHz)
Reference
Characteristics
1
Clock
2
Min
frequencya
Max
Unit
1.000
4.000
MHz
START condition setup time
233
–
ns
3
START condition hold time
66
–
ns
4
Clock low timeb
½ SCL period
–
ns
5
Clock high timeb
½ SCL period
–
ns
c
6
Data input hold time
0
–
ns
7
Data input setup timed
33.4
–
ns
8
STOP condition setup time
233
–
ns
9
Output valid from clock
–
150
ns
10
Bus free timee
650
–
ns
a. Maximum speed is achieved without clock stretching. Strict timing parameter adherence for modes beyond I2C fast mode may require that the total
capacitance of the SDA and SCL traces be very similar so that signal transition times are very similar.
b. Programmable by firmware. Use 50% of period for overclocking frequencies greater than 2.400 MHz. Can be asymmetric (65/35 duty) for modest
overclocking—up to 2.400 MHz.
c. As a transmitter, 125 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP
conditions.
d. Depends on the degree of overclocking. Application-specific programmability of the hardware block can affect this parameter.
e. Time that CBUS must be free before a new transaction can start.
Figure 17. BSC Interface Timing Diagram
1
5
SCL
2
4
8
6
3
7
SDA
IN
10
9
SDA
OUT
3.3.4 PCM Interface Timing
The following is a list of the PCM interface timing diagrams.
■
PCM Electrical Timing Slave — Short Frame Sync
■
PCM Electrical Timing Master—Short Frame Sync
■
PCM Electrical Timing Burst (Slave Rx Only)—Short Frame Sync
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CYW20733
■
PCM Electrical Timing Slave—Long Frame Sync
■
PCM Electrical Timing Master—Long Frame Sync
■ PCM Electrical Timing Burst (Slave Rx Only)—Long Frame Sync
Note: The TX and RX timings are combined on the same diagram. The CYW20733 can only either transmit or receive in a given slot.
PCM Electrical Timing Slave — Short Frame Sync
Figure 18. PCM Electrical Timing Slave—Short Frame Sync Diagram
1
2
3
PCM_BCLK
4
5
PCM_SYNC
9
Bit 15 (Previous Frame)
PCM_OUT
High impedance
Bit 0
6
7
PCM_IN
Bit 15 (Previous Frame)
8
Bit 0
Table 31. PCM Electrical Timing Slave—Short Frame Sync Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low time
41
–
–
ns
3
PCM bit clock high time
41
–
–
ns
4
PCM_SYNC setup time
8
–
–
ns
5
PCM_SYNC hold time
8
–
–
ns
6
PCM_OUT delay
0
–
25
ns
7
PCM_IN setup
8
–
–
ns
8
PCM_IN hold
8
–
–
ns
9
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
Document No. 002-14859 Rev. *R
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CYW20733
PCM Electrical Timing Master—Short Frame Sync
Figure 19. PCM Electrical Timing Master—Short Frame Sync Diagram
1
2
3
PCM_BCLK
4
PCM_SYNC
8
PCM_OUT
Bit 15 (Previous Frame)
High impedance
Bit 0
5
6
PCM_IN
Bit 15 (Previous Frame)
7
Bit 0
Table 32. Values of PCM Electrical Timing Master—Short Frame Sync Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low time
41
–
–
ns
3
PCM bit clock high time
41
–
–
ns
4
PCM_SYNC delay
0
–
25
ns
5
PCM_OUT delay
0
–
25
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
8
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
PCM Electrical Timing Burst (Slave Rx Only)—Short Frame Sync
Figure 20. PCM Electrical Timing Burst (Slave Rx-Only)—Short Frame Sync Diagram
1
2
3
PCM_BCLK
4
5
PCM_SYNC
6
PCM_IN
Bit 15 (previous frame)
Document No. 002-14859 Rev. *R
7
Bit 0
Page 45 of 67
CYW20733
Table 33. Values of PCM Electrical Timing Burst (Slave Rx-Only)—Short Frame Sync Characteristics
Reference
Characteristics
Minimum
–
Typical
–
Maximum
24
Unit
1
PCM bit clock frequency
MHz
2
PCM bit clock low time
20.8
–
–
ns
3
PCM bit clock high time
20.8
–
–
ns
4
PCM_SYNC setup time
8
–
–
ns
5
PCM_SYNC hold time
8
–
–
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
PCM Electrical Timing Slave—Long Frame Sync
Figure 21. PCM Electrical Timing Slave—Long Frame Sync Diagram
1
2
3
PCM_BCLK
4
5
PCM_SYNC
9
PCM_OUT
Bit 0
High impedance
Bit 1
6
7
PCM_IN
8
Bit 1
Bit 0
Table 34. Values of PCM Electrical Timing Slave—Long Frame Sync Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low time
41
–
–
ns
3
PCM bit clock high time
41
–
–
ns
4
PCM_SYNC setup time
8
–
–
ns
5
PCM_SYNC hold time
8
–
–
ns
6
PCM_OUT delay
0
–
25
ns
7
PCM_IN setup
8
–
–
ns
8
PCM_IN hold
8
–
–
ns
9
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
Document No. 002-14859 Rev. *R
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CYW20733
PCM Electrical Timing Master—Long Frame Sync
Figure 22. PCM Electrical Timing Master—Long Frame Sync Diagram
1
2
3
PCM_BCLK
4
PCM_SYNC
8
PCM_OUT
Bit 0
Bit 1
Bit 0
Bit 1
High impedance
5
7
6
PCM_IN
Table 35. Values of PCM Electrical Timing Master—Long Frame Sync Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
PCM bit clock frequency
–
–
12
MHz
2
PCM bit clock low time
41
–
–
ns
3
PCM bit clock high time
41
–
–
ns
4
PCM_SYNC delay
0
–
25
ns
5
PCM_OUT delay
0
–
25
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
8
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0
–
25
ns
PCM Electrical Timing Burst (Slave Rx Only)—Long Frame Sync
Figure 23. PCM Electrical Timing Burst (Slave Rx-Only)—Long Frame Sync Diagram
1
2
3
PCM_BCLK
4
5
PCM_SYNC
6
PCM_IN
Bit 0
Document No. 002-14859 Rev. *R
7
Bit 1
Page 47 of 67
CYW20733
Table 36. Values of PCM Electrical Timing Burst (Slave Rx Only)—Long Frame Sync Characteristics
Reference
Characteristics
Minimum
–
Typical
–
Maximum
24
Unit
1
PCM bit clock frequency
MHz
2
PCM bit clock low time
20.8
–
–
ns
3
PCM bit clock high time
20.8
–
–
ns
4
PCM_SYNC setup time
8
–
–
ns
5
PCM_SYNC hold time
8
–
–
ns
6
PCM_IN setup
8
–
–
ns
7
PCM_IN hold
8
–
–
ns
3.3.5 I2S Timing
The following is a list of the I2S timing diagrams.
■
I2S Electrical Timing Slave—Short Frame WS
■
I2S Electrical Timing Master—Short Frame WS
■
I2S Electrical Timing Burst (Slave Rx Only)—Short Frame WS
■
I2S Electrical Timing Slave—Long Frame WS
■
I2S Electrical Timing Master—Long Frame WS
I2S Electrical Timing Burst (Slave Rx Only)—Long Frame WS
Note: The TX and RX timings are combined on the same diagram. The CYW20733 can only either transmit or receive in a given slot.
■
I2S Electrical Timing Slave—Short Frame WS
Figure 24. I2S Electrical Timing Slave — Short Frame WS Diagram
1
2
3
I2S_BCLK
4
I2S_WS
I2S_OUT
Bit 15 (previous frame)
Bit 0
5
6
I2S_IN
Bit 15 (previous frame)
7
Bit 0
Table 37. Values of I2S Electrical Timing Slave—Short Frame WS Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
I2 S
–
–
12
MHz
2
I2S bit clock low time
41
–
–
ns
3
I2S bit clock high time
41
–
–
ns
4
I2S_WS setup time
8
–
–
ns
5
I2S_OUT delay
0
–
25
ns
bit clock frequency
Document No. 002-14859 Rev. *R
Page 48 of 67
CYW20733
Table 37. Values of I2S Electrical Timing Slave—Short Frame WS Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
6
I2S_IN setup
8
–
–
ns
7
I2S_IN hold
8
–
–
ns
I2S Electrical Timing Master—Short Frame WS
Figure 25. I2S Electrical Timing Master — Short Frame WS Diagram
1
2
3
I2S_BCLK
4
I2S_WS
I2S_OUT
Bit 15 (previous frame)
Bit 0
5
6
I2S_IN
Bit 15 (previous frame)
7
Bit 0
Table 38. Values of I2S Electrical Timing Master—Short Frame WS Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
I2S bit clock frequency
2
I2S bit clock low time
41
–
–
ns
3
I2S bit clock high time
41
–
–
ns
4
I2S_WS delay
0
–
25
ns
5
I2S_OUT delay
0
–
25
ns
6
I2S_IN setup
8
–
–
ns
7
I2S_IN hold
8
–
–
ns
Document No. 002-14859 Rev. *R
–
–
12
MHz
Page 49 of 67
CYW20733
I2S Electrical Timing Burst (Slave Rx Only)—Short Frame WS
Figure 26. I2S Electrical Timing Burst (Slave Rx Only) — Short Frame WS Diagram
1
2
3
I2S_BCLK
4
I2S_WS
6
5
I2S_IN
Bit 15 (previous frame)
Bit 0
Table 39. Values of I2S Electrical Timing Burst (Slave Rx-Only)—Short Frame WS Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
I2S bit clock frequency
–
–
24
MHz
2
I2S bit clock low time
20.8
–
–
ns
2
3
I S bit clock high time
20.8
–
–
ns
4
I2S_WS setup time
8
–
–
ns
5
I2S_IN setup
8
–
–
ns
6
I2S_IN hold
8
–
–
ns
I2S Electrical Timing Slave—Long Frame WS
Figure 27. I2S Electrical Timing Slave — Long Frame WS Diagram
1
2
3
I2S_BCLK
4
I2S_WS
I2S_OUT
Bit 0
Bit 1
5
6
I2S_IN
Bit 0
Document No. 002-14859 Rev. *R
7
Bit 1
Page 50 of 67
CYW20733
Table 40. Values of I2S Electrical Timing Slave—Long Frame WS Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
I2S bit clock frequency
2
I2S bit clock low time
41
–
–
ns
3
I2S bit clock high time
41
–
–
ns
4
I2S_WS setup time
8
–
–
ns
5
I2S_OUT delay
0
–
25
ns
6
I2S_IN setup
8
–
–
ns
7
I2S_IN hold
8
–
–
ns
–
–
12
MHz
I2S Electrical Timing Master—Long Frame WS
Figure 28. I2S Electrical Timing Master — Long Frame WS Diagram
1
2
3
I2S_BCLK
4
I2S_WS
I2S_OUT
Bit 0
Bit 1
5
6
Bit 0
I2S_IN
7
Bit 1
Table 41. Values of I2S Electrical Timing Master—Long Frame WS Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
I2 S
–
–
12
MHz
2
I2S bit clock low time
41
–
–
ns
3
I2S bit clock high time
41
–
–
ns
4
I2S_WS delay
0
–
25
ns
5
I2S_OUT delay
0
–
25
ns
6
I2S_IN setup
8
–
–
ns
7
I2S_IN hold
8
–
–
ns
bit clock frequency
Document No. 002-14859 Rev. *R
Page 51 of 67
CYW20733
I2S Electrical Timing Burst (Slave Rx Only)—Long Frame WS
Figure 29. I2S Electrical Timing Burst (Slave Rx Only) — Long Frame WS Diagram
1
2
3
I2S_BCLK
4
I2S_WS
5
I2S_IN
Bit 0
6
Bit 1
Table 42. Values of I2S Electrical Timing Burst (Slave Rx Only)—Long Frame WS Characteristics
Reference
Characteristics
Minimum
Typical
Maximum
Unit
1
I2S bit clock frequency
–
–
24
MHz
2
I2S bit clock low time
20.8
–
–
ns
2
3
I S bit clock high time
20.8
–
–
ns
4
I2S_WS setup time
8
–
–
ns
5
I2S_IN setup
8
–
–
ns
6
I2S_IN hold
8
–
–
ns
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CYW20733
4. Mechanical Information
Figure 30. 81-Pin FBGA
Document No. 002-14859 Rev. *R
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CYW20733
Figure 31. 121-Pin FBGA
Document No. 002-14859 Rev. *R
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CYW20733
Figure 32. 56-Pin QFN
Document No. 002-14859 Rev. *R
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CYW20733
4.0.1 Tape Reel and Packaging Specifications
Table 43. CYW20733 8 × 8 × 1.0 mm FBGA 81-Pin Tape Reel Specifications
Quantity per reel
2500 pieces
Reel diameter
13 inches
Hub diameter
7 inches
Tape width
16 mm
Tape pitch
12 mm
Table 44. CYW20733 9 x 9 x 1.0 mm FBGA 121-Pin Tape Reel Specifications
Quantity per reel
1500 pieces
Reel diameter
13 inches
Hub diameter
4 inches
Tape width
16 mm
Tape pitch
12 mm
Table 45. CYW20733 7 x 7 x 1.0 mm QFN 56-Pin Tape Reel Specifications
Quantity per reel
2500 pieces
Reel diameter
13 inches
Hub diameter
7 inches
Tape width
16 mm
Tape pitch
12 mm
Document No. 002-14859 Rev. *R
Page 56 of 67
CYW20733
Figure 33. CYW20733 Reel/Labeling/Packaging Specification
Reel Specifications:
0RLVWXUH6HQVLWLYLW\6WLFNHU
(Per MSL
Labeling
Specification
– P-PDE-1051)
(6':DUQLQJ
&\SUHVV%DUFRGH/DEHO
(Per Standard Barcode Label
Specification – P-PDE-1101)
Device Orientation/Mix Lot Number:
(DFK5HHOPD\FRQWDLQXSWRWKUHHLQGLYLGXDOORWQXPEHUVZLWKLQZRUNZHHNV
7KHVHLQGLYLGXDOORWVPXVWEHODEHOHGRQWKHER[PRLVWXUHEDUULHUEDJDQGUHHO
3LQ7RS/HIW&RUQHU7RSRISDFNDJHWRZDUG6SURFNHW+ROHV
x
x
x
x
&
Document No. 002-14859 Rev. *R
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CYW20733
Figure 34. CYW20733 9 × 9 FBGA Package Tray (1 of 2)
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CYW20733
Figure 35. CYW20733 9 × 9 FBGA Package Tray (2 of 2)
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CYW20733
Figure 36. CYW20733 8 × 8 FBGA Package Tray (1 of 2)
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Page 60 of 67
CYW20733
Figure 37. CYW20733 8 × 8 FBGA Package Tray (2 of 2)
NOTES:
1. Tray shall conform to JEDEC CS-004 standard on thin matrix trays
for MQFP package.
2. Tray surfaces to be free of seams.
3. IQA specification SAC-X042 shall apply.
4. Material: MPPO, 150 degree C (max), Black,
Stock Num 215-4004-508, 12X29 Matrix
Document No. 002-14859 Rev. *R
Page 61 of 67
CYW20733
5. Ordering Information
Table 46. Ordering Information
Part Number
Package
Ambient Operating Temperature
CYW20733A3KFB1G
Commercial 81-pin FBGA
0°C to 70°C
CYW20733A3KFB2G
Commercial 121-pin FBGA
0°C to 70°C
CYW20733A3KML1G
Commercial 56-pin QFN
0°C to 70°C
6. IoT Resources
Cypress provides a wealth of data at http://www.cypress.com/internet-things-iot to help you to select the right IoT device for your
design, and quickly and effectively integrate the device into your design. Cypress provides customer access to a wide range of
information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software
updates. Customers can acquire technical documentation and software from the Cypress Support Community website (http://
community.cypress.com/).
A. Acronyms and Abbreviations
The following list of acronyms and abbreviations may appear in this document.
For a more complete list of acronyms and other terms used in Cypress documents, go to:
http://www.cypress.com/glossary
Acronym
Description
ADC
analog-to-digital converter
AFH
adaptive frequency hopping
AHB
advanced high-performance bus
APB
advanced peripheral bus
APU
audio processing unit
ARM7TDMI-S™
Acorn RISC Machine 7 Thumb instruction, Debugger, Multiplier, Ice, Synthesizable
BSC
Broadcom Serial Control
BTC
Bluetooth® controller
COEX
coexistence
DFU
device firmware update
DMA
direct memory access
EBI
external bus interface
HCI
Host Control Interface
HV
high voltage
IDC
initial digital calibration
IF
intermediate frequency
IRQ
interrupt request
JTAG
Joint Test Action Group
LCU
link control unit
LDO
low drop-out
LHL
lean high land
LPO
low power oscillator
LV
LogicVision™
MIA
multiple interface agent
PCM
pulse code modulation
PLL
phase locked loop
PMU
power management unit
Document No. 002-14859 Rev. *R
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CYW20733
Acronym
POR
Description
power-on reset
PWM
pulse width modulation
QD
quadrature decoder
RAM
random access memory
RF
radio frequency
ROM
read-only memory
RX/TX
receive, transmit
SPI
serial peripheral interface
SW
software
UART
universal asynchronous receiver/transmitter
UPI
µ-processor interface
USB
universal serial bus
WD
watchdog
Document No. 002-14859 Rev. *R
Page 63 of 67
CYW20733
Document History
Document Title: CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices
Document Number: 002-14859
Revision
ECN
Orig. of
Change
**
–
–
*A
*B
*C
*D
–
–
–
–
Document No. 002-14859 Rev. *R
–
–
–
–
Submission
Date
Description of Change
07/23/2010
20733-DS00-R
Initial release
07/20/2010
Updated:
Table 10: “Pin Descriptions,” on page 35 and Table 11: “GPIO Pin Descriptions,” on
page 38.
Figure 13: “81-Pin FBGA Ball Map,” on page 44.
Table 16: “Integrated Audio Amplifier Electrical Specifications,” on page 48.
Table 25: “PCM Electrical Timing Slave—Short Frame Sync Characteristics,” on
page 57.
Table 26: “Values of PCM Electrical Timing Master—Short Frame Sync Characteristics,” on page 58.
“PCM Interface Timing” on page 57.
“I2S Timing” on page 63.
08/30/2010
20733-DS02-R
Updated:
“Microprocessor Unit” on page 13: ROM memory capacity.
“Link Control Layer” on page 15: Bluetooth Link Controller tasks.
“UART Interface” on page 17: normal baud rate mode.
“GPIO Port” on page 23.
“Theory of Operation” on page 25: mouse decoder PWMs.
“ADC Port” on page 26: analog input channels.
Table 7: “CYW20733 First SPI Set (Master Mode),” on page 28.
Table 11: “Pin Descriptions,” on page 35 and Table 12: “GPIO Pin Descriptions,” on
page 37.
Figure 13: “81-Pin FBGA Ball Map,” on page 44.
Added:
“Peripheral UART Interface” on page 19.
10/25/2010
20733-DS03-R
Updated:
“General Description” and “Features” on page 1
TBD for second package changed to 121-pin, 9 mm x 9 mm FBGA, throughout the
document.
Table 11: “Pin Descriptions,” on page 39 (added 121-pin info)
Table 12: “GPIO Pin Descriptions,” on page 41 (added 121-pin info)
Figure 14: “121-Pin FBGA Ball Map,” on page 49 (added)
Figure 30: “81-Pin FBGA,” on page 73
Figure 31: “121-Pin FBGA,” on page 74 (121-pin outline drawing, added)
Table 38: “CYW20733 8 × 8 × 1.0 mm FBGA TBD Tape Reel Specifications,” on
page 75
Table 39: “CYW20733M 9 x 9 x 1.0 mm FBGA TBD Tape Reel Specifications,” on
page 75
Figure 33: “CYW20733 9×9 FBGA Package Tray (1 of 2),” on page 77
Figure 35: “CYW20733 8×8 FBGA Package Tray (1 of 2),” on page 79
Table 40: “Ordering Information,” on page 81
04/04/2011
20733-DS04-R
Updated:
Figure 1: “Functional Block Diagram,” on page 2
“UART Interface” on page 19
Table 1: “Common Baud Rate Examples,” on page 20
Table 5: “XTAL Oscillator Characteristics,” on page 25
“Port 0–Port 1, Port 8 – Port 18, Port 20 – Port 23, and Port 28 – Port 38” on page 26
Table 6: “Sampling Rate and Effective Number of Bits,” on page 29
Table 12: “GPIO Pin Descriptions,” on page 40
Table 16: “ADC Specifications,” on page 50
Table 19: “Current Consumption, Class 1,” on page 52
Table 20: “Current Consumption, Class 2 (0 dBm),” on page 53 (added)
Table 21: “Receiver RF Specifications” on page 54
Table 22: “Transmitter RF Specifications,” on page 55
Section 5: “Ordering Information,” on page 81
Page 64 of 67
CYW20733
Document Title: CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices
Document Number: 002-14859
*E
–
–
06/29/2011
20733-DS05-R
Updated:
Figure 1: “Functional Block Diagram,” on page 2
“GPIO Port” on page 25
“High Current I/O” on page 34
Table 10: “Pin Descriptions,” on page 36
Figure 13: “121-Pin FBGA Ball Map,” on page 46
Table 15: “ADC Specifications,” on page 48
Table 17: “Current Consumption, Class 1,” on page 49
Table 18: “Current Consumption, Class 2 (0 dBm),” on page 51
Added:
Table 19: “Current Consumption,” on page 52Removed:
“Integrated Filterless Class-D Audio Amplifier,” on page 35
Table 16: “Integrated Audio Amplifier Electrical Specifications,” on p. 49.
*F
–
–
03/01/2012
20733-DS06-R
Updated:
Table 7: “CYW20733 First SPI Set (Master Mode),” on page 32
Table 10: “Pin Descriptions,” on page 38
Table 11: “GPIO Pin Descriptions,” on page 41
Table 15: “ADC Specifications,” on page 52
Table 17: “Current Consumption, Class 1,” on page 53
Table 18: “Current Consumption, Class 2 (0 dBm),” on page 55
Notes in Table 20 on page 57 and Table 21 on page 59
Table 23: “Values of SPI1 Timing Characteristics,” on page 61
Table 39: “CYW20733 8 × 8 × 1.0 mm FBGA 81-Pin Tape Reel Specifications,” on
page 80
Table 40: “CYW20733 9 x 9 x 1.0 mm FBGA 121-Pin Tape Reel Specifications,” on
page 80
Added:
Information related to the 56-pin QFN package on page 1
“56-Pin QFN Diagram” on page 50
Table 24: “Values of SPI2 Timing Characteristics,” on page 62
Figure 32: “56-Pin QFN,” on page 79
Table 41: “CYW20733 7 x 7 x 1.0 mm QFN 56-Pin Tape Reel Specifications,” on
page 80
Figure 33: “CYW20733 Reel/Labeling/Packaging Specification,” on page 81
*G
–
–
03/19/2012
20733-DS07-R
Updated:
Notes in Table 23: “Values of SPI1 Timing Characteristics,” on page 65 and
Table 24: “Values of SPI2 Timing Characteristics,” on page 66
*H
–
–
05/18/2012
20733-DS08-R
Updated:
Table 8: “CYW20733 Second SPI Set (Master Mode),” on page 33.
Table 9: “CYW20733 Second SPI Set (Slave Mode),” on page 34.
*I
–
–
06/08/2012
20733-DS09-R
Updated:
Bluetooth HID profile version 1.0 to 1.1 on the cover page.
“Calibration” on page 15.
“Triac Control” on page 38.
“Cypress Proprietary Control Signalling and Triggered Broadcom Fast Connect” on
page 38.
Table 15: “ADC Specifications,” on page 56 by fixing the Conditions for the
Reference settling time and Input resistance parameters.
Table 20: “Receiver RF Specifications” on page 59 by updating Df to uf in the intermodulation performance row.
“SPI Timing” on page 63.
*J
–
–
08/30/2012
20733-DS10-R
Updated:
Table 43: “Ordering Information,” on page 89.
10/01/2012
20733-DS11-R
Updated:
Cover page features to include Class-D audio amplifier.
Figure 1: “Functional Block Diagram,” on page 2 by adding Class-D audio driver.
Table 11: “Pin Descriptions,” on page 43.
Figure 14: “56-Pin QFN Diagram,” on page 55.
Added:
“Integrated Filterless Class-D Audio Amplifier” on page 40.
Table 17: “Integrated Audio Amplifier Electrical Specifications,” on page 58
*K
–
Document No. 002-14859 Rev. *R
–
Page 65 of 67
CYW20733
Document Title: CYW20733 Single-Chip Bluetooth Transceiver Wireless Input Devices
Document Number: 002-14859
*L
–
–
11/26/2012
20733-DS12-R
Updated:
Table 17: “Integrated Audio Amplifier Electrical Specifications,” on page 58.
Table 21: “Current Consumption,” on page 61.
*M
–
–
01/21/2013
20733-DS13-R
Updated:
Table 12: “GPIO Pin Descriptions,” on page 46.
*N
–
–
05/31/2013
20733-DS14-R
Updated:
Table 45: “Ordering Information,” on page 91.
*O
–
–
08/12/2013
20733-DS15-R
Updated:
Table 21: “Current Consumption,” on page 62.
*P
–
–
09/25/2013
20733-DS16-R
Updated:
Table 4: “Reference Crystal Electrical Specifications,” on page 26.
*Q
–
–
07/10/2015
20733-DS17-R
Updated document status.
*R
5487130
UTSV
10/21/2016
Updated to Cypress Template
Added Cypress part numbering scheme
Document No. 002-14859 Rev. *R
Page 66 of 67
CYW20733
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Document No. 002-14859 Rev. *R
Revised October 21, 2016
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