BLF8G20LS-220 Power LDMOS transistor Rev. 2 — 30 May 2013 Product data sheet 1. Product profile 1.1 General description 220 W LDMOS power transistor for base station applications at frequencies from 1800 MHz to 2000 MHz. Table 1. Typical performance Typical RF performance at Tcase = 25 C in a common source class-AB production test circuit. Test signal f (MHz) (mA) (V) (W) 2-carrier W-CDMA 1805 to 1880 1600 28 55 [1] IDq VDS PL(AV) D ACPR (dB) (%) (dBc) 18.9 34 31 [1] Gp Test signal: 3GPP test model 1; 64 DPCH; PAR = 8.4 dB at 0.01 % probability on CCDF; carrier spacing 5 MHz. 1.2 Features and benefits Excellent ruggedness High efficiency Low Rth providing excellent thermal stability Designed for broadband operation Lower output capacitance for improved performance in Doherty applications Designed for low memory effects providing excellent pre-distortability Internally matched for ease of use Integrated ESD protection Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 1.3 Applications RF power amplifiers for W-CDMA base stations and multi carrier applications in the 1800 MHz to 2000 MHz frequency range BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description 1 drain 2 gate 3 source Simplified outline Graphic symbol 1 1 3 [1] 2 2 3 sym112 [1] Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BLF8G20LS-220 - SOT502B earless flanged ceramic package; 2 leads 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS drain-source voltage - 65 V VGS gate-source voltage 0.5 +13 V Tstg storage temperature 65 +150 C Min - 225 C [1] junction temperature Tj [1] Conditions Max Unit Continuous use at maximum temperature will affect the reliability. 5. Thermal characteristics Table 5. BLF8G20LS-220 Product data sheet Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-c) thermal resistance from junction to case Tcase = 80 C; PL = 55 W; VDS = 28 V; IDq = 1600 mA 0.27 K/W All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 2 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 6. Characteristics Table 6. DC characteristics Tj = 25 C, unless otherwise specified. Symbol Parameter Conditions V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 2.7 mA Min Typ Max Unit 65 - - V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 270 mA 1.5 1.9 2.3 V VGSq gate-source quiescent voltage VDS = 28 V; ID = 1.6 A 1.7 2.1 2.5 V IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 4.2 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V - 50.6 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 420 nA gfs forward transconductance VDS = 10 V; ID = 13.5 A - 19.6 - S RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 9.45 A - 0.057 - Table 7. RF characteristics Test signal: 2-carrier W-CDMA; PAR = 8.4 dB at 0.01 % probability on CCDF; 3GPP test model 1; 64 DPCH; f1 = 1807.5 MHz; f2 = 1812.5 MHz; f3 = 1872.5 MHz; f4 = 1877.5 MHz; RF performance at VDS = 28 V; IDq = 1600 mA; Tcase = 25 C; unless otherwise specified; in a production circuit. Symbol Parameter Conditions Min Typ Max Unit Gp power gain PL(AV) = 55 W 17.8 18.9 - dB D drain efficiency PL(AV) = 55 W 29 34 - % RLin input return loss PL(AV) = 55 W - 15.5 7 dB ACPR adjacent channel power ratio PL(AV) = 55 W - 31 dBc 26 7. Test information 7.1 Ruggedness in class-AB operation The BLF8G20LS-220 is capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V; IDq = 1600 mA; PL = 200 W (CW); f = 1805 MHz. 7.2 Impedance information Table 8. Typical impedance Measured load-pull data; IDq = 1600 mA; VDS = 28 V. f ZS[1] ZL[1] (MHz) () () 1805 1.38 j3.45 0.90 j2.50 1843 1.43 j3.63 0.82 j2.37 1880 1.38 j3.56 0.90 j2.60 [1] BLF8G20LS-220 Product data sheet ZS and ZL defined in Figure 1. All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 3 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor drain ZL gate ZS 001aaf059 Fig 1. Definition of transistor impedance 7.3 Test circuit PP PP & & & & & & & 5 & & PP %/)*/6B,13873&% & & %/)*/6B2873873&% & & & & & DDD See Table 9 for list of components. Fig 2. Component layout Table 9. List of components See Figure 2 for component layout. The used PCB material is Rogers RO4350B with a thickness of 0.76 mm. Component BLF8G20LS-220 Product data sheet Description Value Remarks C1, C2, C3, C4, C5, C6 multilayer ceramic chip capacitor 33 pF [1] C7, C8, C9, C10 multilayer ceramic chip capacitor 1 F [2] TDK C11, C12, C13, C14 multilayer ceramic chip capacitor 10 F [3] Murata C15, C16 multilayer ceramic chip capacitor 470 F, 63 V R1 chip resistor 9.1 [1] American Technical Ceramics type 100B or capacitor of same quality. [2] TDK or capacitor of same quality. [3] Murata or capacitor of same quality. All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 ATC100B SMD 0805 © NXP B.V. 2013. All rights reserved. 4 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 7.4 Graphical data 7.4.1 CW pulse DDD 5/LQ G% *S DDD Ș' *S G% Ș' 3/ : VDS = 28 V; IDq = 1600 mA; tp = 100 s; = 10 %. (1) f = 1805 MHz (2) f = 1843 MHz (2) f = 1843 MHz (3) f = 1880 MHz (3) f = 1880 MHz Power gain and drain efficiency as function of output power; typical values BLF8G20LS-220 Product data sheet 3/ : VDS = 28 V; IDq = 1600 mA; tp = 100 s; = 10 %. (1) f = 1805 MHz Fig 3. Fig 4. Input return loss as a function of output power; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 5 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 7.4.2 1-Carrier W-CDMA DDD *S G% Ș' *S DDD $&350 G%F Ș' 3/ : VDS = 28 V; IDq = 1600 mA. 3/ : VDS = 28 V; IDq = 1600 mA. (1) f = 1805 MHz (1) f = 1805 MHz (2) f = 1843 MHz (2) f = 1843 MHz (3) f = 1880 MHz (3) f = 1880 MHz Fig 5. Power gain and drain efficiency as function of output power; typical values Fig 6. Adjacent channel power ratio (5 MHz) as a function of output power; typical values DDD 5/LQ G% 3/ G%P VDS = 28 V; IDq = 1600 mA. (1) f = 1805 MHz (2) f = 1843 MHz (3) f = 1880 MHz Fig 7. Input return loss as a function of output power; typical values BLF8G20LS-220 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 6 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 7.4.3 2-Carrier W-CDMA DDD *S G% Ș' *S DDD $&350 G%F Ș' 3/ : VDS = 28 V; IDq = 1600 mA; f = 5 MHz; = 46 %. 3/ : VDS = 28 V; IDq = 1600 mA; f = 5 MHz; = 46 %. (1) f = 1810 MHz (1) f = 1810 MHz (2) f = 1843 MHz (2) f = 1843 MHz (3) f = 1877.5 MHz (3) f = 1877.5 MHz Fig 8. Power gain and drain efficiency as function of output power; typical values Fig 9. Adjacent channel power ratio (5 MHz) as a function of output power; typical values DDD 5/LQ G% 3/ G%P VDS = 28 V; IDq = 1600 mA; f = 5 MHz; = 46 %. (1) f = 1810 MHz (2) f = 1843 MHz (3) f = 1877.5 MHz Fig 10. Input return loss as a function of output power; typical values BLF8G20LS-220 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 7 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 8. Package outline Earless flanged ceramic package; 2 leads SOT502B D A F 3 D D1 c U1 1 L H E1 U2 E 2 w2 M D M b 0 5 Q 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 4.72 3.43 12.83 12.57 0.15 0.08 inches 0.186 0.135 0.505 0.006 0.495 0.003 OUTLINE VERSION E E1 F H L Q U1 U2 w2 20.02 19.96 19.61 19.66 9.50 9.30 9.53 9.25 1.14 0.89 19.94 18.92 5.33 4.32 1.70 1.45 20.70 20.45 9.91 9.65 0.25 0.788 0.786 0.772 0.774 0.374 0.375 0.366 0.364 0.045 0.785 0.035 0.745 0.210 0.170 0.067 0.815 0.057 0.805 D D1 REFERENCES IEC JEDEC JEITA 0.390 0.010 0.380 EUROPEAN PROJECTION ISSUE DATE 07-05-09 12-05-02 SOT502B Fig 11. Package outline SOT502B BLF8G20LS-220 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 8 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 9. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 10. Abbreviations Table 10. Abbreviations Acronym Description 3GPP 3rd Generation Partnership Project CCDF Complementary Cumulative Distribution Function CW Continuous Wave DPCH Dedicated Physical CHannel ESD ElectroStatic Discharge LDMOS Laterally Diffused Metal Oxide Semiconductor PAR Peak-to-Average Ratio SMD Surface Mounted Device VSWR Voltage Standing Wave Ratio W-CDMA Wideband Code Division Multiple Access 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes BLF8G20LS-220 v.2 20130530 Product data sheet - BLF8G20LS-220 v.1 Modifications: BLF8G20LS-220 v.1 BLF8G20LS-220 Product data sheet • • Table 1 on page 1: table has been updated Table 7 on page 3: table has been updated 20130307 Objective data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 - © NXP B.V. 2013. All rights reserved. 9 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 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BLF8G20LS-220 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 10 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BLF8G20LS-220 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 30 May 2013 © NXP B.V. 2013. All rights reserved. 11 of 12 BLF8G20LS-220 NXP Semiconductors Power LDMOS transistor 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.4.1 7.4.2 7.4.3 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ruggedness in class-AB operation . . . . . . . . . 3 Impedance information . . . . . . . . . . . . . . . . . . . 3 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 5 CW pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 6 2-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Handling information. . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 30 May 2013 Document identifier: BLF8G20LS-220