Dallas DS83C530-ENL Eprom/rom microcontrollers with real-time clock Datasheet

DS87C530/DS83C530
EPROM/ROM Microcontrollers with
Real-Time Clock
www.maxim-ic.com
FEATURES
PIN CONFIGURATIONS
80C52 Compatible
8051 Instruction-Set Compatible
Four 8-Bit I/O Ports
Three 16-Bit Timer/Counters
256 Bytes Scratchpad RAM
TOP VIEW
7
1
47
8
46
Large On-Chip Memory
16kB EPROM (OTP)
1kB Extra On-Chip SRAM for MOVX
ROMSIZE Features
Selects Effective On-Chip ROM Size from
0 to 16kB
Allows Access to Entire External Memory Map
Dynamically Adjustable by Software
Useful as Boot Block for External Flash
DALLAS
DS87C530
DS83C530
20
34
21
Nonvolatile Functions
On-Chip Real-Time Clock with Alarm Interrupt
Battery Backup Support of 1kB SRAM
33
PLCC, WINDOWED CLCC
High-Speed Architecture
4 Clocks/Machine Cycle (8051 = 12)
Runs DC to 33MHz Clock Rates
Single-Cycle Instruction in 121ns
Dual Data Pointer
Optional Variable Length MOVX to Access
Fast/Slow RAM /Peripherals
40
Power Management Mode
Programmable Clock Source Saves Power
Runs from (crystal/64) or (crystal/1024)
Provides Automatic Hardware and Software Exit
52
39
27
26
DALLAS
DS87C530
DS83C530
14
1
EMI Reduction Mode Disables ALE
13
TQFP
Two Full-Duplex Hardware Serial Ports
High Integration Controller Includes:
Power-Fail Reset
Early-Warning Power-Fail Interrupt
Programmable Watchdog Timer
The High-Speed Microcontroller User’s Guide must
be used in conjunction with this data sheet. Download it
at: www.maxim-ic.com/microcontrollers.
14 Total Interrupt Sources with Six External
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here: www.maxim-ic.com/errata.
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REV: 071107
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
ORDERING INFORMATION
TEMP RANGE
MAX CLOCK
SPEED
(MHz)
DS87C530-QCL
0°C to +70°C
33
52 PLCC
DS87C530-QCL+
0°C to +70°C
33
52 PLCC
DS87C530-QNL
-40°C to +85°C
33
52 PLCC
DS87C530-QNL+
-40°C to +85°C
33
52 PLCC
DS87C530-KCL*
0°C to +70°C
33
52 Windowed CLCC
DS87C530-ECL
0°C to +70°C
33
52 TQFP
DS87C530-ECL+
0°C to +70°C
33
52 TQFP
DS87C530-ENL
-40°C to +85°C
33
52 TQFP
DS87C530-ENL+
-40°C to +85°C
33
52 TQFP
DS83C530-QCL
0°C to +70°C
33
52 PLCC
DS83C530-QCL+
0°C to +70°C
33
52 PLCC
DS83C530-QNL
-40°C to +85°C
33
52 PLCC
DS83C530-QNL+
-40°C to +85°C
33
52 PLCC
DS83C530-ECL
0°C to +70°C
33
52 TQFP
DS83C530-ECL+
0°C to +70°C
33
52 TQFP
DS83C530-ENL
-40°C to +85°C
33
52 TQFP
DS83C530-ENL+
-40°C to +85°C
33
52 TQFP
PART
+ Denotes a Pb-free/RoHS-compliant device.
* The windowed ceramic LCC package is intrinsically Pb free.
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PIN-PACKAGE
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
DETAILED DESCRIPTION
The DS87C530/DS83C530 EPROM/ROM microcontrollers with a real-time clock (RTC) are 8051compatible microcontrollers based on the Dallas Semiconductor high-speed core. They use 4 clocks per
instruction cycle instead of the 12 used by the standard 8051. They also provide a unique mix of
peripherals not widely available on other processors. They include an on-chip RTC and battery backup
support for an on-chip 1k x 8 SRAM. The new Power Management Mode allows software to select
reduced power operation while still processing.
A combination of high-performance microcontroller core, RTC, battery-backed SRAM, and power
management makes the DS87C530/DS83C530 ideal for instruments and portable applications. They also
provide several peripherals found on other Dallas high-speed microcontrollers. These include two
independent serial ports, two data pointers, on-chip power monitor with brownout detection and a
watchdog timer.
Power Management Mode (PMM) allows software to select a slower CPU clock. While default operation
uses four clocks per machine cycle, the PMM runs the processor at 64 or 1024 clocks per cycle. There is a
corresponding drop in power consumption when the processor slows.
The EMI reduction feature allows software to select a reduced emission mode. This disables the ALE
signal when it is unneeded.
The DS83C530 is a factory mask ROM version of the DS87C530 designed for high-volume, costsensitive applications. It is identical in all respects to the DS87C530, except that the 16kB of EPROM is
replaced by a user-supplied application program. All references to features of the DS87C530 will apply to
the DS83C530, with the exception of EPROM-specific features where noted. Please contact your local
Dallas Semiconductor sales representative for ordering information.
Note: The DS87C530/DS83C530 are monolithic devices. A user must supply an external battery or super
cap and a 32.768kHz timekeeping crystal to have permanently powered timekeeping or nonvolatile RAM.
The DS87C530/DS83C530 provide all the support and switching circuitry needed to manage these
resources.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Figure 1. Block Diagram
DS87C530/
DS83C530
PIN DESCRIPTION
PIN
NAME
FUNCTION
PLCC
TQFP
52
45
VCC
+5V Processor Power Supply
1, 25
18, 46
GND
Processor Digital Circuit Ground
29
22
VCC2
+5V RTC Supply. VCC2 is isolated from VCC to isolate the RTC from digital noise.
26
19
GND2
12
5
RST
23
16
XTAL2
24
17
XTAL1
RTC Circuit Ground
Reset Input. This pin contains a Schmitt voltage input to recognize external active
high reset inputs. The pin also employs an internal pulldown resistor to allow for a
combination of wired OR external reset sources. An RC is not required for power-up,
as the device provides this function internally.
Crystal Oscillator Pins. XTAL1 and XTAL2 provide support for parallel-resonant,
AT-cut crystals. XTAL1 acts also as an input if there is an external clock source in
place of a crystal. XTAL2 is the output of the crystal amplifier.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
PIN DESCRIPTION (continued)
PIN
PLCC
TQFP
38
31
NAME
FUNCTION
PSEN
Program Store-Enable Output. This active-low signal is a chip enable for optional
external ROM memory. PSEN provides an active-low pulse and is driven high when
external ROM is not being accessed.
Address Latch-Enable Output. This pin latches the external address LSB from the
multiplexed address/data bus on Port 0. This signal is commonly connected to the
latch enable of an external 373 family transparent latch. ALE has a pulse width of
1.5 XTAL1 cycles and a period of four XTAL1 cycles. ALE is forced high when the
device is in a Reset condition. ALE can be disabled and forced high by writing
ALEOFF = 1 (PMR.2). ALE operates independently of ALEOFF during external
memory accesses.
39
32
ALE
50
43
P0.0 (AD0)
49
42
P0.1 (AD1)
48
41
P0.2 (AD2)
47
40
P0.3 (AD3)
46
39
P0.4 (AD4)
45
38
P0.5 (AD5)
44
37
P0.6 (AD6)
43
36
P0.7 (AD7)
3
48
P1.0
4
49
P1.1
5
50
P1.2
6
51
P1.3
7
52
P1.4
8
1
P1.5
9
2
P1.6
10
3
P1.7
Port 0 (AD0–AD7), I/O. Port 0 is an open-drain, 8-bit, bidirectional I/O port. As an
alternate function Port 0 can function as the multiplexed address/data bus to access
off-chip memory. During the time when ALE is high, the LSB of a memory address
is presented. When ALE falls to a logic 0, the port transitions to a bidirectional data
bus. This bus is used to read external ROM and read/ write external RAM memory
or peripherals. When used as a memory bus, the port provides active high drivers.
The reset condition of Port 0 is tri-state. Pullup resistors are required when using
Port 0 as an I/O port.
Port 1, I/O. Port 1 functions as both an 8-bit, bidirectional I/O port and an alternate
functional interface for Timer 2 I/O, new External Interrupts, and new Serial Port 1.
The reset condition of Port 1 is with all bits at a logic 1. In this state, a weak pullup
holds the port high. This condition also serves as an input mode, since any external
circuit that writes to the port will overcome the weak pullup. When software writes a
0 to any port pin, the device will activate a strong pulldown that remains on until
either a 1 is written or a reset occurs. Writing a 1 after the port has been at 0 will
cause a strong transition driver to turn on, followed by a weaker sustaining pullup.
Once the momentary strong driver turns off, the port again becomes the output high
(and input) state. The alternate modes of Port 1 are outlined as follows.
Port
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
Alternate
T2
T2EX
RXD1
TXD1
INT2
INT3
INT4
INT5
Function
External I/O for Timer/Counter 2
Timer/Counter 2 Capture/Reload Trigger
Serial Port 1 Input
Serial Port 1 Output
External Interrupt 2 (Positive Edge Detect)
External Interrupt 3 (Negative Edge Detect)
External Interrupt 4 (Positive Edge Detect)
External Interrupt 5 (Negative Edge Detect)
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
PIN DESCRIPTION (continued)
PIN
NAME
FUNCTION
23
P2.0 (AD8)
31
24
P2.1 (AD9)
32
25
P2.2 (AD10)
33
26
P2.3 (AD11)
34
27
P2.4 (AD12)
35
28
P2.5 (AD13)
36
29
P2.6 (AD14)
37
30
P2.7 (AD15)
Port 2 (A8–A15), I/O. Port 2 is a bidirectional I/O port. The reset condition of
Port 2 is logic high. In this state, a weak pullup holds the port high. This condition
also serves as an input mode, since any external circuit that writes to the port will
overcome the weak pullup. When software writes a 0 to any port pin, the device
will activate a strong pulldown that remains on until either a 1 is written or a reset
occurs. Writing a 1 after the port has been at 0 will cause a strong transition driver
to turn on, followed by a weaker sustaining pullup. Once the momentary strong
driver turns off, the port again becomes both the output high and input state. As an
alternate function Port 2 can function as MSB of the external address bus. This
bus can be used to read external ROM and read/write external RAM memory or
peripherals.
15
8
P3.0
16
9
P3.1
17
10
P3.2
18
11
P3.3
19
12
P3.4
20
13
P3.5
21
14
P3.6
22
15
P3.7
42
35
EA
External Access Input, Active Low. Connect to ground to use an external ROM.
Internal RAM is still accessible as determined by register settings. Connect to VCC
to use internal ROM.
51
44
VBAT
VBAT Input. Connect to the power source that maintains SRAM and RTC when
VCC < VBAT. Can be connected to a 3V lithium battery or a super cap. Connect to
GND if battery will not be used with device.
27
20
RTCX2
28
21
RTCX1
2, 11, 13,
14, 40,
41
4, 6, 7,
33, 34,
47
N.C.
PLCC
TQFP
30
Port 3, I/O. Port 3 functions as both an 8-bit, bi-directional I/O port and an
alternate functional interface for external interrupts, Serial Port 0, Timer 0 and 1
Inputs, and RD and WR strobes. The reset condition of Port 3 is with all bits at a
logic 1. In this state, a weak pullup holds the port high. This condition also serves
as an input mode, since any external circuit that writes to the port will overcome
the weak pullup. When software writes a 0 to any port pin, the device will activate
a strong pulldown that remains on until either a 1 is written or a reset occurs.
Writing a 1 after the port has been at 0 will cause a strong transition driver to turn
on, followed by a weaker sustaining pullup. Once the momentary strong driver
turns off, the port again becomes both the output high and input state. The
alternate modes of Port 3 are outlined below.
Port
Alternate
Function
P3.0
RXD0
Serial Port 0 Input
P3.1
TXD0
Serial Port 0 Output
P3.2
INT0
External Interrupt 0
P3.3
INT1
External Interrupt 1
P3.4
T0
Timer 0 External Input
P3.5
T1
Timer 1 External Input
P3.6
WR
External Data Memory Write Strobe
P3.7
RD
External Data Memory Read Strobe
Timekeeping Crystals. A 32.768kHz crystal between these pins supplies the time
base for the RTC. The devices support both 6pF and 12.5pF load capacitance
crystals as selected by an SFR bit (described later). To prevent noise from
affecting the RTC, the RTCX2 and RTCX1 pins should be guard-ringed with
GND2.
Not Connected. These pins should not be connected. They are reserved for use
with future devices in the family.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
COMPATIBILITY
The DS87C530/DS83C530 are fully static, CMOS 8051-compatible microcontrollers designed for high
performance. While remaining familiar to 8051 users, the devices have many new features. In general,
software written for existing 8051-based systems works without modification on the
DS87C530/DS83C530. The exception is critical timing since the high-speed microcontrollers perform its
instructions much faster than the original for any given crystal selection. The DS87C530/DS83C530 run
the standard 8051 instruction set. They are not pin compatible with other 8051s due to the timekeeping
crystal.
The DS87C530/DS83C530 provide three 16-bit timer/counters, full-duplex serial port (2), 256 bytes of
direct RAM plus 1kB of extra MOVX RAM. I/O ports have the same operation as a standard 8051
product. Timers will default to a 12 clock-per-cycle operation to keep their timing compatible with
original 8051 systems. However, timers are individually programmable to run at the new 4 clocks per
cycle if desired. The PCA is not supported.
The DS87C530/DS83C530 provide several new hardware features implemented by new Special Function
Registers. A summary of these SFRs is provided below.
PERFORMANCE OVERVIEW
The DS87C530/DS83C530 feature a high-speed, 8051-compatible core. Higher speed comes not just
from increasing the clock frequency, but also from a newer, more efficient design.
This updated core does not have the dummy memory cycles that are present in a standard 8051. A
conventional 8051 generates machine cycles using the clock frequency divided by 12. In the
DS87C530/DS83C530, the same machine cycle takes 4 clocks. Thus the fastest instruction, one machine
cycle, executes three times faster for the same crystal frequency. Note that these are identical instructions.
The majority of instructions on the DS87C530/DS83C530 will see the full 3-to-1 speed improvement.
Some instructions will get between 1.5 and 2.4 to 1 improvement. All instructions are faster than the
original 8051.
The numerical average of all opcodes gives approximately a 2.5 to 1 speed improvement. Improvement of
individual programs will depend on the actual instructions used. Speed-sensitive applications would make
the most use of instructions that are three times faster. However, the sheer number of 3 to 1 improved
opcodes makes dramatic speed improvements likely for any code. These architecture improvements
produce a peak instruction cycle in 121ns (8.25 MIPs). The Dual Data Pointer feature also allows the user
to eliminate wasted instructions when moving blocks of memory.
INSTRUCTION SET SUMMARY
All instructions perform the same functions as their 8051 counterparts. Their effect on bits, flags, and
other status functions is identical. However, the timing of each instruction is different. This applies both
in absolute and relative number of clocks.
For absolute timing of real-time events, the timing of software loops can be calculated using a table in the
High-Speed Microcontroller User’s Guide. However, counter/timers default to run at the older 12 clocks
per increment. In this way, timer-based events occur at the standard intervals with software executing at
higher speed. Timers optionally can run at 4 clocks per increment to take advantage of faster processor
operation.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
The relative time of two instructions might be different in the new architecture than it was previously. For
example, in the original architecture, the “MOVX A, @DPTR” instruction and the “MOV direct, direct”
instruction used two machine cycles or 24 oscillator cycles. Therefore, they required the same amount of
time. In the DS87C530/DS83C530, the MOVX instruction takes as little as two machine cycles or eight
oscillator cycles but the “MOV direct, direct” uses three machine cycles or 12 oscillator cycles. While
both are faster than their original counterparts, they now have different execution times. This is because
the DS87C530/DS83C530 usually use one instruction cycle for each instruction byte. The user concerned
with precise program timing should examine the timing of each instruction for familiarity with the
changes. Note that a machine cycle now requires just 4 clocks, and provides one ALE pulse per cycle.
Many instructions require only one cycle, but some require five. In the original architecture, all were one
or two cycles except for MUL and DIV. Refer to the High-Speed Microcontroller User’s Guide for
details and individual instruction timing.
SPECIAL FUNCTION REGISTERS
Special Function Registers (SFRs) control most special features of the DS87C530/DS83C530. This
allows the device to incorporate new features but remain instruction-set compatible with the 8051.
EQUATE statements can be used to define the new SFR to an assembler or compiler. All SFRs contained
in the standard 80C52 are duplicated in this device. Table 1 shows the register addresses and bit locations.
The High-Speed Microcontroller User’s Guide describes all SFRs.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Table 1. Special Function Register Locations
* Functions not present in the 80C52 are in bold.
REGISTER
P0
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
ADDRESS
P0.7
P0.6
P0.5
P0.4
P0.3
P0.2
P0.1
P0.0
80h
SP
81h
DPL
82h
DPH
83h
DPL1
84h
DPH1
85h
0
0
0
0
0
0
0
SEL
86h
PCON
SMOD_0
SMOD0
—
—
GF1
GF0
STOP
IDLE
87h
TCON
TF1
TR1
TF0
TR0
IE1
IT1
IE0
IT0
88h
TMOD
GATE
C/ T
M1
M0
GATE
C/ T
M1
M0
89h
DPS
TL0
8Ah
TL1
8Bh
TH0
8Ch
TH1
8Dh
CKCON
WD1
WD0
T2M
T1M
T0M
MD2
MD1
MD0
8Eh
P1
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
90h
EXIF
IE5
IE4
IE3
IE2
XT/RG
RGMD
RGSL
BGS
91h
TRIM
E4K
X12/ 6
TRM2
TRM2
TRM1
TRM1
TRM0
TRM0
96h
SCON0
SM0/FE_0
SM1_0
SM2_0
REN_0
TB8_0
RB8_0
TI_0
RI_0
98h
SBUF0
99h
P2
P2.7
P2.6
P2.5
P2.4
P2.3
P2.2
P2.1
P2.0
A0h
IE
EA
ES1
ET2
ES0
ET1
EX1
ET0
EX0
A8h
SADDR0
A9h
SADDR1
AAh
P3
P3.7
P3.6
P3.5
P3.4
P3.3
P3.2
P3.1
P3.0
B0h
IP
—
PS1
PT2
PS0
PT1
PX1
PT0
PX0
B8h
SADEN0
B9h
SADEN1
SCON1
BAh
SM0/FE_1
SM1_1
SM2_1
REN_1
TB8_1
RB8_1
TI_1
RI_1
C0h
C1h
SBUF1
—
—
—
—
—
RMS2
RMS1
RMS0
C2h
PMR
CD1
CD0
SWB
—
XTOFF
ALEOFF
DME1
DME0
C4h
STATUS
PIP
HIP
LIP
XTUP
SPTA1
SPRA1
SPTA0
SPRA0
C5h
ROMSIZE
TA
C7h
T2CON
TF2
EXF2
RCLK
TCLK
EXEN2
TR2
C/ T2
CP/ RL2
C8h
T2MOD
—
—
—
—
—
—
T2OE
DCEN
C9h
RCAP2L
CAh
RCAP2H
CBh
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Table 1. Special Function Register Locations (continued)
* Functions not present in the 80C52 are in bold.
REGISTER
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
ADDRESS
TL2
CCh
TH2
CDh
PSW
WDCON
CY
AC
F0
RS1
RS0
OV
FL
P
D0h
SMOD_1
POR
EPFI
PFI
WDIF
WTRF
EWT
RWT
D8h
ACC
EIE
E0h
—
—
ERTCI
EWDI
EX5
EX4
EX3
EX2
E8h
B
F0h
RTASS
F2h
RTAS
0
0
F3h
RTAM
0
0
F4h
RTAH
0
0
0
EIP
—
—
PRTCI
PWDI
PX5
PX4
PX3
PX2
F8h
SSCE
SCE
MCE
HCE
RTCRE
RTCWE
RTCIF
RTCE
F9h
RTCC
F5h
FAh
RTCSS
RTCS
0
0
FBh
RTCM
0
0
FCh
RTCH
FDh
RTCD0
FEh
RTCD1
FFh
NONVOLATILE FUNCTIONS
The DS87C530/DS83C530 provide two functions that are permanently powered if a user supplies an
external energy source. These are an on-chip RTC and a nonvolatile SRAM. The chip contains all related
functions and controls. The user must supply a backup source and a 32.768kHz timekeeping crystal.
REAL-TIME CLOCK
The on-chip RTC keeps time of day and calendar functions. Its time base is a 32.768kHz crystal between
pins RTCX1 and RTCX2. The RTC maintains time to 1/256 of a second. It also allows a user to read (and
write) seconds, minutes, hours, day of the week, and date. Figure 2 shows the clock organization.
Timekeeping registers allow easy access to commonly needed time values. For example, software can
simply check the elapsed number of minutes by reading one register. Alternately, it can read the complete
time of day, including subseconds, in only four registers. The calendar stores its data in binary form.
While this requires software translation, it allows complete flexibility as to the exact value. A user can
start the calendar with a variety of selections since it is simply a 16-bit binary number of days. This
number allows a total range of 179 years beginning from 0000.
The RTC features a programmable alarm condition. A user selects the alarm time. When the RTC reaches
the selected value, it sets a flag. This will cause an interrupt if enabled, even in Stop mode. The alarm
consists of a comparator that matches the user value against the RTC actual value. A user can select a
match for 1 or more of the sub-seconds, seconds, minutes, or hours. This allows an interrupt
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
automatically to occur once per second, once per minute, once per hour, or once per day. Enabling
interrupts with no match will generate an interrupt 256 times per second.
Software enables the timekeeper oscillator using the RTC enable bit in the RTC Control register (F9h).
This starts the clock. It can disable the oscillator to preserve the life of the backup energy-source if
unneeded. Values in the RTC Control register are maintained by the backup source through power failure.
Once enabled, the RTC maintains time for the life of the backup source even when VCC is removed.
The RTC will maintain an accuracy of ±2 minutes per month at 25°C. Under no circumstances are
negative voltages, of any amplitude, allowed on any pin while the device is in data retention mode
(VCC < VBAT). Negative voltages will shorten battery life, possibly corrupting the contents of internal
SRAM and the RTC.
Figure 2. Real-Time Clock
NONVOLATILE RAM
The 1k x 8 on-chip SRAM can be nonvolatile if an external backup energy source is used. This allows the
device to log data or to store configuration settings. Internal switching circuits will detect the loss of VCC
and switch SRAM power to the backup source on the VBAT pin. The 256 bytes of direct RAM are not
affected by this circuit and are volatile.
CRYSTAL AND BACKUP SOURCES
To use the unique functions of the DS87C530/DS83C530, a 32.768kHz timekeeping crystal and a backup
energy source are needed. The following describes guidelines for choosing these devices.
Timekeeping Crystal
The DS87C530/DS83C530 can use a standard 32.768kHz crystal as the RTC time base. There are two
versions of standard crystals available, with 6pF and 12.5pF load capacitance. The tradeoff is that the 6pF
uses less power, giving longer life while VCC is off, but is more sensitive to noise and board layout. The
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
12.5pF crystal uses more power, giving a shorter battery backed life, but produces a more robust
oscillator. Bit 6 in the RTC Trim register (TRIM; 96h) must be programmed to specify the crystal type
for the oscillator. When TRIM.6 = 1, the circuit expects a 12.5pF crystal. When TRIM.6 = 0, it expects a
6pF crystal. This bit will be nonvolatile so these choices will remain while the backup source is present.
A guard ring (connected to the RTC ground) should encircle the RTCX1 and RTCX2 pins.
Backup Energy Source
The DS87C530/DS83C530 use an external energy source to maintain timekeeping and SRAM data
without VCC. This source can be either a battery or 0.47F super cap and should be connected to the VBAT
pin. The nominal battery voltage is 3V. The VBAT pin will not source current. Therefore, a super cap
requires an external resistor and diode to supply charge.
The backup lifetime is a function of the battery capacity and the data retention current drain. This drain is
specified in the electrical specifications. The circuit loads the VBAT only when VCC has fallen below VBAT.
Thus the actual lifetime depends not only on the current and battery capacity, but also on the portion of
time without power. A very small lithium cell provides a lifetime of more than 10 years.
Figure 3. Internal Backup Circuit
IMPORTANT APPLICATION NOTE
The pins on the DS87C530/DS83C530 are generally as resilient as other CMOS circuits. They have no
unusual susceptibility to electrostatic discharge (ESD) or other electrical transients. However, no pin on
the DS87C530/DS83C530 should ever be taken to a voltage below ground. Negative voltages on any
pin can turn on internal parasitic diodes that draw current directly from the battery. If a device pin is
connected to the “outside world” where it may be handled or come in contact with electrical noise,
protection should be added to prevent the device pin from going below -0.3V. Some power supplies can
give a small undershoot on power-up, which should be prevented. Application Note 93: Design
Guidelines for Microcontrollers Incorporating NV RAM discusses how to protect the
DS87C530/DS83C530 against these conditions.
MEMORY RESOURCES
Like the 8051, the DS87C530/DS83C530 use three memory areas. The total memory configuration of the
device is 16kB of ROM, 1kB of data SRAM and 256 bytes of scratchpad or direct RAM. The 1kB of data
12 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
space SRAM is read/write accessible and is memory mapped. This on-chip SRAM is reached by the
MOVX instruction. It is not used for executable memory. The scratchpad area is 256 bytes of register
mapped RAM and is identical to the RAM found on the 80C52. There is no conflict or overlap among the
256 bytes and the 1kB as they use different addressing modes and separate instructions.
OPERATIONAL CONSIDERATION
The erasure window of the windowed LCC should be covered without regard to the
programmed/unprogrammed state of the EPROM. Otherwise, the device may not meet the AC and DC
parameters listed in the data sheet.
PROGRAM MEMORY ACCESS
On-chip ROM begins at address 0000h and is contiguous through 3FFFh (16kB). Exceeding the
maximum address of on-chip ROM will cause the DS87C530/DS83C530 to access off-chip memory.
However, the maximum on-chip decoded address is selectable by software using the ROMSIZE feature.
Software can cause the microcontroller to behave like a device with less on-chip memory. This is
beneficial when overlapping external memory, such as Flash, is used.
The maximum memory size is dynamically variable. Thus a portion of memory can be removed from the
memory map to access off-chip memory, then restored to access on-chip memory. In fact, all the on-chip
memory can be removed from the memory map allowing the full 64kB memory space to be addressed
from off-chip memory. ROM addresses that are larger than the selected maximum are automatically
fetched from outside the part via Ports 0 and 2. Figure 4 shows a depiction of the ROM memory map.
The ROMSIZE register is used to select the maximum on-chip decoded address for ROM. Bits RMS2,
RMS1, RMS0 have the following effect:
RMS2
RMS1
RMS0
MAXIMUM ON-CHIP ROM ADDRESS
0
0
0
0kB
0
0
1
1kB
0
1
0
2kB
0
1
1
4kB
1
0
0
8kB
1
0
1
16kB (default)
1
1
0
Invalid—reserved
1
1
1
Invalid—reserved
The reset default condition is a maximum on-chip ROM address of 16kB. Thus no action is required if
this feature is not used. When accessing external program memory, the first 16kB would be inaccessible.
To select a smaller effective ROM size, software must alter bits RMS2–RMS0. Altering these bits
requires a timed-access procedure.
Care should be taken so that changing the ROMSIZE register does not corrupt program execution. For
example, assume that a device is executing instructions from internal program memory near the 12kB
boundary (~3000h) and that the ROMSIZE register is currently configured for a 16kB internal program
space. If software reconfigures the ROMSIZE register to 4kB (0000h–0FFFh) in the current state, the
13 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
device will immediately jump to external program execution because program code from 4kB to 16kB
(1000h–3FFFh) is no longer located on-chip. This could result in code misalignment and execution of an
invalid instruction. The recommended method is to modify the ROMSIZE register from a location in
memory that will be internal (or external) both before and after the operation. In the above example, the
instruction which modifies the ROMSIZE register should be located below the 4kB (1000h) boundary, so
that it will be unaffected by the memory modification. The same precaution should be applied if the
internal program memory size is modified while executing from external program memory.
Off-chip memory is accessed using the multiplexed address/data bus on P0 and the MSB address on P2.
While serving as a memory bus, these pins are not I/O ports. This convention follows the standard 8051
method of expanding on-chip memory. Off-chip ROM access also occurs if the EA pin is a logic 0. EA
overrides all bit settings. The PSEN signal will go active (low) to serve as a chip enable or output enable
when Ports 0 and 2 fetch from external ROM.
Figure 4. ROM Memory Map
DATA MEMORY ACCESS
Unlike many 8051 derivatives, the DS87C530/DS83C530 contain on-chip data memory. The devices also
contain the standard 256 bytes of RAM accessed by direct instructions. These areas are separate. The
MOVX instruction accesses the on-chip data memory. Although physically on-chip, software treats this
area as though it was located off-chip. The 1kB of SRAM is between address 0000h and 03FFh.
Access to the on-chip data RAM is optional under software control. When enabled by software, the data
SRAM is between 0000h and 03FFh. Any MOVX instruction that uses this area will go to the on-chip
RAM while enabled. MOVX addresses greater than 03FFh automatically go to external memory through
Ports 0 and 2.
When disabled, the 1kB memory area is transparent to the system memory map. Any MOVX directed to
the space between 0000h and FFFFh goes to the expanded bus on Ports 0 and 2. This also is the default
condition. This default allows the DS87C530/DS83C530 to drop into an existing system that uses these
addresses for other hardware and still have full compatibility.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
The on-chip data area is software selectable using 2 bits in the Power Management Register at location
C4h. This selection is dynamically programmable. Thus access to the on-chip area becomes transparent to
reach off-chip devices at the same addresses. The control bits are DME1 (PMR.1) and DME0 (PMR.0).
They have the following operation:
Table 2. Data Memory Access Control
DME1
DME0
DATA MEMORY ADDRESS
0
0
0000h–FFFFh
External Data Memory (default condition)
0
1
0000h–03FFh
Internal SRAM Data Memory
0400h–FFFFh
External Data Memory
1
0
1
1
Reserved
MEMORY FUNCTION
Reserved
0000h–03FFh
Internal SRAM Data Memory
0400h–FFFBh
Reserved—no external access
FFFCh
Read access to the status of lock bits
FFFDh–FFFh
Reserved—no external access
Notes on the status byte read at FFFCh with DME1, 0 = 1, 1: Bits 2-0 reflect the programmed status of
the security lock bits LB2–LB0. They are individually set to a logic 1 to correspond to a security lock bit
that has been programmed. These status bits allow software to verify that the part has been locked before
running if desired. The bits are read-only.
Note: After internal MOVX SRAM has been initialized, changing bits DEM0/1 has no effect on the
contents of the SRAM.
STRETCH MEMORY CYCLE
The DS87C530/DS83C530 allow software to adjust the speed of off-chip data memory access. The
microcontrollers can perform the MOVX in as few as two instruction cycles. The on-chip SRAM uses
this speed and any MOVX instruction directed internally uses two cycles. However, the time can be
stretched for interface to external devices. This allows access to both fast memory and slow memory or
peripherals with no glue logic. Even in high-speed systems, it may not be necessary or desirable to
perform off-chip data memory access at full speed. In addition, there are a variety of memory-mapped
peripherals such as LCDs or UARTs that are slow.
The Stretch MOVX is controlled by the Clock Control Register at SFR location 8Eh as described below.
It allows the user to select a Stretch value between 0 and 7. A Stretch of 0 will result in a two-machine
cycle MOVX. A Stretch of 7 will result in a MOVX of nine machine cycles. Software can dynamically
change this value depending on the particular memory or peripheral.
On reset, the Stretch value will default to a 1, resulting in a three-cycle MOVX for any external access.
Therefore, off-chip RAM access is not at full speed. This is a convenience to existing designs that may
not have fast RAM in place. Internal SRAM access is always at full speed regardless of the Stretch
setting. When desiring maximum speed, software should select a Stretch value of 0. When using very
slow RAM or peripherals, select a larger Stretch value. Note that this affects data memory only and the
only way to slow program memory (ROM) access is to use a slower crystal.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Using a Stretch value between 1 and 7 causes the microcontroller to stretch the read/write strobe and all
related timing. Also, setup and hold times are increased by 1 clock when using any Stretch greater than 0.
This results in a wider read/write strobe and relaxed interface timing, allowing more time for
memory/peripherals to respond. The timing of the variable speed MOVX is in the Electrical
Specifications section. Table 3 shows the resulting strobe widths for each Stretch value. The memory
Stretch uses the Clock Control Special Function Register at SFR location 8Eh. The Stretch value is
selected using bits CKCON.2–0. In the table, these bits are referred to as M2 through M0. The first
Stretch (default) allows the use of common 120ns RAMs without dramatically lengthening the memory
access.
Table 3. Data Memory Cycle Stretch Values
CKCON.2–0
MEMORY CYCLES
RD OR WR STROBE
WIDTH IN CLOCKS
STROBE WIDTH TIME
AT 33MHz
(ns)
M2
M1
M0
0
0
0
2 (forced internal)
2
60
0
0
1
3 (default external)
4
121
0
1
0
4
8
242
0
1
1
5
12
364
1
0
0
6
16
485
1
0
1
7
20
606
1
1
0
8
24
727
1
1
1
9
28
848
DUAL DATA POINTER
The timing of block moves of data memory is faster using the Dual Data Pointer (DPTR). The standard
8051 DPTR is a 16-bit value that is used to address off-chip data RAM or peripherals. In the
DS87C530/DS83C530, the standard data pointer is called DPTR, located at SFR addresses 82h and 83h.
These are the standard locations. Using DPTR requires no modification of standard code. The new DPTR
at SFR 84h and 85h is called DPTR1. The DPTR Select bit (DPS) chooses the active pointer. Its location
is the lsb of the SFR location 86h. No other bits in register 86h have any effect and are 0. The user
switches between data pointers by toggling the lsb of register 86h. The increment (INC) instruction is the
fastest way to accomplish this. All DPTR-related instructions use the currently selected DPTR for any
activity. Therefore it takes only one instruction to switch from a source to a destination address. Using the
Dual Data Pointer saves code from needing to save source and destination addresses when doing a block
move. The software simply switches between DPTR and 1 once software loads them. The relevant
register locations are as follows.
DPL
DPH
DPL1
DPH1
DPS
82h
83h
84h
85h
86h
Low byte original DPTR
High byte original DPTR
Low byte new DPTR
High byte new DPTR
DPTR Select (lsb)
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
POWER MANAGEMENT
Along with the standard Idle and power-down (Stop) modes of the standard 80C52, the
DS87C530/DS83C530 provide a new Power Management Mode. This mode allows the processor to
continue functioning, yet to save power compared with full operation. The DS87C530/DS83C530 also
feature several enhancements to Stop mode that make it more useful.
POWER MANAGEMENT MODE (PMM)
Power Management Mode offers a complete scheme of reduced internal clock speeds that allow the CPU
to run software but to use substantially less power. During default operation, the DS87C530/DS83C530
use four clocks per machine cycle. Thus the instruction cycle rate is (Clock/4). At 33MHz crystal speed,
the instruction cycle speed is 8.25MHz (33/4). In PMM, the microcontroller continues to operate but uses
an internally divided version of the clock source. This creates a lower power state without external
components. It offers a choice of two reduced instruction cycle speeds (and two clock sources - discussed
below). The speeds are (Clock/64) and (Clock/1024).
Software is the only mechanism to invoke the PMM. Table 4 illustrates the instruction cycle rate in PMM
for several common crystal frequencies. Since power consumption is a direct function of operating speed,
PMM 1 eliminates most of the power consumption while still allowing a reasonable speed of processing.
PMM 2 runs very slowly and provides the lowest power consumption without stopping the CPU. This is
illustrated in Table 5.
Note that PMM provides a lower power condition than Idle mode. This is because in Idle, all clocked
functions such as timers run at a rate of crystal divided by 4. Since wake-up from PMM is as fast as or
faster than from Idle and PMM allows the CPU to operate (even if doing NOPs), there is little reason to
use Idle mode in new designs.
Table 4. Machine Cycle Rate
CRYSTAL SPEED
(MHz)
FULL OPERATION
(4 CLOCKS)
(MHz)
PMM1
(64 CLOCKS)
(kHz)
PMM2
(1024 CLOCKS)
(kHz)
11.0592
2.765
172.8
10.8
16
4.00
250.0
15.6
25
6.25
390.6
24.4
33
8.25
515.6
32.2
Table 5. Typical Operating Current in PMM
CRYSTAL SPEED
(MHz)
FULL OPERATION
(4 CLOCKS)
(mA)
PMM1
(64 CLOCKS)
(mA)
PMM2
(1024 CLOCKS)
(mA)
11.0592
13.1
5.3
4.8
16
17.2
6.4
5.6
25
25.7
8.1
7.0
33
32.8
9.8
8.2
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
CRYSTAL-LESS PMM
A major component of power consumption in PMM is the crystal amplifier circuit. The
DS87C530/DS83C530 allow the user to switch CPU operation to an internal ring oscillator and turn off
the crystal amplifier. The CPU would then have a clock source of approximately 2MHz to 4MHz, divided
by either 4, 64, or 1024. The ring is not accurate, so software cannot perform precision timing. However,
this mode allows an additional saving of between 0.5mA and 6.0mA, depending on the actual crystal
frequency. While this saving is of little use when running at 4 clocks per instruction cycle, it makes a
major contribution when running in PMM1 or PMM2.
PMM OPERATION
Software invokes the PMM by setting the appropriate bits in the SFR area. The basic choices are divider
speed and clock source. There are three speeds (4, 64, and 1024) and two clock sources (crystal, ring).
Both the decisions and the controls are separate. Software will typically select the clock speed first. Then,
it will perform the switch to ring operation if desired. Lastly, software can disable the crystal amplifier if
desired.
There are two ways of exiting PMM. Software can remove the condition by reversing the procedure that
invoked PMM or hardware can (optionally) remove it. To resume operation at a divide-by-4 rate under
software control, simply select 4 clocks per cycle, and then crystal-based operation if relevant. When
disabling the crystal as the time base in favor of the ring oscillator, there are timing restrictions associated
with restarting the crystal operation. Details are described below.
There are three registers containing bits that are concerned with PMM functions. They are Power
Management Register (PMR; C4h), Status (STATUS; C5h), and External Interrupt Flag (EXIF; 91h)
Clock Divider
Software can select the instruction cycle rate by selecting bits CD1 (PMR.7) and CD0 (PMR.6) as
follows:
CD1
CD0
CYCLE RATE
0
0
Reserved
0
1
4 clocks (default)
1
0
64 clocks
1
1
1024 clocks
The selection of instruction cycle rate will take effect after a delay of one instruction cycle. Note that the
clock divider choice applies to all functions including timers. Since baud rates are altered, it will be
difficult to conduct serial communication while in PMM. There are minor restrictions on accessing the
clock selection bits. The processor must be running in a 4-clock state to select either 64 (PMM1) or 1024
(PMM2) clocks. This means software cannot go directly from PMM1 to PMM2 or visa versa. It must
return to a 4-clock rate first.
18 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Switchback
To return to a 4-clock rate from PMM, software can simply select the CD1 and CD0 clock control bits to
the 4 clocks per cycle state. However, the DS87C530/DS83C530 provide several hardware alternatives
for automatic Switchback. If Switchback is enabled, then the device will automatically return to a 4-clock
per cycle speed when an interrupt occurs from an enabled, valid external interrupt source. A Switchback
will also occur when a UART detects the beginning of a serial start bit if the serial receiver is enabled
(REN = 1). Note the beginning of a start bit does not generate an interrupt; this occurs on reception of a
complete serial word. The automatic Switchback on detection of a start bit allows hardware to correct
baud rates in time for a proper serial reception. A Switchback will also occur when a byte is written to the
SBUF0 or SBUF1 for transmission.
Switchback is enabled by setting the SWB bit (PMR.5) to a 1 in software. For an external interrupt,
Switchback will occur only if the interrupt source could really generate the interrupt. For example, if
INT0 is enabled but has a low priority setting, then Switchback will not occur on INT0 if the CPU is
servicing a high priority interrupt.
Status
Information in the Status register assists decisions about switching into PMM. This register contains
information about the level of active interrupts and the activity on the serial ports.
The DS87C530/DS83C530 support three levels of interrupt priority. These levels are Power-fail, High,
and Low. Bits STATUS.7–5 indicate the service status of each level. If PIP (Power-fail Interrupt Priority;
STATUS. 7) is 1, then the processor is servicing this level. If either HIP (High Interrupt Priority;
STATUS.6) or LIP (Low Interrupt Priority; STATUS.5) is high, then the corresponding level is in
service.
Software should not rely on a lower priority level interrupt source to remove PMM (Switchback) when a
higher level is in service. Check the current priority service level before entering PMM. If the current
service level locks out a desired Switchback source, then it would be advisable to wait until this condition
clears before entering PMM.
Alternately, software can prevent an undesired exit from PMM by entering a low priority interrupt service
level before entering PMM. This will prevent other low priority interrupts from causing a Switchback.
Status also contains information about the state of the serial ports. Serial Port Zero Receive Activity
(SPRA0; STATUS.0) indicates a serial word is being received on Serial Port 0 when this bit is set to a 1.
Serial Port 0 Transmit Activity (SPTA0; STATUS.1) indicates that the serial port is still shifting out a
serial transmission. STATUS.2 and STATUS.3 provide the same information for Serial Port 1,
respectively. These bits should be interrogated before entering PMM1 or PMM2 to ensure that no serial
port operations are in progress. Changing the clock divisor rate during a serial transmission or reception
will corrupt the operation.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Crystal/Ring Operation
The DS87C530/DS83C530 allow software to choose the clock source as an independent selection from
the instruction cycle rate. The user can select crystal-based or ring oscillator-based operation under
software control. Power-on reset default is the crystal (or external clock) source. The ring may save
power depending on the actual crystal speed. To save still more power, software can then disable the
crystal amplifier. This process requires two steps. Reversing the process also requires two steps.
The XT/ RG bit (EXIF.3) selects the crystal or ring as the clock source. Setting XT/ RG = 1 selects the
crystal. Setting XT/ RG = 0 selects the ring. The RGMD (EXIF.2) bit serves as a status bit by indicating
the active clock source. RGMD = 0 indicates the CPU is running from the crystal. RGMD = 1 indicates it
is running from the ring. When operating from the ring, disable the crystal amplifier by setting the
XTOFF bit (PMR.3) to a 1. This can only be done when XT/ RG = 0.
When changing the clock source, the selection will take effect after a one-instruction-cycle delay. This
applies to changes from crystal to ring and vise versa. However, this assumes that the crystal amplifier is
running. In most cases, when the ring is active, software previously disabled the crystal to save power. If
ring operation is being used and the system must switch to crystal operation, the crystal must first be
enabled. Set the XTOFF bit to 0. At this time, the crystal oscillation will begin. The
DS87C530/DS83C530 then provide a warm-up delay to make certain that the frequency is stable.
Hardware will set the XTUP bit (STATUS.4) to 1 when the crystal is ready for use. Then software should
write XT/ RG to 1 to begin operating from the crystal. Hardware prevents writing XT/ RG to 1 before
XTUP = 1. The delay between XTOFF = 0 and XTUP = 1 will be 65,536 crystal clocks in addition to the
crystal cycle startup time.
Switchback has no affect on the clock source. If software selects a reduced clock divider and enables the
ring, a Switchback will only restore the divider speed. The ring will remain as the time base until altered
by software. If there is serial activity, Switchback usually occurs with enough time to create proper baud
rates. This is not true if the crystal is off and the CPU is running from the ring. If sending a serial
character that wakes the system from crystal-less PMM, then it should be a dummy character of no
importance with a subsequent delay for crystal startup.
Table 6 is a summary of the bits relating to PMM and its operation. The flow chart below illustrates a
typical decision set associated with PMM.
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DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Table 6. PMM Control and Status Bit Summary
NAME
LOCATION
FUNCTION
XT/ RG
EXIF.3
Control. XT/ RG =1, runs from crystal or external
clock; XT/ RG =0, runs from internal ring oscillator.
X
0 to 1 only when
XTUP = 1 and
XTOFF= 0
RGMD
EXIF.2
Status. RGMD=1, CPU clock = ring; RGMD = 0,
CPU clock = crystal.
0
None
CD1, CD0
PMR7, PMR.6
Control. CD1, 0 = 01, 4 clocks; CS1, 0 = 10, PMM1;
CD1, 0 = 11, PMM2.
0, 1
SWB
PMR.5
Control. SWB = 1, hardware invokes switchback to 4
clocks, SWB = 0, no hardware switchback.
0
Unrestricted
XTOFF
PMR.3
Control. Disables crystal operation after ring is
selected.
0
1 only when XT/ RG
=0
PIP
STATUS.7
Status. 1 indicates a power-fail interrupt in service.
0
None
HIP
STATUS.6
Status. 1 indicates high priority interrupt in service.
0
None
LIP
STATUS.5
Status. 1 indicates low priority interrupt in service.
0
None
XTUP
STATUS.4
Status. 1 indicates that the crystal has stabilized.
1
None
SPTA1
STATUS.3
Status. Serial transmission on serial port 1.
0
None
SPRA1
STATUS.2
Status. Serial word reception on serial port 1.
0
None
SPTA0
STATUS.1
Status. Serial transmission on serial port 0.
0
None
SPRA0
STATUS.0
Status. Serial word reception on serial port 0.
0
None
21 of 47
RESET
WRITE ACCESS
Write CD1, 0 = 10 or
11 only from CD1, 0 =
01
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Figure 5. Invoking and Clearing PMM
22 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
IDLE MODE
Setting the lsb of the Power Control register (PCON; 87h) invokes the Idle mode. Idle will leave internal
clocks, serial ports and timers running. Power consumption drops because the CPU is not active. Since
clocks are running, the Idle power consumption is a function of crystal frequency. It should be
approximately one-half the operational power at a given frequency. The CPU can exit the Idle state with
any interrupt or a reset. Idle is available for backward software compatibility. The system can now reduce
power consumption to below Idle levels by using PMM1 or PMM2 and running NOPs.
STOP MODE ENHANCEMENTS
Setting bit 1 of the Power Control register (PCON; 87h) invokes the Stop mode. Stop mode is the lowest
power state since it turns off all internal clocking. The ICC of a standard Stop mode is approximately 1 mA
but is specified in the Electrical Specifications. The CPU will exit Stop mode from an external interrupt
or a reset condition. Internally generated interrupts (timer, serial port, watchdog) are not useful since they
require clocking activity. One exception is that a RTC interrupt can cause the device to exit Stop mode.
This provides a very power efficient way of performing infrequent yet periodic tasks.
The DS87C530/DS83C530 provide two enhancements to the Stop mode. As documented below, the
device provides a bandgap reference to determine Power-fail Interrupt and Reset thresholds. The default
state is that the bandgap reference is off while in Stop mode. This allows the extremely low-power state
mentioned above. A user can optionally choose to have the bandgap enabled during Stop mode. With the
bandgap reference enabled, PFI and Power-fail Reset are functional and are a valid means for leaving
Stop mode. This allows software to detect and compensate for a brownout or power supply sag, even
when in Stop mode.
In Stop mode with the bandgap enabled, ICC will be approximately 50mA compared with 1mA with the
bandgap off. If a user does not require a Power-fail Reset or Interrupt while in Stop mode, the bandgap
can remain disabled. Only the most power sensitive applications should turn off the bandgap, as this
results in an uncontrolled power-down condition.
The control of the bandgap reference is located in the Extended Interrupt Flag register (EXIF; 91h).
Setting BGS (EXIF.0) to a 1 will keep the bandgap reference enabled during Stop mode. The default or
reset condition is with the bit at a logic 0. This results in the bandgap being off during Stop mode. Note
that this bit has no control of the reference during full power, PMM, or Idle modes.
The second feature allows an additional power saving option while also making Stop easier to use. This is
the ability to start instantly when exiting Stop mode. It is the internal ring oscillator that provides this
feature. This ring can be a clock source when exiting Stop mode in response to an interrupt. The benefit
of the ring oscillator is as follows.
Using Stop mode turns off the crystal oscillator and all internal clocks to save power. This requires that
the oscillator be restarted when exiting Stop mode. Actual startup time is crystal-dependent, but is
normally at least 4ms. A common recommendation is 10ms. In an application that will wake up, perform
a short operation, then return to sleep, the crystal startup can be longer than the real transaction. However,
the ring oscillator will start instantly. Running from the ring, the user can perform a simple operation and
return to sleep before the crystal has even started. If a user selects the ring to provide the startup clock and
the processor remains running, hardware will automatically switch to the crystal once a power-on reset
interval (65,536 clocks) has expired. Hardware uses this value to assure proper crystal start even though
power is not being cycled.
23 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
The ring oscillator runs at approximately 2MHz to 4MHz but will not be a precise value. Do not conduct
real-time precision operations (including serial communication) during this ring period. Figure 6 shows
how the operation would compare when using the ring, and when starting up normally. The default state
is to exit Stop mode without using the ring oscillator.
The RGSL ring-select bit at EXIF.1 (EXIF; 91h) controls this function. When RGSL = 1, the CPU will
use the ring oscillator to exit Stop mode quickly. As mentioned above, the processor will automatically
switch from the ring to the crystal after a delay of 65,536 crystal clocks. For a 3.57MHz crystal, this is
approximately 18ms. The processor sets a flag called RGMD- Ring Mode, located at EXIF.2, that tells
software that the ring is being used. The bit will be a logic 1 when the ring is in use. Attempt no serial
communication or precision timing while this bit is set, since the operating frequency is not precise.
Figure 6. Ring Oscillator Exit from Stop Mode
NOTE: DIAGRAM ASSUMES THAT THE OPERATION FOLLOWING STOP REQUIRES LESS THAN 18ms TO COMPLETE.
EMI REDUCTION
One of the major contributors to radiated noise in an 8051-based system is the toggling of ALE. The
DS87C530/DS83C530 allow software to disable ALE when not used by setting the ALEOFF (PMR.2) bit
to 1. When ALEOFF = 1, ALE will still toggle during an off-chip MOVX. However, ALE will remain in
a static when performing on-chip memory access. The default state of ALEOFF = 0 so ALE toggles with
every instruction cycle.
24 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
PERIPHERAL OVERVIEW
The DS87C530/DS83C530 provide several of the most commonly needed peripheral functions in
microcomputer-based systems. These new functions include a second serial port, power-fail reset, Powerfail interrupt, and a programmable watchdog timer. These are described below, and more details are
available in the High-Speed Microcontroller User’s Guide.
SERIAL PORTS
The DS87C530/DS83C530 provide a serial port (UART) that is identical to the 80C52. In addition it
includes a second hardware serial port that is a full duplicate of the standard one. This port optionally
uses pins P1.2 (RXD1) and P1.3 (TXD1). It has duplicate control functions included in new SFR
locations.
Both ports can operate simultaneously but can be at different baud rates or even in different modes. The
second serial port has similar control registers (SCON1; C0h, SBUF1; C1h) to the original. The new
serial port can only use Timer 1 for timer-generated baud rates.
TIMER RATE CONTROL
There is one important difference between the DS87C530/DS83C530 and 8051 regarding timers. The
original 8051 used 12 clocks per cycle for timers as well as for machine cycles. The
DS87C530/DS83C530 architecture normally uses 4 clocks per machine cycle. However, in the area of
timers and serial ports, the DS87C530/DS83C530 will default to 12 clocks per cycle on reset. This allows
existing code with real-time dependencies such as baud rates to operate properly.
If an application needs higher speed timers or serial baud rates, the user can select individual timers to run
at the 4-clock rate. The Clock Control register (CKCON; 8Eh) determines these timer speeds. When the
relevant CKCON bit is logic 1, the DS87C530/DS83C530 use 4 clocks per cycle to generate timer
speeds. When the bit is a 0, the DS87C530 uses 12 clocks for timer speeds. The reset condition is a 0.
CKCON.5 selects the speed of Timer 2. CKCON.4 selects Timer 1 and CKCON.3 selects Timer 0.
Unless a user desires very fast timing, it is unnecessary to alter these bits. Note that the timer controls are
independent.
POWER-FAIL RESET
The DS87C530/DS83C530 use a precision bandgap voltage reference to decide if VCC is out of tolerance.
While powering up, the internal monitor circuit maintains a reset state until VCC rises above the VRST
level. Once above this level, the monitor enables the crystal oscillator and counts 65,536 clocks. It then
exits the reset state. This power-on reset (POR) interval allows time for the oscillator to stabilize.
A system needs no external components to generate a power-related reset. Anytime VCC drops below
VRST, as in power failure or a power drop, the monitor will generate and hold a reset. It occurs
automatically, needing no action from the software. Refer to the Electrical Specifications section for the
exact value of VRST.
POWER-FAIL INTERRUPT
The voltage reference that sets a precise reset threshold also generates an optional early warning powerfail interrupt (PFI). When enabled by software, the processor will vector to program memory address
0033h if VCC drops below VPFW. PFI has the highest priority. The PFI enable is in the Watchdog Control
SFR (WDCON–D8h). Setting WDCON.5 to logic 1 will enable the PFI. Application software can also
25 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
read the PFI flag at WDCON.4. A PFI condition sets this bit to a 1. The flag is independent of the
interrupt enable and software must manually clear it. If the PFI is enabled and the bandgap select bit
(BGS) is set, a PFI will bring the device out of Stop mode.
WATCHDOG TIMER
To prevent software from losing control, the DS87C530/DS83C530 include a programmable watchdog
timer. The Watchdog is a free-running timer that sets a flag if allowed to reach a preselected timeout. It
can be (re)started by software.
A typical application is to select the flag as a reset source. When the Watchdog times out it sets its flag,
which generates reset. Software must restart the timer before it reaches its timeout or the processor is
reset.
Software can select one of four timeout values. Then, it restarts the timer and enables the reset function.
After enabling the reset function, software must then restart the timer before its expiration or hardware
will reset the CPU. Both the Watchdog Reset Enable and the Watchdog Restart control bits are protected
by a “Timed Access” circuit. This prevents errant software from accidentally clearing the Watchdog.
Timeout values are precise since they are a function of the crystal frequency as shown in Table 7. For
reference, the time periods at 33MHz also are shown.
The Watchdog also provides a useful option for systems that do not require a reset circuit. It will set an
interrupt flag 512 clocks before setting the reset flag. Software can optionally enable this interrupt source.
The interrupt is independent of the reset. A common use of the interrupt is during debug, to show
developers where the Watchdog times out. This indicates where the Watchdog must be restarted by
software. The interrupt also can serve as a convenient time-base generator or can wake-up the processor
from power saving modes.
The Watchdog function is controlled by the Clock Control (CKCON–8Eh), Watchdog Control
(WDCON–D8h), and Extended Interrupt Enable (EIE–E8h) SFRs. CKCON.7 and CKCON.6 are WD1
and WD0, respectively, and they select the Watchdog timeout period as shown in Table 7.
Table 7. Watchdog Timeout Values
WD1
WD0
INTERRUPT
TIMEOUT
TIME (33MHz)
RESET TIMEOUT
TIME (33MHz)
0
0
217 clocks
3.9718ms
217 + 512 clocks
3.9874ms
0
1
1
1
0
1
20
2 clocks
23
2 clocks
26
2 clocks
31.77ms
254.20ms
2033.60ms
20
31.79ms
23
254.21ms
26
2033.62ms
2 + 512 clocks
2 + 512 clocks
2 + 512 clocks
As shown above, the Watchdog Timer uses the crystal frequency as a time base. A user selects one of
four counter values to determine the timeout. These clock counter lengths are 217 = 131,072 clocks; 220 =
1,048,576; 223 = 8,388,608 clocks; and 226 = 67,108,864 clocks. The times shown in Table 7 are with a
33MHz crystal frequency. Once the counter chain has completed a full interrupt count, hardware will set
an interrupt flag. Regardless of whether the user enables this interrupt, there are then 512 clocks left until
the reset flag is set. Software can enable the interrupt and reset individually. Note that the Watchdog is a
free-running timer and does not require an enable.
26 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
There are five control bits in special function registers that affect the Watchdog Timer and two status
flags that report to the user. WDIF (WDCON.3) is the interrupt flag that is set at timer termination when
there are 512 clocks remaining until the reset flag is set. WTRF (WDCON.2) is the flag that is set when
the timer has completely timed out. This flag is normally associated with a CPU reset and allows software
to determine the reset source. EWT (WDCON.1) is the enable for the Watchdog Timer reset function.
RWT (WDCON.0) is the bit that software uses to restart the Watchdog Timer. Setting this bit restarts the
timer for another full interval. Application software must set this bit before the timeout. Both of these bits
are protected by Timed Access discussed below. As mentioned previously, WD1 and 0 (CKCON .7 and
6) select the timeout. The Reset Watchdog Timer bit (WDCON.0) should be asserted prior to modifying
the Watchdog Timer Mode Select bits (WD1, WD0) to avoid corruption of the watchdog count. Finally,
the user can enable the Watchdog Interrupt using EWDI (EIE.4).
INTERRUPTS
The DS87C530/DS83C530 provide 14 interrupt sources with three priority levels. The Power-Fail
Interrupt (PFI) has the highest priority. Software can assign high or low priority to other sources. All
interrupts that are new to the 8051 family, except for the PFI, have a lower natural priority than the
originals.
Table 8. Interrupt Sources and Priorities
NAME
FUNCTION
VECTOR
NATURAL
PRIORITY
8051/DALLAS
PFI
Power-Fail Interrupt
33h
1
DALLAS
INT0
External Interrupt 0
03h
2
8051
TF0
Timer 0
0Bh
3
8051
INT1
External Interrupt 1
13h
4
8051
TF1
Timer 1
1Bh
5
8051
TI0 or RI0 from Serial Port 0
23h
6
8051
Timer 2
2Bh
7
8051
TI1 or RI1 from Serial Port 1
3Bh
8
DALLAS
INT2
External Interrupt 2
43h
9
DALLAS
INT3
External Interrupt 3
4Bh
10
DALLAS
INT4
External Interrupt 4
53h
11
DALLAS
INT5
External Interrupt 5
5Bh
12
DALLAS
WDTI
Watchdog Timeout Interrupt
63h
13
DALLAS
RTCI
RTC Interrupt
6Bh
14
DALLAS
SCON0
TF2
SCON1
27 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
TIMED-ACCESS PROTECTION
It is useful to protect certain SFR bits from an accidental write operation. The Timed-Access procedure
stops an errant CPU from accidentally changing these bits. It requires that the following instructions
precede a write of a protected bit.
MOV
MOV
0C7h, #0AAh
0C7h, #55h
Writing an AAh and then a 55h to the Timed-Access register (location C7h) opens a three-cycle window
for write access. The window allows software to modify a protected bit(s). If these instructions do not
immediately precede the write operation, then the write will not take effect. The protected bits are:
EXIF.0
WDCON.6
WDCON.1
WDCON.0
WDCON.3
ROMSIZE.2
ROMSIZE.1
ROMSIZE.0
TRIM.7–0
RTCC.2
RTCC.0
BGS
POR
EWT
RWT
WDIF
RMS2
RMS1
RMS0
—
RTCWE
RTCE
Bandgap Select
Power-On Reset flag
Enable Watchdog Reset
Restart Watchdog
Watchdog Interrupt Flag
ROM Size Select 2
ROM Size Select 1
ROM Size Select 0
All RTC Trim Functions
RTC Write Enable
RTC Oscillator Enable
EPROM PROGRAMMING
The DS87C530 follows standards for a 16kB EPROM version in the 8051 family. It is available in a UV
erasable, ceramic windowed package and in plastic packages for one-time user-programmable versions.
The part has unique signature information so programmers can support its specific EPROM options.
PROGRAMMING PROCEDURE
The DS87C530 should run from a clock speed between 4MHz and 6MHz when programmed. The
programming fixture should apply address information for each byte to the address lines and the data
value to the data lines. The control signals must be manipulated as shown in Table 9. The diagram in
Figure 5 shows the expected electrical connection for programming. Note that the programmer must
apply addresses in demultiplexed fashion to Ports 1 and 2 with data on Port 0. Waveforms and timing are
provided in the Electrical Specifications section. Program the DS87C530 as follows:
Apply the address value,
Apply the data value,
Select the programming option from Table 9 using the control signals,
Increase the voltage on VPP from 5V to 12.75V if writing to the EPROM,
Pulse the PROG signal five times for EPROM array and 25 times for encryption table, lock bits, and other
EPROM bits,
6) Repeat as many times as necessary.
1)
2)
3)
4)
5)
28 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
DS87C530 SECURITY OPTIONS
The DS87C530 employs a standard three-level lock that restricts viewing of the EPROM contents. A 64byte Encryption Array allows the authorized user to verify memory by presenting the data in encrypted
form.
Lock Bits
The security lock consists of 3 lock bits. These bits select a total of 4 levels of security. Higher levels
provide increasing security but also limit application flexibility. Table 10 shows the security settings.
Note that the programmer cannot directly read the state of the security lock. User software has access to
this information as described in the Memory section.
Encryption Array
The Encryption Array allows an authorized user to verify EPROM without allowing the true memory to
be dumped. During a verify, each byte is Exclusive NORed (XNOR) with a byte in the Encryption Array.
This results in a true representation of the EPROM while the Encryption is unprogrammed (FFh). Once
the Encryption Array is programmed in a non-FFh state, the verify value will be encrypted.
For encryption to be effective, the Encryption Array must be unknown to the party that is trying to verify
memory. The entire EPROM also should be a non-FFh state or the Encryption Array can be discovered.
The Encryption Array is programmed as shown in Table 9. Note that the programmer cannot read the
array. Also note that the verify operation always uses the Encryption Array. The array has no impact
while FFh. Simply programming the array to a non-FFh state will cause the encryption to function.
Other EPROM Options
The DS87C530 has user-selectable options that must be set before beginning software execution. These
options use EPROM bits rather than SFRs.
Program the EPROM selectable options as shown in Table 9. The Option Register sets or reads these
selections. The bits in the Option Control Register have the following function:
Bits 7 to 4
Reserved, program to 1.
Bit 3
Watchdog POR default. Set = 1; Watchdog reset function is disabled on power-up.
Set = 0; Watchdog reset function is enabled automatically.
Bits 2 to 0
Reserved. Program to 1.
DS87C530 Signature
The Signature bytes identify the product and programming revision to EPROM programmers. This
information is at programming addresses 30h, 31h, and 60h. This information is as follows:
ADDRESS
30h
31h
60h
VALUE
DAh
30h
01h
29 of 47
MEANING
Manufacturer
Model
Extension
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Table 9. EPROM Programming Modes
RST
PSEN
ALE/PROG
EA/VPP
P2.6
P2.7
P3.3
P3.6
P3.7
Program Code Data
H
L
PL
12.75V
L
H
H
H
H
Verify Code Data
H
L
H
H
L
L
L
H
H
Program Encryption
Array Address 0-3Fh
H
L
PL
12.75V
L
H
H
L
H
LB1
H
L
PL
12.75V
H
H
H
H
H
LB2
H
L
PL
12.75V
H
H
H
L
L
LB3
H
L
PL
12.75V
H
L
H
H
L
Program Option
Register Address FCh
H
L
PL
12.75V
L
H
H
L
L
Read Signature or
Option Registers 30,
31, 60, FCh
H
L
H
H
L
L
L
L
L
MODE
Program Lock
Bits
* PL indicates pulse to a logic low.
Table 10. EPROM Lock Bits
LEVEL
LOCK BITS
PROTECTION
LB1
LB2
LB3
1
U
U
U
No program lock. Encrypted verify if encryption table was
programmed.
2
P
U
U
Prevent MOVC instructions in external memory from reading
program bytes in internal memory. EA is sampled and latched on
reset. Allow no further programming of EPROM.
3
P
P
U
Level 2 plus no verify operation. Also, prevent MOVX instructions in
external memory from reading SRAM (MOVX) in internal memory.
4
P
P
P
Level 3 plus no external execution.
30 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
Figure 7. EPROM Programming Configuration
ROM-SPECIFIC FEATURES (DS83C530)
The DS83C530 supports a subset of the EPROM features found on the DS87C530.
SECURITY OPTIONS
Lock Bits
The DS83C530 employs a lock that restricts viewing of the ROM contents. When set, the lock will
prevent MOVC instructions in external memory from reading program bytes in internal memory. When
locked, the EA pin is sampled and latched on reset. The lock setting is enabled or disabled when the
devices are manufactured according to customer specifications. The lock bit cannot be read in software,
and its status can only be determined by observing the operation of the device.
Encryption Array
The DS83C530 Encryption Array allows an authorized user to verify ROM without allowing the true
memory contents to be dumped. During a verify, each byte is Exclusive NORed (XNOR) with a byte in
the Encryption Array. This results in a true representation of the ROM while the Encryption is
unprogrammed (FFh). Once the Encryption Array is programmed in a non-FFh state, the Encryption
Array is programmed (or optionally left unprogrammed) when the devices are manufactured according to
customer specifications.
31 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
DS83C530 ROM Verification
The DS83C530 memory contents can be verified using a standard EPROM programmer. The memory
address to be verified is placed on the pins shown in Figure 7, and the programming control pins are set to
the levels shown in Table 9. The data at that location is then asserted on port 0.
DS83C530 Signature
The Signature bytes identify the DS83C530 to EPROM programmers. This information is at
programming addresses 30h, 31h, and 60h. Because Mask ROM devices are not programmed in device
programmers, most designers will find little use for the feature, and it is included only for compatibility.
ADDRESS
30h
31h
60h
VALUE
DAh
31h
01h
32 of 47
MEANING
Manufacturer
Model
Extension
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground……………………………………………….………-0.3V to (VCC + 0.5V)
Voltage Range on VCC Relative to Ground…………………………………………………………………..-0.3V to +6.0V
Operating Temperature Range………………………………………………………………………………….0°C to +70°C
Storage Temperature Range……………………………………………………………………...-55°C to +125°C (Note 1)
Soldering Temperature.…………………………………………………………See IPD/JEDEC J-STD-020 Specification
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = 4.5V to 5.5V, TA = -40°C to +85°C.) (Note 2)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Supply Voltage
VCC
4.5
5.0
5.5
V
3
Power-Fail Warning
VPFW
4.25
4.38
4.5
V
3
Minimum Operating Voltage
VRST
4.0
4.13
4.25
V
3
Backup Battery Voltage
VBAT
2.5
3.0
VCC-0.7
V
Supply Current Active Mode at 33MHz
ICC
30
46
mA
4
Supply Current Idle Mode at 33MHz
IIdle
15
25
mA
5
1
100
mA
6
1
150
mA
6
50
170
mA
6
50
195
mA
6
0
0.5
mA
7
0
1
mA
7
Supply Current Stop Mode, Bandgap Disabled
(0°C to +70°C)
Supply Current Stop Mode, Bandgap Disabled
(-40°C to +85°C)
Supply Current Stop Mode, Bandgap Enabled
(0°C to +70°C)
Supply Current Stop Mode, Bandgap Enabled
(-40°C to +85°C)
Backup Supply Current, Data-Retention Mode
(0°C to +70°C)
Backup Supply Current, Data-Retention Mode
(-40°C to +85°C)
IStop
ISPBG
IBAT
Input Low Level
VIL
-0.3
+0.8
V
3
Input High Level
VIH
2.0
VCC+0.3
V
3
Input High Level XTAL1 and RST
VIH2
3.5
VCC+0.3
V
3
Output Low Voltage at IOL = 1.6mA
VOL1
0.15
0.45
V
3
Output Low Voltage Ports 0, 2, ALE, and PSEN
at IOL = 3.2mA
VOL2
0.15
0.45
V
3
Output High Voltage Ports 1, 2, 3, ALE, PSEN at
IOH = -50mA
VOH1
2.4
V
3, 8
Output High Voltage Ports 1, 2, 3
at IOH = -1.5mA
VOH2
2.4
V
3, 9
Output High Voltage Port 0 in Bus Mode
IOH = -8mA
VOH3
2.4
V
3, 10
Input Low Current Ports 1, 2, 3 at 0.45V
IIL
-70
mA
11
Transition Current from 1 to 0 Ports 1, 2, 3 at 2V
ITL
-800
mA
12
33 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
DC ELECTRICAL CHARACTERISTICS (continued)
(VCC = 4.5V to 5.5V, TA = -40°C to +85°C.)
PARAMETER
SYMBOL
MIN
Input Leakage Port 0, EA, Pins, I/O Mode
IL
Input Leakage Port 0, Bus Mode
RST Pulldown Resistance
Note 1:
TYP
MAX
UNITS
NOTES
-10
+10
mA
13
IL
-300
+300
mA
14
RRST
50
200
kW
Note 2:
Note 3:
Storage temperature is defined as the temperature of the device when VCC = 0V and VBAT = 0V. In this state, the contents of
SRAM are not battery backed and are undefined.
All parameters apply to both commercial and industrial temperature operation unless otherwise noted.
All voltages are referenced to ground.
Note 4:
Note 5:
Active current measured with 33MHz clock source on XTAL1, VCC = RST = 5.5V, other pins disconnected.
Idle mode current measured with 33MHz clock source on XTAL1, VCC = 5.5V, RST at ground, other pins disconnected.
Note 6:
Stop mode current measured with XTAL1 and RST grounded, VCC = 5.5V, all other pins disconnected.
Note 7:
Note 8:
VCC = 0V, VBAT = 3.3V. 32.768kHz crystal with 12.5pF load capacitance between RTCX1 and RTCX2 pins. RTCE bit set to 1.
RST = VCC. This condition mimics operation of pins in I/O mode. Port 0 is tri-stated in reset and when at a logic high state during
I/O mode.
During a 0-to-1 transition, a one-shot drives the ports hard for two clock cycles. This measurement reflects port in transition
mode.
When addressing external memory. This specification only applies to the first clock cycle following the transition.
This is the current required from an external circuit to hold a logic low level on an I/O pin while the corresponding port latch bit is
set to 1. This is only the current required to hold the low level; transitions from 1 to 0 on an I/O pin will also have to overcome the
transition current.
Ports 1, 2, and 3 source transition current when being pulled down externally. It reaches its maximum at approximately 2V.
0.45 < VIN < VCC. RST = VCC. This condition mimics operation of pins in I/O mode.
0.45 < VIN < VCC. Not a high-impedance input. This port is a weak address holding latch in Bus Mode. Peak current occurs near
the input transition point of the latch, approximately 2V.
Note 9:
Note 10:
Note 11:
Note 12:
Note 13:
Note 14:
TYPICAL ICC vs. FREQUENCY
34 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
AC ELECTRICAL CHARACTERISTICS (Note 1)
PARAMETER
Oscillator
Frequency
External Oscillator
External Crystal
SYMBOL
1/tCLCL
33MHz
VARIABLE CLOCK
MIN
MAX
MIN
MAX
0
33
0
33
1
33
1
33
UNITS
MHz
ALE Pulse Width
tLHLL
40
1.5tCLCL-5
ns
Port 0 Address Valid to ALE Low
tAVLL
10
0.5tCLCL-5
ns
Address Hold after ALE Low
tLLAX1
(Note 2)
(Note 2)
ns
ALE low to Valid Instruction In
tLLIV
ALE Low to PSEN Low
tLLPL
4
0.5tCLCL-11
ns
PSEN Pulse Width
tPLPH
55
2tCLCL-5
ns
PSEN Low to Valid Instruction In
tPLIV
Input Instruction Hold after PSEN
tPXIX
Input Instruction Float after PSEN
tPXIZ
26
tCLCL-5
ns
Port 0 Address to Valid Instruction In
tAVIV1
59
3tCLCL-32
ns
Port 2 Address to Valid Instruction In
tAVIV2
68
3.5tCLCL-38
ns
PSEN Low to Address Float
tPLAZ
(Note 2)
(Note 2)
ns
43
2.5tCLCL-33
37
0
2tCLCL-24
0
ns
ns
ns
Note 1:
All parameters apply to both commercial and industrial temperature range operation unless otherwise noted. Specifications to
-40°C are guaranteed by design and are not production tested. AC electrical characteristics are not 100% tested, but are
characterized and guaranteed by design. All signals are characterized with load capacitance of 80pF except Port 0, ALE, PSEN, RD
and WR with 100pF. Interfacing to memory devices with float times (turn off times) over 25ns may cause contention. This will not
damage the parts, but will cause an increase in operating current. Specifications assume a 50% duty cycle for the oscillator. Port 2
and ALE timing will change in relation to duty cycle variation.
Note 2:
Address is driven strongly until ALE falls, and is then held in a weak latch until overdriven externally.
35 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
MOVX CHARACTERISTICS USING STRETCH MEMORY CYCLES
PARAMETER
SYMBOL
Data Access ALE Pulse Width
tLHLL2
Port 0 Address Valid to ALE Low
tAVLL2
Address Hold After ALE Low for
MOVX Write
tLLAX2
RD Pulse Width
tRLRH
WR Pulse Width
tWLWH
RD Low Valid Data In
tRLDV
Data Hold After Read
tRHDX
Data Float After Read
tRHDZ
ALE Low to Valid Data In
tLLDV
Port 0 Address to Valid Data In
tAVDV1
Port 2 Address to Valid Data In
tAVDV2
ALE Low to RD or WR Low
tLLWL
Port 0 Address to RD or WR Low
tAVWL1
Port 2 Address to RD or WR Low
tAVWL2
Data Valid to WR Transition
tQVWX
Data Hold After Write
tWHQX
RD Low to Address Float
tRLAZ
RD or WR High to ALE High
tWHLH
Note 1:
VARIABLE CLOCK
MIN
MAX
1.5tCLCL-5
UNITS
ns
2tCLCL-5
0.5tCLCL-5
ns
tCLCL-5
0.5tCLCL-10
ns
tCLCL-7
2tCLCL-5
ns
tMCS-10
2tCLCL-5
ns
tMCS-10
2tCLCL-22
tMCS-24
0
tCLCL-5
ns
tMCS+tCLCL-26
3tCLCL-29
tMCS+2CLCL-29
3.5tCLCL-37
tMCS+2.5LCL-37
0.5tCLCL-10
0.5tCLCL+5
tCLCL-5
tCLCL+5
tCLCL-9
1.5tCLCL-17
-6
tMCS=0
tMCS>0
tMCS=0
tMCS>0
tMCS=0
tMCS>0
tMCS=0
tMCS>0
tMCS=0
tMCS>0
ns
tMCS=0
tMCS>0
ns
ns
ns
ns
ns
2.5tCLCL-16
tMCS>0
—
ns
2tCLCL-7
tMCS=0
ns
2tCLCL-5
2.5tCLCL-31
STRETCH
tMCS=0
tMCS>0
tMCS=0
tMCS>0
tMCS=0
tMCS>0
tMCS=0
tMCS>0
tMCS=0
tMCS>0
tMCS=0
tMCS>0
ns
tCLCL-5
ns
2tCLCL-6
(Note 1)
-4
10
tCLCL-5
tCLCL+5
tMCS=0
tMCS>0
ns
ns
tMCS=0
tMCS>0
tMCS is a time period related to the Stretch memory cycle selection. The following table shows the value of tMCS for each Stretch
selection.
36 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
MOVX CHARACTERISTICS USING STRETCH MEMORY CYCLES (continued)
M2
M1
M0
MOVX CYCLES
tMCS
0
0
0
2 machine cycles
0
0
0
1
3 machine cycles (default)
4 tCLCL
0
1
0
4 machine cycles
8 tCLCL
0
1
1
5 machine cycles
12 tCLCL
1
0
0
6 machine cycles
16 tCLCL
1
0
1
7 machine cycles
20 tCLCL
1
1
0
8 machine cycles
24 tCLCL
1
1
1
9 machine cycles
28 tCLCL
EXTERNAL CLOCK CHARACTERISTICS
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
Clock High Time
tCHCX
10
ns
Clock Low Time
tCLCX
10
ns
Clock Rise Time
tCLCL
5
ns
Clock Fall Time
tCHCL
5
ns
TYP
MAX
SERIAL PORT MODE 0 TIMING CHARACTERISTICS
PARAMETER
SYMBOL
Serial Port Clock Cycle
Time
tXLXL
Output Data Setup to
Clock Rising
tQVXH
Output Data Hold from
Clock Rising
tXHQX
Input Data Hold after
Clock Rising
tXHDX
Clock Rising Edge to
Input Data Valid
tXHDV
CONDITIONS
MIN
SM2 = 0, 12 clocks per cycle
12tCLCL
SM2 = 1, 4 clocks per cycle
4tCLCL
SM2 = 0, 12 clocks per cycle
10tCLCL
SM2 = 1, 4 clocks per cycle
3tCLCL
SM2 = 0, 12 clocks per cycle
2tCLCL
SM2 = 1, 4 clocks per cycle
tCLCL
SM2 = 0, 12 clocks per cycle
tCLCL
SM2 = 1, 4 clocks per cycle
tCLCL
SM2 = 0, 12 clocks per cycle
11tCLCL
SM2 = 1, 4 clocks per cycle
3tCLCL
37 of 47
UNITS
ns
ns
ns
ns
ns
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
EXPLANATION OF AC SYMBOLS
In an effort to remain compatible with the original 8051 family, this device specifies the same parameters
as such devices, using the same symbols. For completeness, the following is an explanation of the
symbols.
t
A
C
D
H
L
Time
Address
Clock
Input data
Logic level high
Logic level low
I
P
Q
R
V
Instruction
PSEN
Output data
RD signal
Valid
WR signal
No longer a valid logic
level
Tri-State
W
X
Z
POWER-CYCLE TIMING CHARACTERISTICS
PARAMETER
SYMBOL
Cycle Startup Time
tCSU
Power-On Reset Delay
tPOR
MIN
TYP
MAX
1.8
65,536
UNITS
NOTES
ms
1
tCLCL
2
Note 1:
Startup time for crystals varies with load capacitance and manufacturer. Time shown is for an 11.0592MHz crystal manufactured by
Fox.
Note 2:
Reset delay is a synchronous counter of crystal oscillations after crystal startup. At 33MHz, this time is 1.99ms.
EPROM PROGRAMMING AND VERIFICATION
(VCC = 4.5V to 5.5V, TA = +21°C to +27°C.)
PARAMETER
SYMBOL
MIN
Programming Voltage
VPP
12.5
Programming Supply Current
IPP
Oscillator Frequency
TYP
MAX
UNITS
NOTES
13.0
V
1
50
mA
6
MHz
1/tCLCL
4
Address Setup to PROG Low
tAVGL
48tCLCL
Address Hold after PROG
tGHAX
48tCLCL
Data Setup to PROG Low
tDVGL
48tCLCL
Data Hold after PROG
tGHDX
48tCLCL
Enable High to VPP
tEHSH
48tCLCL
VPP Setup to PROG Low
tSHGL
10
ms
VPP Hold after PROG
tGHSL
10
ms
PROG Width
tGLGH
90
Address to Data Valid
tAVQV
48tCLCL
Enable Low to Data Valid
tELQV
48tCLCL
Data Float after Enable
tEHQZ
0
PROG High to PROG Low
tGHGL
10
Note 1: All voltages are referenced to ground.
38 of 47
110
ms
48tCLCL
ms
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
EXTERNAL PROGRAM MEMORY READ CYCLE
EXTERNAL DATA MEMORY READ CYCLE
tVALL2
39 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
DATA MEMORY WRITE CYCLE
tAVLL2
DATA MEMORY WRITE WITH STRETCH = 1
40 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
DATA MEMORY WRITE WITH STRETCH = 2
EXTERNAL CLOCK DRIVE
41 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
SERIAL PORT MODE 0 TIMING
42 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
POWER-CYCLE TIMING
EPROM PROGRAMMING AND VERIFICATION WAVEFORMS
43 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
PACKAGE INFORMATION
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information, go to www.maxim-ic.com/DallasPackInfo.)
44 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
PACKAGE INFORMATION (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information, go to www.maxim-ic.com/DallasPackInfo.)
45 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
PACKAGE INFORMATION (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package
outline information, go to www.maxim-ic.com/DallasPackInfo.)
PKG
52-PIN
DIM
MIN
NOM
MAX
A
—
—
1.20
A1
0.05
0.10
0.15
A2
0.95
1.00
1.05
b
0.25
0.32
0.40
c
0.09
—
0.20
D
11.80
12.00
12.20
D1
E
10.00 BSC
11.80
E1
12.20
10.00 BSC
e
L
12.00
0.65 BSC
0.45
0.60
0.75
46 of 47
DS87C530/DS83C530 EPROM/ROM Microcontrollers with Real-Time Clock
DATA SHEET REVISION SUMMARY
REVISION
071107
070505
040104
112299
070798
022097
060895
1)
2)
3)
4)
5)
6)
7)
8)
9)
10)
11)
12)
DESCRIPTION
Corrected P1.5 pin for TQFP package from 4 to 1 (page 5).
Added Pb-free/RoHS-compliant part numbers to Ordering Information table.
Deleted the “A” from the IPC/JEDEC J-STD-020 specification in the Absolute Maximum Ratings.
Removed “Preliminary” status.
Soldering temperature parameter now references JEDEC specification.
Added note to absolute maximums clarifying voltages referenced to ground and storage temperature.
Updated ICC, IIDLE, ISTOP, ISPBG, IIL, and ITL to incorporate errata conditions.
Added note clarifying DC electrical test conditions.
Added note clarifying VOH3 specification applies to first clock cycle following the transition.
Updated AC and MOVX electrical characteristics with final characterization values.
Added tAVLL2 specification and corrected MOVX timing diagrams to show tAVLL2 instead of tAVLL.
Updated IBAT to incorporate errata conditions.
Contact factory for details.
1)
2)
3)
4)
5)
6)
7)
8)
Added DS83C530 to data sheet.
Updated PMM operating current estimates.
Added note to clarify IIL specification.
Added note to prevent accidental corruption of Watchdog Timer count while changing counter length.
Changed IBAT specification to 1μA over extended temperature range.
Changed minimum oscillator frequency to 1MHz when using external crystal.
Changed RST pulldown resistance from 170kΩ to 200kΩ maximum.
Corrected “Data memory write with stretch” diagrams to show falling edge of ALE coincident with
rising edge of C3 clock.
1) Updated ALE pin description.
2) Added note pertaining to erasure window.
3) Added note pertaining to internal MOVX SRAM.
4) Changed Note 6 from RST=5.5V to RST=VCC.
5) Changed Note 10 from RST=5.5V to RST=VCC.
6) Changed serial port mode 0 timing diagram label from tQVXL to tQVXH.
7) Added information pertaining to 52-pin TQFP package.
Initial release.
47 of 47
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
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© 2007 Maxim Integrated Products
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.