Cymbet CBC012-D5C-TR Rechargeable solid state energy storage: 12uah, 3.8v Datasheet

EnerChip™ CBC012
Rechargeable Solid State Energy Storage: 12µAh, 3.8V
Features
•
•
•
•
•
•
All Solid State Construction
SMT Package and Process
Lead-Free Reflow Tolerant
Thousands of Recharge Cycles
Low Self-Discharge
Eco-friendly, RoHS compliant
Electrical Properties
5 mm x 5 mm
DFN SMT Package
Output voltage (nominal):
Capacity (nominal):
Charging source:
Recharge time to 80%:
Charge/discharge cycles:
3.8V
12µAh
4.00V to 4.15V
10 minutes
>5000 to 10% DOD
Package size (DFN):
Operating temperature:
Storage temperature:
5 mm x 5 mm x 0.9 mm
-20°C to 70°C
-40°C to 125°C
Physical Properties
Applications
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•
•
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Standby supply for non-volatile SRAM, real-time
clocks, controllers, supply supervisors, and other
system-critical components.
Wireless sensors and RFID tags and other
powered, low duty cycle applications.
Localized power source to keep microcontrollers
and other devices alert in standby mode.
Power bridging to provide backup power to
system during exchange of primary batteries.
Embedded Energy where bare die can be
embedded into modules or co-packaged with
other ICs
Pin Number(s)
Description
1
V-
2,3,4,5
NIC
6
V+
Note: NIC = No Internal Connection
2.8 mm x 3.5 mm
Bare Die
The EnerChip™ CBC012 is a surface-mount, solid
state, thin film, rechargeable energy storage device
rated for 12µAh at 3.8V. It is ideal as a localized
on-board power source for SRAMs, real-time clocks
and microcontrollers which require standby power
to retain time or data. It is also suitable for RFID
tags, smart sensors, and remote applications which
require a miniature, low-cost, and rugged power
source. For many applications, the CBC012 is a
superior alternative to button cell batteries and
super-capacitors.
Because of their solid state design, EnerChip™
storage devices are able to withstand solder reflow
temperatures and can be processed in highvolume manufacturing lines similar to conventional
semiconductor devices. There are no harmful gases,
liquids or special handling procedures, in contrast to
traditional rechargeable batteries.
The CBC012 is based on a patented, all solid state,
rechargeable energy cell with a nominal 3.8V output.
Recharge is fast and simple, with a direct connection
to a 4.1V voltage source and no current limiting
components. Recharge time is 10 minutes to 80%
capacity. Robust design offers thousands of charge/
discharge cycles. The CBC012 is packaged in a 5 mm
x 5 mm 6-pin DFN package. It is shipped in tubes,
tape-and-reel, or waffle pack trays.
6 5
+
4
1
2
3
CBC012 Schematic Representation
Top View
©2009-2010 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev A
Page 1 of 5
EnerChip™ CBC012 Solid State Energy Storage
Operating Characteristics
Condition
Min
Typical
Max
Units
Discharge Cutoff Voltage
Parameter
25°C
3.0(1)
-
-
V
Charge Voltage
25°C
4.0
4.1
4.3
V
Pulse Discharge Current
25°C
100(3)
-
-
µA
Cell Resistance (25°C)
Charge cycle 2
-
2.8
4.5
Charge cycle 1000
-
13
20
Non-recoverable
-
2.5
Recoverable
-
1.5
Operating Temperature
-
-20
Storage Temperature
-
-40
10% depth-of-discharge
Self-Discharge (5-yr average; 25°C)
Recharge Cycles
(to 80% of rated
capacity; 4.1V charge
voltage)
25°C
40°C
Recharge Time (to 80% of rated capacity;
4.1V charge voltage)
Capacity
(2)
kΩ
-
% per year
-
% per year
25
+70
°C
-
+125(5)
°C
5000
-
-
cycles
50% depth-of discharge
1000
-
-
cycles
10% depth-of-discharge
2500
-
-
cycles
50% depth-of-discharge
500
-
-
cycles
Charge cycle 2
-
10
22
Charge cycle 1000
-
45
70
12
-
-
50µA discharge; 25°C
(4)
(1)
Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation.
(2)
Charging at 4.0V will charge the cell to approximately 70% of its rated capacity.
(3)
Typical pulse duration = 20 milliseconds.
(4)
First month recoverable self-discharge is 4% average.
(5)
Storage temperature is for uncharged EnerChip.
minutes
µAh
Note: All specifications contained within this document are subject to change without notice
EnerChip Discharge Characteristics
©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev A
Page 2 of 5
EnerChip™ CBC012 Solid State Energy Storage
Package Dimensions - 6-pin DFN (package code D5)
Pin Number(s)
Description
1
V-
2,3,4,5
NIC
6
V+
Notes:
1. All linear dimensions are in millimeters.
2. Drawing is subject to change without notice.
Note: NIC = No Internal Connection
Printed Circuit Board (PCB) Layout Guidelines and Recommendations
Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup
energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering
power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the
board following soldering.
The PCB layout can make this problem worse if the cell’s positive and negative terminals are routed near each
other and under the package, where it is difficult to wash the flux residue away. An undesirable example is
shown in Figure 1. The negative connection on the EnerChip is routed from the negative pad to a via placed
under the package near the positive pad. In this scenario, solder flux residue can wick from the positive solder
pad, covering both the positive pad and the via. This results in a high resistance current path between the
EnerChip terminals. This current path will make the cell appear to be defective or make the application circuit
appear to be drawing too much current.
To avoid this situation, make sure positive and negative traces are routed outside of the package footprint,
as shown in Figure 2, to ensure that flux residue will not cause a discharge path between the positive and
negative pads.
Similarly, a leakage current path can exist from the package lead solder pads to the exposed die pad on the
underside of the package as well as any solder pad on the PCB that would be connected to that exposed die
pad during the reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a
solder pad in the region where the exposed die pad of the package will land. It is sufficient to place PCB solder
pads only where the package leads will be. That region of the PCB where the exposed die pad will land must
not have any solder pads, traces, or vias.
©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev A
Page 3 of 5
EnerChip™ CBC012 Solid State Energy Storage
When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of
the package and all metal pads. Failure to observe this precaution can result in package cracking during solder
reflow due to the silk screen material interfering with the solder solidification process during cooling.
Figure 1: Improper PCB traces resulting in an
undesirable parasitic leakage path.
Figure 2: Proper PCB traces, precluding the
formation of a parasitic leakage path.
For the CBC012-D5C the PCB layout of Figure 3 is recommended. Note that there should not be a center pad
on the PCB that could contact the exposed die pad on the D5C package. Again, this is to reduce the possible
number and severity of leakage paths between the EnerChip terminals.
Figure 3: Recommended PCB layout to accommodate CBC012 package
Soldering, Rework, and Electrical Test
Refer to the Cymbet User Manual for soldering, rework, and replacement of the EnerChip on printed circuit
boards, and for instructions on in-circuit electrical testing of the EnerChip.
©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev A
Page 4 of 5
EnerChip™ CBC012 Solid State Energy Storage
Ordering Information
EnerChip Part Number
Description
Notes
CBC012-D5C
12µAh EnerChip in 6-pin M8 DFN, tube
Package for new designs
CBC012-D5C-TR
12µAh EnerChip in 6-pin M8 DFN, Tape/Reel
Package for new designs
CBC012-D5C-WP
12µAh EnerChip in 6-pin M8 DFN, Waffle Pack
Package for new designs
CBC012-BDC-WP
12µAh EnerChip Bare Die, Waffle Pack
Contact Cymbet
CBC012-BUC-WP
12µAh EnerChip Bumped Bare Die, Waffle Pack
Contact Cymbet
Disclaimer of Warranties; As Is
The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any
kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the
implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of
dealing, course of performance, or usage of trade. Cymbet EnerChip products are not approved for use in life critical applications. Users
shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted
for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and
any use of the Cymbet EnerChip product described herein in any such product or applications.
Cymbet, the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation. All Rights Reserved
©2009-2010Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev A
Page 5 of 5
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