12-Bit, Multichannel, DAC/ADC Temperature Sensor and Current Sense for Monitor and Control Applications AD7294 Preliminary Technical Data FEATURES GENERAL DESCRIPTION 4-channel 12-bit DAC Guaranteed monotonic 10 μs settling time 10 mA sink and source capability Offset in for range adjustment Output span: 5 V in 0 to 15 V range 9-channel, 12-bit ADC 200 kSPS throughput Input range: 0 to VREF, 0 to 2 VREF Differential/single-ended Limit registers per channel 2 high-side current sense 48 V max operation ±1% FS accuracy ±200 mV input range 3-channel temperature sensor Diode temperature measurement ±2°C accuracy Measurement range: −10°C to +90°C Internal 2.5 V reference I2C®-compatible serial interface Temperature range: −40°C to +105°C Alert function Package type: LFCSP-56, TQFP-64 The AD7294 contains all the functions required for generalpurpose monitoring and control of current, voltage, and temperature integrated into a single-chip solution. The part includes low voltage (±200 mV) analog-input sense amplifiers for current monitoring across shunt resistors, temperature-sense inputs, and four uncommitted analog input channels multiplexed into a 200 kSPS SAR ADC. An internal low ppm reference is provided to drive both the DAC and ADC. Four 12-bit DACs provide the outputs for voltage control. The AD7294 also includes limit registers for alarm functions. The part is designed on a high voltage DMOS process for a high voltage compliance, 48 V on the current-sense inputs, and up to 15 V DAC output voltage. The part is ideal for bias current control of the power transistors used in power amplifiers employed in CDMA, GSM, EDGE, and UMTS cellular base stations. The DACs provide digital control with 1.2 mV resolution to control the bias currents of the power transistors. They can also be used to provide control voltages for variable gain amplifiers or impedance match networks in the main signal chain. Thermal diode based temperature sensors are incorporated to compensate for temperature effects. The ADC monitors the high-side current and temperature. All this functionality is provided in a 56-lead LFCSP package and a 64-lead TQFP package operating over a temperature range of −40°C to +105°C. APPLICATIONS Cellular base station (GSM, EDGE, UMTS, CDMA) Point-to-multipoint and other RF transmission systems 12 V, 24 V, 48 V automotive applications Industrial control FUNCTIONAL BLOCK DIAGRAM R Sense VPP(1-2) RS1(+) RS1(-) REFOUT/ REFIN ADC RS2(+) RS2(-) REFOUT/ REFIN DAC AVDD(1-5) AGND(1-9) V+(1-2) RF CHOKE HIGH SIDE CURRENT SENSE HIGH SIDE CURRENT SENSE 2.5V REF 12-BIT DAC ISENSE2 OVER-RANGE ISENSE1 OVER-RANGE VIN 0 VIN 1 VIN 2 VIN 3 D1 (+) RF OUT 200K VOUT A FILTER SET-POINT 240mV 100K LDMOS 200K OFFSET IN A 12-BIT ADC MUX 12-BIT DAC 100K 200K VOUT B FILTER 100K D0 (+) T1 100K OFFSET IN B LIMIT REGISTERS T0 12-BIT DAC TEMP SENSOR D0 (-) LDMOS 200K 100K 100K 200K VOUT C GAIN CONTROL 200K OFFSET IN C D1 (-) 12-BIT DAC CONTROL LOGIC AD7294 DVDD 100K I2C INTERFACE PROTOCOL DGND(1-2) SDA SCL A2 A1 A0 100K 200K VOUT D IMPEDANCE MATCH 200K OFFSET IN D CAP ALERT Figure 1. Typical Configuration for AD7294 in Cellular Base Station RF LDMOS Power Amplifier Control Rev. PrB Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved. AD7294 Preliminary Technical Data TABLE OF CONTENTS Features .............................................................................................. 1 Gain Control Of PA ................................................................... 24 Applications....................................................................................... 1 Analog Comparator Loop ......................................................... 24 General Description ......................................................................... 1 Register Setting ............................................................................... 25 Functional Block Diagram .............................................................. 1 Address Point Register............................................................... 25 Revision History ............................................................................... 2 ADC Channel Allocation.......................................................... 25 Specifications..................................................................................... 3 Command Register .................................................................... 26 DAC Specifications....................................................................... 3 Result Register ............................................................................ 26 ADC Specifications ...................................................................... 4 TSENSE1, TSENSE2 Result Registers................................................ 28 General Specifications ................................................................. 7 TSENSEINT Result Register .......................................................... 28 Timing Characteristics, ................................................................ 8 TSENSE Offset Registers ................................................................ 28 Absolute Maximum Ratings............................................................ 9 Alert Status Registers ................................................................. 28 ESD Caution.................................................................................. 9 Channel Sequence Register....................................................... 28 Pin Configuration and Function Descriptions........................... 10 Configuration Register .............................................................. 28 Terminology .................................................................................... 12 Sample Delay and Bit Trial Delay............................................. 30 System Description......................................................................... 13 Power-Down Register ................................................................ 30 ADC Information....................................................................... 14 DATAHIGH/DATALOW Register ................................................... 30 ADC Operation .......................................................................... 14 Hysteresis Registers.................................................................... 31 ADC Transfer Functions ........................................................... 14 Serial Bus Interface......................................................................... 32 Analog Inputs.............................................................................. 15 General I2C Timing.................................................................... 32 Digital Inputs .............................................................................. 17 Serial Bus Address Byte ............................................................. 33 VDRIVE ............................................................................................ 17 Writing/Reading to the AD7294 .............................................. 34 DAC Operation........................................................................... 18 Modes Of Operation ...................................................................... 40 Current Sensor............................................................................ 19 Mode 1 – Command Mode....................................................... 40 Temperature Sensor ................................................................... 20 Mode 2 – Autocycle Mode ........................................................ 41 Reference for ADC/DAC........................................................... 21 Layout and Configuration............................................................. 42 Analog Comparator Loop ......................................................... 22 Power Supply Bypassing and Grounding................................ 42 Applications..................................................................................... 23 Evaluation Board For the AD7294............................................... 43 Typical RF Front-End Application........................................... 23 Outline Dimensions ....................................................................... 47 REVISION HISTORY 10/05—Revision PrA: Preliminary Version Rev. PrB | Page 2 of 45 Preliminary Technical Data AD7294 SPECIFICATIONS DAC SPECIFICATIONS1 AVDD = DVDD 4.5 V to 5.5 V, AGND = DGND= 0 V, external 2.5 V reference. Temperature range for B version: −40°C to +105°C. All specifications TMIN to TMAX, unless otherwise noted. Offset pin is open, so range is from 0 to 5V. Table 1. Parameter ACCURACY Resolution Relative Accuracy (INL) Differential Nonlinearity (DNL) Zero-Scale Error Full-Scale Error Offset Error Offset Error TC Gain Error Gain Temperature Coefficient DC Crosstalk DAC OUTPUT CHARACTERISTICS Output Voltage Range Output Voltage Span Output Voltage Settling Time Slew Rate Output Noise Spectral Density Short-Circuit Current Load Current Capacitive Load Stability RL = ∞ DC Output Impedance Power Supply Sensitivity ∆Vout/∆ΑVDD OFFSET INPUT Input Range Min Typ Max 12 ±4 ±1 4 TBD ±4 1 Guaranteed monotonic Measured in the linear region 0.5 5 15 V V With a 2.5 V internal reference The 5 V o/p voltage range can be positioned on the span by the offset 40 ±10 mA mA FS current shorted to ground Source/Sink within 200 mV of supply 1000 0.5 pF Ω ±0.024 2 TBD TBD TBD –85 dB 0 5 DC Input Impedance REFERENCE Reference Output Voltage Reference Input Voltage Range DC Leakage Current Input Capacitance VREF Output Impedance Reference Temperature Coefficient Bits LSB LSB mV Test Conditions / Comments mV µV/°C % FSR ppm FSR/°C LSB ±5 0 0 Unit 75 2.49 0.1 2.51 2.5 ±30 20 25 25 Guaranteed by design and characterization; not subject to production testing. Rev. PrB | Page 3 of 45 V V kΩ V V µA pF Ω ppm/°C VOUT = 3 VOFFSET − 2VREF + VDAC 10 ppm/°C typ AD7294 Preliminary Technical Data ADC SPECIFICATIONS1 AVDD = DVDD 4.5 V to 5.5 V, AGND = DGND= 0 V, external 2.5 V reference. Temperature range for B version: −40°C to +105°C. All specifications TMIN to TMAX, unless otherwise noted. Parameter ACCURACY Resolution Integral Nonlinearity (INL) Min Typ Max Unit 12 ±0.5 ±1 Bits LSB ±1 LSB ±3 ±2 TBD 3 VREF or 2 VREF ±1 LSB LSB LSB μS V pF µA ±2 °C ±2 °C Differential Nonlinearity (DNL) Offset Error Gain Error Total Unadjusted Error (TUE) Conversion Rate Analog Input Range Input Capacitance DC Input Leakage Current TEMPERATURE SENSOR Accuracy 0 30 Accuracy Resolution Low Level Output Current Source Medium Level Output Current Source High Level Output Current Source CURRENT SENSE Common-Mode Input Range Full-Scale Sense Voltage RS(+) and RS(−) Input Bias Current CMRR / PSRR Maximum Series Resistance for external diode Gain Accuracy Offset Bandwidth Amplifier Equivalent RMS Noise REFERENCE Reference Output Voltage Reference Input Voltage Range DC Leakage Current Input Capacitance VREF Output Impedance Reference Temperature Coefficient 11 8 32 Bits µA µA 128 µA AVDD 48 Differential Mode Single Ended or Pseudo-Differential Mode Differential Mode Single Ended or Pseudo-Differential Mode External temperature sensors × 2 TA = −10°C to +90°C Internal temperature sensor TA = −10°C to +90°C 0.25 °C LSB size 10 V mV µA dB kΩ ±1 % FS TA = TMIN to TMAX 0.8 kHz LSB 60 µV RMS referred to input V V µA pF Ω ppm/°C 10 ppm/°C typ 200 25 80 300 2.49 0.1 Test Conditions / Comments 2.51 2.5 ±30 20 25 25 Rev. PrB | Page 4 of 45 ±200 mV Full Scale Voltage Pin connected to power supply Preliminary Technical Data AD7294 GENERAL SPECIFICATIONS1 AVDD = DVDD 4.5 V to 5.5 V, AGND = DGND= 0 V, external 2.5 V reference. Temperature range for B version: −40°C to +105°C. All specifications TMIN to TMAX, unless otherwise noted. Parameter LOGIC INPUTS (SDA, SCL ONLY) VIH, Input High Voltage VIL, Input Low Voltage IIN, Input Leakage Current VHYST, Input Hysteresis CIN, Input Capacitance Glitch Rejection Min Typ 0.7 VDRIVE 0.3 VDRIVE ±1 0.05 DVDD 8 50 LOGIC OUTPUTS (SDA, ALERT, FAULT) VOL, Output Low Voltage Three-State Leakage Current Three-State Output Capacitance POWER REQUIREMENTS VPP AVDD V(+) DVDD VDRIVE IPP AIDD DIDD AIDD (Power-Down) DIDD (Power-Down) Power Dissipation 1 Max V V µA V pF ns 0.4 0.6 ±1 V V µA pF 48 5.5 16.5 5.5 5.5 V V V V V 1 5 5 TBD mA mA µA µA mW 8 AVDD 4.5 4.5 4.5 3 TBD TBD Unit Guaranteed by design and characterization; not subject to production testing. Rev. PrB | Page 5 of 45 Test Conditions / Comments Input filtering suppresses noise spikes of less than 50 ns ISINK = 3 mA ISINK = 6 mA Outputs unloaded VIH = DVDD, VIL = DGND AD7294 Preliminary Technical Data TIMING CHARACTERISTICS1,2 I2C Serial Interface DVDD = 4.5 V to 5.5 V, AGND = DGND = 0 V. All specifications TMIN to TMAX, unless otherwise noted. Table 2. Parameter FSCL t1 t2 t3 t4 t5 t63 t7 t8 t9 t10 t11 Cb Limit at TMIN, TMAX 400 2.5 0.6 1.3 0.6 100 0.9 0 0.6 0.6 1.3 300 0 300 0 300 20 + 0.1Cb4 400 Unit kHz max µs min µs min µs min µs min ns min µs max µs min µs min µs min µs min ns max ns min ns max ns min ns max ns min pF max Description SCL clock frequency SCL cycle time tHIGH, SCL high time tLOW, SCL low time tHD,STA, start/repeated start condition hold time tSU,DAT, data set-up time tHD,DAT, data hold time tHD,DAT, data hold time tSU,STA, set-up time for repeated start tSU,STO, stop condition set-up time tBUF, bus free time between a stop and a start condition tR, rise time of SCL and SDA when receiving tR, rise time of SCL and SDA when receiving (CMOS compatible) tF, fall time of SDA when transmitting tF, fall time of SDA when receiving (CMOS compatible) tF, fall time of SCL and SDA when receiving tF, fall time of SCL and SDA when transmitting Capacitive load for each bus line 1 Guaranteed by design and characterization; not subject to production test. See Figure 2. A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal) to bridge the undefined region of SCL’s falling edge. 4 Cb is the total capacitance in pF of one bus line. tR and tF are measured between 0.3 DVDD and 0.7 DVDD. 2 3 SDA t9 t3 t10 t11 t4 SCL t2 t1 t5 START CONDITION REPEATED START CONDITION STOP CONDITION Figure 2. I2C-Compatible Serial Interface Timing Diagram 200µA IOL VOH (MIN) OR VOL (MAX) TO OUTPUT PIN CL 50pF 200µA t8 t7 IOH Figure 3. Load Circuit for Digital Output Rev. PrB | Page 6 of 45 03731-0-007 t6 03731-0-003 t4 Preliminary Technical Data AD7294 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted.1 Table 3. Parameter VPP to AGND AVDD to AGND V(+) to AGND DVDD to DGND Digital Inputs to DGND SDA/SCL to DGND Digital Outputs to DGND RS(+)/RS(−) to AGND REFIN to AGND AGND to DGND VOUTx to AGND Analog Inputs to AGND Operating Temperature Range Commercial (B Version) Storage Temperature Range Junction Temperature (TJ Max) LFCSP-56 Package θJA Thermal Impedance θJC Thermal Impedance Reflow Soldering Peak Temperature 1 Rating −0.3 V to +70 V −0.3 V to +7 V −0.3 V to +17 V −0.3 V to +7 V −0.3 V to DVDD + 0.3 V −0.3 V to + 7 V −0.3 V to DVDD + 0.3 V −0.3 V to VPP + 0.3 V −0.3 V to AVDD + 0.3 V −0.3 V to +0.3 V −0.3 V to AVDD + 0.3 V −0.3 V to AVDD + 0.3 V Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. −40°C to +105°C −65°C to +150°C 150°C 30°C/W 2.9°C/W 230°C Transient currents of up to 100 mA do not cause SCR latch-up. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. PrB | Page 7 of 45 AD7294 Preliminary Technical Data 56 VPP2 55 VPP1 54 RS1(-) 53 RS1(+) 52 NC 51 AGND7 50 AVDD5 49 AGND6 48 DCAP 47 REFOUT / REFIN ADC 46 VIN0 45 VIN1 44 VIN2 43 VIN3 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RS2 (-) RS2(+) NC AVDD1 AGND1 AGND2 AVDD2 D2(-) D2(+) D1(+) D1(-) AGND3 AVDD3 REFOUT / REFIN DAC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PIN 1 INDICATOR AD7294 TOP VIEW (Not to scale) 42 41 40 39 38 37 36 35 34 33 32 31 30 29 NC ISENSE 1 OVERRANGE ISENSE 2 OVERRANGE DVDD DGND VDRIVE OPGND SCL SDA (I2C) / SDI (SPI) AS0 (I2C) / SDO (SPI) AS1 (I2C) / CSB (SPI) AS2 (I2C) / ALERT (SPI) ALERT (I2C) / AGND6 (SPI) AGND5 OFFSET IN A 15 VOUT A 16 DAC OUT GND AB 17 DAC OUT V+ AB 18 VOUT B 19 OFFSET IN B 20 AGND 4 21 AVDD4 22 OFFSET IN C 23 VOUT C 24 DAC OUT V+ CD 25 DAC OUT GND CD 26 VOUT D 27 OFFSET IN D 28 NC = NO CONNECT Figure 4. Table 4. Pin Function Descriptions Pin No. 1, 54 2, 53 3, 42, 52 4, 7, 13, 22, 50 Mnemonic RS2(−), RS1(−) RS2(+), RS1(+) NC AVDD1 to AVDD5 5, 6, 12, 21, 29, 49, 51 8, 11 9, 10 14 AGND 1 to AGND7 15, 20, 23, 28 16, 19, 24, 27 17, 18 D2(−), D1(−) D2(+), D1(+) REFOUT/REFIN DAC OFFSET IN A to OFFSET IN D VOUT A to VOUT D 30 DAC OUT GND AB, DAC OUT V+ AB DAC OUT V+ CD, DAC OUT GND CD ALERT 31 to 33 AS2, AS1, AS0 34 35 SDA SCL 25, 26 Description Low-Side Connection for External Sense Resistor. High-Side Connection for External Sense Resistor. No Connection Analog Supply Pins. These pins should be decoupled with a 0.1 µF ceramic capacitor and a 10 µF tantalum capacitor. Operating range is 4.5 V to 5.5 V. Analog Ground Reference Point. All AGND pins should be connected externally to the AGND plane. Analog Input. Connected to cathodes of the external temperature-sensing diodes. Analog Input. Connected to anodes of the external temperature-sensing diodes. The AD7294 contains a REFOUT/REFIN DAC pin common to all four DAC channels. When the internal reference is selected, this pin is the reference output. If the application requires an external reference, it can be applied to this pin, and the internal reference can be disabled via the control register. The default for this pin is a reference input. Used to set the desired output range for each DAC channel. Input range is 0 V to 5 V. Buffered Analog Outputs for DAC Channels A to D. Each analog output is driven by an output amplifier that can be offset using the offset in pin. DACs provide 12-bit resolution in a 5 V range, providing an output voltage from 0 V to 15 V. Each output is capable of sourcing and sinking 10 mA and driving a 1,000 pF load. Analog Supply Pins for Output Amplifiers on VOUTA and VOUTB. Analog Supply Pins for Output Amplifiers on VOUTC and VOUTD. Digital Output. This pin acts as an out-of-range indicator and becomes active when a conversion result violates the DATAHIGH or DATALOW register values associated with each channel input. Logic Inputs. These inputs are used to select unique addresses for the AD7294. Device address depends on the voltage applied to these pins. Digital I/O. Serial bus bidirectional data. Open-drain output. Digital Input. Serial bus clock. The data transfer rate in I2C mode is compatible with both 100 kHz Rev. PrB | Page 8 of 45 Preliminary Technical Data Pin No. Mnemonic 36 37 OPGND VDRIVE 38 39 DGND DVDD 40, 41 43 to 46 ISENSE1 Overrange, ISENSE2 Overrange VIN3 to VIN0 47 REFOUT/REFIN ADC 48 DCAP 55, 56 VPP1, VPP2 AD7294 Description and 400 kHz operating modes. Dedicated Ground Pin for I2C Interface. This pin should be connected to the supply that the I2C bus is pulled up to. This is not a supply pin in I2C mode—it just sets up the input threshold levels. Ground for All Digital Circuitry. Logic Power Supply. Guaranteed operating range is 2.7 V to 5.5 V. It is recommended that these pins be decoupled with 0.1 µF ceramic and 10 µF tantalum capacitors to DGND. Outputs from Fault Comparators Connected to High-Side Current Sense Amplifiers. Single-Ended Analog Inputs with Input Range from 0 V to REFIN/REFOUT ADC. The AD7294 contains REFOUT/REFIN ADC pin for the ADC. When the internal reference is selected, this pin is the reference output. If the application requires an external reference, it can be applied to this pin, and the internal reference can be disabled via the control register. The default for this pin is a reference input. External Decoupling Capacitor Input for Internal Temperature Sensor. A 0.1 μF capacitor to AGND should be connected to this pin. Analog Supply Pins. Power supply pins for the high-side current sense amplifiers. Operating range is from AVDD to +60 V. Rev. PrB | Page 9 of 45 AD7294 Preliminary Technical Data TERMINOLOGY Integral Nonlinearity The maximum deviation from a straight line passing through the endpoints of the ADC/DAC transfer function. The endpoints are zero scale, a point 1 LSB. below the first code transition, and full scale, a point 1 LSB above the last code transition. Digital-to-Analog Glitch Impulse Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV-s and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x2000 to 0x1FFF). Differential Nonlinearity Differential nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. Digital Feedthrough Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC, but is measured when the DAC output is not updated. It is specified in nV-s and is measured with a full-scale code change on the data bus—from all 0s to all 1s or vice versa. Gain Error Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from ideal, expressed as a percentage of the full-scale range. Gain Error Match The difference in gain error between any two channels. Zero-Code Error Zero-code error is a measure of the output error when zero code (0x000) is loaded into the DAC register. Ideally, the output should be 0 V. Zero-code error is due to a combination of the offset errors in the DAC and output amplifier. Zero-code error is expressed in mV. Full-Scale Error Full-scale error is a measure of the output error when full-scale code (0xFFFF) is loaded into the DAC register. Ideally, the output should be VDD − 1 LSB. Full-scale error is expressed in mV. Zero-Code Error Drift Zero-code error drift is a measure of the change in zero-code error with a change in temperature. It is expressed in µV/°C. Gain Error Drift Gain error drift is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C. Channel-to-Channel Isolation A measure of the level of crosstalk between channels, taken by applying a full-scale sine wave signal to the unselected input channels and determining how much of the 108 Hz signal is attenuated in the selected channel. The sine wave signal applied to the unselected channels is then varied from 1 kHz up to 2 MHz, and each time it is determined how much of the 108 Hz signal in the selected channel is attenuated. This figure represents the worst-case level across all channels. Aperture Delay The measured interval between the sampling clock’s leading edge and the point at which the ADC takes the sample. Aperture Jitter The sample-to-sample variation in the effective point in time at which the sample is taken. Offset Error The deviation of the first code transition (00 … 000) to (00 … 001) from the ideal—that is, AGND + 1 LSB. Offset Error Match The difference in offset error between any two channels. Rev. PrB | Page 10 of 45 Preliminary Technical Data AD7294 SYSTEM DESCRIPTION R Sense VPP(1-2) RS1(+) RS1(-) REFOUT/ REFIN ADC RS2(+) RS2(-) REFOUT/ REFIN DAC AVDD(1-5) AGND(1-9) V+(1-2) RF CHOKE HIGH SIDE CURRENT SENSE HIGH SIDE CURRENT SENSE 2.5V REF 12-BIT DAC FAULT2 FAULT1 100K RF OUT 200K VOUT A LDMOS FILTER SET-POINT 240mV 100K 200K OFFSET IN A VIN 0 VIN 1 VIN 2 VIN 3 D1 (+) 12-BIT ADC MUX 100K 200K VOUT B FILTER 100K D0 (+) T1 12-BIT DAC LIMIT REGISTERS T0 TEMP SENSOR D0 (-) LDMOS 200K OFFSET IN B 12-BIT DAC 100K 100K 200K VOUT C GAIN CONTROL 200K OFFSET IN C D1 (-) 12-BIT DAC CONTROL LOGIC AD7294 DVDD DGND(1-2) 100K I2C INTERFACE PROTOCOL SDA SCL A2 A1 A0 100K 200K VOUT D IMPEDANCE MATCH 200K OFFSET IN D CAP ALERT Figure 5. System Diagram The AD7294 contains all the functions required for generalpurpose monitoring and control of current, voltage, and temperature integrated into a single-chip solution. The part includes low voltage (±200 mV) analog-input sense amplifiers for current monitoring across shunt resistors, temperaturesense inputs, and four uncommitted analog input channels multiplexed into a 200 kSPS SAR ADC. Four 12-bit DACs provide the outputs for voltage control and complete the analog-to-digital digital-to-analog control loop. The DACs provide digital control with 1.2 mV resolution to control the bias currents of the power transistors; they can also be used to provide control voltages for variable gain amplifiers or impedance-match networks in the main signal chain. An internal, 2.5 V, low ppm reference is provided to drive both the DAC and ADC. This internal reference can be overdriven when an external reference is required. The AD7294 also includes limit registers for alarm functions. Using alert registers, the AD7294 flags an alert signal when the ADC readings go above or below predetermined values. The analog input range for the ADC can be selected to be a 0 V to VREF or 0 V to a 2×VREF input, configured with either single-ended or differential analog inputs. To compensate for temperature effects, one local on-chip, band gap, temperature sensor and two remote, diode based, temperature sensors can alternatively be selected. The high side current sense is specified to manage LDMOS FETs up to 48 V with bias currents ranging from 300 mA to 800 mA and gate voltages of 4 V to 9 V. The part is designed on a high voltage DMOS process for high voltage compliance, 60 V on the current-sense inputs, and up to 15 V DAC output voltage. The ADC monitors the high-side current and temperature sensors as shown in Figure 6. If the temperature of, for example, an LDMOS High Power Amplifier (HPA) transistor rises above predetermined limits, out of limit comparisons generate flags. The on-chip DAC will use the digital correction loop to decrease the VGS of the device to maintain the desired output voltage. An external resistor is used to sense the transistors drain current and so automatically control the gate bias voltage of the device. VDD CURRENT SENSE RSENSE RF CHOKE ADC TEMP SENSE VOUTPUT DAC VDRIVE HPA Figure 6. Simplified Diagram of System The part is ideal for bias current control of the power transistors in power amplifiers employed in CDMA, GSM, EDGE, and UMTS cellular base stations. The I2C digital interface allows the flexibility of programming the bias points using an external controller. The I2C bus also allows a number of devices to be connected in parallel to control multiple FETS, the standard in single-carrier and multi-carrier base station systems. Rev. PrB | Page 11 of 45 AD7294 Preliminary Technical Data ADC INFORMATION The AD7294 consists of a successive 200 kSPS approximation analog-to-digital converter based around a capacitive DAC. The analog input range for the part can be selected to be a 0 V to VREF input or a 2 × VREF input, configured with either single-ended or differential analog inputs. The AD7294 has an on-chip 2.5 V reference that can be n when an external reference is preferred. If the internal reference is to be used elsewhere in a system, the output must be buffered first. When the ADC starts a conversion, as shown in Figure 9, SW3 opens, and SW1 and SW2 move to Position B, causing the comparator to become unbalanced. Both inputs are disconnected once the conversion begins. When the comparator is rebalanced, the conversion is complete. The control logic generates the ADC output code. The output impedances of the sources driving the VIN+ and VIN− pins must be matched; otherwise, the two inputs will have different settling times, resulting in errors. The various monitored and uncommitted input signals are multiplexed into the ADC. The nine channel-allocation address bits select which analog input channel to convert using the multiplexer. Four uncommitted analog input channels are multiplexed to the ADC, VIN (0 to 3). These four channels allow differential and pseudodifferential mode measurements of various system signals. CAPACITIVE DAC VIN– COMPARATOR CS B VIN+ A SW1 A SW2 CS CONTROL LOGIC SW3 VREF Figure 7 shows a very simplified schematic of the ADC. The control logic, SAR and capacitive DACs are used to add and subtract fixed amounts of charge from the sampling capacitor arrays to bring the comparator back to a balanced condition. CAPACITIVE DAC VIN Figure 9. ADC Conversion Phase ADC TRANSFER FUNCTIONS The designed code transitions occur at successive integer LSB values (1 LSB, 2 LSB, and so on). In single-ended mode, the LSB size is VREF/4,096 when the 0 V to VREF range is used and 2 × VREF/4,096 when the 0 V to 2 × VREF range is used. COMPARATOR VREF CAPACITIVE DAC 04603-014 B ADC OPERATION SWITCHES 111...111 SAR Figure 7. Simplified ADC Block Diagram Figure 8 and Figure 9 show simplified schematics of the ADC during its acquisition and conversion phases in differential mode, respectively. Figure 8 shows the ADC during its acquisition phase. SW3 is closed, SW1 and SW2 are in Position A, the comparator is held in a balanced condition, and the sampling capacitor arrays acquire the differential signal on the input. 111...000 1LSB = VREF/4096 011...111 000...010 000...001 000...000 0V 1LSB VREF – 1LSB ANALOG INPUT NOTE 1. VREF IS EITHER VREF OR 2 × VREF. 04603-027 OUTPUT DATA 14-BIT PARALLEL ADC CODE CONTROL LOGIC CONTROL INPUTS 02642-0-013 111...110 Figure 10. Straight Binary Transfer Characteristic CAPACITIVE DAC CS B VIN– A SW1 A SW2 CS CONTROL LOGIC SW3 B VREF CAPACITIVE DAC 04603-013 VIN+ COMPARATOR In differential mode, the LSB size is 2 × VREF /4,096 when the 0 V to VREF range is used and 4 × VREF/4,096 when the 0 V to 2 × VREF range is used. The ideal transfer characteristic for the ADC when outputting straight binary coding is shown in Figure 10, and the ideal transfer characteristic for the ADC when outputting twos complement coding is shown in Figure 11 (this is shown with the 2 × VREF range). Figure 8. ADC Acquisition Phase Rev. PrB | Page 12 of 45 Preliminary Technical Data AD7294 1LSB = 2 × VREF/4096 +2.5V R 011...111 +1.25V 011...110 0V VIN 3R –1.25V ADC CODE 0V R VA1 AD7294 1 VB6 DCAP A/DCAP B R 000...001 000...000 111...111 0.47µF +VREF – 1 LSB ANALOG INPUT Figure 11. Twos Complement Transfer Characteristic with VREF ± VREF Input Range For Channels 1 to 4 in single-ended mode, the output code is straight binary, where 000 = 0 V, FFF = VREF. In differential mode, the code is twos complement, where 000 =0 V, 7FF = +VREF, 800 = −VREF, and FFF = 0 V − 1 LSB. Channels 5 and 6 are twos complement, where 000 = 0 mV, 7FF = +200 mV, 800 = −200 mV, and FFF = 0 V − 1 LSB. 1ADDITIONAL PINS OMITTED FOR CLARITY. Figure 12. Single-Ended Mode Connection Diagram Differential Mode The AD7294 can have two differential analog input pairs. Differential signals have some benefits over single-ended signals, including noise immunity based on the device’s common-mode rejection and improvements in distortion performance. Figure 13 defines the fully differential analog input of the AD7294. VREF p-p Channels 7 to 9 are twos complement with LSB = 0.25°C, where 000 = 0°C, 7FF = +255.75°C, 800 = −256°C, and FFF = −0.25°C. VIN+ AD7294 1 COMMON MODE VOLTAGE VREF p-p VIN– ANALOG INPUTS The AD7294 has a total of four analog inputs. Depending on the configuration register setup, they can be configured as two single-ended inputs, two pseudodifferential channels or two fully differential channels. See the Register Setting section for further details. Single-Ended Mode The AD7294 can have four single-ended analog input channels. In applications where the signal source has high impedance, it is recommended to buffer the analog input before applying it to the ADC. The analog input range can be programmed to be either 0 to VREF or 0 to 2 × VREF.In 2 × Vref mode, the input is effectively divided by 2 before the conversion takes place, so the input range becomes 0 to 2 × VREF. Note that the voltage on the input channel pins with respect to GND cannot exceed VDD. If the analog input signal to be sampled is bipolar, the internal reference of the ADC can be used to externally bias up this signal so that it is correctly formatted for the ADC. Figure 12 shows a typical connection diagram when operating the ADC in single-ended mode. 1ADDITIONAL PINS OMITTED FOR CLARITY. 04603-020 100...000 –VREF + 1LSB VREF – 1LSB 04603-028 100...001 04603-019 100...010 Figure 13. Differential Input Definition The amplitude of the differential signal is the difference between the signals applied to the VIN+ and VIN− pins in each differential pair (VIN+ − VIN−). For the various differential modes, refer to the ADC Channel Allocation section. The resulting converted data is stored in 2s complement format in the Result Register. VIN+ and VIN− should be driven simultaneously by two signals each of amplitude VREF (or 2 × VREF, depending on the range chosen) that are 180° out of phase. Assuming the 0 to VREF range is selected, the amplitude of the differential signal is therefore −VREF to +VREF peak-to-peak (2 × VREF), regardless of the common mode (CM). The common mode is the average of the two signals (VIN+ + VIN−)/2 And is therefore the voltage on which the two inputs are centered. This results in the span of each input being CM ± VREF/2. This voltage has to be set up externally, and its range varies with the reference value, VREF. As the value of VREF increases, the commonmode range decreases. When driving the inputs with an amplifier, the actual common-mode range is determined by the amplifier’s output voltage swing. Rev. PrB | Page 13 of 45 AD7294 Preliminary Technical Data When a conversion takes place, the common mode is rejected, resulting in a virtually noise-free signal of amplitude −VREF to +VREF, corresponding to the digital codes of 0 to 4,096. If the 2 × VREF range is used, the input signal amplitude extends from −2 VREF (VIN0 = 0 V , VIN1 = VREF) to +2 VREF (VIN1 = 0 V , VIN0= VREF). Driving Differential Inputs The differential modes available on Channels 1 to 4 in Table 7 requires that VIN+ and VIN− be driven simultaneously with two equal signals that are 180° out of phase. The common mode must be set up externally. The common-mode range is determined by VREF, the power supply, and the particular amplifier used to drive the analog inputs. Differential modes of operation with either an ac or dc input provide the best THD performance over a wide frequency range. Since not all applications have a signal preconditioned for differential operation, there is often a need to perform single-ended-to-differential conversion. Using an Op Amp Pair An op amp pair can be used to directly couple a differential signal to one of the analog input pairs of the AD7294. The circuit configurations illustrated in Figure 14 and Figure 15 show how a dual op amp can be used to convert a single-ended signal into a differential signal for both a bipolar and unipolar input signal, respectively. The voltage applied to Point A sets up the common-mode voltage. In both diagrams, Point A is connected to the reference, but any value in the common-mode range can be input here to set up the common mode. The AD8022 is a suitable dual op amp that can be used in this configuration to provide differential drive to the AD7294. Take care when choosing the op amp; the selection depends on the required power supply and system performance objectives. The driver circuits in Figure 14 and Figure 15 are optimized for dc coupling applications requiring best distortion performance. The circuit configuration shown in Figure 14 converts a unipolar, single-ended signal into a differential signal. The differential op amp driver circuit shown in Figure 15 is configured to convert and level shift a single-ended, ground-referenced (bipolar) signal to a differential signal centered at the VREF level of the ADC. 2 × VREF p–p VREF 440Ω 27Ω 3.75V 2.5V 1.25V 27Ω 3.75V 2.5V 1.25V 220Ω V+ VIN+ GND AD72941 V– 220Ω 220Ω V+ A VIN– DCAPA/DCAPB V– 10kΩ 1ADDITIONAL PINS OMITTED FOR CLARITY. 04603-023 0.47µF Figure 14. Dual Op Amp Circuit to Convert a Single-Ended Unipolar Signal into a Differential Signal 2 × VREF p–p GND 440Ω 27Ω 3.75V 2.5V 1.25V 27Ω 3.75V 2.5V 1.25V 220Ω V+ VIN+ AD72941 V– 220kΩ 220Ω 220Ω V+ A VIN– DCAPA/DCAPB V– 10kΩ 0.47µF 1ADDITIONAL PINS OMITTED FOR CLARITY. Figure 15. Dual Op Amp Circuit to Convert a Single-Ended Bipolar Signal into a Differential Unipolar Signal Rev. PrB | Page 14 of 45 04603-024 20kΩ Preliminary Technical Data AD7294 Pseudodifferential Mode DIGITAL INPUTS The AD7294 can have two pseudodifferential pairs, see the Configuration Register section for register details. Uncommitted input channels 1 and 2 are a pseudodifferential pair, as are channels 3 and channel 4 . In this mode, VIN+ is connected to the signal source, which must have amplitude of VREF (or 2 × VREF, depending on the range chosen) to make use of the full dynamic range of the part. A dc input is applied to the VIN− pin. The voltage applied to this input provides an offset from ground or a pseudoground for the VIN+ input. Which channel is VIN+ is determined by the ADC channel allocation. The differential mode must be selected in order to operate in the pseudodifferential mode. The resulting converted pseudodifferential data is stored in 2s complement format in the result register. The digital inputs applied to the AD7294 are not limited by the maximum ratings that limit the analog inputs. Instead, the digital inputs can be applied at up to 7 V and are not restricted by the VDD + 0.3 V limit as are the analog inputs, see the Absolute Maximum Ratings section for more information. Another advantage of the SDA, SCL, and A0 to A2 not being restricted by the VDD + 0.3 V limit is that power supply sequencing issues are avoided. If one of these digital inputs is applied before VDD, there is no risk of latch-up, as there would be on the analog inputs if a signal greater than 0.3 V were applied prior to VDD. The governing equation for the pseudodifferential mode, for channel 1 is: VOUT = 2(VIN0 − VIN1) − VREF_ADC Where VIN0 is the single-ended signal on channel 1 and VIN1 is the single-ended signal on channel 2. The benefit of pseudodifferential inputs is that they separate the analog input signal ground from the ADC’s ground, allowing dc common-mode voltages to be cancelled. VDRIVE The AD7294 also has a VDRIVE feature to control the voltage at which the I2C interface operates. Because the I2C pins are opendrain, there is not a corresponding VDD pin. The VDRIVE pin should be connected to the supply that the I2C bus is pulled up to. This is not a supply pin in I2C mode—it merely sets up the input threshold levels. VDRIVE allows the ADC to easily interface to both 3 V and 5 V processors. For example, if the AD7294 is operated with a VDD of 5 V, the VDRIVE pin can be powered from a 3 V supply, allowing a large dynamic range with low voltage digital processors. Thus, the AD7294 can be used with the 2 × VREF input range with a VDD of 5 V while still being able to interface to 3 V digital parts. Rev. PrB | Page 15 of 45 AD7294 Preliminary Technical Data DAC OPERATION R The AD7294 contains four 12-bit DACs, which provide digital control with 1.2 mV resolution to control the bias currents of the power transistors. They can also be used to provide control voltages for variable gain amplifiers or impedance match networks in the main signal chain. The DAC core is a thin film 12-bit string DAC with a 5 V internal buffer to drive the high voltage output stage. The DAC has a range of 0 to 5 V with a 2.5 V reference input. The output span of the DAC, which is controlled by the offset input, can be positioned anywhere between 0 to 15 V. Figure 16 is a block diagram of the DAC architecture. The DAC can maintain 12-bit accuracy for up to a 500 Ω load. R VREF 200K R1 R2 A1 12-Bit DAC VDAC 04783-038 R R 100K TO OUTPUT AMPLIFIER R VHI Figure 17. Resistor String Structure VOUT A2 I2C DATA INPUTS EXTERNAL REFERENCE CAPACITOR R1 R2 100K 200K Output Amplifier VLO OFFSET IN Figure 16. DAC Architecture To improve functionality of the device, the DAC output is digitally inverted. Therefore, although the input coding to the DAC is straight binary, the ideal output voltage is given by VOUT = 3VOFFSET − 2VDAC The DAC word is digitally inverted on-chip such that VDAC = VREF − VDAC* VOUT = 3VOFFSET + 2(VDAC* − VREF) ⎡ ⎛ D ⎞⎤ Where VDAC *= ⎢VREF × ⎜ n ⎟⎥ ⎝ 2 ⎠⎦ ⎣ where D is the decimal equivalent of the binary code that is loaded to the DAC register, and n is the bit resolution of the DAC. Table 5. DAC Output Code Table Digital Input 0000 0000 0000 0000 0000 0001 1000 0000 0000 1111 1111 1111 Referring to Figure 16, the purpose of A1 is to buffer the DAC output range from 0 V to VREF. The second amplifier, A2, is configured such that when an offset is applied to OFFSET IN, its output voltage is three times the offset voltage minus twice the DAC voltage. The user has the option of leaving the offset pin open, in which case the voltage on the noninverting input of op amp, A2, is set by the resistor divider, giving VOUT = 2VDAC This generates the 5 V output span from a 2.5 V reference. Digitally inverting the DAC allows the circuit to operate as a generic DAC when no offset is applied. Analog Output (V) VREF −VREF (0/4,096)=VREF VREF −VREF (1/4,096) VREF −VREF (2048/4,096) = VREF/2 VREF −VREF (4095/4,096) Resistor String The resistor string structure is shown in Figure 17. It is simply a string of 2n resistors, each of value R. The code loaded to the DAC register determines at which node on the string the voltage is tapped off to be fed into the output amplifier. The voltage is tapped off by closing one of the switches connecting the string to the amplifier. This architecture is inherently monotonic, voltage out, and low glitch. It is also linear due to the fact that all of the resistors are of equal value. The DACs provide digital control with 1.2 mV resolution to control the bias currents of the power transistors. The DAC output buffer, A2, is capable of driving a 1 nF capacitor with current source and sink capabilities of 10 mA to within 200 mV off the supply. The output buffer has a supply range of 20 V with a slew rate of 1 V/μs. Current limiting should take effect at about 40 mA. Note that a significant amount of power could be dissipated in this situation; a thermal shutdown circuit will set the DAC outputs to high impedance if a die temperature of >150°C is measured by the internal temperature sensor. Rev. PrB | Page 16 of 45 Preliminary Technical Data AD7294 CURRENT SENSOR Two current-sense amplifiers are provided, which can accurately amplify small differential current shunt voltages in the presence of rapidly changing common mode voltages. Each accepts a (VPP) ±200 mV full-scale input voltage and supplies a (VCC/2) ± 2.5 V signal to the ADC. The current sense in the AD7294 is a high-side current sense amplifier, which allows for the monitoring of currents on the VDD line ranging from AVDD up to 48 V, see Figure 18. The sense amplifier works correctly for common mode voltages on RS(−) and RS(+) of between 47 V (VPP − 1 V) and 48.2 V (VPP + 200 mV). It gives a full scale output to the ADC for a differential input of ± 200 mV, e.g. 48 V on RS+ and 47.8 on RS−. An input signal of greater than 240 mV magnitude should trigger an alert. An alert will also be triggered if the common mode voltages on RS+ and RS− go outside the specified limits, as the amplifier will no longer be in its linear region. The inputs can be sampled at approximately 6 μs intervals, giving a Nyquist frequency of approximately 160 KHz. Note that when using the external reference for the ADC, the maximum ISENSE input span is 240 mV with a gain of 12.5 in the ISENSE amplifier. Therefore, the maximum usable span on the ADC is 3 V. If an external reference of 5 V is required by the user, only 60% the ADC span will be used for the ISENSE conversion. Choosing RSENSE Example calculation: The AD7294 current sense has a specified full-scale sense range of ± 200 mV. With a VPP of, for example, 48V and a RLOAD of, for example, 50 Ω, the ILOAD is : ILOAD = VPP / RLOAD = 48 V / 50 Ω = 0.96 A With a full scale sense range of 200 mV, sense resistor value is: ILOAD RSENSE RSENSE = FSVSENSE / ILOAD = 200 mV / 0.96 A = 208.3 m Ω AVDD to +48V RS(+) RS(-) In applications monitoring very high currents, RSENSE must be able to dissipate the I2R losses. If the resistor’s rated power dissipation is exceeded, its value may drift or it may fail altogether, causing a differential voltage across the terminals in excess of the absolute maximum ratings. If ISENSE has a large high frequency component, care should be taken to choose a resistor with low inductance. Wire-wound resistors have the highest inductance, metal-film resistors are somewhat better, and low inductance metal-film resistors are best suited for these applications. AD7294 R1 R2 A1 Q1 Q2 A2 R3 converted into a single-ended output voltage by A2. The gain is internally set with thin-film resistors to 12.5V/V. Hence for an input voltage of ± 200 mV an output span of ± 2.5 V will be generated. VOUT TO MUX R4 Figure 18. High-Side Current Sense The AD7294 is comprised of two main blocks, a differential and an instrumentation amplifier. A load current flowing through the external shunt resistor produces a voltage at the input terminals of the AD7294. Resistors R1 and R2 connect the input terminals to the differential amplifier (A1). A1 nulls the voltage appearing across its own input terminals by adjusting the current through R1 and R2 with transistors Q1 and Q2. When the input signal to the AD7294 is 0, the currents in R1 and R2 are equal. When the differential signal is nonzero, the current increases through one of the resistors and decreases in the other. The current difference is proportional to the size and polarity of the input signal. Since the differential input voltage is converted into a current, common-mode rejection is no longer reliant on resistor matching, and high accuracy and performance is provided throughout the wide common-mode voltage range. The amplifier is chopper stabilized with a switching frequency of approximately 300kHz. Kelvin Sense Resistor Connection When using a low value sense resistor for high current measurement, the problem of parasitic series resistance can arise. The lead resistance can be a substantial fraction of the rated resistance, making the total resistance a function of lead length. This problem can be avoided by using a Kelvin sense connection. This type of connection separates the current path through the resistor and the voltage drop across the resistor. Figure 19 shows the correct way to connect the sense resistor between the VCC and SENSE pins of the AD7294. The differential currents through QI and Q2 are converted into a differential voltage due to R3 and R4. A2 is configured as an instrumentation amplifier, and this differential input signal is Rev. PrB | Page 17 of 45 SENSE RESISTOR CURRENT FLOW FROM SUPPLY CURRENT FLOW TO LOAD KELVIN SENSE TRACES RSX(+) RSX(-) AD7294 Figure 19. Kelvin Sense Connections AD7294 Preliminary Technical Data This is given by The AD7294 consists of one local and two remote temperature sensors. The analog input multiplexer can alternately select either the on-chip band gap temperature sensor, to measure the temperature of the system, or one of the two remote diode temperature sensors. The 12-bit ADC digitizes these signals, and the results are stored in the TSENSEINT, TSENSE1, and TSENSE2 registers. These results are compared with their respective DATALOW, DATAHIGH, and hysteresis registers. Out-of-limit comparisons generate flags, and further information on these are stored in the alert registers. A result that exceeds the high temperature limit, the low temperature limit, or an external diode fault causes the ALERT output to assert high. VDD N*I I I-BIAS MUX TO ADC LOW PASS FILTER fc = 65 KHz D1 (+) D0 (+) T1 ΔVBE = KT/q × 1n(N) where: K is Boltzmann’s constant. q is the charge on the carrier. T is the absolute temperature in Kelvin. N is the ratio of the two currents. If a discrete transistor is used for T1 and T0, such as a 2N3904/2N3906, the collector is not grounded and should be linked to the base. If a PNP transistor is used, the base is connected to the D− input and the emitter to the D+ input. If an NPN transistor is used, the emitter is connected to the D− input and the base to the D+ input. Figure 21 and Figure 22 show how to connect the AD7294 to an NPN or PNP transistor for temperature measurement. To prevent ground noise from interfering with the measurement, the more negative terminal of the sensor is not referenced to ground, but is biased above ground by an internal diode at the D− input. LIMIT REGISTERS T0 AD7294 TEMP SENSOR D0 (-) MUX D1 (-) 2N3904 NPN BIAS DIODE D+ D– REMOTE SENSING TRANSISTORS AD7294 05381-025 TEMPERATURE SENSOR Figure 21. Measuring Temperature Using an NPN Transistor CAP ALERT Figure 20. Internal and Remote Temperature Sensors AD7294 The temperature sensor module on the AD7294 is based on the 3-current principle, see Figure 20, where three currents are passed through a diode and the forward voltage drop is measured at each diode, allowing the temperature to be calculated free of errors caused by series resistance. Temperature Measurement Method The AD7294 can measure the temperature of two remote diode sensors or diode-connected transistors connected from D0(+) to D0(−) and from D1(+) to D1(−). The forward voltage of a diode or diode-connected transistor operated at constant current exhibits a negative temperature coefficient of about 2 mV/°C. Unfortunately, the absolute value of VBE varies from device to device, and individual calibration is required to null this; therefore, the technique is unsuitable for mass production. The technique used in the AD7294 is to measure the change in VBE when the device is operated at three different currents, see Figure 20. D– 05381-026 D+ 2N3906 PNP Figure 22. Measuring Temperature Using a PNP Transistor To measure ΔVBE, the sensor is switched between operating currents of I and N × I. The resulting waveform is passed through a 65 kHz low-pass filter to remove noise, and to a chopper-stabilized amplifier that performs the functions of amplification and rectification of the waveform to produce a dc voltage proportional to ΔVBE. This voltage is measured by the ADC to give a temperature output in 10-bit, twos complement format. Series Resistance Cancellation Parasitic resistance to the D+ and D− inputs to the AD7294, seen in series with the remote diode, is caused by a variety of factors, including PCB track resistance and track length. This series resistance appears as a temperature offset in the remote sensor’s temperature measurement. This error typically causes a 0.5°C offset per ohm of parasitic resistance in series with the remote diode. Rev. PrB | Page 18 of 45 Preliminary Technical Data AD7294 The AD7294 automatically cancels out the effect of this series resistance on the temperature reading, giving a more accurate result, without the need for user characterization of this resistance. The AD7294 is designed to automatically cancel typically up to 3 kΩ of resistance. By using an advanced temperature measurement method, this is transparent to the user. This feature allows resistances to be added to the sensor path to produce a filter, allowing the part to be used in noisy environments. differential inputs, by their very nature, have a high immunity to noise. Remote Sensing Diode To reduce the error due to variations in both substrate and discrete transistors, a number of factors should be taken into consideration: • Temperature Measurement Method The temperature reading from the ADC is stored in a 10-bit twos complement format and in a sign bit format, D10 to D0, to accommodate both positive and negative temperature measurements. The temperature data format is shown in Table 6, which shows the achievable temperature measurement range. The ADC can theoretically measure a 512°C temperature span, ranging from −256°C to +255.75°C with an LSB of 0.25°C. Table 6. TSENSE Data Format Digital Input 111 1111 1111 100 0000 0000 011 1111 1111 000 0000 0000 Bit Weight (°C) −0.25 −256 +255.75 +0.0 ∆T = (nf − 1.008) × (273.15 K + T) To factor this in, the user can write the ∆T value to the offset register. The AD7294 then automatically adds it to or subtracts it from the temperature measurement. If a discrete transistor is used with the AD7294, the best accuracy is obtained by choosing devices according to the following criteria: Each input is integrated in turn over a period of several hundred microseconds. This takes place continuously in the background, leaving the user free to perform conversions on the other channels. When integration is complete, a signal is passed to the control logic to automatically initiate a conversion. If the ADC is in command mode, the temperature conversion is performed as soon as the next conversion is completed. In autocycle mode, the conversion is inserted into an appropriate place in the current sequence; see the Register Setting section for further details. If the ADC is idle, the conversion takes place immediately. Three registers store the result of the last conversion on each temperature channel; these can be read at any time. In addition, in command mode, one or both of the two external channel registers can be read out as part of the output sequence. The MSB of the registers is set if an open-circuit condition is detected on the input of the external sensors, indicating an invalid result. Noise Filtering For temperature sensors operating in noisy environments, previous practice was to place a capacitor across the D+ pin and D− pin to help combat the effects of noise. However, large capacitances affect the accuracy of the temperature measurement, leading to a recommended maximum capacitor value of 1000 pF. This capacitor reduces the noise, but does not eliminate it. Sometimes, this sensor noise is a problem in a very noisy environment. In most cases, a capacitor is not required as The ideality factor, nf, of the transistor is a measure of the deviation of the thermal diode from ideal behavior. The AD7294 is trimmed for an nf value of 1.008. Use the following equation to calculate the error introduced at a temperature T (°C), when using a transistor whose nf does not equal 1.008. See the processor data sheet for the nf values. • Base-emitter voltage greater than 0.25 V at 11 µA, at the highest operating temperature. • Base-emitter voltage less than 0.95 V at 180 µA, at the lowest operating temperature. • Base resistance less than 100 Ω. • Small variation in hFE (approximately 50 to 150) that indicates tight control of VBE characteristics. REFERENCE FOR ADC/DAC The internal reference on the AD7294 is a well regulated, low ppm 2.5 V reference with low drift voltage and a stable output. The reference is common to all four DAC channels and the SAR ADC. If the application requires an external reference, it can be applied to the REFOUT/REFIN DAC pin or to the REFOUT/ REFIN ADC pin. If the reference is driving external nodes, a buffer is required to achieve a low impedance output. For stability, the reference buffers each require at least 470 nF on the output pin. Note that on power up, the ADC and DAC reference buffers are switched off by default ; note the power-down register in the Register Setting section. When using an external reference to achieve the desired performance from the AD7294, thought should be given to the choice of a precision voltage reference. There are four possible sources of error that should be considered when choosing a voltage reference for high accuracy applications: initial accuracy, ppm drift, long-term drift, and output voltage noise. To minimize these errors, a reference with high initial accuracy Rev. PrB | Page 19 of 45 AD7294 Preliminary Technical Data is preferred. In addition, choosing a reference with an output trim adjustment, such as the on-chip internal reference or the AD431, allows a system designer to trim system errors by setting a reference voltage to a voltage other than the nominal. Long-term drift is a measure of how much the reference drifts over time. A reference with a tight long-term drift specification ensures that the overall solution remains stable during its entire lifetime. If choosing an external reference, consider a tight temperature coefficient specification to reduce the temperature dependence of the system output voltage on ambient conditions. ANALOG COMPARATOR LOOP The AD7294 consists of two set-point comparators that are used for independent analog control. The advantage of using analog control for current sensing is the dynamic speed of the analog loop vs. the speed of the digital loop, in that the analog control loop does not have the digital delays inherent in ADCto-DAC signal processing. The ISENSEOVERRANGE pins signal whether the instrumentation amplifiers voltage from the current sense is greater then or less then the set point 240 mV. The 240 mV is the fixed threshold voltage of the over-range comparator and the current sense amplifier will saturate above this. Rev. PrB | Page 20 of 45 Preliminary Technical Data AD7294 APPLICATIONS The AD7294 is used in a power amplifier signal chain to achieve the optimal bias condition for the LDMOS transistor. The main factors influencing the bias conditions are temperature, supply voltage, gate voltage drift, and general processing parameters. The overall performance of a power amplifiers configuration is determined by the inherent tradeoffs required in efficiency, gain, and linearity. Dynamically controlling the drain bias current, in order to maintain a constant value over temperature and time, can significantly improve the overall performance of the power amplifier. The AD7294 contains all the functions required for generalpurpose monitoring and control of current, voltage, and temperature. Depending on the signal chain, a number of amplifiers can be used in predrive and drive modes prior to the PA final stage to increase the overall power gain of the signal, see Figure 23 . This addition of power gain has an adverse effect on the overall efficiency of the PA. To minimize the degradation of the PA’s efficiency, the drivers must be monitored and controlled to optimize performance. TYPICAL RF FRONT-END APPLICATION The circuit in Figure 24 is a typical application for the AD7294. The device is used to monitor and control the overall performance of a two final stage amplifiers. The gain control and phase adjustment of the driver stage are incorporated in the application and are carried out by the two available uncommitted outputs of the AD7294. Both high-side current senses measure the amount of current on the respective final stage amplifiers. The comparator outputs, ISENSE OVER-RANGE pins, are the controlling signals for switches on the RF inputs of the LDMOS power FETs. If the high-side current sense reads a value above a specified limit compared with the set-point, the RF IN signal is switched off by the comparator. AD7294 By measuring the transmitted power (Tx) and the received power (Rx), the device can dynamically change the drivers and PA signal to optimize performance. This application requires a logarithmic detector/controller, such as Analog Devices AD8317. RF SIGNAL TO ANTENNA DRIVER PRE-DRIVER 2-STAGE FINAL Figure 23. Typical HPA Signal Chain R Sense RF CHOKE VDD R Sense RS2(-) RS1(+) RS1(-) HIGH SIDE CURRENT SENSE ISENSE2 OVER-RANGE RF CUTOFF TX POWER RX POWER RX Power Monitor FILTER LDMOS VIN 0 MUX 12-BIT ADC 12-BIT DAC VOUT B FILTER LDMOS VIN 2 COMPARATORS & REGISTERS 12-BIT DAC D1 (+) VOUT C GAIN CONTROL D0 (+) VOUT D T1 RF OUT RF IN VIN 3 REF RF OUT RF IN VOUT A SET-POINT 240mV VIN 1 REF AD7294* HIGH SIDE CURRENT SENSE 12-BIT DAC ISENSE1 OVER-RANGE TX Power Monitor RF CHOKE RS2(+) RS2(-) 12-BIT DAC T0 D0 (-) TEMP SENSOR D1 (-) * ADDITIONAL PINS OMITTED FOR CLARITY Figure 24. Typical HPA Monitor and Control Application Rev. PrB | Page 21 of 45 IMPEDANCE MATCH AD7294 Preliminary Technical Data GAIN CONTROL OF PA ANALOG COMPARATOR LOOP In this mode, a setpoint voltage, proportional in dB to the desired output power, is applied to a Logarithmic Amplifier such as the AD8317, see Figure 25. A sample of the output power from the PA, via a directional coupler and attenuator (or by other means), is fed to the input of the AD8317. The VOUT is then connected to the gain control terminal of the PA. Based on the defined relationship between VOUT and the RF input signal, the AD8317 will adjust the voltage on VOUT (VOUT is now an error amplifier output) until the level at the RF input corresponds to the applied VSET. The AD7294 completes a feedback loop, which can track the output of the AD8317 and adjust the VSET input of the AD8317 accordingly. Utilizing the internal analog comparator loop allows the AD7294 to control the RF switch controlling the RF IN signal to the HPA. The ISENSEOVERRANGE 1 pin signals whether the instrumentation amplifiers voltage from the current sense is greater then or less then the set point 240 mV. The 240 mV is the fixed threshold voltage of the over-range comparator and the current sense amplifier will saturate above this. This overrange signal can be used for the control signal on, for example, an RF switch such as the ADG901. R Sense VPP RS1(-) RS1(+) AD7294* ENVELOPE OF TRANSMITTED SIGNAL HIGH SIDE CURRENT SENSE RF CHOKE RF OUT SET-POINT 240mV ISENSE1 OVERRANGE POWER AMPLIFIER TO ADC VOUT A FILTER LDMOS RF IN DIRECTIONAL COUPLER ATTENUATOR ADG901* RF CHOKE RF IN RF2 RF1 AD7294 50 50 CTRL AD8317 INHI VOUT INLO VSET VIN Figure 26. Analog Comparator Loop This is a useful safety feature available in the AD7294. The analog control loop senses any high current supplied to the power amplifier and dynamically cuts the RF signal to the gate of the device in direct response. VOUT CFLT Figure 25. Setpoint Controller Operation VOUT of the AD8317 is applied to the gain control terminal of the power amplifier. In order for this output power control loop to be stable, a ground-referenced capacitor must be connected to the CFLT pin. This capacitor integrates the error signal (which is actually a current) that is present when the loop is not balanced. In a system where a Variable Gain Amplifier or Variable Voltage Attenuator feeds the power amp only one AD8317 is required. In such a case the gain on one of the parts (VVA, PA) is fixed and VOUT feeds the control input of the other. Rev. PrB | Page 22 of 45 Preliminary Technical Data AD7294 REGISTER SETTING The AD7294 contains 43 internal registers (see Figure 27) that are used to store conversion results, high and low conversion limits, and information to configure and control the device. There are 42 data registers and one address pointer register. COMMAND REGISTER RESULT REGISTER ADC CHANNEL ALLOCATION TSENSE RESULT REGISTERS x3 These nine channel address bits select which analog input channel is to convert using the multiplexer, see Table 7. Choosing Channels 1 to 4 selects the standard analog voltage inputs. Channels 5 and 6 represent the analog-input sense amplifiers for current monitoring. Channel 7 and 8 designate the use of the external temperature-sensing diodes, whereas Channel 9 represents the internal temperature sensor. ALERT REGISTERS x3 CHANNEL SEQUENCE REGISTER ADDRESS POINTER REGISTER AD7294’s data registers, see Table 11. The first byte following each write address is the address of one of the data registers, which is stored in the address pointer register and selects the data register to which subsequent data bytes are written. On power-up, the address pointer register contains all 0s, pointing to the command register. CONFIGURATION REGISTER D A T A POWER DOWN REGISTER Table 7. ADC Channel Allocation DATAHIGH / DATALOW REGISTERS x 18 HYSTERESIS REGISTER TSENSE OFFSET REGISTERS x2 FUSE BLOCK REGISTERS x2 SERIAL BUS INTERFACE SDA SCL Figure 27. AD7294 Register Structure Each data register has an address to which the address pointer register points when communicating with it. The command register and fuse block registers are the only registers that are write-only registers; the rest are read/write registers. ADDRESS POINT REGISTER The address pointer register does not have and does not require an address, because it is the register to which the first data byte of every write operation is written automatically. The address pointer register is an 8-bit register, in which the 6 LSBs are used as pointer bits to store an address that points to one of the Channel CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH8 CH9 Function VIN0 or (VIN0 − VIN1) VIN1 or (VIN1 − VIN0) VIN2 or (VIN2 − VIN3) VIN3 or (VIN3 − VIN2) ISENSE1 ISENSE2 TSENSE1 TSENSE2 TSENSEINT Channel ID 000 001 010 011 100 101 110 111 – There are two modes of operation with respect to the ADC. In command mode, a sequence is written to the ADC, and on subsequent reads, the next channel in the sequence is converted as the current sequence is read out. In autocycle mode, a sequence is programmed, and then the ADC automatically cycles through the selected channels, outputting an alert if one of the channels goes outside its preset range. Rev. PrB | Page 23 of 45 AD7294 Preliminary Technical Data COMMAND REGISTER RESULT REGISTER Writing in this register puts the part into command mode. While in command mode, the part cycles through the selected channels on each subsequent read. If the external TSENSE channels are selected in the command word, it is not actually requesting a conversion, but the result of the last automatic conversion will be output in sequence. See the Channel Sequence Register section for information on autocycle mode. The result register is a 16-bit read/write register. The four uncommitted input channels and the two ISENSE channels converted results are stored in the result register for reading. Writing to this register sets the DAC1 output code. The register consists of bits D14 to D12 to identify the ADC channel allocation. Bits D11 to D0, in the result register, are the data bits sent to DAC1. While the MSB, D15, is reserved as an Alert_Flag bit. The Alert_Flag bit indicates whether the conversion result being read or any other channel result has violated the limit registers associated with it. If an alert occurs, the master may wish to read the alert status register to obtain more information on where the alert occurred if the Alert_Flag bit is set. Table 8. Address Pointer Byte—Command Bits Parameter C1 C2 C3 C4 C5 C6 C7 C8 Function Convert on CH1 Convert on CH2 Convert on CH3 Convert on CH4 Convert on ISENSE1 Convert on ISENSE2 Read out last result from TSENSE1 Read out last result from TSENSE2 Table 9 shows the contents of the first byte to read from the AD7294; Table 10 shows the contents of the second byte read. Table 9. Result Register (First Read) MSB D15 Alert_Flag D14 CHID2 D13 CHID1 D12 CHID0 D11 B11 D10 B10 LSB D8 B8 D9 B9 Table 10. Result Register (Second Read) MSB D7 B7 D6 B6 D5 B5 D4 B4 D3 B3 Rev. PrB | Page 24 of 45 D2 B2 D1 B1 LSB D0 B0 Preliminary Technical Data AD7294 Table 11. AD7294 Register Addresses P7 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P6 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P5 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 P4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 P3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 P2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 P1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 Rev. PrB | Page 25 of 45 P0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Registers Command register (W) Result register (R)/DAC1 value (W) TSENSE1 result (R)/DAC2 value (W) TSENSE2 result (R)/DAC3 value (W) TSENSEINT result (R)/DAC4 value (W) Alert Register A (R/W) Alert Register B (R/W) Alert Register C (R/W) Channel sequence register (R/W) Configuration register (R/W) Power-down register (R/W) DATALOW register CH1 (R/W) DATAHIGH register CH1 (R/W) Hysteresis register CH1 (R/W) DATALOW register CH2 (R/W) DATAHIGH register CH2 (R/W) Hysteresis register CH2 (R/W) DATALOW register CH3 (R/W) DATAHIGH register CH3 (R/W) Hysteresis register CH3 (R/W) DATALOW register CH4 (R/W) DATAHIGH register CH4 (R/W) Hysteresis register CH4 (R/W) DATALOW register ISENSE1 (R/W) DATAHIGH register ISENSE1 (R/W) Hysteresis register ISENSE1 (R/W) DATALOW register ISENSE2 (R/W) DATAHIGH register ISENSE2 (R/W) Hysteresis register ISENSE2 (R/W) DATALOW register TSENSE1 (R/W) DATAHIGH register TSENSE1 (R/W) Hysteresis register TSENSE1 (R/W) DATALOW register TSENSE2 (R/W) DATAHIGH register TSENSE2 (R/W) Hysteresis register TSENSE2 (R/W) DATALOW register TSENSEINT (R/W) DATAHIGH register TSENSEINT (R/W) Hysteresis register TSENSEINT (R/W) TSENSE1 offset register (R/W) TSENSE2 offset register (R/W) AD7294 Preliminary Technical Data TSENSE1, TSENSE2 RESULT REGISTERS Registers TSENSE1 and TSENSE2 are 16-bit read/write registers. General alert is flagged by the MSB, D15. Bits D14 to D12 are reserved for the ADC channel allocation. D11 is reserved for flagging diode open-circuits. The temperature reading from the ADC is stored in a 10-bit twos complement format plus a sign bit, D10 to D0. Writing to the TSENSE1 register sets the DAC2 output code while writing to the TSENSE2 register sets the DAC3 output code. TSENSEINT RESULT REGISTER The TSENSEINT register is a 16-bit read/write register used to store the ADC data generated from the internal temperature sensor. Similar to the TSENSE1 and TSENSE2 result registers, this register stores the temperature readings from the ADC in a 10-bit twos complement format and in a sign bit format, D10 to D0, and uses the MSB as a general alert flag. However, Bits D14 to D11 are not used. Conversions take place approximately every 5 ms. Writing to this register sets the DAC4 output code. The temperature data format in Table 6 also applies to the internal temperature sensor data. TSENSE OFFSET REGISTERS Due to the high frequency clock signals of the system, some temperature errors can be attributable to noise coupled onto the D+/D− lines of the remote temperature sensors even when the layout guidelines are followed. Constant high frequency noise usually attenuates/increases the temperature measurements by a linear constant value. The AD7294 has temperature offset 8-bit twos complement registers for both Remote Channels TSENSE1 and TSENSE2. By completing a one-time calibration of the system, the user can determine the offset caused by system board noise and null it using the offset registers. The offset registers for TSENSE1 and TSENSE2 are 8-bit read/write registers that store data in a twos complement format. This data is subtracted from the temperature readings taken by TSENSE1 and TSENSE2 temperature sensors. The offset is carried out before the values are stored in the TSENSE result register. Table 12. TSENSE Offset Data Format Digital Input 1111 1111 1000 0000 0111 1111 0000 0000 Bit Weight ( °C ) − 0.25 − 32 + 31.75 + 0.0 Register A , see Table 13, consists of four channels with two status bits per channel, one corresponding to each of the DATAHIGH and DATALOW limits. It stores the alert event data for Channels 1 to 4, which are the standard voltage inputs. The bit with a status of 1 shows where the violation occurred—that is, on which channel—and whether the violation occurred on the upper or lower limit. If a second alert event occurs on another channel between receiving the first alert and interrogating the alert status register, the corresponding bit for that alert event is also set. Register B, see Table 14, reserves two bits for user input. It also consists of three channels with two status bits per channel, representing the specified DATAHIGH and DATALOW limits. Bits B3 to B0 correspond to the high and low limit alerts for the current sense inputs. Bits B5 to B4 represent the ISENSE over the full-scale range of 200 mV. Register Cs most significant bit, see Table 15, is used to alert the user if an open diode flag occurs on the external temperature sensors. An over temperature alert for the external temperature sensor occupies C6. The remaining 6 bits in this register are used to store alert event data for TSENSE1, TSENSE2 and TSENSEINT with two status bits per channel, one corresponding to each of the DATAHIGH and DATALOW limits. The entire contents of the alert status register can be cleared by writing 1 to bit D1 and 1 to bit D2 in the configuration register, as shown in Table 17. This can also be achieved by writing all 1s to the alert status register itself. Therefore, if the alert status register is addressed for a write operation, which is all 1s, the contents of the alert status register are cleared or reset to all 0s. CHANNEL SEQUENCE REGISTER The channel sequence register is an 8-bit read/write register that allows the user to sequence the ADC conversions in autocycle mode. This mode must first be selected in the configuration register, see Table 16. This is an extremely useful mode, for example, when checking for alerts on a channel. On power-up, the channel sequence register contains all 0s, thus disabling automatic cycle operation of the AD7294. To enable the automatic cycle mode, the user must write a 1 to the desired channel. The temperature sense channels, including TSENSEINT, are a special case. The conversions on these channels take place automatically, unless the temperature sense circuit is powered down, either after certain other conversions or in other quiet times. This is transparent to the user. ALERT STATUS REGISTERS The alert status registers are 8-bit read/write registers that provides information on an alert event. If a conversion results in activating the ALERT pin or Alert_Flag bit in the result register or TSENSE registers, the alert status register can be read to gain further information. CONFIGURATION REGISTER The configuration register is a 16-bit read/write register that is used to set the operating modes of the AD7294. The bit functions of the configuration register are outlined in. Table 17 Rev. PrB | Page 26 of 45 Preliminary Technical Data AD7294 Table 13. Alert Status Register A Alert Bit Function A7 CH4 high alert A6 CH4 low alert A5 CH3 high alert A4 CH3 low alert A3 CH2 high alert A2 CH2 low alert A1 CH1 high alert A0 CH1 low alert Table 14. Alert Status Register B Alert Bit Function B7 Reserved B6 Reserved B5 ISENSE2 over-range B4 ISENSE1 over-range B3 ISENSE2 high alert B2 ISENSE2 low alert B1 ISENSE1 high alert B0 ISENSE1 low alert C5 TSENSEINT high alert C4 TSENSEINT low alert C3 TSENSE2 high alert C2 TSENSE2 low alert C1 TSENSE1 high alert C0 TSENSE1 low alert Table 15. Alert Status Register C Alert Bit Function C7 Open-diode flag C6 Over-temp alert Table 16. Channel Sequence Register Channel Bit Function D7 Reserved D6 Reserved D5 ISENSE2 D4 ISENSE1 D3 CH4 D2 CH3 D1 CH2 D0 CH1 Table 17. Configuration Register Bit Function Description Config. Bit D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 Comment Reserved Enable noise-delayed sampling. Used to delay critical sample intervals from occurring when there is activity on the I2C bus. Enable noise-delayed bit trials. Used to delay critical bit trials from occurring when there is activity on the I2C bus. Enable autocycle mode. Enable pseudodifferential mode for CH3/CH4 Enable pseudodifferential mode for CH1/CH2 Enable differential mode for CH3/CH4 Enable differential mode for CH1/CH2 Enable 2 VREF range on CH4 Enable 2 VREF range on CH3 Enable 2 VREF range on CH2 Enable 2 VREF range on CH1 Enable I2C filters Enable alert pin Enable busy pin (D2 = 0)/clear alerts (D2 = 1) Sets polarity of alert pin (active high/active low) Table 18. ALERT/BUSY Function D2 0 0 1 1 Rev. PrB | Page 27 of 45 D1 0 1 0 1 ALERT/BUSY Pin Configuration Pin does not provide any interrupt signal. Pin configuration as a BUSY output Pin configuration as an ALERT output. Resets the ALERT output pin, the Alert_Flag bit in the conversion result register, and the entire alert status register (if any is active). If 1/1 is written to Bits D2/D1 in the configuration register to reset the ALERT pin, the Alert_Flag bit, and the alert status register, the contents of the configuration register read 1/0 for D2/D1, respectively, if read back. AD7294 Preliminary Technical Data SAMPLE DELAY AND BIT TRIAL DELAY It is recommended that no I2C Bus activity occurs when a conversion is taking place; however, this may not be possible, for example when operating in automatic cycle mode. To maintain the performance of the ADC in such cases, Bits D14 and D13 in the configuration register are used to delay critical sample intervals and bit trials from occurring while there is activity on the I2C bus. This may increase the conversion time. When Bits D14 and D13 are both 1, the bit trial-and-sample interval delaying mechanism are implemented. The default setting of D14 and D13 is 0. If bit trial delays extend longer than 1 µs, the conversion terminates. When D14 is 1, the sampling instant delay is implemented. When D13 is 1, the bit trial delay is implemented. To turn off both the sample delay and bit trial delay, set D14 and D13 to 0. POWER-DOWN REGISTER either hardware, software or both, depending on the configuration) if the result moves outside the upper or lower limit set by the user. Table 20. Default values for DATAHIGH and DATALOW REGISTERS ADC Channel CH1 CH2 CH3 CH4 ISENSE1 ISENSE2 TSENSE1 TSENSE2 The power-down register is an 8-bit read/write register that is used to power down various sections on the AD7294 device. TSENSEINT Table 19. Power-Down Register Description Bit P7 P6 P5 P4 P3 P2 P1 P0 Single Ended Differential 000 and FFF 000 and FFF 000 and FFF 000 and FFF 7FF and 800 (2’s Complement) 7FF and 800 (2’s Complement) 3FF and 400 (2’s Complement) 3FF and 400 (2’s Complement) 3FF and 400 (2’s Complement) 7FF and 800 7FF and 800 7FF and 800 7FF and 800 N/A N/A N/A N/A N/A The DATAHIGH register stores the upper limit that activates the ALERT output and/or the Alert_Flag bit in the conversion result register. If the value in the conversion result register is greater than the value in the DATAHIGH register, an alert occurs. When the conversion result returns to a value of at least N LSB below the DATAHIGH register value, the ALERT output pin and Alert_Flag bit are reset. The value of N is taken from the 12-bit hysteresis register associated with that channel. For the TSENSE limit registers D11 is equal to 0, as this denotes the diode opencircuit flag in the TSENSE registers. Function Power down full chip (apart from DACs) Reserved Power down ADC reference buffer (to allow external reference, 1 at power-up) Power down DAC reference buffer (to allow external reference, 1 at power-up) Power down temperature sensor Power down ISENSE2 Power down ISENSE1 DAC outputs set to high impedance (set automatically if die temperature >150°C) DATAHIGH/DATALOW REGISTER The DATAHIGH / DATALOW registers for a channel are 16-bit, read/write registers. General alert is flagged by the MSB, D15. D14 – D12 are not used in the register and are read as 0s. The remaining 12-bits set the high/low limits for the relevant channel. With respect to Channels 1 to 4, for Single Ended mode, 000 and FFF are the defaults values. For differential mode on Channels 1 to 4, the default values for DATAHIGH & DATALOW are 7FF and 800. Note that if the part is configured in Single Ended mode and the limits are changed, the user must re-program limits when changing to a different mode. Channels 5 and 6 ( ISENSE1 and ISENSE2 ) are two’s complement format and so the default limits will also be 7FF and 800. There is no differential mode for channels 5 and 6. Channels 7 to 9, (TSENSE1, TSENSE2 and TSENSEINT) default to 3FF and 400 for the DATAHIGH and DATALOW limits as they are in two’s complement 10-bit format. Differential mode is not available for channels 7 to 9. The AD7294 signals an alert (in The DATALOW register stores the lower limit that activates the ALERT output and/or the Alert_Flag bit in the conversion result register. If the value in the conversion result register is less than the value in the DATALOW register, an alert occurs. When the conversion result returns to a value of at least N LSB above the DATALOW register value, the ALERT output pin and Alert_Flag bit are reset. The value of N is taken from the hysteresis register associated with that channel. The ALERT pin can also be reset by writing to Bits D2 and D1 in the configuration register. Table 21. AD7294 DATAHIGH/LOW Register (First R/W) MSB D15 Alert_Flag D14 0 D13 0 D12 0 D11 B11 D10 B10 D9 B9 LSB D8 B8 Table 22. AD7294 DATAHIGH/LOW Register (Second R/W) MSB D7 B7 Rev. PrB | Page 28 of 45 D6 B6 D5 B5 D4 B4 D3 B3 D2 B2 D1 B1 LSB D0 B0 Preliminary Technical Data AD7294 HYSTERESIS REGISTERS Each hysteresis register is a 16-bit read/write register; only the 12 LSBs of the register are used, with the MSB signaling the alert event. The hysteresis register stores the hysteresis value, N, when using the limit registers. Each pair of limit registers has a dedicated hysteresis register. The hysteresis value determines the reset point for the ALERT pin/Alert_Flag if a violation of the limits occurs. For example, if a hysteresis value of 8 LSB is required on the upper and lower limits of Channel 1, the 16-bit word 0000 0000 0000 1000 should be written to the hysteresis register of CH1 (see Table 11). On power-up, the hysteresis registers contain a value of 8 LSB for non-temperature result registers and 8 °C, or 32 LSB, for the TSENSE registers. If a different hysteresis value is required, that value must be written to the hysteresis register for the channel in question. For the TSENSE register D11, in Table 23 is 0. Using the Limit Registers to Store Min/Max Conversion Results If full scale—that is, all 1s—is written to the hysteresis register for a particular channel, the DATAHIGH and DATALOW registers for that channel no longer act as limit registers as previously described, but act as storage registers for the maximum and minimum conversion results returned from conversions on a channel over any given period of time. This function is useful in applications where the widest span of actual conversion results is required rather than using the ALERT to signal that an intervention is necessary. Note that on power-up, the contents of the DATAHIGH register for each channel are full scale, whereas the contents of the DATALOW registers are zero scale by default. Therefore, minimum and maximum conversion values being stored in this way are lost if power is removed or cycled. Table 23. Hysteresis Register (First Read/Write) MSB D15 Alert_Flag D14 0 D13 0 D12 0 D11 B11 D10 B10 D9 B9 LSB D8 B8 Table 24. Hysteresis Register (Second Read/Write) MSB D7 B7 D6 B6 D5 B5 D4 B4 D3 B3 D2 B2 D1 B1 LSB D0 B0 Rev. PrB | Page 29 of 45 AD7294 Preliminary Technical Data SERIAL BUS INTERFACE to-high transition when the clock is high may be interpreted as a stop signal. If the operation is a write operation, the first data byte after the slave address is a command byte. This tells the slave device what to expect next. It may be an instruction telling the slave device to expect a block write, or it may be a register address that tells the slave where subsequent data is to be written. Because data can flow in only one direction, as defined by the R/W bit, it is not possible to send a command to a slave device during a read operation. Before performing a read operation, it is sometimes necessary to perform a write operation to tell the slave what sort of read operation to expect and/or the address from which data is to be read. Control of the AD7294 is carried out via the I2C-compatible serial bus. The AD7294 is connected to this bus as a slave device under the control of a master device. GENERAL I2C TIMING Figure 28 shows the timing diagram for general read and write operations using an I2C-compliant interface. The master initiates a data transfer by establishing a start condition, defined as a high-to-low transition on the serial data line (SDA) while the serial clock line (SCL) remains high. This indicates that a data stream follows. The master sends a 7-bit slave address (MSB first) and an R/W bit that determines the direction of the data transfer—that is, whether data is written to or read from the slave device (0 = written, 1 = read). When all data bytes have been read or written, stop conditions are established. In write mode, the master pulls the data line high during the 10th clock pulse to assert a stop condition. In read mode, the master device releases the SDA line during the low period before the ninth clock pulse, but the slave device does not pull it low. This is known as a no acknowledge (NACK). The master takes the data line low during the low period before the 10th clock pulse, and then high during the 10th clock pulse to assert a stop condition. The slave responds by pulling the data line low during the low period before the ninth clock pulse, known as the acknowledge bit, and holding it low during the high period of this clock pulse. All other devices on the bus remain idle while the selected device waits for data to be read from or written to it. If the R/W bit is 0, the master writes to the slave device. If the R/W bit is 1, the master reads from the slave device. Data is sent over the serial bus in sequences of nine clock pulses—eight bits of data followed by an acknowledge bit, which can be from the master or slave device. Data transitions on the data line must occur during the low period of the clock signal and remain stable during the high period, because a low- SCL SDA 1 START COND BY MASTER 1 0 1 1 0 1 SERIAL BUS ADDRESS BYTE P7 R/W P6 ACK. BY AD7294 USER PROGRAMMABLE 5 LSBs Figure 28. General I2C Timing Rev. PrB | Page 30 of 45 P5 P4 P3 P2 REGISTER ADDRESS P1 P0 ACK. BY STOP BY MASTER / MASTER SLAVE Preliminary Technical Data AD7294 SERIAL BUS ADDRESS BYTE The first byte the user writes to the device is the Serial Bus Address Byte. Like all I2C-compatible devices the AD7294 has a 7-bit serial address. The 5 LSBs are user programmable by the 3 three-state input pins as shown in Table 25 where Z refers to a pin left floating. Table 25. Serial Address control using 3-State Input Pins AS2 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 Z Z Z Z Z Z Z Z Z AS1 0 0 0 1 1 1 Z Z Z 0 0 0 1 1 1 Z Z Z 0 0 0 1 1 1 Z Z Z AS0 0 1 Z 0 1 Z 0 1 Z 0 1 Z 0 1 Z 0 1 Z 0 1 Z 0 1 Z 0 1 Z A4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 Rev. PrB | Page 31 of 45 A3 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 A2 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 A1 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 A0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 AD7294 Preliminary Technical Data WRITING/READING TO THE AD7294 2 The AD7294 uses the following I C protocols: Writing to the Address Pointer Register for a Subsequent Read In the AD7294, to read from a particular register, the address pointer register must first contain the address of that register. If the address pointer is not set, the correct address must be written to the address pointer register by performing a single byte write operation, as shown in Figure 29. In this operation, the slave device receives a single byte from a master as follows: 1 9 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the write (low) bit. 3. The addressed slave device asserts ACK on SDA. 4. The slave receives a data byte. 5. The slave asserts ACK on SDA. 6. The master asserts a stop condition on SDA, and the transaction ends. 1 9 SCL SDA 1 1 A4 A3 A2 A1 START BY MASTER A0 P7 R/W P6 P5 P4 P3 P2 P1 ACK. BY AD7294 FRAME 1 SERIAL BUS ADDRESS BYTE P0 ACK. BY AD7294 FRAME 2 ADDRESS POINTER REGISTER BYTE Figure 29. Writing to the Address Pointer Register to Select a Register for a Subsequent Read Operation Rev. PrB | Page 32 of 45 STOP BY MASTER Preliminary Technical Data AD7294 Reading Data from an 8-Bit Register 1. The master device asserts a start condition on SDA. Reading the contents from any of the 8-bit registers is a singlebyte read operation, as shown in Figure 30. This protocol assumes that the particular register address has been set up by a single-byte write operation to the address pointer register (see Figure 30). Once the register address has been set up, any number of reads can be performed from that particular register without having to write to the address pointer register again. If a read from a different address is required, the relevant register address has to be written to the address pointer register, and again any number of reads from this register can then be performed. In this operation, the master device receives a single byte from a slave device as follows: 2. The master sends the 7-bit slave address followed by the read bit (high). 3. The addressed slave device asserts ACK on SDA. 4. The master receives a data byte. 5. The master asserts NACK on SDA so that the slave knows the data transfer is complete. 6. The master asserts a stop condition on SDA, and the transaction ends. 1 9 1 9 SC L SD A 1 1 A4 A3 A2 A1 START BY MASTER A0 D7 R/W D6 D5 D4 D3 D2 D1 ACK. BY AD7294 FRAME 1 SERIAL BUS ADDRESS BYT E NO ACK. BY MASTER FRAME 2 SINGLE DATA BYT E FROM AD7294 Figure 30. Reading a Single Byte of Data from a Selected Register Rev. PrB | Page 33 of 45 D0 STOP BY MASTER AD7294 Preliminary Technical Data Reading Two Bytes of Data from a 16-Bit Register 4. The master receives a data byte. In this operation, the master device reads two bytes of data from a slave device. This protocol assumes that the particular register address has been set up by a single-byte write operation to the address pointer register, see Figure 31. 5. The master asserts ACK on SDA. 6. The master receives a second data byte. 7. The master asserts NACK on SDA, so the slave knows that the data transfer is complete. 8. The master asserts a stop condition on SDA to end the transaction. 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the read bit (high). 3. The addressed slave device asserts ACK on SDA. 1 9 1 9 SCL SDA 1 1 A4 A3 A2 A1 A0 R/W ACK. BY AD7294 START BY MASTER D14 D13 D12 D11 D10 D9 D8 ACK. BY MASTER ALERTFLAG FRAME 2 MOST SIGNIFICANT DATA BYTE FROM AD7294 FRAME 1 SERIAL BUS ADDRESS BYTE 1 9 SCL (CONTINUED) SDA (CONTINUED) D7 D6 D5 D4 D3 D2 D1/0 D0/0 NO ACK. BY MASTER FRAME 2 MOST SIGNIFICANT DATA BYTE FROM AD7294 Figure 31. Reading Two Bytes of Data from the Conversion Result Register Rev. PrB | Page 34 of 45 STOP BY MASTER Preliminary Technical Data AD7294 Reading Two Bytes of Data from a Result Register 8. The master sends a register address. The result register, TSENSE1 result register and the TSENSE2 register are 16-bit registers used to store the conversion results from the ADC. The master must first write to the command register to determine which multiplexed channel to convert on. The address pointer register is then pointed towards the register to which to enter the converted data. The master sends a repeated start to the frame and then enters the two bytes of converted data into the desired result register. : 9. The slave asserts ACK on SDA. 1. The master device asserts a start condition on SDA. 13. The master sends the most significant data byte. 2. The master sends the 7-bit slave address followed by the write bit (low). 14. The master asserts ACK on SDA. 3. The addressed slave device asserts ACK on SDA. 4. The master sends a register address of all 0s in order to write to the command register. 5. The addressed slave device asserts ACK on SDA. 6. The master writes to the command register. 7. The slave asserts ACK on SDA. 10. The master device asserts a repeated start condition on SDA. 11. The master sends the 7-bit slave address followed by the read bit (high). 12. The slave asserts ACK on SDA. 15. The master sends the least significant data byte. 16. The master asserts NACK on SDA, so the slave knows that the data transfer is complete. 17. The master asserts a stop condition on SDA to end the transaction. 1 9 1 9 SC L 1 SD A 1 A4 A3 A2 A1 A0 0 R /W ST AR T BY MA ST ER 0 0 0 0 0 A CK . B Y AD7294 FR AME 2 COMMAND PO IN TER RE GIST ER BY TE FRA ME 1 SERIAL BUS A D DR E SS B YT E + WRITE 9 0 0 A CK . BY AD7294 1 9 1 9 SC L (CON TIN U ED ) SD A (CONTINU E D) C8 C7 C6 C5 C4 C3 C2 C1 P7 P6 P5 P3 P4 P2 P1 P0 A CK. B Y AD7294 A CK . B Y AD7294 FR A ME 3 C OMMAND REGISTER VALUE FR AME 4 POINTER TO RESULT REGISTER 1 9 SC L (CON TIN U ED ) SD A (CONTINU E D) 1 A4 1 A3 A2 A1 A0 R/W A CK . B Y AD7294 REPEATED START BY MASTER FRA ME 5 SERIAL BUS ADDRESS BYTE + READ 1 9 1 9 SC L (CON TINU ED ) SD A (CON TINUE D) ALERT CHID CHID CHID D11 D10 D9 D7 D8 D6 D5 D4 D3 D2 D1 FRA ME 6 MOST SIGNIFICANT DATA BYTE FR A ME 7 LEAST SIGNIFICANT DATA BYTE Figure 32. Reading 2-Bytes from Result Register Rev. PrB | Page 35 of 45 D0 NO ACK BY STOP BY MASTER MASTER ACK . B Y MASTER AD7294 Preliminary Technical Data Writing a Single Byte of Data to an 8-Bit Register 20. The addressed slave device asserts ACK on SDA. The alert registers, power down register, channel sequence register, offset registers, and the command register are 8-bit registers; therefore, only one byte of data can be written to each. In this operation, the master device sends a byte of data to the slave device. To write data to the register, the command sequence is as follows: 21. The master sends a register address. 18. The master device asserts a start condition on SDA. 25. The master asserts a stop condition on SDA to end the transaction. 22. The slave asserts ACK on SDA. 23. The master sends a data byte. 24. The slave asserts ACK on SDA. 19. The master sends the 7-bit slave address followed by the write bit (low). 1 9 1 9 SC L SD A 1 1 A4 A3 A2 A1 A0 P7 R/W ST AR T BY MA ST ER P6 P5 P4 P3 P2 P1 P0 A CK . B Y AD7294 ACK. B Y AD7294 FR A ME 2 A DD RES S PO IN TER RE GIST ER BY TE FRA ME 1 SE R IA L B US AD DR E SS BYT E 1 9 SC L (C O N TIN U ED ) SD A (C ONTINU E D) D7 D6 D5 D4 D3 D2 D1 D0 A CK. B Y AD7294 FR A ME 3 D AT A B YT E Figure 33. Single-Byte Write Sequence Rev. PrB | Page 36 of 45 ST OP BY MA ST ER Preliminary Technical Data AD7294 Writing Two Bytes of Data to a 16-Bit Register Both types of limit registers, the hysteresis registers, the result register, the TSENSE result registers, the configuration register, and the fuse registers are 16-bit registers; therefore, two bytes of data are required to write a value to any one of these registers. Writing two bytes of data to one of these registers consists of the following: 1. The master device asserts a start condition on SDA. 2. The master sends the 7-bit slave address followed by the write bit (low). 3. The addressed slave device asserts ACK on SDA. 1 4. The master sends a register address. The slave asserts ACK on SDA. 5. The master sends the first data byte 6. The slave asserts ACK on SDA. 7. The master sends the second data byte. 8. The slave asserts ACK on SDA. 9. The master asserts a stop condition on SDA to end the transaction. 9 1 9 SCL 0 SDA 1 A4 A3 A2 A1 A0 P7 R/W START BY MASTER P6 P5 P4 P3 P2 P1 P0 ACK. BY AD7294 ACK. BY AD7294 FRAME 2 ADDRESS POINTER REGISTER FRAME 1 SERIAL BUS ADDRESS BYTE 1 9 1 9 SCL (CONTINUED) SDA (CONTINUED) 0 0 0 0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 ACK. BY AD7294 MOST SIGNIFICANT DATA BYTE D0/0 ACK. BY AD7294 LEAST SIGNIFICANT DATA BYTE Figure 34. 2-Byte Write Sequence Rev PrB | Page 37 of 45 D1/0 STOP BY MASTER AD7294 Preliminary Technical Data MODES OF OPERATION register choose the sequence of conversions required. At this point the ADC will power up and begin channel conversions. When supplies are first applied to the AD7294 the ADC powers up in sleep mode and normally rmains in this shutdown state while not converting. There are two different methods of initiating a conversion on the AD7294. Also take note that the address pointer must be re-addressed to the result register to read the conversions results. For each channel conversion in the sequence, the frame is re-addressed to the result register to synchronize the frames. When more then one channel is selected in the command register. The first read accesses the data from the conversion on channel1. While this read takes place, a conversion occurs on channel 2. The second read accesses this data from channel 2 and so on. MODE 1 – COMMAND MODE In this mode the part cycles through the selected channels on each subsequent read. To setup the command mode the command register must first be told which ADC channels to convert on, see Table 7 . In the case of TSENSE1, TSENSE2 and TSENSEINT, the command mode is not actually requesting a conversion but outputting the last automatic conversion in sequence. In the case of the internal temperature sensor TSENSEINT, it is not possible to read the result via the ADC result register. The result is stored in the TSENSEINT result register. Figure 35 illustrates a 2–byte read operation from the result register. Prior to the read operation, ensure that the address pointer is pointing to the command register. In the command The wake-up and conversion time together should take approximately 5 μs, and the conversion begins when the last bit in the command register has been clocked in. 1 9 1 9 SC L 1 SD A 1 A4 A3 A2 A1 A0 0 R/W ST ART BY MA ST ER 0 0 0 0 0 ACK . B Y AD7294 FRAME 2 COMMAND PO INTER RE GIST ER BY TE FRA ME 1 SERIAL BUS A DDR E SS BYT E + WRITE 9 0 0 ACK. BY AD7294 1 9 1 9 SC L (CON TIN UED ) SD A (CONTINUE D) C8 C7 C6 C5 C4 C3 C2 C1 P7 P6 P5 P3 P4 P2 P1 P0 ACK. B Y AD7294 ACK. B Y AD7294 FR AME 3 C OMMAND REGISTER VALUE FR AME 4 POINTER TO RESULT REGISTER 1 9 SC L (CONTINU ED ) SD A (CONTINUE D) 1 A4 1 A3 A2 A1 A0 R/W ACK . B Y AD7294 REPEATED START BY MASTER FR AME 5 SERIAL BUS ADDRESS BYTE + READ 1 9 1 9 SC L (CONTINU ED ) SD A (CONTINUE D) ALERT CHID CHID CHID D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 ACK. BY MASTER FRA ME 6 MOST SIGNIFICANT DATA BYTE Figure 35. Command Mode Operation Rev. PrB | Page 38 of 45 D0 NO ACK BY STOP BY MASTER MASTER FR AME 7 LEAST SIGNIFICANT DATA BYTE Preliminary Technical Data AD7294 sequence, starting with the lowest channel. Once the sequence is complete, the ADC starts converting on the lowest channel again, continuing to loop through the sequence until the cycle timer register contents are set to all 0s. This mode is useful for monitoring signals, such as signal power and current sensing, alerting only when the limits are violated. To exit the autocycle mode the user must write all zeroes to the channel sequence register or disable the autocycle mode in the configuration register. Figure 36 shows the autocycle mode where only one channel is chosen from the channel sequence register. Depending on the controller of the I2C interface, it is also possible to break the long write frame into two shorter frames, where a second frame can begin after writing to the configuration register. After writing to the configuration register, the user can stop the frame, re-address the part and write to the channel sequence. MODE 2 – AUTOCYCLE MODE An automatic conversion cycle can be selected and enabled by initially selecting the enable autocycle mode option in the configuration register. The desired sequence of the autocycle mode is controlled using the channel sequence register. The automatic cycle mode can be set on the four uncommitted analog input channels along with the two ISENSE channels. When the 6 LSBs of this register are programmed with any configuration other than all 0s, a conversion takes place every 5 ms. In autocycle mode the sample delay and bit trial delay are two configuration options which can be used to maintain ADC performance when I2C bus activity is taking place during a conversion. If more than one channel bit is set in the channel sequence register, the ADC automatically cycles through the channel 1 9 1 9 SC L 1 SD A 1 A4 A3 A2 A1 A0 0 R /W ST ART BY MA ST ER 0 0 1 A CK . BY AD7294 FR A ME 2 POINTER TO CONFIGURATION REGISTER FR AME 1 SERIAL BUS A D DR E SS B YT E + WRITE 9 0 1 0 0 ACK. B Y AD7294 1 9 1 9 SC L (CO NTIN U ED ) SD A (CON TINU E D) D15 D14 D13 D11 1 D10 D9 D8 D7 D6 D5 D3 D4 D2 D1 D0 A CK . B Y AD7294 A CK . B Y AD7294 FR AME 3 CONFIGURATION REGISTER VALUE MSB 9 FR A ME 4 CONFIGURATION REGISTER VALUE LSB 1 9 1 9 SC L (CON TIN U ED ) SD A (CO NTINUE D) 0 0 0 0 0 0 0 D7 D6 D5 D3 D4 D2 D1 D0 A CK . B Y AD7294 A CK . B Y AD7294 FRA ME 5 POINTER TO CHANNEL SEQUENCE REGISTER 9 1 FRA ME 6 CHANNEL SEQUENCE REGISTER 1 9 9 SC L (CO NTIN U ED ) SD A (CON TINU E D) 0 0 0 0 1 0 0 1 0 1 A4 A3 A2 A1 A0 R/W A CK . BY AD7294 . REPEATED START BY MASTER FR A ME 8 SERIAL BUS ADDRESS BYTE + READ FR A ME 7 POINTER TO RESULT REGISTER 9 1 9 1 9 SC L (CO NTIN U ED ) SD A (CON TINU E D) ALERT CHID CHID CHID D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 FR AME 9 MOST SIGNIFICANT DATA BYTE FR A ME 10 LEAST SIGNIFICANT DATA BYTE Figure 36. Autocycle Mode Operation Rev. PrB | Page 39 of 45 D0 NO . ACK STOP BY AD7294 MASTER A CK . B Y AD7294 AD7294 Preliminary Technical Data LAYOUT AND CONFIGURATION POWER SUPPLY BYPASSING AND GROUNDING When accuracy is important in a circuit, carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD7294 should have separate analog and digital sections, each having its own area of the board. If the AD7294 is in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD7294. The power supply to the AD7294 should be bypassed with 10 µF and 0.1 µF capacitors. The capacitors should physically be as close as possible to the device, with the 0.1 µF capacitor ideally right up against the device. The 10 µF capacitors are the tantalum bead type. It is important that the 0.1 µF capacitor has low effective series resistance (ESR) and low effective series inductance (ESI); common ceramic types of capacitors are suitable. The 0.1 µF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching. The power supply line should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other components with fast switching digital signals should be shielded from other parts of the board by a digital ground. Avoid crossover of digital and analog signals if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects on the board. The best board layout technique is the microstrip technique where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side; however, this is not always possible with a 2-layer board. Rev. PrB | Page 40 of 45 Preliminary Technical Data AD7294 EVALUATION BOARD FOR THE AD7294 The AD7294 evaluation board consists of the AD7294 LFCSP package along with two RSENSE resistors and a number of SMB sockets and jumpers, which allow access to the various on-chip functionalities of the AD7294. Other on-board components are used to interface the part to the PC, such as an EEPROM, a USB Microcontroller and a voltage regulator. More information, on the AD7294 evaluation board, is available in the EVALAD7294EB application note and should be consulted when evaluating the board. Rev. PrB | Page 41 of 45 AD7294 Preliminary Technical Data Figure 37. Evaluation Board Schematic Rev. PrB | Page 42 of 45 Preliminary Technical Data AD7294 Figure 38. Component Side Artwork Figure 39. Component Side SilkScreen Rev. PrB | Page 43 of 45 AD7294 Preliminary Technical Data Figure 40. Solder-Side Artwork Rev. PrB | Page 44 of 45 Preliminary Technical Data AD7294 OUTLINE DIMENSIONS 8.00 BSC SQ 0.60 MAX 0.60 MAX 0.30 0.23 0.18 43 42 PIN 1 INDICATOR TOP VIEW PIN 1 INDICATOR 56 1 6.25 6.10 SQ 5.95 EXPOSED PAD (BOTTOM VIEW) 7.75 BSC SQ 0.50 0.40 0.30 29 28 15 14 0.25 MIN 1.00 0.85 0.80 12° MAX 6.50 REF 0.80 MAX 0.65 TYP 0.50 BSC SEATING PLANE 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2 Figure 41. LFCSP-56 Pin Package ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR05747-0-3/06(PrB) Rev. PrB | Page 45 of 45