TI1 MC34063AD 1.5-a peak boost/buck/inverting switching regulator Datasheet

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MC33063A, MC34063A
SLLS636N – DECEMBER 2004 – REVISED JANUARY 2015
MC3x063A 1.5-A Peak Boost/Buck/Inverting Switching Regulators
1 Features
3 Description
•
•
•
•
•
•
•
The MC33063A and MC34063A devices are easy-touse ICs containing all the primary circuitry needed for
building simple DC-DC converters. These devices
primarily consist of an internal temperaturecompensated reference, a comparator, an oscillator,
a PWM controller with active current limiting, a driver,
and a high-current output switch. Thus, the devices
require minimal external components to build
converters in the boost, buck, and inverting
topologies.
1
Wide Input Voltage Range: 3 V to 40 V
High Output Switch Current: Up to 1.5 A
Adjustable Output Voltage
Oscillator Frequency Up to 100 kHz
Precision Internal Reference: 2%
Short-Circuit Current Limiting
Low Standby Current
2 Applications
•
•
•
•
•
•
•
The MC33063A device is characterized for operation
from –40°C to 85°C, while the MC34063A device is
characterized for operation from 0°C to 70°C.
Blood Gas Analyzers: Portable
Cable Solutions
HMIs (Human Machine Interfaces)
Telecommunications
Portable Devices
Consumer & Computing
Test & Measurement
Device Information(1)
PART NUMBER
MC3x063A
PACKAGE (PIN)
BODY SIZE
SOIC (8)
4.90 mm × 3.91 mm
SON (8)
4.00 mm × 4.00 mm
PDIP (8)
9.81 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
Drive
Collector
8
1
Switch
Collector
2
Switch
Emitter
3
Timing
Capacitor
Q2
S Q
Q1
R
100 W
Ipk
Sense
7
Ipk
Oscillator
CT
6
VCC
+
−
Comparator
Inverting Input
5
1.25-V
Reference
Regulator
4
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MC33063A, MC34063A
SLLS636N – DECEMBER 2004 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
4
4
4
4
4
5
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics—Oscillator ........................
Electrical Characteristics—Output Switch.................
Electrical Characteristics—Comparator ....................
Electrical Characteristics—Total Device ...................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
8.1
8.2
8.3
8.4
9
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
7
7
7
7
Application and Implementation .......................... 8
9.1 Application Information.............................................. 8
9.2 Typical Application .................................................... 9
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 18
12.1
12.2
12.3
12.4
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
13 Mechanical, Packaging, and Orderable
Information ........................................................... 18
5 Revision History
Changes from Revision M (January 2011) to Revision N
Page
•
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply
Recommendations section, Layout section, Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section. ..................................................................................................................... 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
2
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SLLS636N – DECEMBER 2004 – REVISED JANUARY 2015
6 Pin Configuration and Functions
D (SOIC) OR P (PDIP) PACKAGE
(TOP VIEW)
Switch Collector
Switch Emitter
Timing Capacitor
GND
1
8
2
7
3
6
4
5
Driver Collector
Ipk
VCC
Comparator Inverting Input
DRJ (QFN) PACKAGE
(TOP VIEW)
Switch Collector
1
Switch Emitter
†
8
Driver Collector
2
7
Ipk
Timing Capacitor
3
6
VCC
GND
4
5
Comparator Inverting Input
†
The exposed thermal pad is electrically bonded internally to pin 4 (GND) .
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
Switch Collector
1
I/O
High-current internal switch collector input.
Switch Emitter
2
I/O
High-current internal switch emitter output.
Timing Capacitor
3
—
Attach a timing capacitor to change the switching frequency.
GND
4
—
Ground
Comparator
Inverting Input
5
I
Attach to a resistor divider network to create a feedback loop.
VCC
6
I
Logic supply voltage. Tie to VIN.
IPK
7
I
Current-limit sense input.
Driver Collector
8
I/O
Darlington pair driving transistor collector input.
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
VCC
Supply voltage
VIR
Comparator inverting input voltage range
VC(switch)
Switch collector voltage
VE(switch)
Switch emitter voltage
VCE(switch)
VC(driver)
MAX
UNIT
40
V
40
V
40
V
40
V
Switch collector to switch emitter voltage
40
V
Driver collector voltage
40
V
IC(driver)
Driver collector current
100
mA
ISW
Switch current
1.5
A
TJ
Operating virtual junction temperature
150
°C
Tstg
Storage temperature range
150
°C
(1)
–0.3
VPIN1 = 40 V
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
2500
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
VCC
Supply voltage
TA
Operating free-air temperature
MIN
MAX
3
40
MC33063A
–40
85
MC34063A
0
70
UNIT
V
°C
7.4 Thermal Information
MC33063A
THERMAL METRIC (1)
D
DRJ
P
UNIT
85
°C/W
8 PINS
RθJA
(1)
Junction-to-ambient thermal resistance
97
41
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
7.5 Electrical Characteristics—Oscillator
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram)
MIN
TYP
MAX
fosc
Oscillator frequency
PARAMETER
VPIN5 = 0 V, CT = 1 nF
25°C
24
33
42
kHz
Ichg
Charge current
VCC = 5 V to 40 V
25°C
24
35
42
μA
Idischg
Discharge current
VCC = 5 V to 40 V
25°C
140
220
260
μA
Idischg/Ichg
Discharge-to-charge current ratio
VPIN7 = VCC
25°C
5.2
6.5
7.5
—
VIpk
Current-limit sense voltage
Idischg = Ichg
25°C
250
300
350
mV
4
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TEST CONDITIONS
TA
UNIT
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7.6 Electrical Characteristics—Output Switch
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram) (1)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
VCE(sat)
Saturation voltage –
Darlington connection
ISW = 1 A, pins 1 and 8 connected
Full range
1
1.3
V
VCE(sat)
Saturation voltage –
non-Darlington connection (2)
ISW = 1 A, RPIN8 = 82 Ω to VCC,
forced β ∼ 20
Full range
0.45
0.7
V
hFE
DC current gain
ISW = 1 A, VCE = 5 V
IC(off)
Collector off-state current
VCE = 40 V
100
μA
(1)
(2)
25°C
50
Full range
75
0.01
—
Low duty-cycle pulse testing is used to maintain junction temperature as close to ambient temperature as possible.
In the non-Darlington configuration, if the output switch is driven into hard saturation at low switch currents (≤300 mA) and high driver
currents (≥30 mA), it may take up to 2 μs for the switch to come out of saturation. This condition effectively shortens the off time at
frequencies ≥30 kHz, becoming magnified as temperature increases. The following output drive condition is recommended in the nonDarlington configuration:
Forced β of output switch = IC,SW / (IC,driver – 7 mA) ≥ 10, where ∼7 mA is required by the 100-Ω resistor in the emitter of the driver to
forward bias the Vbe of the switch.
7.7 Electrical Characteristics—Comparator
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
25°C
1.225
1.25
1.275
Full range
1.21
UNIT
Vth
Threshold voltage
ΔVth
Threshold-voltage line regulation
VCC = 5 V to 40 V
Full range
1.4
5
mV
IIB
Input bias current
VIN = 0 V
Full range
–20
–400
nA
MIN
MAX
UNIT
1.29
V
7.8 Electrical Characteristics—Total Device
VCC = 5 V, TA = full operating range (unless otherwise noted) (see block diagram)
PARAMETER
ICC
TEST CONDITIONS
VCC = 5 V to 40 V, CT = 1 nF,
VPIN7 = VCC, VPIN5 > Vth,
VPIN2 = GND, All other pins open
Supply current
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TA
Full range
4
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mA
5
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7.9 Typical Characteristics
1000
1.8
100
Pin 7 = VCC
Pin 5 = GND
TA = 25°C
VCE(SAT), Output Switch
Saturation Voltage (V)
On-Off Time (µs)
t ON-OFF, Output Switch
VCC = 5 V
t ON
10
t OFF
1
0.01
0.1
1
CT, Oscillator Timing Capacitor (nF)
1.6
1.5
1.4
1.3
1.2
1.1
1.0
1
0
0.0
10
Force Beta = 20
0.6
0.0
0
0
0.0
VCC = 5 V
Pin 7 = VCC
Pin 2, 3, 5 = GND
TA = 25°C
0.2
1
0.4 0.6 0.8 1.0
1.2
IC, Collector Current (A)
1.4
Figure 3. Output Switch Saturation Voltage vs
Collector Current (Common-Emitter Configuration)
6
ICC, Supply Current (mA)
VCE(SAT), Output Switch
Saturation Voltage (V)
1.0
0.2
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0.6
0.8
1
1.0
1.2
1.4
1.6
3.6
1.2
0.4
0.4
IE, Emitter Current (A)
Darlington Connection
0.8
0.2
Figure 2. Output Switch Saturation Voltage vs
Emitter Current (Emitter-Follower Configuration)
Figure 1. Output Switch On-Off Time vs
Oscillator Timing Capacitor
1.4
VCC = 5 V
Pin 1, 7, 8 = VCC
Pin 3, 5 = GND
TA = 25°C
1.7
3.2
2.8
2.4
2.0
1.6
CT = 1 nF
Pin 7 = VCC
Pin 2 = GND
TA = 25°C
1.2
0.8
0.4
0.0
1.6
0
5
10
15
20
25
30
VCC, Supply Voltage (V)
35
40
Figure 4. Standby Supply Current vs Supply Voltage
Copyright © 2004–2015, Texas Instruments Incorporated
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8 Detailed Description
8.1 Overview
The MC33063A and MC34063A devices are easy-to-use ICs containing all the primary circuitry needed for
building simple DC-DC converters. These devices primarily consist of an internal temperature-compensated
reference, a comparator, an oscillator, a PWM controller with active current limiting, a driver, and a high-current
output switch. Thus, the devices require minimal external components to build converters in the boost, buck, and
inverting topologies.
The MC33063A device is characterized for operation from –40°C to 85°C, while the MC34063A device is
characterized for operation from 0°C to 70°C.
8.2 Functional Block Diagram
Drive
Collector
8
1
Switch
Collector
2
Switch
Emitter
3
Timing
Capacitor
Q2
S Q
Q1
R
100 W
Ipk
Sense
7
Ipk
Oscillator
CT
6
VCC
+
−
Comparator
Inverting Input
1.25-V
Reference
Regulator
4
5
GND
8.3 Feature Description
•
•
•
•
•
•
•
Wide Input Voltage Range: 3 V to 40 V
High Output Switch Current: Up to 1.5 A
Adjustable Output Voltage
Oscillator Frequency Up to 100 kHz
Precision Internal Reference: 2%
Short-Circuit Current Limiting
Low Standby Current
8.4 Device Functional Modes
8.4.1 Standard operation
Based on the application, the device can be configured in multiple different topologies. See the Application and
Implementation section for how to configure the device in several different operating modes.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 External Switch Configurations for Higher Peak Current
R*
8
1
7
1
7
2
VOUT
2
RSC
RSC
6
VIN
8
VOUT
VIN
6
7
* R → 0 for constant Vin
a) EXTERNAL npn SWITCH
A.
b) EXTERNAL npn SATURATED SWITCH (see Note A)
If the output switch is driven into hard saturation (non-Darlington configuration) at low switch currents (≤300 mA) and
high driver currents (≥30 mA), it may take up to 2 μs to come out of saturation. This condition will shorten the off time
at frequencies ≥30 kHz and is magnified at high temperatures. This condition does not occur with a Darlington
configuration because the output switch cannot saturate. If a non-Darlington configuration is used, the output drive
configuration in Figure 7b is recommended.
Figure 5. Boost Regulator Connections for IC Peak Greater Than 1.5 A
8
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Application Information (continued)
1
1
8
8
7
7
2
RSC
2
RSC
VOUT
6
VIN
VOUT
6
VIN
a) EXTERNAL npn SWITCH
b) EXTERNAL pnp SATURATED SWITCH
Figure 6. Buck Regulator Connections for IC Peak Greater Than 1.5 A
8
8
1
1
VOUT
7
2
6
3
5
4
7
2
6
3
5
4
VOUT
VIN
VIN
a) External NPN Switch
b) External PNP Saturated Switch
Figure 7. Inverting Regulator Connections for IC Peak Greater Than 1.5 A
9.2 Typical Application
9.2.1
Voltage-Inverting Converter Application
1
8
S Q
R
Q2
Q1
2
7
Oscillator
6
VIN
4.5 V to 6.0 V
L
88 mH
Ipk
RSC
0.24 W
CT
3
VCC
+
+
_ Comparator
100 mF
1.25-V
Reference
Regulator
1N5819
+
1500 pF
4
5
1.0 mH
R1
R2
8.2 kW
VOUT
−12 V/100 mA
953 W
CO
1000 mF
VOUT = –1.25 (1+ R2)
R1
100 mF
+
+
Optional Filter
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Typical Application (continued)
Figure 8. Voltage-Inverting Converter
10
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Typical Application (continued)
9.2.1.1 Design Requirements
The user must determine the following desired parameters:
Vsat = Saturation voltage of the output switch
VF = Forward voltage drop of the chosen output rectifier
The following power-supply parameters are set by the user:
Vin = Nominal input voltage
Vout = Desired output voltage
Iout = Desired output current
fmin = Minimum desired output switching frequency at the selected values of Vin and Iout
Vripple = Desired peak-to-peak output ripple voltage. The ripple voltage directly affects the line and load
regulation and, thus, must be considered. In practice, the actual capacitor value should be larger than the
calculated value, to account for the capacitor's equivalent series resistance and board layout.
9.2.1.2 Detailed Design Procedure
CALCULATION
VOLTAGE INVERTING
Vout + VF
ton/toff
Vin - Vsat
1
f
+ t off
(ton + toff)
toff
t on
t on
+1
t off
ton
(ton + toff ) - toff
CT
4 ´ 10-5 t on
æt
ö
2Iout(max ) ç on + 1÷
è t off
ø
0.3
Ipk (switch )
Ipk(switch)
RSC
(
)
æ V
- Vsat ö
ç in(min )
÷
ç
÷ t on(max )
I
pk (switch )
ç
÷
è
ø
I t
9 out on
Vripple(pp )
L(min)
CO
æ R2 ö
-1.25 ç 1 +
R1 ÷ø
è
Vout
See Figure 8
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9.2.1.3 Application Performance
380
VCC = 5 V
ICHG = IDISCHG
360
VIPK, Current Limit
Sense Voltage (mV)
340
320
300
280
260
240
220
200
−50
−25
0
25
50
75
100
TA, Ambient Temperature (°C)
125
Figure 9. Current-Limit Sense Voltage vs Temperature
TEST
CONDITIONS
RESULTS
Line regulation
VIN = 4.5 V to 6 V, IO = 100 mA
3 mV ± 0.12%
Load regulation
VIN = 5 V, IO = 10 mA to 100 mA
0.022 V ± 0.09%
Output ripple
VIN = 5 V, IO = 100 mA
500 mVPP
Short-circuit current
VIN = 5 V, RL = 0.1 Ω
910 mA
Efficiency
VIN = 5 V, IO = 100 mA
62.2%
Output ripple with optional filter
VIN = 5 V, IO = 100 mA
70 mVPP
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9.2.2 Step-Up Converter Application
170 mH
L
1
8
180 W
S Q
R
Q2
1N5819
Q1
2
7
Ipk
RSC
0.22 W
VIN
12 V
3
CT
6
VCC
+
+
_ Comparator
100 mF
1.25-V
Reference
Regulator
CT
1500 pF
4
5
1.0 mH
R2
R1
2.2 kW
47 kW
CO
330 mF
+
VOUT = 1.25 (1+ R2)
R1
VOUT
28 V/175 mA
100 mF
+
Optional Filter
Figure 10. Step-Up Converter
9.2.2.1 Design Requirements
The user must determine the following desired parameters:
Vsat = Saturation voltage of the output switch
VF = Forward voltage drop of the chosen output rectifier
The following power-supply parameters are set by the user:
Vin = Nominal input voltage
Vout = Desired output voltage
Iout = Desired output current
fmin = Minimum desired output switching frequency at the selected values of Vin and Iout
Vripple = Desired peak-to-peak output ripple voltage. The ripple voltage directly affects the line and load
regulation and, thus, must be considered. In practice, the actual capacitor value should be larger than the
calculated value, to account for the capacitor's equivalent series resistance and board layout.
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9.2.2.2 Detailed Design Procedure
CALCULATION
STEP UP
Vout + VF- Vin(min )
ton/toff
Vin(min ) - Vsat
1
f
+ t off
(ton + toff)
toff
t on
t on
+1
t off
ton
(ton + toff ) - toff
CT
4 ´ 10-5 t on
æt
ö
2Iout(max ) ç on + 1÷
è t off
ø
0.3
Ipk (switch )
Ipk(switch)
RSC
(
)
æ V
- Vsat ö
ç in(min )
÷
ç
÷ t on(max )
Ipk (switch )
ç
÷
è
ø
I t
9 out on
Vripple(pp )
L(min)
CO
æ R2 ö
1.25 ç 1 +
R1 ÷ø
è
Vout
See Figure 10
9.2.2.3 Application Performance
TEST
CONDITIONS
RESULTS
Line regulation
VIN = 8 V to 16 V, IO = 175 mA
30 mV ± 0.05%
Load regulation
VIN = 12 V, IO = 75 mA to 175 mA
10 mV ± 0.017%
Output ripple
VIN = 12 V, IO = 175 mA
400 mVPP
Efficiency
VIN = 12 V, IO = 175 mA
87.7%
Output ripple with optional filter
VIN = 12 V, IO = 175 mA
40 mVPP
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9.2.3 Step-Down Converter Application
1
8
S Q
R
Q2
Q1
2
7
VIN
25 V
1N5819
Ipk
RSC
0.33 W
Oscillator
6
CT
3
VCC
+
+
_ Comparator
100 mF
1.25-V
Reference
Regulator
L
220 mH
CT
470 pF
4
5
1.0 mH
R2
R1
1.2 kW
VOUT
5 V/500 mA
3.8 kW
CO
470 mF
VOUT = 1.25 (1+ R2)
R1
+
100 mF
+
Optional Filter
Figure 11. Step-Down Converter
9.2.3.1 Design Requirements
The user must determine the following desired parameters:
Vsat = Saturation voltage of the output switch
VF = Forward voltage drop of the chosen output rectifier
The following power-supply parameters are set by the user:
Vin = Nominal input voltage
Vout = Desired output voltage
Iout = Desired output current
fmin = Minimum desired output switching frequency at the selected values of Vin and Iout
Vripple = Desired peak-to-peak output ripple voltage. The ripple voltage directly affects the line and load
regulation and, thus, must be considered. In practice, the actual capacitor value should be larger than the
calculated value, to account for the capacitor's equivalent series resistance and board layout.
Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: MC33063A MC34063A
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15
MC33063A, MC34063A
SLLS636N – DECEMBER 2004 – REVISED JANUARY 2015
www.ti.com
9.2.3.2 Detailed Design Procedure
CALCULATION
STEP DOWN
ton/toff
Vout + VF
Vin(min ) - Vsat - Vout
1
f
+ t off
(ton + toff)
toff
t on
t on
+1
t off
ton
(ton + toff ) - toff
CT
4 ´ 10-5 t on
Ipk(switch)
2Iout(max )
0.3
RSC
Ipk (switch )
L(min)
(
æ V
- Vsat - Vout
ç in(min )
ç
Ipk (switch )
ç
è
)ö÷ t
÷
÷
ø
on(max )
Ipk (switch ) (t on + t off )
CO
8Vripple(pp )
æ R2 ö
1.25 ç 1 +
R1 ÷ø
è
Vout
See Figure 11
9.2.3.3 Application Performance
TEST
CONDITIONS
RESULTS
Line regulation
VIN = 15 V to 25 V, IO = 500 mA
12 mV ± 0.12%
Load regulation
VIN = 25 V, IO = 50 mA to 500 mA
3 mV ± 0.03%
Output ripple
VIN = 25 V, IO = 500 mA
120 mVPP
Short-circuit current
VIN = 25 V, RL = 0.1 Ω
1.1 A
Efficiency
VIN = 25 V, IO = 500 mA
83.7%
Output ripple with optional filter
VIN = 25 V, IO = 500 mA
40 mVPP
16
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Product Folder Links: MC33063A MC34063A
MC33063A, MC34063A
www.ti.com
SLLS636N – DECEMBER 2004 – REVISED JANUARY 2015
10 Power Supply Recommendations
This device accepts 3 V to 40 V on the input. It is recommended to have a 1000-µF decoupling capacitor on the
input.
11 Layout
11.1 Layout Guidelines
Keep feedback loop layout trace lengths to a minimum to avoid unnecessary IR drop. In addition, the loop for the
decoupling capacitor at the input should be as small as possible. The trace from VIN to pin 1 of the device should
be thicker to handle the higher current.
11.2 Layout Example
1
8
2
7
0.33
MC33063A
3
6
4
5
VIN
CT
100 PF
VOUT
R2
CO
R1
Figure 12. Layout Example for a Step-Down Converter
Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: MC33063A MC34063A
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MC33063A, MC34063A
SLLS636N – DECEMBER 2004 – REVISED JANUARY 2015
www.ti.com
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
MC33063A
Click here
Click here
Click here
Click here
Click here
MC34063A
Click here
Click here
Click here
Click here
Click here
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
Submit Documentation Feedback
Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: MC33063A MC34063A
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MC33063AD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M33063A
MC33063ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M33063A
MC33063ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M33063A
MC33063ADR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M33063A
MC33063ADRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M33063A
MC33063ADRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
M33063A
MC33063ADRJR
ACTIVE
SON
DRJ
8
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
ZYF
MC33063ADRJRG4
ACTIVE
SON
DRJ
8
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
ZYF
MC33063AP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
MC33063AP
MC33063AP-P
PREVIEW
PDIP
P
8
TBD
Call TI
Call TI
-40 to 85
MC33063APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 85
MC34063AD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
M34063A
MC34063ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
M34063A
MC34063ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
M34063A
MC34063ADR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
M34063A
MC34063ADRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
M34063A
MC34063ADRG4
ACTIVE
SOIC
D
8
TBD
Call TI
Call TI
0 to 70
Addendum-Page 1
MC33063AP
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2016
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MC34063ADRJR
ACTIVE
SON
DRJ
8
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
ZYF
MC34063ADRJRG4
ACTIVE
SON
DRJ
8
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
0 to 70
ZYF
MC34063AP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
MC34063AP
MC34063APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
MC34063AP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Jun-2016
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MC33063A :
• Automotive: MC33063A-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Oct-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
MC33063ADR
SOIC
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
D
8
2500
330.0
12.4
6.4
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
5.2
2.1
8.0
12.0
Q1
MC33063ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
MC33063ADRJR
SON
DRJ
8
1000
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
MC34063ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
MC34063ADRJR
SON
DRJ
8
1000
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Oct-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MC33063ADR
SOIC
D
8
2500
367.0
367.0
35.0
MC33063ADR
SOIC
D
8
2500
340.5
338.1
20.6
MC33063ADRJR
SON
DRJ
8
1000
367.0
367.0
35.0
MC34063ADR
SOIC
D
8
2500
340.5
338.1
20.6
MC34063ADRJR
SON
DRJ
8
1000
210.0
185.0
35.0
Pack Materials-Page 2
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