TI1 LM4671ITLX/NOPB Lm4671 filterless high efficiency 2.5w switching audio amplifier Datasheet

LM4671
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LM4671
Filterless High Efficiency 2.5W Switching Audio
Amplifier
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FEATURES
DESCRIPTION
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The LM4671 is a single supply, high efficiency 2.5W
switching audio amplifier. A low noise, filterless PWM
architecture eliminates the output filter, reducing
external component count, board area consumption,
system cost, and simplifying design.
1
2
No Output Filter Required for Inductive Loads
Externally Configurable Gain
Very Fast Turn On Time: 17μs (typ)
Minimum External Components
"Click and pop" Suppression Circuitry
Micro-Power Shutdown Mode
Available in Space-Saving DSBGA Package
APPLICATIONS
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Mobile Phones
PDAs
Portable Electronic Devices
KEY SPECIFICATIONS
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Efficiency @ 3.6V, 100mW into 8Ω Speaker:
80 % (typ)
Efficiency @ 3.6V, 400mW into 8Ω Speaker:
88 % (typ)
Efficiency @ 5V, 1W into 8Ω Speaker: 86 %
(typ)
Quiescent Current, 3.6V Supply: 2.8 mA (typ)
Total Shutdown Power Supply Current: 0.01
µA (typ)
Single Supply Range: 2.4 to 5.5 V
The LM4671 is designed to meet the demands of
mobile phones and other portable communication
devices. Operating on a single 5V supply, it is
capable of driving a 4Ω speaker load at a continuous
average output of 2.1W with less than 1% THD+N. Its
flexible power supply requirements allow operation
from 2.4V to 5.5V.
The LM4671 has high efficiency with speaker loads
compared to a typical Class AB amplifier. With a 3V
supply driving an 8Ω speaker, the IC's efficiency for a
100mW power level is 80%, reaching 88% at 400mW
output power.
The LM4671 features a low-power consumption
shutdown mode. Shutdown may be enabled by
driving the Shutdown pin to a logic low (GND).
The gain of the LM4671 is externally configurable
which allows independent gain control from multiple
sources by summing the signals.
Typical Application
Figure 1. Typical Audio Amplifier Application Circuit
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Connection Diagram
GND
IN+
A
Vo1
VDD
B
PGND
IN-
C
Vo2
1
2
SHUTDOWN
3
PVDD
Figure 2. 9 Bump DSBGA Package Top View
See Package Number YZR0009AAA
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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Absolute Maximum Ratings (1) (2) (3)
Supply Voltage (1)
6.0V
−65°C to +150°C
Storage Temperature
VDD + 0.3V ≥ V ≥ GND - 0.3V
Voltage at Any Input Pin
Power Dissipation (4)
Internally Limited
ESD Susceptibility, all other pins
(5)
2.0kV
ESD Susceptibility (6)
200V
Junction Temperature (TJMAX)
150°C
θJA (DSBGA)
Thermal Resistance
220°C/W
Soldering Information
See AN-1112 "MicroSMD Wafers Level Chip Scale Package" (Literature Number SNVA009)
(1)
(2)
(3)
(4)
(5)
(6)
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4671, TJMAX = 150°C. The typical θJA is 220°C/W for the DSBGA package.
Human body model, 100pF discharged through a 1.5kΩ resistor.
Machine Model, 220pF–240pF discharged through all pins.
Operating Ratings (1) (2)
TMIN ≤ TA ≤ TMAX
Temperature Range
−40°C ≤ TA ≤ 85°C
2.4V ≤ VDD ≤ 5.5V
Supply Voltage
(1)
(2)
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Electrical Characteristics (1) (2)
The following specifications apply for AV = 2V/V (RI = 150kΩ), RL = 15µH + 8Ω + 15µH unless otherwise specified. Limits
apply for TA = 25°C.
Symbol
Parameter
Conditions
LM4671
Typical (3)
Limit (4)
(5)
Units
(Limits)
|VOS|
Differential Output Offset Voltage
VI = 0V, AV = 2V/V,
VDD = 2.4V to 5.0V
5
mV (max)
PSRRGSM
GSM Power Supply Rejection Ratio
VDD = 2.4V to 5.0V
61
dB (min)
CMRRGSM
VDD = 2.4V to 5.0V
GSM Common Mode Rejection Ratio VIC = VDD/2 to 0.5V,
VIC = VDD/2 to VDD – 0.8V
68
dB (min)
|IIH|
Logic High Input Current
VDD = 5.0V, VI = 5.5V
17
100
μA (max)
|IIL|
Logic Low Input Current
VDD = 5.0V, VI = –0.3V
0.9
5
μA (max)
(1)
(2)
(3)
(4)
(5)
All voltages are measured with respect to the ground pin, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Typical specifications are specified at 25°C and represent the parametric norm.
Tested limits are specified to AOQL (Average Outgoing Quality Level).
Datasheet min/max specification limits are specified by design, test, or statistical analysis.
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Electrical Characteristics(1)(2) (continued)
The following specifications apply for AV = 2V/V (RI = 150kΩ), RL = 15µH + 8Ω + 15µH unless otherwise specified. Limits
apply for TA = 25°C.
Symbol
IDD
Parameter
Quiescent Power Supply Current
Conditions
LM4671
Typical (3)
Limit (4)
(5)
Units
(Limits)
VIN = 0V, No Load, VDD = 5.0V
6.4
VIN = 0V, No Load, VDD = 3.6V
3.8
6.2
mA (max)
mA
VIN = 0V, No Load, VDD =2.4V
2.0
3.0
mA (max)
VSHUTDOWN = 0V
VDD = 2.4V to 5.0V
0.01
1
μA (max)
ISD
Shutdown Current
VSDIH
Shutdown voltage input high
1.2
1.4
V (min)
VSDIL
Shutdown voltage input low
1.1
0.4
V (max)
ROSD
Output Impedance
270kΩ/RI
330kΩ/RI
V/V (min)
V/V (max)
AV
Gain
RSD
Resistance from Shutdown Pin to
GND
PO
Output Power
VSHUTDOWN = 0.4V
100
300kΩ/RI
kΩ
300
kΩ
RL = 15μH + 4Ω + 15μH
THD = 10% (max)
f = 1kHz, 22kHz BW
VDD = 5V
VDD = 3.6V
VDD = 2.5V
2.5
1.3
520
W
W
mW
RL = 15μH + 4Ω + 15μH
THD = 1% (max)
f = 1kHz, 22kHz BW
VDD = 5V
VDD = 3.6V
VDD = 2.5V
2.21
1.06
420
W
W
mW
RL = 15μH + 8Ω + 15μH
THD = 10% (max)
f = 1kHz, 22kHz BW
PO
THD+N
4
Output Power
Total Harmonic Distortion + Noise
VDD = 5V
1.7
W
VDD = 3.6V
870
mW
VDD = 2.5V
425
mW
RL = 15μH + 8Ω + 15μH
THD = 1% (max)
f = 1kHz, 22kHz BW
VDD = 5V
1.19
VDD = 3.6V
700
VDD = 2.5V
350
mW
VDD = 5V, PO = 0.1WRMS,
f = 1kHz
0.09
%
VDD = 3.6V, PO = 0.1WRMS,
f = 1kHz
0.04
%
VDD = 3.6V, PO = 0.1WRMS,
f = 5kHz
0.12
%
VDD = 3.6V, PO = 0.1WRMS,
f = 10kHz
0.05
%
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W
600
mW
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Electrical Characteristics(1)(2) (continued)
The following specifications apply for AV = 2V/V (RI = 150kΩ), RL = 15µH + 8Ω + 15µH unless otherwise specified. Limits
apply for TA = 25°C.
Symbol
PSRR
SNR
εOUT
Parameter
Power Supply Rejection Ratio
Conditions
LM4671
Typical (3)
Limit (4)
(5)
Units
(Limits)
VDD = 3.6V, 5V
VRipple = 200mVPP Sine,
fRipple = 217Hz
Inputs to AC GND, CI = 2μF
61.8
dB
VDD = 3.6V, 5V
VRipple = 200mVPP Sine,
fRipple = 1kHz
Inputs to AC GND, CI = 2μF
59.8
dB
VDD = 3.6V, 5V
VRipple = 200mVPP Sine,
fRipple = 10kHz
Inputs to AC GND, CI = 2μF
48.7
dB
VDD = 3.6V, 5V
VRipple = 200mVPP Sine,
fRipple = 217Hz
fIN = 1kHz, PO = 10mWRMS
65.7
dB
Signal to Noise Ratio
VDD = 5V, PO = 1WRMS
93
dB
58
μVRMS
Output Noise
VDD = 3.6V, f = 20Hz – 20kHz
Inputs to AC GND, CI = 2μF
No Weighting
VDD = 3.6V, Inputs to AC GND
CI = 2μF, A Weighted
38
μVRMS
68.3
dB
CMRR
Common Mode Rejection Ratio
VDD = 3.6V, VRipple = 1VPP Sine
fRipple = 217Hz
TWU
Wake-up Time
VDD = 3.6V
TSD
Shutdown Time
17
49
μs (max)
140
μs
External Components Description
(Figure 1)
Components
Functional Description
1.
CS
Supply bypass capacitor which provides power supply filtering. Refer to POWER SUPPLY BYPASSING for
information concerning proper placement and selection of the supply bypass capacitor.
2.
CI
Input AC coupling capacitor which blocks the DC voltage at the amplifier's input terminals.
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Typical Performance Characteristics
6
THD+N vs Frequency
VDD = 2.4V, RL = 15μH+4Ω+15μH,
PO = 375mW, 22kHz BW
THD+N vs Frequency
VDD = 3.6V, RL = 15μH+4Ω+15μH,
PO = 750mW, 22kHz BW
Figure 3.
Figure 4.
THD+N vs Frequency
VDD = 5V, RL = 15μH+4Ω+15μH,
PO = 1.5mW, 22kHz BW
THD+N vs Frequency
VDD = 2.4V, RL = 15μH+8Ω+15μH,
PO = 200mW, 22kHz BW
Figure 5.
Figure 6.
THD+N vs Frequency
VDD = 3.6V, RL = 15μH+8Ω+15μH,
PO = 500mW, 22kHz BW
THD+N vs Frequency
VDD = 5V, RL = 15μH+8Ω+15μH,
PO = 1W, 22kHz BW
Figure 7.
Figure 8.
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Typical Performance Characteristics (continued)
THD+N vs Output Power
VDD = 5V, RL = 15μH+4Ω+15μH,
f = 1kHz, 22kHz BW
THD+N vs Output Power
VDD = 5V, RL = 15μH+8Ω+15μH,
f = 1kHz, 22kHz BW
Figure 9.
Figure 10.
CMRR vs Frequency
VDD = 3.6V, RL = 15μH+8Ω+15μH,
Vripple = 1Vp-p, 22kHz BW
PSRR vs Frequency
VDD = 3.6V, RL = 15μH+8Ω+15μH,
Vripple = 200mVp-p, 22kHz BW
Figure 11.
Figure 12.
Efficiency vs Output Power
RL = 15μH+4Ω+15μH,
f = 1kHz, 22kHz BW
Efficiency vs Output Power
RL = 15μH+8Ω+15μH,
f = 1kHz, 22kHz BW
Figure 13.
Figure 14.
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Typical Performance Characteristics (continued)
8
Power Dissipation vs Output Power
RL = 15μH+4Ω+15μH,
f = 1kHz, 22kHz BW
Power Dissipation vs Output Power
RL = 15μH+8Ω+15μH,
f = 1kHz, 22kHz BW
Figure 15.
Figure 16.
Output Power vs Supply Voltage
RL = 15μH+4Ω+15μH,
VDD = 3.6V
Output Power vs Supply Voltage
RL = 15μH+8Ω+15μH,
VDD = 3.6V
Figure 17.
Figure 18.
Gain vs Supply Voltage
Rin = 150kΩ
Supply Current vs Supply Voltage
RL = 15μH+8Ω+15μH
Figure 19.
Figure 20.
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Typical Performance Characteristics (continued)
Shutdown Current vs Supply Voltage
RL = 15μH+8Ω+15μH
Figure 21.
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APPLICATION INFORMATION
GENERAL AMPLIFIER FUNCTION
The LM4671 features a filterless modulation scheme. The differential outputs of the device switch at 300kHz from
VDD to GND. When there is no input signal applied, the two outputs (VO1 and VO2) switch with a 50% duty cycle,
with both outputs in phase. Because the outputs of the LM4671 are differential, the two signals cancel each
other. This results in no net voltage across the speaker, thus there is no load current during an idle state,
conserving power.
With an input signal applied, the duty cycle (pulse width) of the LM4671 outputs changes. For increasing output
voltages, the duty cycle of VO1 increases, while the duty cycle of VO2 decreases. For decreasing output voltages,
the converse occurs, the duty cycle of VO2 increases while the duty cycle of VO1 decreases. The difference
between the two pulse widths yields the differential output voltage.
POWER DISSIPATION AND EFFICIENCY
In general terms, efficiency is considered to be the ratio of useful work output divided by the total energy required
to produce it with the difference being the power dissipated, typically, in the IC. The key here is “useful” work. For
audio systems, the energy delivered in the audible bands is considered useful including the distortion products of
the input signal. Sub-sonic (DC) and super-sonic components (>22kHz) are not useful. The difference between
the power flowing from the power supply and the audio band power being transduced is dissipated in the
LM4671 and in the transducer load. The amount of power dissipation in the LM4671 is very low. This is because
the ON resistance of the switches used to form the output waveforms is typically less than 0.25Ω. This leaves
only the transducer load as a potential "sink" for the small excess of input power over audio band output power.
The LM4671 dissipates only a fraction of the excess power requiring no additional PCB area or copper plane to
act as a heat sink.
DIFFERENTIAL AMPLIFIER EXPLANATION
As logic supply voltages continue to shrink, designers are increasingly turning to differential analog signal
handling to preserve signal to noise ratios with restricted voltage swing. The LM4671 is a fully differential
amplifier that features differential input and output stages. A differential amplifier amplifies the difference between
the two input signals. Traditional audio power amplifiers have typically offered only single-ended inputs resulting
in a 6dB reduction in signal to noise ratio relative to differential inputs. The LM4671 also offers the possibility of
DC input coupling which eliminates the two external AC coupling, DC blocking capacitors. The LM4671 can be
used, however, as a single ended input amplifier while still retaining its fully differential benefits. In fact,
completely unrelated signals may be placed on the input pins. The LM4671 simply amplifies the difference
between the signals. A major benefit of a differential amplifier is the improved common mode rejection ratio
(CMRR) over single input amplifiers. The common-mode rejection characteristic of the differential amplifier
reduces sensitivity to ground offset related noise injection, especially important in high noise applications.
PCB LAYOUT CONSIDERATIONS
As output power increases, interconnect resistance (PCB traces and wires) between the amplifier, load and
power supply create a voltage drop. The voltage loss on the traces between the LM4671 and the load results is
lower output power and decreased efficiency. Higher trace resistance between the supply and the LM4671 has
the same effect as a poorly regulated supply, increase ripple on the supply line also reducing the peak output
power. The effects of residual trace resistance increases as output current increases due to higher output power,
decreased load impedance or both. To maintain the highest output voltage swing and corresponding peak output
power, the PCB traces that connect the output pins to the load and the supply pins to the power supply should
be as wide as possible to minimize trace resistance.
The use of power and ground planes will give the best THD+N performance. While reducing trace resistance, the
use of power planes also creates parasite capacitors that help to filter the power supply line.
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The inductive nature of the transducer load can also result in overshoot on one or both edges, clamped by the
parasitic diodes to GND and VDD in each case. From an EMI standpoint, this is an aggressive waveform that can
radiate or conduct to other components in the system and cause interference. It is essential to keep the power
and output traces short and well shielded if possible. Use of ground planes, beads, and micro-strip layout
techniques are all useful in preventing unwanted interference.
As the distance from the LM4671 and the speaker increase, the amount of EMI radiation will increase since the
output wires or traces acting as antenna become more efficient with length. What is acceptable EMI is highly
application specific. Ferrite chip inductors placed close to the LM4671 may be needed to reduce EMI radiation.
The value of the ferrite chip is very application specific.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection ratio (PSRR). The capacitor (CS) location should be as close as possible to the LM4671. Typical
applications employ a voltage regulator with a 10µF and a 0.1µF bypass capacitors that increase supply stability.
These capacitors do not eliminate the need for bypassing on the supply pin of the LM4671. A 1µF tantalum
capacitor is recommended.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4671 contains shutdown circuitry that reduces
current draw to less than 0.01µA. The trigger point for shutdown is shown as a typical value in the Electrical
Characteristics Tables and in the Shutdown Hysteresis Voltage graphs found in the Typical Performance
Characteristics section. It is best to switch between ground and supply for minimum current usage while in the
shutdown state. While the LM4671 may be disabled with shutdown voltages in between ground and supply, the
idle current will be greater than the typical 0.01µA value.
The LM4671 has an internal resistor connected between GND and Shutdown pins. The purpose of this resistor is
to eliminate any unwanted state changes when the Shutdown pin is floating. The LM4671 will enter the shutdown
state when the Shutdown pin is left floating or if not floating, when the shutdown voltage has crossed the
threshold. To minimize the supply current while in the shutdown state, the Shutdown pin should be driven to
GND or left floating. If the Shutdown pin is not driven to GND, the amount of additional resistor current due to the
internal shutdown resistor can be found by Equation (1) below.
(VSD - GND) / 60kΩ
(1)
With only a 0.5V difference, an additional 8.3µA of current will be drawn while in the shutdown state.
PROPER SELECTION OF EXTERNAL COMPONENTS
The gain of the LM4671 is set by the external resistors, Ri in Figure 1, The Gain is given by Equation (2) below.
Best THD+N performance is achieved with a gain of 2V/V (6dB).
AV = 2 * 150 kΩ / Ri (V/V)
(2)
It is recommended that resistors with 1% tolerance or better be used to set the gain of the LM4671. The Ri
resistors should be placed close to the input pins of the LM4671. Keeping the input traces close to each other
and of the same length in a high noise environment will aid in noise rejection due to the good CMRR of the
LM4671. Noise coupled onto input traces which are physically close to each other will be common mode and
easily rejected by the LM4671.
Input capacitors may be needed for some applications or when the source is single-ended (see Figures 3 and 5).
Input capacitors are needed to block any DC voltage at the source so that the DC voltage seen between the
input terminals of the LM4671 is 0V. Input capacitors create a high-pass filter with the input resistors, Ri. The
–3dB point of the high-pass filter is found using Equation (3) below.
fC = 1 / (2πRi Ci ) (Hz)
(3)
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The input capacitors may also be used to remove low audio frequencies. Small speakers cannot reproduce low
bass frequencies so filtering may be desired. When the LM4671 is using a single-ended source, power supply
noise on the ground is seen as an input signal by the +IN input pin that is capacitor coupled to ground (see
Figures 5 -7). Setting the high-pass filter point above the power supply noise frequencies, 217Hz in a GSM
phone, for example, will filter out this noise so it is not amplified and heard on the output. Capacitors with a
tolerance of 10% or better are recommended for impedance matching.
DIFFERENTIAL CIRCUIT CONFIGURATIONS
The LM4671 can be used in many different circuit configurations. The simplest and best performing is the DC
coupled, differential input configuration shown in Figure 22. Equation (2) above is used to determine the value of
the Ri resistors for a desired gain.
Input capacitors can be used in a differential configuration as shown in Figure 23. Equation (3) above is used to
determine the value of the Ci capacitors for a desired frequency response due to the high-pass filter created by
Ci and Ri. Equation (2) above is used to determine the value of the Ri resistors for a desired gain
The LM4671 can be used to amplify more than one audio source. Figure 24 shows a dual differential input
configuration. The gain for each input can be independently set for maximum design flexibility using the Ri
resistors for each input and Equation (2). Input capacitors can be used with one or more sources as well to have
different frequency responses depending on the source or if a DC voltage needs to be blocked from a source.
SINGLE-ENDED CIRCUIT CONFIGURATIONS
The LM4671 can also be used with single-ended sources but input capacitors will be needed to block any DC at
the input terminals. Figure 25 shows the typical single-ended application configuration. The equations for Gain,
Equation (2), and frequency response, Equation (3), hold for the single-ended configuration as shown in
Figure 25.
When using more than one single-ended source as shown in Figure 26, the impedance seen from each input
terminal should be equal. To find the correct values for Ci3 and Ri3 connected to the +IN input pin the equivalent
impedance of all the single-ended sources are calculated. The single-ended sources are in parallel to each other.
The equivalent capacitor and resistor, Ci3 and Ri3, are found by calculating the parallel combination of all
Civalues and then all Ri values. Equations (4) and (5) below are for any number of single-ended sources.
Ci3 = Ci1 + Ci2 + Cin ... (μF)
(4)
Ri3 = 1 / (1/Ri1 + 1/Ri2 + 1/Rin ...) (Ω)
(5)
The LM4671 may also use a combination of single-ended and differential sources. A typical application with one
single-ended source and one differential source is shown in Figure 27. Using the principle of superposition, the
external component values can be determined with the above equations corresponding to the configuration.
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Figure 22. Differential input configuration
Figure 23. Differential input configuration with input capacitors
Figure 24. Dual differential input configuration
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Figure 25. Single-ended input configuration
Figure 26. Dual single-ended input configuration
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Figure 27. Dual input with a single-ended input and a differential input
REFERENCE DESIGN BOARD SCHEMATIC
Figure 28. Reference Design Board Schematic
In addition to the minimal parts required for the application circuit, a measurement filter is provided on the
evaluation circuit board so that conventional audio measurements can be conveniently made without additional
equipment. This is a balanced input, grounded differential output low pass filter with a 3dB frequency of
approximately 35kHz and an on board termination resistor of 300Ω (see Figure 28). Note that the capacitive load
elements are returned to ground. This is not optimal for common mode rejection purposes, but due to the
independent pulse format at each output there is a significant amount of high frequency common mode
component on the outputs. The grounded capacitive filter elements attenuate this component at the board to
reduce the high frequency CMRR requirement placed on the analysis instruments.
Even with the grounded filter the audio signal is still differential, necessitating a differential input on any analysis
instrument connected to it. Most lab instruments that feature BNC connectors on their inputs are NOT differential
responding because the ring of the BNC is usually grounded.
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Product Folder Links: LM4671
15
LM4671
SNAS258D – MARCH 2005 – REVISED MAY 2013
www.ti.com
The commonly used Audio Precision analyzer is differential, but its ability to accurately reject high frequency
signals is questionable necessitating the on board measurement filter. When in doubt or when the signal needs
to be single-ended, use an audio signal transformer to convert the differential output to a single ended output.
Depending on the audio transformer's characteristics, there may be some attenuation of the audio signal which
needs to be taken into account for correct measurement of performance.
Measurements made at the output of the measurement filter suffer attenuation relative to the primary, unfiltered
outputs even at audio frequencies. This is due to the resistance of the inductors interacting with the termination
resistor (300Ω) and is typically about -0.25dB (3%). In other words, the voltage levels (and corresponding power
levels) indicated through the measurement filter are slightly lower than those that actually occur at the load
placed on the unfiltered outputs. This small loss in the filter for measurement gives a lower output power reading
than what is really occurring on the unfiltered outputs and its load.
LM4671 DSBGA BOARD ARTWORK
Figure 29. Composite View
Figure 30. Silk Screen
Figure 31. Top Layer
16
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Product Folder Links: LM4671
LM4671
www.ti.com
SNAS258D – MARCH 2005 – REVISED MAY 2013
Figure 32. Internal Layer 1, GND
Figure 33. Internal Layer 2, GND
Figure 34. Bottom Layer
Revision History
Rev
Date
1.0
03/16/05
Initial release.
Description
1.01
12/17/07
Some text edits.
1.02
03/03/08
Edited the SHUTDOWN FUNCTION section (under Application Information).
D
05/02/13
Changed layout of National Data Sheet to TI format
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Product Folder Links: LM4671
17
PACKAGE OPTION ADDENDUM
www.ti.com
2-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM4671ITL/NOPB
ACTIVE
DSBGA
YZR
9
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
G
E7
LM4671ITLX/NOPB
ACTIVE
DSBGA
YZR
9
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
G
E7
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
LM4671ITL/NOPB
DSBGA
YZR
9
250
178.0
8.4
LM4671ITLX/NOPB
DSBGA
YZR
9
3000
178.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.7
1.7
0.76
4.0
8.0
Q1
1.7
1.7
0.76
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM4671ITL/NOPB
DSBGA
YZR
LM4671ITLX/NOPB
DSBGA
YZR
9
250
210.0
185.0
35.0
9
3000
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
YZR0009xxx
D
0.600±0.075
E
TLA09XXX (Rev C)
D: Max = 1.542 mm, Min =1.481 mm
E: Max = 1.542 mm, Min =1.481 mm
4215046/A
NOTES:
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
B. This drawing is subject to change without notice.
www.ti.com
12/12
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