MURA115, MURA120, NRVUA120V, SURA8120 Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. Features • • • • • • Small Compact Surface Mountable Package with J−Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction Low Forward Voltage Drop (0.71 V Max @ 1.0 A, TJ = 150°C) NRVUA and SURA8 Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* www.onsemi.com ULTRAFAST RECTIFIERS 1 AMPERE, 100−200 VOLTS SMA CASE 403D Mechanical Characteristics: MARKING DIAGRAM • Case: Epoxy, Molded • Weight: 70 mg (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal U4x AYWW G Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: • • 260°C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Protection: ♦ Human Body Model > 4000 V (Class 3) ♦ Machine Model > 400 V (Class C) U4x = Device Code x = C for MURA115 = D for MURA120 A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Package Shipping† MURA115T3G SMA (Pb−Free) 5,000/Tape & Reel MURA120T3G SMA (Pb−Free) 5,000/Tape & Reel NRVUA120VT3G SMA (Pb−Free) 5,000/Tape & Reel SURA8120T3G SMA (Pb−Free) 5,000/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2016 October, 2016 − Rev. 9 1 Publication Order Number: MURA115T3/D MURA115, MURA120, NRVUA120V, SURA8120 MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MURA115T3G MURA120T3G/SURA8120T3G/NRVUA120VT3G VRRM VRWM VR Average Rectified Forward Current @ TL = 155°C @ TL = 135°C IF(AV) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM Value Unit V 150 200 A 1.0 2.0 Operating Junction Temperature Range A 40 TJ −65 to +175 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction−to−Lead (TL = 25°C) (Note 1) Thermal Resistance, Junction−to−Ambient (Note 1) Symbol Max Unit PsiJL (Note 2) RqJA 24 °C/W 216 1. Rating applies when surface mounted on the minimum pad size recommended, PC Board FR−4. 2. In compliance with JEDEC 51, these values (historically represented by RqJL) are now referenced as PsiJL. ELECTRICAL CHARACTERISTICS Characteristic Symbol Maximum Instantaneous Forward Voltage (Note 3) (iF = 1.0 A, TJ = 25°C) (iF = 1.0 A, TJ = 150°C) vF Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TJ = 25°C) (Rated DC Voltage, TJ = 150°C) iR Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) trr Max Unit V 0.875 0.71 mA 2.0 50 ns 35 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. www.onsemi.com 2 MURA115, MURA120, NRVUA120V, SURA8120 TYPICAL CHARACTERISTICS 100 TJ = 175°C IR, REVERSE CURRENT (mA) IR, REVERSE CURRENT (mA) 100 10 TJ = 150°C 1 TJ = 100°C 0.1 0.01 TJ = 175°C 10 TJ = 150°C 1 TJ = 100°C 0.1 TJ = 25°C TJ = 25°C 0.01 0.001 20 40 60 80 100 120 140 160 180 200 0 80 100 120 140 160 180 200 Figure 2. Maximum Reverse Current TC = 175°C 150°C 100°C 0.4 60 Figure 1. Typical Reverse Current 0.1 0.01 0.3 40 VR, REVERSE VOLTAGE (VOLTS) 10 1 20 VR, REVERSE VOLTAGE (VOLTS) IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 0 0.5 25°C 0.6 −65°C 0.7 0.8 0.9 1.0 1.1 10 TC = 175°C 1 0.1 150°C 100°C 0.01 0.3 VF, INSTANTANEOUS VOLTAGE (VOLTS) 0.4 0.5 0.6 25°C 0.7 −65°C 0.8 0.9 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 4. Maximum Forward Voltage Figure 3. Typical Forward Voltage www.onsemi.com 3 1.1 MURA115, MURA120, NRVUA120V, SURA8120 TYPICAL CHARACTERISTICS 50 50 NOTE: TYPICAL CAPACITANCE AT 0 V = 45 pF 35 30 25 20 15 10 40 35 30 25 20 15 10 5 5 0 0 4 8 12 16 20 24 28 32 36 0 40 8 12 16 20 24 28 32 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance Figure 6. Maximum Capacitance 5 4 dc 3 SQUARE WAVE 2 1 0 80 90 4 VR, REVERSE VOLTAGE (VOLTS) IF(AV), AVERAGE FORWARD CURRENT (A) 0 NOTE: MAXIMUM CAPACITANCE AT 0 V = 47 pF 45 C, CAPACITANCE (pF) 40 100 110 120 130 140 150 160 170 180 160 180 dc 1 0.75 SQUARE WAVE 0.5 0.25 0 20 0 40 60 80 100 120 140 TA, AMBIENT TEMPERATURE (°C) Figure 8. Current Derating, Ambient (FR−4 Board with Minimum Pad) 3 2.5 dc 2 SQUARE WAVE 1.5 1 0.5 0 0.5 40 1.25 Figure 7. Current Derating, Lead 0 36 1.5 TL, LEAD TEMPERATURE (°C) PF, AVERAGE POWER DISSIPATION (W) IF(AV), AVERAGE FORWARD CURRENT (A) C, CAPACITANCE (pF) 45 1 1.5 2 2.5 3 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 9. Power Dissipation www.onsemi.com 4 3.5 MURA115, MURA120, NRVUA120V, SURA8120 PACKAGE DIMENSIONS SMA CASE 403D ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L. E b DIM A A1 b c D E HE L D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) MIN 1.97 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.10 2.20 0.10 0.20 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.078 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.083 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.087 0.008 0.064 0.016 0.115 0.180 0.220 0.060 STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE A L A1 c SOLDERING FOOTPRINT* 4.000 0.157 2.000 0.079 2.000 0.079 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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