Vishay MBR3045CTPBF Schottky rectifier, 2 x 15 a Datasheet

VS-MBR3045CTPbF, VS-MBR3045CT-N3
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Vishay Semiconductors
Schottky Rectifier, 2 x 15 A
FEATURES
Base 2
common
cathode
Anode
TO-220AB
•
•
•
•
Anode
2
1 Common 3
cathode
•
•
•
•
PRODUCT SUMMARY
Package
TO-220AB
IF(AV)
2 x 15 A
VR
45 V
VF at IF
See Electrical table
IRM max.
100 mA at 125 °C
TJ max.
150 °C
Diode variation
Common cathode
EAS
10 mJ
150 °C TJ operation
Low forward voltage drop
High frequency operation
High purity, high temperature epoxy
encapsulation for enhanced mechanical
strength and moisture resistance
Guard ring for enhanced ruggedness and long
term reliability
Compliant to RoHS Directive 2002/95/EC
Designed and qualified according to JEDEC-JESD47
Halogen-free according to IEC 61249-2-21 definition
(-N3 only)
DESCRIPTION
This center tap Schottky rectifier has been optimized for low
reverse leakage at high temperature. The proprietary barrier
technology allows for reliable operation up to 150 °C
junction temperature. Typical applications are in switching
power supplies, converters, freewheeling diodes, and
reverse battery protection.
MAJOR RATINGS AND CHARACTERISTICS
CHARACTERISTICS
SYMBOL
IF(AV)
VALUES
UNITS
30
A
35/45
V
Rectangular waveform (per device)
VRRM
IFRM
TC = 123 °C (per leg)
IFSM
tp = 5 μs sine
VF
20 Apk, TJ = 125 °C
TJ
Range
30
A
1020
0.6
V
- 65 to 150
°C
VS-MBR3045CTPbF
VS-MBR3045CT-N3
UNITS
45
45
V
VOLTAGE RATINGS
SYMBOL
PARAMETER
VR
Maximum DC reverse voltage
Maximum working peak reverse voltage
VRWM
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
Maximum average
forward current
per leg
per device
Peak repetitive forward current per leg
TEST CONDITIONS
Non-repetitive peak surge current
TC = 123 °C, rated VR
IFRM
Rated VR, square wave, 20 kHz, TC = 123 °C
Non-repetitive avalanche energy per leg
Repetitive avalanche current per leg
Revision: 26-Aug-11
IFSM
UNITS
15
IF(AV)
5 µs sine or 3 µs rect. pulse
VALUES
30
Following any rated load
condition and with rated
VRRM applied
30
A
1020
Surge applied at rated load conditions halfwave,
single phase, 60 Hz
200
EAS
TJ = 25 °C, IAS = 2 A, L = 5 mH
10
mJ
IAR
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical
2
A
Document Number: 94292
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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VS-MBR3045CTPbF, VS-MBR3045CT-N3
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Vishay Semiconductors
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
TJ = 25 °C
30 A
VFM (1)
Maximum forward voltage drop
20 A
TJ = 125 °C
30 A
Maximum instantaneous reverse current
IRM (1)
Threshold voltage
VF(TO)
TJ = 25 °C
Rated DC voltage
TJ = 125 °C
TJ = TJ maximum
VALUES
UNITS
0.76
V
0.6
0.72
1
100
mA
0.29
V
13.6
m
Forward slope resistance
rt
Maximum junction capacitance
CT
VR = 5 VDC (test signal range 100 kHz to 1 MHz) 25 °C
800
pF
Typical series inductance
LS
Measured from top of terminal to mounting plane
8.0
nH
10 000
V/µs
VALUES
UNITS
Maximum voltage rate of change
dV/dt
Rated VR
Note
(1) Pulse width < 300 μs, duty cycle < 2 %
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Maximum junction temperature range
TJ
- 65 to 150
Maximum storage temperature range
TStg
- 65 to 175
Maximum thermal resistance,
junction to case per leg
RthJC
DC operation
1.5
Typical thermal resistance,
case to heatsink
RthCS
Mounting surface, smooth and greased
Only for TO-220
0.50
Maximum thermal resistance,
junction to ambient
RthJA
DC operation
For D2PAK and TO-262
Approximate weight
Mounting torque
Marking device
Revision: 26-Aug-11
minimum
maximum
Non-lubricated threads
Case style TO-220AB
°C
°C/W
50
2
g
0.07
oz.
6 (5)
kgf · cm
(lbf · in)
12 (10)
MBR3045CT
Document Number: 94292
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MBR3045CTPbF, VS-MBR3045CT-N3
IF - Instantaneous Forward Current (A)
www.vishay.com
Vishay Semiconductors
100
10
IR - Reverse Current (mA)
1000
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
TJ = 150 °C
100
10
TJ = 100 °C
TJ = 125 °C
1
TJ = 75 °C
TJ = 50 °C
0.1
0.01
TJ = 25 °C
1
0.001
0
0.3
0.6
0.9
0
1.5
1.2
10
20
30
40
50
VFM - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
(Per Leg)
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage (Per Leg)
CT - Junction Capacitance (pF)
1000
TJ = 25 °C
100
10
0
20
30
40
50
VR - Reverse Voltage (V)
ZthJC - Thermal Impedance (°C/W)
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage (Per Leg)
10
1
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
PDM
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
0.01
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
0.1
1
10
100
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
Revision: 26-Aug-11
Document Number: 94292
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MBR3045CTPbF, VS-MBR3045CT-N3
www.vishay.com
Vishay Semiconductors
15
140
Average Power Loss (W)
Allowable Case Temperature (°C)
150
DC
130
Square wave (D = 0.50)
Rated VR applied
120
110
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
12
9
RMS limit
6
DC
3
See note (1)
0
100
0
5
15
10
20
5
0
25
10
15
20
25
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current (Per Leg)
Fig. 6 - Forward Power Loss Characteristics (Per Leg)
IFSM - Non-Repetitive Surge Current (A)
IF(AV) - Average Forward Current (A)
1000
At any rated load condition
and with rated VRRM applied
following surge
100
10
100
1000
10 000
tp - Square Wave Pulse Duration (µs)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
Note
Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR
(1)
Revision: 26-Aug-11
Document Number: 94292
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-MBR3045CTPbF, VS-MBR3045CT-N3
www.vishay.com
Vishay Semiconductors
ORDERING INFORMATION TABLE
Device code
VS- MBR
1
2
30
45
CT
PbF
3
4
5
6
1
-
Vishay Semiconductors product
2
-
Schottky MBR series
3
-
Current rating (30 = 30 A)
4
-
Voltage ratings (045 = 45 V)
5
-
CT = Essential part number
6
-
Environmental digit
PbF = Lead (Pb)-free and RoHS compliant
-N3 = Halogen-free, RoHS compliant, and totally lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-MBR3045CTPbF
50
1000
Antistatic plastic tube
VS-MBR3045CT-N3
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
Part marking information
Revision: 26-Aug-11
www.vishay.com/doc?95222
TO-220AB PbF
www.vishay.com/doc?95225
TO-220AB -N3
www.vishay.com/doc?95028
Document Number: 94292
5
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Outline Dimensions
Vishay Semiconductors
TO-220AB
DIMENSIONS in millimeters and inches
A
(6)
E
E2
ØP
0.014 M B A M
(7)
A
B
Seating
plane
A
Thermal pad
(E)
A1
1
Q
(6)
D
(H1)
H1
(7)
C
D2 (6)
(6) D
2 3
D
L1 (2)
C
Detail B
D1
3xb
1
2
3
3 x b2
Detail B
C
E1 (6)
L
Base metal
View A - A
c
Plating
c1 (4)
c
A
2x e
A2
e1
(b, b2)
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead assignments
Lead tip
Diodes
Conforms to JEDEC outline TO-220AB
1. - Anode/open
2. - Cathode
3. - Anode
SYMBOL
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.56
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.25
8.38
9.02
11.68
12.88
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.101
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.600
0.330
0.355
0.460
0.507
NOTES
A
A1
A2
b
b1
4
b2
b3
4
c
c1
4
D
3
D1
D2
6
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1 and E do not include mold flash. Mold flash
shall not exceed 0.127 mm (0.005") per side. These dimensions
are measured at the outermost extremes of the plastic body
(4) Dimension b1, b3 and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2 and
E1
Document Number: 95222
Revision: 08-Mar-11
SYMBOL
E
E1
E2
e
e1
H1
L
L1
ØP
Q

(7)
(8)
MILLIMETERS
MIN.
MAX.
10.11
10.51
6.86
8.89
0.76
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.73
2.60
3.00
90° to 93°
INCHES
MIN.
MAX.
0.398
0.414
0.270
0.350
0.030
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.147
0.102
0.118
90° to 93°
NOTES
3, 6
6
7
6, 7
2
Dimensions E2 x H1 define a zone where stamping and
singulation irregularities are allowed
Outline conforms to JEDEC TO-220, except A2 (maximum) and
D2 (minimum) where dimensions are derived from the actual
package outline
For technical questions within your region, please contact one of the following:
[email protected], [email protected], [email protected]
www.vishay.com
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Revision: 12-Mar-12
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Document Number: 91000
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