ACS244MS Radiation Hardened Non-Inverting, Octal, Three-State Buffer/Line Driver March 1998 Features Description • QML Qualified Per MIL-PRF-38535 Requirements The Radiation Hardened ACS244MS is a Non-Inverting, Octal, Three-State Buffer/Line Driver with two active-LOW Enable inputs (AE and BE). Each Enable input controls four outputs. When an Enable input is LOW, the corresponding outputs are active. A HIGH on an Enable input causes the corresponding outputs to be high impedance, regardless of the input levels. • 1.25Micron Radiation Hardened SOS CMOS • Radiation Environment - Latch-up Free Under any Conditions - Total Dose . . . . . . . . . . . . . . . . . . . . . . 3 x 105 RAD(Si) - SEU Immunity . . . . . . . . . . . <1 x 10-10 Errors/Bit/Day - SEU LET Threshold . . . . . . . . . . . >100MeV/(mg/cm2) The ACS244MS is fabricated on a CMOS Silicon on Sapphire (SOS) process, which provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. These devices offer significant power reduction and faster performance when compared to ALSTTL types. • Input Logic Levels . VIL = (0.3V)(VCC), VIH = (0.7V)(VCC) • Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . ±16mA • Quiescent Supply Current. . . . . . . . . . . . . . . . . . . .20µA • Propagation Delay . . . . . . . . . . . . . . . . . . . . . . . . . 9.0ns Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed below must be used when ordering. Applications Detailed Electrical Specifications for the ACS244 are contained in SMD 5962-98541. A “hot-link” is provided on our homepage with instructions for downloading. http://www.intersil.com/data/sm/index.htm • Databus Driving • Data Routing • Redundant Data Control Circuitry Ordering Information SMD PART NUMBER TEMP. RANGE (oC) INTERSIL PART NUMBER 5962F9854101VRC ACS244DMSR-02 N/A ACS244D/Sample-02 5962F9854101VXC ACS244KMSR-02 N/A N/A -55 to 125 25 PACKAGE 20 Ld SBDIP CASE OUTLINE CDIP2-T20 20 Ld SBDIP CDIP2-T20 -55 to 125 20 Ld Flatpack CDFP4-F20 ACS244K/Sample-02 25 20 Ld Flatpack CDFP4-F20 ACS244HMSR-02 25 Die N/A Pinouts ACS244 (SBDIP) TOP VIEW ACS244 (FLATPACK) TOP VIEW AE 1 1 20 VCC 2 20 VCC 19 BE AE AI1 AI1 2 19 BE BO4 3 18 AO1 BO4 3 18 AO1 17 BI4 AI2 4 17 BI4 BO3 5 16 AO2 AI3 6 15 BI3 BO2 7 14 AO3 AI4 8 13 BI2 AI2 BO3 4 5 16 AO2 AI3 6 BO2 7 14 AO3 AI4 8 13 BI2 BO1 9 12 AO4 BO1 9 12 AO4 GND 10 11 BI1 GND 10 15 BI3 11 BI1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 1 File Number 4479 ACS244MS Die Characteristics PASSIVATION DIE DIMENSIONS: Type: Phosphorous Silicon Glass (PSG) Thickness: 1.30µm ±0.15µm Size: 2540µm x 2540µm (100 mils x 100mils) Thickness: 525µm ±25µm (20.6 mils ±1 mil) Bond Pad: 110µm x 110µm (4.3 x 4.3 mils) SPECIAL INSTRUCTIONS: METALLIZATION: Al Metal 1 Thickness: 0.7µm ±0.1µm Metal 2 Thickness: 1.0µm ±0.1µm Bond VCC First ADDITIONAL INFORMATION: Worst Case Density: <2.0 x 105 A/cm2 Transistor Count: 214 SUBSTRATE POTENTIAL: Unbiased Insulator Metallization Mask Layout ACS244MS AI1 (2) VCC (20) AE (1) VCC (20) BE (19) (18) AO1 BO4 (3) (17) BI4 AI2 (4) (16) AO2 BO3 (5) (15) BI3 AI3 (6) (14) AO3 BO2 (7) (13) BI2 AI4 (8) BO1 (9) AO4 (12) (10) (10) GND GND (11) BI1 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 2 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029