CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +180C) High current capability (up to 4A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable production yield Highly compliant to accommodate wide co-planarity variations Automated probe manufacturing enables low cost and short lead time DETAIL A SCALE 10 : 1 Recommended Torque: 6 in lbs Or Hand tighten Compression screw ~1/3 turn after it touches the BGA top surface. 49.23 33.6000 74.89 46.13 55.6 19.13 5.53 2.00 4.13 A 12.50 24.23 7.5 6.0 12.50 4.0 2.9 4.00 33.50 18.50 26.73 Description: CBT-BGA432 19mm 0.8mm 23x23 array Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6012 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 121.61 STATUS: Released SHEET: 1 OF 5 REV. C ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 1:1 FILE: CBT-BGA-6012 DATE: 9/6/2012 26.725 BACKING PLATE OUTLINE 25.075 Bottom Guide A1 Corner 24.225 SOCKET BASE OULTINE 1.71 (x4) NON-PLATED 12.1125 10.8625 8.80 8.3225±0.025 0.85 (x2) NON-PLATED 25.075 Bottom Guide 0 0.40 (x432) PAD 5.7825±0.025 0.80 Typ. 8.80 10.8625 12.1125 10.8625 8.80 0 8.80 10.8625 12.1125 12.1125 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6012 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 121.61 STATUS: Released SHEET: 2 OF 5 REV. C ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 4:1 FILE: CBT-BGA-6012 DATE: 9/6/2012 0.20 C SEE NOTE 5 0.20 C Ironwood Package Code: BGA432D A A1 A D 6.06 B 0,20 B 6.44 E e 0.8500 b C DETAIL B SCALE 6 : 1 3.0000 (x4) 0.25 C A B 0.10 SEE NOTE 3 DIM Minimum Maximum A 2.5 A1 0.36 0.46 b 0.60 D 19.00 BSC E 19.00 BSC e 0.8 BSC ARRAY 23 X 23 PIN COUNT 432 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane C. 4. Datum C (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6012 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 121.61 STATUS: Released SHEET: 3 OF 5 REV. C ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 3:1 FILE: CBT-BGA-6012 DATE: 9/6/2012 ITEM NO. 1 2 3 4 2 6 4 5 14 10 1 22 Floating Guide 19mm 0.8mm 23X23 array centered 12 13 14 15 16 17 Middle Guide 19mm 0.8mm 23X23 array centered Bottom Guide 19MM, 23X23 ARY, 0.8MM BGA Chip, 19MM 23X23ARRAY 0.8MM PITCH PCB, 19MM 23x23 ARRAY 0.8MM PITCH Insulation plate Backing Plate 19mm #0-80X0.25", 90 deg., head pin guide screw, Peek material #0-80 X .625 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE Floating Guide Spring SBT Pin, SBT-BGA 0.5mm-0.8mm IC frame 19mm IC 12.4mm pocket 18 8 20 21 22 19 12 13 11 11 21 15 7 8 9 10 6 9 3 Material CBT Socket Base 19mm centered pocket Ni Plated Compression Screw Latch Screw, M3 x 12mm, Low Head Cap, SS Hinge Pin and Snap Ring, 3mm OD, 30mm long, 1045 Stl, Blk Oxide Precision Compression Spring, Zinc-Plated Music Wire, 1/2" Length, .12" OD, .016" Wire Spring Clamshell lid assembly Dowel pin, 1/32" X 1/4", SS CBT socket lid for 19mm chip Ni Plated Compression plate 19mm 5 7 DESCRIPTION 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy 18-8 Stainless Steel AISI 1045 Steel, cold drawn Zinc Plated Music Wire Steel Music Wire Stainless Steel (18-8) 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy 1.70 18 PEEK Ceramic filled PEEK Ceramic filled Semitron MDS 100 Material <not specified> Material <not specified> Ultem 7075-T6, Plate (SS) PEEK unfilled Alloy Steel Alloy Steel (SS) Ultem/Cirlex 5.00 21.725±0.05 16 17 19 26.725 ISO View 12 18 Description: Socket Assy, Insulation Plate Insulation Plate Specification Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6012 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Material <not specified> Finish: Weight: 121.61 2.00 STATUS: Released SHEET: 4 OF 5 REV. C ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 2:1 FILE: CBT-BGA-6012 DATE: 9/6/2012 Rev Date Initials Description A 09/06/12 VP Original B 02/18/14 DH Changed current rating of pin C 4/3/15 RP/MR P-P196A was P-P149A, R3182 was R1392 Description: Revision History Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-6012 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Finish: Weight: STATUS: Released SHEET: 5 OF 5 REV. C ENG: V. Panavala DRAWN BY: V. Panavala SCALE: 2:1 FILE: CBT-BGA-6012 DATE: 9/6/2012