TI1 DS3696 Multipoint rs485/rs422 transceivers/repeater Datasheet

DS3695, DS3695T, DS3696, DS3697
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SNLS072C – MAY 1998 – REVISED APRIL 2013
Multipoint RS485/RS422 Transceivers/Repeaters
Check for Samples: DS3695, DS3695T, DS3696, DS3697
FEATURES
DESCRIPTION
•
The DS3695, DS3696, and DS3697 are high speed
differential
TRI-STATE
bus/line
transceivers/repeaters designed to meet the
requirements of EIA standard RS485 with extended
common mode range (+12V to −7V), for multipoint
data transmission.
1
2
•
•
•
•
•
•
•
Meets EIA standard RS485 for Multipoint Bus
Transmission and is Compatible with RS-422
15 ns Driver Propagation Delays with 2 ns
Skew (Typical)
Single +5V supply
−7V to +12V Bus Common Mode Range
Permits ±7V Ground Difference Between
Devices on the Bus
Thermal Shutdown Protection
High Impedance to Bus with Driver in TRISTATE or with Power Off, Over the Entire
Common Mode Range Allows the Unused
Devices on the Bus to be Powered Down
Combined Impedance of a Driver Output and
Receiver Input is Less than one RS485 Unit
Load, Allowing up to 32 Transceivers on the
Bus
70 mV Typical Receiver Hysteresis
The driver and receiver outputs feature TRI-STATE
capability. The driver outputs remain in TRI-STATE
over the entire common mode range of +12V to −7V.
Bus faults that cause excessive power dissipation
within the device trigger a thermal shutdown circuit,
which forces the driver outputs into the high
impedance state. The DS3696 provides an output pin
TS (thermal shutdown) which reports the occurrence
of the thermal shutdown of the device. This is an
“open collector” pin with an internal 10 kΩ pull-up
resistor. This allows the line fault outputs of several
devices to be wire OR-ed.
Both AC and DC specifications are specified over the
0°C to 70°C temperature and 4.75V to 5.25V supply
voltage range.
Connection and Logic Diagrams
Figure 1. PDIP (Top View)
See Package Number P (R-PDIP-T8)
Figure 2. PDIP (Top View)
See Package Number P (R-PDIP-T8)
Figure 3. PDIP (Top View)
See Package Number P (R-PDIP-T8)
TS pin was LF (Line Fault) in previous data sheets and reports the occurrence of a thermal shutdown of the device.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
DS3695, DS3695T, DS3696, DS3697
SNLS072C – MAY 1998 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1) (2)
Absolute Maximum Ratings
VALUE
UNIT
Supply Voltage, VCC
7
V
Control Input Voltages
7
V
Driver Input Voltage
7
V
Driver Output Voltages
+15/−10
V
Receiver Input Voltages (DS3695, DS3696)
+15/−10
V
Receiver Common Mode Voltage (DS3697)
±25
V
Receiver Output Voltage
5.5
V
Continuous Power Dissipation @ 25°C - N Package (3)
1.07
W
−65 to +150
°C
260
°C
Storage Temperature Range
Lead Temperature (Soldering, 4 sec.)
(1)
(2)
(3)
“Absolute Maximum Ratings” are those beyond which the safety of the device cannot be verified. They are not meant to imply that the
device should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device operation.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
All typicals are given for VCC = 5V and TA = 25°C.
Recommended Operating Conditions
Supply Voltage, VCC
Bus Voltage
Operating Free Air Temp. (TA)
Min
Max
Units
4.75
5.25
V
−7
+12
V
0
+70
°C
−40
+85
°C
Commercial
Industrial
Electrical Characteristics
(1) (2)
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
Parameter
Conditions
VOD1
Differential Driver Output Voltage (Unloaded)
IO = 0
VOD2
Differential Driver Output Voltage (with Load)
See Figure 4
Min
R = 50Ω; (RS-422)
R = 27Ω; (RS-485)
ΔVOD
Change in Magnitude of Driver
Differential Output Voltage for
Complementary Output States
VOC
Δ|VOC|
VIH
Input High Voltage
VIL
Input Low Voltage
VCL
Input Clamp Voltage
IIL
IIH
IIN
Input Current
(1)
(2)
(3)
2
See Figure 4
(3)
Typ
Max
Units
5
V
2
V
1.5
V
R = 27Ω
0.2
V
Driver Common Mode Output Voltage
3.0
V
Change in Magnitude of Driver
Common Mode Output Voltage for
Complementary Output States
0.2
V
DI, DE, RE , E, RE /DE
2
V
0.8
V
IIN = −18 mA
−1.5
V
Input Low Current
VIL = 0.4V
−200
μA
Input High Current
VIH = 2.4V
20
μA
VIN = 12V
+1.0
mA
VIN = −7V
−0.8
mA
DO/RI, DO /RI RI, RI
VCC = 0V or 5.25V
RE /DE or DE = 0V
All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
All typicals are given for VCC = 5V and TA = 25°C.
All limits for which derate linearly at 11.1 mW/°C to 570 mW at 70°C is applied must be derated by 10% for DS3695T and DS3696T.
Other parameters remain the same for this extended temperature range device (−40°C ≤ TA ≤ +85°C).
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SNLS072C – MAY 1998 – REVISED APRIL 2013
Electrical Characteristics (1)(2) (continued)
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
Parameter
Conditions
IOZD
TRI-STATE Current
DS3697 & DS3698
VTH
Differential Input Threshold
Voltage for Receiver
−7V ≤ VCM ≤ +12V
ΔVTH
Receiver Input Hysteresis
VCM = 0V
VOH
Receiver Output High Voltage
IOH = −400 μA
VOL
Output Low Voltage
RO
IOL = 16 mA
TS
IOZR
OFF-State (High Impedance)
Output Current at Receiver
RIN
Receiver Input Resistance
−7V ≤ VCM ≤ +12V
ICC
DO, DO
Receiver Switching Characteristics
±100
μA
+0.2
V
−0.2
mV
2.4
V
(3)
V
IOL = 8 mA
0.45
V
VCC = Max
0.4V ≤ VO ≤ 2.4V
±20
μA
VO = −7V
Receiver Short-Circuit Output Current
Units
0.5
No Load
Driver Short-Circuit Output Current
Max
70
(3)
12
kΩ
Driver Outputs Enabled
42
60
mA
Driver Outputs Disabled
27
40
mA
−250
mA
+250
mA
−85
mA
(3)
VO = +12V
IOSR
Typ
VCC = 0V or 5.25V, E = 0V
−7V < VO < +12V
Supply Current
IOSD
Min
(3)
−15
VO = 0V
(1) (2)
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified (Figure 5, Figure 6, Figure 7)
Symbol
Conditions
Min
Typ
Max
Units
tPLH
CL = 15 pF
15
25
37
ns
tPHL
S1 and S2
15
25
37
ns
|tPLH–tPHL|
Closed
0
tPLZ
CL = 15 pF, S2 Open
5
12
16
ns
tPHZ
CL = 15 pF, S1 Open
5
12
16
ns
tPZL
CL = 15 pF, S2 Open
7
15
20
ns
tPZH
CL = 15 pF, S1 Open
7
15
20
ns
Min
Typ
Max
Units
(1)
(2)
ns
All typicals are given for VCC = 5V and TA = 25°C.
Switching Characteristics apply for DS3695, DS3695T, DS3696, DS3697 only.
Driver Switching Characteristics
0°C ≤ TA ≤ +70°C, 4.75V < VCC < 5.25V unless otherwise specified
Symbol
Conditions
SINGLE ENDED CHARACTERISTICS (Figure 8, Figure 9, Figure 10)
tPLH
RLDIFF = 60Ω
9
15
22
ns
tPHL
CL1 = CL2 = 100 pF
9
15
22
ns
2
8
ns
tSKEW|tPLH–tPHL|
tPLZ
CL = 15 pF, S2 Open
7
15
30
ns
tPHZ
CL = 15 pF, S1 Open
7
15
30
ns
tPZL
CL = 100 pF, S2 Open
30
35
50
ns
tPZH
CL = 100 pF, S1 Open
30
35
50
ns
6
10
18
ns
DIFFERENTIAL CHARACTERISTICS (Figure 8 Figure 11)
tr, tf
RLDIFF = 60Ω
CL1 = CL2 = 100 pF
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SNLS072C – MAY 1998 – REVISED APRIL 2013
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AC Test Circuits and Switching Waveforms
Figure 4. Driver VOD and VOC
Figure 5. Receiver Propagation Delay Test Circuit
Note: Differential input voltage may be realized by grounding RI and pulsing RI between +2.5V and −2.5V.
Figure 6. Receiver Input-to-Output Propagation Delay Timing
Figure 7. Receiver Enable/Disable Propagation Delay Timing
Note: Unless otherwise specified the switches are closed.
4
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SNLS072C – MAY 1998 – REVISED APRIL 2013
Figure 8. Driver Propagation Delay and Transition Time Test Circuits
Note: tPLH and tPHL are measured to the respective 50% points. tSKEW is the difference between propagation delays of
the complementary outputs.
Figure 9. Driver Input-to-Output Propagation Delay Timing (Single-Ended)
Figure 10. Driver Enable/Disable Propagation Delay Timing
Figure 11. Driver Differential Transition Timing
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Function Tables
Table 1. DS3695/DS3696 Transmitting (1)
Inputs
(1)
Outputs
RE
DE
DI
Thermal
Shutdown
X
1
1
OFF
0
1
H
X
1
0
OFF
1
0
H
X
0
X
OFF
Z
Z
H
X
1
X
ON
Z
Z
L
DO
DO
TS *
(DS3696 Only)
X—Don't care condition
Z—High impedance state
*TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor that reports the occurrence of a thermal shutdown of the device.
Table 2. DS3695/DS3696 Receiving (1)
Inputs
(1)
Outputs
RE
DE
RI–RI
RO
TS *
(DS3696 Only)
0
0
≥ +0.2V
1
H
0
0
≤ −0.2V
0
H
1
0
X
Z
H
X—Don't care condition
Z—High impedance state
*TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor that reports the occurrence of a thermal shutdown of the device.
Table 3. DS3697 (1)
Inputs
(1)
Outputs
E
RI-RI
Thermal
Shutdown
1
≥ +0.2V
OFF
0
1
1
≤ −0.2V
OFF
1
0
0
0
X
OFF
Z
Z
Z
1
≥ +0.2V
ON
Z
Z
1
1
≤ −0.2V
ON
Z
Z
0
DO
DO
RO
(DS3697 Only)
1
X—Don't care condition
Z—High impedance state
*TS is an “open collector” output with an on-chip 10 kΩ pull-up resistor that reports the occurrence of a thermal shutdown of the device.
Typical Application
Note: Repeater control logic not shown
6
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SNLS072C – MAY 1998 – REVISED APRIL 2013
Typical Performance Characteristics
Driver VOH
vs
IOH
vs
Temperature
Driver VOH
vs IOH
vs VCCDriver VOH
vs IOH
vs VCC
Figure 12.
Figure 13.
Driver VOL
vs
IOL
vs
Temperature
Driver VOH
vs IOH
vs VCC
Figure 14.
Figure 15.
Driver Differential
Propagation Delay
vs
Temperature
Driver Differential
Propagation Delay
vs
VCC
Figure 16.
Figure 17.
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Typical Performance Characteristics (continued)
8
Driver Single-Ended
Propagation Delay
vs
Temperature
Driver Single-Ended
Propagation Delay
vs
VCC
Figure 18.
Figure 19.
Driver Transition Time
vs
Temperature
Driver Transition Time
vs
VCC
Figure 20.
Figure 21.
Cable Length
vs
Data Rate
Supply Current
vs
Temperature
Figure 22.
Figure 23.
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SNLS072C – MAY 1998 – REVISED APRIL 2013
Typical Performance Characteristics (continued)
Supply Current
vs
Power Supply Voltage
Driver ICC
vs
Switching Frequency
Figure 24.
Figure 25.
Driver Short Circuit Current
vs
Temperature
Receiver VOH
vs
IOH
vs
Temperature
Figure 26.
Figure 27.
Receiver VOH
vs
IOH
vs
VCC
Driver Short Circuit Current
vs
Temperature
Figure 28.
Figure 29.
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Typical Performance Characteristics (continued)
10
Receiver VOH
vs
IOH
vs
Temperature
Receiver VOH
vs
IOH
vs
VCC
Figure 30.
Figure 31.
Receiver VOL
vs
IOL
vs
Temperature
Receiver VOL
vs
IOL
vs
VCC
Figure 32.
Figure 33.
Receiver Differential
Propagation Delay
vs
Temperature
Receiver Differential
Propagation Delay
vs
VCC
Figure 34.
Figure 35.
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SNLS072C – MAY 1998 – REVISED APRIL 2013
Typical Performance Characteristics (continued)
Receiver Short
Circuit Current
vs
Temperature
Receiver Short
Circuit Current
vs
Power Supply
Figure 36.
Figure 37.
Receiver Non-Inverting
Input Current
vs
Temperature
Receiver Non-Inverting
Input Current
vs
Power Supply Voltage
Figure 38.
Figure 39.
Receiver Inverting
Input Current
vs
Temperature
Receiver Inverting
Input Current
vs
Power Supply Voltage
Figure 40.
Figure 41.
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Typical Performance Characteristics (continued)
12
Hysteresis and Differential
Transition Voltage
vs
Temperature
Hysteresis and
Differential Transition
Voltage
vs
VCC
Figure 42.
Figure 43.
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SNLS072C – MAY 1998 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
www.ti.com
19-Mar-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS3695N/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 70
DS3695TN/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 85
DS3695N
DS
3695TN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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