ON MC10H330FNR2 Quad bus driver/receiver with 2-to-1 output multiplexer Datasheet

 SEMICONDUCTOR TECHNICAL DATA
!
"
The MC10H330 is a Quad Bus Driver/Receiver with two–to–one output
multiplexers. These multiplexers have a common select and output enable.
When disabled, (OE = high) the bus outputs go to –2.0 V. Their output can be
brought to a low state (VOL) by applying a high level to the receiver enable (RE
= High). The parameters specified are with 25 Ω loading on the bus drivers and
50 Ω loads on the receivers.
L SUFFIX
CERAMIC PACKAGE
CASE 758–02
• Propagation Delay, 1.5 ns Typical Data–to–Output
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K–Compatible
P SUFFIX
PLASTIC PACKAGE
CASE 724–03
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
VEE
VI
–8.0 to 0
Vdc
0 to VEE
Vdc
Power Supply (VCC = 0)
Input Voltage (VCC = 0)
Output Current — Continuous
— Surge
Iout
50
100
mA
Operating Temperature Range
TA
Tstg
0 to +75
°C
–55 to +150
–55 to +165
°C
°C
Storage Temperature Range — Plastic
— Ceramic
FN SUFFIX
PLCC
CASE 776–02
DIP
PIN ASSIGNMENT
ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note)
0°
25°
75°
VCC
1
24
VCC0
XBUS
2
23
YBUS
WBUS
3
22
ZBUS
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
IE
—
157
—
143
—
157
mA
VCC0
4
21
OE
µA
X1
5
20
Y0
—
—
—
667
514
475
—
—
—
417
321
297
—
—
—
417
321
297
X0
6
19
Y1
7
18
Z0
—
0.5
—
0.3
—
µA
W1
0.5
–1.02 –0.84 –0.98 –0.81 –0.92
–0.735
Vdc
W0
8
17
Z1
–1.95 –1.63 –1.95 –1.63 –1.95
–1.60
Vdc
S
9
16
RE
High Input Voltage
VOL
VIH
–1.17 –0.84 –1.13 –0.81 –1.07
–0.735
Vdc
WIN
10
15
ZIN
Low Input Voltage
VIL
–1.95 –1.48 –1.95 –1.48 –1.95
–1.45
Vdc
XIN
11
14
YIN
VEE
12
13
VCC0
Input Current High
Pins 5–8, 17–20
Pins 16, 21
Pin 9
IinH
Input Current Low
IinL
VOH
High Output Voltage
Low Output Voltage
AC PARAMETERS
Propagation Delay
Select–to–Input
Data–to–Bus Output
Select–to–Bus
Output
OE–to–Bus Output
Bus–to–Input
RE–to–Input
Data–to–Receiver
Input
Rise Time
Fall Time
tpd
tr
tf
ns
1.8
0.5
5.3
2.0
1.8
0.5
5.3
2.0
1.8
0.5
5.3
2.0
1.0
0.8
0.8
0.5
3.2
2.2
2.1
2.2
1.0
0.8
0.8
0.5
3.2
2.2
2.1
2.2
1.0
0.8
0.8
0.5
3.2
2.2
2.4
2.2
1.3
4.0
1.3
4.0
1.3
4.0
0.5
2.0
0.5
2.0
0.5
2.0
ns
0.5
2.0
0.5
2.0
0.5
2.0
ns
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
NOTE:
Each MECL 10H series circuit has been designed
to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed
circuit board and transverse air flow greater than
500 Ifpm is maintained. Receiver outputs are
terminated through a 50–ohm resistor to –2.0 volts
dc. Bus outputs are terminated through a 25–ohm
resistor to –2.0 volts dc.
3/93
 Motorola, Inc. 1996
2–299
REV 5
MC10H330
LOGIC DIAGRAM
OE
21
S
9
W0
8
W1
7
WIN
10
X0
6
X1
XIN
11
Y0
20
VCC0
VCC
VCC0
VCC0
VEE
PIN 24
PIN 1
PIN 13
PIN 4
PIN 12
3
WBUS
2
XBUS
23
YBUS
22
ZBUS
5
Y1
19
YIN
14
Z0
18
Z1
17
ZIN
15
RE
16
MULTIPLEXER TRUTH TABLE
OE
S
WBus
H
L
L
X
L
H
–2.0 V –2.0 V –2.0 V –2.0 V
W0
X0
Y0
Z0
W1
X1
Y1
Z1
MOTOROLA
=
=
=
=
=
XBus YBus
RECEIVER TRUTH TABLE
ZBus
2–300
RE
Win
Xin
Yin
Zin
H
L
L
WBus
L
XBus
L
YBus
L
ZBus
MECL Data
DL122 — Rev 6
MC10H330
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
T L–M
M
N
S
T L–M
S
S
Y BRK
–N–
0.007 (0.180)
U
M
N
S
D
Z
–M–
–L–
W
28
D
X
G1
0.010 (0.250)
T L–M
S
N
S
S
V
1
VIEW D–D
A
0.007 (0.180)
R
0.007 (0.180)
M
T L–M
S
N
S
C
M
T L–M
S
N
0.007 (0.180)
H
Z
M
T L–M
N
S
S
S
K1
E
0.004 (0.100)
G
J
S
K
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250)
–T–
T L–M
S
N
S
M
T L–M
S
N
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
MECL Data
DL122 — Rev 6
0.007 (0.180)
2–301
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10_
0.410
0.430
0.040
–––
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10_
10.42
10.92
1.02
–––
MOTOROLA
MC10H330
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 758–02
ISSUE A
L
B
24
P
13
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
12
J
–A–
DIM
A
B
C
D
F
G
J
K
L
N
P
N
C
–T–
K
SEATING
PLANE
G
F
INCHES
MIN
MAX
1.240
1.285
0.285
0.305
0.160
0.200
0.015
0.021
0.045
0.062
0.100 BSC
0.008
0.013
0.100
0.165
0.300
0.310
0.020
0.050
0.360
0.400
MILLIMETERS
MIN
MAX
31.50
32.64
7.24
7.75
4.07
5.08
0.38
0.53
1.14
1.57
2.54 BSC
0.20
0.33
2.54
4.19
7.62
7.87
0.51
1.27
9.14
10.16
D 24 PL
0.25 (0.010)
T A
M
M
P SUFFIX
PLASTIC DIP PACKAGE
CASE 724–03
ISSUE D
–A–
24
13
1
12
–B–
L
C
–T–
NOTE 1
K
SEATING
PLANE
N
E
G
M
J
F
D
24 PL
0.25 (0.010)
24 PL
0.25 (0.010)
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
M
T A
M
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.230
1.265
0.250
0.270
0.145
0.175
0.015
0.020
0.050 BSC
0.040
0.060
0.100 BSC
0.007
0.012
0.110
0.140
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
31.25
32.13
6.35
6.85
3.69
4.44
0.38
0.51
1.27 BSC
1.02
1.52
2.54 BSC
0.18
0.30
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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How to reach us:
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◊
MOTOROLA
2–302
*MC10H330/D*
MC10H330/D
MECL Data
DL122 — Rev 6
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