Samsung K4F160811D 2m x 8bit cmos dynamic ram with fast page mode Datasheet

K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
2M x 8Bit CMOS Dynamic RAM with Fast Page Mode
DESCRIPTION
This is a family of 2,097,152 x 8 bit Fast Page Mode CMOS DRAMs. Fast Page Mode offers high speed random access of memory cells
within the same row. Power supply voltage (+5.0V or +3.3V), refresh cycle (2K Ref. or 4K Ref.), access time (-50 or -60), power consumption(Normal or Low power) and package type(SOJ or TSOP-II) are optional features of this family. All of this family have CASbefore-RAS refresh, RAS-only refresh and Hidden refresh capabilities. Furthermore, Self-refresh operation is available in L-version.
This 2Mx8 Fast Page Mode DRAM family is fabricated using Samsung′s advanced CMOS process to realize high band-width, low power
consumption and high reliability. It may be used as graphic memory unit for microcomputer, personal computer and portable machines.
FEATURES
• Fast Page Mode operation
• Part Identification
• CAS-before-RAS refresh capability
• RAS-only and Hidden refresh capability
- K4F170811D-B(F) (5V, 4K Ref.)
- K4F160811D-B(F) (5V, 2K Ref.)
- K4F170812D-B(F) (3.3V, 4K Ref.)
- K4F160812D-B(F) (3.3V, 2K Ref.)
• Self-refresh capability (L-ver only)
• Fast parallel test mode capability
• TTL(5V)/LVTTL(3.3V) compatible inputs and outputs
• Early Write or output enable controlled write
• JEDEC Standard pinout
• Active Power Dissipation
• Available in Plastic SOJ and TSOP(II) packages
Unit : mW
3.3V
Speed
4K
• Single +5V±10% power supply (5V product)
5V
2K
4K
• Single +3.3V±0.3V power supply (3.3V product)
2K
-50
324
396
495
605
-60
288
360
440
550
FUNCTIONAL BLOCK DIAGRAM
• Refresh Cycles
VCC
K4F170811D
5V
K4F170812D
3.3V
K4F160811D
5V
K4F160812D
3.3V
Refresh Refresh period
cycle
Normal
L-ver
4K
RAS
CAS
W
Control
Clocks
Vcc
Vss
VBB Generator
64ms
Data in
128ms
2K
Refresh Timer
32ms
Refresh Control
Refresh Counter
• Performance Range
Speed
tRAC
tCAC
tRC
tPC
Remark
-50
50ns
13ns
90ns
35ns
5V/3.3V
-60
60ns
15ns
110ns
40ns
5V/3.3V
A0-A11
(A0 - A10) *1
A0 - A8
(A0 - A9)*1
Buffer
Row Decoder
Memory Array
2,097,152 x 8
Cells
Row Address Buffer
Sense Amps & I/O
Part
NO.
DQ0
to
DQ7
Data out
Col. Address Buffer
Column Decoder
Note) *1 : 2K Refresh
SAMSUNG ELECTRONICS CO., LTD. reserves the right to
change products and specifications without notice.
Buffer
OE
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
PIN CONFIGURATION (Top Views)
• K4F17(6)0811(2)D-F
• K4F17(6)0811(2)D-B
VCC
DQ0
DQ1
DQ2
DQ3
W
RAS
*A11(N.C)
A10
A0
A1
A2
A3
VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
DQ0
DQ1
DQ2
DQ3
W
RAS
*A11(N.C)
A10
A0
A1
A2
A3
VCC
VSS
DQ7
DQ6
DQ5
DQ4
CAS
OE
A9
A8
A7
A6
A5
A4
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
*A11 is N.C for K160811(2)D(5V/3.3V, 2K Ref. product)
B : 300mil 28 SOJ
F : 300mil 28 TSOP II
Pin Name
Pin Function
A0 - A11
Address Inputs (4K Product)
A0 - A10
Address Inputs (2K Product)
DQ0 - 7
Data In/Out
VSS
Ground
RAS
Row Address Strobe
CAS
Column Address Strobe
W
Read/Write Input
OE
Data Output Enable
VCC
Power(+5V)
Power(+3.3V)
N.C
No Connection (2K Ref. product)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VSS
DQ7
DQ6
DQ5
DQ4
CAS
OE
A9
A8
A7
A6
A5
A4
VSS
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Symbol
Units
3.3V
5V
VIN,VOUT
-0.5 to +4.6
-1.0 to +7.0
V
Voltage on VCC supply relative to VSS
VCC
-0.5 to +4.6
-1.0 to +7.0
V
Storage Temperature
Tstg
-55 to +150
-55 to +150
°C
Power Dissipation
PD
1
1
W
IOS Address
50
50
mA
Voltage on any pin relative to V SS
Short Circuit Output Current
* Permanent device damage may occur if "ABSOLUTE MAXIMUM RATINGS" are exceeded. Functional operation should be restricted
to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS (Voltage referenced to Vss, TA= 0 to 70°C)
Parameter
3.3V
Symbol
5V
Units
Min
Typ
Max
Min
Typ
Max
Supply Voltage
VCC
3.0
3.3
3.6
4.5
5.0
5.5
V
Ground
VSS
0
0
0
0
0
0
V
Input High Voltage
VIH
2.0
-
VCC+0.3*1
2.4
-
VCC+1.0*1
V
Input Low Voltage
VIL
-0.3*2
-
0.8
-1.0*2
-
0.8
V
*1 : VCC+1.3V/15ns(3.3V), VCC+2.0V/20ns(5V), Pulse width is measured at VCC
*2 : -1.3V/15ns(3.3V), -2.0V/20ns(5V), Pulse width is measured at VSS
DC AND OPERATING CHARACTERISTICS (Recommended operating conditions unless otherwise noted.)
Max
3.3V
5V
Parameter
Symbol
Min
Max
Units
Input Leakage Current (Any input 0≤VIN≤VIN+0.3V,
all other input pins not under test=0 Volt)
II(L)
-5
5
uA
Output Leakage Current
(Data out is disabled, 0V≤VOUT≤VCC)
IO(L)
-5
5
uA
Output High Voltage Level(IOH=-2mA)
VOH
2.4
-
V
Output Low Voltage Level(IOL=2mA)
VOL
-
0.4
V
Input Leakage Current (Any input 0≤VIN≤VIN+0.5V,
all other input pins not under test=0 Volt)
II(L)
-5
5
uA
Output Leakage Current
(Data out is disabled, 0V≤VOUT≤VCC)
IO(L)
-5
5
uA
Output High Voltage Level(IOH=-5mA)
VOH
2.4
-
V
Output Low Voltage Level(IOL=4.2mA)
VOL
-
0.4
V
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
DC AND OPERATING CHARACTERISTICS (Continued)
Symbol
Power
Speed
ICC1
Don′t care
ICC2
Max
Units
K4F170812D
K4F160812D
K4F170811D
K4F160811D
-50
-60
90
80
110
100
90
80
110
100
mA
mA
Normal
L
Don′t care
1
1
1
1
2
1
2
1
mA
mA
ICC3
Don′t care
-50
-60
90
80
110
100
90
80
110
100
mA
mA
ICC4
Don′t care
-50
-60
80
70
90
80
80
70
90
80
mA
mA
ICC5
Normal
L
Don′t care
0.5
200
0.5
200
1
250
1
250
mA
uA
ICC6
Don′t care
-50
-60
90
80
110
100
90
80
110
100
mA
mA
ICC7
L
Don′t care
250
250
300
300
uA
ICCS
L
Don′t care
200
200
250
250
uA
ICC1* : Operating Current (RAS and CAS cycling @tRC=min.)
ICC2 : Standby Current (RAS=CAS=W=VIH)
ICC3* : RAS-only Refresh Current (CAS=VIH, RAS cycling @tRC=min.)
ICC4* : Fast Page Mode Current (RAS=VIL, CAS, Address cycling @tPC=min.)
ICC5 : Standby Current (RAS=CAS=W=VCC-0.2V)
ICC6* : CAS-Before-RAS Refresh Current (RAS and CAS cycling @t RC=min.)
ICC7 : Battery back-up current, Average power supply current, Battery back-up mode
Input high voltage(VIH)=VCC-0.2V, Input low voltage(VIL)=0.2V, CAS=0.2V,
DQ=Don′t care, TRC=31.25us(4K/L-ver), 62.5us(2K/L-ver),
TRAS=TRASmin~300ns
ICCS : Self Refresh Current
RAS=CAS=VIL, W=OE=A0 ~ A11=VCC-0.2V or 0.2V,
DQ0 ~ DQ7=VCC-0.2V, 0.2V or Open
*Note : ICC1, ICC3, I CC4 and ICC6 are dependent on output loading and cycle rates. Specified values are obtained with the output open.
ICC is specified as an average current. In ICC1, ICC3 and ICC6 address can be changed maximum once while RAS=VIL. In ICC4,
address can be changed maximum once within one fast page mode cycle time, t PC.
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
CAPACITANCE (TA=25°C, VCC=5V or 3.3V, f=1MHz)
Parameter
Symbol
Min
Max
Units
Input capacitance [A0 ~ A11]
CIN1
-
5
pF
Input capacitance [RAS, CAS, W, OE]
CIN2
-
7
pF
Output capacitance [DQ0 - DQ7]
CDQ
-
7
pF
AC CHARACTERISTICS (0°C≤TA≤70°C, See note 1,2)
Test condition (5V device) : VCC=5.0V±10%, Vih/Vil=2.4/0.8V, Voh/Vol=2.4/0.4V
Test condition (3.3V device) : VCC=3.3V±0.3V, Vih/Vil=2.0/0.8V, Voh/Vol=2.0/0.8V
Parameter
-50
Symbol
Min
-60
Max
Min
Units
Notes
Max
Random read or write cycle time
tRC
90
110
ns
Read-modify-write cycle time
tRWC
133
155
ns
Access time from RAS
tRAC
50
60
ns
3,4,10
Access time from CAS
tCAC
13
15
ns
3,4,5
Access time from column address
tAA
25
30
ns
3,10
CAS to output in Low-Z
tCLZ
0
ns
3
Output buffer turn-off delay
tOFF
0
13
0
15
ns
6
Transition time (rise and fall)
tT
3
50
3
50
ns
2
RAS precharge time
tRP
30
RAS pulse width
tRAS
50
RAS hold time
tRSH
13
15
ns
CAS hold time
tCSH
50
60
ns
CAS pulse width
tCAS
13
10K
15
10K
ns
RAS to CAS delay time
tRCD
20
37
20
45
ns
4
RAS to column address delay time
tRAD
15
25
15
30
ns
10
CAS to RAS precharge time
tCRP
5
5
ns
Row address set-up time
tASR
0
0
ns
Row address hold time
tRAH
10
10
ns
Column address set-up time
tASC
0
0
ns
Column address hold time
tCAH
10
10
ns
Column address to RAS lead time
tRAL
25
30
ns
Read command set-up time
tRCS
0
0
ns
Read command hold time referenced to CAS
tRCH
0
0
ns
8
Read command hold time referenced to RAS
tRRH
0
0
ns
8
Write command hold time
tWCH
10
10
ns
Write command pulse width
tWP
10
10
ns
Write command to RAS lead time
tRWL
13
15
ns
Write command to CAS lead time
tCWL
13
15
ns
0
40
10K
60
ns
10K
ns
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
AC CHARACTERISTICS (Continued)
Parameter
-50
Symbol
Min
Data set-up time
tDS
0
Data hold time
tDH
10
Refresh period (2K, Normal)
Refresh period (4K, Normal)
-60
Max
Min
Units
Note
ns
9
ns
9
Max
0
10
tREF
32
32
ms
tREF
64
64
ms
Refresh period (L-ver)
tREF
128
128
ms
Write command set-up time
tWCS
0
0
ns
7
CAS to W delay time
tCWD
36
40
ns
7
RAS to W delay time
tRWD
73
85
ns
7
Column address to W delay time
tAWD
48
55
ns
7
CAS precharge to W delay time
tCPWD
53
60
ns
CAS set-up time (CAS -before-RAS refresh)
tCSR
5
5
ns
CAS hold time (CAS -before-RAS refresh)
tCHR
10
10
ns
RAS to CAS precharge time
tRPC
5
5
ns
Access time from CAS precharge
tCPA
Fast Page cycle time
Fast Page read-modify-write cycle time
30
35
ns
tPC
35
40
ns
tPRWC
76
85
ns
CAS precharge time (Fast Page cycle)
tCP
10
10
ns
RAS pulse width (Fast Page cycle)
tRASP
50
RAS hold time from CAS precharge
tRHCP
30
OE access time
tOEA
200K
60
200K
35
13
3
ns
ns
15
15
ns
OE to data delay
tOED
13
Output buffer turn off delay time from OE
tOEZ
0
OE command hold time
tOEH
13
15
ns
Write command set-up time (Test mode in)
tWTS
10
10
ns
11
Write command hold time (Test mode in)
11
13
0
ns
15
ns
6
tWTH
10
10
ns
W to RAS precharge time(C-B-R refresh)
tWRP
10
10
ns
W to RAS hold time(C-B-R refresh)
tWRH
10
10
ns
RAS pulse width (C-B-R self refresh)
tRASS
100
100
us
13,14,15
RAS precharge time (C-B-R self refresh)
tRPS
90
110
ns
13,14,15
CAS hold time (C-B-R self refresh)
tCHS
-50
-50
ns
13,14,15
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
TEST MODE CYCLE
Parameter
( Note 11 )
-50
Symbol
Min
Random read or write cycle time
tRC
95
Read-modify-write cycle time
tRWC
138
Access time from RAS
-60
Max
Min
Units
Notes
Max
115
ns
160
ns
tRAC
55
65
ns
3,4,10,12
Access time from CAS
tCAC
18
20
ns
3,4,5,12
Access time from column address
tAA
30
35
ns
3,10,12
RAS pulse width
tRAS
55
10K
65
10K
ns
CAS pulse width
tCAS
18
10K
20
10K
ns
RAS hold time
tRSH
18
20
ns
CAS hold time
tCSH
55
65
ns
Column address to RAS lead time
tRAL
30
35
ns
CAS to W delay time
tCWD
41
45
ns
7
RAS to W delay time
tRWD
78
90
ns
7
Column address to W delay time
tAWD
53
60
ns
7
CAS precharge to W delay time
tCPWD
58
65
ns
Fast Page cycle time
tPC
40
45
ns
Fast Page read-modify-write cycle time
tPRWC
81
90
ns
RAS pulse width (Fast Page cycle)
tRASP
55
Access time from CAS precharge
tCPA
OE access time
tOEA
OE to data delay
tOED
18
20
ns
tOEH
18
20
ns
OE command hold time
200K
65
200K
ns
35
40
ns
18
20
ns
3
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
NOTES
1. An initial pause of 200us is required after power-up followed by any 8 RAS-only refresh or CAS-before-RAS refresh cycles
before proper device operation is achieved.
2. VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Transition times are measured between
VIH(min) and V IL(max) and are assumed to be 5ns for all inputs.
3. Measured with a load equivalent to 2 TTL(5V)/1 TTL(3.3V) loads and 100pF.
4. Operation within the tRCD(max) limit insures that tRAC(max) can be met. tRCD(max) is specified as a reference point only.
If tRCD is greater than the specified tRCD(max) limit, then access time is controlled exclusively by tCAC.
5. Assumes that tRCD≥tRCD(max).
6. tOFF(min)and tOEZ(max) define the time at which the output achieves the open circuit condition and are not referenced V oh or
Vol.
7. tWCS, tRWD, tCWD and tAWD are non restrictive operating parameters. They are included in the data sheet as electrical characteristics only. If tWCS≥tWCS(min), the cycle is an early write cycle and the data output will remain high impedance for the duration of the cycle. If tCWD≥tCWD(min), tRWD≥tRWD(min) and tAWD≥tAWD(min), then the cycle is a read-modify-write cycle and the
data output will contain the data read from the selected address. If neither of the above conditions is satisfied, the condition
of the data out is indeterminate.
8. Either tRCH or tRRH must be satisfied for a read cycle.
9. These parameters are referenced to CAS falling edge in early write cycles and to W falling edge in read-modify-write cycles.
10. Operation within the tRAD(max) limit insures that tRAC(max) can be met. tRAD(max) is specified as a reference point only.
If tRAD is greater than the specified tRAD(max) limit, then access time is controlled by tAA.
11. These specifications are applied in the test mode.
12. In test mode read cycle, the value of tRAC, tAA, tCAC is delayed by 2ns to 5ns for the specified values. These parameters
should be specified in test mode cycles by adding the above value to the specified value in this data sheet.
13. If tRASS≥100us, then RAS precharge time must use tRPS instead of tRP.
14. For RAS-only refresh and burst CAS-before-RAS refresh mode, 4096(4K)/2048(2K) cycles of burst refresh must be executed within 64ms/32ms before and after self refresh, in order to meet refresh specification.
15. For distributed CAS-before-RAS with 15.6us interval CAS-before-RAS refresh should be executed with in 15.6us immediately before and after self refresh in order to meet refresh specification.
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
READ CYCLE
tRC
tRAS
RAS
tRP
VIH VIL -
tCSH
tCRP
CAS
tRCD
tCRP
tRSH
tCAS
VIH VIL -
tRAD
tASR
A
VIH VIL -
tRAH
tASC
tRAL
tCAH
COLUMN
ADDRESS
ROW
ADDRESS
tRCH
tRCS
W
tRRH
VIH VIL -
tOFF
tAA
OE
VIH -
tOEZ
tOEA
VIL -
tCAC
DQ0 ~ DQ3(7)
VOH VOL -
tRAC
OPEN
tCLZ
DATA-OUT
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
WRITE CYCLE ( EARLY WRITE )
NOTE : D OUT = OPEN
tRAS
RAS
tRC
tRP
VIH VIL -
tCSH
tCRP
CAS
tRCD
tRSH
tCAS
VIH VIL -
tRAD
tASR
A
tCRP
VIH VIL -
tRAH
tASC
ROW
ADDRESS
tRAL
tCAH
COLUMN
ADDRESS
tCWL
tRWL
tWCS
W
OE
tWCH
VIH -
tWP
VIL -
VIH VIL -
DQ0 ~ DQ3(7)
VIH VIL -
tDS
tDH
DATA-IN
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
WRITE CYCLE ( OE CONTROLLED WRITE )
NOTE : D OUT = OPEN
tRC
tRAS
RAS
tRP
VIH VIL -
tCSH
tCRP
CAS
tRSH
tCAS
VIH VIL -
VIH VIL -
tCRP
tRAD
tASR
A
tRCD
tRAH
tRAL
tASC
ROW
ADDRESS
tCAH
COLUMN
ADDRESS
tCWL
tRWL
W
OE
VIH -
tWP
VIL -
VIH VIL -
DQ0 ~ DQ3(7)
VIH VIL -
tOED
tOEH
tDS
tDH
DATA-IN
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
READ - MODIFY - WRTIE CYCLE
tRWC
tRP
tRAS
RAS
VIH VIL -
tCRP
CAS
tRCD
tRSH
tCAS
VIH VIL -
tASR
tRAD
tRAH
tASC
tCAH
tCSH
A
VIH VIL -
ROW
ADDR
COLUMN
ADDRESS
tRWL
tAWD
tCWD
W
OE
tCWL
VIH -
tWP
VIL -
tRWD
tOEA
VIH VIL -
tCLZ
tCAC
DQ0 ~ DQ3(7)
VI/OH VI/OL -
tAA
tOED
tOEZ
tRAC
VALID
DATA-OUT
tDS
tDH
VALID
DATA-IN
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
FAST PAGE READ CYCLE
tRP
tRASP
RAS
VIH -
tRHCP
VIL -
¡ó
tCRP
CAS
tCP
tRCD
VIH -
VIH VIL -
OE
tRSH
tCAS
¡ó
tCSH
tRAH
tCAH
ROW
ADDR
tASC
COLUMN
ADDRESS
tRCS
W
tCP
tCAS
tCAS
tRAD
tASC
VIL -
tASR
A
tPC
tCAH
COLUMN
ADDRESS
tRCH
tRCS
VIH -
tASC
¡ó
tCAH
COLUMN
ADDRESS
¡ó
tRAL
tRCS
¡ó
tRRH
tRCH
VIL -
tCAC
tOEA
tCAC
tOEA
VIH VIL -
VOH VOL -
¡ó
¡ó
tAA
DQ0 ~ DQ3(7)
tCAC
tOEA
tRAC
tCLZ
tOEZ
VALID
DATA-OUT
tAA
tOFF
tCLZ
tOEZ
VALID
DATA-OUT
tAA
tOFF
tCLZ
tOFF
tOEZ
VALID
DATA-OUT
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
FAST PAGE WRITE CYCLE ( EARLY WRITE )
NOTE : D OUT = OPEN
tRP
tRASP
RAS
tRHCP
VIH VIL -
¡ó
tPC
tCRP
CAS
tRAD
tASC
VIL -
tCAS
tRAL
tCSH
tCAH
tRAH
ROW
ADDR
tASC
COLUMN
ADDRESS
VIH -
tWCH
tCAH
tASC
¡ó
COLUMN
ADDRESS
tWCS
tWP
¡ó
tWCH
tWP
tCAH
COLUMN
ADDRESS
tWCS
¡ó
tWCH
tWP
VIL -
tCWL
OE
tRSH
¡ó
tWCS
W
tCP
tCAS
tCAS
VIL -
tASR
A
tCP
tRCD
VIH -
VIH -
tPC
¡ó
VIH VIL -
DQ0 ~ DQ3(7)
VIH VIL -
tCWL
tRWL
tCWL
¡ó
tDS
tDH
VALID
DATA-IN
tDS
tDH
VALID
DATA-IN
tDS
tDH
¡ó
VALID
DATA-IN
¡ó
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
FAST PAGE READ - MODIFY - WRITE CYCLE
tRP
tRASP
RAS
VIH -
tCSH
VIL -
tRSH
tRCD
CAS
tCP
VIH -
tCRP
tCAS
tCAS
VIL -
tRAD
tPRWC
tRAH
tASR
A
VIH VIL -
tCAH
tASC
COL.
ADDR
ROW
ADDR
COL.
ADDR
tRWL
tRCS
W
tRAL
tCAH
tASC
tCWL
VIH -
tCWL
tWP
VIL -
tWP
tCWD
tCWD
tAWD
OE
tAWD
tCPWD
tRWD
tOEA
VIH -
tOEA
VIL -
tOED
tCAC
tCAC
tAA
DQ0 ~ DQ3(7)
tRAC
tOEZ
tDH
tOED
tDH
tAA
tDS
tDS
tOEZ
VI/OH VI/OL -
tCLZ
tCLZ
VALID
DATA-OUT
VALID
DATA-IN
VALID
DATA-OUT
VALID
DATA-IN
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
RAS - ONLY REFRESH CYCLE
NOTE : W, OE, DIN = Don ′t care
DOUT = OPEN
tRAS
RAS
tRC
tRP
VIH VIL -
tRPC
tCRP
CAS
VIH VIL -
tASR
A
tCRP
VIH VIL -
tRAH
ROW
ADDR
CAS - BEFORE - RAS REFRESH CYCLE
NOTE : OE, A = Don′t care
tRC
tRP
RAS
tRAS
tRP
VIH VIL -
tRPC
tCP
CAS
tRPC
tCSR
VIH -
tWRP
W
tCHR
VIL -
tWRH
VIH VIL -
DQ0 ~ DQ3(7)
VOH -
tOFF
OPEN
VOL Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
HIDDEN REFRESH CYCLE ( READ )
tRC
tRC
tRP
tRAS
RAS
VIH VIL -
tCRP
CAS
tRP
tRAS
tRCD
tRSH
tCHR
VIH VIL -
tRAD
tASR
A
VIH VIL -
tRAH
tASC
ROW
ADDRESS
tCAH
COLUMN
ADDRESS
tWRH
tRAL
tRCS
W
VIH VIL -
tAA
OE
VIH -
tOEA
VIL -
tOFF
tCAC
DQ0 ~ DQ3(7)
VOH VOL -
tRAC
OPEN
tCLZ
tOEZ
DATA-OUT
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
HIDDEN REFRESH CYCLE ( WRITE )
NOTE : D OUT = OPEN
tRC
RAS
VIH -
tRP
tRCD
tRSH
tCHR
VIH VIL -
tRAD
tASR
A
tRAS
VIL -
tCRP
CAS
tRC
tRP
tRAS
VIH VIL -
tRAH
tASC
tCAH
COLUMN
ADDRESS
ROW
ADDRESS
tRAL
tWRH
tWRP
W
OE
VIH -
tWCS
tWCH
tWP
VIL -
VIH VIL -
tDS
DQ0 ~ DQ3(7)
VIH VIL -
tDH
DATA-IN
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
CAS - BEFORE - RAS SELF REFRESH CYCLE
NOTE : OE, A = Don ′t care
tRP
RAS
tRASS
tRPS
VIH VIL -
tRPC
tRPC
tCP
CAS
tCHS
VIH -
tCSR
VIL -
DQ0 ~ DQ3(7)
VOH -
tOFF
OPEN
VOL -
tWRP
W
tWRH
VIH VIL -
TEST MODE IN CYCLE
NOTE : OE, A = Don′t care
tRC
tRP
RAS
tRAS
tRP
VIH VIL -
tRPC
tCP
CAS
tRPC
VIH -
tCSR
tWTS
W
tCHR
VIL -
tWTH
VIH VIL -
DQ0 ~ DQ3(7)
VOH VOL -
tOFF
OPEN
Don′t care
Undefined
K4F170811D, K4F160811D
K4F170812D, K4F160812D
CMOS DRAM
PACKAGE DIMENSION
28 SOJ 300mil
Units : Inches (millimeters)
0.280 (7.11)
0.260 (6.61)
0.300 (7.62)
0.330 (8.39)
0.340 (8.63)
#28
0.006 (0.15)
0.012 (0.30)
#1
0.148 (3.76)
MAX
0.027 (0.69)
MIN
0.741 (18.82)
MAX
0.720 (18.30)
0.730 (18.54)
0.0375 (0.95)
0.050 (1.27)
0.026 (0.66)
0.032 (0.81)
0.015 (0.38)
0.021 (0.53)
28 TSOP(II) 300mil
0.300 (7.62)
0.355 (9.02)
0.371 (9.42)
Units : Inches (millimeters)
0.004 (0.10)
0.010 (0.25)
0.741 (18.81)
MAX
0.721 (18.31)
0.729 (18.51)
0.037 (0.95)
0.050 (1.27)
0.047 (1.20)
MAX
0.002 (0.05)
MIN
0.012 (0.30)
0.020 (0.50)
0.010 (0.25)
TYP
0.018 (0.45)
0.030 (0.75)
0~8
O
Similar pages