DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D168 BZG04 series Transient voltage suppressor diodes Preliminary specification Supersedes data of 1996 Jun 10 1996 Sep 19 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes BZG04 series FEATURES DESCRIPTION • Glass passivated DO-214AC surface mountable package with glass passivated chip. • High maximum operating temperature • Low leakage current • Excellent stability ,, ,, ,, cathode band handbook, 4 columns • UL 94V-O classified plastic package • Transient suppressor stand-off voltage range: 8.2 to 220 V for 32 types • Shipped in 12 mm embossed tape. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. k a Top view Side view MSA473 Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS 10/1000 µs exponential pulse (see Fig.4); Tj = 25 °C prior to surge; see also Fig.2 MIN. MAX. UNIT − 300 W PRSM non-repetitive peak reverse power dissipation Tstg storage temperature −65 +175 °C Tj junction temperature −65 +175 °C 1996 Sep 19 2 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes BZG04 series ELECTRICAL CHARACTERISTICS Total series Tj = 25 °C unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS IF = 0.5 A; see Fig.3 MIN. MAX. − 1.2 UNIT V Per type Tj = 25 °C unless otherwise specified. TYPE NUMBER REVERSE BREAKDOWN VOLTAGE TEMPERATURE COEFFICIENT TEST CURRENT CLAMPING VOLTAGE V(BR)R (V) at Itest SZ (%/K) at Itest Itest (mA) V(CL)R (V) at IRSM (A) note 1 MAX. MIN. REVERSE CURRENT at STAND-OFF VOLTAGE IR (µA) MIN. MAX. BZG04-10 9.4 10.4 11.4 0.05 0.05 0.05 0.09 0.10 0.10 50 50 50 14.8 15.7 17.0 20.3 19.1 17.7 20 5 5 BZG04-11 12.4 0.05 0.10 50 18.9 15.9 5 11 BZG04-12 13.8 0.05 0.10 50 20.9 14.4 5 12 BZG04-13 15.3 0.06 0.11 25 22.9 13.1 5 13 BZG04-15 16.8 0.06 0.11 25 25.6 11.7 5 15 BZG04-16 18.8 0.06 0.11 25 28.4 10.6 5 16 BZG04-18 20.8 0.06 0.11 25 31.0 9.7 5 18 BZG04-20 22.8 0.06 0.11 25 33.8 8.9 5 20 BZG04-22 25.1 0.06 0.11 25 38.1 7.9 5 22 BZG04-24 28 0.06 0.11 25 42.2 7.1 5 24 BZG04-27 31 0.06 0.11 25 46.2 6.5 5 27 BZG04-30 34 0.06 0.11 10 50.1 6.0 5 30 BZG04-33 37 0.06 0.11 10 54.1 5.5 5 33 BZG04-36 40 0.07 0.12 10 60.7 4.9 5 36 BZG04-39 44 0.07 0.12 10 65.5 4.6 5 39 BZG04-43 48 0.07 0.12 10 70.8 4.2 5 43 BZG04-47 52 0.07 0.12 10 78.6 3.8 5 47 BZG04-51 58 0.08 0.13 10 86.5 3.5 5 51 BZG04-56 64 0.08 0.13 10 94.4 3.2 5 56 BZG04-62 70 0.08 0.13 10 103.5 2.9 5 62 BZG04-68 77 0.08 0.13 10 114 2.6 5 68 BZG04-75 85 0.09 0.13 5 126 2.4 5 75 BZG04-82 94 0.09 0.13 5 139 2.2 5 82 BZG04-91 104 0.09 0.13 5 152 2.0 5 91 BZG04-100 114 0.09 0.13 5 167 1.8 5 100 BZG04-8V2 BZG04-9V1 1996 Sep 19 3 MAX. at VR (V) 8.2 9.1 10 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes TYPE NUMBER BZG04 series REVERSE BREAKDOWN VOLTAGE TEMPERATURE COEFFICIENT TEST CURRENT CLAMPING VOLTAGE V(BR)R (V) at Itest SZ (%/K) at Itest Itest (mA) V(CL)R (V) at IRSM (A) note 1 MAX. MIN. MIN. MAX. REVERSE CURRENT at STAND-OFF VOLTAGE IR (µA) MAX. at VR (V) BZG04-110 124 0.09 0.13 5 185 1.6 5 110 BZG04-120 138 0.09 0.13 5 204 1.5 5 120 BZG04-130 153 0.09 0.13 5 224 1.3 5 130 BZG04-150 168 0.09 0.13 5 249 1.2 5 150 BZG04-160 188 0.09 0.13 5 276 1.1 5 160 BZG04-180 208 0.09 0.13 2 305 1.0 5 180 BZG04-200 228 0.09 0.13 2 336 0.9 5 200 BZG04-220 251 0.09 0.13 2 380 0.8 5 220 Note 1. Non-repetitive peak reverse current in accordance with “IEC 60-1, Section 8” (10/1000 µs pulse); see Fig.4. THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth j-tp thermal resistance from junction to tie-point Rth j-a thermal resistance from junction to ambient CONDITIONS VALUE UNIT 25 K/W note 1 100 K/W note 2 150 K/W Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5. For more information please refer to the “General Part of associated Handbook”. 1996 Sep 19 4 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes BZG04 series GRAPHICAL DATA MBH452 104 handbook, halfpage MBH453 3 handbook, halfpage IF (A) PZSM (W) 103 2 102 1 10 10−2 10−1 0 1 tp (ms) 1 0 10 2 VF (V) Tj = 25 °C prior to surge. Tj = 25 °C. Fig.2 Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). Fig.3 Forward current as a function of forward voltage; typical values. IRSMhalfpage handbook, 50 (%) 100 90 4.5 50 50 2.5 10 t t1 1.25 t2 MSB213 MGD521 In accordance with “IEC 60-1, Section 8”. t1 = 10 µs. t2 = 1000 µs. Dimensions in mm. Fig.4 Non-repetitive peak reverse current pulse definition. 1996 Sep 19 Fig.5 Printed-circuit board for surface mounting. 5 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes BZG04 series PACKAGE OUTLINE 5.5 5.1 4.5 4.3 handbook, full pagewidth 2.3 2.0 0.05 2.8 1.6 2.4 1.4 , , , , 0.2 3.3 2.7 MSA414 Dimensions in mm. The marking band indicates the cathode. Fig.6 DO-214AC; SOD106. 1996 Sep 19 6 Philips Semiconductors Preliminary specification Transient voltage suppressor diodes BZG04 series DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Sep 19 7