Lumileds AB105 Assembly and handling information Datasheet

ILLUMINATION
LUXEON Z
Assembly and Handling Information
Introduction
This application brief addresses the recommended assembly and handling
procedures for LUXEON Z emitters. Proper assembly, handling, and thermal
management, as outlined in this application brief, ensure high optical output and
long lumen maintenance for LUXEON Z emitters.
Scope
The assembly and handling guidelines in this application brief apply to the following
products:
LUXEON Z White (all CCT & CRI)
LUXEON Z Royal Blue (LXZ1-PR01)
LUXEON Z Lime (LXZ1-PX01)
LUXEON Z Deep Red (LXZ1-PA01)
LUXEON Z Green (LXZ1-PM01)
LUXEON Z Red (LXZ1-PD01)
LUXEON Z Cyan (LXZ1-PE01)
LUXEON Z Red-Orange (LXZ1-PH01)
LUXEON Z Blue (LXZ1-PB01)
LUXEON Z Amber (LXZ1-PL01)
In the remainder of this document the term LUXEON Z refers to any product in the
LUXEON Z product family.
AB105 LUXEON Z Application Brief ©2017 Lumileds Holding B.V. All rights reserved.
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Optical Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.3 Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.5 Electrical Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.6 Mechanical Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Printed Circuit Board Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Footprint and Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Surface Finishing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 Minimum Spacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Thermal Measurement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Assembly Process Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.1 Stencil Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.2 Pick-and-Place . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Reflow Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5. Packaging Considerations – Chemical Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
About Lumileds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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1. Component
1.1 Description
The LUXEON Z emitter is an ultra-compact, surface mount, high-power direct color or white LED. Each LUXEON Z
emitter consists of a high brightness InGaN or AlInGaP LED chip on a ceramic substrate. The ceramic substrate provides
mechanical support and provides a thermal path from the LED chip to the bottom of the emitter. An interconnect layer
electrically connects the LED chip to cathode and anode pads of equal size on the bottom of the ceramic substrate. The
cathode of the LUXEON Z emitter is marked with a small notch in the center of the electrode (see Figure 1).
The top of the LUXEON Z is covered with a thin layer of silicone to shield the chip from the environment. The bottom of the
LUXEON Z emitter contains two equally sized metallization pads for the anode and cathode.
All InGaN LUXEON Z emitters contain a transient voltage suppressor (TVS) chip which protects the LED chip against
electrostatic discharge (ESD) events. The TVS chip creates some minor topographical variations across the top surface of
the InGaN LUXEON Z emitters; all AlInGaP LUXEON Z emitters have a flat top surface.
The LUXEON Z emitter comes in four different form-factors, depending on the targeted color (see Table 1 and Figure 2):
Table 1. Summary of various LUXEON Z colors, chip technology, phosphor and nominal height of the light emitting area.
Figure 1. 3D renditions of LUXEON Z with InGaN chip (left & center) and AlInGaP chip (right).
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Figure 2. The LUXEON Z emitter comes in four different form factors, depending on the targeted color.
All dimensions in mm.
1.2 Optical Center
The theoretical optical center of the LUXEON Z emitter is 0.625mm from the top and 0.650mm from the side edges of the
ceramic substrate (see Figure 3).
1.3 Handling Precautions
The LUXEON Z emitter is designed to maximize light output and reliability. However, improper handling of the emitter may
damage the LED chip and affect the overall performance and reliability. In order to minimize the risk of damage to the LED
chip during handling, LUXEON Z emitters should only be picked up manually from the side of the ceramic substrate as
shown in Figure 4.
Figure 3. The optical center of the LUXEON Z emitter is 0.625mm from the top and 0.650mm from the side edges.
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Figure 4. Correct handling (top) and incorrect handling (bottom) of LUXEON Z emitters.
When handling finished boards containing LUXEON Z emitters, do not touch the top surface with any fingers (see Figure
5a) or apply any pressure to it. Also, do no turn over the board for probing, if the electrodes are at the back of the board,
or stack multiple boards on top of each other (see Figure 5b). A rough or contaminated surface, which is placed on top of a
LUXEON Z emitter, may damage the silicone overcoat of the emitter. Furthermore, any pressure applied onto the LUXEON
Z emitter during probing may damage the silicone layer or the chip underneath.
1.4 Cleaning
The LUXEON Z emitter should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease
in optical output. In the event that the surface of a LUXEON Z emitter requires cleaning, a compressed gas duster at a
distance of 6” away will be sufficient to remove the dust and debris or an air gun with 20 psi (at nozzle) from a distance of
6”. Make sure the parts are secured first.
1.5 Electrical Isolation
The LUXEON Z emitter contains only two electrical pads on the bottom of the ceramic substrate with a spacing of 0.25mm
between them. In order to avoid any electrical shocks and/or damage to the LUXEON Z emitter, each design needs to
comply with the appropriate standards of safety and isolation distances, known as clearance and creepage distances,
respectively (e.g. IEC60950, clause 2.10.4).
1.6 Mechanical Files
Mechanical drawings for LUXEON Z (2D and 3D) are available upon request.
1.7 Soldering
LUXEON Z emitters are designed to be soldered onto a Printed Circuit Board (PCB). For detailed assembly instructions, see
Section 2. substrate as shown in Figure 4.
Figure 5. Do not touch the top of surface of the LUXEON Z emitter when handling a finished board (a) or stack
boards with one or more LUXEON Z emitters on top of each other (b).
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Figure 6. Recommended PCB Footprint for LUXEON Z. SR denotes solder resist opening and SP denotes stencil pattern.
All dimensions in mm.
2. Printed Circuit Board Design
The LUXEON Z emitter is designed to be soldered onto a Metal Core PCB (MCPCB) or a multi-layer FR4 PCB. To ensure
optimal operation of the LUXEON Z emitter, the PCB should be designed to minimize the overall thermal resistance
between the LED package and the heat sink.
2.1 Footprint and Land Pattern
The LUXEON Z emitter has two pads that need to be soldered onto corresponding pads on a PCB to ensure proper
electrical operation. Figure 6 shows the minimum footprint design for a single LUXEON Z emitter in an application where
multiple LUXEON Z emitters are placed in a densely packed array, with each emitter electrically addressable.
The electrical pads of the LUXEON Z emitter also serve as thermal pads between the LED and the PCB. To enhance
heat dissipation from the LUXEON Z emitter into the PCB, it is best to extend the copper area around each electrode
approximately 4mm from the center of the LUXEON Z emitter, where possible. Furthermore, it is desirable to keep the
thermal resistance values of the two copper pads on the PCB underneath each LUXEON Z emitter approximately equal to
ensure a balanced heat transfer from the LUXEON Z emitter through both electrodes.
Figure 7 shows an example of a densely packed 2x2 LUXEON Z array on a metal core starboard. The spacing between the
four LUXEON Z emitters (labeled D1 through D4) is 0.2mm. The pink areas in the drawing represent solder mask openings
while the white dotted lines correspond to the outlines of the four LUXEON Z packages. The drawing of this starboard is
available upon request.
2.2 Surface Finishing
Lumileds recommends using a high temperature organic solderability preservative (OSP) on the copper layer.
2.3 Minimum Spacing
Lumileds recommends a minimum edge to edge spacing between LUXEON Z emitters of 0.2mm. Placing multiple
LUXEON Z emitters too close to each other may adversely impact the ability of the PCB to dissipate the heat from the
emitters. Also, the light output for each LED may drop due to optical absorption by adjacent LED packages.
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Figure 7. A closely packed 2x2 LUXEON Z array configuration on a metal core PCB (left). Zoomed-in image of four
LUXEON Z Red (AlInGaP) emitters mounted on the board (right). The pads marked with the dashed circles
correspond to the preferred Ts measurement points for this configuration.
3. Thermal Measurement Guidelines
This section provides general guidelines on how to determine the junction temperature of a LUXEON Z emitter in a
stand-alone or array configuration in order to verify that the junction temperature in the actual application during regular
operation does not exceed the maximum allowable temperature specified in the datasheet.
The typical thermal resistance Rθj-thermal pad between the junction and the thermal pad for LUXEON Z is specified in the
LUXEON Z datasheet. In LUXEON Z, both the electrode pads serve as thermal pads. With this information, the junction
temperature Tj can be determined according to the following equation:
Tj = Tthermal pad + Rθj-thermal pad • Pelectrical
In this equation Pelectrical is the electrical power going into the LUXEON Z emitter and Tthermal pad is the temperature at the
bottom of one of the LUXEON Z electrodes, assuming both LUXEON Z electrodes are connected to copper pads on the
PCB with approximately the same thermal resistance.
In typical applications it may be difficult, though, to measure the thermal pad temperature Tthermal pad directly. Therefore, a
practical way to determine the LUXEON Z junction temperature is by measuring the temperature Ts of a predetermined
sensor pad on the PCB right next to the LUXEON Z emitter with a thermocouple. To ensure accurate readings, the
thermocouple must make direct contact with the copper of the PCB onto which the LUXEON Z electrode pads are
soldered, i.e. any solder mask or other masking layer must be first removed before mounting the thermocouple onto
the PCB.
The LUXEON Z emitter is ideally suited for applications where multiple color LEDs need to be placed in a closely packed
array configuration. To mimic this scenario, Lumileds built a 2x2 densely packed array configuration (see Figure 7). Given
the asymmetry in the copper pads on the PCB, there are several candidate sensor pad locations around the 2x2 array
configuration. The most appropriate Ts point depends, to a large extent, on the type of LUXEON Z emitters used and the
operating conditions of the emitter array. The following guidelines help determine the most appropriate Ts location
in a densely packed array application in order to approximate the maximum junction temperature in the LUXEON Z
emitter array:
a.
If there is no symmetry in the copper layout of the PCB, it is best to place the Ts point next to the electrical pad
(anode or cathode) where lateral heat spreading into the PCB is most impeded. This is typically the electrode
with the least amount of copper. For example, in the closely packed 4-up configuration of Figure 7, the circular
pads on the D1-, D2+, D3- and D4+ electrodes are preferred.
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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b.
If multiple LUXEON Z emitters of the same color are used, select the pad next to the LUXEON Z emitter with the
highest nominal forward voltage (Vf).
c.
If a mixture of InGaN and AlInGaP LUXEON Z emitters is operated at approximately the same drive current, it is
preferred to measure the pad temperature of the LUXEON Z AlInGaP emitter with the lowest wavelength and
the LUXEON Z InGaN emitter with the highest wavelength. In this ranking according to wavelength, a
LUXEON Z white emitter falls somewhere between a LUXEON Z Royal Blue and LUXEON Z Cyan emitter.
The highest observed temperature should then be used to approximate the junction temperature.
d.
If different drive currents are used for each LUXEON Z emitter, it is generally best to measure the temperature
next to the LUXEON Z emitter which consumes the most amount of electrical power.
The thermal resistance Rθj-s between the LUXEON Z junction and Ts point was experimentally determined to be
approximately 5K/W for a densely packed 2x2 array of LUXEON Z emitters of the same color on a 1.0mm thick
Al-MCPCB board (1oz copper with 4 mil thick Arlon 92ML dielectric layer). The spacing between the LUXEON Z emitters was
200μm. During these thermal measurements all four LUXEON Z emitters were powered to take into account any thermal
crowding effects due to the close packing of the emitters. The junction temperature can then be calculated as follows:
Tj = Ts + 5 • Pelectrical_array (assuming all 4 LEDs are powered)
In this equation Pelectrical_array is the combined electrical power going into the four LUXEON Z emitters. The Rθj-s will typically be
a bit lower if:
• the spacing between LUXEON Z emitters is increased
• the thickness of the top copper foil of the PCB is increased
• the thickness of the dielectric layer between the top copper foil and metal core is decreased
• the thermal conductivity of the dielectric material is increased.
The thermal resistance Rθj-s between the junction of a single (powered) LUXEON Z emitter and Ts point on the same 4-up
board configuration of Figure 7 was experimentally determined to be 18K/W. The junction temperature for the single
LUXEON Z emitter can then be calculated as follows:
Tj = Ts + 18 • Pelectrical (assuming a single emitter is powered only)
LED board configurations with a larger number of closely packed LUXEON Z emitters may require additional thermal
modeling to determine the pad temperature of those LUXEON Z emitters in the center of the array which are not easily
accessible.
4. Assembly Process Guidelines
4.1 Stencil Design
The appropriate stencil design for the LUXEON Z emitter is included in the PCB footprint design (see Figure 6). The
recommended stencil thickness is 125μm. The slightly smaller stencil pattern, compared to the solder resist opening,
prevents the solder paste from accidentally bridging between the electrodes, which are only spaced 250μm apart.
4.2 Pick-and-Place
Automated pick and place equipment provides the best handling and placement accuracy for LUXEON Z emitters. Figure
8 and Figure 9 show two pick and place nozzle designs and corresponding machine settings which were successfully used
for the various LUXEON Z configurations with pick and place equipment from Yamaha (YV100X) and Juki (KE2080L).
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Based on these pick and place experiments, Lumileds advises customers to take the following general pick and place
guidelines into account:
1.
For LUXEON Z InGaN emitters, the tip of the nozzle should be positioned on the flat surface above the LED chip
area; the area around the TVS should be avoided because of the height differences (see Figure 10). There is no such
constraint on the nozzle position for LUXEON Z AlInGaP emitters.
2.
The nozzle tip should be clean and free of any particles since this may interact with the silicone coating of the
LUXEON Z package during pick and place.
3.
During setup and any initial production runs, it is a good practice to inspect the top surface of the LUXEON Z
emitters under a microscope to ensure the emitters are not accidentally damaged by the pick and place nozzle.
Pick and Mount Information
Pick timer
0s
Mount timer
0s
Pick height
InGaN (White) [1]
InGaN Lime
0.28mm
Vision Information
Alignment group
Special
Alignment type
Odd.Chip
Alignment module
Fore & Back & Las
Light selection
Main + Coax
0.18mm
Lighting level
5/8
InGaN (Direct Color) [1]
0.30mm
Comp. threshold
91
AlInGaP [1]
0.19mm
Comp. tolerance
15
[1]
Mount height
0mm
Search area
1.5mm
Mount action
Normal
Comp. intensity
N/A
Mount speed
100%
Auto threshold
Not Used
Pickup speed
100%
Vacuum check
Normal Chk
Pick vacuum
20%
Mount vacuum
InGaN
60%
AlInGaP
90%
Notes:
1. LUXEON Z AlInGaP product family uses deeper emitter pocket tape depth (1.15mm) than LUXEON Z InGaN product family (0.88mm).
Figure 8. Pick and place nozzle design and corresponding machine settings for Yamaha YV100X in combination with the
off-the-shelf nozzle 7WA. Note that some of the machine settings are unique to each LUXEON Z configuration.
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Pick and Mount Information
Vision Information
XY
Fast2
Centering method
Laser
Pick depth
0mm
Comp shape
Corner Square
Picking stroke
0mm
Pick Z down
Fast2
Pick Z up
Fast2
Placing stroke
0mm
Place Z down
Fast2
Place Z up
Fast2
Theta (measure)
Fast
Theta (other)
Fast
Figure 9. Pick and place nozzle design and corresponding machine settings for Juki KE2080L in combination with
the off-the-shelf nozzle 502. These machine settings were successfully used for all LUXEON Z configurations.
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Figure 10. Nozzle pick-up location for LUXEON Z (InGaN ) emitters.
Note that pick and place nozzles are customer specific and are typically machined to fit specific pick and place tools. Also,
the pick and place machine settings in this application brief are typical values and should be used as a starting point to
fine tune the actual pick and place process of interest. Finally, some pick and place machines may have additional hidden
parameters, and when used with the nozzle design as described here, can affect the overall performance. Sometimes
a customized nozzle such as the one shown in Figure 11 to prevent LUXEON emitter from getting stuck on the nozzle
tip during pick and place process may be needed. Lumileds recommends that customer contact their pick and place
manufacturer for additional nozzle support.
Since the LUXEON Z emitter has no primary optics or lens which can act as a mechanical enclosure protection for the LED
chip, the pick-up and placement force applied to the top of the package should be kept to a minimum. This is particularly
important for LUXEON Z InGaN direct color and LUXEON Z white emitters in which the silicone layer (with phosphor
— for white emitters) is about 25μm and 50μm thick, respectively. The LUXEON Z AlInGaP emitters, in contrast, have a
much thicker silicone layer and LUXEON Z InGaN lime emitters have hard phosphor platelet and are therefore, able to
absorb higher forces. Experimental studies with various pick and place machines confirmed that LUXEON Z emitters can
be reliably picked from tape and placed onto a PCB with a placement force ≤ 30grams. Note that this placement force,
consisting of impact force and dwell force (also known as static force), depends on the nozzle tip material, nozzle spring
stiffness, nozzle diameter, vacuum pressure, over travel distance, PCB height differences and PCB warping.
Figure 11. An example of a custom nozzle with vacuum relief notches to minimize LUXEON Z emitter from getting stuck
to the nozzle tip during pick and place process. Shown here is a nozzle designed by Panasonic (p/n QUBS40209220-ASSY)
for Panasonic pick and place machine. The nozzle tip inner diameter is 0.70 mm and outer diameter 1.00 mm with relief
notches of 0.25 mm wide as shown. Note that the vacuum relief notch does not necessarily have to be a triangular shape
as long as the edges are rounded off to prevent surface damage. Further, the size and the number of notches may need
to be optimized for specific sticky condition.
4.3 Reflow Accuracy
Using the solder resist and stencil pattern layout as shown in Figure 6, Lumileds has determined the placement accuracy
after reflow to be within a standard deviation of 24μm in the x and y direction. For a small and lightweight package like
LUXEON Z, the surface tension of liquid solder is typically sufficient to realign the LUXEON Z package to the nominal
position of the footprint layout as demonstrated in Figure 12.
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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5. Packaging Considerations—Chemical Compatibility
The LUXEON Z package contains a silicone overcoat to protect the LED chip. As with most silicones used in
LED optics, care must be taken to prevent any incompatible chemicals from directly or indirectly reacting with
the silicone.
The silicone overcoat in LUXEON Z is gas permeable. Consequently, oxygen and volatile organic compound (VOC) gas
molecules can diffuse into the silicone overcoat. VOCs may originate from adhesives, solder fluxes, conformal coating
materials, potting materials and even some of the inks that are used to print the PCBs.
Some VOCs and chemicals react with silicone and produce discoloration and surface damage. Other VOCs do not
chemically react with the silicone material directly but diffuse into the silicone and oxidize during the presence of heat or
light. Regardless of the physical mechanism, both cases may affect the total LED light output. Since silicone permeability
increases with temperature, more VOCs may diffuse into and/or evaporate out from the silicone.
Careful consideration must be given to whether LUXEON Z emitters are enclosed in an “air tight” environment or not. In
an “air tight” environment, some VOCs that were introduced during assembly may permeate and remain in the silicone
overcoat. Under heat and “blue” light, the VOCs inside the silicone overcoat may partially oxidize and create a silicone
discoloration, particularly on the surface of the LED where the flux energy is the highest. In an air rich or “open” air
environment, VOCs have a chance to leave the area (driven by the normal air flow). Transferring the devices which were
discolored in the enclosed environment back to “open” air may allow the oxidized VOCs to diffuse out of the silicone
overcoat and may restore the original optical properties of the LED.
Figure 12. LUXEON Z self alignment before (left) and after reflow (right).
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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Determining suitable threshold limits for the presence of VOCs is very difficult since these limits depend on the type of
enclosure used to house the LEDs and the operating temperatures. Also, some VOCs can photo-degrade over time.
Table 2 provides a list of commonly used chemicals that should be avoided as they may react with the silicone material.
Note that Lumileds does not warrant that this list is exhaustive since it is impossible to determine all chemicals that may
affect LED performance.
The chemicals in Table 2 are typically not directly used in the final products that are built around LUXEON Z LEDs.
However, some of these chemicals may be used in intermediate manufacturing steps (e.g. cleaning agents). Consequently,
trace amounts of these chemicals may remain on (sub)components, such as heat sinks. Lumileds, therefore, recommends
the following precautions when designing your application:
• When designing secondary lenses to be used over an LED, provide a sufficiently large air-pocket and allow for
“ventilation” of this air away from the immediate vicinity of the LED.
• Use mechanical means of attaching lenses and circuit boards as much as possible. When using adhesives, potting
compounds and coatings, carefully analyze its material composition and do thorough testing of the entire fixture
under High Temperature over Life (HTOL) conditions.
Table 2. List of commonly used chemicals that will damage the silicone overcoat of LUXEON Z.
Avoid using any of these chemicals in the housing that contains the LED package.
Chemical Name
Normally used as
Hydrochloric Acid
Acid
Sulfuric Acid
Acid
Nitric Acid
Acid
Acetic Acid
Acid
Sodium Hydroxide
Alkali
Potassium Hydroxide
Alkali
Ammonia
Alkali
MEK (Methyl Ethyl Ketone)
Solvent
MIBK (Methyl Isobutyl Ketone)
Solvent
Toluene
Solvent
Xylene
Solvent
Benzene
Solvent
Gasoline
Solvent
Mineral spirits
Solvent
Dichloromethane
Solvent
Tetracholorometane
Solvent
Castor Oil
Oil
Lard
Oil
Linseed Oil
Oil
Petroleum
Oil
Silicone Oil
Oil
Halogenated Hydrocarbons
(containing F, Cl, Br elements)
Misc.
Rosin Flux
Solder Flux
Acrylic Tape
Adhesive
RoHS
COMPLIANT
AB105 LUXEON Z Application Brief 20171214 ©2017 Lumileds Holding B.V. All rights reserved.
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About Lumileds
Companies developing automotive, mobile, IoT and illumination lighting applications need a partner who can collaborate with
them to push the boundaries of light. With over 100 years of inventions and industry firsts, Lumileds is a global lighting solutions
company that helps customers around the world deliver differentiated solutions to gain and maintain a competitive edge. As the
inventor of Xenon technology, a pioneer in halogen lighting and the leader in high performance LEDs, Lumileds builds innovation,
quality and reliability into its technology, products and every customer engagement. Together with its customers, Lumileds is
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AB105 LUXEON Z Application Brief 20171214
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