56F8013 Data Sheet Preliminary Technical Data 56F8000 16-bit Digital Signal Controllers MC56F8013 Rev. 2 4/2005 freescale.com Document Revision History Version History Description of Change Rev 0 Initial release Rev 1 Updates to Part 10, Specifications, Table 10-1, added maximum clamp current , per pin Table 10-12, clarified variation over temperature table and graph Table 10-16, added LIN slave timing Rev 2 Added alternate pins to Figure 11-1 and Table 11-1. Please see http://www.freescale.com for the most current Data Sheet revision. 56F8013 Technical Data, Rev. 2 2 Freescale Semiconductor Preliminary 56F8013 General Description • Up to 32 MIPS at 32MHz core frequency • One Inter-Integrated Circuit (I2C) Port • DSP and MCU functionality in a unified, C-efficient architecture • Computer Operating Properly (COP)/Watchdog • On-Chip Relaxation Oscillator • 16KB Program Flash • Integrated Power-On Reset and Low-Voltage Interrupt Module • 4KB Unified Data/Program RAM • One 6-channel PWM module • JTAG/Enhanced On-Chip Emulation (OnCE™) for unobtrusive, real-time debugging • One 6-channel 12-bit ADC • Up to 26 GPIO lines • One Serial Communication Interface (SCI) with LIN slave functionality • 32-pin LQFP Package • One Serial Peripheral Interface (SPI) • One 16-bit Quad Timer VCAP RESET VDD 4 7 PWM Outputs JTAG/EOnCE Port or GPIOD PWM or Timer Port or GPIOA 3 AD0 3 AD1 VDDA VSSA 2 Digital Reg Analog Reg Low-Voltage Supervisor 16-Bit 56800E Core Address Generation Unit Program Controller and Hardware Looping Unit VSS_IO Data ALU 16 x 16 + 36 -> 36-Bit MAC Three 16-bit Input Registers Four 36-bit Accumulators Bit Manipulation Unit PAB PDB CDBR CDBW ADC or GPIOC Memory Program Memory 8K x 16 Flash R/W Control XDB2 XAB1 XAB2 System Bus Control PAB Unified Data / Program RAM 4KB PDB CDBR CDBW IPBus Bridge (IPBB) 2 Timer or GPIOB SPI or I2C or Timer or GPIOB 4 SCI or I2C or GPIOB COP/ Watchdog Interrupt Controller 2 System Integration Module P O R O Clock S Generator* C *Includes On-Chip Relaxation Oscillator 56F8013 Block Diagram 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 3 56F8013 Data Sheet Table of Contents Part 1: Overview . . . . . . . . . . . . . . . . . . . . . . 5 1.1. 1.2. 1.3. 1.4. 1.5. 1.6. 56F8013 Features . . . . . . . . . . . . . . . . . . . . . 5 56F8013 Description . . . . . . . . . . . . . . . . . . . 6 Award-Winning Development Environment . . 7 Architecture Block Diagram . . . . . . . . . . . . . 7 Product Documentation . . . . . . . . . . . . . . . . 11 Data Sheet Conventions. . . . . . . . . . . . . . . 11 Part 7: Security Features . . . . . . . . . . . . . . .82 7.1. Operation with Security Enabled . . . . . . . . . 82 7.2. Flash Access Lock and Unlock Mechanisms 82 Part 8: General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84 Part 2: Signal/Connection Descriptions . . . 12 8.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 84 8.2. Configuration . . . . . . . . . . . . . . . . . . . . . . . . 84 8.3. Reset Values . . . . . . . . . . . . . . . . . . . . . . . . 86 2.1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.2. 56F8013 Signal Pins . . . . . . . . . . . . . . . . . . 16 Part 9: Joint Test Action Group (JTAG) . . .91 Part 3: OCCS . . . . . . . . . . . . . . . . . . . . . . . . . 24 3.1. 3.2. 3.3. 3.4. 3.5. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Operating Modes . . . . . . . . . . . . . . . . . . . . . 24 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 26 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . 27 Part 4: Memory Map . . . . . . . . . . . . . . . . . . . 27 4.1. 4.2. 4.3. 4.4. 4.5. 4.6. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 27 Interrupt Vector Table . . . . . . . . . . . . . . . . . 27 Program Map . . . . . . . . . . . . . . . . . . . . . . . 29 Data Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 EOnCE Memory Map . . . . . . . . . . . . . . . . . . 31 Peripheral Memory Mapped Registers . . . . 32 Part 5: Interrupt Controller (ITCN) . . . . . . . . 42 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 42 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Functional Description . . . . . . . . . . . . . . . . . 42 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 44 Operating Modes . . . . . . . . . . . . . . . . . . . . . 44 Register Descriptions . . . . . . . . . . . . . . . . . . 45 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Part 6: System Integration Module (SIM) . . 62 6.1. 6.2. 6.3. 6.4. 6.5. 6.6. 6.7. 6.8. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . 62 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Register Descriptions . . . . . . . . . . . . . . . . . . 63 Clock Generation Overview . . . . . . . . . . . . . 76 Power-Down Modes . . . . . . . . . . . . . . . . . . 77 Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . 81 9.1. 56F8013 Information . . . . . . . . . . . . . . . . . . 91 Part 10: Specifications. . . . . . . . . . . . . . . . . 91 10.1. General Characteristics . . . . . . . . . . . . . . . 91 10.2. DC Electrical Characteristics . . . . . . . . . . . 95 10.3. AC Electrical Characteristics . . . . . . . . . . . 98 10.4. Flash Memory Characteristics . . . . . . . . . . 98 10.5. External Clock Operation Timing . . . . . . . . 99 10.6. Phase Locked Loop Timing . . . . . . . . . . . . 99 10.7. Relaxation Oscillator Timing . . . . . . . . . . 100 10.8. Reset, Stop, Wait, Mode Select, and Interrupt Timing . . . . . . . . . . . . . . 101 10.9. Serial Peripheral Interface (SPI) Timing . 102 10.10. Quad Timer Timing . . . . . . . . . . . . . . . . 105 10.11. Serial Communication Interface (SCI) Timing . . . . . . . . . . . . . . . . 106 10.12. Inter-Integrated Circuit Interface (I2C) Timing . . . . . . . . . . . . . . . . 107 10.13. JTAG Timing . . . . . . . . . . . . . . . . . . . . . 108 10.14. Analog-to-Digital Converter (ADC) Parameters . . . . . . . . . . . 109 10.15. Equivalent Circuit for ADC Inputs . . . . . 111 10.16. Power Consumption . . . . . . . . . . . . . . . 112 Part 11: Packaging . . . . . . . . . . . . . . . . . . .114 11.1. 56F8013 Package and Pin-Out Information 114 Part 12: Design Considerations . . . . . . . . .117 12.1. Thermal Design Considerations . . . . . . . . 117 12.2. Electrical Design Considerations . . . . . . . 118 Part 13: Ordering Information . . . . . . . . . . 119 Part 14: Appendix . . . . . . . . . . . . . . . . . . . .120 56F8013 Technical Data, Rev. 2 4 Freescale Semiconductor Preliminary 56F8013 Features Part 1 Overview 1.1 56F8013 Features 1.1.1 • • • • • • • • • • • • • • 1.1.2 • • • Digital Signal Controller Core Efficient 16-bit 56800E family Digital Signal Controller (DSC) engine with dual Harvard architecture As many as 32 Million Instructions Per Second (MIPS) at 32MHz core frequency Single-cycle 16 × 16-bit parallel Multiplier-Accumulator (MAC) Four 36-bit accumulators, including extension bits Arithmetic and logic multi-bit shifter Parallel instruction set with unique DSP addressing modes Hardware DO and REP loops Three internal address buses Four internal data buses Instruction set supports both DSP and controller functions Controller-style addressing modes and instructions for compact code Efficient C compiler and local variable support Software subroutine and interrupt stack with depth limited only by memory JTAG/EOnCE debug programming interface Memory Harvard architecture permits as many as three simultaneous accesses to program and data memory Flash security and protection On-chip memory, including a low-cost, high-volume Flash solution — 16KB of Program Flash — 4KB of Unified Data/Program RAM • 1.1.3 • • • • • • EEPROM emulation capability Peripheral Circuits for 56F8013 One Pulse Width Modulator (PWM) module with six PWM outputs and four Fault inputs; fault-tolerant design with dead time insertion; supports both center-aligned and edge-aligned modes One six-input, 12-bit, Analog-to-Digital Converter (ADC), which support two simultaneous conversions with dual, 3-pin multiplexed inputs; ADC and PWM modules can be synchronized through Timer Channels 2 and 3 One 16-bit Quad Timer module (TMR) totaling four pins: Timer works in conjunction with the PWM and ADC One Serial Communication Interface (SCI) with LIN Slave functionality One Serial Peripheral Interface (SPI) Computer Operating Properly (COP)/Watchdog timer 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 5 • • 26 General Purpose I/O (GPIO) pins Integrated Power-On Reset and Low-Voltage Interrupt Module • • One Inter-Integrated Circuit (I2C) port JTAG/Enhanced On-Chip Emulation (OnCE) for unobtrusive, processor speed-independent, real-time debugging Fixed Phase Lock Loop (PLL) On-chip relaxation oscillator • • 1.1.4 • • • • • Energy Information Fabricated in high-density CMOS with 5V-tolerant, TTL-compatible digital inputs On-chip regulators for digital and analog circuitry to lower cost and reduce noise Wait and Stop modes available ADC smart power management Each peripheral can be individually disabled to save power 1.2 56F8013 Description The 56F8013 is a member of the 56800E core-based family of Digital Signal Controllers (DSCs). It combines, on a single chip, the processing power of a DSP and the functionality of a microcontroller with a flexible set of peripherals to create an extremely cost-effective solution. Because of its low cost, configuration flexibility, and compact program code, the 56F8013 is well-suited for many applications. The 56F8013 includes many peripherals that are especially useful for industrial control, motion control, home appliances, general purpose inverters, smart sensors, fire and security systems, power management, and medical monitoring applications. The 56800E core is based on a Harvard-style architecture consisting of three execution units operating in parallel, allowing as many as six operations per instruction cycle. The MCU-style programming model and optimized instruction set allow straightforward generation of efficient, compact DSP and control code. The instruction set is also highly efficient for C compilers to enable rapid development of optimized control applications. The 56F8013 supports program execution from internal memories. Two data operands can be accessed from the on-chip data RAM per instruction cycle. The 56F8013 also offers up to 26 General Purpose Input/Output (GPIO) lines, depending on peripheral configuration. The 56F8013 Digital Signal Controller includes 16KB of Program Flash and 4KB of Unified Data/Program RAM. Program Flash memory can be independently bulk erased or erased in pages. Program Flash page erase size is 512 Bytes/256 Words. A key application-specific feature of the 56F8013 is the inclusion of one Pulse Width Modulator (PWM) module. This module incorporates three complementary, individually programmable PWM signal output pairs and is also capable of supporting six independent PWM functions to enhance motor control functionality. Complementary operation permits programmable dead time insertion, and separate top and bottom output polarity control. The up-counter value is programmable to support a continuously variable 56F8013 Technical Data, Rev. 2 6 Freescale Semiconductor Preliminary Award-Winning Development Environment PWM frequency. Edge-aligned and center-aligned synchronous pulse width control (0% to 100% modulation) is supported. The device is capable of controlling most motor types: ACIM (AC Induction Motors), both BDC and BLDC (Brush and Brushless DC motors), SRM and VRM (Switched and Variable Reluctance Motors), and stepper motors. The PWM incorporates fault protection and cycle-by-cycle current limiting with sufficient output drive capability to directly drive standard optoisolators. A “smoke-inhibit”, write-once protection feature for key parameters is also included. A patented PWM waveform distortion correction circuit is also provided. Each PWM is double-buffered and includes interrupt controls to permit integral reload rates to be programmable from 1/2 (center-aligned mode only) to 16. The PWM module provides reference outputs to synchronize the Analog-to-Digital Converter (ADC) through Quad Timer, Channels 2 and 3. This Digital Signal Controller also provides a full set of standard programmable peripherals that include one Serial Communications Interface (SCI), one Serial Peripheral Interface (SPI), one Quad Timer, and one Inter-Integrated Circuit (I2C) interface. Any of these interfaces can also be used as General Purpose Input/Outputs (GPIOs). 1.3 Award-Winning Development Environment Processor ExpertTM (PE) provides a Rapid Application Design (RAD) tool that combines easy-to-use component-based software application creation with an expert knowledge system. The CodeWarrior Integrated Development Environment is a sophisticated tool for code navigation, compiling, and debugging. A complete set of evaluation modules (EVMs), demonstration board kit and development system cards will support concurrent engineering. Together, PE, CodeWarrior and EVMs create a complete, scalable tools solution for easy, fast, and efficient development. 1.4 Architecture Block Diagram The 56F8013’s architecture is shown in Figure 1-1, Figure 1-2, and Figure 1-3. Figure 1-1 illustrates how the 56800E system buses communicate with internal memories and the IPBus Bridge. Table 1-1 lists the internal buses in the 56800E architecture and provides a brief description of their function. Figure 1-2 and Figure 1-3 show the peripherals and control blocks connected to the IPBus Bridge. The figures do not show the on-board regulator and power and ground signals. They also do not show the multiplexing between peripherals or the dedicated GPIOs. Please see Part 2 Signal/Connection Descriptions to see which signals are multiplexed with those of other peripherals. 1.4.1 PWM, TMR and ADC Connections Figure 1-3 shows the over/under voltage connections from the ADC to the PWM and the connections to the PWM from the TMR and GPIO. These signals can control the PWM outputs in a similar manner to the over/under voltage control signals. See the 56F8000 Peripheral Reference Manual for additional information. The PWM_reload_sync output can be connected to the TMR channel 3 input and the TMR channels 2 and 3 outputs are connected to the ADC sync inputs. These are controlled by bits in the SIM Control Register; see Section 6.3.1. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 7 4 JTAG / EOnCE pdb_m[15:0] pab[20:0] xdb2_m[15:0] 56800E CHIP TAP Controller Program Flash Program reads can be done on secondary port of data memory Data / Program RAM xab2[23:0] secondary data read port cdbw[31:0] TAP Linking Module primary data read port pdb_m[23:0] Program writes can be done on primary port of data memory GPIO cdbr_m[31:0] External JTAG Port IPBus Bridge To Flash Control Logic Flash Interface Unit NOTE: All Flash reads and writes are routed through the Flash interface units, which encapsulate the Flash memories. This is not shown for clarity’s sake. IPBus Figure 1-1 System Bus Interfaces Note: Flash memories are encapsulated within the Flash Interface Unit (FIU). Flash control is accomplished by the I/O to the FIU over the peripheral bus, while reads and writes are completed between the core and the Flash memories. Note: The primary data RAM port is 32 bits wide. Other data ports are 16 bits. 56F8013 Technical Data, Rev. 2 8 Freescale Semiconductor Preliminary Architecture Block Diagram To/From IPBus Bridge CLKGEN (ROSC / PLL / CLKIN) 8 GPIOAn 8 GPIOBn GPIOCn 6 GPIODn 4 Interrupt Controller Low-Voltage Interrupt GPIO A POR & LVI GPIO B System POR GPIO C SIM RESET / GPIOA7 GPIO D COP Reset COP IPBus (Continues on Figure 1-3) Figure 1-2 Peripheral Subsystem Table 1-1 Bus Signal Names Name Function Program Memory Interface pab[20:0] Program memory address bus. Data is returned on pdb_m bus. pdb_m[15:0] Program data bus for instruction word fetches or read operations. cdbw[15:0] Primary core data bus used for program memory writes. (Only these 16 bits of the cdbw[31:0] bus are used for writes to program memory.) Primary Data Memory Interface Bus xab1[23:0] Primary data address bus. Capable of addressing bytes1, words, and long data types. Data is written on cdbw and returned on cdbr_m. Also used to access memory-mapped I/O. cdbr_m[31:0] Primary core data bus for memory reads. Addressed via xab1 bus. cdbw[31:0] Primary core data bus for memory writes. Addressed via xab1 bus. Secondary Data Memory Interface xab2[23:0] Secondary data address bus used for the second of two simultaneous accesses. Capable of addressing only words. Data is returned on xdb2_m. xdb2_m[15:0] Secondary data bus used for secondary data address bus xab2 in the dual memory reads. 1. Byte accesses can only occur in the bottom half of the memory address space. The Most Significant Bit (MSB) of the address will be forced to 0. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 9 (Continued from Figure 1-2) To/From IPBus Bridge 2 PWM4, 5 PWM PWM0 - 3 4 PWM0 - 3 GPIOA0 - 3 2 Fault1, 2 PWM4, 5 Fault0 Output Controls Reload Pulse 3 Fault1, 2 Fault3 T2, 3 2 2 Fault0 from ADC T3i GPIOA4 - 5 GPIOA6 Fault3 T2/3 2 T1 GPIOB5 T1 Timer T2o, T3o T0 T0 I2C is muxed with both SPI amd SCI. T2 and T3 are muxed with SPI and PWM. CLKO GPIOB4 2 2 SCI I2C SPI 3 TXD, RXD 2 SDA, SCL 2 SCLK, SS 2 MISO, MOSI 2 GPIOB6 - 7 GPIOB0 - 1 T2, 3 to PWM GPIOB2 - 3 Sync0, Sync1 Over/Under Limits ADC ANA0, 1, 3 3 ANA0, 1, 3 ANA2 ANA2 VREFH, VREFL ANB2 ANB0, 1, 3 GPIOC0, 1, 3 ANB2 2 VREFH, VREFL GPIOC2, 6 3 ANB0, 1, 3 GPIOC4, 5, 7 IPBus Figure 1-3 56F8013 Peripheral I/O Pin-Out 56F8013 Technical Data, Rev. 2 10 Freescale Semiconductor Preliminary Product Documentation 1.5 Product Documentation The documents listed in Table 1-2 are required for a complete description and proper design with the 56F8013. Documentation is available from local Freescale distributors, Freescale Semiconductor sales offices, Freescale Literature Distribution Centers, or online at: http://www.freescale.com Table 1-2 56F8013 Chip Documentation Topic Description Order Number DSP56800E Reference Manual Detailed description of the 56800E family architecture, 16-bit Digital Signal Controller core processor, and the instruction set DSP56800ERM 56F8000 Peripheral Reference Manual Detailed description of peripherals of the 56F8000 family of devices MC56F8000RM 56F801x Serial Bootloader User Guide Detailed description of the Serial Bootloader in the 56F801x family of devices 56F801xBLUG 56F8013 Technical Data Sheet Electrical and timing specifications, pin descriptions, and package descriptions (this document) MC56F8013 56F8013 Product Brief Summary description and block diagram of the 56F8013 core, memory, peripherals and interfaces MC56F8013PB 56F8013 Errata Details any chip issues that might be present MC56F8013E 1.6 Data Sheet Conventions This data sheet uses the following conventions: OVERBAR This is used to indicate a signal that is active when pulled low. For example, the RESET pin is active when low. “asserted” A high true (active high) signal is high or a low true (active low) signal is low. “deasserted” A high true (active high) signal is low or a low true (active low) signal is high. Examples: Signal/Symbol Logic State Signal State Voltage1 PIN True Asserted VIL/VOL PIN False Deasserted VIH/VOH PIN True Asserted VIH/VOH PIN False Deasserted VIL/VOL 1. Values for VIL, VOL, VIH, and VOH are defined by individual product specifications. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 11 Part 2 Signal/Connection Descriptions 2.1 Introduction The input and output signals of the 56F8013 are organized into functional groups, as detailed in Table 2-1. Table 2-2 summarizes all device pins. In Table 2-2, each table row describes the signal or signals present on a pin, sorted by pin number. Table 2-1 Functional Group Pin Allocations Functional Group Number of Pins Power (VDD or VDDA) 2 Ground (VSS or VSSA) 3 Supply Capacitors 1 Reset 1 Pulse Width Modulator (PWM) Ports1 7 Serial Peripheral Interface (SPI) Ports2 4 Analog-to-Digital Converter (ADC) Ports 6 Timer Module Ports3 2 Serial Communications Interface (SCI) Ports4 2 JTAG/Enhanced On-Chip Emulation (EOnCE) 4 1. Pins in this section can function as TMR and GPIO. 2. Pins in this section can function as TMR, I2C, and GPIO. 3. Pins can function as PWM and GPIO. 4. Pins in this section can function as I2C and GPIO. 56F8013 Technical Data, Rev. 2 12 Freescale Semiconductor Preliminary Introduction Table 2-2 56F8013 Pins Peripherals: LQFP Pin # Pin Name Signal Name GPIO I2C SCI SPI ADC PWM Quad Power & Timer Ground 1 GPIOB6 GPIOB6, RXD, SDA, CLKIN B6 SDA 2 GPIOB1 GPIOB1, SS, SDA B1 SDA 3 GPIOB7 GPIOB7, TXD, SCL B7 SCL 4 GPIOB5 GPIOB5, T1, FAULT3 B5 5 ANB0 ANB0, GPIOC4 C4 ANB0 6 ANB1 ANB1, GPIOC5 C5 ANB1 7 ANB2 ANB2, VREFL, GPIOC6 C6 ANB2, VREFL 8 VDDA VDDA VDDA 9 VSSA VSSA VSSA 10 ANA2 ANA2, VREFH, GPIOC2 C2 ANA2, VREFH 11 ANA1 ANA1, GPIOC1 C1 ANA1 12 ANA0 ANA0, GPIOC0 C0 ANA0 13 VSS_IO VSS_IO 14 TCK TCK, GPIOD2 D2 15 RESET RESET, GPIOA7 A7 16 GPIOB3 GPIOB3, MOSI, T3 B3 MOSI T3 17 GPIOB2 GPIOB2, MISO, T2 B2 MISO T2 18 GPIOA6 GPIOA6, FAULT0 A6 19 GPIOB4 GPIOB4, T0, CLKO B4 20 GPIOA5 GPIOA5, PWM5, FAULT2, T3 A5 21 GPIOB0 GPIOB0, SCLK, SCL B0 22 GPIOA4 GPIOA4, PWM4, FAULT1, T2 23 GPIOA2 GPIOA2, PWM2 JTAG RXD Misc CLKIN SS TXD FAULT3 T1 VSS_IO TCK RESET FAULT0 T0 PWM5, FAULT2 T3 A4 PWM4, FAULT1 T2 A2 PWM2 SCL CLKO SCLK 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 13 Table 2-2 56F8013 Pins (Continued) Peripherals: LQFP Pin # Pin Name Signal Name GPIO I2C A3 SCI SPI ADC PWM Quad Power & Timer Ground JTAG 24 GPIOA3 GPIOA3, PWM3 25 VCAP 26 VDD_IO VDD_IO VDD_IO 27 VSS_IO VSS_IO 28 GPIOA1 GPIOA1, PWM1 A1 PWM1 29 GPIOA0 GPIOA0, PWM0 A0 PWM0 30 TDI TDI, GPIOD0 D0 TDI 31 TMS TMS, GPIOD3 D3 TMS 32 TDO TDO, GPIOD1 D1 TDO Misc PWM3 VCAP VCAP VSS_IO 56F8013 Technical Data, Rev. 2 14 Freescale Semiconductor Preliminary Introduction VDD_IO Power VSS_IO Ground VDDA Power VSSA Ground 1 2 1 1 56F8013 Other Supply Ports VCAP 1 GPIOB0 (SCLK, SCL) GPIOB1 (SS, SDA) 1 1 GPIOB2 (MISO, T2) SPI Port or I2C Port or Timer Port or GPIO 1 GPIOB3 (MOSI, T3) 1 SCI Port or I2C Port or GPIO GPIOB6 (RXD, SDA, CLKIN) 1 GPIOB7 (TXD, SCL) 1 GPIOA0 - 2 (PWM0 - 2) 3 GPIOA3 (PWM3) 1 GPIOA4 (PWM4, FAULT1, T2) 1 GPIOA5 (PWM5, FAULT2, T3) RESET 1 RESET ( GPIOA7) 1 GPIOA6 (FAULT0) 1 2 GPIOB4 (T0, CLKO) Timer Port or GPIO PWM Port or Timer Port or GPIO 1 1 GPIOB5 (T1, FAULT3) 1 ANA0 - 1 (GPIOC0 - 1) ANA2 (VREFH, GPIOC2) ADC Port or GPIO ANB0 - 1 (GPIOC4 - 5) 2 1 ANB2 (VREFL, GPIOC6) TCK (GPIOD2) 1 JTAG/ EOnCE Port or GPIO TMS (GPIOD3) 1 TDI (GPIOD0) 1 TDO (GPIOD1) 1 Figure 2-1 56F8013 Signals Identified by Functional Group (32-Pin LQFP) 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 15 2.2 56F8013 Signal Pins After reset, each pin is configured for its primary function (listed first). Any alternate functionality must be programmed. Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP Signal Name LQFP Pin No. Type State During Reset Signal Description VDD_IO 26 Supply Supply I/O Power — This pin supplies 3.3V power to the chip I/O interface. VSS_IO 13 Supply Supply VSS — These pins provide ground for chip logic and I/O drivers. VSS_IO 27 VDDA 8 Supply Supply ADC Power — This pin supplies 3.3V power to the ADC modules. It must be connected to a clean analog power supply. VSSA 9 Supply Supply ADC Analog Ground — This pin supplies an analog ground to the ADC modules. VCAP 25 Supply Supply VCAP — Connect this pin to a 4.4µF or greater bypass capacitor in order to bypass the core voltage regulator, required for proper chip operation. See Section 10.2.1. GPIOB6 1 Input/ Output (RXD) Input (SDA1) Input/ Output (CLKIN) Input Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally Receive Data — SCI receive data input. Serial Data — This pin serves as the I2C serial data line. Clock Input — This pin serves as an optional external clock input. After reset, the default state is GPIOB6. The peripheral functionality is controlled via the SIM (See Section 6.3.8) and the CLKMODE bit of the OCCS Oscillator Control Register. 1. This signal is also brought out on the GPIOB1 pin. Return to Table 2-2 56F8013 Technical Data, Rev. 2 16 Freescale Semiconductor Preliminary 56F8013 Signal Pins Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP (Continued) Signal Name LQFP Pin No. GPIOB7 3 Type State During Reset Signal Description Input/ Output Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally (TXD) Input/ Output Transmit Data — SCI transmit data output or transmit / receive in single wire operation. (SCL2) Input/ Output Serial Clock — This pin serves as the I2C serial clock. After reset, the default state is GPIOB7. The peripheral functionality is controlled via the SIM. See Section 6.3.8. 2. This signal is also brought out on the GPIOB0 pin. RESET 15 (GPIOA7) Input Input/Open Drain Output Input, pulled Reset — This input is a direct hardware reset on the processor. high When RESET is asserted low, the chip is initialized and placed in the internally reset state. A Schmitt trigger input is used for noise immunity. The internal reset signal will be deasserted synchronous with the internal clocks after a fixed number of internal clocks. Port A GPIO — This GPIO pin can be individually programmed as an input or open drain output pin. Note that RESET functionality is disabled in this mode and the chip can only be reset via POR, COP reset, or software reset. After reset, the default state is RESET. GPIOB4 19 Input/ Output Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally (T0) Input/ Output T0 — Timer, Channel 0 (CLKO) Output Clock Output — This is a buffered clock signal. Using the SIM_CLKO Select Register (SIM_CLKOSR), this pin can be programmed as any of the following: disabled (logic 0), CLK_MSTR (system clock), IPBus clock, or oscillator output. See Section 6.3.7. After reset, the default state is GPIOB4. The peripheral functionality is controlled via the SIM. See Section 6.3.8. Return to Table 2-2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 17 Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP (Continued) Signal Name LQFP Pin No. GPIOB5 4 Type Input/ Output State During Reset Signal Description Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally (T1) Input/ Output T1 — Timer, Channel 1 (FAULT3) Output FAULT3 — This fault input pin is used for disabling selected PWM outputs in cases where fault conditions originate off-chip. After reset, the default state is GPIOB5. The peripheral functionality is controlled via the SIM. See Section 6.3.8. TCK 14 (GPIOD2) Input Input/ Output Input, pulled Test Clock Input — This input pin provides a gated clock to high synchronize the test logic and shift serial data to the JTAG/EOnCE internally port. The pin is connected internally to a pull-up resistor. A Schmitt trigger input is used for noise immunity. Port D GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is TCK. TMS 31 (GPIOD3) Input Input/ Output Input, pulled Test Mode Select Input — This input pin is used to sequence the high JTAG TAP controller’s state machine. It is sampled on the rising internally edge of TCK and has an on-chip pull-up resistor. Port D GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is TMS. TDI 30 (GPIOD0) Input Input/ Output Input, pulled Test Data Input — This input pin provides a serial input data stream high to the JTAG/EOnCE port. It is sampled on the rising edge of TCK internally and has an on-chip pull-up resistor. Port D GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is TDI. Return to Table 2-2 56F8013 Technical Data, Rev. 2 18 Freescale Semiconductor Preliminary 56F8013 Signal Pins Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP (Continued) Signal Name LQFP Pin No. Type TDO 32 Output Tri-stated, Test Data Output — This tri-stateable output pin provides a serial pulled high output data stream from the JTAG/EOnCE port. It is driven in the internally shift-IR and shift-DR controller states, and changes on the falling edge of TCK. Input/ Output Port D GPIO — This GPIO pin can be individually programmed as an input or output pin. (GPIOD1) State During Reset Signal Description After reset, the default state is TDO. Input/ Output Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally (SCLK) Input/ Output SPI Serial Clock — In the master mode, this pin serves as an output, clocking slaved listeners. In slave mode, this pin serves as the data clock input. A Schmitt trigger input is used for noise immunity. (SCL3) Input/ Output Serial Data — This pin serves as the I2C serial clock. GPIOB0 21 After reset, the default state is GPIOB0. The peripheral functionality is controlled via the SIM. See Section 6.3.8. 3. This signal is also brought out on the GPIOB7 pin. GPIOB1 2 Input/ Output (SS) Input (SDA4) Input/ Output Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally SPI Slave Select — SS is used in slave mode to indicate to the SPI module that the current transfer is to be received. Serial Clock — This pin serves as the I2C serial data line. After reset, the default state is GPIOB1. The peripheral functionality is controlled via the SIM. See Section 6.3.8. 4. This signal is also brought out on the GPIOB6 pin. Return to Table 2-2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 19 Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP (Continued) Signal Name LQFP Pin No. GPIOB2 17 Type Input/ Output State During Reset Signal Description Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally (MISO) Input/ Output SPI Master In/Slave Out — This serial data pin is an input to a master device and an output from a slave device. The MISO line of a slave device is placed in the high-impedance state if the slave device is not selected. The slave device places data on the MISO line a half-cycle before the clock edge the master device uses to latch the data. (T25) Input/ Output T2 — Timer, Channel 2 After reset, the default state is GPIOB2. The peripheral functionality is controlled via the SIM. See Section 6.3.8. 5. This signal is also brought out on the GPIOA4 pin. GPIOB3 16 Input/ Output Input, pulled Port B GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally (MOSI) Input/ Output SPI Master Out/Slave In— This serial data pin is an output from a master device and an input to a slave device. The master device places data on the MOSI line a half-cycle before the clock edge the slave device uses to latch the data. (T36) Input/ Output T3 — Timer, Channel 3 After reset, the default state is GPIOB3. The peripheral functionality is controlled via the SIM. See Section 6.3.8. 6. This signal is also brought out on the GPIOA5 pin. GPIOA0 29 (PWM0) Input/ Output Output Input, pulled Port A GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally PWM0 — This is one of the six PWM output pins. After reset, the default state is GPIOA0. Return to Table 2-2 56F8013 Technical Data, Rev. 2 20 Freescale Semiconductor Preliminary 56F8013 Signal Pins Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP (Continued) Signal Name LQFP Pin No. GPIOA1 28 (PWM1) Type Input/ Output State During Reset Signal Description Input, pulled Port A GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally Output PWM1 — This is one of the six PWM output pins. After reset, the default state is GPIOA1. GPIOA2 23 (PWM2) Input/ Output Input, pulled Port A GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally Output PWM2 — This is one of the six PWM output pins. After reset, the default state is GPIOA2. GPIOA3 24 (PWM3) Input/ Output Input, pulled Port A GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally Output PWM3 — This is one of the six PWM output pins. After reset, the default state is GPIOA3. GPIOA4 22 Input/ Output (PWM4) Output (FAULT1) Input (T27) Input/ Output Input, pulled Port A GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally PWM4 — This is one of the six PWM output pins. Fault1 — This fault input pin is used for disabling selected PWM outputs in cases where fault conditions originate off-chip. T2 — Timer, Channel 2 After reset, the default state is GPIOA4. The peripheral functionality is controlled via the SIM. See Section 6.3.8. 7. This signal is also brought out on the GPIOB2 pin. Return to Table 2-2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 21 Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP (Continued) Signal Name LQFP Pin No. GPIOA5 20 Type Input/ Output State During Reset Signal Description Input, pulled Port A GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally (PWM5) Output PWM5 — This is one of the six PWM output pins. (FAULT2) Input/ Output Fault2 — This fault input pin is used for disabling selected PWM outputs in cases where fault conditions originate off-chip. (T38) Input/ Output T3 — Timer, Channel 3 After reset, the default state is GPIOA5. The peripheral functionality is controlled via the SIM. See Section 6.3.8. 8. This signal is also brought out on the GPIOB3 pin. GPIOA6 18 (FAULT0) Input/ Output Input, pulled Port A GPIO — This GPIO pin can be individually programmed as high an input or output pin. internally Input Fault0 — This fault input pin is used for disabling selected PWM outputs in cases where fault conditions originate off-chip. After reset, the default state is GPIOA6. ANA0 12 (GPIOC0) Input Analog Input Input/ Output ANA0 — Analog input to ADC A, channel 0 Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is ANA0. ANA1 11 (GPIOC1) Input Input/ Output Analog Input ANA1 — Analog input to ADC A, channel 1 Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is ANA1. Return to Table 2-2 56F8013 Technical Data, Rev. 2 22 Freescale Semiconductor Preliminary 56F8013 Signal Pins Table 2-3 56F8013 Signal and Package Information for the 32-Pin LQFP (Continued) Signal Name LQFP Pin No. Type ANA2 10 Input (VREFH) Input (GPIOC2) Input/ Output State During Reset Analog Input Signal Description ANA2 — Analog input to ADC A, channel 2 VREFH — Analog reference voltage high Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is ANA2. ANB0 5 (GPIOC4) Input Analog Input Input/ Output ANB0 — Analog input to ADC B, channel 0 Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is ANB0. ANB1 6 (GPIOC5) Input Analog Input Input/ Output ANB1 — Analog input to ADC B, channel 1 Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is ANB1. ANB2 7 Input (VREFL) Input (GPIOC6) Input/ Output Analog Input ANB2 — Analog input to ADC B, channel 2 VREFL — Analog reference voltage low. This should normally be connected to a low-noise VSS. Port C GPIO — This GPIO pin can be individually programmed as an input or output pin. After reset, the default state is ANB2. Return to Table 2-2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 23 Part 3 OCCS 3.1 Overview This module provides the 2X system clock frequency to the System Integration Module (SIM), which uses it to generate the various chip clocks. This module also produces the OSC_CLK signals plus the ADC clock and high-speed peripheral clock. The on-chip clock synthesis module allows product design using an internal relaxation oscillator to run 56F8000 family parts at user-selectable frequencies up to 32MHz. 3.2 Features The On-Chip Clock Synthesis (OCCS) module interfaces to the oscillator and PLL. The OCCS module features: • • • • • Internal relaxation oscillator Ability to power down the internal relaxation oscillator Ability to put the internal relaxation oscillator into a standby mode 3-bit postscaler provides control for the PLL output Ability to power down the internal PLL • • • • Provides 2X master clock frequency and OSC_CLK signals Provides 3X fast peripheral clock to PWM and Timer Safety shutdown feature is available in the event that the PLL reference clock disappears Can be driven from an external clock source The clock generation module provides the programming interface for both the PLL and internal relaxation oscillator. 3.3 Operating Modes In 56F8000 family parts, either an internal oscillator or an external frequency source can be used to provide a reference clock (SYS_CLK2) to the SIM. The 2X system clock source output from the OCCS can be described by one of the following equations: 2X system frequency = oscillator frequency 2X system frequency = (oscillator frequency X 8) / (postscaler) where: postscaler = 1, 2, 4, 8, 16, or 32 PLL output divider The SIM is responsible for further dividing these frequencies by two, which will insure a 50% duty cycle in the system clock output. 56F8013 Technical Data, Rev. 2 24 Freescale Semiconductor Preliminary Operating Modes The 56F8000 family parts’ on-chip clock synthesis module has the following registers: • • • • • Control Register (OCCS_CR) Divide-by Register (OCCS_DB) Status Register (OCCS_SR) Shutdown Register (OCCS_SHUTDN) Oscillator Control Register (OCCS_OCTRL) For more information on these registers, please refer to the 56F8000 Peripheral Reference Manual. 3.3.1 External Clock Source The recommended method of connecting an external clock is illustrated in Figure 3-1. The external clock source is connected to GPIOB6 / RXD. 56F8013 GPIOB6 / RXD External Clock Figure 3-1 Connecting an External Clock Signal using GPIOB6 / RXD 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 25 3.4 Block Diagram Figure 3-2 provides a block diagram which shows how the 56F8013 creates its internal clock, using the relaxation oscillator as an 8MHz clock reference for the PLL. TRIM[9:0] Relaxation OSC ROSB ROPD Bus Interface and Control GPIOB6 / RXD MUX Bus Interface PRECS FOUT PLL Postscaler (÷ 1, 2, 4, 8, 16, 32) ÷3 X 24 MUX MSTR_OSC SYS_CLK_x2 source to the SIM (64MHz max) ZSRC PLLCOD Lock Detector FOUT/2 Postscaler (÷ 1, 2, 4, 8, 16, 32) Loss of Reference Clock Detector MUX FEEDBACK ÷2 HS PERF CLK (96MHz max) LCK Loss of Reference Clock Interrupt Figure 3-2 OCCS Block Diagram with Relaxation Oscillator 56F8013 Technical Data, Rev. 2 26 Freescale Semiconductor Preliminary Pin Descriptions 3.5 Pin Descriptions 3.5.1 External Reference (GPIOB6 / RXD) The relaxation oscillator is included on chip and the reset mode is to use this as the clock source for the chip. The user then has the option of switching to an external clock reference if desired. Part 4 Memory Map 4.1 Introduction The 56F8013 device is a 16-bit motor-control chip based on the 56800E core. It uses a Harvard-style architecture with two independent memory spaces for Data and Program. On-chip RAM is used in both spaces and Flash memory is used only in Program space. This section provides memory maps for: • • Program Address Space, including the Interrupt Vector Table Data Address Space, including the EOnCE Memory and Peripheral Memory Maps On-chip memory sizes for the device are summarized in Table 4-1. Flash memories’ restrictions are identified in the “Use Restrictions” column of Table 4-1. Table 4-1 Chip Memory Configurations On-Chip Memory 56F8013 Use Restrictions Program Flash (PFLASH) 8k x 16 Erase / Program via Flash interface unit and word writes to CDBW Unified RAM (ram) 2k x 16 Usable by both the Program and Data memory spaces 4.2 Interrupt Vector Table Table 4-2 provides the 56F8013’s reset and interrupt priority structure, including on-chip peripherals. The table is organized with higher-priority vectors at the top and lower-priority interrupts lower in the table. As indicated, the priority of an interrupt can be assigned to different levels, allowing some control over interrupt priorities. All level 3 interrupts will be serviced before level 2, and so on. For a selected priority level, the lowest vector number has the highest priority. The location of the vector table is determined by the Vector Base Address (VBA). Please see Section 5.6.11 for the reset value of the VBA. By default, VBA = 0, and the reset address and COP reset address will correspond to vector 0 and 1 of the interrupt vector table. In these instances, the first two locations in the vector table must contain branch or JMP instructions. All other entries must contain JSR instructions. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 27 Table 4-2 Interrupt Vector Table Contents1 Peripheral Vector Number Priority Level Vector Base Address + Interrupt Function core P:$00 Reserved for Reset Overlay2 core P:$02 Reserved for COP Reset Overlay core 2 3 P:$04 Illegal Instruction core 3 3 P:$06 SW Interrupt 3 core 4 3 P:$08 HW Stack Overflow core 5 3 P:$0A Misaligned Long Word Access core 6 1-3 P:$0C EOnCE Step Counter core 7 1-3 P:$0E EOnCE Breakpoint Unit 0 core 8 1-3 P:$10 EOnCE Trace Buffer core 9 1-3 P:$12 EOnCE Transmit Register Empty core 10 1-3 P:$14 EOnCE Receive Register Full core 11 2 P:$16 SW Interrupt 2 core 12 1 P:$18 SW Interrupt 1 core 13 0 P:$1A SW Interrupt 0 14 Reserved 15 Reserved PS 16 0-2 P:$20 Power Sense OCCS 17 0-2 P:$22 PLL Lock, Loss of Clock Reference Interrupt FM 18 0-2 P:$24 FM Access Error Interrupt FM 19 0-2 P:$26 FM Command Complete FM 20 0-2 P:$28 FM Command, data and address Buffers Empty 21 Reserved GPIOD 22 0-2 P:$2C GPIOD GPIOC 23 0-2 P:$2E GPIOC GPIOB 24 0-2 P:$30 GPIOB GPIOA 25 0-2 P:$32 GPIOA SPI 26 0-2 P:$34 SPI Receiver Full / Error SPI 27 0-2 P:$36 SPI Transmitter Empty SCI 28 0-2 P:$38 SCI Transmitter Empty SCI 29 0-2 P:$3A SCI Transmitter Idle SCI 30 0-2 P:$3C SCI Reserved SCI 31 0-2 P:$3E SCI Receiver Error SCI 32 0-2 P:$40 SCI Receiver Full I2 C 35 0-2 P:$46 I2C Timer 36 0-2 P:$48 Timer Channel 0 Timer 37 0-2 P:$4A Timer Channel 1 33, 34 Reserved (Continues next page) 56F8013 Technical Data, Rev. 2 28 Freescale Semiconductor Preliminary Program Map Table 4-2 Interrupt Vector Table Contents1 (Continued) Peripheral Vector Number Priority Level Vector Base Address + Interrupt Function Timer 38 0-2 P:$4C Timer Channel 2 Timer 39 0-2 P:$4E Timer Channel 3 ADC 40 0-2 P:$50 ADCA Conversion Complete ADC 41 0-2 P:$52 ADCB Conversion Complete ADC 42 0-2 P:$54 ADC Zero Crossing or Limit Error PWM 43 0-2 P:$56 Reload PWM PWM 44 0-2 P:$58 PWM Fault SWILP 45 -1 P:$5A SW Interrupt Low Priority 1. Two words are allocated for each entry in the vector table. This does not allow the full address range to be referenced from the vector table, providing only 19 bits of address. 2. If the VBA is set to $0000, the first two locations of the vector table will overlay the chip reset addresses. 4.3 Program Map The Program Memory map is shown in Table 4-3. Table 4-3 Program Memory Map1 Begin/End Address Memory Allocation P: $FF FFFF P: $00 8800 RESERVED P: $00 87FF P: $00 8000 On-Chip RAM2 4KB P: $00 7FFF P: $00 2000 RESERVED P: $00 1FFF P: $00 0000 Internal Program Flash 16KB Cop Reset Address = $00 0002 Boot Location = $00 0000 1. All addresses are 16-bit Word addresses. 2. This RAM is shared with Data space starting at address X: $00 0000; see Figure 4-1. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 29 4.4 Data Map Table 4-4 Data Memory Map1 Begin/End Address Memory Allocation X:$FF FFFF X:$FF FF00 EOnCE 256 locations allocated X:$FF FEFF X:$01 0000 RESERVED X:$00 FFFF X:$00 F000 On-Chip Peripherals 4096 locations allocated X:$00 EFFF X:$00 8800 RESERVED X:$00 EFFF X:$00 0800 RESERVED X:$00 7FFF X:$00 0040 RESERVED X:$00 07FF X:$00 0000 On-Chip Data RAM2 4KB 1. All addresses are 16-bit Word addresses. 2. This RAM is shared with Program space starting at P: $00 8000; see Figure 4-1. Program Data EOnCE Reserved Reserved RAM Peripherals Reserved Dual Port RAM Reserved Flash RAM Figure 4-1 Dual Port RAM 56F8013 Technical Data, Rev. 2 30 Freescale Semiconductor Preliminary EOnCE Memory Map 4.5 EOnCE Memory Map Figure 4-5 lists all EOnCE registers necessary to access or control the EOnCE. Table 4-5 EOnCE Memory Map Address Register Acronym Register Name X:$FF FFFF OTX1 / ORX1 Transmit Register Upper Word Receive Register Upper Word X:$FF FFFE OTX / ORX (32 bits) Transmit Register Receive Register X:$FF FFFD OTXRXSR Transmit and Receive Status and Control Register X:$FF FFFC OCLSR Core Lock / Unlock Status Register X:$FF FFFB - X:$FF FFA1 X:$FF FFA0 Reserved OCR Control Register X:$FF FF9F Instruction Step Counter X:$FF FF9E OSCNTR (24 bits) Instruction Step Counter X:$FF FF9D OSR Status Register X:$FF FF9C OBASE Peripheral Base Address Register X:$FF FF9B OTBCR Trace Buffer Control Register X:$FF FF9A OTBPR Trace Buffer Pointer Register X:$FF FF99 Trace Buffer Register Stages X:$FF FF98 OTB (21 - 24 bits/stage) Trace Buffer Register Stages X:$FF FF97 X:$FF FF96 Breakpoint Unit Control Register OBCR (24 bits) X:$FF FF95 X:$FF FF94 Breakpoint Unit Address Register 1 OBAR1 (24 bits) X:$FF FF93 X:$FF FF92 OBAR2 (32 bits) Breakpoint Unit Address Register 2 Breakpoint Unit Mask Register 2 OBMSK (32 bits) X:$FF FF8F X:$FF FF8E Breakpoint Unit Address Register 1 Breakpoint Unit Address Register 2 X:$FF FF91 X:$FF FF90 Breakpoint Unit Control Register Breakpoint Unit Mask Register 2 Reserved OBCNTR EOnCE Breakpoint Unit Counter X:$FF FF8D Reserved X:$FF FF8C Reserved X:$FF FF8B Reserved X:$FF FF8A X:$FF FF89 - X:$FF FF00 OESCR External Signal Control Register Reserved 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 31 4.6 Peripheral Memory Mapped Registers On-chip peripheral registers are part of the data memory map on the 56800E series. These locations may be accessed with the same addressing modes used for ordinary Data memory, except all peripheral registers should be read/written using word accesses only. Table 4-6 summarizes base addresses for the set of peripherals on the 56F8013 device. Peripherals are listed in order of the base address. The following tables list all of the peripheral registers required to control or access the peripherals. Table 4-6 Data Memory Peripheral Base Address Map Summary Peripheral Prefix Base Address Table Number Timer TMRn X:$00 F000 4-7 PWM PWM X:$00 F040 4-8 ITCN ITCN X:$00 F060 4-9 ADC ADC X:$00 F080 4-10 SCI SCI X:$00 F0B0 4-11 SPI SPI X:$00 F0C0 4-12 2C I2C X:$00 F0D0 4-13 COP X:$00 F0E0 4-14 CLK, PLL, OSC, TEST OCCS X:$00 F0F0 4-15 GPIO Port A GPIOA X:$00 F100 4-16 GPIO Port B GPIOB X:$00 F110 4-17 GPIO Port C GPIOC X:$00 F120 4-18 GPIO Port D GPIOD X:$00 F130 4-19 SIM SIM X:$00 F140 4-20 Power Supervisor PS X:$00 F160 4-21 FM FM X:$00 F400 4-22 I COP 56F8013 Technical Data, Rev. 2 32 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-7 Quad Timer Registers Address Map (TMR_BASE = $00 F000) Register Acronym Address Offset Register Description TMR0_COMP1 $0 Compare Register 1 TMR0_COMP2 $1 Compare Register 2 TMR0_CAPT $2 Capture Register TMR0_LOAD $3 Load Register TMR0_HOLD $4 Hold Register TMR0_CNTR $5 Counter Register TMR0_CTRL $6 Control Register TMR0_SCTRL $7 Status and Control Register TMR0_CMPLD1 $8 Comparator Load Register 1 TMR0_CMPLD2 $9 Comparator Load Register 2 TMR0_CSCTRL $A Comparator Status and Control Register Reserved TMR1_COMP1 $10 Compare Register 1 TMR1_COMP2 $11 Compare Register 2 TMR1_CAPT $12 Capture Register TMR1_LOAD $13 Load Register TMR1_HOLD $14 Hold Register TMR1_CNTR $15 Counter Register TMR1_CTRL $16 Control Register TMR1_SCTRL $17 Status and Control Register TMR1_CMPLD1 $18 Comparator Load Register 1 TMR1_CMPLD2 $19 Comparator Load Register 2 TMR1_CSCTRL $1A Comparator Status and Control Register TMR2_COMP1 $20 Compare Register 1 TMR2_COMP2 $21 Compare Register 2 TMR2_CAPT $22 Capture Register TMR2_LOAD $23 Load Register TMR2_HOLD $24 Hold Register TMR2_CNTR $25 Counter Register TMR2_CTRL $26 Control Register TMR2_SCTRL $27 Status and Control Register TMR2_CMPLD1 $28 Comparator Load Register 1 TMR2_CMPLD2 $29 Comparator Load Register 2 TMR2_CSCTRL $2A Comparator Status and Control Register Reserved 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 33 Table 4-7 Quad Timer Registers Address Map (TMR_BASE = $00 F000) (Continued) Register Acronym Address Offset Register Description Reserved TMR3_COMP1 $30 Compare Register 1 TMR3_COMP2 $31 Compare Register 2 TMR3_CAPT $32 Capture Register TMR3_LOAD $33 Load Register TMR3_HOLD $34 Hold Register TMR3_CNTR $35 Counter Register TMR3_CTRL $36 Control Register TMR3_SCTRL $37 Status and Control Register TMR3_CMPLD1 $38 Comparator Load Register 1 TMR3_CMPLD2 $39 Comparator Load Register 2 TMR3_CSCTRL $3A Comparator Status and Control Register Table 4-8 Pulse Width Modulator Registers Address Map (PWM_BASE = $00 F040) Register Acronym Address Offset Register Description PWM_CTRL $0 Control Register PWM_FCTRL $1 Fault Control Register PWM_FLTACK $2 Fault Status Acknowledge Register PWM_OUT $3 Output Control Register PWM_CNTR $4 Counter Register PWM_CMOD $5 Counter Modulo Register PWM_VAL0 $6 Value Register 0 PWM_VAL1 $7 Value Register 1 PWM_VAL2 $8 Value Register 2 PWM_VAL3 $9 Value Register 3 PWM_VAL4 $A Value Register 4 PWM_VAL5 $B Value Register 5 PWM_DTIM0 $C Dead Time Register 0 PWM_DTIM1 $D Dead Time Register 1 PWM_DMAP1 $E Disable Mapping Register 1 PWM_DMAP2 $F Disable Mapping Register 2 PWM_CNFG $10 Configure Register PWM_CCTRL $11 Channel Control Register PWM_PORT $12 Port Register PWM_ICCTRL $13 Internal Correction Control Register PWM_SCTRL $14 Source Control Register 56F8013 Technical Data, Rev. 2 34 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-9 Interrupt Control Registers Address Map (ITCN_BASE = $00 F060) Register Acronym Address Offset Register Description ITCN_IPR0 $0 Interrupt Priority Register 0 ITCN_IPR1 $1 Interrupt Priority Register 1 ITCN_IPR2 $2 Interrupt Priority Register 2 ITCN_IPR3 $3 Interrupt Priority Register 3 ITCN_IPR4 $4 Interrupt Priority Register 4 ITCN_VBA $5 Vector Base Address Register ITCN_FIM0 $6 Fast Interrupt Match 0 Register ITCN_FIVAL0 $7 Fast Interrupt Vector Address Low 0 Register ITCN_FIVAH0 $8 Fast Interrupt Vector Address High 0 Register ITCN_FIM1 $9 Fast Interrupt Match 1 Register ITCN_FIVAL1 $A Fast Interrupt Vector Address Low 1 Register ITCN_FIVAH1 $B Fast Interrupt Vector Address High 1 Register ITCN_IRQP0 $C IRQ Pending Register 0 ITCN_IRQP1 $D IRQ Pending Register 1 ITCN_IRQP2 $E IRQ Pending Register 2 ITCN_ICTRL $12 Reserved Interrupt Control Register Reserved Table 4-10 Analog-to-Digital Converter Registers Address Map (ADC_BASE = $00 F080) Register Acronym Address Offset Register Description ADC_CTRL1 $0 Control Register 1 ADC_CTRL2 $1 Control Register 2 ADC_ZXCTRL $2 Zero Crossing Control Register ADC_CLIST 1 $3 Channel List Register 1 ADC_CLIST 2 $4 Channel List Register 2 ADC_SDIS $5 Sample Disable Register ADC_STAT $6 Status Register ADC_LIMSTAT $7 Limit Status Register ADC_ZXSTAT $8 Zero Crossing Status Register ADC_RSLT0 $9 Result Register 0 ADC_RSLT1 $A Result Register 1 ADC_RSLT2 $B Result Register 2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 35 Table 4-10 Analog-to-Digital Converter Registers Address Map (ADC_BASE = $00 F080) (Continued) Register Acronym Address Offset Register Description ADC_RSLT3 $C Result Register 3 ADC_RSLT4 $D Result Register 4 ADC_RSLT5 $E Result Register 5 ADC_RSLT6 $F Result Register 6 ADC_RSLT7 $10 Result Register 7 ADC_LOLIM0 $11 Low Limit Register 0 ADC_LOLIM1 $12 Low Limit Register 1 ADC_LOLIM2 $13 Low Limit Register 2 ADC_LOLIM3 $14 Low Limit Register 3 ADC_LOLIM4 $15 Low Limit Register 4 ADC_LOLIM5 $16 Low Limit Register 5 ADC_LOLIM6 $17 Low Limit Register 6 ADC_LOLIM7 $18 Low Limit Register 7 ADC_HILIM0 $19 High Limit Register 0 ADC_HILIM1 $1A High Limit Register 1 ADC_HILIM2 $1B High Limit Register 2 ADC_HILIM3 $1C High Limit Register 3 ADC_HILIM4 $1D High Limit Register 4 ADC_HILIM5 $1E High Limit Register 5 ADC_HILIM6 $1F High Limit Register 6 ADC_HILIM7 $20 High Limit Register 7 ADC_OFFST0 $21 Offset Register 0 ADC_OFFST1 $22 Offset Register 1 ADC_OFFST2 $23 Offset Register 2 ADC_OFFST3 $24 Offset Register 3 ADC_OFFST4 $25 Offset Register 4 ADC_OFFST5 $26 Offset Register 5 ADC_OFFST6 $27 Offset Register 6 ADC_OFFST7 $28 Offset Register 7 ADC_PWR $29 Power Control Register ADC_VREF $2A Voltage Reference Register Reserved 56F8013 Technical Data, Rev. 2 36 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-11 Serial Communication Interface Registers Address Map (SCI_BASE = $00 F0B0) Register Acronym Address Offset Register Description SCI_RATE $0 Baud Rate Register SCI_CTRL1 $1 Control Register 1 SCI_CTRL2 $2 Control Register 2 SCI_STAT $3 Status Register SCI_DATA $4 Data Register Table 4-12 Serial Peripheral Interface Registers Address Map (SPI_BASE = $00 F0C0) Register Acronym Address Offset Register Description SPI_SCTRL $0 Status and Control Register SPI_DSCTRL $1 Data Size and ControlRegister SPI_DRCV $2 Data Receive Register SPI_DXMIT $3 Data Transmit Register Table 4-13 I2C Registers Address Map (I2C_BASE = $00 F0D0) Register Acronym Address Offset Register Description I2C_ADDR $0 Address Register I2C_FDIV $1 Frequency Divider Register I2C_CTRL $2 Control Register I2C_STAT $3 Status Register I2C_DATA $4 Data I/O Register I2C_NFILT $5 Noise Filter Register Table 4-14 Computer Operating Properly Registers Address Map (COP_BASE = $00 F0E0) Register Acronym Address Offset Register Description COP_CTRL $0 Control Register COP_TOUT $1 Time-Out Register COP_CNTR $2 Counter Register 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 37 Table 4-15 Clock Generation Module Registers Address Map (OCCS_BASE = $00 F0F0) Register Acronym Address Offset Register Description OCCS_CTRL $0 Control Register OCCS_DIVBY $1 Divide-By Register OCCS_STAT $2 Status Register Reserved OCCS_SHUTDN $4 Shutdown Register OCCS_OCTRL $5 Oscillator Control Register Table 4-16 GPIOA Registers Address Map (GPIOA_BASE = $00 F100) Register Acronym Address Offset Register Description GPIOA_PUPEN $0 Pull-up Enable Register GPIOA_DATA $1 Data Register GPIOA_DDIR $2 Data Direction Register GPIOA_PEREN $3 Peripheral Enable Register GPIOA_IASSRT $4 Interrupt Assert Register GPIOA_IEN $5 Interrupt Enable Register GPIOA_IEPOL $6 Interrupt Edge Polarity Register GPIOA_IPEND $7 Interrupt Pending Register GPIOA_IEDGE $8 Interrupt Edge-Sensitive Register GPIOA_PPOUTM $9 Push-Pull Output Mode Control Register GPIOA_RDATA $A Raw Data Register GPIOA_DRIVE $B Drive Strength Control Register 56F8013 Technical Data, Rev. 2 38 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-17 GPIOB Registers Address Map (GPIOB_BASE = $00 F110) Register Acronym Address Offset Register Description GPIOB_PUPEN $0 Pull-up Enable Register GPIOB_DATA $1 Data Register GPIOB_DDIR $2 Data Direction Register GPIOB_PEREN $3 Peripheral Enable Register GPIOB_IASSRT $4 Interrupt Assert Register GPIOB_IEN $5 Interrupt Enable Register GPIOB_IEPOL $6 Interrupt Edge Polarity Register GPIOB_IPEND $7 Interrupt Pending Register GPIOB_IEDGE $8 Interrupt Edge-Sensitive Register GPIOB_PPOUTM $9 Push-Pull Output Mode Control Register GPIOB_RDATA $A Raw Data Register GPIOB_DRIVE $B Drive Strength Control Register Table 4-18 GPIOC Registers Address Map (GPIOC_BASE = $00 F120) Register Acronym Address Offset Register Description GPIOC_PUPEN $0 Pull-up Enable Register GPIOC_DATA $1 Data Register GPIOC_DDIR $2 Data Direction Register GPIOC_PEREN $3 Peripheral Enable Register GPIOC_IASSRT $4 Interrupt Assert Register GPIOC_IEN $5 Interrupt Enable Register GPIOC_IEPOL $6 Interrupt Edge Polarity Register GPIOC_IPEND $7 Interrupt Pending Register GPIOC_IEDGE $8 Interrupt Edge-Sensitive Register GPIOC_PPOUTM $9 Push-Pull Output Mode Control Register GPIOC_RDATA $A Raw Data Register GPIOC_DRIVE $B Drive Strength Control Register 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 39 Table 4-19 GPIOD Registers Address Map (GPIOD_BASE = $00 F130) Register Acronym Address Offset Register Description GPIOD_PUPEN $0 Pull-up Enable Register GPIOD_DATA $1 Data Register GPIOD_DDIR $2 Data Direction Register GPIOD_PEREN $3 Peripheral Enable Register GPIOD_IASSRT $4 Interrupt Assert Register GPIOD_IEN $5 Interrupt Enable Register GPIOD_IEPOL $6 Interrupt Edge Polarity Register GPIOD_IPEND $7 Interrupt Pending Register GPIOD_IEDGE $8 Interrupt Edge-Sensitive Register GPIOD_PPOUTM $9 Push-Pull Output Mode Control Register GPIOD_RDATA $A Raw Data Register GPIOD_DRIVE $B Drive Strength Control Register Table 4-20 System Integration Module Registers Address Map (SIM_BASE = $00 F140) Register Acronym Address Offset Register Description SIM_CTRL $0 Control Register SIM_RSTAT $1 Reset Status Register SIM_SWC0 $2 Software Control Register 0 SIM_SWC1 $3 Software Control Register 1 SIM_SWC2 $4 Software Control Register 2 SIM_SWC3 $5 Software Control Register 3 SIM_MSHID $6 Most Significant Half JTAG ID SIM_LSHID $7 Least Significant Half JTAG ID SIM_PWR $8 Power Control Register Reserved SIM_CLKOUT $A Clock Out Select Register SIM_GPS $B GPIO Peripheral Select Register SIM_PCE $C Peripheral Clock Enable Register SIM_IOSAHI $D I/O Short Address Location High Register SIM_IOSALO $E I/O Short Address Location Low Register 56F8013 Technical Data, Rev. 2 40 Freescale Semiconductor Preliminary Peripheral Memory Mapped Registers Table 4-21 Power Supervisor Registers Address Map (PS_BASE = $00 F160) Register Acronym Address Offset Register Description PS_CTRL $0 Control Register PS_STAT $1 Status Register Table 4-22 Flash Module Registers Address Map (FM_BASE = $00 F400) Register Acronym Address Offset Register Description FM_CLKDIV $0 Clock Divider Register FM_CNFG $1 Configuration Register $2 Reserved FM_SECHI $3 Security High Half Register FM_SECLO $4 Security Low Half Register $5 - $9 FM_PROT $10 $11 - $12 FM_USTAT FM_CMD FM_DATA Reserved Protection Register Reserved $13 User Status Register $14 Command Register $15 Reserved $16 Reserved $17 Reserved $18 Data Buffer Register $19 Reserved $1A Reserved FM_OPT1 $1B Optional Data 1 Register FM_TSTSIG $1D Reserved Test Array Signature Register 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 41 Part 5 Interrupt Controller (ITCN) 5.1 Introduction The Interrupt Controller (ITCN) module is used to arbitrate between various interrupt requests (IRQs), to signal to the 56800E core when an interrupt of sufficient priority exists, and to what address to jump in order to service this interrupt. 5.2 Features The ITCN module design includes these distinctive features: • • • • Programmable priority levels for each IRQ Two programmable Fast Interrupts Notification to SIM module to restart clocks out of Wait and Stop modes Ability to drive initial address on the address bus after reset For further information, see Table 4-2, Interrupt Vector Table Contents. 5.3 Functional Description The Interrupt Controller is a slave on the IPBus. It contains registers that allow each of the 46 interrupt sources to be set to one of four priority levels (excluding certain interrupts that are of fixed priority). Next, all of the interrupt requests of a given level are priority encoded to determine the lowest numerical value of the active interrupt requests for that level. Within a given priority level, number 0 is the highest priority and number 45 is the lowest. 5.3.1 Normal Interrupt Handling Once the INTC has determined that an interrupt is to be serviced and which interrupt has the highest priority, an interrupt vector address is generated. Normal interrupt handling concatenates the Vector Base Address (VBA) and the vector number to determine the vector address, generating an offset into the vector table for each interrupt. 56F8013 Technical Data, Rev. 2 42 Freescale Semiconductor Preliminary Functional Description 5.3.2 Interrupt Nesting Interrupt exceptions may be nested to allow an IRQ of higher priority than the current exception to be serviced. The following table defines the nesting requirements for each priority level. Table 5-1 Interrupt Mask Bit Definition 5.3.3 SR[9] SR[8] Exceptions Permitted Exceptions Masked 0 0 Priorities 0, 1, 2, 3 None 0 1 Priorities 1, 2, 3 Priority 0 1 0 Priorities 2, 3 Priorities 0, 1 1 1 Priority 3 Priorities 0, 1, 2 Fast Interrupt Handling Fast interrupts are described in the DSP56800E Reference Manual. The interrupt controller recognizes Fast Interrupts before the core does. A Fast Interrupt is defined (to the ITCN) by: 1. Setting the priority of the interrupt as level 2, with the appropriate field in the IPR registers 2. Setting the FIMn register to the appropriate vector number 3. Setting the FIVALn and FIVAHn registers with the address of the code for the Fast Interrupt When an interrupt occurs, its vector number is compared with the FIM0 and FIM1 register values. If a match occurs, and it is a level 2 interrupt, the ITCN handles it as a Fast Interrupt. The ITCN takes the vector address from the appropriate FIVALn and FIVAHn registers, instead of generating an address that is an offset from the VBA. The core then fetches the instruction from the indicated vector adddress and if it is not a JSR, the core starts its Fast Interrupt handling. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 43 5.4 Block Diagram any0 Priority Level INT0 Level 0 46 -> 6 Priority Encoder 2 -> 4 Decode 6 INT VAB CONTROL any3 Level 3 IACK SR[9:8] Priority Level INT45 IPIC 46 -> 6 Priority Encoder 6 PIC_EN 2 -> 4 Decode Figure 5-1 Interrupt Controller Block Diagram 5.5 Operating Modes The ITCN module design contains two major modes of operation: • • Functional Mode The ITCN is in this mode by default. Wait and Stop Modes During Wait and Stop modes, the system clocks and the 56800E core are turned off. The ITCN will signal a pending IRQ to the System Integration Module (SIM) to restart the clocks and service the IRQ. An IRQ can only wake up the core if the IRQ is enabled prior to entering the Wait or Stop mode. 56F8013 Technical Data, Rev. 2 44 Freescale Semiconductor Preliminary Register Descriptions 5.6 Register Descriptions A register address is the sum of a base address and an address offset. The base address is defined at the system level and the address offset is defined at the module level. The ITCN module has 16 registers. Table 5-2 ITCN Register Summary (ITCN_BASE = $00 F060) Register Acronym Base Address + Register Name Section Location IPR0 $0 Interrupt Priority Register 0 5.6.1 IPR1 $1 Interrupt Priority Register 1 5.6.2 IPR2 $2 Interrupt Priority Register 2 5.6.3 IPR3 $3 Interrupt Priority Register 3 5.6.4 IPR4 $4 Interrupt Priority Register 4 5.6.5 VBA $5 Vector Base Address Register 5.6.6 FIM0 $6 Fast Interrupt Match 0 Register 5.6.7 FIVAL0 $7 Fast Interrupt 0 Vector Address Low Register 5.6.8 FIVAH0 $8 Fast Interrupt 0 Vector Address High 0 Register 5.6.9 FIM1 $9 Fast Interrupt Match 1 Register 5.6.10 FIVAL1 $A Fast Interrupt 1 Vector Address Low Register 5.6.11 FIVAH1 $B Fast Interrupt 1 Vector Address High Register 5.6.12 IRQP0 $C IRQ Pending Register 0 5.6.13 IRQP1 $D IRQ Pending Register 1 5.6.14 IRQP2 $E IRQ Pending Register 2 5.6.15 Reserved ICTRL $12 Interrupt Control Register 5.6.16 Reserved 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 45 Add. Offset Register Name $0 IPR0 $1 IPR1 $2 IPR2 $3 IPR3 $4 IPR4 $5 VBA $6 FIM0 $7 FIVAL0 $8 FIVAH0 $9 FIM1 $A FIVAL1 $B FIVAH1 $C IRQP0 $D IRQP1 $E IRQP2 15 R W R W R W R W R 14 LVI IPL 13 12 11 10 0 0 0 0 GPIOB IPL GPIOC IPL SCI_RCV IPL SCI_RERR IPL ADCA_CC IPL TMR_3 IPL 0 0 0 0 0 0 0 0 GPIOD IPL 0 0 TMR_2 IPL 0 0 9 8 RX_REG IPL 5 4 0 0 0 R 0 STPCNT IPL FM_CBE IPL FM_CC IPL FM_ERR IPL PLL IPL SCI_TIDL IPL SCI_XMIT IPL SPI_XMIT IPL SPI_RCV IPL GPIOA IPL TMR_1 IPL TMR_0 IPL I2C_ADDR IPL PWM_F IPL PWM_RL IPL 0 0 0 0 0 0 0 0 0 0 0 ADC_ZC_LE IPL 0 0 ADCB_CC IPL FAST INTERRUPT 0 FAST INTERRUPT 0 VECTOR ADDRESS LOW 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 FAST INTERRUPT 0 VECTOR ADDRESS HIGH W FAST INTERRUPT 1 W R FAST INTERRUPT 1 VECTOR ADDRESS LOW W R 1 VECTOR_BASE_ADDRESS W R 2 BKPT_U IPL W R 3 TRBUF IPL W R 6 TX_REG IPL W R 7 0 0 0 0 0 0 0 0 0 0 0 FAST INTERRUPT 1 VECTOR ADDRESS HIGH W R 1 PENDING[16:2] W R PENDING[32:17] W R 1 1 1 PENDING[45:33] W Reserved $12 ICTRL R INT IPIC VAB W INT_ DIS 1 1 1 0 0 Reserved = Reserved Figure 5-2 ITCN Register Map Summary 56F8013 Technical Data, Rev. 2 46 Freescale Semiconductor Preliminary Register Descriptions 5.6.1 Interrupt Priority Register 0 (IPR0) Base + $0 Read 15 14 LVI IPL Write RESET 0 0 13 12 11 10 0 0 0 0 0 0 0 0 9 8 RX_REG IPL 0 0 7 6 TX_REG IPL 0 0 5 4 TRBUF IPL 0 0 3 2 BKPT_U IPL 0 0 1 0 STPCNT IPL 0 0 Figure 5-3 Interrupt Priority Register 0 (IPR0) 5.6.1.1 LVI IPL—Bits 15–14 This field is used to set the interrupt priority levels for a peripheral IRQ. This IRQ is limited to priorities 0 through 2 and is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.1.2 Reserved—Bits 13–10 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.1.3 EOnCE Receive Register Full Interrupt Priority Level (RX_REG IPL)— Bits 9–8 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.1.4 EOnCE Transmit Register Empty Interrupt Priority Level (TX_REG IPL)— Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 47 5.6.1.5 EOnCE Trace Buffer Interrupt Priority Level (TRBUF IPL)— Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.1.6 EOnCE Breakpoint Unit Interrupt Priority Level (BKPT_U IPL)— Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 5.6.1.7 EOnCE Step Counter Interrupt Priority Level (STPCNT IPL)— Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 1 through 3. It is disabled by default. • • • • 5.6.2 00 = IRQ disabled (default) 01 = IRQ is priority level 1 10 = IRQ is priority level 2 11 = IRQ is priority level 3 Interrupt Priority Register 1 (IPR1) Base + $1 Read Write RESET 15 14 GPIOB IPL 0 0 13 12 GPIOC IPL 0 0 11 10 GPIOD IPL 0 0 9 8 0 0 0 0 7 6 FM_CBE IPL 0 0 5 4 FM_CC IPL 0 0 3 2 FM_ERR IPL 0 0 1 0 PLL IPL 0 0 Figure 5-4 Interrupt Priority Register 1 (IPR1) 56F8013 Technical Data, Rev. 2 48 Freescale Semiconductor Preliminary Register Descriptions 5.6.2.1 GPIOB Interrupt Priority Level (GPIOB IPL)—Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.2.2 GPIOC Interrupt Priority Level (GPIOC IPL)—Bits 13–12 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.2.3 GPIOD Interrupt Priority Level (GPIOD IPL)—Bits 11–10 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.2.4 Reserved—Bits 9–8 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.2.5 FM Command, Data, Address Buffers Empty Interrupt Priority Level (FM_CBE IPL)—Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 49 5.6.2.6 FM Command Complete Priority Level (FM_CC IPL)—Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.2.7 FM Error Interrupt Priority Level (FM_ERR IPL)—Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.2.8 PLL Loss of Reference or Change in Lock Status Interrupt Priority Level (PLL IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3 Interrupt Priority Register 2 (IPR2) Base + $2 Read Write RESET 15 14 13 SCI_RCV IPL 0 0 12 SCI_RERR IPL 0 0 11 10 0 0 0 0 9 8 SCI_TIDL IPL 0 0 7 6 5 4 SCI_XMIT IPL SPI_XMIT IPL 0 0 0 0 3 2 SPI_RCV IPL 0 0 1 0 GPIOA IPL 0 0 Figure 5-5 Interrupt Priority Register 2 (IPR2) 56F8013 Technical Data, Rev. 2 50 Freescale Semiconductor Preliminary Register Descriptions 5.6.3.1 SCI Receiver Full Interrupt Priority Level (SCI_RCV IPL)— Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.2 SCI Receiver Error Interrupt Priority Level (SCI_RERR IPL)— Bits 13–12 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.3 Reserved—Bits 11–10 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.3.4 SCI Transmitter Idle Interrupt Priority Level (SCI_TIDL IPL)— Bits 9–8 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.5 SCI Transmitter Empty Interrupt Priority Level (SCI_XMIT IPL)— Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 51 5.6.3.6 SPI Transmitter Empty Interrupt Priority Level (SPI_XMIT IPL)— Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.7 SPI Receiver Full Interrupt Priority Level (SPI_RCV IPL)— Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.3.8 GPIOA Interrupt Priority Level (GPIOA IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. It is disabled by default. • • • • 5.6.4 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 Interrupt Priority Register 3 (IPR3) Base + $3 Read Write RESET 15 14 ADCA_CC IPL 0 0 13 12 TMR_3 IPL 0 0 11 10 TMR_2 IPL 0 0 9 8 TMR_1 IPL 0 0 7 6 TMR_0 IPL 0 0 5 4 I2C_ADDR IPL 0 0 3 2 1 0 0 0 0 0 0 0 0 0 Figure 5-6 Interrupt Priority Register 3 (IPR3) 56F8013 Technical Data, Rev. 2 52 Freescale Semiconductor Preliminary Register Descriptions 5.6.4.1 ADCA Conversion Complete Interrupt Priority Level (ADCA_CC IPL)—Bits 15–14 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4.2 Timer Channel 3 Interrupt Priority Level (TMR_3 IPL)—Bits 13–12 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4.3 Timer Channel 2 Interrupt Priority Level (TMR_2 IPL)—Bits 11–10 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4.4 Timer Channel 1 Interrupt Priority Level (TMR_1 IPL)—Bits 9–8 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 53 5.6.4.5 Timer Channel 0 Interrupt Priority Level (TMR_0 IPL)—Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 I2C Address Detect Interrupt Priority Level (I2C_ADDR IPL)—Bits 5–4 5.6.4.6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.4.7 Reserved—Bits 3–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.5 Interrupt Priority Register 4 (IPR4) Base + $4 15 14 13 12 11 10 9 8 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Write RESET 7 6 PWM_F IPL 0 0 5 4 PWM_RL IPL 0 0 3 2 ADC_ZC_LE IPL 0 0 1 0 ADCB_CC IPL 0 0 Figure 5-7 Interrupt Priority Register 4 (IPR4) 5.6.5.1 Reserved—Bits 15–8 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.5.2 PWM Fault Interrupt Priority Level (PWM_F IPL)— Bits 7–6 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 56F8013 Technical Data, Rev. 2 54 Freescale Semiconductor Preliminary Register Descriptions 5.6.5.3 Reload PWM Interrupt Priority Level (PWM_RL IPL)— Bits 5–4 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.5.4 ADC Zero Crossing or Limit Error Interrupt Priority Level (ADC_ZC_LE IPL)— Bits 3–2 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.5.5 ADCB Conversion Complete Interrupt Priority Level (ADCB_CC IPL)—Bits 1–0 This field is used to set the interrupt priority level for IRQs. This IRQ is limited to priorities 0 through 2. They are disabled by default. • • • • 00 = IRQ disabled (default) 01 = IRQ is priority level 0 10 = IRQ is priority level 1 11 = IRQ is priority level 2 5.6.6 Vector Base Address Register (VBA) Base + $5 15 14 Read 0 0 0 0 13 12 11 10 9 7 6 5 4 3 2 1 0 0 0 0 0 0 VECTOR_BASE_ADDRESS Write RESET 8 0 0 0 0 0 0 0 0 0 Figure 5-8 Vector Base Address Register (VBA) 5.6.6.1 Reserved—Bits 15–14 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 55 5.6.6.2 Vector Address Bus (VAB) Bits 13—0 The value in this register is used as the upper 14 bits of the interrupt vector VAB[20:0]. The lower 7 bits are determined based on the highest priority interrupt and are then appended onto VBA before presenting the full VAB to the Core. 5.6.7 Fast Interrupt Match 0 Register (FIM0) Base + $6 15 14 13 12 11 10 9 8 7 6 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 5 4 2 1 0 0 0 FAST INTERRUPT 0 Write RESET 3 0 0 0 0 Figure 5-9 Fast Interrupt Match 0 Register (FIM0) 5.6.7.1 Reserved—Bits 15–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.7.2 Fast Interrupt 0 Vector Number (FAST INTERRUPT 0)—Bits 5–0 These values determine which IRQ will be Fast Interrupt 0. Fast Interrupts vector directly to a service routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table first. IRQs used as Fast Interrupts must be set to priority level 2. Unexpected results will occur if a Fast Interrupt vector is set to any other priority. A Fast Interrupt automatically becomes the highest-priority level 2 interrupt regardless of its location in the interrupt table prior to being declared as Fast Interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to the vector table. 5.6.8 Fast Interrupt 0 Vector Address Low Register (FIVAL0) Base + $7 15 14 13 12 11 Read 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 FAST INTERRUPT 0 VECTOR ADDRESS LOW Write RESET 0 0 0 0 0 0 0 0 0 0 0 Figure 5-10 Fast Interrupt 0 Vector Address Low Register (FIVAL0) 5.6.8.1 Fast Interrupt 0 Vector Address Low (FIVAL0)—Bits 15—0 The lower 16 bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAH0 to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register. 56F8013 Technical Data, Rev. 2 56 Freescale Semiconductor Preliminary Register Descriptions 5.6.9 Fast Interrupt 0 Vector Address High Register (FIVAH0) Base + $8 15 14 13 12 11 10 9 8 7 6 5 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4 2 1 0 FAST INTERRUPT 0 VECTOR ADDRESS HIGH Write RESET 3 0 0 0 0 0 Figure 5-11 Fast Interrupt 0 Vector Address High Register (FIVAH0) 5.6.9.1 Reserved—Bits 15–5 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.9.2 Fast Interrupt 0 Vector Address High (FIVAH0)—Bits 4–0 The upper five bits of the vector address used for Fast Interrupt 0. This register is combined with FIVAL0 to form the 21-bit vector address for Fast Interrupt 0 defined in the FIM0 register. 5.6.10 Fast Interrupt 1 Match Register (FIM1) Base + $9 15 14 13 12 11 10 9 8 7 6 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 5 4 2 1 0 0 0 FAST INTERRUPT 1 Write RESET 3 0 0 0 0 Figure 5-12 Fast Interrupt 1 Match Register (FIM1) 5.6.10.1 Reserved—Bits 15–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.10.2 Fast Interrupt 1 Vector Number (FAST INTERRUPT 1)—Bits 5–0 These values determine which IRQ will be Fast Interrupt 1. Fast Interrupts vector directly to a service routine based on values in the Fast Interrupt Vector Address registers without having to go to a jump table first. IRQs used as Fast Interrupts must be set to priority level 2. Unexpected results will occur if a Fast Interrupt vector is set to any other priority. A Fast Interrupt automatically becomes the highest priority level 2 interrupt, regardless of its location in the interrupt table prior to being declared as Fast Interrupt. Fast Interrupt 0 has priority over Fast Interrupt 1. To determine the vector number of each IRQ, refer to the vector table. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 57 5.6.11 Fast Interrupt 1 Vector Address Low Register (FIVAL1) Base + $A 15 14 13 12 11 Read 10 9 8 7 6 5 4 3 2 1 0 0 0 0 0 0 FAST INTERRUPT 1 VECTOR ADDRESS LOW Write RESET 0 0 0 0 0 0 0 0 0 0 0 Figure 5-13 Fast Interrupt 1 Vector Address Low Register (FIVAL1) 5.6.11.1 Fast Interrupt 1 Vector Address Low (FIVAL1)—Bits 15–0 The lower 16 bits of the vector address used for Fast Interrupt 1. This register is combined with FIVAH1 to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register. 5.6.12 Fast Interrupt 1 Vector Address High (FIVAH1) Base + $B 15 14 13 12 11 10 9 8 7 6 5 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4 2 1 0 FAST INTERRUPT 1 VECTOR ADDRESS HIGH Write RESET 3 0 0 0 0 0 Figure 5-14 Fast Interrupt 1 Vector Address High Register (FIVAH1) 5.6.12.1 Reserved—Bits 15–5 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 5.6.12.2 Fast Interrupt 1 Vector Address High (FIVAH1)—Bits 4–0 The upper five bits of the vector address used for Fast Interrupt 1. This register is combined with FIVAL1 to form the 21-bit vector address for Fast Interrupt 1 defined in the FIM1 register. 5.6.13 IRQ Pending Register 0 (IRQP0) Base + $C 15 14 13 12 11 10 Read 9 8 7 6 5 4 3 2 1 PENDING[16:2] 0 1 Write RESET 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Figure 5-15 IRQ Pending Register 0 (IRQP0) 5.6.13.1 IRQ Pending (PENDING)—Bits 15–1 This register combines with IRQP1 and IRQP2 to represent the pending IRQs for interrupt vector numbers 2 through 45. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 5.6.13.2 Reserved—Bit 0 This bit is reserved or not implemented. It is read as 1 and cannot be modified by writing. 56F8013 Technical Data, Rev. 2 58 Freescale Semiconductor Preliminary Register Descriptions 5.6.14 IRQ Pending Register 1 (IRQP1) Base + $D 15 14 13 12 11 10 9 Read 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 PENDING[32:17] Write RESET 1 1 1 1 1 1 1 1 1 Figure 5-16 IRQ Pending Register 1 (IRQP1) 5.6.14.1 IRQ Pending (PENDING)—Bits 32–17 This register combines with IRQP0 and IRQP2 to represent the pending IRQs for interrupt vector numbers 2 through 45. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 5.6.15 IRQ Pending Register 2 (IRQP2) Base + $E 15 14 13 Read 1 1 1 1 1 1 12 11 10 9 8 7 6 5 4 3 2 1 0 1 1 1 1 1 PENDING[45:33] Write RESET 1 1 1 1 1 1 1 1 Figure 5-17 IRQ Pending Register 2 (IRQP2) 5.6.15.1 IRQ Pending (PENDING)—Bits 45–33 This register combines with IRQP0 and IRQP1 to represent the pending IRQs for interrupt vector numbers 2 through 45. • • 0 = IRQ pending for this vector number 1 = No IRQ pending for this vector number 5.6.16 Interrupt Control Register (ICTRL) $Base + $12 15 Read INT 14 13 12 11 10 IPIC 9 8 7 6 VAB Write RESET 0 0 0 0 0 0 0 0 0 0 5 4 3 2 1 0 INT_ DIS 1 1 1 0 0 0 1 1 1 0 0 Figure 5-18 Interrupt Control Register (ICTRL) 5.6.16.1 Interrupt (INT)—Bit 15 This read-only bit reflects the state of the interrupt to the 56800E core. • • 0 = No interrupt is being sent to the 56800E core 1 = An interrupt is being sent to the 56800E core 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 59 5.6.16.2 Interrupt Priority Level (IPIC)—Bits 14–13 These read-only bits reflect the state of the new interrupt priority level bits being presented to the 56800E core. These bits indicate the priority level needed for a new IRQ to interrupt the current interrupt being sent to the 56800E core. This field is only updated when the 56800E core jumps to a new interrupt service routine. Note: • • • • Nested interrupts may cause this field to be updated before the original interrupt service routine can read it. 00 = Required nested exception priority levels are 0, 1, 2, or 3 01 = Required nested exception priority levels are 1, 2, or 3 10 = Required nested exception priority levels are 2 or 3 11 = Required nested exception priority level is 3 Table 5-3 Interrupt Priority Encoding 5.6.16.3 IPIC_VALUE[1:0] Current Interrupt Priority Level Required Nested Exception Priority 00 No interrupt or SWILP Priorities 0, 1, 2, 3 01 Priority 0 Priorities 1, 2, 3 10 Priority 1 Priorities 2, 3 11 Priority 2 or 3 Priority 3 Vector Number - Vector Address Bus (VAB)—Bits 12–6 This read-only field shows the vector number (VAB[6:0]) used at the time the last IRQ was taken. In the case of a Fast Interrupt, it shows the lower address bits of the jump address. This field is only updated when the 56800E core jumps to a new interrupt service routine. Note: Nested interrupts may cause this field to be updated before the original interrupt service routine can read it. 5.6.16.4 Interrupt Disable (INT_DIS)—Bit 5 This bit allows all interrupts to be disabled. • • 0 = Normal operation (default) 1 = All interrupts disabled 5.6.16.5 Reserved—Bits 4–2 This bit field is reserved or not implemented. It is read as 1 and cannot be modified by writing. 5.6.16.6 Reserved—Bits 1–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 56F8013 Technical Data, Rev. 2 60 Freescale Semiconductor Preliminary Resets 5.7 Resets 5.7.1 General Table 5-4 Reset Summary Reset Priority Core Reset 5.7.2 Source Characteristics RST Core reset from the SIM Description of Reset Operation 5.7.2.1 Reset Handshake Timing The ITCN provides the 56800E core with a reset vector address on the VAB pins whenever RESET is asserted from the SIM. The reset vector will be presented until the second rising clock edge after RESET is released. The general timing is shown in Figure 5-19 . RES CLK VAB RESET_VECTOR_ADR PAB READ_ADR Figure 5-19 Reset Interface 5.7.3 ITCN After Reset After reset, all of the ITCN registers are in their default states. This means all interrupts are disabled, except the core IRQs with fixed priorities: • • • • • • • • Illegal Instruction SW Interrupt 3 HW Stack Overflow Misaligned Long Word Access SW Interrupt 2 SW Interrupt 1 SW Interrupt 0 SW Interrupt LP These interrupts are enabled at their fixed priority levels. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 61 Part 6 System Integration Module (SIM) 6.1 Introduction The SIM module is a system catchall for the glue logic that ties together the system-on-chip. It controls distribution of resets and clocks and provides a number of control features. The System Integration Module is responsible for the following functions: • • • • • • • • Reset sequencing Clock control & distribution Stop/Wait control System status registers Registers for software access to the JTAG ID of the chip Test registers Power control I/O pad multiplexing These are discussed in more detail in the sections that follow. 6.2 Features The SIM has the following features: • • System bus clocks with pipeline hold-off support System clocks for non-pipelined interfaces • Peripheral clocks for TMR and PWM with high-speed (3X) option • • • • • • • • • • • • Power-saving clock gating for peripherals ITCK clock to the 56800E core TAP interface Three power modes (Run, Wait, Stop) to control power utilization — Stop mode shuts down the 56800E core, system clock, and peripheral clock — Wait mode shuts down the 56800E core and unnecessary system clock operation — Run mode supports full part operation Controls, with write protection, the enable/disable of 56800E core WAIT and STOP instructions Controls, with write protection, the enable/disable of Large Regulator Standby mode Controls to route functional signals to selected peripherals and I/O pads Controls deassertion sequence of internal resets Software-initiated reset Four 16-bit registers reset only by a Power-On Reset usable for general-purpose software control Timer channel Stop mode clocking controls SCI Stop mode clocking control to support LIN Sleep mode stop recovery Short addressing location control • • Registers for software access to the JTAG ID of the chip Controls output to CLKO pin 56F8013 Technical Data, Rev. 2 62 Freescale Semiconductor Preliminary Register Descriptions 6.3 Register Descriptions Table 6-1 SIM Registers (SIM_BASE = $00 F140) Address Offset Address Acronym Register Name Section Location Base + $0 SIM_CTRL Control Register 6.3.1 Base + $1 SIM_RSTAT Reset Status Register 6.3.2 Base + $2 SIM_SWC0 Software Control Register 0 6.3.3 Base + $3 SIM_SWC1 Software Control Register 1 6.3.3 Base + $4 SIM_SWC2 Software Control Register 2 6.3.3 Base + $5 SIM_SWC3 Software Control Register 3 6.3.3 Base + $6 SIM_MSHID Most Significant Half of JTAG ID 6.3.4 Base + $7 SIM_LSHID Least Significant Half of JTAG ID 6.3.5 Base + $8 SIM_PWR Power Control Register 6.3.6 Reserved Base + $A SIM_CLKOUT CLKO Select Register 6.3.7 Base + $B SIM_GPS GPIO Peripheral Select Register 6.3.8 Base + $C SIM_PCE Peripheral Clock Enable Register 6.3.9 Base + $D SIM_IOSAHI I/O Short Address Location High Register 6.3.10 Base + $E SIM_IOSALO I/O Short Address Location Low Register 6.3.10 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 63 Add. Offset Address Acronym $0 SIM_ CTRL $1 SIM_ RSTAT W $2 SIM_SWC0 $3 SIM_SWC1 $4 SIM_SWC2 $5 SIM_SWC3 $6 SIM_MSHID $7 SIM_LSHID $8 SIM_PWR 15 14 13 12 11 10 9 8 7 6 5 4 TC2_ SD TC1_ SD TC0_ SD SCI_ SD 0 TC3_ INP 0 0 0 W TC3_ SD ONCE EBL0 SW RST R 0 0 0 0 0 0 0 0 0 0 R R 2 STOP_ DISABLE COPR EXTR POR 1 0 WAIT_ DISABLE 0 0 Software Control Data 0 W R Software Control Data 1 W R Software Control Data 2 W R Software Control Data 3 W R SWR 3 0 0 0 0 0 0 0 1 1 1 1 1 0 0 1 0 0 1 0 0 0 0 0 0 0 0 0 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 TCR PCR 0 0 CFG_ B7 0 0 0 0 0 0 0 0 0 0 0 0 W R W R W LRSTDBY Reserved $A SIM_ CLKOUT $B SIM_GPS $C SIM_PCE $D SIM_IOSAHI $E SIM_IOSALO R W R W R W R 0 I2C 0 ADC 0 0 CLK DIS PWM3 PWM2 PWM1 PWM0 CFG_ CFG_ CFG_ B6 B5 B4 CFG_ B3 CFG_ B2 CFG_ B1 CLKOSEL CFG_ B0 0 TMR 0 SCI 0 0 CFG_A5 CFG_A4 0 0 SPI 0 0 W R PWM ISAL[23:22] ISAL[21:6] W 0 = Read as 0 1 = Reserved = Read as 1 = Reserved Figure 6-1 SIM Register Map Summary 6.3.1 SIM Control Register (SIM_CTRL) Base + $0 Read 15 14 13 12 11 10 9 8 7 6 5 4 TC3_ INP 0 0 0 ONCE EBL SW RST 0 0 0 0 0 0 Write TC3_ SD TC2_ SD TC1_ SD TC0_ SD SCI_ SD 0 RESET 0 0 0 0 0 0 3 2 1 0 STOP_ DISABLE WAIT_ DISABLE 0 0 0 0 Figure 6-2 SIM Control Register (SIM_CTRL) 56F8013 Technical Data, Rev. 2 64 Freescale Semiconductor Preliminary Register Descriptions 6.3.1.1 Timer Channel 3 Stop Disable (TC3_SD)—Bit 15 This bit enables the operation of the Timer Channel 3 peripheral clock in Stop mode. • • 0 = Timer Channel 3 disabled in Stop mode 1 = Timer Channel 3 enabled in Stop mode 6.3.1.2 Timer Channel 2 Stop Disable (TC2_SD)—Bit 14 This bit enables the operation of the Timer Channel 2 peripheral clock in Stop mode. • • 0 = Timer Channel 2 disabled in Stop mode 1 = Timer Channel 2 enabled in Stop mode 6.3.1.3 Timer Channel 1 Stop Disable (TC1_SD)—Bit 13 This bit enables the operation of the Timer Channel 1 peripheral clock in Stop mode. • • 0 = Timer Channel 1 disabled in Stop mode 1 = Timer Channel 1 enabled in Stop mode 6.3.1.4 Timer Channel 0 Stop Disable (TC0_SD)—Bit 12 This bit enables the operation of the Timer Channel 0 peripheral clock in Stop mode. • • 0 = Timer Channel 0 disabled in Stop mode 1 = Timer Channel 0 enabled in Stop mode 6.3.1.5 SCI Stop Disable (SCI_SD)—Bit 11 This bit enables the operation of the SCI peripheral clock in Stop mode. This is recommended for use in LIN mode so that the SCI can generate interrupts and recover from Stop mode while the LIN interface is in Sleep mode and using Stop mode to reduce power consumption. • • 0 = SCI disabled in Stop mode 1 = SCI enabled in Stop mode 6.3.1.6 Reserved—Bit 10 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.1.7 Timer Channel 3 Input (TC3_INP)—Bit 9 This bit selects the input of Timer Channel 3 to be from the PWM or GPIO. • • 0 = Timer Channel 3 Input from PWM reload_sync signal 1 = Timer Channel 3 Input controlled by SIM_GPS register CFG_B3 and CFG_A5 fields 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 65 6.3.1.8 Reserved—Bits 8–6 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.1.9 • • OnCE Enable (ONCEEBL)—Bit 5 0 = OnCE clock to 56800E core enabled when core TAP is enabled 1 = OnCE clock to 56800E core is always enabled 6.3.1.10 Software Reset (SWRST)—Bit 4 Writing 1 to this field will cause the part to reset. 6.3.1.11 • • • Stop Disable (STOP_DISABLE[1:0])—Bits 3–2 00 = Stop mode will be entered when the 56800E core executes a STOP instruction 01 = The 56800E STOP instruction will not cause entry into Stop mode 10 = Stop mode will be entered when the 56800E core executes a STOP instruction and the STOP_DISABLE field is write-protected until the next reset 11 = The 56800E STOP instruction will not cause entry into Stop mode and the STOP_DISABLE field is write-protected until the next reset • 6.3.1.12 • • • Wait Disable (WAIT_DISABLE[1:0])—Bits 1–0 00 = Wait mode will be entered when the 56800E core executes a WAIT instruction 01 = The 56800E WAIT instruction will not cause entry into Wait mode 10 = Wait mode will be entered when the 56800E core executes a WAIT instruction and the WAIT_DISABLE field is write-protected until the next reset 11 = The 56800E WAIT instruction will not cause entry into Wait mode and the WAIT_DISABLE field is write-protected until the next reset • 6.3.2 SIM Reset Status Register (SIM_RSTAT) This register is updated upon any system reset and indicates the cause of the most recent reset. It also controls whether the COP reset vector or regular reset vector in the vector table is used. This register is asynchronously reset during Power-On Reset (see power supervisor module) and subsequently is synchronously updated based on the level of the external reset, software reset, or cop reset inputs. Only one source will ever be indicated. In the event that multiple reset sources assert simultaneously, the highest-precedence source will be indicated. The precedence from highest to lowest is POR, EXTR, COPR, and SWR. While POR is always set during a Power-On Reset, EXTR will become set if the external reset pin is asserted or remains asserted after the Power-On Reset (POR) has deasserted. Base + $1 15 14 13 12 11 10 9 8 7 6 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Write RESET 5 SWR 4 COPR 3 EXTR 2 POR 1 0 0 0 0 0 Figure 6-3 SIM Reset Status Register (SIM_RSTAT) 56F8013 Technical Data, Rev. 2 66 Freescale Semiconductor Preliminary Register Descriptions 6.3.2.1 Reserved—Bits 15–6 This bit field is reserved or not implemented. It is read as zero and cannot be modified by writing. 6.3.2.2 Software Reset (SWR)—Bit 5 When set, this bit indicates that the previous system reset occurred as a result of a software reset (written 1 to SWRST bit in the SIM_CTRL register). It will not be set if a COP, external, or POR reset also occurred. 6.3.2.3 COP Reset (COPR)—Bit 4 When set, this bit indicates that the previous system reset was caused by the Computer Operating Properly (COP) timer. It will not be set if an external or POR reset also occurred. If COPR is set as code starts executing, the COP reset vector in the vector table will be used. Otherwise, the normal reset vector is used. 6.3.2.4 External Reset (EXTR)—Bit 3 When set, this bit indicates that the previous system reset was caused by an external reset. It will only be set if the external reset pin was asserted or remained asserted after the Power-On Reset deasserted. 6.3.2.5 Power-On Reset (POR)—Bit 2 This bit is set during a Power-On Reset. 6.3.2.6 Reserved—Bits 1–0 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.3 SIM Software Control Registers (SIM_SWC0, SIM_SWC1, SIM_SWC2, and SIM_SWC3) Only SIM_SWC0 is shown in this section. SIM_SWC1, SIM_SWC2, and SIM_SWC3 are identical in functionality. Base + $2 15 14 13 12 11 10 Read 8 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 Software Control Data 0 Write RESET 9 0 0 0 0 0 0 0 0 0 Figure 6-4 SIM Software Control Register 0 (SIM_SWC0) 6.3.3.1 Software Control Data 0 (FIELD)—Bits 15–0 This register is reset only by the Power-On Reset (POR). It has no part-specific functionality and is intended for use by a software developer to contain data that will be unaffected by the other reset sources (RESET pin, software reset, and COP reset). 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 67 6.3.4 Most Significant Half of JTAG ID (SIM_MSHID) This read-only register displays the most significant half of the JTAG ID for the chip. This register reads $01F2. Base + $6 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Read 0 0 0 0 0 0 0 1 1 1 1 1 0 0 1 0 0 0 0 0 0 0 0 1 1 1 1 1 0 0 1 0 Write RESET Figure 6-5 Most Significant Half of JTAG ID (SIM_MSHID) 6.3.5 Least Significant Half of JTAG ID (SIM_LSHID) This read-only register displays the least significant half of the JTAG ID for the chip. This register reads $401D. Base + $7 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Read 0 1 0 0 0 0 0 0 0 0 0 1 1 1 0 1 0 1 0 0 0 0 0 0 0 0 0 1 1 1 0 1 Write RESET Figure 6-6 Least Significant Half of JTAG ID (SIM_LSHID) 6.3.6 SIM Power Control Register (SIM_PWR) This register controls the Standby mode of the large regulator. The large regulator derives the core digital logic power supply from the IO power supply. In some circumstances, the large regulator may be put in a reduced-power Standby mode without interfering with part operation. Refer to the overview of power-down modes and the overview of clock generation for more information on the use of large regulator standby. Base + $8 15 14 13 12 11 10 9 8 7 6 5 4 3 2 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Write RESET 1 0 LRSTDBY 0 0 Figure 6-7 SIM Power Control Register (SIM_PWR) 6.3.6.1 Reserved—Bits 15–2 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 56F8013 Technical Data, Rev. 2 68 Freescale Semiconductor Preliminary Register Descriptions 6.3.6.2 Large Regulator Standby Mode[1:0] (LRSTDBY)—Bits 1–0 This bit controls the pull-up resistors on the IRQA pin. • • • • 00 = Large regulator is in Normal mode 01 = Large regulator is in Standby (reduced-power) mode 10 = Large regulator is in Normal mode and the LRSTDBY field is write-protected until the next reset 11 = Large regulator is in Standby mode and the LRSTDBY field is write-protected until the next reset 6.3.7 CLKO Select Register (SIM_CLKOUT) The CLKO select register can be used to multiplex out selected clocks generated inside the clock generation and SIM modules. All functionality is for test purposes only and is subject to unspecified latencies. Glitches may be produced when the clock is enabled or switched. The lower four bits of the GPIO A register can function as GPIO, PWM, or as additional clock output signals. GPIO has priority and is enabled/disabled via the GPIOA_PEREN. If GPIOA[3:0] are programmed to operate as peripheral outputs, then the choice between PWM and additional clock outputs is done here in the CLKOUT. The default state is for the peripheral function of GPIOA[3:0] to be programmed as PWM. This can be changed by altering PWM3 through PWM0. Base + $A 15 14 13 12 11 10 Read 0 0 0 0 0 0 0 0 0 0 0 0 Write RESET 9 8 PWM3 PWM2 0 0 7 6 PWM1 PWM0 0 0 5 4 3 CLK DIS 1 2 1 0 0 0 CLKOSEL 0 0 0 Figure 6-8 CLKO Select Register (SIM_CLKOUT) 6.3.7.1 Reserved—Bits 15–10 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.7.2 • • 0 = Peripheral output function of GPIOA[3] is defined to be PWM3 1 = Peripheral output function of GPIOA[3] is defined to be the Relaxation Oscillator Clock 6.3.7.3 • • PWM2—Bit 8 0 = Peripheral output function of GPIOA[2] is defined to be PWM2 1 = Peripheral output function of GPIOA[2] is defined to be the system clock 6.3.7.4 • • PWM3—Bit 9 PWM1—Bit 7 0 = Peripheral output function of GPIOA[1] is defined to be PWM1 1 = Peripheral output function of GPIOA[1] is defined to be two times the rate of the system clock 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 69 6.3.7.5 • • 0 = Peripheral output function of GPIOA[0] is defined to be PWM0 1 = Peripheral output function of GPIOA[0] is defined to be three times the rate of the system clock 6.3.7.6 • • PWM0—Bit 6 Clockout Disable (CLKDIS)—Bit 5 0 = CLKOUT output is enabled and will output the signal indicated by CLKOSEL 1 = CLKOUT is 0 6.3.7.7 Clockout Select (CLKOSEL)—Bits 4–0 Selects clock to be muxed out on the CLKO pin. • • • • • • • 6.3.8 00000 = Reserved for factory test—Continuous system clock 01001 = Reserved for factory test—OCCS MSTR OSC clock 01011 = Reserved for factory test—ADC clock 01100 = Reserved for factory test—JTAG TCLK 01101 = Reserved for factory test—Continuous peripheral clock 01110 = Reserved for factory test—Continuous inverted peripheral clock 01111 = Reserved for factory test—Continuous high-speed peripheral clock SIM GPIO Peripheral Select Register (SIM_GPS) All of the peripheral pins on the 56F8013 share their Input/Output (I/O) with GPIO ports. In order to select peripheral or GPIO control, program the GPIOx_PEREN register. In some cases, there are two possible peripherals as well as the GPIO functionality available for control of the I/O. In these cases, the SIM_GPS register is used to determine which peripheral has control. As shown in Figure 6-9, the GPIO Peripheral Enable Register (PEREN) has the final control over which pin controls the I/O. SIM_GPS simply decides which peripheral will be routed to the I/O when PEREN = 1. GPIOB_PEREN Register GPIO Controlled 0 I/O Pad Control 1 SIM_GPS Register Quad Timer Controlled SCI Controlled 0 1 Figure 6-9 Overall Control of Pads Using SIM_GPS Control 56F8013 Technical Data, Rev. 2 70 Freescale Semiconductor Preliminary Register Descriptions Base + $B Read Write RESET 15 14 TCR PCR 0 0 13 12 11 10 9 8 7 6 5 4 0 0 CFG_ B7 CFG_ B6 CFG_ B5 CFG_ B4 CFG_ B3 CFG_ B2 CFG_ B1 CFG_ B0 0 0 0 0 0 0 0 0 0 0 3 2 1 0 CFG_A5 CFG_A4 0 0 0 0 Figure 6-10 GPIO Peripheral Select Register (SIM_GPS) 6.3.8.1 TMR Clock Rate (TCR)—Bit 15 This bit selects the clock speed for the TMR module. • • 0 = TMR module clock rate equals core clock rate, typically 32MHz (default) 1 = TMR module clock rate equals three times core clock rate Note: This bit should only be changed while the TMR module’s clock is disabled. See Section 6.3.9. Note: High-speed clocking is only available when the PLL is being used. Note: If the PWM reload pulse is used as input to Timer 3 (See SIM_CTRL: TC3_INP, Section 6.3.1.7), then the clocks of the Quad Timer and PWM must be related, as shown in Table 6-2. 6.3.8.2 PWM Clock Rate (PCR)—Bit 14 This bit selects the clock speed for the PWM module. • • 0 = PWM module clock rate equals core clock rate, typically 32MHz (default) 1 = PWM module clock rate equals three times core clock rate Note: This bit should only be changed while the PWM module’s clock is disabled. See Section 6.3.9. Note: High-speed clocking is only available when the PLL is being used. Note: If the PWM reload pulse is used as input to Timer 3 (See SIM_CTRL: TC3_INP, Section 6.3.1.7), then the clocks of the Quad Timer and PWM must be related, as shown in Table 6-2. Table 6-2 Allowable Quad Timer and PWM Clock Rates when Using PWM Reload Pulse Quad Timer Clock Speed 1X 3X 1X OK OK 3X NO OK PWM 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 71 6.3.8.3 Reserved—Bits 13–12 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. Note: Take care when programming the following CFG_* signals so as not to connect two different I/O pads to the same peripheral input. For example, do not set CFG_B7 to select SCL and also set CFG_B0 to select SCL. If this occurs for an output signal, then the signal will be routed to two I/O pads. For input signals, the values on the two I/O pads will be ORed together before reaching the peripheral. 6.3.8.4 Configure GPIOB7 (CFG_B7)—Bit 11 This bit selects the alternate function for GPIOB7. • • 0 = TXD (default) 1 = SCL 6.3.8.5 Configure GPIOB6 (CFG_B6)—Bit 10 This bit selects the alternate function for GPIOB6. • • 0 = RXD (default) 1 = SDA Note: The CLKMODE bit in the OCCS Oscillator Control register can enable this pin as the source clock to the chip. In this mode, make sure that no on-chip peripheral (including the GPIO) is driving this pin. 6.3.8.6 Configure GPIOB5 (CFG_B5)—Bit 9 This bit selects the alternate function for GPIOB5. • • 0 = T1 (default) 1 = FAULT3 6.3.8.7 Configure GPIOB4 (CFG_B4)—Bit 8 This bit selects the alternate function for GPIOB4. • • 0 = T0 (default) 1 = CLKO 6.3.8.8 Configure GPIOB3 (CFG_B3)—Bit 7 This bit selects the alternate function for GPIOB3. • • 0 = MOSI (default) 1 = T3 56F8013 Technical Data, Rev. 2 72 Freescale Semiconductor Preliminary Register Descriptions 6.3.8.9 Configure GPIOB2 (CFG_B2)—Bit 6 This bit selects the alternate function for GPIOB2. • • 0 = MISO (default) 1 = T2 6.3.8.10 Configure GPIOB1 (CFG_B1)—Bit 5 This bit selects the alternate function for GPIOB1. • • 0 = SS (default) 1 = SDA 6.3.8.11 Configure GPIOB0 (CFG_B0)—Bit 4 This bit selects the alternate function for GPIOB0. • • 0 = SCLK (default) 1 = SCL 6.3.8.12 Configure GPIOA5[1:0] (CFG_A5)—Bits 3–2 These bits select the alternate function for GPIOA5. • • • • 00 = Select PWM5 when peripheral mode is enabled in GPIOA5 (default) 01 = Select PWM5 when peripheral mode is enabled in GPIOA5 10 = Select FAULT2 when peripheral mode is enabled in GPIOA5 11 = Select T3 when peripheral mode is enabled in GPIOA5 6.3.8.13 Configure GPIOA4[1:0] (CFG_A4)—Bits 1–0 These bits select the alternate function for GPIOA4. • • • • 00 = Select PWM4 when peripheral mode is enabled in GPIOA4 (default) 01 = Select PWM4 when peripheral mode is enabled in GPIOA4 10 = Select FAULT1 when peripheral mode is enabled in GPIOA4 11 = Select T2 when peripheral mode is enabled in GPIOA4 6.3.9 Peripheral Clock Enable Register (SIM_PCE) The Peripheral Clock Enable register is used to enable or disable clocks to the peripherals as a power savings feature. The clocks can be individually controlled for each peripheral on the chip. The corresponding peripheral should itself be disabled while its clock is shut off. IPBus writes cannot be made to a module that has its clock disabled. Base + $C Read 15 14 13 0 12 11 10 9 8 7 0 0 0 0 0 0 ADC I2C 6 5 4 0 TMR 3 2 0 SCI 1 0 0 SPI PWM Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 6-11 Peripheral Clock Enable Register (SIM_PCE) 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 73 6.3.9.1 I2C IPBus Clock Enable (I2C)—Bit 15 Each bit controls clocks to the indicated peripheral. • • 0 = The clock is not provided to the peripheral (the peripheral is disabled) 1 = Clocks are enabled 6.3.9.2 Reserved—Bit 14 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.9.3 Analog-to-Digital Converter IPBus Clock Enable (ADC)—Bit 13 Each bit controls clocks to the indicated peripheral. • • 0 = The clock is not provided to the peripheral (the peripheral is disabled) 1 = Clocks are enabled 6.3.9.4 Reserved—Bits 12–7 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.9.5 Timer IPBus Clock Enable (TMR)—Bit 6 Each bit controls clocks to the indicated peripheral. • • 0 = The clock is not provided to the peripheral (the peripheral is disabled) 1 = Clocks are enabled 6.3.9.6 Reserved—Bit 5 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.9.7 SCI IPBus Clock Enable (SCI)—Bit 4 Each bit controls clocks to the indicated peripheral. • • 0 = The clock is not provided to the peripheral (the peripheral is disabled) 1 = Clocks are enabled 6.3.9.8 Reserved—Bit 3 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.9.9 SPI IPBus Clock Enable (SPI)—Bit 2 Each bit controls clocks to the indicated peripheral. • • 0 = The clock is not provided to the peripheral (the peripheral is disabled) 1 = Clocks are enabled 6.3.9.10 Reserved—Bit 1 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 56F8013 Technical Data, Rev. 2 74 Freescale Semiconductor Preliminary Register Descriptions 6.3.9.11 PWM IPBus Clock Enable (PWM)—Bit 0 Each bit controls clocks to the indicated peripheral. • • 0 = The clock is not provided to the peripheral (the peripheral is disabled) 1 = Clocks are enabled 6.3.10 I/O Short Address Location Register (SIM_IOSAHI and SIM_IOSALO) The I/O Short Address Location registers are used to specify the memory referenced via the I/O short address mode. The I/O short address mode allows the instruction to specify the lower six bits of address; the upper address bits are not directly controllable. This register set allows limited control of the full address, as shown in Figure 6-12. “Hard Coded” Address Portion Instruction Portion 6 Bits from I/O Short Address Mode Instruction 16 Bits from SIM_IOSALO Register 2 bits from SIM_IOSAHI Register Full 24-Bit for Short I/O Address Figure 6-12 I/O Short Address Determination With this register set, an interrupt driver can set the SIM_IOSALO register pair to point to its peripheral registers and then use the I/O Short addressing mode to reference them. The ISR should restore this register to its previous contents prior to returning from interrupt. Note: The default value of this register set points to the EOnCE registers. Note: The pipeline delay between setting this register set and using short I/O addressing with the new value is five instruction cycles. Base + $D 15 14 13 12 11 10 9 8 7 6 5 4 3 2 Read 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 ISAL[23:22] Write RESET 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 Figure 6-13 I/O Short Address Location High Register (SIM_IOSAHI) 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 75 6.3.10.1 Reserved—Bits 15—2 This bit field is reserved or not implemented. It is read as 0 and cannot be modified by writing. 6.3.10.2 Input/Output Short Address Location (ISAL[23:22])—Bits 1–0 This field represents the upper two address bits of the “hard coded” I/O short address. Base + $E 15 14 13 12 11 10 9 Read 8 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 ISAL[21:6] Write RESET 1 1 1 1 1 1 1 1 1 Figure 6-14 I/O Short Address Location Low Register (SIM_IOSALO) 6.3.10.3 Input/Output Short Address Location (ISAL[21:6])—Bits 15–0 This field represents the lower 16 address bits of the “hard coded” I/O short address. 6.4 Clock Generation Overview The SIM uses master clocks from the OCCS module to produce the peripheral and system (core and memory) clocks. The HS_PERF clock input from OCCS operates at three times the system and peripheral bus rate, or a maximum of 96MHz. The SYS_CLK_x2 clock input from OCCS operates at two times the system and peripheral bus rate, or a maximum of 64MHz. Peripheral and system clocks are generated at a maximum of 32MHz by dividing the SYS_CLK_x2 clock by two and gating it with appropriate power mode and clock gating controls. The PWM and TIMER peripheral clocks can optionally be generated at three times the normal rate at a maximum of 96MHz. These clocks are generated by gating the HS_PERF clock with appropriate power mode and clock gating controls. The OCCS configuration controls the operating frequency of the SIM’s master clocks. In the OCCS, either an external clock or the relaxation oscillator can be selected as the master clock source (MSTR_OSC). When selected, the relaxation oscillator can be operated at full speed (8MHz), standby speed (400kHz using ROSB), or powered down (using ROPD). An 8MHz MSTR_OSC can be multiplied to 196MHz using the PLL and postscaled to provide a variety of high speed clock rates. Either the postscaled PLL output or MSTR_OSC signal can be selected to produce the master clocks to the SIM. When the PLL is not selected, the HS_PERF clock is disabled and the SYS_CLK_x2 clock is MSTR_OSC. In combination with the OCCS module, the SIM provides power modes (see Section 6.5), clock enables (SIM_PCE register, CLK_DIS, ONCE_EBL), and clock rate controls (TCR, PCR) to provide flexible control of clocking and power utilization. The SIM’s clock enable controls can be used to disable individual clocks when not needed. The clock rate controls enable the high speed clocking option for the Timer channels and PWM but require the PLL to be on and selected. Refer to the 56F8300 Peripheral User Manual for further details. 56F8013 Technical Data, Rev. 2 76 Freescale Semiconductor Preliminary Power-Down Modes 6.5 Power-Down Modes The 56F8013 operates in one of five Power-Down modes, as shown in Table 6-3. Table 6-3 Clock Operation in Power-Down Modes Mode Core Clocks Peripheral Clocks Description Run Core and memory clocks disabled Peripheral clocks enabled Device is fully functional Wait Core and memory clocks disabled Peripheral clocks enabled Core executes WAIT instruction to enter this mode. Typically used for power-conscious applications. Possible recoveries from Wait mode to Run mode are: 1. Any interrupt 2. Executing a Debug mode entry command during the 56800E core JTAG interface 2. Any reset (POR, external, software, COP) Stop Master clock generation in the OCCS remains operational, but the SIM disables the generation of system and peripheral clocks. Core executes STOP instruction to enter this mode. Possible recoveries from Stop mode to Run mode are: 1. Interrupt from TMR channels that have been configured to operate in Stop mode (TCx_SD) 2. Interrupt for SCI configured to operate in Stop mode (SCI_SD) 3. Low-voltage interrupt 4. Executing a Debug mode entry command using the 56800E core JTAG interface 5. Any reset (POR, external, software, COP) Standby The OCCS generates the SYS_CLK_x2 clock at a reduced frequency (400kHz). The PLL and HS_PERF clocks are disabled and the high-speed peripheral option is not available. System and peripheral clocks operate at 200kHz. The user configures the OCCS and SIM to select the relaxation oscillator clock source (PRECS), shut down the PLL (PLLPD), put the relaxation oscillator in Standby mode (ROSB), and put the large regulator in Standby (LRSTDBY). The part is fully operational, but operating at a minimum frequency and power configuration. Recovery requires reversing the sequence used to enter this mode (allowing for PLL lock time). Power-Down Master clock generation in the OCCS is completely shut down. All system and peripheral clocks are disabled. The user configures the OCCS and SIM to enter Standby mode as shown in the previous description, followed by powering down the oscillator (ROPD). The only possible recoveries from this mode are: 1. External Reset 2. Power-On Reset The power modes provide additional means to disable clock domains, configure the voltage regulator, and configure clock generation to manage power utilization, as shown in Table 6-3. Run, Wait, and Stop modes provide means of enabling/disabling the peripheral and/or core clocking as a group. Stop disable controls are provided for selected peripherals in the control register (SCI and TMR channels) so that these 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 77 peripheral clocks can optionally continue to operate in Stop mode and generate interrupts which will return the part from Stop to Run mode. Standby mode provides normal operation but at very low speed and power utilization. It is possible to invoke Stop or Wait mode while in Standby mode for even greater levels of power reduction. A 400kHz clock external clock can optionally be used in Standby mode to produce the required Standby 200kHz system bus rate. Power-down mode, which selects the ROSC clock source but shuts it off, fully disables the part and minimizes its power utilization but is only recoverable via reset. When the PLL is not selected and the system bus is operating at 200kHz or less, the large regulator can be put into its Standby mode (LRSTDBY) to reduce the power utilization of that regulator. All peripherals, except the COP/watchdog timer, run at the IPBus clock (peripheral bus) frequency1, which is the same as the main processor frequency in this architecture. The COP timer runs at MSTR_OSC / 1024. The maximum frequency of operation is SYS_CLK = 32MHz. The only exception is the TMR and PWM, which can be configured to operate at three times the system bus rate using TCR and PCR controls, provided the PLL is active and selected. 6.6 Resets The SIM supports four sources of reset, as shown in Figure 6-15. The two asynchronous sources are the external reset pin and the Power-On Reset (POR). The two synchronous sources are the software reset, which is generated within the SIM itself by writing the SIM_CTRL register in Section 6.3.1, and the COP reset. The SIM uses these to generate resets for the internal logic. These are outlined in Table 6-4. The first column lists the four primary resets which are calculated. The JTAG circuitry is reset by the Power-On Reset. Columns two through five indicate which reset sources trigger these reset signals. The last column provides additional detail. Table 6-4 Primary System Resets Reset Sources Reset Signal POR External Software COP Comments EXTENDED_POR X CLKGEN_RST X X X X Released 32 Relaxation Oscillator Clock cycles after all reset sources have released. PERIP_RST X X X X Releases 32 Relaxation Oscillator Clock cycles after the CLKGEN_RST is released. CORE_RST X X X X Releases 32 SYS_CLK periods after PERIP_RST is released . Stretched version of POR. Relevant 64 Relaxation Oscillator Clock cycles after POR deasserts. 1. The TMR ans PWM modules can be operated at three times the IPBus clock frequency. 56F8013 Technical Data, Rev. 2 78 Freescale Semiconductor Preliminary Resets Figure 6-15 provides a graphic illustration of the details in Table 6-4. Note that the POR_Delay blocks use the Relaxation Oscillator Clock as their time base since other system clocks are inactive during this phase of reset. EXTENDED_POR JTAG Power-On Reset (active low) POR pulse shaper Delay 64 MSTR_OSC Clocks External RESET IN RESET (active low) Memory Subsystem CLKGEN_RST OCCS COMBINED_RST PERIP_RST Delay 32 MSTR_OSC Clocks Peripherals pulse shaper Delay 32 sys clocks COP (active low) SW Reset pulse shaper Delay blocks assert immediately and deassert only after the programmed number of clock cycles. 56800E Delay 32 sys clocks pulse shaper CORE_RST Figure 6-15 Sources of RESET Functional Diagram (Test modes not included) POR resets are extended 64 MSTR_OSC clocks to stabilize the power supply. All resets are subsequently extended for an additional 32 MSTR_OSC clocks and 64 system clocks as the various internal reset controls are released. Given the normal relaxation oscillator rate of 8MHz, the duration of a POR reset from when power comes on to when code is running is 28µS. An external reset generation chip may also be used. Resets may be asserted asynchronously, but they are always released internally on a rising edge of the system clock. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 79 6.7 Clocks The memory, peripheral and core clocks all operate at the same frequency (32MHz max) with the exception of the TMR and PWM peripheral clocks, which have the option (using TCR and PCR) to operate three times faster. The SIM is responsible for stalling individual clocks as a response to various hold-off requests, low power modes, and other configuration parameters. The SIM has access to the following signals from the OCCS module: MSTR_OSC HS_PERF SYS_CLK_x2 This comes from the input clock source mux of the OCCS. It is the output of the relaxation oscillator or the external clock source, depending on PRECS. It is not guaranteed to be at 50% duty cycle (+ or - 10% can probably be assumed for design purposes). This clock runs continuously, even during resetm and is used for reset generation. The PLL multiplies the MSTR_OSC by 24, to a maximum of 192MHz. The ZSRC field in OCCS selects the active source to be the PLL. This is divided by 2 and postscaled to produce this maximum 96MHz clock. It is used without further division to produce the high-speed (3x system bus rate) variants of the TMR and PWM peripheral clocks. This clock is disabled when ZSRC is selecting MSTR_OSC. The PLL can multiply the MSTR_OSC by 24, to a maximum of 192MHz. When the PLL is selected by the OCCS ZSRC field, the PLL is divided by three and postscaled to produce this maximum 64MHz clock. When MSTR_OSC is selected by the OCCS ZSRC field, MSTR_OSC feeds SYS_CLK_x2 directly. The SIM takes this clock and divides it by two to generate all the normal (1x system bus rate) peripheral and system clocks. While the SIM generates the ADC peripheral clock in the same way it generates all other peripheral clocks, the ADC standby and conversion clocks are generated by a direct interface between the ADC and the OCCS module. Figure 6-16 illustrates clock relationships to one another and to the various resets as the device comes out of reset. RST is assumed to be the logical AND of all active-low system resets (for example, POR, external reset, COP and Software reset). In the 56F8013 architecture, this signal will be stretched by the SIM for a period of time (up to 96 MSTR_OSC clock cycles, depending upon the status of the POR) to create the clock generation reset signal (CLKGEN_RST). The SIM should deassert CLKGEN_RST synchronously with the negative edge of OSC_CLK in order to avoid skew problems. CLKGEN_RST is delayed 32 SYS_CLK cycles to create the peripheral reset signal (PERIP_RST). PERIP_RST is then delayed by 32 SYS_CLK cycles to create CORE_RST. Both PERIP_RST and CORE_RST should be released on the negative edge of SYS_CLK_D as shown. This phased releasing of system resets is necessary to give some peripherals (for example, the Flash interface unit) set-up time prior to the 56800E core becoming active. 56F8013 Technical Data, Rev. 2 80 Freescale Semiconductor Preliminary Interrupts Maximum Delay = 64 MSTR_OSC cycles for POR reset extension and 32 MSTR_OSC cycles for combined reset extension RST MSTR_OSC Switch on falling OSC_CLK 96 MSTR_OSC cycles CKGEN_RST SYS_CLK_x2 SYS_CLK SYS_CLK_D SYS_CLK_DIV2 32 SYS_CLK cycles delay Switch on falling SYS_CLK PERIP_RST Switch on falling SYS_CLK 32 SYS_CLK cycles delay CORE_RST Figure 6-16 Timing Relationships of Reset Signal to Clocks 6.8 Interrupts The SIM generates no interrupts. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 81 Part 7 Security Features The 56F8013 offers security features intended to prevent unauthorized users from reading the contents of the Flash Memory (FM) array. The 56F8013’s Flash security consists of several hardware interlocks that prevent unauthorized users from gaining access to the Flash array. Note, however, that part of the security must lie with the user’s code. An extreme example would be user’s code that includes a subroutine to read and transfer the contents of the internal program to SCI, SPI or another peripheral, as this code would defeat the purpose of security. At the same time, the user may also wish to put a “backdoor” in his program. As an example, the user downloads a security key through the SCI, allowing access to a programming routine that updates parameters stored in another section of the Flash. 7.1 Operation with Security Enabled Once the user has programmed the Flash with his application code, the 56F8013 can be secured by programming the security bytes located in the FM configuration field, which are located at the last 9 words of Program Flash. These non-volatile bytes will keep the part secured through reset and through power-down of the device. Only two bytes within this field are used to enable or disable security. Refer to the Flash Memory chapter in the 56F8000 Peripheral User Manual for the state of the security bytes and the resulting state of security. When Flash security mode is enabled in accordance with the method described in the Flash Memory module chapter, the 56F8013 will disable the core EOnCE debug capabilities. Normal program execution is otherwise unaffected. 7.2 Flash Access Lock and Unlock Mechanisms The 56F8013 has several operating functional and debug modes. Effective Flash security must address operating mode selection and anticipate modes in which the on-chip Flash can be read without explicit user permission. 7.2.1 Disabling EOnCE Access On-chip Flash can be read by issuing commands across the EOnCE port, which is the debug interface for the 56800E CPU. The TCLK, TMS, TDO, and TDI pins comprise a JTAG interface onto which the EOnCE port functionality is mapped. When the 56F8013 boots, the chip-level JTAG TAP (Test Access Port) is active and provides the chip’s boundary scan capability and access to the ID register, but proper implementation of Flash security will block any attempt to access the internal Flash memory via the EOnCE port when security is enabled. 7.2.2 Flash Lockout Recovery Using JTAG If a user inadvertently enables security on the 56F8013, the only lockout recovery mechanism is the complete erasure of the internal Flash contents, including the configuration field, and thus disables security (the protection register is cleared). This does not compromise security, as the entire contents of the user’s secured code stored in Flash are erased before security is disabled on the 56F8013 on the next reset or power-up sequence. 56F8013 Technical Data, Rev. 2 82 Freescale Semiconductor Preliminary Flash Access Lock and Unlock Mechanisms To start the lockout recovery sequence, the JTAG public instruction (LOCKOUT_RECOVERY) must first be shifted into the chip-level TAP controller’s instruction register. Once the LOCKOUT_RECOVERY instruction has been shifted into the instruction register, the clock divider value must be shifted into the corresponding 7-bit data register. After the data register has been updated, the user must transition the TAP controller into the RUN-TEST/IDLE state for the lockout sequence to commence. The controller must remain in this state until the erase sequence has completed. Refer to the 56F8000 Peripheral User Manual for more details, or contact Freescale. Note: Once the lockout recovery sequence has completed, the user must reset both the JTAG TAP controller (by advancing the TAP state machine to the reset state) and the 56F8013 (by asserting external chip reset) to return to normal unsecured operation. 7.2.3 Flash Lockout Recovery using CodeWarrior CodeWarrior can unlock a device using the command sequence described in Section 7.2.2 by selecting the Debug menu, then selecting DSP56800E, followed by Unlock Flash. Another mechanism is also built into CodeWarrior using the device’s memory configuration file. The command “Unlock_Flash_on_Connect1” in the .cfg file accomplishes the same task as using the Debug menu. 7.2.4 Product Analysis The recommended method of unsecuring a programmed 56F8013 for product analysis of field failures is via the backdoor key access. The customer would need to supply Technical Support with the backdoor key and the protocol to access the backdoor routine in the Flash. Additionally, the KEYEN bit that allows backdoor key access must be set. An alternative method for performing analysis on a secured microcontroller would be to mass-erase and reprogram the Flash with the original code, but modify the security bytes. To insure that a customer does not inadvertently lock himself out of the 56F8013 during programming, it is recommended that the user program the backdoor access key first, the application code second and the security bytes within the FM configuration field last. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 83 Part 8 General Purpose Input/Output (GPIO) 8.1 Introduction This section is intended to supplement the GPIO information found in the 56F8000 Peripheral User Manual and contains only chip-specific information. This information supercedes the generic information in the 56F8000 Peripheral User Manual. 8.2 Configuration There are four GPIO ports defined on the 56F8013. The width of each port, the associated peripheral and reset functions are shown in Table 8-1. The specific mapping of GPIO port pins is shown in Table 8-2. Table 8-1 GPIO Ports Configuration GPIO Port Available Pins in 56F8013 A 8 PWM, Reset GPIO, except GPIOA7 B 8 SPI, SCI, Timer GPIO C 6 XTAL, EXTAL, CAN, TMRC (GPIOC5 and GPIOC7 are not bonded out on the 56F8013) Analog D 4 JTAG JTAG Peripheral Function Reset Function 56F8013 Technical Data, Rev. 2 84 Freescale Semiconductor Preliminary Configuration Table 8-2 GPIO External Signals Map Pins in shaded rows are not available in 56F8013 LQFP Package Pin GPIO Function Peripheral Function GPIOA0 PWM0 29 Defaults to A0 GPIOA1 PWM1 28 Defaults toA1 GPIOA2 PWM2 23 Defaults to A2 GPIOA3 PWM3 24 Defaults to A3 GPIOA4 PWM4 / FAULT1 / T2 22 SIM register SIM_GPS is used to select between PWM4, FAULT1, and T2 Defaults to A4 GPIOA5 PWM5 / FAULT2 / T3 20 SIM register SIM_GPS is used to select between PWM5, FAULT2, and T3 Defaults to A5 GPIOA6 FAULT0 18 Defaults to A6 GPIOA7 RESET 15 Defaults to RESET GPIOB0 SCLK / SCL 21 SIM register SIM_GPS is used to select between SCLK and SCL Defaults to B0 GPIOB1 SS / SDA 2 SIM register SIM_GPS is used to select between SS and SDA Defaults to B1 GPIOB2 MISO / T2 17 SIM register SIM_GPS is used to select between MISO and T2 Defaults to B2 GPIOB3 MOSI / T3 16 SIM register SIM_GPS is used to select between MOSI and T3 Defaults to B3 GPIOB4 T0 / CLKO 19 SIM register SIM_GPS is used to select between T0 and CLKO Defaults to B4 GPIOB5 T1 / FAULT3 4 SIM register SIM_GPS is used to select between T1 and FAULT3 Defaults to B5 Notes 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 85 Table 8-2 GPIO External Signals Map (Continued) Pins in shaded rows are not available in 56F8013 LQFP Package Pin GPIO Function Peripheral Function GPIOB6 RXD / SDA / CLKIN 1 SIM register SIM_GPS is used to select between RXD and SDA. CLKIN functionality is enabled using the PLL Control Register within the OCCS block. Defaults to B6 GPIOB7 TXD / SCL 3 SIM register SIM_GPS is used to select between TXD and SCL Defaults to B7 GPIOC0 ANA0 12 Defaults to ANA0 GPIOC1 ANA1 11 Defaults to ANA1 GPIOC2 ANA2 / VREFH 10 Defaults to ANA2 GPIOC3 ANA3 GPIOC4 ANB0 5 Defaults to ANB0 GPIOC5 ANB1 6 Defaults to ANB1 GPIOC6 ANB2 / VREFL 7 Defaults to ANB2 GPIOC7 ANB3 GPIOD0 TDI 30 Defaults to TDI GPIOD1 TDO 32 Defaults to TDO GPIOD2 TCK 14 Defaults to TCK GPIOD3 TMS 31 Defaults to TMS Notes Not bonded out in 56F8013 Defaults to ANA3 Not bonded out in 56F8013 Defaults to ANB3 8.3 Reset Values Tables 4-16 through 4-19 detail registers for the 56F8013; Figures 8-1 through 8-4 summarize register maps and reset values. 56F8013 Technical Data, Rev. 2 86 Freescale Semiconductor Preliminary Reset Values Add. Offset Register Acronym $0 GPIOA_PUPEN $1 $2 $3 $4 $5 $6 $7 $8 $9 $A $B GPIOA_DATA GPIOA_DDIR GPIOA_PEREN GPIOA_IASSRT GPIOA_IEN GPIOA_IEPOL GPIOA_IPEND GPIOA_IEDGE GPIOA_PPOUTM GPIOA_RDATA GPIOA_DRIVE 15 14 13 12 11 10 9 8 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 X X X X X X X X R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W 0 RS 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 X X X 0 0 0 PU 1 1 1 1 D 0 1 1 1 DD 0 0 0 0 PE 1 0 0 0 IA 0 0 0 0 IEN 0 0 0 0 IEPOL 0 0 0 0 IPR 0 0 0 0 IES 0 0 0 0 OEN 1 1 1 1 RAW DATA X X X X X DRIVE 0 0 0 0 0 Read as 0 Reserved Reset Figure 8-1 GPIOA Register Map Summary 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 87 Add. Offset Register Acronym $0 GPIOB_PUPEN $1 $2 $3 $4 $5 $6 $7 $8 $9 $A $B GPIOB_DATA GPIOB_DDIR GPIOB_PEREN GPIOB_IASSRT GPIOB_IEN GPIOB_IEPOL GPIOB_IPEND GPIOB_IEDGE GPIOB_PPOUTM GPIOB_RDATA GPIOB_DRIVE 15 14 13 12 11 10 9 8 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 X X X X X X X X R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W 0 RS 7 6 5 4 3 2 1 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 X X X 0 0 0 PU 1 1 1 1 D 1 1 1 1 DD 0 0 0 0 PE 0 0 0 0 IA 0 0 0 0 IEN 0 0 0 0 IEPOL 0 0 0 0 IPR 0 0 0 0 IES 0 0 0 0 OEN 1 1 1 1 RAW DATA X X X X X DRIVE 0 0 0 0 0 Read as 0 Reserved Reset Figure 8-2 GPIOB Register Map Summary 56F8013 Technical Data, Rev. 2 88 Freescale Semiconductor Preliminary Reset Values Add. Offset Register Acronym $0 GPIOC_PUPEN $1 $2 $3 $4 $5 $6 $7 $8 $9 $A $B GPIOC_DATA GPIOC_DDIR GPIOC_PEREN GPIOC_IASSRT GPIOC_IEN GPIOC_IEPOL GPIOC_IPEND GPIOC_IEDGE GPIOC_PPOUTM GPIOC_RDATA GPIOC_DRIVE 15 14 13 12 11 10 9 8 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 X X X X X X X X R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W 0 RS 7 6 5 4 3 2 1 0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 X X X 0 0 0 PU 1 1 1 1 D 0 0 0 0 DD 0 0 0 0 PE 1 1 1 1 IA 0 0 0 0 IEN 0 0 0 0 IEPOL 0 0 0 0 IPR 0 0 0 0 IES 0 0 0 0 OEN 1 1 1 1 RAW DATA X X X X X DRIVE 0 0 0 0 0 Read as 0 Reserved Reset Figure 8-3 GPIOC Register Map Summary 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 89 Add. Offset Register Acronym $0 GPIOD_PUPEN $1 $2 $3 $4 $5 $6 $7 $8 $9 $A $B GPIOD_DATA GPIOD_DDIR GPIOD_PEREN GPIOD_IASSRT GPIOD_IEN GPIOD_IEPOL GPIOD_IPEND GPIOD_IEDGE GPIOD_PPOUTM GPIOD_RDATA GPIOD_DRIVE 15 14 13 12 11 10 9 8 7 6 5 4 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R 0 0 0 0 0 0 0 0 0 0 0 0 RS 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R 0 0 0 0 0 0 0 0 0 0 0 0 RS 0 0 0 0 0 0 0 0 0 0 0 0 R 0 0 0 0 0 0 0 0 0 0 0 0 RS 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W RS 0 0 0 0 0 0 0 0 0 0 0 0 X X X X X X X X X X X X R W RS 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R W 0 3 2 1 0 1 1 0 0 0 0 1 1 0 0 0 0 PU 1 1 D W 0 0 DD 0 0 PE 1 1 IA 0 0 IEN W 0 0 IEPOL W RS 0 0 0 0 0 0 0 0 1 1 IPR 0 0 IES 0 0 OEN 1 1 RAW DATA X X X X DRIVE 0 0 0 0 Read as 0 Reserved Reset Figure 8-4 GPIOD Register Map Summary 56F8013 Technical Data, Rev. 2 90 Freescale Semiconductor Preliminary 56F8013 Information Part 9 Joint Test Action Group (JTAG) 9.1 56F8013 Information Please contact your Freescale sales representative or authorized distributor for device/package-specific BSDL information. The TRST pin is not available in this package. The pin is tied to VDD in the package. The JTAG state machine is reset during POR and can also be reset via a soft reset by holding TMS high for five rising edges of TCK, as described in the 56F8000 Peripheral User Manual. Part 10 Specifications 10.1 General Characteristics The 56F8013 is fabricated in high-density CMOS with 5V-tolerant TTL-compatible digital inputs. The term “5V-tolerant” refers to the capability of an I/O pin, built on a 3.3V-compatible process technology, to withstand a voltage up to 5.5V without damaging the device. Many systems have a mixture of devices designed for 3.3V and 5V power supplies. In such systems, a bus may carry both 3.3V- and 5V-compatible I/O voltage levels (a standard 3.3V I/O is designed to receive a maximum voltage of 3.3V ± 10% during normal operation without causing damage). This 5V-tolerant capability therefore offers the power savings of 3.3V I/O levels, combined with the ability to receive 5V levels without damage. Absolute maximum ratings in Table 10-1 are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond these ratings may affect device reliability or cause permanent damage to the device. Unless otherwise stated, all specifications within this chapter apply over the temperature range of -40ºC to 105ºC ambient temperature over the following supply ranges: VSS = VSSA = 0V, VDD = VDDA = 3.0–3.6V, CL < 50pF, fOP = 32MHz CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 91 Table 10-1 Absolute Maximum Ratings (VSS = 0V, VSSA = 0V) Characteristic Symbol Notes Min Max Unit Supply Voltage Range VDD -0.3 4.0 V Analog Supply Voltage Range VDDA - 0.3 4.0 V ADC High Voltage Reference VREFH - 0.3 4.0 V Input Voltage Range (Digital inputs) VIN Pin Groups 1, 2 - 0.3 6.0 V Input Voltage Range (ADC inputs) VINA Pin Group 3 - 0.3 4.0 V Input clamp current, per pin (VIN < 0)1 VIC - -20 mA Output clamp current, per pin (VO < 0)1 VOC - -20 mA Output Voltage Range (Normal Push-Pull mode) VOUT Pin Group 1 -0.3 4.0 V Output Voltage Range (Open Drain mode) VOUTOD Pin Groups 1, 2 -0.3 6.0 V Ambient Temperature TA -40 105 °C Storage Temperature Range TS -55 150 °C 1. Continuous input current per pin is -2 mA Default Mode Pin Group 1: GPIO, TDI, TDO, TMS, TCK Pin Group 2: RESET, GPIOA7 Pin Group 3: ADC Analog Inputs 56F8013 Technical Data, Rev. 2 92 Freescale Semiconductor Preliminary General Characteristics 10.1.1 ElectroStatic Discharge (ESD) Model Table 10-2 56F8013 ESD Protection Characteristic Min Typ Max Unit ESD for Human Body Model (HBM) 2000 — — V ESD for Machine Model (MM) 200 — — V ESD for Charge Device Model (CDM) 750 — — V Table 10-3 LQFP Package Thermal Characteristics6 Characteristic Comments Symbol Value (LQFP) Unit Notes RθJA 74 °C/W 1,2 Junction to ambient Natural convection Single layer board (1s) Junction to ambient Natural convection Four layer board (2s2p) RθJMA 50 °C/W 1,3 Junction to ambient (@200 ft/min) Single layer board (1s) RθJMA 67 °C/W 1,3 Junction to ambient (@200 ft/min) Four layer board (2s2p) RθJMA 46 °C/W 1,3 Junction to board RθJB 23 °C/W 4 Junction to case RθJC 20 °C/W 5 ΨJT 4 °C/W 6 Junction to package top Natural Convection 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 3. Per JEDEC JESC51-6 with the board horizontal. 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 7. See Section 12.1 for more details on thermal design considerations. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 93 Table 10-4 Recommended Operating Conditions (VREFL = 0V, VSSA = 0V, VSS = 0V ) Characteristic Symbol Notes Min Typ Max Unit Supply voltage VDD 3 3.3 3.6 V ADC Supply voltage VDDA 3 3.3 3.6 V ADC High Voltage Reference VREFH 3 — VDDA V Device Clock Frequency Using relaxation oscillator Using external clock source FSYSCLK — 8 0 MHz 32 32 Input Voltage High (digital inputs) VIH Pin Groups 1, 2 2 — 5.5 V Input Voltage Low (digital inputs) VIL Pin Groups 1, 2 -0.3 — 0.8 V Output Source Current High (at VOH min.) When programmed for low drive strength When programmed for high drive strength IOH Output Source Current Low (at VOL max.) When programmed for low drive strength When programmed for high drive strength IOL Ambient Operating Temperature TA Flash Endurance (Program Erase Cycles) NF Flash Data Retention TR mA Pin Group 1 — — -4 Pin Group 1 — — -8 mA Pin Groups 1, 2 — — 4 Pin Groups 1, 2 — — 8 -40 — 105 (RθJA X PD) °C TA = -40°C to 105°C 10,000 — — Cycles TJ <= 70°C avg 15 — — Years Note: Total chip source or sink current cannot exceed 50mA Default Mode Pin Group 1: GPIO, TDI, TDO, TMS, TCK Pin Group 2: RESET, GPIOA7 Pin Group 3: ADC analog inputs 56F8013 Technical Data, Rev. 2 94 Freescale Semiconductor Preliminary DC Electrical Characteristics 10.2 DC Electrical Characteristics Table 10-5 DC Electrical Characteristics At Recommended Operating Conditions Symbol Notes Min Typ Max Unit Test Conditions Output Voltage High VOH Pin Group 1 2.4 — — V IOH = IOHmax Output Voltage Low VOL Pin Groups 1, 2 — — 0.4 V IOL = IOLmax Digital Input Current High (a) pull-up enabled or disabled IIH Pin Groups 1, 2 — 0 +/- 2.5 µA VIN = 2.4V to 5.5V ADC Input Current High IIHA Pin Group 3 — 0 +/- 10 µA VINA = VDDA Digital Input Current Low (a) pull-up enabled pull-up disabled IIL Pin Groups 1, 2 µA VIN = 0V -15 — -30 -60 +/- 2.5 ADC Input Current Low IILA Pin Group 3 — 0 +/- 10 µA VINA = 0V Output Current High Impedance State (a) IOZ Pin Groups 1, 2 — 0 +/- 2.5 µA VOUT = 2.4V to 5.5V or 0V VHYS Pin Groups 1, 2 — 0.35 — V — CIN — 10 — pF — COUT — 10 — pF — Characteristic Schmitt Trigger Input Hysteresis Input Capacitance Output Capacitance (a) See Figure 10-1 Default Mode Pin Group 1: GPIO, TDI, TDO, TMS, TCK Pin Group 2: RESET, GPIOA7 Pin Group 3: ADC Analog Inputs 2.0 0.0 µA - 2.0 - 4.0 - 6.0 - 8.0 - 10.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Volt Figure 10-1 IIN/IOZ vs. Voltage (Typical) 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 95 Table 10-6 Current Consumption per Power Supply Pin (Typical) Mode Conditions IDD1 IDDA RUN 32MHz Device Clock Relaxation Oscillator on PLL powered on Continuous MAC instructions with fetches from Program Flash All peripheral modules enabled. TMR and PWM using 1x Clock ADC powered on and clocked 42mA 13.5mA WAIT 32MHz Device Clock Relaxation Oscillator on PLL powered on Core halted All Peripheral modules enabled. TMR and PWM using 1x Clock ADC powered off 17mA 0µA STOP 8MHz Device Clock Relaxation Oscillator on PLL powered off All peripheral module and core clocks are off ADC powered off 5mA 0µA STANDBY 100KHz Device Clock Relaxation Oscillator in Standby mode PLL powered off All peripheral module and core clocks are off ADC in Standby mode Voltage Regulator in Standby mode 210µA 400µA STANDBY > STOP 100KHz Device Clock Relaxation Oscillator in Standby mode PLL powered off All peripheral module and core clocks are off ADC powered off Voltage regulator in Standby mode 210µA 0µA POWERDOWN Device Clock is off Relaxation Oscillator powered off PLL powered off All peripheral module and core clocks are off ADC powered off Voltage Regulator in Standby mode 160µA 0µA 1. No Output Switching All ports configured as inputs All inputs Low No DC Loads 56F8013 Technical Data, Rev. 2 96 Freescale Semiconductor Preliminary DC Electrical Characteristics Table 10-7 Power-On Reset Low-Voltage Parameters Characteristic Symbol Min Typ Max Unit Low-Voltage Interrupt for 3.3V supply1 VEI3.3 2.65 2.7 — V Low-Voltage Interrupt for 2.5V supply2 VE12.5 2.05 2.15 — V Low-Voltage Interrupt Recovery Hysteresis VEIH — 50 — mV Power-On Reset3 POR — 1.8 1.9 V 1. When VDD drops below VEI3.3 maximum value, an interrupt is generated. 2. When VDD drops below VEI32.5 maximum value, an interrupt is generated. 3. Power-On Reset occurs whenever the internally regulated 2.5V digital supply drops below 1.8V. While power is ramping up, this signal remains active for as long as the internal 2.5V is below 2.15V or the 3.3V 1/O voltage is below 2.7V, no matter how long the ramp-up rate is. The internally regulated voltage is typically 100mV less than VDD during ramp-up until 2.5V is reached, at which time it self-regulates. 10.2.1 Voltage Regulator Specifications The 56F8013 has two on-chip regulators. One supplies the PLL and relaxation oscillator. It has no external pins and therefore has no external characteristics which must be guaranteed (other than proper operation of the device). The second regulator supplies approximately 2.5V to the 56F8013’s core logic. This regulator requires an external 4.4µF, or greater, capacitor for proper operation. Ceramic and tantalum capacitors tend to provide better performance tolerances. The output voltage can be measured directly on the VCAP pin. The specifications for this regulator are shown in Table 10-8. Table 10-8. Regulator Parameters Characteristic Input Voltage Output Voltage Short Circuit Current Short Circuit Tolerance (output shorted to ground) Symbol Min Typical Max Unit VIN 3.0 — 3.6 V VOUT 2.25 2.5 2.75 V ISS — 450 650 mA TRSC — — 30 Minutes 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 97 10.3 AC Electrical Characteristics Tests are conducted using the input levels specified in Table 10-5. Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured between the 10% and 90% points, as shown in Figure 10-2. Low VIH Input Signal High 90% 50% 10% Midpoint1 VIL Fall Time Rise Time Note: The midpoint is VIL + (VIH – VIL)/2. Figure 10-2 Input Signal Measurement References Figure 10-3 shows the definitions of the following signal states: • • • Active state, when a bus or signal is driven, and enters a low impedance state Tri-stated, when a bus or signal is placed in a high impedance state Data Valid state, when a signal level has reached VOL or VOH • Data Invalid state, when a signal level is in transition between VOL and VOH Data2 Valid Data1 Valid Data3 Valid Data2 Data1 Data3 Data Tri-stated Data Invalid State Data Active Data Active Figure 10-3 Signal States 10.4 Flash Memory Characteristics Table 10-9 Flash Timing Parameters Characteristic Symbol Min Typ Max Unit Program time1 Tprog 20 — 40 µs Erase time 2 Terase 20 — — ms Tme 100 — — ms Mass erase time 1. There is additional overhead which is part of the programming sequence. See the 56F8000 Peripheral User Manual for details. Program time is per 16-bit word in Flash memory. Two words at a time can be programmed within the Program Flash Module, as it contains two interleaved memories. 2. Specifies page erase time. There are 512 bytes per page in the Program Flash memory. The Program Flash Module uses two interleaved Flash memories, increasing the effective page size to 1024 bytes. 56F8013 Technical Data, Rev. 2 98 Freescale Semiconductor Preliminary External Clock Operation Timing 10.5 External Clock Operation Timing Table 10-10 External Clock Operation Timing Requirements1 Characteristic Symbol Min Typ Max Unit Frequency of operation (external clock driver)2 fosc 4 8 8 MHz Clock Pulse Width3 tPW 6.25 — — ns External Clock Input Rise Time4 trise — — 3 ns External Clock Input Fall Time5 tfall — — 3 ns 1. 2. 3. 4. 5. Parameters listed are guaranteed by design. See Figure 10-4 for details on using the recommended connection of an external clock driver. The high or low pulse width must be no smaller than 6.25ns or the chip may not function. External clock input rise time is measured from 10% to 90%. External clock input fall time is measured from 90% to 10%. VIH External Clock 90% 50% 10% 90% 50% 10% tfall tPW tPW trise VIL Note: The midpoint is VIL + (VIH – VIL)/2. Figure 10-4 External Clock Timing 10.6 Phase Locked Loop Timing Table 10-11 PLL Timing Characteristic Symbol Min Typ Max Unit Internal reference relaxation oscillator frequency for the PLL frosc — 8 — MHz PLL output frequency1 (24 x reference frequency) fop — 192 — MHz PLL lock time2 tlock — .1 1 ms Cycle-to-cycle jitter tjitterpll 350 ps 1. The core system clock will operate at 1/6 of the PLL output frequency. 2. This is the time required after the PLL is enabled to ensure reliable operation. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 99 10.7 Relaxation Oscillator Timing Table 10-12 Relaxation Oscillator Timing Characteristic Symbol Minimum Typical Maximum Relaxation Oscillator output frequency1 Normal Mode Standby Mode fop — Relaxation Oscillator stabilization time2 troscs — 1 tjitterrosc — 400 ps Minimum tuning step size .08 % Maximum tuning step size 40 % Variation over temperature -40°C to 105°C4 — — 8 400 Cycle-to-cycle jitter. This is measured on the CLKO signal (programmed prescaler_clock) over 264 clocks3 Unit MHz kHz 3 µs +3.0 to -3.0 % 1. Output frequency after application of trim value, at 25°C. 2. This is the time required from standby to normal mode transition. 3. JA is required to meet SCI requirements. 4. See Figure 10-5. 8.05 8 MHz 7.95 7.9 7.85 7.8 -50 -25 0 25 50 75 100 125 150 175 Degrees C (Junction) Figure 10-5 Relaxation Oscillator Temperature Variation (Typical) 56F8013 Technical Data, Rev. 2 100 Freescale Semiconductor Preliminary Reset, Stop, Wait, Mode Select, and Interrupt Timing 10.8 Reset, Stop, Wait, Mode Select, and Interrupt Timing Note: All the address and data buses described here are internal. Table 10-13 Reset, Stop, Wait, Mode Select, and Interrupt Timing1,2 Characteristic Symbol Typical Min Typical Max Unit Minimum RESET Assertion Duration tRA 4T — ns Minimum GPIO pin Assertion for Interrupt tIW 2T — ns tRDA 96TOSC + 64T 97TOSC + 65T ns tIF — 6T ns RESET deassertion to First Address Fetch3 Delay from Interrupt Assertion to Fetch of first instruction (exiting Stop) See Figure 10-6 1. In the formulas, T = clock cycle and Tosc = oscillator clock cycle. For an operating frequency of 32MHz, T = 31.25ns. At 8MHz (used during Reset and Stop modes), T = 125ns. 2. Parameters listed are guaranteed by design. 3. During Power-On Reset, it is possible to use the 56F8013 internal reset stretching circuitry to extend this period to 2^21T. GPIO pin (Input) TIW Figure 10-6 GPIO Interrupt Timing (Negative Edge-Sensitive) 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 101 10.9 Serial Peripheral Interface (SPI) Timing Table 10-14 SPI Timing1 Characteristic Symbol Cycle time Master Slave Min Max Unit 125 62.5 — — ns ns — 31 — — ns ns — 125 — — ns ns 50 31 — — ns ns 50 31 — — ns ns 20 0 — — ns ns 0 2 — — ns ns 4.8 15 ns 3.7 15.2 ns — — 4.5 20.4 ns ns 0 0 — — ns ns — — 11.5 10.0 ns ns — — 9.7 9.0 ns ns tC Enable lead time Master Slave tELD Enable lag time Master Slave tELG Clock (SCK) high time Master Slave tCH Clock (SCK) low time Master Slave tCL Data set-up time required for inputs Master Slave tDS Data hold time required for inputs Master Slave tDH Access time (time to data active from high-impedance state) Slave tA Disable time (hold time to high-impedance state) Slave tD Data Valid for outputs Master Slave (after enable edge) tDV Data invalid Master Slave tDI Rise time Master Slave tR Fall time Master Slave tF See Figure 10-7, 10-8, 10-9, 10-10 10-10 10-10 10-7, 10-8, 10-9, 10-10 10-10 10-7, 10-8, 10-9, 10-10 10-7, 10-8, 10-9, 10-10 10-10 10-10 10-7, 10-8, 10-9, 10-10 10-7, 10-8, 10-9, 10-10 10-7, 10-8, 10-9, 10-10 10-7, 10-8, 10-9, 10-10 1. Parameters listed are guaranteed by design. 56F8013 Technical Data, Rev. 2 102 Freescale Semiconductor Preliminary Serial Peripheral Interface (SPI) Timing 1 SS SS is held High on master (Input) tC tR tF tCL SCLK (CPOL = 0) (Output) tCH tF tR tCL SCLK (CPOL = 1) (Output) tDH tCH tDS MISO (Input) MSB in Bits 14–1 tDI MOSI (Output) LSB in tDI(ref) tDV Master MSB out Bits 14–1 Master LSB out tR tF Figure 10-7 SPI Master Timing (CPHA = 0) SS (Input) SS is held High on master tC tF tR tCL SCLK (CPOL = 0) (Output) tCH tF tCL SCLK (CPOL = 1) (Output) tCH tDS tR MISO (Input) MSB in Bits 14–1 tDI tDV(ref) MOSI (Output) tDH Master MSB out tDV Bits 14– 1 tF LSB in tDI(ref) Master LSB out tR Figure 10-8 SPI Master Timing (CPHA = 1) 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 103 SS (Input) tC tF tCL SCLK (CPOL = 0) (Input) tELG tR tCH tELD tCL SCLK (CPOL = 1) (Input) tCH tA MISO (Output) Slave MSB out tF tR Bits 14–1 tDS Slave LSB out tDV tDI tDH MOSI (Input) MSB in tD Bits 14–1 tDI LSB in Figure 10-9 SPI Slave Timing (CPHA = 0) SS (Input) tF tC tR tCL SCLK (CPOL = 0) (Input) tCH tELG tELD tCL SCLK (CPOL = 1) (Input) tDV tCH tR tA MISO (Output) Slave MSB out Bits 14–1 tDS tDV tDH MOSI (Input) tD tF MSB in Bits 14–1 Slave LSB out tDI LSB in Figure 10-10 SPI Slave Timing (CPHA = 1) 56F8013 Technical Data, Rev. 2 104 Freescale Semiconductor Preliminary Quad Timer Timing 10.10 Quad Timer Timing Table 10-15 Timer Timing1, 2 Characteristic Symbol Min Max Unit See Figure PIN 2T + 6 — ns 10-11 Timer input high / low period PINHL 1T + 3 — ns 10-11 Timer output period POUT 125 — ns 10-11 POUTHL 50 — ns 10-11 Timer input period Timer output high / low period 1. In the formulas listed, T = the clock cycle. For 32MHz operation, T = 31.25ns. 2. Parameters listed are guaranteed by design. Timer Inputs PIN PINHL PINHL POUT POUTHL POUTHL Timer Outputs Figure 10-11 Timer Timing 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 105 10.11 Serial Communication Interface (SCI) Timing Table 10-16 SCI Timing1 Characteristic Symbol Min Max Unit See Figure BR — (fMAX/16) Mbps — RXD3 Pulse Width RXDPW 0.965/BR 1.04/BR ns 10-12 TXD4 Pulse Width TXDPW 0.965/BR 1.04/BR ns 10-13 Baud Rate2 LIN Slave Mode Deviation of slave node clock from nominal clock rate before synchronization Deviation of slave node clock relative to the master node clock after synchronization Minimum break character length 1. 2. 3. 4. FTOL_UNSYNCH -14 14 % FTOL_SYNCH -2 2 % TBREAK 13 Master node bit periods 11 Slave node bit periods Parameters listed are guaranteed by design. fMAX is the frequency of operation of the system clock in MHz, which is 32MHz for the 56F8013 device. The RXD pin in SCI0 is named RXD0 and the RXD pin in SCI1 is named RXD1. The TXD pin in SCI0 is named TXD0 and the TXD pin in SCI1 is named TXD1. RXD Receive data pin (Input) RXDPW Figure 10-12 RXD Pulse Width TXD Receive data pin (Input) TXDPW Figure 10-13 TXD Pulse Width 56F8013 Technical Data, Rev. 2 106 Freescale Semiconductor Preliminary Inter-Integrated Circuit Interface (I2C) Timing 10.12 Inter-Integrated Circuit Interface (I2C) Timing Table 10-17 I2C Timing Standard Mode Characteristic Fast Mode Symbol Unit Minimum Maximum Minimum Maximum fSCL 0 100 0 400 tHD; STA 4.0 0.6 µs LOW period of the SCL clock tLOW 4.7 1.25 µs HIGH period of the SCL clock tHIGH 4.0 0.6 µs Set-up time for a repeated START condition tSU; STA 4.7 0.6 µs Data hold time for I2C bus devices tHD; DAT 01 Data set-up time tSU; DAT 250 SCL Clock Frequency Hold time (repeated ) START condition. After this period, the first clock pulse is generated. 3.452 01 kHz 0.92 µs ns 1003 Rise time of both SDA and SCL signals tr 1000 2 +0.1Cb4 300 ns Fall time of both SDA and SCL signals tf 300 2 +0.1Cb4 300 ns Set-up time for STOP condition tSU; STO 4.0 0.6 µs Bus free time between STOP and START condition tBUF 4.7 1.3 µs Pulse width of spikes that must be suppressed by the input filter tSP N/A N/A 0.0 50 ns 1. A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIH min of the SCL signal) to bridge the undefined region of the falling edge of SCL. 2. The maximum tHD; DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL signal. 3. A Fast mode I2C bus device can be used in a Standard mode I2C bus system, but the requirement tSU; DAT > = 250ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU; DAT = 1000 + 250 = 1250ns (according to the Standard mode I2C bus specification) before the SCL line is released. 4. Cb = total capacitance of the one bus line in pF. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 107 SDA tSU; DAT tLOW tHD; STA tBUF tSP SCL S tSU; STA tHD; STA tHD; DAT tHIGH tSU; STO BR P S Figure 10-14 Timing Definition for Fast and Standard Mode Devices on the I2C Bus 10.13 JTAG Timing Table 10-18 JTAG Timing Characteristic Symbol Min Max Unit See Figure TCK frequency of operation1 fOP DC SYS_CLK/8 MHz 10-15 TCK clock pulse width tPW 50 — ns 10-15 TMS, TDI data set-up time tDS 5 — ns 10-16 TMS, TDI data hold time tDH 5 — ns 10-16 TCK low to TDO data valid tDV — 30 ns 10-16 TCK low to TDO tri-state tTS — 30 ns 10-16 1. TCK frequency of operation must be less than 1/8 the processor rate. 1/fOP tPW tPW VM VM VIH TCK (Input) VM = VIL + (VIH – VIL)/2 VIL Figure 10-15 Test Clock Input Timing Diagram 56F8013 Technical Data, Rev. 2 108 Freescale Semiconductor Preliminary Analog-to-Digital Converter (ADC) Parameters TCK (Input) tDS TDI TMS (Input) tDH Input Data Valid tDV TDO (Output) Output Data Valid tTS TDO (Output) Figure 10-16 Test Access Port Timing Diagram 10.14 Analog-to-Digital Converter (ADC) Parameters Table 10-19 ADC Parameters1 Characteristic Symbol Min Typ Max Unit VADIN VREFL — VREFH V Resolution RES 12 — 12 Bits Integral Non-Linearity2 (Full input signal range) INL — +/- 3 +/- 4 LSB3 Integral Non-Linearity4 (10% to 90% input signal range) INL — +/- 2 +/- 3 LSB3 Differential Non-Linearity DNL — -1 < DNL < +1 < +1 LSB3 Input voltages Monotonicity GUARANTEED ADC internal clock fADIC 0.1 — 5.33 MHz Conversion range RAD VREFL — VREFH V ADC power-up time5 tADPU — 6 13 tAIC cycles6 Recovery from auto standby tREC — 0 1 tAIC cycles6 Conversion time tADC — 6 — tAIC cycles6 Sample time tADS — 1 — tAIC cycles6 Input capacitance CADI — See Figure 10-17 — pF Input impedance XIN See Figure 10-17 — Ohms Input injection current7, per pin IADI — 3 mA — 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 109 Table 10-19 ADC Parameters1 (Continued) Characteristic Symbol Min Typ Max Unit IVREFH — 0 — µA VOFFSET — +/- 8 +/- 15 mV EGAIN .99 1 1.01 — VOFFSET — +/- 3 TBD mV Signal-to-noise ratio SNR TBD 62 to 65.7 dB Total Harmonic Distortion THD TBD 63 to 68 dB Spurious Free Dynamic Range SFDR TBD 67 to 70.3 dB Signal-to-noise plus distortion SINAD TBD 61 to 63.9 dB Effective Number Of Bits ENOB 9.1 9.6 to 10.4 Bits VREFH current Offset Voltage Internal Ref Gain Error (transfer gain) Offset Voltage External Ref 1. All measurements were made at VDD = 3.3V, VREFH = 3.3V, and VREFL = ground 2. INL measured from VIN = VREFL to VIN = VREFH 3. LSB = Least Significant Bit 4. INL measure from VIN = 0.1 VREFH to VIN = 0.9VREFH 5. Includes power-up of ADC and VREF 6. ADC clock cycles 7. The current that can be injected or sourced from an unselected ADC signal input without impacting the performance of the ADC. 56F8013 Technical Data, Rev. 2 110 Freescale Semiconductor Preliminary Equivalent Circuit for ADC Inputs 10.15 Equivalent Circuit for ADC Inputs Figure 10-17 illustrates the ADC input circuit during sample and hold. S1 and S2 are always open/closed at the same time that S3 is closed/open. When S1/S2 are closed & S3 is open, one input of the sample and hold circuit moves to (VREFH-VREFL)/2, while the other charges to the analog input voltage. When the switches are flipped, the charge on C1 and C2 are averaged via S3, with the result that a single-ended analog input is switched to a differential voltage centered about (VREFH-VREFL)/2. The switches switch on every cycle of the ADC clock (open one-half ADC clock, closed one-half ADC clock). Note that there are additional capacitances associated with the analog input pad, routing, etc., but these do not filter into the S/H output voltage, as S1 provides isolation during the charge-sharing phase. One aspect of this circuit is that there is an on-going input current, which is a function of the analog input voltage, VREF and the ADC clock frequency. 125Ω ESD Resistor 8pF noise damping capacitor 3 Analog Input 4 S1 C1 S/H S3 1 1. 2. 3. 4. 5. 2 (VREFH- VREFL )/ 2 S2 C2 C1 = C2 = 1pF Parasitic capacitance due to package, pin-to-pin and pin-to-package base coupling; 1.8pF Parasitic capacitance due to the chip bond pad, ESD protection devices and signal routing; 2.04pF Equivalent resistance for the channel select mux; 100 ohms Sampling capacitor at the sample and hold circuit. Capacitor C1 is normally disconnected from the input and is only connected to it at sampling time; 1.4pF 1 Equivalent input impedance, when the the input is selected = (ADC Clock Rate) x 1.4 x 10-12 Figure 10-17 Equivalent Circuit for A/D Loading 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 111 10.16 Power Consumption See Section 10.1 for a list of IDD requirements for the 56F8013. This section provides additional detail which can be used to optimize power consumption for a given application. Power consumption is given by the following equation: Total power = A: internal [static component] +B: internal [state-dependent component] +C: internal [dynamic component] +D: external [dynamic component] +E: external [static] A, the internal [static component], is comprised of the DC bias currents for the oscillator, leakage currents, PLL, and voltage references. These sources operate independently of processor state or operating frequency. B, the internal [state-dependent component], reflects the supply current required by certain on-chip resources only when those resources are in use. These include RAM, Flash memory and the ADCs. C, the internal [dynamic component], is classic C*V2*F CMOS power dissipation corresponding to the 56800E core and standard cell logic. D, the external [dynamic component], reflects power dissipated on-chip as a result of capacitive loading on the external pins of the chip. This is also commonly described as C*V2*F, although simulations on two of the I/O cell types used on the 56800E reveal that the power-versus-load curve does have a non-zero Y-intercept. Table 10-20 I/O Loading Coefficients at 10MHz Intercept Slope 8mA drive 1.3 0.11mW / pF 4mA drive 1.15mW 0.11mW / pF Power due to capacitive loading on output pins is (first order) a function of the capacitive load and frequency at which the outputs change. Table 10-20 provides coefficients for calculating power dissipated in the I/O cells as a function of capacitive load. In these cases: TotalPower = Σ((Intercept + Slope*Cload)*frequency/10MHz) 56F8013 Technical Data, Rev. 2 112 Freescale Semiconductor Preliminary Power Consumption where: • • • Summation is performed over all output pins with capacitive loads TotalPower is expressed in mW Cload is expressed in pF Because of the low duty cycle on most device pins, power dissipation due to capacitive loads was found to be fairly low when averaged over a period of time. E, the external [static component], reflects the effects of placing resistive loads on the outputs of the device. Sum the total of all V2/R or IV to arrive at the resistive load contribution to power. Assume V = 0.5 for the purposes of these rough calculations. For instance, if there is a total of eight PWM outputs driving 10mA into LEDs, then P = 8*.5*.01 = 40mW. In previous discussions, power consumption due to parasitics associated with pure input pins is ignored, as it is assumed to be negligible. 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 113 Part 11 Packaging 11.1 56F8013 Package and Pin-Out Information VCAP VDD_IO VSS_IO GPIOA1/PWM1 GPIOA0/PWM0 TDI/GPIOD0 TMS/GPIOD3 TDO/GPIOD1 This section contains package and pin-out information for the 56F8013. This device comes in a 32-pin Low-profile Quad Flat Pack (LQFP). Figure 11-1 shows the package outline for the 32-pin LQFP, Figure 11-2 shows the mechanical parameters for this package, and Table 11-1 lists the pin-out for the 32-pin LQFP. ORIENTATION MARK GPIOB6/RXD/SDA/CLKIN GPIOA3/PWM3 PIN 25 GPIOB1/SS/SDA GPIOA2/PWM2 PIN 1 GPIOB7/TXD/SCL GPIOA4/PWM4/FAULT1/T2 GPIOB5/T1/FAULT3 56F8013 ANB0/GPIOC4 GPIOB0/SCLK/SCL GPIOA5/PWM5/FAULT2/T3 ANB1/GPIOC5 GPIOB4/T0/CLKO ANB2/VREFL/GPIOC6 PIN 17 PIN 9 VDDA GPIOA6/FAULT0 GPIOB3/MOSI/T3 RESET/GPIOA7 TCK/GPIOD2 VSS_IO ANA0/GPIOC0 ANA1/GPIOC1 ANA2/VREFH/GPIOC2 VSSA GPIOB2/MISO/T2 Note: Alternate signals are in iltalic Figure 11-1 Top View, 56F8013 32-Pin LQFP Package 56F8013 Technical Data, Rev. 2 114 Freescale Semiconductor Preliminary 56F8013 Package and Pin-Out Information Table 11-1 56F8013 32-Pin LQFP Package Identification by Pin Number1 Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name Pin No. Signal Name 1 GPIOB6 RXD,SDA,CLKIN 9 VSSA 17 GPIOB2 MISO,T2 25 VCAP 2 GPIOB1 SS,SDA 10 ANA2 VREFH,GPIOC2 18 GPIOA6 FAULT0 26 VDD_IO 3 GPIOB7 TXD,SCL 11 ANA1 GPIOC1 19 GPIOB4 T0,CLKO 27 VSS_IO 4 GPIOB5 T1,FAULT3 12 ANA0 GPIOC0 20 GPIOA5 PWM5,FAULT2,T3 28 GPIOA1 PWM1 5 ANB0 GPIOC4 13 VSS_IO 21 GPIOB0 SCLK,SCL 28 GPIOA0 PWM0 6 ANB1 GPIOC5 14 TCK GPIOD2 22 GPIOA4 PWM4,FAULT1,T2 30 TDI GPIOD0 7 ANB2 VREFL,GPIOC6 15 RESET GPIOA7 23 GPIOA2 PWM2 31 TMS GPIOD3 8 VDDA 16 GPIOB3 MOSI,T3 24 GPIOA3 PWM3 32 TDO GPIOD1 1.Alternate signals are in iltalic 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 115 –T–, –U–, –Z– A 4X A1 32 0.20 (0.008) AB T–U Z 25 1 –U– –T– B V AE P B1 DETAIL Y 17 8 V1 AE DETAIL Y 9 4X –Z– 9 0.20 (0.008) AC T–U Z S1 S DETAIL AD G –AB– 0.10 (0.004) AC AC T–U Z –AC– BASE METAL ÉÉ ÉÉ ÉÉ ÉÉ F 8X M_ R J M N D 0.20 (0.008) SEATING PLANE SECTION AE–AE W K X DETAIL AD Q_ GAUGE PLANE H 0.250 (0.010) C E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.300 0.450 1.350 1.450 0.300 0.400 0.800 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_ REF 0.090 0.160 0.400 BSC 1_ 5_ 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.276 BSC 0.138 BSC 0.276 BSC 0.138 BSC 0.055 0.063 0.012 0.018 0.053 0.057 0.012 0.016 0.031 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12_ REF 0.004 0.006 0.016 BSC 1_ 5_ 0.006 0.010 0.354 BSC 0.177 BSC 0.354 BSC 0.177 BSC 0.008 REF 0.039 REF Figure 11-2 56F8013 32-Pin LQFP Mechanical Information 56F8013 Technical Data, Rev. 2 116 Freescale Semiconductor Preliminary Thermal Design Considerations Part 12 Design Considerations 12.1 Thermal Design Considerations An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RθJΑ x PD) where: TA = Ambient temperature for the package (oC) RθJΑ = Junction-to-ambient thermal resistance (oC/W) PD = Power dissipation in the package (W) The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy estimation of thermal performance. Unfortunately, there are two values in common usage: the value determined on a single-layer board and the value obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low-power dissipation and the components are well separated. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA = RθJC = RθCA = Package junction-to-ambient thermal resistance (°C/W) Package junction-to-case thermal resistance (°C/W) Package case-to-ambient thermal resistance (°C/W) RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal Characterization Parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (ΨJT x PD) where: TT ΨJT PD = Thermocouple temperature on top of package (oC) = Thermal characterization parameter (oC/W) = Power dissipation in package (W) 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 117 The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. When heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back-calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction-to-case thermal resistance. 12.2 Electrical Design Considerations CAUTION This device contains protective circuitry to guard against damage due to high static voltage or electrical fields. However, normal precautions are advised to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate voltage level. Use the following list of considerations to assure correct operation of the 56F8013: • Provide a low-impedance path from the board power supply to each VDD pin on the 56F8013 and from the board ground to each VSS (GND) pin • The minimum bypass requirement is to place 0.01–0.1µF capacitors positioned as close as possible to the package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better tolerances. Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND) pins are as short as possible Bypass the VDD and VSS with approximately 100µF, plus the number of 0.1µF ceramic capacitors • • • • PCB trace lengths should be minimal for high-frequency signals Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VDD and VSS circuits. 56F8013 Technical Data, Rev. 2 118 Freescale Semiconductor Preliminary Electrical Design Considerations • Take special care to minimize noise levels on the VREF, VDDA and VSSA pins • Using separate power planes for VDD and VDDA and separate ground planes for VSS and VSSA is recommended. Connect the separate analog and digital power and ground planes as close as possible to power supply outputs. If both analog circuit and digital circuit are powered by the same power supply, it is advisable to connect a small inductor or ferrite bead in serial with both VDDA and VSSA traces. • It is highly desirable to physically separate analog components from noisy digital components by ground planes. Do not place an analog trace in parallel with digital traces. It is also desirable to place an analog ground trace around an analog signal trace to isolate it from digital traces. • Because the Flash memory is programmed through the JTAG/EOnCE port, SPI, SCI or I2C, the designer should provide an interface to this port if in-circuit Flash programming is desired. Part 13 Ordering Information Table 13-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor sales office or authorized distributor to determine availability and to order parts. Table 13-1 56F8013 Ordering Information Part Supply Voltage Package Type Pin Count Frequency (MHz) Temperature Range Order Number MC56F8013 3.0–3.6 V Low-Profile Quad Flat Pack (LQFP) 32 32 -40° to + 105° C MC56F8013VFAE 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 119 Part 14 Appendix Register acronyms are revised from previous device data sheets to provide a cleaner register description. A cross reference to legacy and revised acronyms are provided in the following table. Peripheral Reference Manual Module ADC Register Name Control Register 1 CTRL1 ADCR1 ADC_CTRL1 ADC_ADCR1 ADC_ADCR1 0xF080 Control Register 2 CTRL2 ADCR2 ADC_CTRL2 ADC_ADCR2 ADC_ADCR2 0xF081 New Acronym Legacy Acronym Start End Zero Crossing Control Register ZXCTRL ADZCC ADC_ZXCTRL ADC_ADZCC ADC_ADZCC 0xF082 Channel List Register 1 CLIST1 ADLST1 ADC_CLIST1 ADC_ADLST1 ADC_ADLST1 0xF083 Channel List Register 2 CLIST2 ADLST2 ADC_CLIST2 ADC_ADLST2 ADC_ADLST2 0xF084 Sample Disable Register SDIS ADSDIS ADC_SDIS ADC_ADSDIS ADC_ADSDIS 0xF085 STAT ADSTAT ADC_STAT ADC_ADSTAT ADC_ADSTAT 0xF086 LIMSTAT ADLSTAT ADC_LIMSTAT ADC_ADLSTAT ADC_ADLSTAT 0xF087 ADC_ADZCSTAT ADC_ADZCSTAT 0xF088 Zero Crossing Status Register ZXSTAT ADZCSTAT ADC_ZXSTAT Result Registers 0-7 RSLT0-7 ADRSLT0-7 ADC_RSLT0-7 ADC_ADRSLT0-7 ADC_ADRSLT0-7 0xF089 0XF090 Low Limit Registers 0-7 LOLIM0-7 ADLLMT0-7 ADC_LOLIM0-7 ADC_ADLLMT0-7 ADC_ADLLMT0-7 0XF091 0XF098 High Limit Registers 0-7 HILIM0-7 ADHLMT0-7 OFFST0-7 ADOFS0-7 Power Control Register PWR ADPOWER ADC_PWR ADC_ADPOWER ADC_ADPOWER 0XF0A9 Voltage Reference Register CAL ADCAL ADC_VREF ADC_ADCAL ADC_CAL 0XF0AA Offset Registers 0-7 ITCN Memory Address Legacy Acronym Limit Status Register I2C Processor Expert Acronym New Acronym Status Register COP Data Sheet ADC_HILIM0-7 ADC_ADHLMT0-7 ADC_ADHLMT0-7 0XF099 0XF0A0 ADC_OFFST0-7 ADC_ADOFS0-7 ADC_ADOFS0-7 0XF0A1 0XF0A8 Control Register CTRL COPCTL COP_CTRL COPCTL COPCTL 0XF0E0 Time-Out Register TOUT COPTO COP_TOUT COPTO COPTO 0XF0E1 Counter Register CNTR COPCTR COP_CNTR COPCTR COPCTR 0XF0E2 Address Register ADDR IBAD I2C_ADDR I2C_IBAD IBAD 0xF0D0 Frequency Divider Register FDIV IBFD I2C_FDIV I2C_IBFD IBFD 0xF0D1 Control Register CTRL IBCR I2C_CTRL I2C_IBCR IBCR 0xF0D2 Status Register STAT IBSR I2C_STAT I2C_IBSR IBSR 0xF0D3 Data I./O Register DATA IBDR I2C_DATA I2C_IBDR IBDR 0xF0D4 Noise Filter Register NFILT IBNR I2C_NFILT I2C_IBNR IBNR 0xF0D5 0XF060 0XF064 Interrupt Priority Register 0-4 N/A N/A ITCN_IPR0-4 ITCN_IPR0-4 INTC_IPR0-4 Vector Base Address Register N/A N/A ITCN_VBA ITCN_VBA INTC_VBA 0XF065 Fast Interrupt Match 0 Register N/A N/A ITCN_FIM0 ITCN_FIM0 INTC_FIM0 0XF066 Fast Interrupt Vector Address Low 0 N/A N/A ITCN_FIVAL0 ITCN_FIVAL0 INTC_FIVAL0 0XF067 Fast Interrupt Vector Address High 0 N/A N/A ITCN_FIVAH0 ITCN_FIVAH0 INTC_FIVAH0 0XF068 Fast Interrupt Match 1 Register N/A N/A ITCN_FIM1 ITCN_FIM1 INTC_FIM1 0xF069 Fast Interrupt Vector Address Low 1 N/A N/A ITCN_FIVAL1 ITCN_FIVAL1 INTC_FIVAL1 0xF06A Fast Interrupt Vector Address High 1 N/A N/A ITCN_FIVAH1 ITCN_FIVAH1 INTC_FIVAH1 0xF06B Interrupt Pending Register 0 N/A N/A ITCN_IRQP0 ITCN_IRQP0 INTC_IRQP0 0xF06C Interrupt Pending Register 1 N/A N/A ITCN_IRQP1 ITCN_IRQP1 INTC_IRQP1 0xF06D Interrupt Pending Register 2 N/A N/A ITCN_IRQP2 ITCN_IRQP2 INTC_IRQP2 0xF06E Interrupt Control Register N/A N/A ITCN_ICTRL ITCN_ICTL INTC_ICTL 0xF072 56F8013 Technical Data, Rev. 2 120 Freescale Semiconductor Preliminary Electrical Design Considerations Peripheral Reference Manual Module Register Name OCCS Control Register Divide-By Register Status Register Shutdown Register FM Data Sheet Processor Expert Acronym Memory Address New Acronym Legacy Acronym CTRL PLLCR OCCS_CTRL PLLCR PLLCR 0xF0F0 DIVBY PLLDB OCCS_DIVBY PLLDB PLLDB 0xF0F1 PLLSR OCCS_STAT STAT SHUTDN New Acronym Legacy Acronym SHUTDOWN OCCS_SHUTDN Start End PLLSR PLLSR 0xF0F2 SHUTDOWN SHUTDOWN 0xF0F4 0xF0F5 Oscillator Control Register OCTRL OSCTL OCCS_OCTRL OSCTL OSCTL Clock Divider Register CLKDIV FMCLKD FM_CLKDIV FMCLKD FMCLKD 0xF400 Configuration Register CNFG FMCR FM_CNFG FMCR FMCR 0xF401 Security High Half Register SECHI FMSECH FM_SECHI FMSECH FMSECH 0xF403 Security Low Half Register SECLO FMSECL FM_SECLO FMSECL FMSECL 0xF404 Protection Register PROT FMPROT FM_PROT FMPROT FMPROT 0xF410 User Status Register 0xF413 USTAT FMUSTAT FM_USTAT FMUSTAT FMUSTAT Command Register CMD FMCMD FM_CMD FMCMD FMCMD Address Register ADDR FMADDR FM_ADDR FMADDR Data Buffer Register DATA FMDATA FM_DATA FMDATA Optional Data 1 Register OPT1 FMOPT1 FM_OPT1 FMOPT1 TSTSIG FMTST_SIG FM_TSTSIG FMTST_SIG PUPEN PUR GPIOx_PUPEN GPIOx_PUR GPIO_x_PUR 0xF1n0 DATA DR GPIOx_DATA GPIOx_DR GPIO_x_DR 0xF1n1 Test Array Signature Register 0xF414 0xF416 0xF418 FMOPT1 0xF41B 0xF41D x = A (n=0) B (n=1) C (n=2) D (n=3) GPIO Pull-Up Enable Register Data Register DDIR DDR GPIOx_DDIR GPIOx_DDR GPIO_x_DDR 0xF1n2 Peripheral Enable Register Data Direction Register PEREN PER GPIOx_PEREN GPIOx_PER GPIO_x_PER 0xF1n3 Interrupt Assert Register IASSRT IAR GPIOx_IASSRT GPIOx_IAR GPIO_x_IAR 0xF1n4 Interrupt Enable Register IEN IENR GPIOx_IEN GPIOx_IENR GPIO_x_IENR 0xF1n5 Interrupt Edge Polarity Register IEPOL IPOLR GPIOx_IEPOL GPIOx_IPOLR GPIO_x_IPOLR 0xF1n6 Interrupt Pending Register IPEND IPR GPIOx_IPEND GPIOx_IPR GPIO_x_IPR 0xF1n7 GPIOx_IEDGE GPIOx_IESR GPIO_x_IESR Interrupt Edge Sensitive Register Push-Pull Output Mode Control Register PS IEDGE IESR PPOUTM PPMODE GPIOx_PPOUTM GPIOx_PPMODE GPIO_x_PPMODE 0xF1n8 0xF1n9 Raw Data Register RDATA RAWDATA GPIOx_RDATA GPIOx_RAWDATA GPIO_x_RAWDATA 0xF1nA Drive Strength Control Register DRIVE DRIVE GPIOx_DRIVE GPIOx_DRIVE GPIO_x_DRIVE 0xF1nB Control Register CTRL LVICONTROL PS_CTRL LVICONTROL LVICTRL 0xF160 Status Register STAT LVISTATUS PS_STAT LVISTATUS LVISR 0xF161 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 121 Peripheral Reference Manual Module Register Name PWM Control Register SIM SPI Legacy Acronym New Acronym Legacy Acronym Processor Expert Acronym Memory Address Start End CTRL PMCTL PWM_CTRL PWM_PMCTL PWM_PMCTL 0xF040 Fault Control Register FCTRL PMFCTL PWM_FCTRL PWM_PMFCTL PWM_PMFCTL 0xF041 Fault Status/Acknowledge Regis. FLTACK PMFSA PWM_FLTACK PWM_PMFSA PWM_PMFSA 0xF042 OUT PMOUT PWM_OUT PWM_PMOUT PWM_PMOUT 0xF043 Counter Register CNTR PMCNT PWM_CNTR PWM_PMCNT PWM_PMCNT 0xF044 Counter Modulo Register CMOD MCM PWM_CMOD PWM_MCM PWM_PWMCM 0xF045 PMVAL0-5 PWM_VAL0-5 Output Control Register SCI New Acronym Data Sheet Value Register 0-5 VAL0-5 Deadtime Register 0-1 DTIM0-1 PMDEADTM0-1 PWM_DTIM0-1 PWM_PMDEADTM0-1 PWM_PMDEADTM0-1 0xF04C 0xF04D PWM_PMVAL0-5 PWM_PWMVAL0-5 0xF046 0xF04B Disable Mapping Register 1-2 DMAP1-2 PMDISMAP1-2 PWM_DMAP1-2 PWM_PMDISMAP1-2 PWM_PMDISMAP1-2 0xF04E 0xF04F Configure Register CNFG PMCFG PWM_CNFG PWM_PMCFG PWM_PMCFG 0xF050 Channel Control Register CCTRL PMCCR PWM_CCTRL PWM_PMCCR PWM_PMCCR 0xF051 Port Register PORT PMPORT PWM_PORT PWM_PMPORT PWM_PMPORT 0xF052 Internal Correction Control Regis. ICCTRL PMICCR PWM_ICCTRL PWM_PMICCR PWM_PMICCR 0xF053 Source Control Register SCTRL PMSRC PWM_SCTRL PWM_PMSRC PWM_PMSRC 0xF054 Baud Rate Register RATE SCIBR SCI_RATE SCI_SCIBR SCI_SCIBR 0xF0B0 Control Register 1 CTRL1 SCICR SCI_CTRL1 SCI_SCICR SCI_SCICR 0xF0B1 Control Register 2 CTRL2 SCICR2 SCI_CTRL2 SCI_SCICR2 SCI_SCICR2 0xF0B2 Status Register STAT SCISR SCI_STAT SCI_SCISR SCI_SCISR 0xF0B3 Data Register DATA SCIDR SCI_DATA SCI_SCIDR SCI_SCIDR 0xF0B4 Control Register N/A N/A SIM_CTRL SIM_CONTROL SIM_CONTROL 0xF140 Reset Status Register N/A N/A SIM_RSTAT SIM_RSTSTS SIM_RSTSTS 0xF141 Software Control Register 0-3 N/A N/A SIM_SWC0-3 SIM_SCR0-3 SIM_SCR0-3 0xF142 0xF145 Most Significant Half JTAG ID N/A N/A SIM_MSHID SIM_MSH_ID SIM_MSH_ID 0xF146 Least Significant Half JTAG ID N/A N/A SIM_LSHID SIM_LSH_ID SIM_LSH_ID Power Control Register N/A N/A SIM_PWR SIM_POWER 0xF147 0xF148 Clock Out Select Register N/A N/A SIM_CLKOUT SIM_CLKOSR SIM_CLKOSR 0xF14A GPIO Peripheral Select Register N/A N/A SIM_GPS SIM_GPS SIM_GPS 0xF14B Peripheral Clock Enable Register N/A N/A SIM_PCE SIM_PCE SIM_PCE 0xF14C I/O Short Address Location High N/A N/A SIM_IOSAHI SIM_ISALH SIM_ISALH 0xF14D I/O Short Address Location Low N/A N/A SIM_IOSALO SIM_ISALL SIM_ISALL 0xF14E 0xF0C0 Status and Control Register SCTRL SPSCR SPI_SCTRL SPI_SPSCR SPI_SCR DSCTRL SPDSR SPI_DSCTRL SPI_SPDSR SPI_DSR 0xF0C1 Data Receive Register DRCV SPDRR SPI_DRCV SPI_SPDRR SPI_DRR 0xF0C2 Data Transmit Register DXMIT SPDTR SPI_DXMIT SPI_SPDTR SPI_DTR 0xF0C3 Data Size and Control Register 56F8013 Technical Data, Rev. 2 122 Freescale Semiconductor Preliminary Electrical Design Considerations Peripheral Reference Manual Module Register Name Data Sheet Processor Expert Acronym Memory Address New Acronym Legacy Acronym Compare Register 1 COMP1 TMRCMP1 TMRn_COMP1 TMRn_CMP1 TMRn_CMP1 0xF0n0 Compare Register 2 COMP2 TMRCMP2 TMRn_COMP2 TMRn_CMP2 TMRn_CMP2 0xF0n1 New Acronym Legacy Acronym Start End n = 0, 1, 2, 3 TMR Capture Register CAPT TMRCAP TMRn_CAPT TMRn_CAP TMRn_CAP 0xF0n2 Load Register LOAD TMRLOAD TMRn_LOAD TMRn_LOAD TMRn_LOAD 0xF0n3 Hold Register HOLD TMRHOLD TMRn_HOLD TMRn_HOLD TMRn_HOLD 0xF0n4 Counter Register CNTR TMRCNTR TMRn_CNTR TMRn_CNTR TMRn_CNTR 0xF0n5 CTRL TMRCTRL TMRn_CTRL TMRn_CTRL TMRn_CTRL 0xF0n6 SCTRL TMRSCR TMRn_SCTRL TMRn_SCR TMRn_SCR 0xF0n7 Control Register Status and Control Register Comparator Load Register 1 CMPLD1 TMRCMPLD1 TMRn_CMPLD1 TMRn_CMPLD1 TMRn_CMPLD1 0xF0n8 Comparator Load Register 2 CMPLD2 TMRCMPLD2 TMRn_CMPLD2 TMRn_CMPLD2 TMRn_CMPLD2 0xF0n9 Comparator Status/Control Register CSCTRL TMRCOMSCR TMRn_CSCTRL TMRn_COMSCR TMRn_COMSCR 0xF0nA 56F8013 Technical Data, Rev. 2 Freescale Semiconductor Preliminary 123 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. This product incorporates SuperFlash® technology licensed from SST. © Freescale Semiconductor, Inc. 2005. All rights reserved. MC56F8013 Rev. 2 4/2005