1/4 Structure Silicon Monolithic Integrated Circuit Product name 4ch HD Video Drivers for DVD BH76071FJ Type Outer dimensions Fig.1 Block diagram Fig.2 SOP-J14(Plastic Mold) Function ● ● ● ● ● Built in 4-outputs video drivers for CVBS, PY, PB and PR Enables two load drivers Composite※1：Built in 6.75MHz LPF Component※1：13.5MHz/30MHz LPF selectable Built in MUTE function ※1 Composite is a name for CVBS, Component is a names for PY, PB and PR. Absolute Maximum Ratings（Ta = 25℃） ※2 Parameter Symbol Ratings Unit Supply voltage V 7.0 V Power dissipation Pd Input voltage VIN -0.3～(VCC+0.3) V Storage temperature Tstg -55 ～ +125 ℃ ※2 820 mW Reduced by 8.2mW/℃ at Ta = 25℃ or higher. When mounting on a (l) 70mm x (w) 70mm x (t) 1.6mm PCB board.(Glass epoxy substrate, 1layer) Operation Range Parameter Symbol Range Unit Supply voltage VCC 4.5 ～ 5.5 V Operating temperature Topr -40 ～ +85 ※ This product is not designed for protection against radioactive rays. REV. A ℃ 2/4 ■ （Unless otherwise noted, Ta＝25℃, VCC=5.0V, RL=150Ω） Electrical characteristics Limits Item Symbol Unit Conditions MIN. TYP. MAX. ICC 32 45 58 mA No signal, 30MHz LPF Voltage gain(CVBS) GV1 5.5 6.0 6.5 dB Vin=1.0Vp-p, f=100kHz Voltage gain(PY, PB,PR) GV2 5.5 6.0 6.5 dB Vin=0.7Vp-p, f=100kHz Maximum output level VOMV 2.6 2.9 － Vp-p THD=1.0% f=10kHz Gf1675 -1.5 -0.5 0.5 dB Vin=1.0Vp-p, f=6.75MHz/100kHz Gf1135 -1.5 -0.5 0.5 dB Vin=0.7Vp-p, f=13.5MHz/100kHz Gf1300 -3.0 -1.0 1.0 dB Gf2675 － -48 -30 dB Gf2135 － -48 -30 dB Gf2300 － -35 -20 dB Vin=0.7Vp-p, f=74.25MHz/100kHz MT － -65 -55 dB Vin=1.0Vp-p, f=4.43MHz Cross talk CT － -65 -55 dB Vin=1.0Vp-p, f=4.43MHz PB/PR_IN Input impedance ZI4 100 150 200 kΩ Input voltage H VthH 2.0 － VCC V High level input voltage Input voltage L VthL 0.0 － 0.8 V Low level input voltage Input impedance Rin 100 150 200 kΩ Between Control pin and GND ＜Whole circuit＞ VCC current ＜VIDEO part＞ 6.75MHz LPF Frequency characteristics 1 13.5MHz LPF Frequency characteristics 1 30MHz LPF Frequency characteristics 1 6.75MHz LPF Frequency characteristics 2 13.5MHz LPF Frequency characteristics 2 30MHz LPF Frequency characteristics 2 MUTE attenuation Vin=0.7Vp-p, f=30MHz/100kHz Vin=1.0Vp-p, f=27MHz/100kHz Vin=0.7Vp-p, f=54MHz/100kHz ＜Control pin (6,7,8PIN)＞ ■ Control Specifications Pin 6pin (MUTE1) 7pin (MUTE2) 8pin (LPF_SEL) Function Composite output(CVBS_OUT) MUTE control ※3 L： MUTE H： ACTIVE Component outputs(PY/PB/PR_OUT) MUTE control ※3 L： MUTE H： ACTIVE LPF selector for Component L： 13.5MHz LPF H： 30MHz LPF ※3 At MUTE mode, each output terminals usually outputs the bias voltage at no signal. REV. A 3/4 ■ Outer Dimentions BH76071FJ Lot No. Fig.1． SOP-J14 ■ Block Diagram CVBS_IN ■ Pin Number / Pin Name CLAMP CVBS_OUT 6.75MHz LPF 1 6dB MUTE1 VREF 2 PY _IN CLAMP 13.5MHz LPF 30MHz LPF SD 5 MUTE1 6 MUTE2 Pin Name No. Pin Name 1 CVBS_IN 8 LPF_SEL 2 VREF 9 PR_OUT 12 3 PY_IN 10 PB_OUT GND 4 PB_IN 11 GND 5 PR_IN 12 PY_OUT 6 MUTE1 13 VCC 7 MUTE2 14 CVBS_OUT VCC PY _OUT 6dB HD 75Ω MUTE2 BIAS 11 4 PR _IN No. 14 13 REF 3 PB _IN 75Ω BIAS 13.5MHz LPF 30MHz LPF 13.5MHz LPF 30MHz LPF SD PB _OUT 6dB HD SD 75Ω MUTE2 6dB HD 75Ω MUTE2 10 PR _OUT 9 LPF_SEL 8 7 ※ : Please use the impedance of the circuit connected to the input terminals(1 and 3pin) at 1kΩ or less. Fig.2． Block diagram REV. A 4/4 ■ Cautions for use (1) Although we are confident recommending the sample application circuit, carefully check their characteristics further when using them. When modifying externally attached component constants before use, determine them so that They have sufficient margins by taking into account variations in externally attached components and the Rohm IC, not only for static characteristics but also including transient characteristics. (2) Absolute maximum ratings If the absolute maximum ratings for applied voltage and/or operation temperature are exceeded, LSI damage may result. Therefore, do not apply voltage or use in a temperature that exceeds these absolute maximum ratings. If it is possible that absolute maximum ratings will be exceeded, use a physical safety device such as a fuse and make sure that no conditions that might exceed the absolute maximum ratings will be applied to the LSI IC. (3) GND potential Regardless of the operation mode, the voltage of the GND pin should be at least the minimum voltage. Actually check whether or not the voltage at each pin, including transient phenomena, is less than the GND pin voltage. (4) Thermal design The thermal design should be done using an ample margin that takes into consideration the allowable dissipation under actual use conditions. Perform thermal design in which there are adequate margins by taking into account the allowable power dissipation in actual states of use. (5) Shorts between pins and mounting errors When mounting LSI ICs onto the circuit board, make sure each LSI’s orientation and position is correct. The ICs may become damaged if they are not mounted correctly when the power is turned on. Similarly, damage may also result if a short occurs, such as when a foreign object is positioned between pins in an IC, or between a pin and power supply or GND connection. (6) Operation in strong electromagnetic field When used within a strong electromagnetic field, evaluate carefully to avoid the risk of operation faults. (7) Place the decoupling capacitor close to 13pin. REV. 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