Central MPSA05 Complementary silicon transistor Datasheet

MPSA05 MPSA06
MPSA55 MPSA56
NPN
PNP
COMPLEMENTARY
SILICON TRANSISTORS
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DESCRIPTION:
The CENTRAL SEMICONDUCTOR MPSA05, MPSA55
series devices are complementary silicon transistors
designed for low power output and medium power
driver applications.
MARKING: FULL PART NUMBER
TO-92 CASE
MAXIMUM RATINGS: (TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
SYMBOL
VCBO
VCEO
VEBO
IC
MPSA05
MPSA55
60
MPSA06
MPSA56
80
UNITS
V
80
V
60
4.0
V
500
mA
PD
PD
625
mW
1.5
W
-65 to +150
°C
Thermal Resistance
TJ, Tstg
ΘJA
200
°C/W
Thermal Resistance
JC
83.3
°C/W
MAX
100
UNITS
nA
100
nA
Power Dissipation
Power Dissipation (TC=25°C)
Operating and Storage Junction Temperature
ELECTRICAL
SYMBOL
ICBO
ICES
CHARACTERISTICS: (TA=25°C)
TEST CONDITIONS
VCB=Rated VCBO
VCE=60V
BVCEO
IC=1.0mA (MPSA05, 55)
60
V
BVCEO
IC=1.0mA (MPSA06, 56)
80
V
BVEBO
IE=100μA
4.0
VCE(SAT)
IC=100mA, IB=10mA
VCE=1.0V, IC=100mA
VBE(ON)
hFE
MIN
V
0.25
V
1.2
V
100
hFE
VCE=1.0V, IC=10mA
VCE=1.0V, IC=100mA
fT
fT
VCE=2.0V, IC=10mA, f=100MHz (NPN)
VCE=1.0V, IC=100mA, f=100MHz (PNP)
100
MHz
50
MHz
100
R7 (26-March 2015)
MPSA05 MPSA06
MPSA55 MPSA56
NPN
PNP
COMPLEMENTARY
SILICON TRANSISTORS
TO-92 CASE - MECHANICAL OUTLINE
LEAD CODE:
1) Emitter
2) Base
3) Collector
MARKING:
FULL PART NUMBER
TYPICAL ELECTRICAL CHARACTERISTICS
R7 (26-March 2015)
w w w. c e n t r a l s e m i . c o m
MPSA05 MPSA06
MPSA55 MPSA56
NPN
PNP
COMPLEMENTARY
SILICON TRANSISTORS
NPN TYPICAL ELECTRICAL CHARACTERISTICS
R7 (26-March 2015)
w w w. c e n t r a l s e m i . c o m
MPSA05 MPSA06
MPSA55 MPSA56
NPN
PNP
COMPLEMENTARY
SILICON TRANSISTORS
PNP TYPICAL ELECTRICAL CHARACTERISTICS
R7 (26-March 2015)
w w w. c e n t r a l s e m i . c o m
MPSA05 MPSA06
MPSA55 MPSA56
NPN
PNP
COMPLEMENTARY
SILICON TRANSISTORS
SERVICES
• Bonded Inventory
• Custom Electrical Screening
• Custom Electrical Characteristic Curves
• SPICE Models
• Custom Packaging
• Package Base Options
• Custom Device Development / Multi Discrete Modules (MDM™)
• Bare Die Available for Hybrid Applications
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R7 (26-March 2015)
w w w. c e n t r a l s e m i . c o m
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