ON NZ9F5V6ST5G Zener voltage regulators 200 mw sod.923 surface mount Datasheet

NZ9F2V4ST5G SERIES
Zener Voltage Regulators
200 mW SOD−923 Surface Mount
This series of Zener diodes is packaged in a SOD−923 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
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Specification Features
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions:
•
•
•
•
1
Cathode
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
Low Body Height: 0.016″ (0.40 mm)
ESD Rating of Class 3 (>16 kV) per Human Body Model
Tight Tolerance VZ
These are Pb−Free Devices
2
Anode
MARKING
DIAGRAM
2
1
SOD−923
CASE 514AB
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
1
X MG
G
2
X = Specific Device Code
M = Month Code
G = Pb−Free Package
(Note: Microdot may be in either location)
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
MAXIMUM RATINGS
Rating
Total Device Dissipation FR−5 Board,
(Note 1) @ TA = 25°C
Derate above 25°C
Thermal Resistance from
Junction−to−Ambient
Junction and Storage Temperature Range
Symbol
Max
Unit
250
2.0
mW
mW/°C
RqJA
500
°C/W
TJ, Tstg
−65 to
+150
°C
PD
NZ9FxxxST5G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
© Semiconductor Components Industries, LLC, 2011
June, 2011 − Rev. 1
Device
1
Package
Shipping†
SOD−923
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
Publication Order Number:
NZ9F2V4S/D
NZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Symbol
I
IF
Parameter
VZ
Reverse Zener Voltage @ IZT
IZT
Reverse Current
ZZT
Maximum Zener Impedance @ IZT
IZK
Reverse Current
ZZK
Maximum Zener Impedance @ IZK
IR
Reverse Leakage Current @ VR
VR
Reverse Voltage
IF
Forward Current
VF
Forward Voltage @ IF
QVZ
Maximum Temperature Coefficient of VZ
C
Max. Capacitance @VR = 0 and f = 1 MHz
VZ VR
IR VF
IZT
Figure 1. Zener Voltage Regulator
100
POWER DISSIPATION (%)
80
60
40
20
0
0
25
50
75
100
125
TEMPERATURE (°C)
Figure 2. Steady State Power Derating
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2
150
V
NZ9F2V4ST5G SERIES
ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types)
Zener Voltage
VZ
ZZT
IZ = IZT
@ 10%
Mod W
Max
ZZK IZ
= 1.0
mA W
Max
IZK
mA
mA
V
Min
Max
CpF Max @
VR = 0
f = 1 MHz
Max
IR @ VR
dVZ/dt (mV/k)
@ IZT1 = 5 mA
Device
Device
Marking
Min
Max
Test
Current
Izt mA
NZ9F2V4ST5G
2*
2.43
2.63
5
100
1000
1
50
1
−3.5
0
210
NZ9F2V7ST5G
3*
2.67
2.91
5
100
1000
1
20
1
−3.5
0
210
NZ9F3V0ST5G
4*
2.94
3.26
5
100
1000
1
10
1
−3.5
0
210
NZ9F3V3ST5G
5*
3.32
3.53
5
100
1000
1
10
1
−3.5
0
210
NZ9F3V6ST5G
6*
3.6
3.85
5
100
1000
1
10
1
−3.5
0
210
NZ9F3V9ST5G
A**
3.89
4.16
5
100
1000
1
5
1
−3.5
−2.5
210
NZ9F4V3ST5G
D**
4.17
4.43
5
100
1000
1
5
1
−3.5
0
210
NZ9F4V7ST5G
E**
4.55
4.75
5
100
800
0.5
2
1
−3.5
0.2
150
NZ9F5V1ST5G
F**
4.989
5.2
5
80
500
0.5
2
1.5
−2.7
1.2
130
NZ9F5V6ST5G
J**
5.49
5.73
5
60
200
0.5
1
2.5
−2.0
2.5
115
NZ9F6V2ST5G
K**
6.06
6.33
5
60
100
0.5
1
3
0.4
3.7
110
NZ9F6V8ST5G
L**
6.65
6.93
5
40
60
0.5
0.5
3.5
1.2
4.5
105
NZ9F7V5ST5G
P**
7.28
7.6
5
30
60
0.5
0.5
4
2.5
5.3
100
NZ9F8V2ST5G
Q**
8.02
8.36
5
30
60
0.5
0.5
5
3.2
6.2
90
NZ9F9V1ST5G
R**
8.85
9.23
5
30
60
0.5
0.5
6
3.8
7
80
NZ9F10VST5G
T**
9.77
10.21
5
30
60
0.5
0.1
7
4.5
8
80
NZ9F11VST5G
V**
10.76
11.22
5
30
60
0.5
0.1
8
5.4
9
80
NZ9F12VST5G
Y**
11.74
12.24
5
30
80
0.5
0.1
9
6
10
80
NZ9F13VST5G
2**
12.91
13.49
5
37
80
0.5
0.1
10
7
11
75
NZ9F15VST5G
3**
14.34
14.98
5
42
80
0.5
0.1
11
9.2
13
70
NZ9F16VST5G
4**
15.85
16.51
5
50
80
0.5
0.1
12
10.4
14
65
NZ9F18VST5G
5**
17.56
18.35
5
50
80
0.5
0.1
14
12.4
16
60
*Rotated 90°.
**Rotated 180°.
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3
NZ9F2V4ST5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AB−01
ISSUE B
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
1
b
2
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
HE
MILLIMETERS
MIN
NOM MAX
0.34
0.37
0.40
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.013
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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NZ9F2V4S/D
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