ON MC74LVX573DT Octal d-type latch with 3-state outputs with 5 v−tolerant input Datasheet

MC74LVX573
Octal D−Type Latch
with 3−State Outputs
With 5 V−Tolerant Inputs
The MC74LVX573 is an advanced high speed CMOS octal latch
with 3−state outputs. The inputs tolerate voltages up to 7.0 V, allowing
the interface of 5.0 V systems to 3.0 V systems.
This 8−bit D−type latch is controlled by a latch enable input and an
output enable input. When the output enable input is high, the eight
outputs are in a high impedance state.
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MARKING
DIAGRAMS
20
Features
•
•
•
•
•
•
•
•
•
High Speed: tPD = 6.4 ns (Typ) at VCC = 3.3 V
Low Power Dissipation: ICC = 4 A (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Balanced Propagation Delays
Low Noise: VOLP = 0.8 V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300 mA
ESD Performance: Human Body Model > 2000 V;
Machine Model > 200 V
Pb−Free Packages are Available*
VCC
O0
O1
O2
O3
O4
O5
O6
O7
LE
20
19
18
17
16
15
14
13
12
11
LVX573
AWLYYWW
SOIC−20
DW SUFFIX
CASE 751D
1
LVX
573
ALYW
TSSOP−20
DT SUFFIX
CASE 948E
LVX573
AWLYWW
SOEIAJ−20
M SUFFIX
CASE 967
1
2
OE
D0
3
4
5
6
7
8
9
10
D1
D2
D3
D4
D5
D6
D7
GND
A
WL, L
Y, YY
W, WW
Figure 1. 20−Lead Pinout (Top View)
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2005
March, 2005 − Rev. 3
1
Publication Order Number:
MC74LVX573/D
MC74LVX573
OE
LE
D0
D1
D2
D3
D4
D5
D6
D7
1
Table 1. PIN NAMES
11
Pins
2
3
4
5
6
7
8
9
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
nLE
D
19
Q
18
Q
17
Q
16
Q
15
Q
14
Q
13
Q
12
Q
Function
OE
LE
D0−D7
O0−O7
O0
O1
Output Enable Input
Latch Enable Input
Data Inputs
3−State Latch Outputs
INPUTS
O2
O3
O4
OUTPUTS
OE
LE
Dn
On
OPERATING MODE
L
L
H
H
H
L
H
L
Transparent (Latch
Disabled); Read Latch
L
L
L
L
h
l
H
L
Latched (Latch Enabled)
Read Latch
L
L
X
NC
Hold; Read Latch
H
L
X
Z
Hold; Disabled Outputs
H
H
H
H
H
L
Z
Z
Transparent (Latch
Disabled); Disabled Outputs
H
H
L
L
h
l
Z
Z
Latched (Latch Enabled);
Disabled Outputs
H = High Voltage Level; h = High Voltage Level One Setup Time
Prior to the Latch Enable High−to−Low Transition; L = Low
Voltage Level; l = Low Voltage Level One Setup Time Prior to the
Latch Enable High−to−Low Transition; NC = No Change, State
Prior to the Latch Enable High−to−Low Transition; X = High or
Low Voltage Level or Transitions are Acceptable; Z = High
Impedance State; For ICC Reasons DO NOT FLOAT Inputs.
O5
O6
O7
Figure 2. Logic Diagram
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MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
–0.5 to +7.0
V
Vin
DC Input Voltage
–0.5 to +7.0
V
Vout
DC Output Voltage
–0.5 to VCC +0.5
V
IIK
Input Diode Current
−20
mA
IOK
Output Diode Current
±20
mA
Iout
DC Output Current, per Pin
±25
mA
ICC
DC Supply Current, VCC and GND Pins
±75
mA
PD
Power Dissipation
180
mW
Tstg
Storage Temperature
–65 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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2
MC74LVX573
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RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
2.0
3.6
V
VCC
DC Supply Voltage
Vin
DC Input Voltage
0
5.5
V
Vout
DC Output Voltage
0
VCC
V
−40
+85
°C
0
100
ns/V
TA
t/V
Operating Temperature, All Package Types
Input Rise and Fall Time
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Test Conditions
TA = 25°C
VCC
V
Min
1.5
2.0
2.4
VIH
High−Level Input Voltage
2.0
3.0
3.6
VIL
Low−Level Input Voltage
2.0
3.0
3.6
VOH
High−Level Output Voltage
(Vin = VIH or VIL)
IOH = −50 A
IOH = −50 A
IOH = −4 mA
2.0
3.0
3.0
VOL
Low−Level Output Voltage
(Vin = VIH or VIL)
IOL = 50 A
IOL = 50 A
IOL = 4 mA
2.0
3.0
3.0
Typ
TA = − 40 to 85°C
Max
Min
1.5
2.0
2.4
0.5
0.8
0.8
1.9
2.9
2.58
Max
2.0
3.0
0.0
0.0
Unit
V
0.5
0.8
0.8
1.9
2.9
2.48
V
V
0.1
0.1
0.36
0.1
0.1
0.44
V
Iin
Input Leakage Current
Vin = 5.5 V or GND
3.6
±0.1
±1.0
A
IOZ
Maximum 3−State Leakage Current
Vin = VIL or VIH
Vout = VCC or GND
3.6
±0.2
5
±2.5
A
ICC
Quiescent Supply Current
Vin = VCC or GND
3.6
4.0
40.0
A
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)
TA = 25°C
Symbol
tPLH,
tPHL
tPLH,
tPHL
tPZL,
tPZH
tPLZ,
tPHZ
tOSHL
tOSLH
Parameter
Propagation Delay
LE to O
Propagation Delay
D to O
Output Enable Time
OE to O
Output Disable Time
OE to O
Output−to−Output Skew
(Note 1)
Test Conditions
Min
TA = − 40 to 85°C
Typ
Max
Min
Max
Unit
ns
VCC = 2.7 V
CL = 15 pF
CL = 50 pF
8.2
10.7
15.6
19.1
1.0
1.0
18.5
22.0
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
6.4
8.9
10.1
13.6
1.0
1.0
12.0
15.5
VCC = 2.7 V
CL = 15 pF
CL = 50 pF
7.6
10.1
14.5
18.0
1.0
1.0
17.5
21.0
VCC = 3.3 ± 0.3 V
CL = 15 pF
CL = 50 pF
5.9
8.4
9.3
12.8
1.0
1.0
11.0
14.5
VCC = 2.7 V
RL = 1 k
CL = 15 pF
CL = 50 pF
7.8
10.3
15.0
18.5
1.0
1.0
18.5
22.0
VCC = 3.3 ± 0.3 V
RL = 1 k
CL = 15 pF
CL = 50 pF
6.1
8.6
9.7
13.2
1.0
1.0
12.0
15.5
VCC = 2.7 V
RL = 1 k
CL = 50 pF
12.1
19.1
1.0
22.0
VCC = 3.3 ± 0.3 V
RL = 1 k
CL = 50 pF
10.1
13.6
1.0
15.5
VCC = 2.7 V
VCC = 3.3 ± 0.3 V
CL = 50 pF
CL = 50 pF
1.5
1.5
1.5
1.5
ns
ns
ns
ns
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter
guaranteed by design.
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3
MC74LVX573
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CAPACITIVE CHARACTERISTICS
TA = 25°C
Symbol
Min
Parameter
TA = − 40 to 85°C
Typ
Max
10
Min
Max
Unit
10
pF
Cin
Input Capacitance
4
Cout
Maximum 3−State Output Capacitance
6
pF
CPD
Power Dissipation Capacitance (Note 2)
29
pF
2. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 8 (per latch). CPD is used to determine the
no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 3.3 V, Measured in SOIC Package)
TA = 25°C
Symbol
Characteristic
Typ
Max
Unit
VOLP
Quiet Output Maximum Dynamic VOL
0.5
0.8
V
VOLV
Quiet Output Minimum Dynamic VOL
−0.5
−0.8
V
VIHD
Minimum High Level Dynamic Input Voltage
2.0
V
VILD
Maximum Low Level Dynamic Input Voltage
0.8
V
TIMING REQUIREMENTS (Input tr = tf = 3.0 ns)
TA = 25°C
Symbol
tw(h)
Parameter
Test Conditions
Typ
TA = − 40 to 85°C
Limit
Limit
Unit
Minimum Pulse Width, LE
VCC = 2.7 V
VCC = 3.3 ± 0.3 V
6.5
5.0
7.5
5.0
ns
tsu
Minimum Setup Time, D to LE
VCC = 2.7 V
VCC = 3.3 ± 0.3 V
5.0
3.5
5.0
3.5
ns
th
Minimum Hold Time, D to LE
VCC = 2.7 V
VCC = 3.3 ± 0.3 V
1.5
1.5
1.5
1.5
ns
ORDERING INFORMATION
Package
Shipping†
MC74LVX573DWR2
SOIC−20
1000 / Tape & Reel
MC74LVX573DWR2G
SOIC−20
(Pb−Free)
1000 / Tape & Reel
MC74LVX573DT
TSSOP−20*
75 Units / Rail
MC74LVX573DTR2
TSSOP−20*
2500 / Tape & Reel
MC74LVX573M
SOEIAJ−20
50 Units / Rail
MC74LVX573MG
SOEIAJ−20
(Pb−Free)
50 Units / Rail
MC74LVX573MEL
SOEIAJ−20
2000 / Tape & Reel
MC74LVX573MELG
SOEIAJ−20
(Pb−Free)
2000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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4
MC74LVX573
SWITCHING WAVEFORMS
tw
VCC
D
50%
tPLH
O
tPHL
LE
VCC
50%
GND
GND
tPHL
tPLH
50% VCC
O
50% VCC
Figure 3.
Figure 4.
VCC
OE
50%
tPZL
O
VALID
HIGH
IMPEDANCE
50% VCC
tPZH
O
GND
tPLZ
tsu
VOL +0.3 V
tPHZ
LE
VOL −0.3 V
50% VCC
VCC
50%
D
th
50%
HIGH
IMPEDANCE
Figure 5.
GND
VCC
GND
Figure 6.
TEST CIRCUITS
TEST POINT
TEST POINT
OUTPUT
DEVICE
UNDER
TEST
OUTPUT
DEVICE
UNDER
TEST
CL*
*Includes all probe and jig capacitance
1 k
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 7. Propagation Delay Test Circuit
Figure 8. 3−State Test Circuit
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5
MC74LVX573
PACKAGE DIMENSIONS
SOIC−20 WB
DW SUFFIX
CASE 751D−05
ISSUE G
A
20
X 45 h
1
10
20X
B
B
0.25
M
T A
B
S
DIM
A
A1
B
C
D
E
e
H
h
L
S
A
L
H
M
E
0.25
10X
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
11
B
M
D
e
18X
SEATING
PLANE
A1
C
T
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE B
20X
0.15 (0.006) T U
2X
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
S
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
K
K1
11
J J1
B
L
−U−
PIN 1
IDENT
SECTION N−N
1
10
0.25 (0.010)
N
0.15 (0.006) T U
S
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN
FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
A
−V−
N
F
DETAIL E
−W−
C
D
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
12.65
12.95
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0
7
G
H
DETAIL E
0.100 (0.004)
−T− SEATING
PLANE
http://onsemi.com
6
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0
8
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
−−−
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0
8
MC74LVX573
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE O
20
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
11
Q1
E HE
1
M
L
10
DETAIL P
Z
D
VIEW P
e
A
c
A1
b
0.13 (0.005)
M
0.10 (0.004)
http://onsemi.com
7
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 0
0.70
0.90
−−−
0.81
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 0
0.028
0.035
−−−
0.032
MC74LVX573
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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