MN101E29 Series Type Internal ROM type MN101E29G MN101EF29G Mask ROM FLASH 128K ROM (byte) 128K+4K 6K RAM (byte) Package (Lead-free) Minimum Instruction Execution Time LQFP100-P-1414, QFP100-P-1818B 50 ns (at 2.2 V to 5.5 V, 20 MHz) *: at internal 2 , 3 , 4 , 5 , 6 , 8 , 10 times oscillation used Interrupts 6 external interrupts. 28 internal interrupts RESET. NMI. External 0 to 4. Timer 0 to 4. Timer 6. Timer 7 (2 systems). Timer 8 (2 systems). Timer 9 (2 systems). Time base. Serial 0 (2 systems). Serial 1 (2 systems). Serial 2 (2 systems). Serial 3 (2 systems). Serial 4. Serial 5. A/D conversion. Automatic transfer (2 systems). Key interrupt Timer Counter 8-bit timer × 7 Timer 0 ..................Timer pulse output. Event count. Added pulse (2-bit) type PWM output. Remote control carrier output. Simple pulse width measurement. Real time output control Timer 1 ..................Timer pulse output. Event count. 16-bit cascade connected (timer 0, 1). Timer synchronous output Timer 2 ..................Timer pulse output. Event count. Added pulse (2-bit) type PWM output. Simple pulse width measurement. 24-bit cascade connected (timer 0, 1, 2). Timer synchronous output. Real time output control Timer 3 ..................Timer pulse output. Event count. Remote control carrier output. 16-bit cascade connected (timer 2, 3). 32-bit cascade connected (timer 0, 1, 2, 3) Timer 4 ..................Timer pulse output. Added pulse (2-bit) type PWM output. Event count. Serial transfer clock output. Simple pulse width measurement Timer 6 ..................8-bit freerun timer. Time base timer Timer A..................Event count. Baud rate timer. Clock output for peripheral function 16-bit timer × 3 Timer 7 ..................Timer pulse output. Event count. High accuracy PWM. High performance IGBT output (cycle/duty continuous variable). Timer synchronous output. Input capture (both edge available). Real time output control. Double buffer compare register Timer 8 ..................Timer pulse output. Event count. High accuracy PWM output (cycle/duty continuous variable). Pulse width measurement. Input capture (both edge available). 32-bit cascade connected (timer 7, 8). 32-bit PWM output. Synchronous output event. Double buffer compare register Timer 9 ..................Timer pulse output. Event count. High accuracy PWM output (cycle/duty continuous variable). Pulse width measurement. Input capture (both edge available). Real time output control. Double buffer compare register Watchdog timer × 1 Serial interface Synchronous type/UART (full-duplex) × 4: Serial 0 to 3 Synchronous type/Multi-master I2C × 1: Serial 4 I2C slave × 1: Serial 5 DMA controller 2 systems. Maximum transfer cycles are 255 Starting factor: External request. Internal event. Software I/O Pins I/O 90 : Common use. Specified pull-up/pull-down resistor available. Input/output selectable (bit unit) A/D converter 10-bit × 16 channels D/A converter 8-bit × 4 channels Display control function LCD: 55 segments × 4 commons (Static, 1/2, 1/3, or 1/4 duty) 1/3 bias Usable if VLC1 ≤ VDD MAD00062FEM MN101E29G, MN101EF29G Special Ports Buzzer output. Inverted buzzer output. Remote control carrier output. High-current drive port ROM Correction Correcting address designation: Up to 7 addresses possible Pin Assignment 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P72, SBT2A, NWE, SEG9 P71, SBI2A, RXD2A, A7, SEG10 P70, SBO2A, TXD2A, A6, SEG11 P67, SBT4A, SCL4A, A5, SEG12 P66, SBO4A, SDA4A, A4, SEG13 P65, SBI4A, A3, SEG14 P64, TM4IOB, A2, SEG15 P63, TM3IOB, A1, SEG16 P62, TM1IOB, A0, SEG17 P61, DA_B, SEG18 P60, SEG19 P50, SBO0A, TXD0A, KEY0, D0, SEG20 P51, SBI0A, RXD0A, KEY1, D1, SEG21 P52, SBT0A, KEY2, D2, SEG22 P53, BUZZERA, KEY3, D3, SEG23 P54, NBUZZERA, KEY4, D4, SEG24 P55, KEY5, D5, SEG25 P56, KEY6, D6, SEG26 P57, KEY7, D7, SEG27 P47, SCL5B, SEG28 P46, SDA5B, SEG29 P45, SBT0B, SEG30 P44, SBI0B, RXD0B, SEG31 P43, SBO0B, TXD0B, SEG32 P42, SBT3B, SEG33 LQFP100-P-1414, QFP100-P-1818B 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 AN0, TM0IOA, RMOUTA, PA0 AN1, TM1IOA, PA1 AN2, TM2IOA, PA2 AN3, TM3IOA, PA3 AN4, TM4IOA, PA4 AN5, TM7IOA, PA5 AN6, TM8IOA, PA6 AN7, TM9IOA, PA7 VREF+ MMOD ATRST NRST, P27 XO, P91 XI, P90 VSS OSC1 OSC2 VDD5 VDD18 P96 DMOD LED0, TM7IOB, SBI1A, RXD1A, P00 LED1, TM8IOB, SBO1A, TXD1A, P01 LED2, TM9IOB, SBT1A, P02 LED3, TM0IOB, TM2IOB, RMOUTB, P03 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 SDA5A, NRE, SEG8, P73 SCL5A, NCS, SEG7, P74 SBO1B, TXD1B, A8, SEG6, P75 SBI1B, RXD1B, A9, SEG5, P76 SBT1B, A10, SEG4, P77 TM9OD0, SDO0, A11, SEG3, P80 TM9OD1, SDO1, A12, SEG2, P81 TM9OD2, SDO2, A13, SEG1, P82 TM9OD3, SDO3, A14, SEG0, P83 TM9OD4, SDO4, A15, COM0, P84 TM9OD5, SDO5, A16, COM1, P85 SDO6, A17, COM2, P86 SDO7, A18, COM3, P87 A19, VLC3, P92 NDK, VLC2, P93 DA_C, VLC1, P94 DA_D, P95 AN15, PB7 AN14, PB6 AN13, PB5 AN12, PB4 AN11, PB3 AN10, PB2 AN9, PB1 AN8, PB0 MAD00062FEM 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P41, SBI3B, RXD3B, SEG34 P40, SBO3B, TXD3B, SEG35 P36, SEG36 P35, SBI4B, SEG37 P34, SBT4B, SCL4B, SEG38 P33, SBO4B, SDA4B, SEG39 P32, SBT2B, SEG40 P31, SBI2B, RXD2B, SEG41 P30, SBO2B, TXD2B, SEG42 P16, TM8IOC, NBUZZERB, SEG43 P15, TM7IOC, BUZZERB, SEG44 P14, TM4IOC, SEG45 P13, TM3IOC, SEG46 P12, TM1IOC, SEG47 P11, TM2IOC, SEG48 P10, TM0IOC, RMOUTC, SEG49 P24, IRQ4, SEG50 P23, IRQ3, SEG51 P22, IRQ2, SEG52 P21, IRQ1, ACZ1, SEG53 P20, IRQ0, ACZ0, SEG54 P07, LED7, DA_A P06, LED6, SBT3A P05, LED5, SBI3A, RXD3A P04, LED4, SBO3A, TXD3A Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805