TI MSP430F1121AIDWR Quadruple bus buffer gate with 3-state output Datasheet

SN74LVC125A
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
www.ti.com
SCAS290O – JANUARY 1993 – REVISED AUGUST 2005
FEATURES
•
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4OE
4A
4Y
3OE
3A
3Y
RGY PACKAGE
(TOP VIEW)
1A
1Y
2OE
2A
2Y
VCC
•
1
1
14
2
13 4OE
3
4
12 4A
5
6
10 3OE
9 3A
11 4Y
7
8
3Y
•
1OE
1A
1Y
2OE
2A
2Y
GND
1OE
•
•
•
D, DB, NS, OR PW PACKAGE
(TOP VIEW)
Operates From 1.65 V to 3.6 V
Specified From –40°C to 85°C
and –40°C to 125°C
Inputs Accept Voltages to 5.5 V
Max tpd of 4.8 ns at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
GND
•
•
DESCRIPTION/ORDERING INFORMATION
This quadruple bus buffer gate is designed for 1.65-V to 3.6-V VCC operation.
The SN74LVC125A features independent line drivers with 3-state outputs. Each output is disabled when the
associated output-enable (OE) input is high.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
QFN – RGY
SN74LVC125ARGYR
Tube of 50
SN74LVC125AD
Reel of 2500
SN74LVC125ADR
Reel of 250
SN74LVC125ADT
SOP – NS
Reel of 2000
SN74LVC125ANSR
LVC125A
SSOP – DB
Reel of 2000
SN74LVC125ADBR
LC125A
Tube of 90
SN74LVC125APW
Reel of 2000
SN74LVC125APWR
Reel of 250
SN74LVC125APWT
TSSOP – PW
(1)
TOP-SIDE MARKING
Reel of 1000
SOIC – D
–40°C to 125°C
ORDERABLE PART NUMBER
LC125A
LVC125A
LC125A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1993–2005, Texas Instruments Incorporated
SN74LVC125A
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
www.ti.com
SCAS290O – JANUARY 1993 – REVISED AUGUST 2005
FUNCTION TABLE
(EACH BUFFER)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1A
2OE
2A
1
2
3OE
3
1Y
3A
4
5
4OE
6
2Y
4A
10
9
8
3Y
13
12
11
4Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
6.5
UNIT
V
range (2)
–0.5
6.5
V
–0.5
VCC + 0.5
VI
Input voltage
VO
Output voltage range (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Package thermal impedance
D package (4)
86
DB package (4)
96
NS package (4)
76
PW package (4)
113
RGY package (5)
Tstg
Storage temperature range
Ptot
Power dissipation
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2
°C/W
47
–65
TA = –40°C to 125°C (6) (7)
V
150
°C
500
mW
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5.
For the D package: above 70°C, the value of Ptot derates linearly with 8 mW/K.
For the DB, NS, and PW packages: above 60°C, the value of Ptot derates linearly with 5.5 mW/K.
SN74LVC125A
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
www.ti.com
SCAS290O – JANUARY 1993 – REVISED AUGUST 2005
Recommended Operating Conditions
(1)
TA = 25°C
VCC
Supply voltage
VIH
High-level
input voltage
Low-level
input voltage
VIL
VI
Input voltage
VO
Output voltage
High-level
output current
IOH
Operating
Data retention only
–40°C to 125°C
MIN
MAX
MIN
MAX
MIN
MAX
1.65
3.6
1.65
3.6
1.65
3.6
1.5
1.5
1.5
0.65 × VCC
0.65 × VCC
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
1.7
1.7
VCC = 2.7 V to 3.6 V
2
2
2
VCC = 1.65 V to 1.95 V
0.35 × VCC
0.35 × VCC
0.35 × VCC
0.7
0.7
0.7
VCC = 2.7 V to 3.6 V
0.8
0.8
0.8
0
5.5
0
5.5
V
0
VCC
0
VCC
0
VCC
V
VCC = 1.65 V
–4
–4
–4
VCC = 2.3 V
–8
–8
–8
VCC = 2.7 V
–12
–12
–12
VCC = 3 V
–24
–24
–24
4
4
4
8
8
8
12
12
12
VCC = 3 V
24
24
24
Input transition rise or fall rate
8
8
8
∆t/∆v
V
5.5
VCC = 2.7 V
Low-level
output current
V
0
VCC = 2.3 V
IOL
UNIT
V
VCC = 2.3 V to 2.7 V
VCC = 1.65 V to 1.95 V
VCC = 1.65 V
(1)
–40°C to 85°C
mA
mA
ns/V
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VOH
TA = 25°C
MIN
TYP
–40°C to 85°C
MAX
1.65 V to 3.6 V VCC – 0.2
MIN
MAX
–40°C to 125°C
MIN
VCC – 0.2
VCC – 0.3
IOH = –4 mA
1.65 V
1.29
1.2
1.05
IOH = –8 mA
2.3 V
1.9
1.7
1.55
2.7 V
2.2
2.2
2.05
2.25
IOH = –12 mA
VOL
VCC
MAX
UNIT
V
3V
2.4
2.4
IOH = –24 mA
3V
2.3
2.2
IOL = 100 µA
1.65 V to 3.6 V
0.1
0.2
IOL = 4 mA
1.65 V
0.24
0.45
0.6
IOL = 8 mA
2.3 V
0.3
0.7
0.75
IOL = 12 mA
2.7 V
0.4
0.4
0.6
IOL = 24 mA
3V
0.55
0.55
0.8
2
0.3
V
II
VI = 5.5 V or GND
3.6 V
±1
±5
±20
µA
IOZ
VO = VCC or GND
3.6 V
±1
±10
±20
µA
ICC
VI = VCC or GND,
3.6 V
1
10
40
µA
500
500
5000
µA
∆ICC
Ci
IO = 0
One input at VCC – 0.6 V,
Other inputs at VCC or
GND
VI = VCC or GND
2.7 V to 3.6 V
3.3 V
5
pF
3
SN74LVC125A
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
www.ti.com
SCAS290O – JANUARY 1993 – REVISED AUGUST 2005
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
ten
tdis
FROM
(INPUT)
TO
(OUTPUT)
A
OE
OE
Y
Y
Y
VCC
TA = 25°C
–40°C to 85°C
TYP
MAX
MIN
MAX
MIN
MAX
1.8 V ± 0.15 V
1
4.5
11.8
1
12.3
1
13.8
2.5 V ± 0.2 V
1
2.7
5.8
1
6.3
1
8.4
2.7 V
1
3
5.3
1
5.5
1
7
3.3 V ± 0.3 V
1
2.5
4.6
1
4.8
1
6
1.8 V ± 0.15 V
1
4.3
13.8
1
14.3
1
15.8
2.5 V ± 0.2 V
1
2.7
6.9
1
7.4
1
9.5
2.7 V
1
3.3
6.4
1
6.6
1
8.5
3.3 V ± 0.3 V
1
2.4
5.2
1
5.4
1
7
1.8 V ± 0.15 V
1
4.3
10.6
1
11.1
1
12.6
2.5 V ± 0.2 V
1
2.2
5.1
1
5.6
1
7.7
2.7 V
1
2.5
4.8
1
5
1
6.5
3.3 V ± 0.3 V
1
2.4
4.4
1
4.6
1
3.3 V ± 0.3 V
tsk(o)
–40°C to 125°C
MIN
1
UNIT
ns
ns
ns
6
1.5
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance per gate
TEST
CONDITIONS
f = 10 MHz
VCC
TYP
1.8 V
7.4
2.5 V
11.3
3.3 V
15
UNIT
pF
SN74LVC125A
QUADRUPLE BUS BUFFER GATE
WITH 3-STATE OUTPUTS
www.ti.com
SCAS290O – JANUARY 1993 – REVISED AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
Output
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VM
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH - V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
D Low Supply Voltage Range 1.8 V to 3.6 V
D Ultralow-Power Consumption
D
D
D
D
D
D Serial Onboard Programming,
− Active Mode: 160 µA at 1 MHz, 2.2 V
− Standby Mode: 0.7 µA
− Off Mode (RAM Retention): 0.1 µA
Wake-Up From Standby Mode in less
than 6 µs
16-Bit RISC Architecture, 125 ns
Instruction Cycle Time
Basic Clock Module Configurations:
− Various Internal Resistors
− Single External Resistor
− 32-kHz Crystal
− High-Frequency Crystal
− Resonator
− External Clock Source
16-Bit Timer_A With Three
Capture/Compare Registers
On-Chip Comparator for Analog Signal
Compare Function or Slope A/D
Conversion
D
D
D
No External Programming Voltage Needed
Programmable Code Protection by
Security Fuse
Family Members Include:
MSP430C1101: 1KB ROM, 128B RAM
MSP430C1111: 2KB ROM, 128B RAM
MSP430C1121: 4KB ROM, 256B RAM
MSP430F1101A: 1KB + 128B Flash Memory
128B RAM
MSP430F1111A: 2KB + 256B Flash Memory
128B RAM
MSP430F1121A: 4KB + 256B Flash Memory
256B RAM
Available in a 20-Pin Plastic Small-Outline
Wide Body (SOWB) Package, 20-Pin Plastic
Small-Outline Thin Package, 20-Pin TVSOP
(F11x1A only) and 24-Pin QFN
For Complete Module Descriptions, Refer
to the MSP430x1xx Family User’s Guide,
Literature Number SLAU049
description
The Texas Instruments MSP430 family of ultralow power microcontrollers consist of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes is optimized to achieve extended battery life in portable measurement applications. The device features
a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that attribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 6µs.
The MSP430x11x1(A) series is an ultralow-power mixed signal microcontroller with a built-in 16-bit timer,
versatile analog comparator and fourteen I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and then
process the data for display or for transmission to a host system. Stand alone RF sensor front end is another
area of application. The I/O port inputs provide single slope A/D conversion capability on resistive sensors.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
−40°C to 85°C
PLASTIC
20-PIN SOWB
(DW)
PLASTIC
20-PIN TSSOP
(PW)
MSP430C1101IDW
MSP430C1111IDW
MSP430C1121IDW
MSP430F1101AIDW
MSP430F1111AIDW
MSP430F1121AIDW
MSP430C1101IPW
MSP430C1111IPW
MSP430C1121IPW
MSP430F1101AIPW
MSP430F1111AIPW
MSP430F1121AIPW
PLASTIC
20-PIN TVSOP
(DGV)
MSP430F1101AIDGV
MSP430F1111AIDGV
MSP430F1121AIDGV
PLASTIC
24-PIN QFN
(RGE)
MSP430C1101IRGE
MSP430C1111IRGE
MSP430C1121IRGE
MSP430F1101AIRGE
MSP430F1111AIRGE
MSP430F1121AIRGE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999 − 2004 Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $ ! !#$!
!(( +,) (#" %"$!!- ($! $"$!!', "'#($
$!- '' %$$!)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
RGE PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI/TCLK
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/CA1/TA2
P2.3/CA0/TA1
NC
VSS
XOUT
XIN
RST/NMI
P2.0/ACLK
1 23 22 21 20
2
3
4
5
6 8 9 10 11
18
17
16
15
14
13
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.1/INCLK
P2.2/CAOUT/TA0
NC
P2.3/CA0/TA1
P2.4/CA1/TA2
NC
TEST
VCC
P2.5/Rosc
VSS
XOUT
XIN
RST/NMI
P2.0/ACLK
P2.1/INCLK
P2.2/CAOUT/TA0
P2.5/ROSC
VCC
TEST
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI/TCLK
NC
DW, PW, or DGV PACKAGE
(TOP VIEW)
Note: NC pins not internally connected
Power Pad connection to VSS recommended
functional block diagram
XIN
XOUT
VCC
P1/JTAG
RST/NMI
VSS
8
ROSC
Oscillator
System
Clock
ACLK
Flash/ROM
4KB
RAM
256B
2KB
128B
1KB
128B
SMCLK
I/O Port 1
8 I/Os, with
Interrupt
Capability
POR
P2
6
I/O Port 2
6 I/Os, with
Interrupt
Capability
MCLK
Test
MAB,
4 Bit
MAB,MAB,
16 Bit16-Bit
JTAG
CPU
TEST
MCB
Emulation
Module
Incl. 16 Reg.
Bus
Conv
MDB,
16-Bit
MDB,
16 Bit
Watchdog
Timer
Timer_A3
Comparator
A
3 CC Reg
15/16-Bit
2
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MDB, 8 Bit
• DALLAS, TEXAS 75265
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
Terminal Functions
TERMINAL
DW, PW, or DGV
RGE
NO.
NO.
P1.0/TACLK
13
13
I/O
General-purpose digital I/O pin/Timer_A, clock signal TACLK input
P1.1/TA0
14
14
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0A input,
compare: Out0 output/BSL transmit
P1.2/TA1
15
15
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI1A input,
compare: Out1 output
P1.3/TA2
16
16
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI2A input,
compare: Out2 output
P1.4/SMCLK/TCK
17
17
I/O
General-purpose digital I/O pin/SMCLK signal output/test clock, input
terminal for device programming and test
P1.5/TA0/TMS
18
18
I/O
General-purpose digital I/O pin/Timer_A, compare: Out0 output/test
mode select, input terminal for device programming and test
P1.6/TA1/TDI/TCLK
19
20
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output/test
data input or test clock input
P1.7/TA2/TDO/TDI†
20
21
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output/test
data output terminal or data input during programming
P2.0/ACLK
8
6
I/O
General-purpose digital I/O pin/ACLK output
P2.1/INCLK
9
7
I/O
General-purpose digital I/O pin/Timer_A, clock signal at INCLK
P2.2/CAOUT/TA0
10
8
I/O
General-purpose digital I/O pin/Timer_A, capture: CCI0B input/
comparator_A, output/BSL receive
P2.3/CA0/TA1
11
10
I/O
General-purpose digital I/O pin/Timer_A, compare: Out1 output/
comparator_A, input
P2.4/CA1/TA2
12
11
I/O
General-purpose digital I/O pin/Timer_A, compare: Out2 output/
comparator_A, input
P2.5/ROSC
3
24
I/O
General-purpose digital I/O pin/input for external resistor that defines
the DCO nominal frequency
RST/NMI
7
5
I
Reset or nonmaskable interrupt input
TEST
1
22
I
Selects test mode for JTAG pins on Port1. The device protection fuse
is connected to TEST.
VCC
VSS
2
23
4
2
XIN
6
4
XOUT
5
3
NAME
QFN Pad
NA
Package Pad
† TDO or TDI is selected via JTAG instruction.
DESCRIPTION
I/O
Supply voltage
Ground reference
I
Input terminal of crystal oscillator
O
Output terminal of crystal oscillator
NA
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• DALLAS, TEXAS 75265
3
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
short-form description
CPU
The MSP430 CPU has a 16-bit RISC architecture
that is highly transparent to the application. All
operations, other than program-flow instructions,
are performed as register operations in
conjunction with seven addressing modes for
source operand and four addressing modes for
destination operand.
Program Counter
PC/R0
Stack Pointer
SP/R1
SR/CG1/R2
Status Register
Constant Generator
The CPU is integrated with 16 registers that
provide reduced instruction execution time. The
register-to-register operation execution time is
one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as
program counter, stack pointer, status register,
and constant generator respectively. The
remaining registers are general-purpose
registers.
Peripherals are connected to the CPU using data,
address, and control buses, and can be handled
with all instructions.
instruction set
The instruction set consists of 51 instructions with
three formats and seven address modes. Each
instruction can operate on word and byte data.
Table 1 shows examples of the three types of
instruction formats; the address modes are listed
in Table 2.
CG2/R3
General-Purpose Register
R4
General-Purpose Register
R5
General-Purpose Register
R6
General-Purpose Register
R7
General-Purpose Register
R8
General-Purpose Register
R9
General-Purpose Register
R10
General-Purpose Register
R11
General-Purpose Register
R12
General-Purpose Register
R13
General-Purpose Register
R14
General-Purpose Register
R15
Table 1. Instruction Word Formats
Dual operands, source-destination
e.g. ADD R4,R5
R4 + R5 −−−> R5
Single operands, destination only
e.g. CALL
PC −−>(TOS), R8−−> PC
Relative jump, un/conditional
e.g. JNE
R8
Jump-on-equal bit = 0
Table 2. Address Mode Descriptions
ADDRESS MODE
S D
Register
F F
MOV Rs,Rd
MOV R10,R11
Indexed
F F
MOV X(Rn),Y(Rm)
MOV 2(R5),6(R6)
Symbolic (PC relative)
F F
MOV EDE,TONI
M(EDE) −−> M(TONI)
Absolute
F F
MOV &MEM,&TCDAT
M(MEM) −−> M(TCDAT)
EXAMPLE
OPERATION
R10
−−> R11
M(2+R5)−−> M(6+R6)
Indirect
F
MOV @Rn,Y(Rm)
MOV @R10,Tab(R6)
M(R10) −−> M(Tab+R6)
Indirect
autoincrement
F
MOV @Rn+,Rm
MOV @R10+,R11
M(R10) −−> R11
R10 + 2−−> R10
F
MOV #X,TONI
MOV #45,TONI
Immediate
NOTE: S = source
4
SYNTAX
D = destination
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#45
−−> M(TONI)
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
operating modes
The MSP430 has one active mode and five software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the five low-power modes, service the request and restore back to
the low-power mode on return from the interrupt program.
The following six operating modes can be configured by software:
D Active mode AM;
−
All clocks are active
D Low-power mode 0 (LPM0);
−
CPU is disabled
ACLK and SMCLK remain active. MCLK is disabled
D Low-power mode 1 (LPM1);
−
CPU is disabled
ACLK and SMCLK remain active. MCLK is disabled
DCO’s dc-generator is disabled if DCO not used in active mode
D Low-power mode 2 (LPM2);
−
CPU is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator remains enabled
ACLK remains active
D Low-power mode 3 (LPM3);
−
CPU is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator is disabled
ACLK remains active
D Low-power mode 4 (LPM4);
−
CPU is disabled
ACLK is disabled
MCLK and SMCLK are disabled
DCO’s dc-generator is disabled
Crystal oscillator is stopped
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SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the address range of 0FFFFh−0FFE0h.
The vector contains the 16-bit address of the appropriate interrupt handler instruction sequence.
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM INTERRUPT
WORD ADDRESS
PRIORITY
Power-up
External reset
Watchdog
Flash Memory
WDTIFG
KEYV
(see Note 1)
Reset
0FFFEh
15, highest
NMI
Oscillator fault
Flash memory access violation
NMIIFG
OFIFG
ACCVIFG
(see Notes 1 & 4)
(non)-maskable,
(non)-maskable,
(non)-maskable
0FFFCh
14
0FFFAh
13
0FFF8h
12
Comparator_A
CAIFG
maskable
0FFF6h
11
Watchdog Timer
WDTIFG
maskable
0FFF4h
10
Timer_A3
TACCR0 CCIFG (see Note 2)
maskable
0FFF2h
9
Timer_A3
TACCR1 CCIFG.
TACCR2 CCIFG
TAIFG (see Notes 1 & 2)
maskable
0FFF0h
8
7
6
0FFEAh
5
0FFE8h
4
I/O Port P2
(eight flags; see Note 3)
P2IFG.0 to P2IFG.7
(see Notes 1 & 2)
maskable
0FFE6h
3
I/O Port P1
(eight flags)
P1IFG.0 to P1IFG.7
(see Notes 1 & 2)
maskable
0FFE4h
2
0FFE2h
1
0FFE0h
0, lowest
NOTES: 1.
2.
3.
4.
6
0FFEEh
0FFECh
Multiple source flags
Interrupt flags are located in the module
There are eight Port P2 interrupt flags, but only six Port P2 I/O pins (P2.0−5) implemented on the ’C11x1 and ’F11x1A devices.
(non)-maskable: the individual interrupt-enable bit can disable an interrupt event, but the general interrupt enable cannot.
Nonmaskable: neither the individual nor the general interrupt-enable bit will disable an interrupt event.
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special function registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
not allocated to a functional purpose are not physically present in the device. Simple software access is provided
with this arrangement.
interrupt enable 1 and 2
Address
7
6
0h
5
4
ACCVIE
NMIIE
rw-0
WDTIE:
OFIE:
NMIIE:
ACCVIE:
Address
3
2
1
OFIE
rw-0
0
WDTIE
rw-0
rw-0
Watchdog Timer interrupt enable. Inactive if watchdog mode is selected. Active if Watchdog Timer
is configured in interval timer mode.
Oscillator fault enable
(Non)maskable interrupt enable
Flash access violation interrupt enable
7
6
5
6
5
4
3
2
4
3
2
1
0
01h
interrupt flag register 1 and 2
Address
7
02h
NMIIFG
rw-0
WDTIFG:
OFIFG:
NMIIFG:
Address
1
OFIFG
rw-1
0
WDTIFG
rw-(0)
Set on Watchdog Timer overflow (in watchdog mode) or security key violation.
Reset on VCC power-up or a reset condition at RST/NMI pin in reset mode.
Flag set on oscillator fault
Set via RST/NMI-pin
7
6
5
4
3
2
1
0
03h
Legend
rw:
rw-0,1:
rw-(0,1):
Bit can be read and written.
Bit can be read and written. It is Reset or Set by PUC.
Bit can be read and written. It is Reset or Set by POR.
SFR bit is not present in device
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memory organization
MSP430C1101
MSP430C1111
MSP430C1121
Memory
Main: interrupt vector
Main: code memory
Size
ROM
ROM
1KB ROM
0FFFFh−0FFE0h
0FFFFh−0FC00h
2KB ROM
0FFFFh−0FFE0h
0FFFFh−0F800h
4KB ROM
0FFFFh−0FFE0h
0FFFFh−0F000h
Information memory
Size
Flash
Not applicable
Not applicable
Not applicable
Boot memory
Size
ROM
Not applicable
Not applicable
Not applicable
Size
128 Byte
027Fh − 0200h
128 Byte
027Fh − 0200h
256 Byte
02FFh − 0200h
16-bit
8-bit
8-bit SFR
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
RAM
Peripherals
MSP430F1101A
MSP430F1111A
MSP430F1121A
Memory
Main: interrupt vector
Main: code memory
Size
Flash
Flash
1KB Flash
0FFFFh−0FFE0h
0FFFFh−0FC00h
2KB Flash
0FFFFh−0FFE0h
0FFFFh−0F800h
4KB Flash
0FFFFh−0FFE0h
0FFFFh−0F000h
Information memory
Size
Flash
128 Byte
010FFh − 01080h
256 Byte
010FFh − 01000h
256 Byte
010FFh − 01000h
Boot memory
Size
ROM
1KB
0FFFh − 0C00h
1KB
0FFFh − 0C00h
1KB
0FFFh − 0C00h
Size
128 Byte
027Fh − 0200h
128 Byte
027Fh − 0200h
256 Byte
02FFh − 0200h
16-bit
8-bit
8-bit SFR
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
01FFh − 0100h
0FFh − 010h
0Fh − 00h
RAM
Peripherals
bootstrap loader (BSL)
The MSP430 bootstrap loader (BSL) enables users to program the flash memory or RAM using a UART serial
interface. Access to the MSP430 memory via the BSL is protected by user-defined password. For complete
description of the features of the BSL and its implementation, see the Application report Features of the MSP430
Bootstrap Loader, Literature Number SLAA089.
8
BSL Function
DW, PW & DGV Package Pins
RGE Package Pins
Data Transmit
14 - P1.1
14 - P1.1
Data Receive
10 - P2.2
8 - P2.2
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flash memory
The flash memory can be programmed via the JTAG port, the bootstrap loader, or in-system by the CPU. The
CPU can perform single-byte and single-word writes to the flash memory. Features of the flash memory include:
D Flash memory has n segments of main memory and two segments of information memory (A and B) of 128
bytes each. Each segment in main memory is 512 bytes in size.
D Segments 0 to n may be erased in one step, or each segment may be individually erased.
D Segments A and B can be erased individually, or as a group with segments 0−n.
Segments A and B are also called information memory.
D New devices may have some bytes programmed in the information memory (needed for test during
manufacturing). The user should perform an erase of the information memory prior to the first use.
0FFFFh
0FE00h
Segment0 w/
Interrupt Vectors
0FDFFh
0FC00h
Segment1
0FBFFh
0FA00h
Segment2
0F9FFh
0F800h
Segment3
0F7FFh
0F600h
Segment4
0F5FFh
0F400h
Segment5
0F3FFh
0F200h
Segment6
0F1FFh
0F000h
Segment7
010FFh
01080h
SegmentA
0107Fh
01000h
SegmentB
Flash Main Memory
Information
Memory
NOTE: All segments not implemented on all devices.
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peripherals
Peripherals are connected to the CPU through data, address, and control busses and can be handled using
all instructions. For complete module descriptions, refer to the MSP430x1xx Family User’s Guide, literature
number SLAU049.
oscillator and system clock
The clock system is supported by the basic clock module that includes support for a 32768-Hz watch crystal
oscillator, an internal digitally-controlled oscillator (DCO) and a high frequency crystal oscillator. The basic clock
module is designed to meet the requirements of both low system cost and low-power consumption. The internal
DCO provides a fast turn-on clock source and stabilizes in less than 6 µs. The basic clock module provides the
following clock signals:
D Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal or a high frequency crystal.
D Main clock (MCLK), the system clock used by the CPU.
D Sub-Main clock (SMCLK), the sub-system clock used by the peripheral modules.
digital I/O
There are two 8-bit I/O ports implemented—ports P1 and P2 (only six P2 I/O signals are available on external
pins):
D
D
D
D
All individual I/O bits are independently programmable.
Any combination of input, output, and interrupt conditions is possible.
Edge-selectable interrupt input capability for all the eight bits of port P1 and six bits of port P2.
Read/write access to port-control registers is supported by all instructions.
NOTE:
Six bits of port P2, P2.0 to P2.5, are available on external pins − but all control and data bits for port
P2 are implemented.
watchdog timer
The primary function of the watchdog timer (WDT) module is to perform a controlled system restart after a
software problem occurs. If the selected time interval expires, a system reset is generated. If the watchdog
function is not needed in an application, the module can be configured as an interval timer and can generate
interrupts at selected time intervals.
comparator_A
The primary function of the comparator_A module is to support precision slope analog-to-digital conversions,
battery-voltage supervision, and monitoring of external analog signals.
10
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electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
Schmitt-trigger inputs − Ports P1 and P2; (P1.0 to P1.7, P2.0 to P2.5)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT−
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ − VIT−)
MIN
TYP
MAX
VCC = 2.2 V
VCC = 3 V
1.1
1.5
1.5
1.9
VCC = 2.2 V
VCC = 3 V
VCC = 2.2 V
0.4
0.9
0.9
1.3
0.3
1.1
VCC = 3 V
0.5
1
UNIT
V
V
V
standard inputs − RST/NMI, JTAG: TCK, TMS, TDI/TCLK
PARAMETER
VIL
VIH
TEST CONDITIONS
Low-level input voltage
VCC = 2.2 V / 3 V
High-level input voltage
MIN
TYP
VSS
0.8×VCC
MAX
VSS+0.6
VCC
UNIT
V
V
inputs Px.x, TAx
PARAMETER
t(int)
External interrupt timing
TEST CONDITIONS
VCC
2.2 V/3 V
Port P1, P2: P1.x to P2.x, External trigger signal
for the interrupt flag, (see Note 1)
t(cap)
Timer_A, capture timing
TA0, TA1, TA2
f(TAext)
Timer_A clock frequency
externally applied to pin
TACLK, INCLK t(H) = t(L)
f(TAint)
Timer_A clock frequency
SMCLK or ACLK signal selected
MIN
TYP
MAX
1.5
2.2 V
62
3V
50
2.2 V
62
3V
50
UNIT
cycle
ns
ns
2.2 V
8
3V
10
2.2 V
8
3V
10
MHz
MHz
NOTES: 1. The external signal sets the interrupt flag every time the minimum t(int) cycle and time parameters are met. It may be set even with
trigger signals shorter than t(int). Both the cycle and timing specifications must be met to ensure the flag is set. t(int) is measured in
MCLK cycles.
leakage current
PARAMETER
Ilkg(Px.x)
High-impedance leakage current
TEST CONDITIONS
MIN
TYP
MAX
Port P1: P1.x, 0 ≤ × ≤ 7
(see Notes 1, 2)
VCC = 2.2 V/3 V,
±50
Port P2: P2.x, 0 ≤ × ≤ 5
(see Notes 1, 2)
VCC = 2.2 V/3 V,
±50
UNIT
nA
NOTES: 1. The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
2. The leakage of the digital port pins is measured individually. The port pin must be selected for input and there must be no optional
pullup or pulldown resistor.
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SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
outputs − Ports P1 and P2; (P1.0 to P1.7, P2.0 to P2.5)
PARAMETER
VOH
VOH
VOL
TEST CONDITIONS
High-level output voltage
Port 1 and Port 2 (C11x1)
Port 1 (F11x1A)
High-level output voltage
Port 2 (F11x1A)
Low-level output voltage
Port 1 and Port 2 (C11x1,
F11x1A)
I(OHmax) = −1.5 mA
I(OHmax) = −6 mA
VCC = 2.2 V
I(OHmax) = −1.5 mA
I(OHmax) = −6 mA
VCC = 3 V
I(OHmax) = −1 mA
I(OHmax) = −3.4 mA
VCC = 2.2 V
I(OHmax) = −1 mA
I(OHmax) = −3.4 mA
VCC = 3 V
I(OLmax) = 1.5 mA
I(OLmax) = 6 mA
VCC = 2.2 V
MIN
See Note 1
MAX
VCC
VCC
VCC−0.25
VCC−0.6
VCC
VCC
VCC−0.25
VCC−0.6
VCC
VCC
VCC−0.25
VCC−0.6
VCC
VCC
See Note 2
VSS
VSS
VSS+0.25
VSS+0.6
See Note 1
VSS
VSS+0.25
See Note 2
See Note 1
See Note 2
See Note 3
See Note 3
See Note 3
See Note 3
See Note 1
I(OLmax) = 1.5 mA
TYP
VCC−0.25
VCC−0.6
UNIT
V
V
V
VCC = 3 V
I(OLmax) = 6 mA
See Note 2
VSS
VSS+0.6
NOTES: 1. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±12 mA to hold the maximum voltage
drop specified.
2. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±48 mA to hold the maximum voltage
drop specified.
3. One output loaded at a time.
output frequency
PARAMETER
fP20
fTAx
Output frequency
TEST CONDITIONS
2.2 V/3 V
TA0, TA1, TA2, CL = 20 pF
Internal clock source, SMCLK signal applied (see Note 1)
2.2 V/3 V
P1.4/SMCLK,
CL = 20 pF
tXdc
VCC
P2.0/ACLK, CL = 20 pF
Duty cycle of O/P
frequency
fSMCLK = fLFXT1 = fXT1
fSMCLK = fLFXT1 = fLF
fSMCLK = fLFXT1/n
fSMCLK = fDCOCLK
P2.0/ACLK,
CL = 20 pF
2.2 V/3 V
fP20 = fLFXT1 = fXT1
fP20 = fLFXT1 = fLF
fP20 = fLFXT1/n
TA0, TA1, TA2, CL = 20 pF, duty cycle = 50%
2.2 V/3 V
MIN
dc
fSystem
40%
60%
35%
65%
50%−
15 ns
50%
50%+
15 ns
50%−
15 ns
50%
50%+
15 ns
40%
2.2 V/3 V
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MAX
UNIT
fSystem
MHz
60%
30%
tTAdc
2.2 V/3 V
NOTE 1: The limits of the system clock MCLK has to be met. MCLK and SMCLK can have different frequencies.
16
TYP
70%
50%
0
±50
ns
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
outputs − Ports P1 and P2 (continued)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
25
TA = 25°C
VCC = 2.2 V
P1.0
14
I OL − Typical Low-Level Output Current − mA
I OL − Typical Low-Level Output Current − mA
16
12
TA = 85°C
10
8
6
4
2
0
0.0
0.5
1.0
1.5
2.0
VCC = 3 V
P1.0
20
TA = 85°C
15
10
5
0
0.0
2.5
TA = 25°C
0.5
VOL − Low-Level Output Voltage − V
1.0
Figure 2
I OH − Typical High-Level Output Current − mA
I OH − Typical High-Level Output Current − mA
3.0
3.5
0
VCC = 2.2 V
P1.0
−4
−6
−8
−10
TA = 85°C
−12
TA = 25°C
0.5
2.5
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
−14
0.0
2.0
Figure 3
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
−2
1.5
VOL − Low-Level Output Voltage − V
1.0
1.5
2.0
2.5
VOH − High-Level Output Voltage − V
VCC = 3 V
P1.0
−5
−10
−15
−20
TA = 85°C
−25
−30
0.0
TA = 25°C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
VOH − High-Level Output Voltage − V
Figure 5
Figure 4
NOTE: One output loaded at a time.
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SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
optional resistors, individually programmable with ROM code (see Note 1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
R(opt1)
2.5
5
10
kΩ
R(opt2)
3.8
7.7
15
kΩ
R(opt3)
7.6
15
31
kΩ
R(opt4)
11.5
23
46
kΩ
R(opt5)
23
45
90
kΩ
R(opt6)
Resistors, individually programmable with ROM code, all port pins,
values applicable for pulldown and pullup
VCC = 2.2 V/3 V
46
90
180
kΩ
R(opt7)
70
140
280
kΩ
R(opt8)
115
230
460
kΩ
R(opt9)
160
320
640
kΩ
R(opt10)
205
420
830
kΩ
MAX
UNIT
NOTE 1: Optional resistors Roptx for pulldown or pullup are not available in standard flash memory device MSP430F11x1A.
wake-up from lower power modes (LPMx)
PARAMETER
TEST CONDITIONS
MIN
TYP
t(LPM0)
t(LPM2)
VCC = 2.2 V/3 V
VCC = 2.2 V/3 V
f(MCLK) = 1 MHz,
f(MCLK) = 2 MHz,
VCC = 2.2 V/3 V
VCC = 2.2 V/3 V
6
t(LPM3)
f(MCLK) = 3 MHz,
VCC = 2.2 V/3 V
6
f(MCLK) = 1 MHz,
f(MCLK) = 2 MHz,
VCC = 2.2 V/3 V
VCC = 2.2 V/3 V
6
f(MCLK) = 3 MHz,
NOTE 1: Parameter applicable only if DCOCLK is used for MCLK.
VCC = 2.2 V/3 V
6
Delay time (see Note 1)
t(LPM4)
100
ns
100
6
6
µs
µs
RAM
PARAMETER
MIN
NOM
MAX
UNIT
V(RAMh)
CPU halted (see Note 1)
1.6
V
NOTE 1: This parameter defines the minimum supply voltage VCC when the data in the program memory RAM remains unchanged. No program
execution should happen during this supply voltage condition.
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electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
Comparator_A (see Note 1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
VCC = 2.2 V
VCC = 3 V
25
40
45
60
I(DD)
CAON=1, CARSEL=0, CAREF=0
CAON=1, CARSEL=0,
CAREF=1/2/3, no load at
P2.3/CA0/TA1 and P2.4/CA1/TA2
VCC = 2.2 V
30
50
I(Refladder/RefDiode)
VCC = 3 V
45
71
CAON =1
VCC = 2.2 V/3 V
0
PCA0=1, CARSEL=1, CAREF=1,
No load at P2.3/CA0/TA1 and
P2.4/CA1/TA2
VCC = 2.2 V/3 V
0.23
0.24
0.25
PCA0=1, CARSEL=1, CAREF=2,
No load at P2.3/CA0/TA1 and
P2.4/CA1/TA2
VCC = 2.2 V/3 V
0.47
0.48
0.5
VCC = 2.2 V
390
480
540
VCC = 3 V
400
490
550
−30
V(IC)
V(Ref025)
V(Ref050)
Common-mode input
voltage
Voltage @ 0.25 V
V
node
CC
Voltage @ 0.5V
V
CC
CC
node
CC
VCC−1
V(RefVT)
(see Figure 6 and Figure 7)
V(offset)
Vhys
Offset voltage
PCA0=1, CARSEL=1, CAREF=3,
No load at P2.3/CA0/TA1 and
P2.4/CA1/TA2, TA = 85°C
See Note 2
Input hysteresis
CAON=1
VCC = 2.2 V/3 V
VCC = 2.2 V/3 V
0
TA = 25
25°C,
C, Overdrive 10 mV,
Without filter: CAF=0
VCC = 2.2 V
VCC = 3 V
160
90
150
240
TA = 25
25°C,
C, Overdrive 10 mV,
With filter: CAF=1
VCC = 2.2 V
VCC = 3 V
1.4
1.9
3.4
0.9
1.5
2.6
25°C,
TA = 25
C, Overdrive 10 mV,
Without filter: CAF=0
VCC = 2.2 V
VCC = 3 V
130
210
300
80
150
240
TA = 25
25°C,
C, Overdrive 10 mV,
With filter: CAF=1
VCC = 2.2 V
VCC = 3 V
1.4
1.9
3.4
0.9
1.5
2.6
t(response LH)
t(response HL)
UNIT
µA
µA
V
mV
30
mV
0.7
1.4
mV
210
300
ns
µs
ns
µs
NOTES: 1. The leakage current for the Comparator_A terminals is identical to Ilkg(Px.x) specification.
2. The input offset voltage can be cancelled by using the CAEX bit to invert the Comparator_A inputs on successive measurements.
The two successive measurements are then summed together.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
650
650
VCC = 2.2 V
V(REFVT) − Reference Volts −mV
V(REFVT) − Reference Volts −mV
VCC = 3 V
600
Typical
550
500
450
400
−45
−25
−5
15
35
55
75
600
Typical
550
500
450
400
−45
95
−25
−5
15
35
55
TA − Free-Air Temperature − °C
0 V VCC
1
CAF
CAON
Low Pass Filter
V+
V−
+
_
0
0
1
1
To Internal
Modules
CAOUT
Set CAIFG
Flag
τ ≈ 2.0 µs
Figure 8. Block Diagram of Comparator_A Module
VCAOUT
Overdrive
V−
400 mV
V+
t(response)
Figure 9. Overdrive Definition
20
95
Figure 7. V(RefVT) vs Temperature, VCC = 2.2 V
Figure 6. V(RefVT) vs Temperature, VCC = 3 V
0
75
TA − Free-Air Temperature − °C
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
PUC/POR
PARAMETER
TEST CONDITIONS
t(POR_Delay)
Internal time delay to release POR
VPOR
VCC threshold at which POR
release delay time begins
(see Note 1)
TA = −40°C
TA = 25°C
VCC threshold required to
generate a POR (see Note 2)
VCC |dV/dt| ≥ 1V/ms
V(min)
MIN
VCC = 2.2 V/3 V
TA = 85°C
TYP
MAX
UNIT
150
250
µs
1.4
1.8
V
1.1
1.5
V
0.8
1.2
V
0.2
V
t(reset)
RST/NMI low time for PUC/POR
Reset is accepted internally
2
µs
NOTES: 1. VCC rise time dV/dt ≥ 1V/ms.
2. When driving VCC low in order to generate a POR condition, VCC should be driven to 200mV or lower with a dV/dt equal to or less
than −1V/ms. The corresponding rising VCC must also meet the dV/dt requirement equal to or greater than +1V/ms.
V
VCC
V
POR
No POR
POR
V
(min)
POR
t
Figure 10. Power-On Reset (POR) vs Supply Voltage
2.0
1.8
1.8
V POR [V]
1.6
1.4
1.2
1.5
Max
1.2
1.4
1.0
Min
1.1
0.8
0.8
0.6
0.4
0.2
25°C
0
−40
−20
0
20
40
60
80
Temperature [°C]
Figure 11. VPOR vs Temperature
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
21
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
DCO
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
0.12
0.15
Rsel = 0, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
VCC = 2.2 V
VCC = 3 V
0.08
f(DCO03)
0.08
0.13
0.16
0.19
0.23
Rsel = 1, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
VCC = 2.2 V
VCC = 3 V
0.14
f(DCO13)
0.14
0.18
0.22
f(DCO23)
Rsel = 2, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
VCC = 2.2 V
VCC = 3 V
0.22
0.30
0.36
0.22
0.28
0.34
f(DCO33)
Rsel = 3, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
VCC = 2.2 V
VCC = 3 V
0.37
0.49
0.59
0.37
0.47
0.56
f(DCO43)
Rsel = 4, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
VCC = 2.2 V
VCC = 3 V
0.61
0.77
0.93
0.61
0.75
0.9
f(DCO53)
Rsel = 5, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
VCC = 2.2 V
VCC = 3 V
1
1.2
1.5
1
1.3
1.5
f(DCO63)
Rsel = 6, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
VCC = 2.2 V
VCC = 3 V
f(DCO73)
Rsel = 7, DCO = 3, MOD = 0, DCOR = 0,
TA = 25°C
f(DCO77)
Rsel = 7, DCO = 7, MOD = 0, DCOR = 0,
TA = 25°C
f(DCO47)
Rsel = 4, DCO = 7, MOD = 0, DCOR = 0,
TA = 25°C
S(Rsel)
S(DCO)
1.6
1.9
2.2
1.69
2
2.29
VCC = 2.2 V
VCC = 3 V
2.4
2.9
3.4
2.7
3.2
3.65
VCC = 2.2 V
4
4.5
4.9
4.4
4.9
5.4
VCC = 2.2 V/3 V
fDCO40
x1.7
fDCO40
x2.1
fDCO40
x2.5
SR = fRsel+1/fRsel
VCC = 2.2 V/3 V
1.35
1.65
2
SDCO = fDCO+1/fDCO
VCC = 2.2 V/3 V
1.07
1.12
1.16
Temperature drift, Rsel = 4, DCO = 3, MOD = 0
(see Note 1)
VCC = 2.2 V
−0.31
−0.36
−0.40
Dt
VCC = 3 V
−0.33
−0.38
−0.43
DV
Drift with VCC variation, Rsel = 4, DCO = 3, MOD = 0
(see Note 1)
0
5
10
VCC = 3 V
VCC = 2.2 V/3 V
f(DCOx7)
f(DCOx0)
Max
Min
Max
Min
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
2.2 V
1
f DCOCLK
Frequency Variance
NOTE 1: These parameters are not production tested.
3V
0
1
VCC
3
4
5
6
DCO Steps
Figure 12. DCO Characteristics
22
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
UNIT
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
ratio
%/°C
%/V
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
main DCO characteristics
D Individual devices have a minimum and maximum operation frequency. The specified parameters for
f(DCOx0) to f(DCOx7) are valid for all devices.
D All ranges selected by Rsel(n) overlap with Rsel(n+1): Rsel0 overlaps Rsel1, ... Rsel6 overlaps Rsel7.
D DCO control bits DCO0, DCO1, and DCO2 have a step size as defined by parameter SDCO.
D Modulation control bits MOD0 to MOD4 select how often f(DCO+1) is used within the period of 32 DCOCLK
cycles. The frequency f(DCO) is used for the remaining cycles. The frequency is an average equal to:
f average +
MOD
32 f (DCO) f (DCO)1)
f (DCO))(32*MOD) f (DCO)1)
DCO when using ROSC (see Note 1)
PARAMETER
TEST CONDITIONS
fDCO, DCO output frequency
Rsel = 4, DCO = 3, MOD = 0, DCOR = 1,
TA = 25°C
Dt, Temperature drift
Rsel = 4, DCO = 3, MOD = 0, DCOR = 1
Dv, Drift with VCC variation
Rsel = 4, DCO = 3, MOD = 0, DCOR = 1
VCC
2.2 V
MIN
NOM
MAX
UNIT
1.8±15%
MHz
1.95±15%
MHz
2.2 V/3 V
±0.1
%/°C
2.2 V/3 V
10
%/V
3V
NOTES: 1. ROSC = 100kΩ. Metal film resistor, type 0257. 0.6 watt with 1% tolerance and TK = ±50ppm/°C.
crystal oscillator, LFXT1
PARAMETER
CXIN
CXOUT
VIL
VIH
Input capacitance
Output capacitance
TEST CONDITIONS
XTS=0; LF mode selected.
VCC = 2.2 V / 3 V
XTS=1; XT1 mode selected.
VCC = 2.2 V / 3 V (see Note 1)
XTS=0; LF mode selected.
VCC = 2.2 V / 3 V
XTS=1; XT1 mode selected.
VCC = 2.2 V / 3 V (see Note 1)
MIN
TYP
MAX
12
pF
2
12
pF
2
VSS
0.2×VCC
0.8×VCC
VCC
NOTES: 1. Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
2. Applies only when using an external logic-level clock source. Not applicable when using a crystal or resonator.
Input levels at XIN
VCC = 2.2 V/3 V (see Note 2)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
V
23
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (continued)
Flash Memory
TEST
CONDITIONS
PARAMETER
VCC(PGM/
ERASE)
VCC
MIN
NOM
MAX
UNIT
Program and Erase supply voltage
2.7
3.6
V
fFTG
IPGM
Flash Timing Generator frequency
257
476
kHz
Supply current from VCC during program
2.7 V/ 3.6 V
3
5
mA
IERASE
tCPT
Supply current from VCC during erase
2.7 V/ 3.6 V
3
7
mA
Cumulative program time
see Note 1
2.7 V/ 3.6 V
4
ms
tCMErase
Cumulative mass erase time
see Note 2
2.7 V/ 3.6 V
Program/Erase endurance
TJ = 25°C
200
104
ms
105
tRetention
Data retention duration
tWord
tBlock, 0
Word or byte program time
Block program time for 1st byte or word
tBlock, 1-63
tBlock, End
Block program time for each additional byte or word
tMass Erase
tSeg Erase
Mass erase time
5297
Segment erase time
4819
Block program end-sequence wait time
cycles
100
years
35
30
21
see Note 3
tFTG
6
NOTES: 1. The cumulative program time must not be exceeded when writing to a 64-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
2. The mass erase duration generated by the flash timing generator is at least 11.1ms ( = 5297x1/fFTG,max = 5297x1/476kHz). To
achieve the required cumulative mass erase time the Flash Controller’s mass erase operation can be repeated until this time is met.
(A worst case minimum of 19 cycles are required).
3. These values are hardwired into the Flash Controller’s state machine (tFTG = 1/fFTG).
JTAG Interface
TEST
CONDITIONS
PARAMETER
fTCK
TCK input frequency
see Note 1
RInternal
Internal pull-down resistance on TEST
see Note 2
VCC
MIN
2.2 V
0
NOM
MAX
UNIT
5
MHz
3V
0
10
MHz
2.2 V/ 3 V
25
60
90
kΩ
MIN
NOM
MAX
NOTES: 1. fTCK may be restricted to meet the timing requirements of the module selected.
2. TEST pull-down resistor implemented in all versions.
JTAG Fuse (see Note 1)
TEST
CONDITIONS
PARAMETER
VCC(FB)
Supply voltage during fuse-blow condition
TA = 25°C
Voltage level on TEST for fuse-blow - ’C11x1
VFB
IFB
tFB
VCC
2.5
3.5
Voltage level on TEST for fuse-blow - ’F11x1A
6
Supply current into TEST during fuse blow
Time to blow fuse
UNIT
V
3.9
7
V
V
100
mA
1
ms
NOTES: 1. Once the fuse is blown, no further access to the MSP430 JTAG/Test and emulation features is possible. The JTAG block is switched
to bypass mode.
24
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
input/output schematic
Port P1, P1.0 to P1.3, input/output with Schmitt-trigger
VCC
P1SEL.x
0
P1DIR.x
(See Note 1)
1
Direction Control
From Module
(See Note 2)
0
P1OUT.x
Pad Logic
P1.0 − P1.3
1
Module X OUT
(See Note 2)
(See Note 1)
P1IN.x
GND
EN
Module X IN
P1IRQ.x
D
P1IE.x
P1IFG.x
Q
EN
Set
Interrupt
Flag
Interrupt
Edge
Select
P1IES.x
P1SEL.x
NOTE: x = Bit/identifier, 0 to 3 for port P1
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P1Sel.0
P1DIR.0
P1DIR.0
P1OUT.0
P1IN.0
P1IFG.0
P1IES.0
P1DIR.1
P1DIR.1
P1OUT.1
TACLK†
CCI0A†
P1IE.0
P1Sel.1
P1IE.1
P1IFG.1
P1IES.1
P1Sel.2
P1DIR.2
P1DIR.2
P1OUT.2
VSS
Out0 signal†
Out1 signal†
CCI1A†
CCI2A†
P1IE.2
P1IFG.2
P1IES.2
P1Sel.3
P1DIR.3
P1DIR.3
P1OUT.3
P1IN.3
P1IE.3
P1IFG.3
† Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
P1IES.3
Out2 signal†
POST OFFICE BOX 655303
P1IN.1
P1IN.2
• DALLAS, TEXAS 75265
25
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
Port P1, P1.4 to P1.7, input/output with Schmitt-trigger and in-system access features
VCC
P1SEL.x
0
P1DIR.x
See Note 1
1
Direction Control
From Module
See Note 2
0
P1OUT.x
Pad Logic
P1.4−P1.7
1
Module X OUT
See Note 2
See Note 1
GND
TST
Bus Keeper
P1IN.x
EN
Module X IN
D
TEST
TST
P1IRQ.x
P1IE.x
P1IFG.x
Q
Interrupt
Edge
Select
EN
Set
60 kΩ
Typical
Fuse
GND
Interrupt
Flag
Control By JTAG
P1IES.x
P1SEL.x
Fuse
Blow
TSTControl
P1.x
TDO
Controlled By JTAG
P1.7/TDI/TDO
Controlled by JTAG
TDI
TST
P1.x
P1.6/TDI/TCLK
NOTE: The test pin should be protected from potential EMI
and ESD voltage spikes. This may require a smaller
external pulldown resistor in some applications.
TST
P1.x
TMS
P1.5/TMS
x = Bit identifier, 4 to 7 for port P1
During programming activity and during blowing
of the fuse, the pin TDO/TDI is used to apply the test
input for JTAG circuitry.
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
P1Sel.4
P1DIR.4
P1DIR.4
P1Sel.5
P1DIR.5
P1DIR.5
P1Sel.6
P1DIR.6
P1DIR.6
P1Sel.7
P1DIR.7
P1DIR.7
TST
P1.x
TCK
P1.4/TCK
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P1OUT.4
SMCLK
P1IN.4
unused
P1IE.4
P1IFG.4
P1IES.4
P1OUT.5
P1IN.5
unused
P1IE.5
P1IFG.5
P1IES.5
P1OUT.6
Out0 signal†
Out1 signal†
P1IN.6
unused
P1IE.6
P1IFG.6
P1IES.6
P1OUT.7
Out2 signal†
P1IN.7
unused
P1IE.7
P1IFG.7
P1IES.7
† Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
26
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
Port P2, P2.0 to P2.2, input/output with Schmitt-trigger
P2SEL.x
VCC
0
P2DIR.x
0: Input
1
Direction Control
From Module
See Note 2
Pad Logic
0
P2OUT.x
See Note 1
1: Output
P2.0 − P2.2
1
Module X OUT
See Note 2
See Note 1
GND
Bus Keeper
P2IN.x
EN
D
Module X IN
CAPD.X
P2IRQ.x
P2IE.x
P2IFG.x
Q
EN
Set
Interrupt
Flag
NOTE: x = Bit Identifier, 0 to 2 for port P2
Interrupt
Edge
Select
P2IES.x
P2SEL.x
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P2Sel.0
P2DIR.0
P2DIR.0
P2OUT.0
ACLK
P2IN.0
P2IFG.0
P1IES.0
P2DIR.1
P2DIR.1
P2OUT.1
P2IN.1
P2IE.1
P2IFG.1
P1IES.1
P2Sel.2
P2DIR.2
P2DIR.2
P2OUT.2
VSS
CAOUT
unused
INCLK†
CCI0B†
P2IE.0
P2Sel.1
P2IE.2
P2IFG.2
P1IES.2
P2IN.2
† Signal from or to Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
27
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
Port P2, P2.3 to P2.4, input/output with Schmitt-trigger
P2SEL.3
P2DIR.3
VCC
0
Direction Control
From Module
P2OUT.3
0: Input
1
1: Output
0
Pad Logic
See Note 1
See Note 2
P2.3
1
Module X
OUT
See Note 2
See Note 1
P2IN.3
GND
Bus Keeper
EN
D
Module X IN
P2IE.3
P2IRQ.3
P2IFG.3
Interrupt
Edge
Select
EN
Q
Set
Interrupt
Flag
CAPD.3
Comparator_A
CAREF P2CA CAEX
P2IES.3 P2SEL.3
CAF
+
_
CCI1B
0V
Interrupt
Flag
P2IFG.4
P2IRQ.4
Q
P2IES.4 P2SEL.4
Set
EN
P2IE.4
CAREF
Reference Block
Interrupt
Edge
Select
CAPD.4
D
Module X IN
EN
Bus Keeper
P2IN.4
VCC
See Note 1
See Note 2
Module X OUT
P2OUT.4
Direction Control
From Module
P2DIR.4
P2SEL.4
1
0
Pad Logic
See Note 2
1
1: Output
See Note 1
P2.4
0: Input
0
GND
PnSel.x
PnDIR.x
Direction
control from module
PnOUT.x
Module X OUT
PnIN.x
Module X IN
PnIE.x
PnIFG.x
PnIES.x
P2Sel.3
P2DIR.3
P2DIR.3
P2OUT.3
P2IN.3
unused
P2IE.3
P2IFG.3
P1IES.3
P2Sel.4
P2DIR.4
P2DIR.4
P2OUT.4
Out1 signal†
Out2 signal†
P2IN.4
unused
P2IE.4
P2IFG.4
P1IES.4
† Signal from Timer_A
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
28
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
Port P2, P2.5, input/output with Schmitt-trigger and ROSC function for the Basic Clock module
VCC
P2SEL.5
0: Input
1: Output
0
P2DIR.5
Pad Logic
See Note 1
1
Direction Control
From Module
See Note 2
0
P2OUT.5
P2.5
1
Module X OUT
See Note 2
See Note 1
GND
Bus Keeper
P2IN.5
EN
Module X IN
P2IRQ.5
D
P2IE.5
P2IFG.5
Q
EN
Set
Interrupt
Flag
Internal to
Basic Clock
Module
0
VCC
Interrupt
Edge
Select
P2IES.5
1
DC
Generator
DCOR
P2SEL.5
CAPD.5
NOTE: DCOR: Control bit from Basic Clock Module if it is set, P2.5 Is disconnected from P2.5 pad
PnSel.x
PnDIR.x
Direction
control from
module
PnOUT.x
Module X OUT
PnIFG.x
PnIES.x
P2Sel.5
P2DIR.5
P2DIR.5
P2OUT.5
VSS
P2IN.5
unused
P2IE.5
P2IFG.5
NOTES: 1. Optional selection of pullup or pulldown resistors with ROM (masked) versions
2. Fuses for optional pullup and pulldown resistors can only be programmed at the factory (ROM versions only).
P2IES.5
POST OFFICE BOX 655303
PnIN.x
Module X IN
• DALLAS, TEXAS 75265
PnIE.x
29
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
APPLICATION INFORMATION
Port P2, unbonded bits P2.6 and P2.7
P2SEL.x
0: Input
1: Output
0
P2DIR.x
1
Direction Control
From Module
0
P2OUT.x
1
Module X OUT
P2IN.x
Node Is Reset With PUC
EN
Bus Keeper
Module X IN
P2IRQ.x
D
P2IE.x
P2IFG.x
Q
PUC
Interrupt
Edge
Select
EN
Set
Interrupt
Flag
P2IES.x
P2SEL.x
NOTE: x = Bit/identifier, 6 to 7 for port P2 without external pins
P2Sel.x
P2DIR.x
Direction
control from
module
P2OUT.x
Module X OUT
P2IN.x
Module X IN
P2IE.x
P2IFG.x
P2IES.x
P2Sel.6
P2DIR.6
P2DIR.6
P2OUT.6
P2IN.6
unused
P2IE.6
P2IFG.6
P2IES.6
P2Sel.7
P2DIR.7
P2DIR.7
P2OUT.7
VSS
VSS
P2IN.7
unused
P2IE.7
P2IFG.7
P2IES.7
NOTE 1: Unbonded bits 6 and 7 of port P2 can be used as software interrupt flags. The interrupt flags can only be influenced by software. They
work then as a software interrupt.
30
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLAS241H − SEPTEMBER 1999 − REVISED SEPTEMBER 2004
JTAG fuse check mode
MSP430 devices that have the fuse on the TEST terminal have a fuse check mode that tests the continuity of
the fuse the first time the JTAG port is accessed after a power-on reset (POR). When activated, a fuse check
current, ITF , of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TEST pin to ground if the fuse is not burned. Care
must be taken to avoid accidentally activating the fuse check mode and increasing overall system power
consumption.
When the TEST pin is taken back low after a test or programming session, the fuse check mode and sense
currents are terminated.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin after power up or if TMS
is being held low during power up. The second positive edge on the TMS pin deactivates the fuse check mode.
After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the fuse
check mode has the potential to be activated.
The fuse check current will only flow when the fuse check mode is active and the TMS pin is in a low state (see
Figure 13). Therefore, the additional current flow can be prevented by holding the TMS pin high (default
condition).
Time TMS Goes Low After POR
TMS
ITEST
ITF
Figure 13. Fuse Check Mode Current, MSP430F11x1A and MSP430C11x1
NOTE:
The CODE and RAM data protection is ensured if the JTAG fuse is blown and the 256-bit bootloader
access key is used. Also, see the bootstrap loader section for more information.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
31
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MSP430C1101
ACTIVE
MSP430F1101AIDGV
ACTIVE
TVSOP
DGV
20
MSP430F1101AIDGVR
ACTIVE
TVSOP
DGV
20
MSP430F1101AIDW
ACTIVE
SOIC
DW
20
MSP430F1101AIDWR
ACTIVE
SOIC
DW
20
MSP430F1101AIPW
ACTIVE
TSSOP
PW
20
MSP430F1101AIPWR
ACTIVE
TSSOP
PW
MSP430F1101AIRGER
ACTIVE
QFN
MSP430F1101AIRGET
ACTIVE
MSP430F1111AIDGV
Lead/Ball Finish
MSL Peak Temp (3)
TBD
Call TI
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
QFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ACTIVE
TVSOP
DGV
20
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1111AIDGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1111AIDW
ACTIVE
SOIC
DW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIPW
ACTIVE
TSSOP
PW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIRGER
ACTIVE
QFN
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1111AIRGET
ACTIVE
QFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIDGV
ACTIVE
TVSOP
DGV
20
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIDGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIDW
ACTIVE
SOIC
DW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIPW
ACTIVE
TSSOP
PW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIRGER
ACTIVE
QFN
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIRGET
ACTIVE
QFN
RGE
24
250
CU NIPDAU
Level-2-260C-1 YEAR
90
25
70
25
70
25
70
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
MSP430C1101
ACTIVE
MSP430F1101AIDGV
ACTIVE
TVSOP
DGV
20
MSP430F1101AIDGVR
ACTIVE
TVSOP
DGV
20
MSP430F1101AIDW
ACTIVE
SOIC
DW
20
MSP430F1101AIDWR
ACTIVE
SOIC
DW
20
MSP430F1101AIPW
ACTIVE
TSSOP
PW
20
MSP430F1101AIPWR
ACTIVE
TSSOP
PW
MSP430F1101AIRGER
ACTIVE
QFN
MSP430F1101AIRGET
ACTIVE
MSP430F1111AIDGV
Lead/Ball Finish
MSL Peak Temp (3)
TBD
Call TI
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
QFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
ACTIVE
TVSOP
DGV
20
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1111AIDGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1111AIDW
ACTIVE
SOIC
DW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIPW
ACTIVE
TSSOP
PW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1111AIRGER
ACTIVE
QFN
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1111AIRGET
ACTIVE
QFN
RGE
24
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIDGV
ACTIVE
TVSOP
DGV
20
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIDGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIDW
ACTIVE
SOIC
DW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIDWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIPW
ACTIVE
TSSOP
PW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIPWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
MSP430F1121AIRGER
ACTIVE
QFN
RGE
24
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
MSP430F1121AIRGET
ACTIVE
QFN
RGE
24
250
CU NIPDAU
Level-2-260C-1 YEAR
90
25
70
25
70
25
70
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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