NIC NMC-P1206X7R105K50TRPLPF Multilayer ceramic chip capacitor Datasheet

Multilayer Ceramic Chip Capacitors
FEATURES
• CRACK RESISTANT TERMINATION
• SOFT TERMINATION, OPEN MODE FAILURE
• WIDE VOLTAGE RANGE (16V TO 5KV)
• HIGH CAPACITANCE (UP TO 10µF)
• RoHS COMPLIANT
• SAC SOLDER COMPATIBLE**
NMC-P Series
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
Temperature Coefficient
Capacitance Range
NPO
X7R
2.2pF ~ 0.22µF
180pF ~ 10µF
For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F)
Capacitance Tolerance
±10% (K) & ±20% (M)
Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K)
Operating Temperature Range
-55°C ~ +125°C
Temperature Characteristics
±30ppm/°C
±15% ∆ Cap.
Rated Voltages
16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc
Q = > 1000 (more then 30pF)*
2.5% max. @ 1KHz, 1.0V ± 0.2Vrms
Q or Dissipation Factor
Q = > 400 + 20 x C in pF (30pF and below)*
insulation Resistance
10,000Megohm or 500Megohm/µF whichever is less @ +25°C
200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)
Dielectric Withstanding Voltage
150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)
120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)
*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms
**Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods.
PART NUMBER SYSTEM
NMC-P 1206 X7R 105 K 50 TRP or TRPLP F
RoHS Compliant
Tape & Reel (Plastic Carrier)
Tape & Reel (Paper Carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros
Temperature Characteristic (NPO or X7R)
Size Code (see chart)
Series
CONSTRUCTION
Base layer (Cu 50V ~ 250V)
(Ag 500V ~ up)
Flexible layer (Polymer)
Barrier layer (Ni)
Finish layer (Sn)
OPEN MODE FAILURE AS A RESULT OF BENDING STRESS
Termination Separation
(Open Failure Mode)
®
NIC COMPONENTS CORP.
NMC-P rev. 1 05302007
www.niccomp.com
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15
Multilayer Ceramic Chip Capacitors
NMC-P Series
NPO VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
0603
1.60 ± 0.1
0.80 ± 0.1
0.90 max.
0.15 min.
200V
0805
2.00 ± 0.2
1.25 ± 0.25
1.45 max.
0.20 min.
16 25
1206
3.20 ± 0.3
1.60 ± 0.2
1.80 max.
0.30 min.
Working Voltage (Vdc)
50 200 250 500 16 25 50 200 250 500 1KV 2KV 3KV
1210
3.20 ± 0.30
2.50 ± 0.20
2.60 max.
0.30 min.
16
25
50 200 250 500
2.0pF
3.3
3.9
5.0
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001µF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01µF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1
®
16
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Multilayer Ceramic Chip Capacitors
NMC-P Series
NPO VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
1808
4.60 ± 0.3
2.00 ±0.2
2.20 max.
0.30 min.
1812
1825
4.60 ± 0.3
4.60 ± 0.3
3.20 ±0.3
6.35 ±0.4
3.00 max.
2.60 max.
0.30 min.
0.30 min.
Working Voltage (Vdc)
1KV 2KV 3KV 5KV 16 25 50 1KV 2KV 3KV 250 500 1KV
2220
5.70 ± 0.4
5.00 ±0.4
3.00 max.
0.30 min.
1KV
5KV
2225
5.70 ± 0.4
6.35 ± 0.4
3.00 max.
0.30 min.
250
500 1KV
2.0pF
3.3
3.9
5.0
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001µF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01µF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1
0.12
0.15
0.22
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
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17
Multilayer Ceramic Chip Capacitors
NMC-P Series
X7R LOW VOLTAGE VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
0805
2.00 ± 0.2
1.25 ± 0.25
1.45 max.
0.20 min.
1206
3.20 ± 0.3
1.60 ± 0.2
1.80 max.
0.30 min.
1210
3.20 ± 0.3
2.50 ± 0.2
2.60 max.
0.30 min.
2220
5.70 ± 0.4
5.00 ± 0.4
3.00 max.
0.30 min.
2225
5.70 ± 0.4
6.35 ± 0.4
3.00 max.
0.30 min
50
50
50
50
50
100
100
1812
1825
4.60 ± 0.3
4.60 ± 0.3
3.20 ± 0.3
6.35 ± 0.4
3.00 max.
2.60 max.
0.30 min.
0.30 min.
Working Voltage (Vdc)
100
50
100
50
100
100
100
0.1µF
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
6.8
10
X7R HIGH V0LTAGE VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
0805
2.00 ± 0.2
1.25 ± 0.25
1.45 max.
0.20 min.
200
250
500
200
1206
3.20 ± 0.3
1.60 ± 0.2
1.80 max.
0.30 min.
Working Voltage (Vdc)
250
500
630
1K
1210
3.20 ± 0.3
2.50 ± 0.2
2.60 max.
0.30 min.
200
250
500
1K
180pF
220
270
330
390
470
560
680
0.001µF
0.0015µF
0.0022µF
0.0027µF
0.0033µF
0.0039µF
0.0047µF
0.0056µF
0.0068µF
0.01µF
0.012µF
0.015µF
0.018µF
0.022µF
0.027µF
0.033µF
0.039µF
0.047µF
0.056µF
0.068µF
0.1µF
0.12µF
0.15µF
0.18µF
0.22µF
®
18
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Multilayer Ceramic Chip Capacitors
NMC-P Series
X7R HIGH V0LTAGE VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
1808
4.60 ± 0.3
2.0 ± 0.2
2.20 max.
0.30 min.
500
1K
2K
1812
4.60 ± 0.3
3.2 ± 0.3
3.00 max.
0.30 min.
3K
200
250
500
1825
4.60 ± 0.3
6.35 ± 0.4
2.60 max.
0.30 min.
Working Voltage (Vdc)
2K
3K 250 500 1K
1K
2220
5.70 ± 0.4
5.00 ± 0.4
3.00 max.
0.30 min.
250
500
1K
2225
5.70 ± 0.4
6.35 ± 0.4
3.00 max.
0.30 min.
2K
250
500
1K
150pF
180
220
270
330
390
470
560
680
0.001µF
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
1.0
1.5
2.2
W
H
P
P
L
®
NIC COMPONENTS CORP.
100% Sn over Ni barrier
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19
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