NCP690, NCP691, NCP692 1 A, Low IGND, Very Low Dropout Regulator (VLDO) with/without Enable The NCP690, NCP691, NCP692 CMOS LDO family provides 1 A of output current with enhanced ESD in either fixed voltage options or an adjustable output voltage from 5.0 V down to 1.25 V. This device is designed for space constrained and portable battery powered applications and offer additional features such as high PSRR, low Quiescent and Ground current consumption, low noise operation, short circuit and thermal protection. The device is designed to be used with low cost ceramic capacitors and is packaged in the 6−Lead DFN3x3 package. http://onsemi.com DFN6 3x3 MN SUFFIX CASE 506AH 1 MARKING DIAGRAM Features 1 xxxzz AYWW G • Output Voltage Options: Adjustable, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V – Other Options Possible • Adjustable Output by External Resistors from 5.0 V down to 1.25 V • Guaranteed 1 A Output Current • ±1.5% Output Voltage Tolerance over All Operating Conditions EN GND IN N/C 1 1 OUT IN EN IN GND NCP691, NCP692 − 6 PIN DFN Fixed Version (Bottom View) N/C IN NCP690 − 6 PIN DFN Fixed Version (Bottom View) SNS GND OUT SNS GND IN 1 NCP690 − 6 PIN DFN Adjustable Version (Bottom View) ADJ IN GND ADJ OUT IN GND OUT Laptops and PCI Cards Modem Banks and Telecom Boards DSP, FPGA, Microprocessor Boards Portable, Battery−Power Applications Hard Disk Drives These are Pb−Free Devices GND 1 Applications • • • • • • = 690, 691, 692 = 15, 18, 25, 33, 50, AD = Assembly Location = Year = Work Week = Pb−Free Package PIN ASSIGNMENT GND • • • • • • xxx zz A Y WW G IN • (Adjustable) ±2% Output Voltage Tolerance over All Operating Conditions (Fixed) Typical Noise Voltage of 50 mVrms without a Bypass Capacitor Typical Dropout Voltage of 190 mV at 1 A (Vout = 2.5 V, TJ = 25°C) Active Output Discharge Active Low Enable Pin (NCP691 Device) Active High Enable Pin (NCP692 device) Enhanced ESD: 4 kV and 400 V Pb−Free NCP691, NCP692 − 6 PIN DFN Adjustable Version (Bottom View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. © Semiconductor Components Industries, LLC, 2009 September, 2009 − Rev. 6 1 Publication Order Number: NCP690/D NCP690, NCP691, NCP692 VIN 1,6 IN 3 EN* NCP692 GND CIN 1 mF** OUT SNS VOUT 4 5 COUT 1 mF** 2, EPAD Note: * NCP692 device has EN active high Note: ** Minimum value required for stability Figure 1. NCP692 Typical Application Circuit for Fixed Version (Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V) VIN 1,6 3 IN EN* CIN 1 mF** NCP691 GND OUT SNS VOUT 4 5 COUT 1 mF** 2, EPAD Note: * NCP691 device has EN active low Note: ** Minimum value required for stability Figure 2. NCP691 Typical Application Circuit for Fixed Version (Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V) VIN 1,6 3 CIN 1 mF* IN N/C NCP690 GND OUT SNS VOUT 4 5 COUT 1 mF* 2, EPAD Note: * Minimum value required for stability Figure 3. NCP690 Typical Application Circuit for Fixed Version (Output voltage versions: 1.5 V, 1.8 V, 2.5 V, 5.0 V) VIN 3.3 V VEN CIN 1 mF** VOUT 2.5 V 1,6 5 OUT IN NCP691−ADJ/ NCP692−ADJ 3 4 EN* ADJ GND 2, EPAD R1 9.1 k R2 9.1 k COUT 1 mF** Note: * NCP691−ADJ device has EN active low and Note: * NCP692−ADJ device has EN active high Note: ** Minimum value required for stability Figure 4. NCP692 Typical Application Circuit for Adjustable Version (Adjustable version for 1.25 V < VOUT ≤ 5.0 V) http://onsemi.com 2 NCP690, NCP691, NCP692 OUT IN R2 SNS MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN N/C R1 ENABLE LOGIC BANDGAP REFERENCE ACTIVE DISCHARGE GND Figure 5. NCP690 Block Diagram (Fixed Version) IN OUT R2 SNS MOSFET DRIVER WITH CURRENT LIMIT R1 THERMAL SHUTDOWN EN BANDGAP REFERENCE ENABLE LOGIC ACTIVE DISCHARGE GND Figure 6. NCP691 Block Diagram (Fixed Version) IN OUT R2 SNS MOSFET DRIVER WITH CURRENT LIMIT R1 THERMAL SHUTDOWN EN BANDGAP REFERENCE ENABLE LOGIC ACTIVE DISCHARGE GND Figure 7. NCP692 Block Diagram (Fixed Version) Table 1. PIN FUNCTION DESCRIPTION FOR FIXED VERSION Pin No. Pin Name Description 1, 6 IN 2 GND Power supply ground of the regulator. Connected to the die through the lead frame. Soldered to the copper plane allows for effective heat removal. 3 EN For NCP691 and NCP692 this pin functions as Enable Active Low and Enable Active High respectively. For NCP690 this pin has no special meaning and should be left disconnected. 4 OUT Regulated output voltage 5 SNS Sense input. This pin should be connected directly to OUT pin. Voltage inputs which supplies the current to the regulator. Both of these pins should be connected together for full output current capability http://onsemi.com 3 NCP690, NCP691, NCP692 IN OUT ADJ MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN N/C ENABLE LOGIC BANDGAP REFERENCE ACTIVE DISCHARGE GND Figure 8. NCP690 Block Diagram (Adjustable Version) IN OUT ADJ MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN EN BANDGAP REFERENCE ENABLE LOGIC ACTIVE DISCHARGE GND Figure 9. NCP691 Block Diagram (Adjustable Version) IN OUT ADJ MOSFET DRIVER WITH CURRENT LIMIT THERMAL SHUTDOWN EN BANDGAP REFERENCE ENABLE LOGIC ACTIVE DISCHARGE GND Figure 10. NCP692 Block Diagram (Adjustable Version) Table 2. PIN FUNCTION DESCRIPTION FOR ADJUSTABLE VERSION Pin No. Pin Name Description 1, 6 IN 2 GND Power supply ground of the regulator. Connected to the die through the lead frame. Soldered to the copper plane allows for effective heat removal. 3 EN For NCP691 and NCP692 this pin functions as Enable Active Low and Enable Active High respectively. For NCP690 this pin has no special meaning and should be left disconnected. 4 ADJ Feedback input. Connect to middle point of resistor divider for Adjustable version. 5 OUT Regulated output voltage Voltage inputs which supplies the current to the regulator. Both of these pins should be connected together for full output current capability http://onsemi.com 4 NCP690, NCP691, NCP692 Table 3. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) VIN −0.3 to 6.5 V Chip Enable Voltage VEN −0.3 to 6.5 V Output Voltage VOUT −0.3 to 6.5 V VSNS −0.3 to 6.5 V ESD 4000 V Output Voltage / Sense Input, (SNS pin) Electrostatic Discharge Human Body Model Machine Model 400 Maximum Junction Temperature Storage Temperature Range TJ_MAX 150 _C TSTG −65 to 150 _C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device series contains ESD protection and exceeds the following tests: ESD HBM tested per JEDEC standard: JESD22−A114 ESD MM tested per JEDEC standard: JESD22−A115 Latch–up Current Maximum Rating: ≤ 150 mA per JEDEC standard: JESD78 Table 4. PACKAGE THERMAL CHARACTERISTICS Rating Thermal Resistance, Junction−to−Ambient (Note 2) Condition Symbol Value Unit DFN6 3x3, 1 oz Cu mm2 64 Cu 645 mm2 Cu RqJA 169 70 °C/W DFN6 3x3, 2 oz Cu 64 mm2 Cu 645 mm2 Cu RqJA 151 62 °C/W RqJL 15 °C/W Thermal Resistance, Junction−to−Pin Table 5. OPERATING RANGES Rating 1. 2. 3. 4. Symbol Value Unit Operating Input Voltage (Notes 3 and 4) VIN 1.5 to 6.0 V Operating Junction Temperature Range TJ −40 to 125 °C Operating Ambient Temperature Range TA −40 to 85 °C Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher. Soldered on FR4 copper area, please refer to Applications Section for Safe Operating Area. Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher. Refer to Electrical Characteristics and Application Information for Safe Operating Area. http://onsemi.com 5 NCP690, NCP691, NCP692 Table 6. ELECTRICAL CHARACTERISTICS VIN = (VOUT + 1 V), VEN = VIN, IOUT = 1 mA, CIN = 10 mF, COUT = 10 mF, for typical values TJ = 25°C, for Min/Max values TJ = −40°C to 125°C; unless otherwise noted. (Note 5) Test Conditions Parameter Symbol Min Typ Max Unit VOUT 1.231 (−1.5%) 1.250 1.269 (+1.5%) V VOUT 1.470 1.764 2.450 3.234 4.900 (−2%) 1.5 1.8 2.5 3.3 5.0 1.530 1.836 2.550 3.366 5.100 (+2%) V RegLINE − 3.2 8 mV RegLOAD − − − − − 10 10 10 10 10 30 30 35 35 40 mV VDO − 450 470 mV Output voltage (Adjustable Version) VIN = 1.75 V to 6.0 V IOUT = 100 mA to 1 A Output voltage (Fixed Version) VIN = (VOUT + 1 V) to 6.0 V IOUT = 100 mA to 1 A Line regulation VIN = (VOUT + 1 V) to 6.0 V Load regulation IOUT = 100 mA to 1 A Dropout voltage (Adjustable Version, Note 6) VDO = VIN − VOUT VOUT = 1.25 V IOUT = 1 A Dropout voltage (Fixed Version, Note 9) IOUT = 1 A VOUT = 1.5 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5.0 V VDO − − − − − 290 240 190 180 120 410 380 300 250 210 mV Ground current VIN = VOUT + 1 V, VOUT = 1.5 V, 1.8 V, 2.5 V, 3.3 V IOUT = 1 A IOUT = 10 mA IOUT = 100 mA IGND − − − 145 145 145 200 200 200 mA VIN = VOUT + 1 V, VOUT = 5.0 V IOUT = 1 A IOUT = 10 mA IOUT = 100 mA − − − 145 145 145 240 240 240 mA VOUT = 1.5 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5.0 V VOUT = 1.5 V VOUT = 1.8 V VOUT = 2.5 V VOUT = 3.3 V VOUT = 5.0 V Disable current (NCP692 only, Notes 5 and 7) VEN < 0.4 V IDIS − 0.1 1 mA Output Current Limit VIN = VOUT + 1 V, VOUT = 85% VOUT_NOM ILIM 1.1 1.6 2.4 A Short Circuit Current VOUT = 0 V Enable High Level Threshold Enable Low Level Threshold (NCP691 and NCP692) VEN increasing from low to high logic level VEN decreasing from high to low logic level Enable Input Current (Enable Active Low) (NCP691 only, Note 8) ISC 1.2 − − A VEN_ HI VEN_ LO 0.9 − − − − 0.4 V VEN = 0.9 V to VIN IEN_HI − 0.01 250 nA Enable Input Current (NCP692 only, Note 8) VEN = 0 V IEN_LO − 0.01 100 nA Feedback Current VFB = 1.25 (Adjustable version only) IIFB − 210 320 nA Turn−on Time (Note 8) VIN = 0 V to (VOUT +1 V) or 1.75 V VOUT = 0 V to 90% VOUT_NOM tON − 50 − ms 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 6. Maximum dropout voltage is limited by minimum input voltage. VIN = 1.7 V recommended for guaranteed operation at maximum output current. 7. Refer to the Applications Information Section. 8. Values based on design and/or characterization. 9. Dropout voltage is defined as the differential voltage between VOUT and VIN, when VOUT drops 100 mV below its nominal value. http://onsemi.com 6 NCP690, NCP691, NCP692 Table 6. ELECTRICAL CHARACTERISTICS VIN = (VOUT + 1 V), VEN = VIN, IOUT = 1 mA, CIN = 10 mF, COUT = 10 mF, for typical values TJ = 25°C, for Min/Max values TJ = −40°C to 125°C; unless otherwise noted. (Note 5) (continued) Parameter Test Conditions Symbol Min Typ Max Unit PSRR − − − 62 55 40 − − − dB VN − 50 − mVrms Thermal Shutdown Temperature (Note 8) TSD − 175 − °C Thermal Shutdown Hysteresis (Note 8) TSH − 10 − °C Power supply ripple rejection (Note 8) VOUT = 1.25 V VIN = VOUT + 1 V, with VPP = 0.5 V, COUT = 1 mF f = 120 Hz f = 1 kHz f = 10 kHz Output noise voltage (Note 8) BW = 200 Hz to 100 kHz, CIN = 1 mF, COUT = 10 mF, TA = 25°C 5. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 6. Maximum dropout voltage is limited by minimum input voltage. VIN = 1.7 V recommended for guaranteed operation at maximum output current. 7. Refer to the Applications Information Section. 8. Values based on design and/or characterization. 9. Dropout voltage is defined as the differential voltage between VOUT and VIN, when VOUT drops 100 mV below its nominal value. TYPICAL CHARACTERISTICS 1.27 1.55 VIN = VOUT_NOM + 1 V = 1.75 V, CIN = COUT = 10 mF VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 1.28 1.26 IOUT = 100 mA 1.25 1.24 IOUT = 1 A 1.23 1.22 −40 −15 10 35 60 85 110 1.52 1.51 IOUT = 100 mA 1.50 IOUT = 1 A 1.49 1.48 1.47 −15 10 35 60 85 110 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 11. Output Voltage vs. Temperature (Vout = 1.25 V) Figure 12. Output Voltage vs. Temperature (Vout = 1.5 V) 135 3.35 2.54 VIN = VOUT_NOM + 1 V = 3.5 V, CIN = COUT = 10 mF 2.53 VOUT, OUTPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) VIN = VOUT_NOM + 1 V = 2.5 V, CIN = COUT = 10 mF 1.53 1.46 −40 135 2.55 2.52 IOUT = 100 mA 2.51 2.50 IOUT = 1 A 2.49 2.48 2.47 2.46 −40 1.54 −15 10 35 60 85 110 3.33 3.31 IOUT = 100 mA 3.29 IOUT = 1 A 3.27 3.25 −40 135 VIN = VOUT_NOM + 1 V = 4.3 V, CIN = COUT = 10 mF −15 10 35 60 85 110 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 13. Output Voltage vs. Temperature (Vout = 2.5 V) Figure 14. Output Voltage vs. Temperature (Vout = 3.3 V) http://onsemi.com 7 135 NCP690, NCP691, NCP692 TYPICAL CHARACTERISTICS 500 5.04 VDO, DROPOUT VOLTAGE (mV) VOUT, OUTPUT VOLTAGE (V) 5.05 VIN = VOUT_NOM + 1 V = 6.0 V, CIN = COUT = 10 mF 5.03 5.02 5.01 IOUT = 100 mA 5.00 4.99 4.98 IOUT = 1 A 4.97 4.96 −40 −15 10 35 60 85 110 350 300 VOUT = 2.5 V 250 200 VOUT = 3.3 V 150 VOUT = 5.0 V −15 10 35 60 110 TA, AMBIENT TEMPERATURE (°C) Figure 15. Output Voltage vs. Temperature (Vout = 5.0 V) Figure 16. Dropout Voltage vs. Temperature (Vout = 1.25 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V) VOUT = 5.0 V IOUT = 1.0 A, VIN = VOUT + 1 V 240 85 TA, AMBIENT TEMPERATURE (°C) IGND, GROUND CURRENT (mA) IGND, GROUND CURRENT (mA) VOUT = 1.5 V VOUT = 1.8 V 270 210 3.3 V 180 150 2.5 V 120 1.5 V 90 −40 1.25 V −15 10 35 60 85 110 135 VOUT = 5.0 V IOUT = 100 mA, VIN = VOUT + 1 V 240 210 3.3 V 180 150 2.5 V 120 1.5 V 1.25 V 90 60 −40 135 −15 10 35 60 85 110 TA, AMBIENT TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 17. Ground Current vs. Temperature (Vout = 1.25 V, 1.5 V, 2.5 V, 3.3 V, 5.0 V) Figure 18. Ground Current vs. Temperature (Vout = 1.25 V, 1.5 V, 2.5 V, 3.3 V, 5.0 V) 1.4 135 3.0 VIN = 2.5 V, VOUT = 1.5 V, CIN = COUT = 1 mF, IOUT = 10 mA, TA = 25°C 1.2 VN = 19 mVRMS 1.0 0.8 VN, NOISE DENSITY (mVrms/rtHz) VN, NOISE DENSITY (mVrms/rtHz) VOUT = 1.25 V 400 100 −40 135 270 0.6 0.4 0.2 0 IOUT = 1.0 A, CIN = COUT = 10 mF 450 10 100 1000 10,000 100,000 VIN = 3.5 V, VOUT = 2.5 V, CIN = COUT = 1 mF, IOUT = 10 mA, TA = 25°C 2.5 VN = 35 mVRMS 2.0 1.5 1.0 0.5 0 10 100 1000 10,000 100,000 FREQUENCY (Hz) FREQUENCY (Hz) Figure 19. Noise Density vs. Frequency (Vout = 1.5 V) Figure 20. Noise Density vs. Frequency (Vout = 2.5 V) http://onsemi.com 8 NCP690, NCP691, NCP692 TYPICAL CHARACTERISTICS 2.0 VOUT, OUTPUT VOLTAGE (V) VIN = 6.0 V, VOUT = 5.0 V, CIN = COUT = 1 mF, IOUT = 10 mA, TA = 25°C 2.5 1.75 VIN = 3.5 V, CIN = COUT = 10 mF, DIOUT/Dt = 0.5 A/1 ms 1.50 VOUT 1.0 1.25 1.5 1.0 0.5 10 1000 10,000 0.5 0 100,000 FREQUENCY (Hz) TIME (100 ms/DIV) Figure 21. Noise Density vs. Frequency (Vout = 5.0 V) Figure 22. Load Transient (Vout = 1.5 V) 2.5 VOUT 2.3 IOUT 1.0 0.5 VIN = 6.0 V, CIN = COUT = 10 mF, DIOUT/Dt = 0.5 A/1 ms 5.25 5.00 VOUT 4.75 IOUT 1.0 0.5 0 CIN = COUT = 10 mF, trise = 10 ms 4 VIN 3 VOUT 1.45 VOUT, OUTPUT VOLTAGE (V) 1.50 TIME (50 ms/DIV) Figure 24. Load Transient (Vout = 5.0 V) 5 VIN 2.55 VOUT 2.50 2.45 CIN = COUT = 10 mF, trise = 10 ms TIME (50 ms/DIV) TIME (50 ms/DIV) Figure 25. Line Transient (Vout = 1.5 V) Figure 26. Line Transient (Vout = 2.5 V) http://onsemi.com 9 4 VIN, INPUT VOLTAGE (V) 1.55 TIME (50 ms/DIV) Figure 23. Load Transient (Vout = 2.5 V) VIN, INPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) 0 IOUT, OUTPUT CURRENT (A) VIN = 3.5 V, CIN = COUT = 10 mF, DIOUT/Dt = 0.5 A/1 ms IOUT, OUTPUT CURRENT (A) 2.7 100 IOUT VOUT, OUTPUT VOLTAGE (V) 0 VOUT, OUTPUT VOLTAGE (V) VN = 64 mVRMS 3.0 IOUT, OUTPUT CURRENT (A) VN, NOISE DENSITY (mVrms/rtHz) 3.5 NCP690, NCP691, NCP692 5 5.05 VOUT 5.00 CIN = COUT = 10 mF, trise = 10 ms 2.0 VOUT 1.5 1.0 VIN = 2.5 V, CIN = COUT = 10 mF, IOUT = 1 A, trise_EN = 10 ms 0.5 TIME (50 ms/DIV) TIME (50 ms/DIV) Figure 27. Line Transient (Vout = 5.0 V) Figure 28. Start−Up Transient (Vout = 1.5 V) VEN VEN 6 3.0 2.5 2.0 0 VOUT 1.5 VIN = 3.5 V, CIN = COUT = 10 mF, IOUT = 1 A, trise_EN = 10 ms 1.0 0.5 0 VEN, VOUT VOLTAGE (V) 4.95 VEN 2.5 VEN, VOUT VOLTAGE (V) VIN 3.5 5 VOUT 4 3 2 VIN = 6.0 V, CIN = COUT = 10 mF, IOUT = 1 A, trise_EN = 10 ms 1 0 TIME (50 ms/DIV) TIME (50 ms/DIV) Figure 29. Start−Up Transient (Vout = 2.5 V) Figure 30. Start−Up Transient (Vout = 5.0 V) 70 60 50 PSRR (dB) VEN, VOUT VOLTAGE (V) 6 VIN, INPUT VOLTAGE (V) VOUT, OUTPUT VOLTAGE (V) TYPICAL CHARACTERISTICS 40 VIN = 2.5 V, VOUT = 1.5 V, VPP = 0.5 V, COUT = 1 mF 30 20 10 0 10 100 1000 10,000 FREQUENCY (Hz) Figure 31. PSRR vs. Frequency (Vout = 1.5 V) http://onsemi.com 10 100,000 NCP690, NCP691, NCP692 DEFINITIONS Load Regulation Line Regulation The change in output voltage for a change in output load current at a constant temperature. The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that the average junction temperature is not significantly affected. Dropout Voltage The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured, when the output drops 100 mV below its nominal value. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Line Transient Response Typical output voltage overshoot and undershoot response when the input voltage is excited with a given slope. Load Transient Response Typical output voltage overshoot and undershoot response when the output current is excited with a given slope between no−load and full−load conditions. Output Noise Voltage This is the integrated value of the output noise over a specified frequency range. Input voltage and output load current are kept constant during the measurement. Results are expressed in mVrms or nV √Hz. Thermal Protection Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175°C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. Ground Current Ground Current is the current that flows through the ground pin when the regulator operates without a load on its output (IGND). This consists of internal IC operation, bias, etc. It is actually the difference between the input current (measured through the LDO input pin) and the output load current. If the regulator has an input pin that reduces its internal bias and shuts off the output (enable/disable function), this term is called the disable current (IDIS.) Maximum Package Power Dissipation The power dissipation level at which the junction temperature reaches its maximum operating value. APPLICATIONS INFORMATION approximately 20 mV, this circuit becomes active and clamps the output from further voltage increase. Tying the ENABLE pin to VIN will ensure that the part is active whenever the supply voltage is present, The NCP690 regulator is self−protected with internal thermal shutdown and internal current limit. Typical application circuit is shown in Figure 1. Input Decoupling (CIN) A ceramic 10 mF capacitor is recommended and should be connected close to the NCP690 package. Higher capacitance and lower ESR will improve the overall line transient response. Noise Decoupling The NCP690 is a low noise regulator and needs no external noise reduction capacitor. Unlike other low noise regulators which require an external capacitor and have slow startup times, the NCP690 operates without a noise reduction capacitor, has a typical 50 ms turn−on time and achieves a 50 mVrms overall noise level between 10 Hz and 100 kHz. Output Decoupling (COUT) The NCP690 does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The minimum output decoupling capacitor required for stability is 1 mF. In order to improve the load transient response and start up performance 10 mF capacitor is recommended. The regulator is stable with ceramic chip as well as tantalum capacitors. Larger values improve noise rejection and load transient response. Enable Operation The enable pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet. The turn−on/turn−off transient voltage being supplied to the enable pin should exceed a slew rate of 10 mV/ms to ensure correct operation. If the enable function is not to be used then the pin should be connected to VIN. No−Load Regulation Considerations The required minimum 100 mA load current is assured by the internal resistor divider network. The NCP690 contain an overshoot clamp circuit to improve transient response during a load current step release. When output voltage exceeds the nominal by Adjustable Operation The output voltage can be adjusted from 1 to 4 times the typical 1.250 V regulation voltage by the use of resistor http://onsemi.com 11 NCP690, NCP691, NCP692 divider network as shown on Figure 4. The output voltage and resistors should be chosen using Equations 1 and 2. ǒ V OUT + 1.250 1 ) R2 ^ R1 Ǔ R1 ) (I ADJ @ R 1) R2 1 The power dissipated by the NCP690 can be calculated from the following equations: P D [ V IN(I GND@I OUT) ) I OUT(V IN * V OUT) (eq. 1) or (eq. 2) VOUT *1 1.25 (eq. 4) V IN(MAX) [ Input bias current IADJ is typically less than 210 nA. Choose R1 arbitrarily to minimize errors due to the bias current and to minimize noise contribution to the output voltage. Use Equation 2 to find the required value for R2. P D(MAX) ) (V OUT I OUT) I OUT ) I GND (eq. 5) 250 200 RqJA (°C/W) Thermal Characteristics As power dissipated in the NCP690 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCP690 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCP690 can handle is given by: P D(MAX) + [T J(MAX) * T A] R qJA 150 FR4 − 1.0 oz 100 FR4 − 2.0 oz 50 0 0 200 400 COPPER AREA (mm2) 600 800 Figure 32. Thermal Resistance vs. Copper Area (eq. 3) Hints VIN and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCP690, and make traces as short as possible. Since TJ is not recommended to exceed 125°C (TJ(MAX)), then the NCP690 can dissipate up to 1 W when the ambient temperature (TA) is 25°C. http://onsemi.com 12 NCP690, NCP691, NCP692 DEVICE ORDERING INFORMATION Nominal Output Voltage Marking Package Shipping† NCP690MN15T2G 1.5 V 69015 DFN6 (Pb-Free) 3000 / Tape & Reel NCP690MN18T2G 1.8 V 69018 DFN6 (Pb-Free) 3000 / Tape & Reel NCP690MN25T2G 2.5 V 69025 DFN6 (Pb-Free) 3000 / Tape & Reel NCP690MN33T2G 3.3 V 69033 DFN6 (Pb-Free) 3000 / Tape & Reel NCP690MN50T2G 5.0 V 69050 DFN6 (Pb-Free) 3000 / Tape & Reel NCP690MNADJT2G ADJ 690AD DFN6 (Pb-Free) 3000 / Tape & Reel NCP691MN15T2G 1.5 V 69115 DFN6 (Pb-Free) 3000 / Tape & Reel NCP691MN18T2G 1.8 V 69118 DFN6 (Pb-Free) 3000 / Tape & Reel NCP691MN25T2G 2.5 V 69125 DFN6 (Pb-Free) 3000 / Tape & Reel NCP691MN33T2G 3.3 V 69133 DFN6 (Pb-Free) 3000 / Tape & Reel NCP691MN50T2G 5.0 V 69150 DFN6 (Pb-Free) 3000 / Tape & Reel NCP691MNADJT2G ADJ 691AD DFN6 (Pb-Free) 3000 / Tape & Reel NCP692MN15T2G 1.5 V 69215 DFN6 (Pb-Free) 3000 / Tape & Reel NCP692MN18T2G 1.8 V 69218 DFN6 (Pb-Free) 3000 / Tape & Reel NCP692MN25T2G 2.5 V 69225 DFN6 (Pb-Free) 3000 / Tape & Reel NCP692MN33T2G 3.3 V 69233 DFN6 (Pb-Free) 3000 / Tape & Reel NCP692MN50T2G 5.0 V 69250 DFN6 (Pb-Free) 3000 / Tape & Reel NCP692MNADJT2G ADJ 692AD DFN6 (Pb-Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 13 NCP690, NCP691, NCP692 PACKAGE DIMENSIONS A D PIN 1 REFERENCE 2X 0.15 C 2X 0.15 C DFN6 3*3 MM, 0.95 PITCH CASE 506AH−01 ISSUE O B ÇÇÇ ÇÇÇ ÇÇÇ NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMESNION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. E DIM A A1 A3 b D D2 E E2 e K L TOP VIEW 0.10 C A 6X 0.08 C (A3) SIDE VIEW 6X D2 L e 1 6X C A1 SEATING PLANE MILLIMETERS MIN NOM MAX 0.80 0.90 1.00 0.00 0.03 0.05 0.20 REF 0.35 0.40 0.45 3.00 BSC 2.40 2.50 2.60 3.00 BSC 1.50 1.60 1.70 0.95 BSC 0.21 −−− −−− 0.30 0.40 0.50 SOLDERING FOOTPRINT* 4X 0.450 0.0177 3 0.950 0.0374 E2 K 6 4 6X b 1.700 0.685 3.31 0.130 (NOTE 3) 0.10 C A B BOTTOM VIEW 0.05 C 0.63 0.025 2.60 0.1023 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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